JPH10237184A - Antistatic thermoplastic resin molding and its production - Google Patents
Antistatic thermoplastic resin molding and its productionInfo
- Publication number
- JPH10237184A JPH10237184A JP9085021A JP8502197A JPH10237184A JP H10237184 A JPH10237184 A JP H10237184A JP 9085021 A JP9085021 A JP 9085021A JP 8502197 A JP8502197 A JP 8502197A JP H10237184 A JPH10237184 A JP H10237184A
- Authority
- JP
- Japan
- Prior art keywords
- thermoplastic resin
- antistatic
- conductive
- molded article
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、帯電防止熱可塑性
樹脂成形体及びその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an antistatic thermoplastic resin molded article and a method for producing the same.
【０００２】[0002]
【従来の技術】半導体ウェハー保存容器の材料や、電子
部品、半導体等各種の極もしくは超微細加工を要する製
造工場における床材や壁材は、帯電による塵埃の付着、
これら塵埃の落下や再分散による２次汚染等を防止する
目的で、高度に帯電防止された熱可塑性樹脂成形体が使
用される。従来、上記目的に使用される帯電防止熱可塑
性樹脂は、アルミニウム、亜鉛等の金属微粉末、酸化チ
タン、酸化亜鉛、酸化錫等の金属酸化物、導電性カーボ
ン粉末、導電性ポリアニリン粉末等からなる導電性物質
を熱可塑性樹脂プレート等の成型体の表面に薄く均一に
塗布したり、熱可塑性樹脂をシートやプレート等の加工
素材や半導体ウェハー保存容器の如き成型体を成型する
際に、熱可塑性樹脂中に均質に練り込んでおき、これら
の導電性熱可塑性樹脂組成物を押出成型や射出成型によ
って成型して導電性熱可塑性樹脂成形体を製造していた
のである。2. Description of the Related Art Materials for semiconductor wafer storage containers, floor materials and wall materials in manufacturing plants that require various kinds of ultra- or ultra-fine processing such as electronic components and semiconductors are subject to the adhesion of dust due to electrification.
For the purpose of preventing secondary contamination and the like due to dropping and re-dispersion of the dust, a highly antistatic thermoplastic resin molding is used. Conventionally, the antistatic thermoplastic resin used for the above purpose is composed of fine metal powders such as aluminum and zinc, metal oxides such as titanium oxide, zinc oxide and tin oxide, conductive carbon powder, conductive polyaniline powder and the like. When applying a conductive material thinly and uniformly to the surface of a molded body such as a thermoplastic resin plate, or when molding a thermoplastic resin into a molded material such as a processing material such as a sheet or a plate or a semiconductor wafer storage container, The resin was homogeneously kneaded in the resin, and the conductive thermoplastic resin composition was molded by extrusion molding or injection molding to produce a conductive thermoplastic resin molded article.
【０００３】しかし、上記熱可塑性樹脂中に導電性物質
を均質に練り込んでおき、これらの導電性熱可塑性樹脂
組成物を押出成型や射出成型によって成型した成型体
は、光線透過率を高めるために、練り込まれる導電性物
質の粒度を０．２μｍ以下の微粒子とする等、光学的に
工夫してはいるが、殆どの場合、熱可塑性樹脂中に分散
した導電性物質によって著しく透明性が阻害されるもの
であった。[0003] However, a molded article obtained by uniformly kneading a conductive substance into the above-mentioned thermoplastic resin and molding the conductive thermoplastic resin composition by extrusion molding or injection molding is intended to increase the light transmittance. Although optically devised, such as making the particle size of the conductive material kneaded into fine particles of 0.2 μm or less, in most cases, the transparency is significantly increased by the conductive material dispersed in the thermoplastic resin. Was inhibited.
【０００４】従って、高度に帯電防止され、且つ、透明
性に優れた熱可塑性樹脂成形耐を製造するためには、帯
電防止能を有する部分が表面部分に濃縮された塗布方式
が採用され、上記帯電防止能を有する塗膜が透光性を保
持するため極めて薄い層で形成される。従って、極端な
厚さのバラツキが発生して帯電防止能にバラツキが発生
することのないように塗膜の厚さの精度を高める必要が
あった。Accordingly, in order to produce a thermoplastic resin having high antistatic properties and excellent transparency, a coating method in which a portion having an antistatic function is concentrated on a surface portion is adopted. A coating film having an antistatic function is formed of an extremely thin layer in order to maintain translucency. Therefore, it is necessary to increase the accuracy of the thickness of the coating film so that the thickness of the coating does not vary due to the extreme thickness variation.
【０００５】上記の如き導電性熱可塑性樹脂成形体とそ
の製造方法として、特開平６−２６３８９９号公報に、
熱可塑性樹脂と導電性材料とから成る塗料を熱可塑性樹
脂離型フィルムの表面に塗布し硬化させて導電性塗膜を
形成し、次いで、当該離型フィルムを、その塗膜面を熱
可塑性樹脂の基材シートの表面に対面させて当該樹脂基
材シートと熱圧着する導電性樹脂シートの製造方法、上
記導電性材料がポリアニリンである導電性樹脂シートの
製造方法及び上記熱可塑性樹脂と導電性ポリアニリンと
から成る導電性塗膜層が、熱可塑性樹脂基材シートの表
面に、熱圧一体に積層形成されてなる導電性樹脂シート
が開示されている。[0005] JP-A-6-263899 discloses a conductive thermoplastic resin molded article as described above and a method for producing the same.
A coating composed of a thermoplastic resin and a conductive material is applied to the surface of the thermoplastic resin release film and cured to form a conductive coating film. Then, the release film is coated with a thermoplastic resin. A method for producing a conductive resin sheet which faces the surface of the base material sheet and is thermocompression-bonded to the resin base material sheet, a method for producing a conductive resin sheet in which the conductive material is polyaniline, and a method for preparing the thermoplastic resin and the conductive material A conductive resin sheet is disclosed in which a conductive coating layer made of polyaniline is laminated on a surface of a thermoplastic resin base sheet by heat and pressure.
【０００６】しかし、上記特開平６−２６３８９９号公
報に開示された導電性樹脂シートの製造方法では、導電
性塗膜層を熱可塑性樹脂基材シートの表面に、熱圧一体
に積層するためには、導電性塗膜層を相当高温に加熱し
なければ熱可塑性樹脂基材シートの表面に密着させるこ
とができず、従って、このような高温に加熱して熱圧す
ると熱可塑性樹脂基材シートが熱変形してしまうという
問題点があった。However, in the method of manufacturing a conductive resin sheet disclosed in Japanese Patent Application Laid-Open No. Hei 6-263899, it is necessary to laminate the conductive coating layer on the surface of the thermoplastic resin base sheet by heat and pressure. Can not be adhered to the surface of the thermoplastic resin substrate sheet unless the conductive coating layer is heated to a considerably high temperature, and therefore, when heated to such a high temperature and hot pressed, the thermoplastic resin substrate sheet However, there is a problem that the material is thermally deformed.
【０００７】更に、上記特開平６−２６３８９９号公報
に開示された導電性樹脂シートの如く、帯電防止能を有
する部分が表面部分に濃縮される塗布方式によって製造
された帯電防止熱可塑性樹脂成形体は、図１〜図４に示
す該帯電防止熱可塑性樹脂成形体の２次加工、即ち、図
１の曲げ加工では、矢印で指し示す屈曲部外側の先端の
導電層１が基材の熱可塑性樹脂層２の厚さによって引き
延ばされて薄くなり、該部の帯電防止性能を著しく低下
している。図２の切削加工及び図３の穴開け加工では、
矢印で指し示す切削部分ないし穴開け部分の帯電防止性
能がなくなる。又、図４の真空成形等の導電層が引き延
ばされる成形加工では、図１に示す曲げ加工同様、導電
層が基材の熱可塑性樹脂と共に引き延ばされ全体的に薄
くなって帯電防止性能が低下するという問題点を有す
る。Further, as in the conductive resin sheet disclosed in the above-mentioned JP-A-6-263899, an antistatic thermoplastic resin molded article produced by a coating method in which a portion having an antistatic function is concentrated on a surface portion. In the secondary processing of the antistatic thermoplastic resin molded body shown in FIGS. 1 to 4, that is, in the bending processing of FIG. 1, the conductive layer 1 at the tip outside the bent portion indicated by the arrow is the thermoplastic resin of the base material. The thickness of the layer 2 is elongated by the thickness of the layer 2, and the antistatic performance of the portion is significantly reduced. In the cutting process of FIG. 2 and the boring process of FIG. 3,
The antistatic performance of the cut or drilled portion indicated by the arrow is lost. Also, in the forming process in which the conductive layer is stretched such as the vacuum forming in FIG. 4, the conductive layer is stretched together with the thermoplastic resin of the base material and becomes thinner as a whole, similarly to the bending process shown in FIG. Is reduced.
【０００８】[0008]
【発明が解決しようとする課題】本発明は、叙上の事実
に鑑みなされたものであって、その目的とするところ
は、熱可塑性樹脂成形体の内部に三次元網状に導電層を
形成せしめることによって、２次加工によってその帯電
防止性能が低下するのない高度帯電防止熱可塑性樹脂成
形体及びその製造方法を提供することにある。SUMMARY OF THE INVENTION The present invention has been made in view of the above facts, and has as its object to form a conductive layer in a three-dimensional network inside a thermoplastic resin molded article. Accordingly, an object of the present invention is to provide a highly antistatic thermoplastic resin molded article whose antistatic performance is not reduced by secondary processing, and a method for producing the same.
【０００９】[0009]
【課題を解決するための手段】請求項１記載の発明は、
内部に三次元網状導電層が形成されてなることを特徴と
する帯電防止熱可塑性樹脂成形体をその要旨とするもの
である。According to the first aspect of the present invention,
The gist of the present invention is an antistatic thermoplastic resin molded article having a three-dimensional net-like conductive layer formed therein.
【００１０】請求項２記載の発明は、三次元網状導電層
の個々のドメインの断面径が１〜３ｍｍであることを特
徴とする請求項１記載の帯電防止熱可塑性樹脂成形体を
その要旨とするものである。According to a second aspect of the present invention, there is provided an antistatic thermoplastic resin molded article according to the first aspect, wherein the cross-sectional diameter of each domain of the three-dimensional network conductive layer is 1 to 3 mm. Is what you do.
【００１１】請求項３記載の発明は、導電性物質を含む
薄膜で被覆されてなる粒径１〜３ｍｍの熱可塑性樹脂粒
状体を加熱加圧することを特徴とする帯電防止熱可塑性
樹脂成形体の製造方法をその要旨とするものである。According to a third aspect of the present invention, there is provided an antistatic thermoplastic resin molded article characterized in that a thermoplastic resin granule having a particle diameter of 1 to 3 mm, which is coated with a thin film containing a conductive substance, is heated and pressed. The gist is a manufacturing method.
【００１２】請求項４記載の発明は、導電性繊維を重合
性モノマー内部に三次元網状に埋設し、この状態で重合
性モノマーを重合させることを特徴とする帯電防止熱可
塑性樹脂成形体の製造方法をその要旨とするものであ
る。According to a fourth aspect of the present invention, there is provided a method for producing an antistatic thermoplastic resin molded article, comprising embedding conductive fibers in a three-dimensional network inside a polymerizable monomer, and polymerizing the polymerizable monomer in this state. The gist is a method.
【００１３】請求項１記載の発明において三次元網状導
電層は、図５に、帯電防止熱可塑性樹脂成形体の断面の
模式的に示した説明図において、その断面を細かく区画
する黒線３で示したように、文字通り三次元網状に導電
性物質が相互に連通している状態のものであってもよい
が、三次元にランダムに配置され、部分的に断続する状
態のものであってもよく、又、二次元網状体を複数枚積
み重ねて実質的に三次元網状体を構成したものであって
もよい。又、三次元網状導電層の個々のドメインは、図
５において、符号４’を付し、矢印で示した位置の１つ
を黒く塗りつぶして示したが、上記のように網状に配置
された繊維状物質によって熱可塑性樹脂４が区画される
ものであってもよいが、特にその形状が限定されるもの
ではなく、被膜状ないしは被膜の一部が破れて欠けた破
れ被膜状の導電性物質によって熱可塑性樹脂４が部分的
に区画されるものであってもよい。According to the first aspect of the present invention, the three-dimensional net-like conductive layer is indicated by a black line 3 which divides the cross section finely in the explanatory view schematically showing the cross section of the antistatic thermoplastic resin molded article in FIG. As shown, the conductive substances may be literally in a three-dimensional net-like state in which they are in communication with each other, but may be arranged three-dimensionally at random and partially intermittently. Alternatively, a plurality of two-dimensional nets may be stacked to form a substantially three-dimensional net. Also, in FIG. 5, the individual domains of the three-dimensional net-like conductive layer are denoted by reference numeral 4 ', and one of the positions indicated by the arrows is blacked out, but the fibers arranged in a net-like manner as described above are shown. The thermoplastic resin 4 may be partitioned by the state-like substance, but the shape is not particularly limited, and the film-like or a partly broken and broken film-like conductive substance may be used. The thermoplastic resin 4 may be partially partitioned.
【００１４】請求項３記載の発明において用いられる熱
可塑性樹脂粒状体の形状は特に限定されるものではない
が、通常、球形乃至は円柱形のものが大多数であるの
で、球形乃至は円柱形でなくとも、その直径、縦、横及
び長さのうち最も大きい値を『粒径』として取り扱う。
上記熱可塑性樹脂粒状体の粒径は、１ｍｍ未満である
と、得られる帯電防止熱可塑性樹脂成形体の強度が低下
し、３ｍｍを超えると得られる帯電防止熱可塑性樹脂成
形体の帯電防止性能が低下するので、１〜３ｍｍに限定
される。The shape of the thermoplastic resin granules used in the third aspect of the present invention is not particularly limited, but usually, the majority is spherical or cylindrical. However, the largest value among the diameter, length, width, and length is treated as “particle size”.
When the particle size of the thermoplastic resin particles is less than 1 mm, the strength of the obtained antistatic thermoplastic resin molded product is reduced, and when it exceeds 3 mm, the antistatic performance of the obtained antistatic thermoplastic resin molded product is reduced. Because it decreases, it is limited to 1-3 mm.
【００１５】上記三次元網状導電層を作製する手段は、
特に限定されるものではないが、例えば、請求項３記載
の発明の帯電防止熱可塑性樹脂成形体の製造方法に示す
ように、直径２〜３ｍｍ程度の通常の熱可塑性樹脂成形
用ペレットの表面に、導電性物質を被膜状に形成してお
き、これを圧縮成形等の適宜成形手段によって、加熱加
圧して成形し、熱可塑性樹脂成形体内部に三次元網状導
電層を充満して形成してもよく、又、図６にその工程の
一部を模式的に示した請求項４記載の発明の帯電防止熱
可塑性樹脂成形体の製造方法のように、金属メッキされ
た繊維製ネット５をキャスティング用金型６内に充満す
るように複数枚を重ねて充填し、三次元網状構造体を形
成しておき、該キャスティング金型６内に、重合性モノ
マー７を注入し、上記三次元網状構造体を重合性モノマ
ー７中に埋設した状態で、重合性モノマー７を重合する
ことによって熱可塑性樹脂成形体内部に三次元網状導電
層を充満して形成してもよい。The means for producing the three-dimensional net-like conductive layer includes:
Although not particularly limited, for example, as shown in the method for producing an antistatic thermoplastic resin molded article of the invention according to claim 3, the surface of a normal thermoplastic resin molding pellet having a diameter of about 2 to 3 mm A conductive material is formed in a film shape, and is formed by heating and pressing by appropriate molding means such as compression molding, and is formed by filling a three-dimensional net-like conductive layer inside a thermoplastic resin molded body. Also, as shown in FIG. 6, a part of the process is schematically shown in FIG. 6, and the metal-plated fiber net 5 is cast as in the method for producing an antistatic thermoplastic resin molded article according to the invention. A plurality of sheets are stacked and filled so as to fill the mold 6 to form a three-dimensional network structure, and a polymerizable monomer 7 is injected into the casting mold 6, and the three-dimensional network structure is formed. Embedded in polymerizable monomer 7 In state, it may be formed by filling a three-dimensional network conductive layer inside the thermoplastic resin molded article by polymerizing a polymerizable monomer 7.
【００１６】上記熱可塑性樹脂としては、特に限定され
るものではないが、例えば、塩化ビニル系樹脂、ポリエ
チレン、ポリプロピレン等のポリオレフィン系樹脂、ポ
リスチレン、アクリロニトリル−ブタジエン−スチレン
共重合体等のスチレン系樹脂、アクリル系樹脂、ポリカ
ーボネート樹脂、ポリブチルテレフタレート樹脂、ポリ
フェニレンサルファイド樹脂等が挙げられる。The thermoplastic resin is not particularly restricted but includes, for example, vinyl chloride resins, polyolefin resins such as polyethylene and polypropylene, and styrene resins such as polystyrene and acrylonitrile-butadiene-styrene copolymer. Acryl resin, polycarbonate resin, polybutyl terephthalate resin, polyphenylene sulfide resin and the like.
【００１７】又、上記重合性モノマーとしては、特に限
定されるものではないが、例えば、メチルメタクリレー
ト、エチルメタクリレート、エチルアクリレート等の基
剤となるアルキル（メタ）アクリレート類、（メタ）ア
クリル酸、マレイン酸、フマル酸、イタコン酸等のカル
ボキシル基含有モノマー又はその無水物、（メタ）アク
リロニトリル、Ｎ−ビニルピロリドン、Ｎ−ビニルカプ
ロラクタム、アクリロイルモルホリン、（メタ）アクリ
ルアミド等の窒素含有モノマー、２−ヒドロキシエチル
（メタ）アクリレート等の水酸基含有モノマー等の少量
の官能基含有モノマー類、エチレングリコールジ（メ
タ）アクリレート、トリメチロールプロパントリ（メ
タ）アクリレート、ペンタエリスリトールテトラ（メ
タ）アクリレート等の（メタ）アクリレート類、ジアリ
ルフタレート、ジアリルマレート、ジアリルフマレー
ト、ジアリルサクシネート、トリアリルイソシアヌレー
ト等のアリル化合物、ジビニルベンゼン等のジビニル化
合物等の多官能モノマー類からなる重合性モノマーに、
重合触媒として、例えば、アゾイソブチロニトリルや４
−（２−ヒドロキシエトキシ）フェニル（２−ヒドロキ
シ−２−プロピル）ケトン（チバガイギー社製、商品名
「ダロキュア２９５９」）等のケトン系；α−ヒドロキ
シ−α，α’−ジメチル−アセトフェノン（チバガイギ
ー社製、商品名「ダロキュア１１７３」）、メトキシア
セトフェノン、２，２−ジメトキシ−２−フェニルアセ
トフェノン（チバガイギー社製、商品名「イルガキュア
６５１」）、２−ヒドロキシ−２−シクロヘキシルアセ
トフェノン（チバガイギー社製、商品名「イルガキュア
１８４」）等のアセトフェノン系；ベンジルジメチルケ
タール等のケタール系等を挙げることができる。上記重
合触媒の含有量は、上記（メタ）アクリル酸エステルモ
ノマー等の重合性モノマー１００重量部に対し、０．０
１〜５重量部、好ましくは０．０５〜３重量部である。Examples of the polymerizable monomer include, but are not particularly limited to, alkyl (meth) acrylates serving as bases such as methyl methacrylate, ethyl methacrylate, and ethyl acrylate; (meth) acrylic acid; Carboxyl group-containing monomers such as maleic acid, fumaric acid and itaconic acid or anhydrides thereof, (meth) acrylonitrile, N-vinylpyrrolidone, N-vinylcaprolactam, acryloylmorpholine, nitrogen-containing monomers such as (meth) acrylamide, 2-hydroxy Small amounts of functional group-containing monomers such as hydroxyl group-containing monomers such as ethyl (meth) acrylate, ethylene glycol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, and pentaerythritol tetra (meth) acrylate Data) acrylates, diallyl phthalate, diallyl maleate, diallyl fumarate, diallyl succinate, allyl compounds such as triallyl isocyanurate, a polymerizable monomer consisting of polyfunctional monomers divinyl compounds such as divinylbenzene,
As a polymerization catalyst, for example, azoisobutyronitrile and 4
Ketones such as-(2-hydroxyethoxy) phenyl (2-hydroxy-2-propyl) ketone (trade name “Darocure 2959”, manufactured by Ciba Geigy); α-hydroxy-α, α′-dimethyl-acetophenone (Ciba Geigy) (Trade name "Darocure 1173"), methoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone (Circa Geigy, trade name "Irgacure 651"), 2-hydroxy-2-cyclohexyl acetophenone (Ciba Geigy, product) Acetophenones such as "IRGACURE 184"); ketals such as benzyldimethyl ketal; The content of the polymerization catalyst is 0.0% with respect to 100 parts by weight of a polymerizable monomer such as the (meth) acrylate monomer.
It is 1 to 5 parts by weight, preferably 0.05 to 3 parts by weight.
【００１８】又、導電性物質としては、特に限定される
ものではないが、例えば、銀ペースト、銅ペースト等の
導電性ペースト類、アルミニウム、亜鉛等の金属微粉末
類、酸化チタン、酸化亜鉛、酸化錫等の金属酸化物微粉
末類、導電性カーボン粉末、導電性ポリアニリン粉末等
の有機導電性物質等が挙げられる。尚、導電性物質とし
て金属微粉末類、金属酸化物微粉末類もしくは有機導電
性物質を用いる場合、熱可塑性樹脂成形用ペレットもし
くは繊維状物質ないしは繊維状物質からなる三次元網状
構造体表面への付着性を高めるため、使用される熱可塑
性樹脂と同種の熱可塑性樹脂等をバインダーとして用い
ることが好ましい。Examples of the conductive substance include, but are not limited to, conductive pastes such as silver paste and copper paste, fine metal powders such as aluminum and zinc, titanium oxide, zinc oxide, and the like. Examples thereof include metal oxide fine powders such as tin oxide, and organic conductive substances such as conductive carbon powder and conductive polyaniline powder. When a metal fine powder, a metal oxide fine powder, or an organic conductive material is used as the conductive material, a pellet for thermoplastic resin molding or a fibrous material or a three-dimensional network structure made of a fibrous material is used. In order to enhance the adhesion, it is preferable to use a thermoplastic resin or the like of the same type as the thermoplastic resin used as the binder.
【００１９】又、導電性繊維としては、特に限定される
ものではないが、例えば、各種断面形状の天然繊維や合
成繊維、中空合成繊維等の表面に、前記する導電性物質
もしくはこれらの導電性物質を含む被膜を形成した繊
維、上記繊維を銀、銅、錫、ニッケル、亜鉛、アルミニ
ウム等の金属をメッキした繊維等が挙げられる。The conductive fiber is not particularly limited. For example, the surface of a natural fiber, a synthetic fiber, a hollow synthetic fiber or the like having various cross-sectional shapes may be coated on the conductive material or the conductive material described above. Fibers having a coating containing a substance formed thereon, and fibers obtained by plating the above fibers with a metal such as silver, copper, tin, nickel, zinc, and aluminum are exemplified.
【００２０】上記表面に前記する導電性物質を含む被膜
を形成するための塗料として、例えば、２−ヒドロキシ
プロピルアクリレート１０モル％／塩化ビニル９０モル
％からなる共重合体等の被膜形成能を有する合成樹脂を
バインダーとして用い、該バインダーに前記する導電性
物質、例えば、酸化錫粉末５〜３０重量％を添加しこれ
らを、例えば、メチルエチルケトン：シクロヘキサン＝
１：５（重量比）混合溶剤等の溶剤に溶解した溶剤型導
電性塗料が挙げられる。上記溶剤型導電性塗料を用いて
得られる導電性繊維の表面固有抵抗は、１０3〜１０10
Ω／□程度である。上記溶剤型導電性塗料における導電
性物質の添加量がバインダーに対して５重量％未満では
得られる耐電防止熱可塑性成形体の耐電防止性能が十分
でなく、３０重量％を超えると被膜形成能が低下し、繊
維表面等の被着体に均一な被膜を形成しにくくなるおそ
れがある。As a coating material for forming a film containing the above-mentioned conductive material on the surface, for example, a coating material such as a copolymer composed of 10 mol% of 2-hydroxypropyl acrylate / 90 mol% of vinyl chloride has a film forming ability. Using a synthetic resin as a binder, the above-mentioned conductive substance, for example, 5 to 30% by weight of tin oxide powder is added to the binder, and these are added to, for example, methyl ethyl ketone: cyclohexane =
Solvent-type conductive paint dissolved in a solvent such as a 1: 5 (weight ratio) mixed solvent may be used. The surface specific resistance of the conductive fiber obtained by using the solvent-type conductive paint is 10 3 to 10 10
It is about Ω / □. When the amount of the conductive substance in the solvent-type conductive paint is less than 5% by weight with respect to the binder, the obtained antistatic thermoplastic molded article does not have sufficient antistatic performance. It may be difficult to form a uniform coating on an adherend such as a fiber surface.
【００２１】又、上記塗料として、例えば、ジペンタエ
リスルトールヘキサアクリレート（６官能オリゴマー）
２０〜４０重量部／重合度２４００のポリビニルアセタ
ール７０〜３０重量部からなる被膜形成能を有する重合
性オリゴマー及び合成樹脂に対し、導電性物質、例え
ば、酸化錫粉末１０〜３０重量部を配合し、該組成物に
たいし、ハイドロキノン（重合禁止剤）０．２重量部、
２，４−ジエチルチオキサントン（重合開始剤）４重量
部及びｐ−ジメチルアミノ安息香酸エチル（光増感剤）
４重量部を添加した紫外線硬化塗料が挙げられる。Further, as the above coating material, for example, dipentaerythritol hexaacrylate (hexafunctional oligomer)
A conductive substance, for example, 10 to 30 parts by weight of a tin oxide powder is blended with a polymerizable oligomer and a synthetic resin having a film forming ability consisting of 20 to 40 parts by weight / 70 to 30 parts by weight of polyvinyl acetal having a polymerization degree of 2400. With respect to the composition, hydroquinone (polymerization inhibitor) 0.2 parts by weight,
4 parts by weight of 2,4-diethylthioxanthone (polymerization initiator) and ethyl p-dimethylaminobenzoate (photosensitizer)
UV-curable paints to which 4 parts by weight are added.
【００２２】上記紫外線硬化塗料を浸漬塗布した被着
体、例えば、ポリエステル繊維に、高圧水銀ランプ等の
光源から１８００ｍＪ／ｃｍ2 の紫外線を照射して得ら
れる導電性繊維の表面固有抵抗は、１０6 〜１０11Ω／
□程度である。上記溶剤型導電性塗料における導電性物
質の添加量が１０重量％未満では得られる耐電防止熱可
塑性成形体の耐電防止性能が十分でなく、３０重量％を
超えると被膜形成能が低下し、繊維表面等の被着体に均
一な被膜を形成しにくくなるおそれがある。The surface resistivity of a conductive fiber obtained by irradiating an ultraviolet-ray of 1800 mJ / cm 2 from a light source such as a high-pressure mercury lamp to an adherend, for example, a polyester fiber, which has been immersed and coated with the above-mentioned ultraviolet curable paint, has a surface resistivity of 10%. 6 to 10 11 Ω /
□ It is about. If the amount of the conductive substance in the solvent-type conductive paint is less than 10% by weight, the obtained antistatic thermoplastic molded article has insufficient antistatic performance. There is a possibility that it is difficult to form a uniform coating on the adherend such as the surface.
【００２３】請求項１記載の発明において、三次元網状
導電層の個々のドメインの断面径は、特に限定されるも
のでなく、用いられる導電性物質の性能、三次元網状導
電層の構造等によって適宜設定されるものである。請求
項２記載の発明の帯電防止熱可塑性樹脂成形体は、上記
三次元網状導電層の個々のドメインの断面径を１〜３ｍ
ｍに限定するものである。上記三次元網状導電層の個々
のドメインの断面径が１ｍｍ未満の場合、導電性物質の
種類によっては、得られる帯電防止熱可塑性樹脂成形体
の強度が低下するおそれがあり、３ｍｍを超えると、得
られる帯電防止熱可塑性樹脂成形体の表面固有抵抗が１
０6 〜１０7 Ω／□より大きく（悪く）なるおそれがあ
る。In the first aspect of the present invention, the cross-sectional diameter of each domain of the three-dimensional net-like conductive layer is not particularly limited, and depends on the performance of the conductive material used, the structure of the three-dimensional net-like conductive layer, and the like. It is set appropriately. According to a second aspect of the present invention, there is provided the antistatic thermoplastic resin molded article having a cross-sectional diameter of each domain of the three-dimensional net-like conductive layer of 1 to 3 m.
m. When the cross-sectional diameter of each domain of the three-dimensional network conductive layer is less than 1 mm, depending on the type of the conductive substance, the strength of the obtained antistatic thermoplastic resin molded article may be reduced, and when it exceeds 3 mm, The surface resistivity of the obtained antistatic thermoplastic resin molded product is 1
0 6 ~10 7 Ω / □ is greater (worse) becomes a possibility.
【００２４】請求項３記載の発明において、熱可塑性樹
脂粒状体の粒径は、上記三次元網状導電層の個々のドメ
インの断面径に対応するものであるが、帯電防止熱可塑
性樹脂成形体の所望の帯電防止性能に応じて、以下に示
す導電性物質の選定がなされる。例えば、導電性物質と
して、銀ペースト、銅ペースト等の導電ペーストが用い
て、直径２〜３ｍｍ程度の通常の熱可塑性樹脂成形用ペ
レットからなる粒状体表面にコーティングが施された場
合、得られる帯電防止熱可塑性樹脂成形体の表面固有抵
抗が１０1 〜１０2 Ω／□程度となる。又、アルミニウ
ム、亜鉛等の金属微粉末類、酸化チタン、酸化亜鉛、酸
化錫等の金属酸化物微粉末類を用いた場合、表面固有抵
抗が１０6 〜１０8 Ω／□程度となり、導電性カーボン
粉末、導電性ポリアニリン粉末等の有機導電性物質を用
いた場合、表面固有抵抗が１０7 〜１０8 Ω／□程度と
なる。According to the third aspect of the present invention, the particle size of the thermoplastic resin particles corresponds to the cross-sectional diameter of each domain of the three-dimensional net-like conductive layer. The following conductive materials are selected according to the desired antistatic performance. For example, when a conductive paste such as a silver paste or a copper paste is used as a conductive substance and a coating is applied to the surface of a granular material made of a normal thermoplastic resin molding pellet having a diameter of about 2 to 3 mm, the obtained charged material is charged. The surface resistivity of the prevention thermoplastic resin molded article is about 10 1 to 10 2 Ω / □. Also, when metal fine powders such as aluminum and zinc, and metal oxide fine powders such as titanium oxide, zinc oxide and tin oxide are used, the surface resistivity becomes about 10 6 to 10 8 Ω / □, and When an organic conductive substance such as a carbon powder and a conductive polyaniline powder is used, the surface specific resistance is about 10 7 to 10 8 Ω / □.
【００２５】上記導電ペーストの付着量は、熱可塑性樹
脂１００重量部に対し５〜１５重量部が好ましい。上記
導電ペーストの付着量が５重量部未満である場合、得ら
れる耐電防止熱可塑性樹脂成形体の帯電防止性能が低下
し、又、上記付着量が１５重量部を超えると、得られる
耐電防止熱可塑性樹脂成形体の強度が低下する。The amount of the conductive paste attached is preferably 5 to 15 parts by weight based on 100 parts by weight of the thermoplastic resin. When the amount of the conductive paste is less than 5 parts by weight, the antistatic performance of the obtained antistatic thermoplastic resin molded article is reduced. When the amount of the conductive paste exceeds 15 parts by weight, the obtained antistatic heat is obtained. The strength of the plastic resin molded article decreases.
【００２６】上記金属微粉末類もしくは金属酸化物微粉
末類からなる導電性粉末の付着量は、熱可塑性樹脂１０
０重量部に対し１〜１５重量部が好ましい。上記付着量
が１重量部未満である場合、得られる耐電防止熱可塑性
樹脂成形体の帯電防止性能が低下し、又、上記付着量が
１５重量部を超えると、得られる耐電防止熱可塑性樹脂
成形体の強度が低下する。The amount of the conductive powder composed of the above-mentioned metal fine powder or metal oxide fine powder is determined by the amount of thermoplastic resin 10
1 to 15 parts by weight per 0 parts by weight is preferred. When the amount is less than 1 part by weight, the antistatic performance of the obtained antistatic thermoplastic resin molded article is reduced, and when the amount exceeds 15 parts by weight, the obtained antistatic thermoplastic resin molding is obtained. Body strength is reduced.
【００２７】アニリン系重合体、ピロール系重合体、チ
オフェン系重合体等の有機質の導電性物質の付着量は、
熱可塑性樹脂１００重量部に対し０．１〜３０重量部が
好ましい。上記付着量が０．１重量部未満である場合、
得られる耐電防止熱可塑性樹脂成形体の帯電防止性能が
低下し、又、上記付着量が３０重量部を超えると、得ら
れる耐電防止熱可塑性樹脂成形体の透明性が低下する。The amount of the organic conductive material such as aniline polymer, pyrrole polymer, thiophene polymer, etc.
0.1 to 30 parts by weight is preferable for 100 parts by weight of the thermoplastic resin. When the adhesion amount is less than 0.1 parts by weight,
When the antistatic performance of the obtained antistatic thermoplastic resin molded article decreases, and when the amount of adhesion exceeds 30 parts by weight, the transparency of the obtained antistatic thermoplastic resin molded article decreases.
【００２８】上記導電性物質は、熱可塑性樹脂バインダ
ーの他、必要に応じて、紫外線吸収剤、酸化防止剤、熱
重合禁止剤等が添加されてもよい。The conductive material may contain, as necessary, an ultraviolet absorber, an antioxidant, a thermal polymerization inhibitor and the like in addition to the thermoplastic resin binder.
【００２９】上記紫外線吸収剤としては、特に限定され
るものではないが、例えば、サリチル酸系紫外線吸収
剤、ベンゾフェノン系紫外線吸収剤、ベンゾトリアゾー
ル系紫外線吸収剤、シアノアクリレート系紫外線吸収剤
等が挙げられる。上記酸化防止剤としては、例えば、フ
ェノール系酸化防止剤、リン酸系酸化防止剤、イオウ系
酸化防止剤等が挙げられる。上記重合禁止剤としては、
例えば、ヒドロキノン、ｐ−メトキシフェノール等が挙
げられる。The ultraviolet absorber is not particularly limited, but examples thereof include a salicylic acid-based ultraviolet absorber, a benzophenone-based ultraviolet absorber, a benzotriazole-based ultraviolet absorber, and a cyanoacrylate-based ultraviolet absorber. . Examples of the antioxidant include a phenolic antioxidant, a phosphoric acid antioxidant, and a sulfur antioxidant. As the above polymerization inhibitor,
For example, hydroquinone, p-methoxyphenol and the like can be mentioned.
【００３０】請求項１記載の発明の帯電防止熱可塑性樹
脂成形体は、内部に三次元網状導電層が充満しているの
で高度の帯電防止性能を有するものであって、図１〜図
４に示すような曲げ、切削、穴開け及び真空成形等の二
次加工が施されても、上記三次元網状導電層の機能に影
響を及ぼすことが実質的になく、高度の帯電防止性能を
保持し得るものである。The antistatic thermoplastic resin molded article according to the first aspect of the present invention has a high degree of antistatic performance because the inside thereof is filled with a three-dimensional net-like conductive layer. Even if secondary processing such as bending, cutting, drilling, and vacuum forming as shown is performed, the function of the three-dimensional net-like conductive layer is not substantially affected, and a high level of antistatic performance is maintained. What you get.
【００３１】請求項２記載の発明の帯電防止熱可塑性樹
脂成形体は、請求項１記載の発明の帯電防止熱可塑性樹
脂成形体において、該帯電防止熱可塑性樹脂成形体の内
部の三次元網状導電層の個々のドメインの断面径が１〜
３ｍｍとなされているので、導電性物質を所定量で用い
れば、その表面固有抵抗が１０1 〜１０6 Ω／□の範囲
で確実に高度の帯電防止性能を有するものである。The antistatic thermoplastic resin molded article according to the second aspect of the present invention is the antistatic thermoplastic resin molded article according to the first aspect of the present invention, wherein the three-dimensional network conductive inside the antistatic thermoplastic resin molded article is provided. The cross-sectional diameter of each domain of the layer is 1 to
Since the thickness is set to 3 mm, when a predetermined amount of the conductive substance is used, the surface specific resistance surely has a high antistatic performance in a range of 10 1 to 10 6 Ω / □.
【００３２】請求項３記載の発明の帯電防止熱可塑性樹
脂成形体の製造方法は、通常用いられる直径２〜３ｍｍ
の熱可塑性樹脂ペレットに、予め導電性物質を所定量で
含む被膜を形成しておき、加熱加圧して成形することに
よって、請求項１もしくは請求項２記載の発明の帯電防
止熱可塑性樹脂成形体を極めて容易に製造することがで
きる。The method for producing an antistatic thermoplastic resin molded article according to the third aspect of the present invention is a method for manufacturing a normally used antistatic thermoplastic resin article having a diameter of 2 to 3 mm.
3. An antistatic thermoplastic resin molded article according to claim 1 or 2, wherein a coating containing a predetermined amount of a conductive substance is formed in advance on said thermoplastic resin pellet, and is formed by applying heat and pressure. Can be produced very easily.
【００３３】請求項４記載の発明の帯電防止熱可塑性樹
脂成形体の製造方法は、導電性繊維が三次元網状組織を
形成して熱可塑性樹脂成形体の内部に充満するようにキ
ャスティング用金型内に配置して重合性モノマーを注入
され重合硬化されるので、請求項１もしくは請求項２記
載の発明の帯電防止熱可塑性樹脂成形体を極めて容易に
製造することができる。更に、本製造方法によって得ら
れる帯電防止熱可塑性樹脂成形体は、上記のように高度
の帯電防止性能と共に高度の電磁波遮蔽性能を有するも
のである。According to a fourth aspect of the present invention, there is provided a method of manufacturing an antistatic thermoplastic resin molded article, wherein the conductive fiber forms a three-dimensional network and fills the inside of the thermoplastic resin molded article. Since the polymerizable monomer is injected and polymerized and cured, the antistatic thermoplastic resin molded article according to the first or second aspect of the present invention can be manufactured very easily. Furthermore, the antistatic thermoplastic resin molded article obtained by the present production method has a high antistatic performance and a high electromagnetic wave shielding performance as described above.
【００３４】又、請求項１〜２記載の帯電防止熱可塑性
樹脂成形体及び請求項３〜４記載の帯電防止熱可塑性樹
脂成形体の製造方法で得られる帯電防止熱可塑性樹脂成
形体は、切削や穴開けによって、切削面や穴開け面に導
電部分が露出するので該面からアース端子を容易に取り
出すことができる。In addition, the antistatic thermoplastic resin molded article obtained by the method for producing an antistatic thermoplastic resin molded article according to claim 1 or 2 and the method for producing an antistatic thermoplastic resin molded article according to claim 3 or 4 are cut. By drilling holes, the conductive portion is exposed on the cutting surface or the drilling surface, so that the ground terminal can be easily taken out from the surface.
【００３５】[0035]
【発明の実施の形態】以下に実施例を掲げて、本発明の
実施の態様を更に詳しく説明するが、本発明はこれら実
施例のみに限定されるものではない。DESCRIPTION OF THE PREFERRED EMBODIMENTS The embodiments of the present invention will be described in more detail with reference to the following examples, but the present invention is not limited to these examples.
【００３６】（実施例１）塩化ビニル樹脂１００重量部
に、錫マレエート系安定剤１．８重量部、錫メルカプタ
ン系安定剤０．３重量部、錫ラウレート系安定剤０．３
重量部からなる安定剤その他滑剤、着色剤等を添加し、
更に、銀ペースト１１重量部を加えてブレンダーで混合
し、塩化ビニル樹脂組成物を調製した後、ペレタイザー
を用いて直径２ｍｍ、長さ２ｍｍの枕型の帯電防止ペレ
ットを作製した。上記帯電防止ペレットを圧縮成形機を
用いて厚さ３ｍｍの帯電防止塩化ビニル樹脂板を作製し
た。得られた帯電防止塩化ビニル樹脂板の表面固有抵抗
は、５×１０Ω／□であった。Example 1 1.8 parts by weight of a tin maleate stabilizer, 0.3 part by weight of a tin mercaptan stabilizer, and 0.3 part by weight of a tin laurate stabilizer were added to 100 parts by weight of a vinyl chloride resin.
Stabilizer consisting of parts by weight, other lubricants, coloring agents, etc. are added,
Further, 11 parts by weight of silver paste was added and mixed with a blender to prepare a vinyl chloride resin composition, and a pillow-shaped antistatic pellet having a diameter of 2 mm and a length of 2 mm was prepared using a pelletizer. A 3 mm thick antistatic vinyl chloride resin plate was prepared from the above antistatic pellets using a compression molding machine. The surface specific resistance of the obtained antistatic vinyl chloride resin plate was 5 × 10Ω / □.
【００３７】（実施例２）塩化ビニル樹脂１００重量部
に、錫マレエート系安定剤１．８重量部、錫メルカプタ
ン系安定剤０．３重量部、錫ラウレート系安定剤０．３
重量部からなる安定剤その他滑剤、着色剤等を添加し、
更に、導電性酸化チタン粉体７重量部を加えてブレンダ
ーで混合し、塩化ビニル樹脂組成物を調製した後、ペレ
タイザーを用いて直径２ｍｍ、長さ２ｍｍの枕型の帯電
防止ペレットを作製した。上記帯電防止ペレットを圧縮
成形機を用いて厚さ３ｍｍの帯電防止塩化ビニル樹脂板
を作製した。得られた帯電防止塩化ビニル樹脂板の表面
固有抵抗は、３×１０7 Ω／□であった。Example 2 1.8 parts by weight of a tin maleate-based stabilizer, 0.3 parts by weight of a tin mercaptan-based stabilizer, and 0.3 parts by weight of a tin laurate-based stabilizer were added to 100 parts by weight of a vinyl chloride resin.
Stabilizer consisting of parts by weight, other lubricants, coloring agents, etc. are added,
Further, 7 parts by weight of conductive titanium oxide powder was added and mixed with a blender to prepare a vinyl chloride resin composition, and a pillow-shaped antistatic pellet having a diameter of 2 mm and a length of 2 mm was prepared using a pelletizer. A 3 mm thick antistatic vinyl chloride resin plate was prepared from the above antistatic pellets using a compression molding machine. The surface resistivity of the obtained antistatic vinyl chloride resin plate was 3 × 10 7 Ω / □.
【００３８】（実施例３）メチルエチルケトン／シクロ
ヘキサノン＝１：５（重量比）混合溶媒に導電性酸化錫
を分散した液中に錫マレエート系安定剤１．８重量部、
錫メルカプタン系安定剤０．３重量部、錫ラウレート系
安定剤０．３重量部からなる安定剤その他滑剤、着色剤
等を含有する塩化ビニル樹脂組成物（徳山積水社製、商
品名「エスレックＥ−ＨＡ」）からなる直径２ｍｍ、長
さ２ｍｍの枕型ペレットを浸漬した後、乾燥して、塩化
ビニル樹脂１００重量部に対し、導電性酸化錫がその表
面に被膜状に７重量部付着した帯電防止ペレットを作製
した。上記帯電防止ペレットを圧縮成形機を用いて厚さ
３ｍｍの帯電防止塩化ビニル樹脂板を作製した。得られ
た帯電防止塩化ビニル樹脂板の表面固有抵抗は、４×１
０6 Ω／□であった。Example 3 1.8 parts by weight of a tin maleate-based stabilizer in a liquid in which conductive tin oxide was dispersed in a mixed solvent of methyl ethyl ketone / cyclohexanone = 1: 5 (weight ratio),
A vinyl chloride resin composition containing 0.3 parts by weight of a tin mercaptan-based stabilizer and 0.3 parts by weight of a tin laurate-based stabilizer and containing a lubricant, a colorant, and the like (trade name "ESLEC E" manufactured by Tokuyama Sekisui Co., Ltd.) -HA "), a pillow-shaped pellet having a diameter of 2 mm and a length of 2 mm was immersed and dried, and 7 parts by weight of conductive tin oxide was adhered to the surface of the vinyl chloride resin in a film form with respect to 100 parts by weight of vinyl chloride resin. An antistatic pellet was prepared. A 3 mm thick antistatic vinyl chloride resin plate was prepared from the above antistatic pellets using a compression molding machine. The surface specific resistance of the obtained antistatic vinyl chloride resin plate was 4 × 1
0 6 Ω / □ it was.
【００３９】（実施例４）金属付着量が１３．３重量
％、繊維径４５μｍ（繊度２０デニール）、１３５メッ
シュからなる開口率０．５８のニッケル無電解メッキポ
リエステルモノフィラメント糸織布（高瀬染工場社製、
商品名「メッタス４０１−Ｄ」）５枚を重ねてキャステ
ィング用金型に充填し、該金型内に、メチルメタクリレ
ート１００重量部に、アゾイソブチロニトリル０．５重
量部を混合した重合性モノマーを、６０℃の加熱炉中
で、２４時間加熱、硬化させ、厚さ３ｍｍの帯電防止ポ
リメチルメタクリレート板を作製した。得られた帯電防
止ポリメチルメタクリレート板の表面固有抵抗は、２×
１０6 Ω／□であった。Example 4 Nickel electroless plated polyester monofilament yarn woven cloth having a metal adhesion amount of 13.3% by weight, a fiber diameter of 45 μm (fineness of 20 denier), and an opening ratio of 0.58 consisting of 135 mesh (Takase Dyeing Factory) Company
A trade name "METTAS 401-D") 5 sheets are stacked and filled in a casting mold, and in the mold, 0.5 parts by weight of azoisobutyronitrile is mixed with 100 parts by weight of methyl methacrylate. The monomer was heated and cured in a heating furnace at 60 ° C. for 24 hours to produce an antistatic polymethyl methacrylate plate having a thickness of 3 mm. The surface resistivity of the obtained antistatic polymethyl methacrylate plate is 2 ×
It was 10 6 Ω / □.
【００４０】（実施例５）ジペンタエリスリトールヘキ
サアクリレート３０重量部、ハイドロキノン０．２重量
部、２，４−ジエチルチオキサントン４重量部及びｐ−
ジメチルアミノ安息香酸エチル４重量部をエチルセロソ
ルブに溶解、分散させた後、重合度２４００のポリビニ
ルアセタール５０重量部及び導電性酸化錫２０重量部を
攪拌機を用い１０時間攪拌混合して紫外線硬化塗料を調
製した。上記紫外線硬化塗料中にポリエステル繊維を浸
漬塗布し、高圧水銀ランプを用いて１８００ｍＪ／ｃｍ
2 の紫外線を照射してポリエステル繊維上の塗膜を硬化
させて導電性繊維を作製した。得られた導電性繊維を実
施例４と同様に織成した織布を用いたこと以外、実施例
４と同様にして厚さ３ｍｍの帯電防止ポリメチルメタク
リレート板を作製した。得られた帯電防止ポリメチルメ
タクリレート板の表面固有抵抗は、５×１０6Ω／□で
あった。Example 5 30 parts by weight of dipentaerythritol hexaacrylate, 0.2 part by weight of hydroquinone, 4 parts by weight of 2,4-diethylthioxanthone and p-
After dissolving and dispersing 4 parts by weight of ethyl dimethylaminobenzoate in ethyl cellosolve, 50 parts by weight of polyvinyl acetal having a polymerization degree of 2400 and 20 parts by weight of conductive tin oxide are stirred and mixed for 10 hours using a stirrer to prepare an ultraviolet-curable paint. Prepared. A polyester fiber is immersed and coated in the above-mentioned ultraviolet-curing paint, and is subjected to 1800 mJ / cm using a high-pressure mercury lamp.
The conductive fiber was prepared by irradiating the ultraviolet ray of No. 2 to cure the coating film on the polyester fiber. An antistatic polymethyl methacrylate plate having a thickness of 3 mm was produced in the same manner as in Example 4, except that a woven fabric in which the obtained conductive fibers were woven in the same manner as in Example 4 was used. The surface resistivity of the obtained antistatic polymethyl methacrylate plate was 5 × 10 6 Ω / □.
【００４１】上記実施例で得られた帯電防止熱可塑性樹
脂成形体の図１〜図４に示される各２次加工の後の表面
固有抵抗を各々測定したが、いずれも加工前の値と同じ
であり、帯電防止性能が低下することはなかった。The surface resistivity of each of the antistatic thermoplastic resin molded articles obtained in the above Examples after the secondary processing shown in FIGS. 1 to 4 was measured. And the antistatic performance did not decrease.
【００４２】[0042]
【発明の効果】本発明の帯電防止熱可塑性樹脂成形体
は、叙上の如く構成されているので、導高度の帯電防止
性能を有するものであって、曲げ、切削、穴開け、真空
成形等の各種二次加工が施されても、実質的に何ら影響
することなく、高度の帯電防止性能を保持し得るもので
ある。又、請求項３及び請求項４記載の帯電防止熱可塑
性樹脂成形体の製造方法は、叙上の如く構成されている
ので、極めて容易に上記高度の帯電防止性能を有する帯
電防止熱可塑性樹脂成形体をえることができる。The antistatic thermoplastic resin molded article of the present invention has a high degree of antistatic performance since it is constructed as described above, and can be formed by bending, cutting, drilling, vacuum forming, etc. Even if the various secondary processes described above are performed, a high degree of antistatic performance can be maintained without any substantial effect. In addition, since the method for producing an antistatic thermoplastic resin molded article according to the third and fourth aspects is configured as described above, it is very easy to mold the antistatic thermoplastic resin molded article having the high antistatic performance. You can gain body.
【００４３】[0043]
【図面の簡単な説明】[Brief description of the drawings]
【図１】（ａ）帯電防止熱可塑性樹脂成形体の２次加工
前の断面図である。 （ｂ）帯電防止熱可塑性樹脂成形体の曲げ加工後の断面
図である。FIG. 1 (a) is a cross-sectional view of an antistatic thermoplastic resin molded product before secondary processing. (B) It is sectional drawing after bending processing of the antistatic thermoplastic resin molded object.
【図２】（ａ）帯電防止熱可塑性樹脂成形体の２次加工
前の断面図である。 （ｂ）帯電防止熱可塑性樹脂成形体の切削加工後の断面
図である。FIG. 2A is a cross-sectional view of an antistatic thermoplastic resin molded product before secondary processing. (B) It is sectional drawing after cutting of the antistatic thermoplastic resin molded object.
【図３】（ａ）帯電防止熱可塑性樹脂成形体の２次加工
前の断面図である。 （ｂ）帯電防止熱可塑性樹脂成形体の穴開け加工後の断
面図である。FIG. 3A is a cross-sectional view of an antistatic thermoplastic resin molded product before secondary processing. (B) It is sectional drawing after drilling of the antistatic thermoplastic resin molded object.
【図４】（ａ）帯電防止熱可塑性樹脂成形体の２次加工
前の断面図である。 （ｂ）帯電防止熱可塑性樹脂成形体の真空成形加工後の
断面図である。FIG. 4A is a cross-sectional view of an antistatic thermoplastic resin molded product before secondary processing. (B) It is sectional drawing after vacuum forming of an antistatic thermoplastic resin molded object.
【図５】本発明の実施例１で得られた帯電防止熱可塑性
樹脂成形体の断面を模式的に示す説明図である。FIG. 5 is an explanatory view schematically showing a cross section of the antistatic thermoplastic resin molded article obtained in Example 1 of the present invention.
【図６】本発明の実施例４の帯電防止熱可塑性樹脂成形
体の製造方法を模式的に示す説明図である。FIG. 6 is an explanatory view schematically showing a method for producing an antistatic thermoplastic resin molded article of Example 4 of the present invention.
１ 導電層（塗膜） ２ 基材層（熱可塑性樹脂） ３ （本発明の）導電層 ４ 熱可塑性樹脂 ４’ドメインの１つ ５ 金属メッキ繊維製ネット ６ キャスティング用金型 ７ 重合性モノマー REFERENCE SIGNS LIST 1 conductive layer (coating film) 2 base layer (thermoplastic resin) 3 conductive layer (of the present invention) 4 thermoplastic resin 4 ′ one of domains 5 metal-plated fiber net 6 casting mold 7 polymerizable monomer
フロントページの続き (51)Int.Cl.6 識別記号 ＦＩ // Ｂ２９Ｋ 105:00 Continued on the front page (51) Int.Cl. 6 Identification code FI // B29K 105: 00
Claims (4)
ることを特徴とする帯電防止熱可塑性樹脂成形体。1. An antistatic thermoplastic resin molded article having a three-dimensional network conductive layer formed therein.
面径が１〜３ｍｍであることを特徴とする請求項１記載
の帯電防止熱可塑性樹脂成形体。2. The molded article according to claim 1, wherein the cross-sectional diameter of each domain of the three-dimensional net-like conductive layer is 1 to 3 mm.
粒径１〜３ｍｍの熱可塑性樹脂粒状体を加熱加圧するこ
とを特徴とする帯電防止熱可塑性樹脂成形体の製造方
法。3. A method for producing an antistatic thermoplastic resin article, comprising heating and pressing a thermoplastic resin particle having a particle size of 1 to 3 mm, which is coated with a thin film containing a conductive substance.
元網状に埋設し、この状態で重合性モノマーを重合させ
ることを特徴とする帯電防止熱可塑性樹脂成形体の製造
方法。4. A method for producing a molded article of an antistatic thermoplastic resin, comprising burying conductive fibers in a three-dimensional network inside a polymerizable monomer and polymerizing the polymerizable monomer in this state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9085021A JPH10237184A (en) | 1996-12-25 | 1997-04-03 | Antistatic thermoplastic resin molding and its production |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34616296 | 1996-12-25 | ||
| JP8-346162 | 1996-12-25 | ||
| JP9085021A JPH10237184A (en) | 1996-12-25 | 1997-04-03 | Antistatic thermoplastic resin molding and its production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10237184A true JPH10237184A (en) | 1998-09-08 |
Family
ID=26426062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9085021A Withdrawn JPH10237184A (en) | 1996-12-25 | 1997-04-03 | Antistatic thermoplastic resin molding and its production |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10237184A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013028115A (en) * | 2011-07-29 | 2013-02-07 | Toda Kogyo Corp | Method for producing molded article, and molded article |
| KR20180048557A (en) * | 2015-07-01 | 2018-05-10 | 아쉬.에.에프. | Conductive composites made from coated powder |
-
1997
- 1997-04-03 JP JP9085021A patent/JPH10237184A/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013028115A (en) * | 2011-07-29 | 2013-02-07 | Toda Kogyo Corp | Method for producing molded article, and molded article |
| KR20180048557A (en) * | 2015-07-01 | 2018-05-10 | 아쉬.에.에프. | Conductive composites made from coated powder |
| JP2018523267A (en) * | 2015-07-01 | 2018-08-16 | エイチ．イー．エフ． | Conductive composites produced from coating powders |
| US11001678B2 (en) | 2015-07-01 | 2021-05-11 | H.E.F. | Conductive composite produced from coated powders |
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