JPH10209697A - Method for optimizing part mounting data - Google Patents
Method for optimizing part mounting dataInfo
- Publication number
- JPH10209697A JPH10209697A JP9007292A JP729297A JPH10209697A JP H10209697 A JPH10209697 A JP H10209697A JP 9007292 A JP9007292 A JP 9007292A JP 729297 A JP729297 A JP 729297A JP H10209697 A JPH10209697 A JP H10209697A
- Authority
- JP
- Japan
- Prior art keywords
- line
- component
- components
- data
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、基板に対して部品
を実装する部品実装機の実装データの最適化に関するも
のである。[0001] 1. Field of the Invention [0002] The present invention relates to optimization of mounting data of a component mounter for mounting components on a board.
【０００２】[0002]
【従来の技術】図５、図６を参照しながら、従来の部品
実装データ最適化方法である実装部品の振り分けについ
て説明する。2. Description of the Related Art With reference to FIGS. 5 and 6, a description will be given of distribution of mounted components, which is a conventional component mounting data optimizing method.
【０００３】図５のフローチャートを用いて従来の実装
部品の振り分けについて説明する。まず特定の部品実装
機でしか実装できない部品（実装機の性能・仕様やユー
ザの任意の設定による）に対し、その実装機で実装でき
るように振り分けを行う（ステップ＃１）。[0005] A conventional distribution of mounted components will be described with reference to a flowchart of FIG. First, components that can only be mounted on a specific component mounter (depending on the performance and specifications of the mounter and user's arbitrary settings) are sorted so that they can be mounted on the mounter (step # 1).
【０００４】次に、１枚の基板に実装される部品点数
（以下使用員数と呼ぶ）の多い部品順にライン内の各部
品実装機の生産時間が均等になるように１部品ずつ振り
分けていく（ステップ＃２）。[0004] Next, components are distributed one by one so that the production time of each component mounter in the line becomes equal, in order of components having the largest number of components (hereinafter referred to as the number of employees) mounted on one substrate ( Step # 2).
【０００５】ここで、図６の具体例を用いてその動作を
説明する。ここで、Ｍ1，Ｍ2，Ｍ3，Ｍ4は実装ラインを
構成する各実装機の名称である。Here, the operation will be described with reference to a specific example of FIG. Here, M 1 , M 2 , M 3 , and M 4 are the names of the respective mounting machines constituting the mounting line.
【０００６】まず、前述の図５のステップ＃１のよう
に、特定の部品実装機でしか実装できない部品に対し振
り分けを行う（図６の斜線部）。First, as shown in step # 1 in FIG. 5 described above, components that can only be mounted by a specific component mounter are sorted (hatched portions in FIG. 6).
【０００７】次に、どの部品実装機でも実装できる部品
がＡ〜Ｇまでの７種類で、それぞれの使用員数と実装タ
クトが表１のようであったとする。Next, it is assumed that there are seven types of components A to G that can be mounted on any component mounter, and the number of employees and mounting tact are as shown in Table 1.
【０００８】[0008]
【表１】 [Table 1]
【０００９】この場合、ステップ＃１の時点で最も生産
時間の少ない部品実装機Ｍ2に対してまず、部品Ａが振
り分けられＭ2の生産時間に部品Ａの実装タクト０．１
５ｓｅｃ×５＝０．７５ｓｅｃが加算され、その後、最
も生産時間の少ない部品実装機Ｍ1に対して部品Ｂが振
り分けられることとなる。以下、部品Ｃは部品実装機Ｍ
2と順次振り分けが行われることとなる。[0009] In this case, step # first and most produced against small mounter M 2 times at 1, mounting tact 0.1 parts A to the production time M 2 component A is distributed
5sec × 5 = 0.75sec are added, then, the fact that the components B are distributed relative small component mounter M 1 of the most productive time. Hereinafter, the component C is the component mounter M
2 is sequentially assigned.
【００１０】[0010]
【発明が解決しようとする課題】しかしながら上記のよ
うな構成では、使用員数の多い部品順に各部品実装機に
対して部品の振り分けを行うため、低速部品がライン上
の下流の部品実装機に振り分けられてしまう（従来例で
の部品Ｃが部品実装機Ｍ2に振り分けられてしまう）場
合が発生する。部品実装機の生産ラインにおいては、実
装精度等の問題から高速実装部品（実装タクトの速い部
品）から順にラインの下流に向けて振り分けなければな
らないという原則があり、この原則に矛盾する。However, in the above configuration, since components are sorted to the component mounters in the order of the number of employees, the low-speed components are sorted to the component mounters downstream on the line. is to cause (part C of the conventional example will be allocated to the component mounting machine M 2) if occurs. In the production line of component mounting machines, there is a principle that high-speed mounting components (components with fast mounting tact) must be sorted in order from the downstream to the downstream of the line due to problems such as mounting accuracy, which contradicts this principle.
【００１１】本発明は上記従来の問題点を解決するもの
で、高速実装部品はより上流の部品実装機に振り分け、
低速部品はより下流の部品実装機に振り分けるといった
原則を守りながら、できるだけ少ない計算量でライン内
の部品実装機の生産時間が均等になるような部品振り分
けを行う部品実装データ最適化方法を提供することを目
的とする。The present invention solves the above-mentioned conventional problems, in which high-speed mounted components are distributed to a component mounting machine located further upstream.
Provide a component mounting data optimization method that distributes components so that the production time of component mounting machines in a line is equalized with the least amount of calculation while keeping the principle that low-speed components are distributed to component mounting machines downstream. The purpose is to:
【００１２】[0012]
【課題を解決するための手段】上記問題点を解決するた
めには、請求項１の発明の部品実装データ最適化方法
は、基板上に部品を実装する部品実装機を複数連結して
ラインを構成し、前記部品実装機に実装すべき部品に関
するデータを最適に振り分ける部品実装データ最適化方
法において、部品に関するデータを前記ラインの先頭と
最後尾の少なくとも２台の部品実装機に振り分け、その
後、前記ラインをさらに２分割し、その分割された各ラ
イン内の先頭と最後尾の２台の部品実装機に振り分ける
ことを繰り返し行うことで部品に関するデータの振り分
けを行うことを特徴とする。In order to solve the above problems, a component mounting data optimizing method according to the first aspect of the present invention relates to a method for optimizing a component mounting data by connecting a plurality of component mounting machines for mounting components on a board. In the component mounting data optimizing method for optimizing and allocating data on components to be mounted on the component mounting machine, the data on the components is distributed to at least two component mounting machines at the beginning and end of the line, The line is further divided into two parts, and the data regarding the parts is distributed by repeatedly performing the distribution to the first and last two component mounters in each of the divided lines.
【００１３】[0013]
【発明の実施の形態】以下本発明の実施の形態としての
部品実装データ最適化方法について図を参照しながら説
明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS A component mounting data optimizing method according to an embodiment of the present invention will be described below with reference to the drawings.
【００１４】（実施の形態１）本実施の形態１は、図１
のフローチャートに示すように生産ライン内の実装設備
に対し、高速実装部品はより上流の部品実装機に振り分
け、低速部品はより下流の部品実装機に振り分けるとい
った原則を守りながら、できるだけ少ない計算量でライ
ン内の部品実装機の生産時間が均等になるような部品振
り分けの作用をするものである。(Embodiment 1) This embodiment 1 is shown in FIG.
As shown in the flow chart, for the mounting equipment in the production line, the principle of allocating high-speed components to higher-level component mounters and lower-speed components to lower-level components The parts are distributed so that the production time of the component mounters in the line becomes uniform.
【００１５】本発明の一実施の形態について図面を参照
しながら説明する。図１、図２、図３、図４は、それぞ
れ本発明の一実施の形態の部品実装データ最適化方法を
説明するためのフローチャートおよびそれらの図であ
る。An embodiment of the present invention will be described with reference to the drawings. FIGS. 1, 2, 3, and 4 are a flowchart and a diagram, respectively, for explaining a component mounting data optimizing method according to an embodiment of the present invention.
【００１６】図１、図２をもとに、以下その動作を一例
で部品実装データ最適化方法である実装部品の振り分け
について説明する。Referring to FIGS. 1 and 2, the operation will be described as an example to explain the distribution of mounted components, which is a component mounting data optimizing method.
【００１７】ここでは、特定の部品実装機でしか実装で
きない部品（実装機の性能・仕様やユーザの任意の設定
による）に対し、その実装機で実装できるように振り分
けを行うことは従来例と同様であるので省略する。ま
ず、すべての部品に対して、実装タクトで図２のように
タクトグループごとに高速実装部品から順にグルーピン
グを行う（ステップ＃１）。Here, it is different from the conventional example that a component that can only be mounted by a specific component mounter (depending on the performance / specification of the mounter or a user's arbitrary setting) can be mounted by the mounter. The description is omitted because it is the same. First, all components are grouped in order from the high-speed mounting component for each tact group as shown in FIG. 2 by the mounting tact (step # 1).
【００１８】次に、ステップ＃１でグルーピングされた
各グループに対して、使用員数の多い順にグルーピング
を行い、高速実装部品でかつ使用員数の多い部品が先頭
にくるように並び替える（ステップ＃２）。Next, the groups grouped in step # 1 are grouped in descending order of the number of employees, and rearranged so that high-speed mounted components and components with the largest number of employees come first (step # 2). ).
【００１９】次に、生産ラインの先頭設備１と最後尾設
備２の２台の部品実装機について図２の各部品ごとの実
装タクトで均等になるように、高速部品は先頭設備１に
グルーピングされた先頭から順に、また低速部品は最後
尾設備２にグルーピングされた後方から順に１部品ずつ
振り分ける（ステップ＃３）。Next, the high-speed components are grouped into the leading equipment 1 so that the two component mounting machines, the leading equipment 1 and the trailing equipment 2, of the production line are equalized in the mounting tact for each part in FIG. The low-speed parts are sorted one by one from the rear, and the low-speed parts are sorted one by one from the rear grouped to the last equipment 2 (step # 3).
【００２０】次に、生産ライン上の全部品実装機に振り
分けられたか判定し（ステップ＃４）、完了していれば
終了する。そうでなければステップ＃５へ進む。Next, it is determined whether the components have been distributed to all the component mounters on the production line (step # 4). Otherwise, go to step # 5.
【００２１】次に、図３に示すように生産ラインの中央
で２分割し、それぞれの分割されたラインに対して、そ
のライン内の先頭設備３と最後尾設備４においてステッ
プ＃３を行い、前述の手順を図３に示すように繰り返
す。ここで、図４のように奇数台数に対して部品振り分
けを行う場合は、中心の設備をそれぞれ０．５倍の倍率
で均等振り分けを行うものとする（例では、設備Ｘ：設
備Ｙ＝１：０．５となるように振り分ける、同様に設備
Ｙ：設備Ｚ＝０．５：１となるように振り分ける）。Next, as shown in FIG. 3, the production line is divided into two parts at the center thereof, and each divided line is subjected to step # 3 in the leading equipment 3 and the tail equipment 4 in the line. The above procedure is repeated as shown in FIG. Here, when parts are allocated to an odd number as shown in FIG. 4, the central equipment is equally distributed at a magnification of 0.5 times (in the example, equipment X: equipment Y = 1). : Equipment 0.5: similarly, equipment Y: equipment Z = 0.5: 1).
【００２２】なお、以上の説明では、４台の部品実装機
の生産ラインでの例で説明したが、その他、どのような
構成の生産ラインへの部品均等振り分けであっても良い
し、部品実装機以外の機械組立装置、加工装置一般につ
いても同様に実施可能である。In the above description, the production line of four component mounters has been described as an example. Alternatively, the components may be equally distributed to the production line having any configuration. The same can be applied to a machine assembling apparatus other than a machine and a general processing apparatus.
【００２３】なお、本実施の形態の部品実装データ最適
化方法を部品実装機自身が備えることもできるし、制御
装置またはプログラムに備えることもできる。The component mounting data optimizing method according to the present embodiment can be provided in the component mounting machine itself, or can be provided in a control device or a program.
【００２４】[0024]
【発明の効果】以上のように本発明の部品実装データ最
適化方法によれば、生産ライン内の実装設備に対し、高
速実装部品はより上流の部品実装機に振り分け、低速部
品はより下流の部品実装機に振り分けるといった原則を
守りながら、できるだけ少ない計算量で（常に、設備へ
の振り分けは２台の設備に対して行うのみで各部品の実
装タクトを全設備分計算しなくて良い）ライン内の部品
実装機の生産時間が均等になるような部品振り分けを行
うことができ、その機能を有した部品実装機や制御装置
は実装精度が高く、生産時間の短縮化が可能であるとい
う有利な効果が得られる。As described above, according to the component mounting data optimizing method of the present invention, high-speed mounting components are distributed to a higher-level component mounting machine, and low-speed components are allocated to a lower-stream mounting device. A line with as little computational complexity as possible, while keeping the principle of distributing to component mounters (always distributing to equipment only for two facilities, without having to calculate the mounting tact of each component for all equipment) The components can be sorted such that the production time of the component mounters in them can be equalized, and the component mounters and control devices with the function have the advantage of high mounting accuracy and shortening the production time. Effects can be obtained.
【図１】本発明の一実施の形態による部品実装データ最
適化方法を示すフローチャートFIG. 1 is a flowchart showing a component mounting data optimizing method according to an embodiment of the present invention;
【図２】本発明の一実施の形態による部品実装データ最
適化方法の説明図FIG. 2 is an explanatory diagram of a component mounting data optimizing method according to one embodiment of the present invention;
【図３】本発明の一実施の形態による部品実装データ最
適化方法の説明図FIG. 3 is an explanatory diagram of a component mounting data optimizing method according to one embodiment of the present invention;
【図４】本発明の一実施の形態による部品実装データ最
適化方法の説明図FIG. 4 is an explanatory diagram of a component mounting data optimizing method according to one embodiment of the present invention;
【図５】従来の一実施の形態による部品実装データ最適
化方法の説明図FIG. 5 is an explanatory diagram of a component mounting data optimizing method according to a conventional embodiment.
【図６】従来の一実施の形態による部品実装データ最適
化方法の説明図FIG. 6 is an explanatory diagram of a component mounting data optimizing method according to a conventional embodiment.
【符号の説明】 １ 生産ライン上の先頭設備 ２ 生産ライン上の最後尾設備 ３ 生産ライン上の先頭設備 ４ 生産ライン上の最後尾設備[Description of Signs] 1 Leading equipment on production line 2 Trailing equipment on production line 3 Leading equipment on production line 4 Trailing equipment on production line
───────────────────────────────────────────────────── フロントページの続き (72)発明者 栗林 毅 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Takeshi Kuribayashi 1006 Kazuma Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd.
Claims (2)
数連結してラインを構成し、前記部品実装機に実装すべ
き部品に関するデータを最適に振り分ける部品実装デー
タ最適化方法において、部品に関するデータを前記ライ
ンの先頭と最後尾の少なくとも２台の部品実装機に振り
分け、その後、前記ラインをさらに２分割し、その分割
された各ライン内の先頭と最後尾の２台の部品実装機に
振り分けることを繰り返し行うことで部品に関するデー
タの振り分けを行うことを特徴とする部品実装データ最
適化方法。1. A component mounting data optimizing method for connecting a plurality of component mounting machines for mounting components on a substrate to form a line and optimally distributing data on components to be mounted on the component mounting machine, the method comprising: The data is distributed to at least two component mounters at the beginning and end of the line, and then the line is further divided into two parts, and the two parts at the beginning and end of each divided line are divided into two parts. A component mounting data optimizing method, wherein data on components is distributed by repeatedly performing the distribution.
数連結してラインを構成し、前記部品実装機に実装すべ
き部品に関するデータを最適に振り分ける部品実装デー
タ最適化方法において、実装する部品のタクトを算出す
る第１工程と、第１工程で算出された部品をタクト毎に
グループ分けする第２工程と、第２工程でグループ分け
した各グループに対して使用員数の多い部品に並びかえ
る第３工程と、前記ラインの先頭の部品実装機にタクト
の速い部品を順に、またラインの最後尾の部品実装機に
タクトの遅い部品を順に振り分ける第４工程と、ライン
を２分割して第１ライン及び第２ラインを構成する第５
工程と、第５工程での各ラインにおいてラインの先頭の
部品実装機にタクトの速い部品を順にラインの最後尾の
部品実装機にタクトの遅い部品を順に振り分ける第６工
程とを少なくとも有した部品実装データ最適化方法。2. A component mounting data optimizing method in which a plurality of component mounting machines for mounting components on a substrate are connected to form a line, and data relating to components to be mounted on the component mounting machine are optimally distributed. A first step for calculating the tact of the parts, a second step for grouping the parts calculated in the first step for each tact, and a list of parts having a large number of employees for each group divided in the second step A third step of changing the order, a part with the fastest tact to the component mounter at the head of the line in order, and a fourth step of sequentially assigning the part with the slowest tact to the component mounter at the end of the line. Fifth line forming the first line and the second line
A component having at least a process and a sixth process of sequentially allocating components having a short tact to the component mounters at the head of the line in the order of the tact components to the component mounters at the head of the line in each line in the fifth process. Implementation data optimization method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP00729297A JP3653911B2 (en) | 1997-01-20 | 1997-01-20 | Parts distribution method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP00729297A JP3653911B2 (en) | 1997-01-20 | 1997-01-20 | Parts distribution method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10209697A true JPH10209697A (en) | 1998-08-07 |
| JP3653911B2 JP3653911B2 (en) | 2005-06-02 |
Family
ID=11661969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP00729297A Expired - Fee Related JP3653911B2 (en) | 1997-01-20 | 1997-01-20 | Parts distribution method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3653911B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0918199A (en) * | 1995-06-30 | 1997-01-17 | Matsushita Electric Ind Co Ltd | Method for generating electronic component mounting data |
| WO2003030611A1 (en) * | 2001-09-28 | 2003-04-10 | Matsushita Electric Industrial Co., Ltd. | Optimalization apparatus, mounting apparatus, and electronic part mounting system |
| WO2005022433A2 (en) * | 2003-09-01 | 2005-03-10 | Matsushita Electric Industrial Co., Ltd. | Method for optimization of an order for component mounting and apparatus for optimization of an order for component mounting |
| US6996440B2 (en) | 2000-08-04 | 2006-02-07 | Matsushita Electric Industrial Co., Ltd. | Method for optimization of an order of component mounting, apparatus using the same, and mounter |
| DE112009000071T5 (en) | 2008-01-23 | 2011-01-13 | Panasonic Corporation, Kadoma-shi | Determination method for component mounting conditions |
-
1997
- 1997-01-20 JP JP00729297A patent/JP3653911B2/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0918199A (en) * | 1995-06-30 | 1997-01-17 | Matsushita Electric Ind Co Ltd | Method for generating electronic component mounting data |
| US6996440B2 (en) | 2000-08-04 | 2006-02-07 | Matsushita Electric Industrial Co., Ltd. | Method for optimization of an order of component mounting, apparatus using the same, and mounter |
| WO2003030611A1 (en) * | 2001-09-28 | 2003-04-10 | Matsushita Electric Industrial Co., Ltd. | Optimalization apparatus, mounting apparatus, and electronic part mounting system |
| US7313859B2 (en) | 2001-09-28 | 2008-01-01 | Matsushita Electric Industrial Co., Ltd. | Method for optimizing placement order by placement apparatuses that place electronic components on circuit board |
| WO2005022433A2 (en) * | 2003-09-01 | 2005-03-10 | Matsushita Electric Industrial Co., Ltd. | Method for optimization of an order for component mounting and apparatus for optimization of an order for component mounting |
| WO2005022433A3 (en) * | 2003-09-01 | 2005-12-22 | Matsushita Electric Ind Co Ltd | Method for optimization of an order for component mounting and apparatus for optimization of an order for component mounting |
| US7603193B2 (en) | 2003-09-01 | 2009-10-13 | Panasonic Corporation | Method for optimization of an order for component mounting and apparatus for optimization of an order for component mounting |
| DE112009000071T5 (en) | 2008-01-23 | 2011-01-13 | Panasonic Corporation, Kadoma-shi | Determination method for component mounting conditions |
| US8315728B2 (en) | 2008-01-23 | 2012-11-20 | Panasonic Corporation | Component mounting condition determination method |
Also Published As
| Publication number | Publication date |
|---|---|
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