JPH10190355A - Package for piezoelectric device - Google Patents
Package for piezoelectric deviceInfo
- Publication number
- JPH10190355A JPH10190355A JP35721796A JP35721796A JPH10190355A JP H10190355 A JPH10190355 A JP H10190355A JP 35721796 A JP35721796 A JP 35721796A JP 35721796 A JP35721796 A JP 35721796A JP H10190355 A JPH10190355 A JP H10190355A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- package
- crystal oscillator
- terminal group
- adjustment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Oscillators With Electromechanical Resonators (AREA)
- Inductance-Capacitance Distribution Constants And Capacitance-Resistance Oscillators (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は圧電デバイスに関
し、特に携帯電話等の移動体通信機に用いられる温度補
償された高精度小型水晶発振器のパッケージ構造に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a piezoelectric device, and more particularly, to a package structure of a temperature-compensated high-precision small crystal oscillator used for a mobile communication device such as a mobile phone.
【0002】[0002]
【従来の技術】水晶発振器は他の振動子等を利用した発
振器と比べ周波数安定度、経年変化等が優れているため
各種の通信機器に利用され、特に近年では移動体通信機
の普及と共にその需要が増加している。近年、温度補償
型水晶発振器に関する小型化、コスト低減の要請は強
く、それを達成すべく発振回路、温度補償回路および温
度補償定数調整回路をIC化する方法が提案され実用化
されている。図2はそのような温度補償型水晶発振器1
0の調整工程における模式図であり、前記発振器10と
調整装置12とを接続する端子群13および出力、電
源、接地等に接続する端子群14より構成されている。
端子群13は温度補償型水晶発振器の温度補償定数、出
力周波数精度、出力電圧等の調整時のみ必要で、調整後
は不要となる端子であるのに対し、端子群4は水晶発振
器として完成した後、携帯電話等に搭載する際に電源の
受給、接地および出力周波数の供給等に必要な端子であ
る。2. Description of the Related Art Quartz oscillators are used for various types of communication equipment because of their superior frequency stability, aging, etc. as compared with oscillators using other oscillators and the like. Demand is increasing. In recent years, there has been a strong demand for miniaturization and cost reduction of temperature-compensated crystal oscillators, and in order to achieve the demand, a method of integrating an oscillation circuit, a temperature compensation circuit, and a temperature compensation constant adjustment circuit into ICs has been proposed and put into practical use. FIG. 2 shows such a temperature-compensated crystal oscillator 1
FIG. 4 is a schematic diagram in an adjustment process of 0, and is composed of a terminal group 13 for connecting the oscillator 10 and the adjustment device 12 and a terminal group 14 for connection to an output, a power supply, a ground, and the like.
The terminal group 13 is necessary only when adjusting the temperature compensation constant, output frequency accuracy, output voltage, etc. of the temperature-compensated crystal oscillator, and becomes unnecessary after the adjustment. On the other hand, the terminal group 4 is completed as a crystal oscillator. These terminals are necessary for receiving power, grounding, supplying output frequency, and the like when mounted on a mobile phone or the like.
【0003】温度補償型水晶発振器の外部出力端子とし
ては前記端子群14があり、周波数出力端子14a、電
源端子14b、接地端子14c(GND端子)、そして
数本のオプション端子14d、14e・・等を設けるの
が一般的である。一方、従来は発振回路、温度補償回路
を設定し、温度−周波数特性の測定値に基づいて個別の
補償電子部品を決定していたが、IC化に伴って前記補
償電子部品の値を外部より信号で制御することが可能と
なり、調整装置12との電気的導通を確保するための端
子群13が必要となった。該端子群13としては例えば
温度補償定数調整用端子、出力周波数調整用端子、出力
調整用端子等があり、その本数はICの設計により決ま
る。The external output terminals of the temperature compensated crystal oscillator include the terminal group 14, a frequency output terminal 14a, a power supply terminal 14b, a ground terminal 14c (GND terminal), and several optional terminals 14d, 14e, etc. Is generally provided. On the other hand, conventionally, an oscillation circuit and a temperature compensation circuit were set, and individual compensation electronic components were determined based on the measured value of the temperature-frequency characteristic. The control can be performed by a signal, and a terminal group 13 for securing electrical conduction with the adjusting device 12 is required. The terminal group 13 includes, for example, a temperature compensation constant adjustment terminal, an output frequency adjustment terminal, an output adjustment terminal, and the like, and the number thereof is determined by the design of the IC.
【0004】図3は従来の温度補償型水晶発振器のセラ
ミックパッケージ11の裏面における端子配置例を示す
平面図である。温度補償定数調整用端子、周波数調整用
端子、出力調整用端子等として端子群13と温度補償型
水晶発振器の外部出力端子として端子群14とが、セラ
ミックパッケージ11の裏面に半田付け用端子として配
置されている。周知のように水晶発振器用セラミックパ
ッケージ11のベース部分は数層の積層から構成され、
各層には配線が形成されている。層間は必要な配線と各
端子を接続する貫通導体が複数施されている。FIG. 3 is a plan view showing an example of terminal arrangement on the back surface of a ceramic package 11 of a conventional temperature-compensated crystal oscillator. A terminal group 13 as a temperature compensation constant adjustment terminal, a frequency adjustment terminal, an output adjustment terminal, and the like, and a terminal group 14 as an external output terminal of the temperature-compensated crystal oscillator are arranged as soldering terminals on the back surface of the ceramic package 11. Have been. As is well known, the base portion of the ceramic package 11 for a crystal oscillator is composed of several layers.
Wiring is formed in each layer. A plurality of through conductors for connecting necessary wiring and each terminal are provided between the layers.
【0005】また、図4は従来の温度補償型水晶発振器
の他のセラミックパッケージの一例で、温度補償定数調
整用、周波数調整用端子、出力調整用端子等の端子群1
3をダミー基板部15上に形成した例を示す斜視図であ
る。セラミックパッケージ11を製作する際にダミー基
板部15も含めて一体的に製作し、該基板部15上に上
記端子群13を配置する。端子群13を用いて温度補償
等の必要な調整を行った後、ダミー基板部15を基板1
1上に形成した溝B−B’に沿って切断し、端子群13
を取り去る。FIG. 4 shows an example of another ceramic package of a conventional temperature-compensated crystal oscillator. The terminal group 1 includes terminals for temperature compensation constant adjustment, frequency adjustment, and output adjustment.
FIG. 3 is a perspective view showing an example in which 3 is formed on a dummy substrate unit 15. When manufacturing the ceramic package 11, the dummy package part 15 and the dummy substrate part 15 are integrally manufactured, and the terminal group 13 is arranged on the substrate part 15. After performing necessary adjustments such as temperature compensation using the terminal group 13, the dummy substrate 15 is moved to the substrate 1.
1 along the groove BB ′ formed on the
Remove.
【0006】[0006]
【発明が解決しようとする課題】しかしながら端子とし
て温度制御定数調整用端子、周波数調整用端子等が多数
必要であり、上記のパッケージの裏面に端子群13、1
4を配置した例においてはセラミックパッケージの外形
寸法が端子ピッチと端子数によって制限され、小型化が
困難であるという欠点があった。また、温度定数調整用
端子、周波数調整用端子等にダミー基板部15を設ける
方法では実際にパッケージとして機能する機能寸法に比
べて基板寸法が大きくなり、パッケージコストが高くな
るという欠点があった。更に、上記2例のパッケージを
用いた水晶発振器をプリント板等に搭載する場合に上記
端子群14あるいはその配線が実装される側の配線に接
触する虞があるという欠点があった。本発明は上記欠点
を解決するためになされたものであって、高精度で小型
な温度補償型水晶発振器を提供することを目的とする。However, a large number of terminals for temperature control constant adjustment, frequency adjustment, and the like are required as terminals.
In the example where 4 is arranged, the external dimensions of the ceramic package are limited by the terminal pitch and the number of terminals, and there is a disadvantage that miniaturization is difficult. In addition, the method of providing the dummy substrate portion 15 on the terminal for adjusting the temperature constant, the terminal for adjusting the frequency, and the like has a disadvantage that the substrate size is larger than the functional size that actually functions as a package, and the package cost is increased. Further, when the crystal oscillator using the above two packages is mounted on a printed board or the like, there is a disadvantage that the terminal group 14 or the wiring on the side on which the wiring is mounted may come into contact. The present invention has been made in order to solve the above-mentioned drawbacks, and has as its object to provide a high-precision and small-sized temperature-compensated crystal oscillator.
【0007】[0007]
【課題を解決するための手段】上記目的を達成するため
に請求項1の本発明は、圧電デバイスを構成する電子部
品を収納する表面実装形式のパッケージにおいて、前記
圧電デバイスの調整端子をパッケージ裏面に形成した凹
陥部に配設したことを特徴とする圧電デバイス用パッケ
ージである。請求項2記載の発明は、前記凹陥部の形状
を左右非対称とすると共に調整治工具の形状をこれにほ
ぼ一致させることにより、調整治工具の前記凹陥部への
誤挿入を防止したことを特徴とする請求項1記載の圧電
デバイス用パッケージである。According to a first aspect of the present invention, there is provided a surface mount type package for accommodating electronic components constituting a piezoelectric device, wherein an adjustment terminal of the piezoelectric device is provided on a back surface of the package. A package for a piezoelectric device, wherein the package is provided in a recess formed in the piezoelectric device. The invention according to claim 2 is characterized in that the shape of the recess is left-right asymmetric and the shape of the adjusting jig is made to substantially match this, thereby preventing erroneous insertion of the adjusting jig into the recess. The package for a piezoelectric device according to claim 1, wherein
【0008】[0008]
【発明の実施の形態】以下本発明を図面に示した実施の
形態に基づいて詳細に説明する。図1(a)、(b)は
本発明の一実施例を示す温度補償型水晶発振器用セラミ
ックパッケージ1の裏面の平面図及びA−A’断面図で
あって、ほぼ中央に凹陥部2を設け、該部2に温度補償
定数調整用端子、周波数調整用端子等の端子群3を格子
状に形成する。一方、温度補償型水晶発振器の出力端
子、電源端子、接地端子等の外部出力端子として端子群
4を、図1(a)に示すようにセラミックパッケージ1
の裏面の平面部、一般的には底面の4隅に形成する。セ
ラミックパッケージ1は数層の積層板より構成され、各
層には必要な配線が施されている。更に、層間の必要な
接続あるいは端子との接続のため各層を気密貫通する導
体を形成してある。更に、発振、補償回路、補償部品等
を含むIC5と電子部品6、7等をセラミックパッケー
ジの上部に搭載し、電気的シールド等を兼ねて金属の蓋
を被せる。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail based on an embodiment shown in the drawings. FIGS. 1A and 1B are a plan view and a cross-sectional view taken along the line AA ′ of the back surface of a ceramic package 1 for a temperature-compensated crystal oscillator according to an embodiment of the present invention. A terminal group 3 such as a temperature compensation constant adjusting terminal and a frequency adjusting terminal is formed in a lattice shape on the portion 2. On the other hand, a terminal group 4 as an external output terminal such as an output terminal, a power supply terminal, and a ground terminal of the temperature-compensated crystal oscillator is connected to a ceramic package 1 as shown in FIG.
Are formed at the flat portion on the back surface, generally at the four corners of the bottom surface. The ceramic package 1 is composed of several layers of laminated boards, and each layer is provided with necessary wiring. Further, a conductor is formed through each layer in a hermetically sealed manner for necessary connection between layers or connection to terminals. Further, the IC 5 including the oscillation, the compensation circuit, the compensation component, and the like, and the electronic components 6, 7 and the like are mounted on the upper part of the ceramic package, and a metal cover is also put on as an electric shield and the like.
【0009】温度補償の調整工程では、凹陥部に形成さ
れた端子群3の温度補償定数調整用端子にプローブピン
を接触させ、それを介してセラミックパッケージ1に搭
載されたIC5に調整時の情報、例えば温度、抵抗値等
の情報を書き込む。図1(c)にプローブ9の一例を示
すように、プローブの外形は前記凹陥部2の形状に合致
するように形成し、該プローブに前記端子群3と対応す
る位置にこれと同数の接点9aを埋め込んで置く。端子
群3のそれぞれの端子寸法は、プローブピンが接触でき
る大きさがあれば良く、端子群4の端子のように半田付
けする必要がないため端子寸法を小さくすることが可能
で、小さな凹陥部2に多数の端子を配置することができ
る。従って、上記端子群3に要していた底面積を縮小す
ることが可能でセラミックパッケージ1を大幅に小型化
することができる。また、温度補償定数調整用端子、周
波数調整用端子等の端子群3をセラミックパッケージ1
の裏面の小さな凹陥部2に形成することにより、温度補
償調整工程において、多数の温度補償型水晶発振器をマ
ザーボードに搭載する際に、該発振器の端子群3とマザ
ーボード上の対応するプローブピンの接触が極めて容易
である。また端子同士の短絡を防止することができ、マ
ザーボード上の配置の自由度が高まり、多数の温度補償
型水晶発振器をマザーボード上に収容することが可能と
なる。In the temperature compensation adjustment step, the probe pins are brought into contact with the temperature compensation constant adjustment terminals of the terminal group 3 formed in the recessed portions, and the information at the time of adjustment is applied to the IC 5 mounted on the ceramic package 1 via the probe pins. For example, information such as a temperature and a resistance value is written. As shown in FIG. 1 (c), an example of the probe 9 is formed so that the outer shape of the probe matches the shape of the concave portion 2, and the probe has the same number of contacts at positions corresponding to the terminal group 3. 9a is embedded and placed. The terminal dimensions of the terminal group 3 need only be large enough to allow the probe pins to come into contact with each other, and need not be soldered unlike the terminals of the terminal group 4, so that the terminal dimensions can be reduced. 2 can be provided with a large number of terminals. Accordingly, the bottom area required for the terminal group 3 can be reduced, and the size of the ceramic package 1 can be significantly reduced. A terminal group 3 such as a terminal for temperature compensation constant adjustment and a terminal for frequency adjustment is connected to the ceramic package 1.
When a large number of temperature-compensated crystal oscillators are mounted on the motherboard in the temperature compensation adjustment step, contact between the terminal groups 3 of the oscillators and the corresponding probe pins on the motherboard can be achieved. Is very easy. In addition, short-circuiting between terminals can be prevented, the degree of freedom in arrangement on the motherboard is increased, and a large number of temperature-compensated crystal oscillators can be accommodated on the motherboard.
【0010】従来の温度補償型水晶発振器では温度補償
用IC等からの調整用の端子群3にいたる配線はセラミ
ックパッケージの表面上を横断する様に形成されていた
が、本発明ではセラミックパッケージ1の表裏を貫通す
る複数の導体を形成し、セラミックパッケージ1の裏面
に最短距離で端子群3を形成するため、配線による浮遊
容量を大幅に低減することができ、浮遊容量による周波
数への悪影響、例えば周波数がシフトする等を避けるこ
とができる。また、端子群3を平面配線とせず、層間を
貫通させるため、セラミックパッケージ上の配線設計の
自由度を高めることも可能となる。In the conventional temperature-compensated crystal oscillator, the wiring from the temperature-compensating IC and the like to the terminal group 3 for adjustment is formed so as to cross over the surface of the ceramic package. Since a plurality of conductors penetrating the front and back of the ceramic package 1 are formed and the terminal group 3 is formed at the shortest distance on the back surface of the ceramic package 1, the stray capacitance due to wiring can be greatly reduced. For example, frequency shift can be avoided. Further, since the terminal group 3 is not formed as a plane wiring but penetrates between layers, it is also possible to increase the degree of freedom in wiring design on the ceramic package.
【0011】セラミックパッケージ1の裏面に形成した
凹陥部2を図1(a)に示すように左右非対称にするに
より、調整用プローブピンを温度補償定数調整用端子、
周波数調整用端子等の端子群3に接触させる際に、誤接
触を防止することができる。また、調整用の端子群3が
温度補償型水晶発振器のセラミックパッケージ1の裏面
に残してあるため経年変化等で発振周波数あるいは温度
補償が変化した場合には前記端子群3を用いて再調整す
ることが可能である。The recess 2 formed on the back surface of the ceramic package 1 is made asymmetrical as shown in FIG.
When contacting the terminal group 3 such as a frequency adjusting terminal, erroneous contact can be prevented. Further, since the adjustment terminal group 3 is left on the back surface of the ceramic package 1 of the temperature-compensated crystal oscillator, if the oscillation frequency or the temperature compensation changes due to aging or the like, the terminal group 3 is readjusted. It is possible.
【0012】また、必ずしも一つの凹陥部に全ての調整
用端子を形成する必要はなく、調整用端子毎に凹陥部を
形成してもよい。また温度補償方式および調整方法にか
かわらず、調整用端子を外部に露出する必要がある水晶
発振器には本発明を適用できることは自明であろう。Further, it is not always necessary to form all the adjustment terminals in one recess, and a recess may be formed for each adjustment terminal. Further, it is obvious that the present invention can be applied to a crystal oscillator that needs to expose an adjustment terminal to the outside irrespective of the temperature compensation method and the adjustment method.
【0013】また、チップ部品をセラミック基板1の裏
面に実装する場合、調整用端子の端子群3を形成する凹
陥部2とチップ部品を搭載する凹陥部とを別々に形成す
れば、チップ部品を接合する際に用いられる導電性接着
剤または半田の流れ込みによる調整用端子の短絡を防止
することができる。尚、以上本発明を水晶発振器に適応
した場合を例として説明したが、本発明はこれのみに限
定されるものではなく、組立後に電気的調整を要するモ
ジュールであってもよい。When the chip component is mounted on the back surface of the ceramic substrate 1, the recess 2 for forming the terminal group 3 of the adjustment terminal and the recess for mounting the chip component are separately formed. It is possible to prevent a short circuit of the adjustment terminal due to the inflow of the conductive adhesive or solder used for joining. In the above, the case where the present invention is applied to a crystal oscillator has been described as an example. However, the present invention is not limited to this, and may be a module that requires electrical adjustment after assembly.
【0014】[0014]
【発明の効果】本発明は以上説明した如く構成するもの
であるから、温度補償定数用端子、周波数調整用端子等
が多くても、外形寸法を小型化する上で著しい効果を発
揮する。更に、マザーボード上に搭載する際に調整用の
配線が接触ピンの圧接だけで済むため、搭載時の工数が
大幅に短縮されるという効果がある。Since the present invention is constructed as described above, even if there are many terminals for temperature compensation constants, terminals for frequency adjustment, etc., a remarkable effect can be obtained in reducing the external dimensions. Furthermore, when mounting on a motherboard, the wiring for adjustment only needs to be press-contacted with the contact pins, so that there is an effect that the man-hour at the time of mounting is greatly reduced.
【図1】(a)は本発明に係る温度補償型水晶発振器用
パッケージの裏面の平面図、(b)は(a)の断面図、
(c)はプローブの一例を示す斜視図である。1A is a plan view of a back surface of a package for a temperature-compensated crystal oscillator according to the present invention, FIG. 1B is a cross-sectional view of FIG.
(C) is a perspective view showing an example of a probe.
【図2】温度補償型水晶発振器の調整用端子、出力端子
を示す模造図である。FIG. 2 is a schematic diagram showing an adjustment terminal and an output terminal of the temperature compensated crystal oscillator.
【図3】従来の温度補償型水晶発振器用セラミックパッ
ケージの一例の裏面を示す平面図である。FIG. 3 is a plan view showing a back surface of an example of a conventional ceramic package for a temperature-compensated crystal oscillator.
【図4】従来の他の温度補償型水晶発振器用セラミック
パッケージの裏面を示す斜視図である。FIG. 4 is a perspective view showing the back surface of another conventional ceramic package for a temperature-compensated crystal oscillator.
1・・・セラミックパッケージ 2・・・凹陥部 3・・・温度補償定数調整用、周波数調整用等の端子群 4・・・出力、電源、接地用等の外部用の端子群 5・・・IC 6、7・・・電子部品 8・・・蓋 9・・・プローブ 9a・・・接点 A、A’・・・切断点 DESCRIPTION OF SYMBOLS 1 ... Ceramic package 2 ... Depressed part 3 ... Terminal group for temperature compensation constant adjustment, frequency adjustment, etc. 4 ... External terminal group for output, power supply, grounding, etc. 5 ... IC 6, 7: Electronic component 8: Lid 9: Probe 9a: Contact A, A ': Cutting point
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 FI H03H 9/10 H03H 9/10 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 6 Identification code FI H03H 9/10 H03H 9/10
Claims (2)
する表面実装形式のパッケージにおいて、前記圧電デバ
イスの調整端子をパッケージ裏面に形成した凹陥部に配
設したことを特徴とする圧電デバイス用パッケージ。1. A package for a piezoelectric device, wherein an adjustment terminal of the piezoelectric device is disposed in a concave portion formed on a back surface of the package in a surface mounting type package for housing electronic components constituting the piezoelectric device.
共に調整治工具の形状をこれにほぼ一致させることによ
り、調整治工具の前記凹陥部への誤挿入を防止したこと
を特徴とする請求項1記載の圧電デバイス用パッケー
ジ。2. The erroneous insertion of the adjusting jig into the concave portion is prevented by making the shape of the concave portion left-right asymmetric and making the shape of the adjusting jig substantially coincide with the shape of the adjusting jig. Item 7. A package for a piezoelectric device according to Item 1.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP35721796A JPH10190355A (en) | 1996-12-25 | 1996-12-25 | Package for piezoelectric device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP35721796A JPH10190355A (en) | 1996-12-25 | 1996-12-25 | Package for piezoelectric device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH10190355A true JPH10190355A (en) | 1998-07-21 |
Family
ID=18452983
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP35721796A Pending JPH10190355A (en) | 1996-12-25 | 1996-12-25 | Package for piezoelectric device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH10190355A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001058007A1 (en) * | 2000-01-31 | 2001-08-09 | Kinseki Limited | Vessel for oscillation circuits using piezoelectric vibrator, method of producing the same, and oscillator |
JP2006157674A (en) * | 2004-11-30 | 2006-06-15 | Kyocera Kinseki Corp | Temperature compensated crystal oscillator |
JP2009055545A (en) * | 2007-08-29 | 2009-03-12 | Citizen Finetech Miyota Co Ltd | Piezoelectric device and manufacturing method thereof |
-
1996
- 1996-12-25 JP JP35721796A patent/JPH10190355A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001058007A1 (en) * | 2000-01-31 | 2001-08-09 | Kinseki Limited | Vessel for oscillation circuits using piezoelectric vibrator, method of producing the same, and oscillator |
JP4795602B2 (en) * | 2000-01-31 | 2011-10-19 | 京セラキンセキ株式会社 | Oscillator |
JP2006157674A (en) * | 2004-11-30 | 2006-06-15 | Kyocera Kinseki Corp | Temperature compensated crystal oscillator |
JP2009055545A (en) * | 2007-08-29 | 2009-03-12 | Citizen Finetech Miyota Co Ltd | Piezoelectric device and manufacturing method thereof |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7098580B2 (en) | Piezoelectric oscillator | |
US7256659B2 (en) | Temperature compensated crystal oscillator and method of manufacturing same | |
US7123108B2 (en) | Surface mount crystal oscillator | |
US20050225406A1 (en) | Temperature-compensated quartz-crystal oscillator | |
JP2960374B2 (en) | Piezoelectric oscillator | |
US6798307B2 (en) | Sheet substrate for crystal oscillator and method of manufacturing surface-mount crystal oscillators using same | |
JP2001177044A (en) | Electronic part module and piezoelectric oscillator | |
US4058970A (en) | Digital display electronic timepiece | |
JP2000278047A (en) | Surface mount crystal oscillator and its manufacture | |
JP3426053B2 (en) | Package structure of temperature compensated piezoelectric oscillator | |
KR20010006928A (en) | Surface mounting structure and surface mount type electronic component included therein | |
JP4724518B2 (en) | Piezoelectric oscillator | |
JPH10190355A (en) | Package for piezoelectric device | |
JP2002134873A (en) | Method for packaging chip element and quartz crystal oscillator for surface mounting | |
JPH1197931A (en) | Oscillator | |
JP3231203B2 (en) | Surface mount type temperature compensated crystal oscillator | |
JP2006060281A (en) | Piezoelectric oscillator | |
JP3099404B2 (en) | Crystal oscillator | |
JP2005253007A (en) | Temperature compensated crystal oscillator | |
JPH06104641A (en) | Surface mount type oscillator | |
JP3250366B2 (en) | Piezoelectric oscillator | |
JP2005244641A (en) | Temperature compensated crystal oscillator | |
KR100501193B1 (en) | A crystal oscillator | |
JPH02141109A (en) | Structure for piezo-oscillator | |
JP2974034B2 (en) | Circuit board and crystal oscillator using the same |