JPH10197599A - Inspection device for semiconductor devices - Google Patents
Inspection device for semiconductor devicesInfo
- Publication number
- JPH10197599A JPH10197599A JP9017286A JP1728697A JPH10197599A JP H10197599 A JPH10197599 A JP H10197599A JP 9017286 A JP9017286 A JP 9017286A JP 1728697 A JP1728697 A JP 1728697A JP H10197599 A JPH10197599 A JP H10197599A
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- electrode
- inspected
- semiconductor element
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Tests Of Electronic Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ＢＧＡ等の電極が
バンプ形状を有する半導体素子を検査対象とした半導体
素子検査装置に関するものである。さらに詳しくは、半
導体素子の電気的性能を異方導電性シートを介在させて
検査する際に、絶縁性シートを介在させることにより被
検査半導体素子の電極と異方導電性シートの導電部との
位置合わせを高精度に行うことが可能な半導体素子検査
装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device inspection apparatus for inspecting a semiconductor device such as a BGA having a bump-shaped electrode. More specifically, when inspecting the electrical performance of a semiconductor element with an anisotropic conductive sheet interposed, an insulating sheet is interposed between an electrode of a semiconductor element to be inspected and a conductive portion of the anisotropic conductive sheet. The present invention relates to a semiconductor device inspection apparatus capable of performing alignment with high accuracy.
【０００２】[0002]
【従来の技術】一般に、機器の小型化、高性能化に伴
い、半導体素子の電極数は増加し、その電極ピッチも微
細化する傾向にある。また、ＢＧＡ等のようにその裏面
にバンプ形状の電極が形成されたパッケージＬＳＩは、
機器に実装する上において、その専有面積を小さくでき
るためその重要性が高まってきた。一方、異方導電性シ
ートは、厚さ方向にのみ導電性を示すもの、または加圧
されたときに厚さ方向にのみ導電性を示す多数の加圧導
電性導電部を有するものであり、種々の構造のものがあ
り、例えば特公昭５６−４８９５１号公報、特開昭５１
−９３３９３号公報、特開昭５３−１４７７７２号公
報、特開昭５４−１４６８７３号公報などにより知られ
ている。かかる異方導電性シートは、回路基板等の電気
検査の際に電極を傷つけることなく、確実な電気的接続
を達成できる点で有効であり、実用化されている。2. Description of the Related Art Generally, the number of electrodes of a semiconductor device is increasing and the electrode pitch is also becoming finer with the miniaturization and higher performance of equipment. In addition, a package LSI having a bump-shaped electrode formed on its back surface, such as a BGA,
The importance of mounting on devices has been increasing because the area occupied by the devices can be reduced. On the other hand, the anisotropic conductive sheet has conductivity only in the thickness direction, or has a large number of pressurized conductive conductive portions that show conductivity only in the thickness direction when pressed, There are various structures, for example, Japanese Patent Publication No. 56-48951,
-93393, JP-A-53-147772, JP-A-54-146873, and the like. Such an anisotropic conductive sheet is effective in that reliable electrical connection can be achieved without damaging electrodes during an electrical inspection of a circuit board or the like, and has been put to practical use.
【０００３】[0003]
【発明が解決しようとする課題】しかし、上記、異方導
電性シートを用いて、微細な電極ピッチを有するＢＧＡ
等の半導体素子の電気検査を行う場合、その半導体素子
の微細かつ高密度な電極と異方導電性シートの導電部と
の位置合わせが重要であり、電極間のピッチが微細かつ
高密度になるほどその重要性が増し、技術的な対応が求
められてきている。しかし、従来においては、例えばそ
の半導体素子の外形を元に位置決め板等で位置を規制し
ても、素子製造時に生ずる外形の微妙な寸法バラツキ、
そり、電極位置のずれ等により、半導体素子の電極部と
異方導電性シートの導電部との電気的接続が十分に確保
できるように確実な位置合わせを行うことは困難であっ
た。また、異方導電性シートは、通常それ自体が弾性体
で製造されているため、伸び、縮み、そり、変形などが
あったり、圧接時の変形などにより半導体素子の電極部
と異方導電性シートの導電部との電気的接続が十分に確
保できるように確実な位置合わせを行うことは困難であ
った。本発明は以上のような問題点を解決するものであ
って、その目的は、検査対象であるＢＧＡ等の半導体素
子の電極ピッチが微細であっても、また半導体素子の外
形に多少の寸法バラツキ、そり、電極位置のずれ等があ
っても、半導体素子の電極部と異方導電性シートの導電
部との電気的接続が正確に確保できる半導体素子検査装
置を提供するものである。However, using the above-described anisotropic conductive sheet, a BGA having a fine electrode pitch can be used.
When conducting an electrical inspection of a semiconductor device such as a semiconductor device, it is important to align the fine and high-density electrodes of the semiconductor device with the conductive portions of the anisotropic conductive sheet. Its importance has increased and technical measures have been required. However, conventionally, for example, even if the position is regulated by a positioning plate or the like based on the outer shape of the semiconductor element, delicate dimensional variations in the outer shape generated during element manufacturing,
It has been difficult to perform reliable alignment so that electrical connection between the electrode portion of the semiconductor element and the conductive portion of the anisotropic conductive sheet can be sufficiently ensured due to warpage, displacement of the electrode position, and the like. In addition, since the anisotropic conductive sheet itself is usually made of an elastic body, it may be stretched, shrunk, warped, deformed, or deformed at the time of pressure welding, and may become electrically conductive with the electrode portion of the semiconductor element. It has been difficult to perform reliable alignment so that electrical connection with the conductive portion of the sheet can be sufficiently ensured. The present invention has been made to solve the above problems, and has as its object to reduce the dimensional variation in the outer shape of a semiconductor element even if the electrode pitch of a semiconductor element such as a BGA to be inspected is fine. It is an object of the present invention to provide a semiconductor device inspection apparatus capable of accurately securing an electrical connection between an electrode portion of a semiconductor device and a conductive portion of an anisotropic conductive sheet even if there is a warp, a displacement of an electrode position, or the like.
【０００４】[0004]
【課題を解決するための手段】すなわち本発明は、検査
対象半導体素子と電気的検査装置の間に、異方導電性シ
ートを介在させて当該半導体素子の電気的検査を行う電
気的検査装置であって、前記異方導電性シートと検査対
象半導体素子との間に絶縁性シートを介在させ、該絶縁
性シートには検査対象半導体素子の各被検査電極に対応
した位置に開口部を設け、前記異方導電性シートはシー
トの厚さ方向に伸びる複数の導電部が前記絶縁シートの
開口部と対応するように配置されてなることを特徴とす
る半導体素子検査装置を提供するものである。また、上
記半導体素子検査装置において、検査対象半導体素子の
被検査電極が該素子平面より突出した形状を有し、該電
極が絶縁性シートの開口部に貫通もしくは挿入され、異
方導電性シートの導電部と圧接される機構を有する半導
体素子検査装置を提供するものである。That is, the present invention relates to an electric inspection apparatus for electrically inspecting a semiconductor element to be inspected by interposing an anisotropic conductive sheet between the semiconductor element to be inspected and the electric inspection apparatus. Then, an insulating sheet is interposed between the anisotropic conductive sheet and the semiconductor element to be inspected, and the insulating sheet is provided with an opening at a position corresponding to each electrode to be inspected of the semiconductor element to be inspected, The anisotropic conductive sheet provides a semiconductor device inspection apparatus, wherein a plurality of conductive portions extending in a thickness direction of the sheet are arranged so as to correspond to openings of the insulating sheet. Further, in the above-described semiconductor element inspection apparatus, the electrode to be inspected of the semiconductor element to be inspected has a shape protruding from the element plane, and the electrode is penetrated or inserted into the opening of the insulating sheet, and An object of the present invention is to provide a semiconductor device inspection apparatus having a mechanism that is pressed against a conductive portion.
【０００５】[0005]
【発明の実施の形態】本発明において、絶縁性シートは
異方導電性シートと検査対象半導体素子との間に介在さ
せて用いられ、該絶縁性シートには検査対象半導体素子
の各被検査電極に対応した位置に開口部を設けたもので
ある。該絶縁性シートの開口部は、検査対象半導体素子
の電極に対応する位置に設けられ、検査対象半導体素子
を異方導電性シートを介在させて電気的検査を行う際
に、検査対半導体素子の電極が該開口部に貫通もしくは
一部が挿入され、異方導電性シートの導電部と接合もし
くは圧接されるものである。また、該絶縁性シートの開
口部は異方導電性シートの導電部と一体的に配置して用
いるが、その状態で絶縁性シートと異方導電性シートと
が接合されていてもよい。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the present invention, an insulating sheet is used between an anisotropic conductive sheet and a semiconductor element to be inspected, and the insulating sheet has electrodes to be inspected of the semiconductor element to be inspected. An opening is provided at a position corresponding to. The opening portion of the insulating sheet is provided at a position corresponding to the electrode of the semiconductor element to be inspected, and when the semiconductor element to be inspected is subjected to an electrical inspection with an anisotropic conductive sheet interposed therebetween, the inspection to the semiconductor element is performed. An electrode is penetrated or partially inserted into the opening, and is joined or pressed to the conductive portion of the anisotropic conductive sheet. In addition, the opening of the insulating sheet is used by being integrally disposed with the conductive portion of the anisotropic conductive sheet. In this state, the insulating sheet and the anisotropic conductive sheet may be joined.
【０００６】本発明の絶縁性シートによれば、位置決め
ピン等を利用することにより、絶縁性シートの開口部が
異方導電性シートの導電部と同一位置に配置することが
できる。このように配置した絶縁性シートの異方導電性
シートとは反対側の面に、被検査半導体素子が設置され
る。本発明の対象となる半導体素子は、クリップチップ
等のベアチップＬＳＩ，ＢＧＡ等のパッケージＬＳＩ，
ＭＣＭ等の複数の半導体素子が搭載されたモジュール基
板、回路基板等であり、特に、その電極が素子平面から
突出しているバンプ状のものに対して効果適である。さ
らに、バンプはボール形状、円柱形状、角柱形状のもの
が特に好ましい。このような電極が半導体素子平面から
突出している被検査半導体素子であると、該突出電極の
各々を上記絶縁性シートの各対応する開口部に挿入する
ことにより，半導体素子の電極部と異方導電性シートの
導電部とを正確に位置決めすることができる。そしてこ
の状態で半導体素子の電気検査で通常行われる程度の加
圧を行えば、半導体素子の電極と異方導電性シートの導
電部との電気的接続が確保できる。According to the insulating sheet of the present invention, the opening of the insulating sheet can be arranged at the same position as the conductive portion of the anisotropic conductive sheet by utilizing the positioning pins and the like. The semiconductor element to be inspected is placed on the surface of the insulating sheet thus arranged opposite to the anisotropic conductive sheet. The semiconductor element to be used in the present invention is a bare chip LSI such as a clip chip, a package LSI such as a BGA,
It is a module board, a circuit board, or the like on which a plurality of semiconductor elements such as an MCM are mounted, and is particularly suitable for bump-shaped electrodes whose electrodes protrude from the element plane. Further, it is particularly preferable that the bump has a ball shape, a column shape, and a prism shape. When such an electrode is a semiconductor element to be inspected projecting from the plane of the semiconductor element, each of the projecting electrodes is inserted into a corresponding opening of the insulating sheet to form an anisotropic electrode with the electrode section of the semiconductor element. The conductive portion of the conductive sheet can be accurately positioned. In this state, if pressure is applied to the extent normally performed in the electrical inspection of the semiconductor element, electrical connection between the electrode of the semiconductor element and the conductive portion of the anisotropic conductive sheet can be secured.
【０００７】また、本発明の絶縁性シートは、透明であ
っても不透明であってもよいが、半導体素子の電極部を
開口部に貫通もしくは挿入する際に目視で確認できる点
で透明である方が好ましい。また、本発明の絶縁性シー
トと異方導電性シートとは、別々に製造して組み合わせ
てもよいし、あらかじめ両者を一体化して製造してもよ
いが、両者の位置合わせが正確にでき、位置合わせの手
間を省ける点で、一体化されていることが好ましい。両
者を一体化するためには、それぞれを成形した後に、両
者の接合する面にシランカップリング剤等の接合剤を塗
布し加熱する方法、絶縁性シートの存在下に異方導電性
シートを製造する方法等の方法が挙げられる。The insulating sheet of the present invention may be transparent or opaque, but is transparent in that it can be visually confirmed when the electrode of the semiconductor element is penetrated or inserted into the opening. Is more preferred. Further, the insulating sheet and the anisotropic conductive sheet of the present invention may be separately manufactured and combined, or both may be integrated and manufactured in advance, but both can be accurately aligned, It is preferable that they are integrated in that they can save the trouble of alignment. In order to integrate the two, after molding each, a bonding agent such as a silane coupling agent is applied to the surface to be bonded and heated by heating, producing an anisotropic conductive sheet in the presence of an insulating sheet And the like.
【０００８】異方導電性シートはその導電部表面がシー
ト平面上に突起を有していてもよいし、平面でもよい
が、半導体素子の電極との確実な電気的接触を得るため
には、半導体素子の電極と接する側に絶縁性シートの厚
みに満たない突起を有していることが好ましい。[0008] The anisotropic conductive sheet may have a projection on the surface of the sheet or a flat surface on the surface of the sheet, but in order to obtain reliable electrical contact with the electrodes of the semiconductor element, It is preferable to have a projection less than the thickness of the insulating sheet on the side in contact with the electrode of the semiconductor element.
【０００９】異方導電性シートは、絶縁性で弾性を有す
る高分子物質で構成された絶縁部中に、導電性粒子が密
に充填されて構成された複数の導電部がシートの厚さ方
向に伸びる形で構成されたものである。導電部は異方導
電性シート全面に密に配置されていてもよいが、隣接し
たもの同士のショートを防止し、確実な導通を得られる
点で、絶縁性シートの開口部に対応した位置に柱状に配
置したものが好ましい。The anisotropic conductive sheet has a plurality of conductive portions formed by densely filling conductive particles in an insulating portion made of an insulating and elastic polymer material in the thickness direction of the sheet. It is constructed in a form that extends. The conductive portion may be densely arranged on the entire surface of the anisotropic conductive sheet, but at a position corresponding to the opening of the insulating sheet, in that a short circuit between adjacent ones is prevented and reliable conduction is obtained. Those arranged in a columnar shape are preferred.
【００１０】導電部(3a)を構成する導電粒子としては、
例えばニッケル、鉄、コバルトなどの磁性を示す金属粒
子もしくはこれらの合金の粒子、またはこれらの粒子に
金、銀、パラジウム、ロジウムなどの導電性のよい金属
のメッキを施したもの、非磁性金属粒子もしくはガラス
ビーズなどの無機質粒子またはポリマー粒子にニッケ
ル、コバルトなどの導電性磁性体のメッキを施したもの
などを挙げることができる。 これらの中ではニッケル
粒子の表面に金や銀のメッキを施した粒子が好ましい。The conductive particles constituting the conductive portion (3a) include:
For example, nickel, iron, magnetic metal particles such as cobalt or particles of alloys thereof, or gold, silver, palladium, rhodium or other such conductive metal-plated particles, non-magnetic metal particles Alternatively, inorganic particles such as glass beads or polymer particles plated with a conductive magnetic material such as nickel or cobalt can be used. Among these, particles obtained by plating gold or silver on the surface of nickel particles are preferable.
【００１１】絶縁部を構成する絶縁性で弾性を有する高
分子物質としては、架橋構造を有する高分子物質が好ま
しい。かかる架橋構造を有する高分子物質を得るために
用いることができる高分子材料としては、シリコーンゴ
ム、ポリブタジエン、天然ゴム、ポリイソプレン、スチ
レンーブタジエン共重合体ゴム、アクリロニトリルーブ
タジエン共重合体ゴム、エチレンープロピレン共重合体
ゴム、ウレタンゴム、ポリエステル系ゴム、クロロプレ
ンゴム、エピクロルヒドリンゴムなどを挙げることがで
きる。これらの中では、成形性、電気特性の点でシリコ
ーンゴムが好ましい。異方導電性シートは、上記成形材
料を用いて形成した層の厚さ方向に平行磁場をかけて、
その磁力によって導電粒子を移動させながら、硬化する
ことによって製造することができる。As the insulating and elastic polymer constituting the insulating portion, a polymer having a crosslinked structure is preferable. Examples of the polymer material that can be used to obtain a polymer substance having such a crosslinked structure include silicone rubber, polybutadiene, natural rubber, polyisoprene, styrene butadiene copolymer rubber, acrylonitrile butadiene copolymer rubber, and ethylene. -Propylene copolymer rubber, urethane rubber, polyester rubber, chloroprene rubber, epichlorohydrin rubber and the like. Among these, silicone rubber is preferred in terms of moldability and electrical properties. The anisotropic conductive sheet applies a parallel magnetic field in the thickness direction of the layer formed using the molding material,
It can be manufactured by hardening while moving the conductive particles by the magnetic force.
【００１２】以下、図面によって本発明を具体的に説明
する。図１は本発明の絶縁性シートを用いた半導体素子
検査装置およびそこに検査対象半導体素子を装着した具
体的構成例を示すものである。検査対象のパッケージＬ
ＳＩ１の電極１ａは、絶縁性シート２の開口部２ａに挿
入されている。一方、片面に導電部の突起を有する異方
導電性シート３は、その導電部３ａが絶縁性シートの開
口部２ａに対応した位置となるように位置決めピン４で
位置を規制されている。検査対象のパッケージＬＳＩ１
の電極１ａと異方導電性シートの導電部３ａとは、加圧
板５を介して十分な電気的接続を得る程度に加圧されて
おり、異方導電性シートの導電部と対応した位置から配
線を引き出した基板６を介して、パッケージＬＳＩの各
電極は外部の電気的検査測定機に接続されている。Hereinafter, the present invention will be described in detail with reference to the drawings. FIG. 1 shows a semiconductor device inspection apparatus using an insulating sheet of the present invention and a specific configuration example in which a semiconductor device to be inspected is mounted thereon. Package L to be inspected
The electrode 1a of SI1 is inserted into the opening 2a of the insulating sheet 2. On the other hand, the position of the anisotropic conductive sheet 3 having the protrusion of the conductive portion on one side is regulated by the positioning pin 4 so that the conductive portion 3a is located at a position corresponding to the opening 2a of the insulating sheet. Package LSI1 to be inspected
Of the anisotropically conductive sheet and the conductive portion 3a of the anisotropically conductive sheet are pressed to such an extent that a sufficient electrical connection is obtained via the pressing plate 5, and from a position corresponding to the conductive portion of the anisotropically conductive sheet. Each electrode of the package LSI is connected to an external electrical inspection and measurement device via the substrate 6 from which the wiring is drawn.
【００１３】絶縁性シート１は、実用的には好ましくは
０．０１−１ｍｍ、さらに好ましくは０．１−０．５ｍ
ｍ程度の厚みで用いられる。この厚さは、検査対象ＩＣ
基板の電極の突出高さと異方導電性シートの厚み、突起
高さを考慮して設定することができる。絶縁性シートの
材質は、例えばポリイミド樹脂、エポキシ樹脂等の熱硬
化性樹脂や、例えばポリエチレンテレフタレート樹脂、
塩化ビニル樹脂、ポリスチレン樹脂、ポリアクリロニト
リル樹脂、ポリエチレン樹脂。アクリル樹脂、ポリブタ
ジエン樹脂等の熱可塑性樹脂などが用いられる。これら
の中では、耐熱性、寸法安定性の点で熱硬化性樹脂が好
ましく、特にポリイミド樹脂が好ましい。絶縁性シート
の開口部の穴あけは、ＮＣ(Numerical Control)制御の
ドリル穴あけ装置やレーザー加工装置を用いて行うこと
ができる。 また、多数のピンを有する金型を用いて成
形することによっても製造できる。絶縁シートの開口部
の形状は、円形であっても角形であってもよい。また、
開口部は、回路基板の各電極に対応した位置に開けるの
が好ましい。例えばＢＣＡの場合、その電極位置に対応
して図２のように格子状（グリッド）に配列して開ける
のが好ましい。また、開口部は図３のように、２つ以上
の電極位置を連結して開けてもよい。被検査対象半導体
素子の位置合わせは、上記絶縁シートのみでも可能だ
が、例えば図４に示されるような位置合わせ板７などを
併用することができる。The insulating sheet 1 is practically preferably 0.01-1 mm, more preferably 0.1-0.5 m.
It is used with a thickness of about m. This thickness depends on the IC to be inspected.
It can be set in consideration of the protruding height of the electrode on the substrate, the thickness of the anisotropic conductive sheet, and the height of the protrusion. The material of the insulating sheet is, for example, a thermosetting resin such as a polyimide resin or an epoxy resin, or a polyethylene terephthalate resin, for example.
Vinyl chloride resin, polystyrene resin, polyacrylonitrile resin, polyethylene resin. A thermoplastic resin such as an acrylic resin and a polybutadiene resin is used. Among these, a thermosetting resin is preferable in terms of heat resistance and dimensional stability, and a polyimide resin is particularly preferable. Drilling of the opening of the insulating sheet can be performed using a drilling device or a laser processing device controlled by Numerical Control (NC). It can also be manufactured by molding using a mold having a large number of pins. The shape of the opening of the insulating sheet may be circular or square. Also,
The opening is preferably opened at a position corresponding to each electrode of the circuit board. For example, in the case of BCA, it is preferable to open the electrodes in a grid pattern as shown in FIG. Further, the opening may be opened by connecting two or more electrode positions as shown in FIG. The alignment of the semiconductor element to be inspected can be performed using only the insulating sheet, but for example, an alignment plate 7 as shown in FIG. 4 can be used together.
【００１４】以下、本発明の実施例を説明するが、本発
明はこれらの実施例に限定されるものではない。Hereinafter, embodiments of the present invention will be described, but the present invention is not limited to these embodiments.
【実施例】厚さ０．１ｍｍのポリイミドフィルムに、Ｎ
Ｃ制御のドリル穴あけ装置で、検査対象パッケージＬＳ
Ｉの半球状（径０．２５ｍｍ、厚み０．１ｍｍ）のバン
プ（０．５ｍｍピッチ）に対応した位置に０．３ｍｍ径
の穴を開け、さらにフィルムの４隅に位置決め用のピン
のガイド穴を４点あけ、位置決め用の絶縁性シートを製
造した。次に、熱硬化型シリコーンゴムに平均粒径４０
umの金メッキしたニッケルよりなる導電性磁性体粒子を
１２体積％となる割合で混合して成形材料を調製した。
次にこの成形材料を金型のキャビティ内（厚み０．２５
ｍｍ）に層状に配置した。この金型は、各々電磁石で構
成される上型と下型よりなり、上型と下型には、それぞ
れ検査対象パッケージＬＳＩの電極位置に対応したパタ
ーンの強磁性体部分と、それ以外の非磁性体部分を有し
成形材料と接する磁極板が設けられている。また、上記
の上下の磁極板は、上記イミドフィルムの４隅のガイド
穴に相当する位置にガイドピンをたてることにより位置
合わせを行った。この状態で上型、下型の電磁石を動作
させ、異方導電性シート材料層の厚さ方向に平行磁場を
作用させて、導電性粒子を磁場方向に並べさせ、圧力を
加えながら１００℃、１時間硬化させて異方導電性シー
トを製造した。上記のように成形金型の４隅にガイドピ
ンをたてることにより、４隅に位置合わせ用のガイド穴
を有する異方導電性シートが得られた。EXAMPLE A 0.1 mm thick polyimide film was coated with N
Package C to be inspected with C control drilling machine
Holes of 0.3 mm diameter are made at positions corresponding to the hemispherical (0.25 mm diameter, 0.1 mm thickness) bumps (0.5 mm pitch) of I, and guide holes for positioning pins at the four corners of the film. Was opened at four points to produce an insulating sheet for positioning. Next, an average particle size of 40 was added to the thermosetting silicone rubber.
A molding material was prepared by mixing conductive magnetic particles of um gold-plated nickel at a ratio of 12% by volume.
Next, the molding material is placed in the cavity of the mold (having a thickness of 0.25).
mm) in layers. This mold includes an upper mold and a lower mold each composed of an electromagnet. The upper mold and the lower mold have a ferromagnetic portion having a pattern corresponding to the electrode position of the package LSI to be inspected, and a non-magnetic part other than the pattern. A pole plate having a magnetic portion and in contact with the molding material is provided. The upper and lower magnetic pole plates were aligned by setting guide pins at positions corresponding to the guide holes at the four corners of the imide film. In this state, the upper and lower electromagnets are operated, and a parallel magnetic field is applied in the thickness direction of the anisotropic conductive sheet material layer to arrange the conductive particles in the direction of the magnetic field. After curing for one hour, an anisotropic conductive sheet was produced. By setting guide pins at the four corners of the molding die as described above, an anisotropic conductive sheet having alignment guide holes at the four corners was obtained.
【００１５】上記のようにして得られた位置決め用絶縁
シートおよび異方導電性シートを用いて、図１に示した
構成とし、無作為に抽出した１００個のパッケージＬＳ
Ｉについて電気検査を行なった。パッケージＬＳＩの各
電極の間隔のピッチは０．５ｍｍと微細で、ＩＣパッケ
ージには若干のそり等が見られていたが、位置合わせが
容易かつ正確であり、対象としたパッケージＬＳＩ全数
の電気検査を精度よく行うことができた。Using the positioning insulating sheet and the anisotropic conductive sheet obtained as described above, the configuration shown in FIG. 1 is used, and 100 packages LS extracted at random.
An electrical test was performed on I. The pitch between the electrodes of the package LSI was as fine as 0.5 mm, and slight warpage and the like were observed in the IC package. However, the alignment was easy and accurate, and the electrical inspection of all target package LSIs was performed. Was performed with high accuracy.
【００１６】[0016]
【発明の効果】本発明の半導体素子回路基板検査装置よ
れば、半導体素子の各電極部を絶縁性シートの開口部に
貫通もしくは挿入することにより正確に位置決めがで
き、さらに位置決めピン等を利用することにより、半導
体素子の電極部と異方導電性シートの導電部とを正確に
対応させることができ、この状態で半導体素子に加圧を
行えば、半導体素子の電極と異方導電性シートの導電部
との電気的接続が確保できる。このため微細かつ高密度
の半導体素子電極であっても、精度よく電気的検査装置
（治具）との導通ができ、効率よく半導体素子の検査が
できる。また、本発明の構成にすることにより、電極の
繰り返し圧接による異方どう伝性シートの導電部の劣化
も防止でき、検査装置の耐久性も高められる。According to the semiconductor device circuit board inspection apparatus of the present invention, accurate positioning can be achieved by penetrating or inserting each electrode portion of the semiconductor device into the opening of the insulating sheet, and a positioning pin or the like is used. Thereby, the electrode portion of the semiconductor element and the conductive portion of the anisotropic conductive sheet can be accurately corresponded, and when the semiconductor element is pressed in this state, the electrode of the semiconductor element and the anisotropic conductive sheet Electrical connection with the conductive portion can be secured. For this reason, even with a fine and high-density semiconductor element electrode, conduction with an electrical inspection device (jig) can be performed with high accuracy, and the semiconductor element can be inspected efficiently. Further, according to the configuration of the present invention, deterioration of the conductive portion of the anisotropic conductive sheet due to repeated pressure contact of the electrodes can be prevented, and the durability of the inspection device can be enhanced.
【図１】本発明の半導体素子検査装置の構成の一例を示
す説明図である。FIG. 1 is an explanatory diagram showing an example of a configuration of a semiconductor device inspection device of the present invention.
【図２】本発明に用いる絶縁性シートの平面図の一例で
ある。FIG. 2 is an example of a plan view of an insulating sheet used in the present invention.
【図３】本発明に用いる絶縁性シートの開口部の平面図
の一例である。FIG. 3 is an example of a plan view of an opening of an insulating sheet used in the present invention.
【図４】本発明の半導体素子検査装置の構成の一例を示
す説明図である。FIG. 4 is an explanatory diagram showing an example of a configuration of a semiconductor device inspection device of the present invention.
１ 検査対象のパッケージＬＳＩ １ａ 電極 ２ 絶縁性シート ２ａ 開口部 ３ 異方導電性シート ３ａ 導電部 ４ 位置決めピン ５ 加圧板 ６ 基板 ７ 位置合わせ板 DESCRIPTION OF SYMBOLS 1 Package LSI to be inspected 1a Electrode 2 Insulating sheet 2a Opening 3 Anisotropic conductive sheet 3a Conducting part 4 Positioning pin 5 Pressure plate 6 Substrate 7 Positioning plate
Claims (2)
に、異方導電性シートを介在させて当該素子の電気的検
査を行う電気的検査装置であって、前記異方導電性シー
トと検査対象半導体素子との間に絶縁性シートを介在さ
せ、該絶縁性シートには検査対象半導体素子の各被検査
電極に対応した位置に開口部を設け、前記異方導電性シ
ートはシートの厚さ方向に伸びる複数の導電部が前記絶
縁性シートの開口部と対応するように配置されてなるこ
とを特徴とする半導体素子検査装置。An electrical inspection apparatus for electrically inspecting a semiconductor element to be inspected and an electrical inspection apparatus by interposing an anisotropic conductive sheet between said semiconductor element and said electrical inspection apparatus. An insulating sheet is interposed between the semiconductor element to be inspected and an opening is provided in the insulating sheet at a position corresponding to each electrode to be inspected of the semiconductor element to be inspected. A plurality of conductive portions extending in the vertical direction are arranged so as to correspond to the openings of the insulating sheet.
平面より突出した形状を有し、該電極が絶縁性シートの
開口部に貫通もしくは挿入され、異方導電性シートの導
電部と圧接される機構を有する請求項１の半導体素子検
査装置2. An electrode to be inspected of a semiconductor element to be inspected has a shape projecting from a plane of the element, and the electrode penetrates or is inserted into an opening of an insulating sheet, and is pressed against a conductive part of an anisotropic conductive sheet. 2. The semiconductor device inspection apparatus according to claim 1, further comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9017286A JPH10197599A (en) | 1997-01-14 | 1997-01-14 | Inspection device for semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9017286A JPH10197599A (en) | 1997-01-14 | 1997-01-14 | Inspection device for semiconductor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10197599A true JPH10197599A (en) | 1998-07-31 |
Family
ID=11939751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9017286A Pending JPH10197599A (en) | 1997-01-14 | 1997-01-14 | Inspection device for semiconductor devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10197599A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6422879B2 (en) | 2000-02-23 | 2002-07-23 | Nec Corporation | IC socket for surface-mounting semiconductor device |
| JP2005308685A (en) * | 2004-04-26 | 2005-11-04 | Hitachi Ulsi Systems Co Ltd | Manufacturing method for semiconductor device, and test tool used therefor |
| JP2010157472A (en) * | 2009-01-05 | 2010-07-15 | Shin Etsu Polymer Co Ltd | Connector with guide for ball grid array package |
-
1997
- 1997-01-14 JP JP9017286A patent/JPH10197599A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6422879B2 (en) | 2000-02-23 | 2002-07-23 | Nec Corporation | IC socket for surface-mounting semiconductor device |
| JP2005308685A (en) * | 2004-04-26 | 2005-11-04 | Hitachi Ulsi Systems Co Ltd | Manufacturing method for semiconductor device, and test tool used therefor |
| JP4512407B2 (en) * | 2004-04-26 | 2010-07-28 | 株式会社日立超エル・エス・アイ・システムズ | Operation test method of semiconductor device |
| JP2010157472A (en) * | 2009-01-05 | 2010-07-15 | Shin Etsu Polymer Co Ltd | Connector with guide for ball grid array package |
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