JPH10163625A - Apparatus and method of separating electronic components and solder from printed board - Google Patents
Apparatus and method of separating electronic components and solder from printed boardInfo
- Publication number
- JPH10163625A JPH10163625A JP31910696A JP31910696A JPH10163625A JP H10163625 A JPH10163625 A JP H10163625A JP 31910696 A JP31910696 A JP 31910696A JP 31910696 A JP31910696 A JP 31910696A JP H10163625 A JPH10163625 A JP H10163625A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- electronic components
- circuit board
- printed circuit
- specific gravity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、プリント基板から
の電子部品および半田の分離装置および分離方法に関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and a method for separating electronic components and solder from a printed circuit board.
【０００２】[0002]
【従来の技術】テレビ、ビデオ、パソコンなどの電気機
器にはプリント基板が内蔵されており、これらの電気機
器を廃棄するときは、プリント基板も一緒に廃棄され
る。しかしながらプリント基板に電子部品を接着する半
田は環境上の有害物であることから、電気機器を廃棄す
るときには別途回収することが望ましい。2. Description of the Related Art A printed circuit board is built in an electric device such as a television, a video, a personal computer, and the like. When these electric devices are discarded, the printed circuit board is also discarded. However, since the solder for bonding the electronic components to the printed circuit board is an environmentally harmful substance, it is desirable that the electrical equipment be separately collected when discarded.
【０００３】このため従来、電気機器を廃棄するとき
は、プリント基板を電気機器から取りはずし、プリント
基板を焼却することが知られている。[0003] For this reason, conventionally, when discarding electric equipment, it is known to remove the printed circuit board from the electric equipment and incinerate the printed circuit board.
【０００４】[0004]
【発明が解決しようとする課題】しかしながらプリント
基板を焼却する方法では、半田は加熱されて溶融して他
の物質と混ざり合うため、半田だけを他の物質と分離し
て回収できないものであった。However, in the method of incinerating a printed circuit board, the solder is heated, melted, and mixed with other substances, so that only the solder cannot be separated and collected from other substances. .
【０００５】したがって本発明は、プリント基板から電
子部品および半田を別々に分離して回収できるプリント
基板からの電子部品および半田の分離装置および分離方
法を提供することを目的とする。Accordingly, an object of the present invention is to provide an apparatus and a method for separating electronic components and solder from a printed circuit board, which can separate and collect the electronic components and solder from the printed circuit board separately.
【０００６】[0006]
【課題を解決するための手段】請求項１の発明のプリン
ト基板からの電子部品および半田の分離装置は、電子部
品よりも比重が大きくまた半田よりも比重が小さい熱媒
体液を貯溜する容器と、この熱媒体液を半田の溶融温度
以上に加熱する加熱手段とを備えた。According to the first aspect of the present invention, there is provided an apparatus for separating an electronic component and a solder from a printed circuit board, the container having a specific gravity higher than that of the electronic component and a lower specific gravity than the solder. And a heating means for heating the heat medium liquid to a temperature equal to or higher than the melting temperature of the solder.
【０００７】請求項２の発明のプリント基板からの電子
部品および半田の分離方法は、容器に貯溜された電子部
品よりも比重が大きくまた半田よりも比重が小さい熱媒
体液を加熱手段により半田の溶融温度以上に加熱し、こ
の熱媒体液中に電子部品が接着されたプリント基板を浸
漬し、電子部品および半田に外力付与手段により外力を
付与して電子部品および半田をプリント基板から分離
し、熱媒体液中に浮遊する電子部品と熱媒体液中に沈澱
する半田を別々に回収するようにした。According to a second aspect of the present invention, there is provided a method of separating an electronic component and a solder from a printed circuit board, wherein a heating medium having a specific gravity higher than that of the electronic component stored in the container and a specific gravity lower than that of the solder is removed by the heating means. Heating above the melting temperature, immersing the printed circuit board with the electronic component bonded in this heat medium liquid, applying external force to the electronic component and solder by external force applying means to separate the electronic component and solder from the printed circuit board, The electronic components floating in the heat medium liquid and the solder precipitated in the heat medium liquid are separately collected.
【０００８】[0008]
【発明の実施の形態】請求項１および請求項２記載の本
発明は、プリント基板を熱媒体液中に浸漬して電子部品
および半田をプリント基板から分離するが、分離された
電子部品は熱媒体液中に浮遊し、また半田は熱媒体液中
に沈澱するので、電子部品と半田を別々に簡単に回収で
きる。According to the first and second aspects of the present invention, a printed circuit board is immersed in a heat medium to separate electronic components and solder from the printed circuit board. Since the solder floats in the medium and the solder precipitates in the heat medium, the electronic component and the solder can be easily collected separately.
【０００９】以下、本発明の一実施の形態を図面を参照
して説明する。図１、図２、図３はプリント基板からの
電子部品および半田の分離装置の側面図であって、電子
部品と半田の分離・回収工程を工程順に示すものであ
る。An embodiment of the present invention will be described below with reference to the drawings. FIGS. 1, 2 and 3 are side views of a device for separating electronic components and solder from a printed circuit board, and show the steps of separating and collecting the electronic components and solder in the order of steps.
【００１０】まず、図１を参照して全体構造を説明す
る。１は容器であり、熱媒体液２が貯溜されている。熱
媒体液２の比重は電子部品の比重よりも大きく、半田
（一般にＰｂとＳｎの合金）の比重よりも小さい。熱媒
体液２は加熱手段３により加熱される。First, the overall structure will be described with reference to FIG. Reference numeral 1 denotes a container in which a heat medium liquid 2 is stored. The specific gravity of the heat medium liquid 2 is larger than the specific gravity of the electronic component, and smaller than the specific gravity of the solder (generally, an alloy of Pb and Sn). The heating medium liquid 2 is heated by the heating means 3.
【００１１】４はプリント基板であり、多品種の電子部
品５，６が半田７で接着されている。プリント基板４は
クランパ８にクランプして保持され、熱媒体液２に浸漬
される。９はクランパ８が備えられたブロックであっ
て、クランパ８に開閉動作を行わせ、またクランパ８に
水平方向の振動を付与する。１１はスキージであって、
シリンダ１２のロッド１３に結合されている。ロッド１
３が前進後退することにより、スキージ１１はプリント
基板４の下面に沿って摺動し、電子部品５，６をプリン
ト基板４から強制的にこすり落す。Reference numeral 4 denotes a printed circuit board on which various kinds of electronic components 5 and 6 are bonded by solder 7. The printed circuit board 4 is clamped and held by the clamper 8 and is immersed in the heating medium liquid 2. Reference numeral 9 denotes a block provided with a clamper 8, which causes the clamper 8 to perform an opening and closing operation and imparts horizontal vibration to the clamper 8. 11 is a squeegee,
It is connected to a rod 13 of a cylinder 12. Rod 1
By moving the squeegee 3 forward and backward, the squeegee 11 slides along the lower surface of the printed circuit board 4 and forcibly scrapes the electronic components 5 and 6 off the printed circuit board 4.
【００１２】次に、プリント基板４からの電子部品５，
６や半田８の分離・回収方法を説明する。図１に示すよ
うに、プリント基板４をクランパ８でクランプして熱媒
体液２中に浸漬する。熱媒体液２は加熱手段３により半
田７の溶融温度（一般に、１８３°Ｃ程度）以上に加熱
されている。Next, the electronic components 5 from the printed circuit board 4
A method of separating and collecting the solder 6 and the solder 8 will be described. As shown in FIG. 1, the printed circuit board 4 is clamped by a clamper 8 and immersed in the heating medium liquid 2. The heating medium liquid 2 is heated by the heating means 3 to a temperature higher than the melting temperature of the solder 7 (generally, about 183 ° C.).
【００１３】次に図２に示すようにシリンダ１２のロッ
ド１３を突出させ、スキージ１１を左方へ移動させる。
このとき、ブロック９を駆動してプリント基板４を水平
方向へ往復振動させる。スキージ１１はプリント基板４
の下面に沿って摺動し、電子部品５，６および半田７を
プリント基板４からこすり取る。次にシリンダ１２のロ
ッド１３は引き込んでスキージ１１は当初の右位置に復
帰する（図３）。Next, as shown in FIG. 2, the rod 13 of the cylinder 12 is projected, and the squeegee 11 is moved to the left.
At this time, the block 9 is driven to reciprocate the printed circuit board 4 in the horizontal direction. Squeegee 11 is printed circuit board 4
, And rub the electronic components 5 and 6 and the solder 7 from the printed circuit board 4. Next, the rod 13 of the cylinder 12 is retracted, and the squeegee 11 returns to the initial right position (FIG. 3).
【００１４】以上のようにして電子部品５，６および半
田７はプリント基板４から分離されるが、分離後には、
電子部品５，６の比重は熱媒体液２の比重よりも小さい
ので、図３に示すように熱媒体液２中に浮遊し、また半
田７の比重は熱媒体液２の比重よりも大きいので熱媒体
液２中に沈澱する。そこで熱媒体液２中の電子部品５，
６と半田７を別々に回収する。The electronic components 5 and 6 and the solder 7 are separated from the printed circuit board 4 as described above.
Since the specific gravity of the electronic components 5 and 6 is smaller than the specific gravity of the heat medium liquid 2, they float in the heat medium liquid 2 as shown in FIG. 3 and the specific gravity of the solder 7 is larger than the specific gravity of the heat medium liquid 2. It precipitates in the heating medium 2. Therefore, the electronic components 5 in the heat medium liquid 2
6 and the solder 7 are separately collected.
【００１５】以上のように本方法によれば、プリント基
板４に接着された電子部品５，６と半田７を別々に分離
して回収することができる。なおブロック９によりプリ
ント基板４を振動させる手段や、スキージ１１により電
子部品５，６や半田７をこすり取る手段は原理的にはな
くてもよいものであるが、このような外力付与手段を設
けることにより、電子部品５，６や半田７をより確実に
プリント基板４から分離させることができる。As described above, according to the present method, the electronic components 5 and 6 adhered to the printed circuit board 4 and the solder 7 can be separately separated and collected. The means for vibrating the printed circuit board 4 by the block 9 and the means for rubbing the electronic components 5, 6 and the solder 7 by the squeegee 11 need not be in principle, but such external force applying means is provided. Thereby, the electronic components 5 and 6 and the solder 7 can be more reliably separated from the printed circuit board 4.
【００１６】[0016]
【発明の効果】本発明によれば、電子部品や半田をプリ
ント基板から別々に簡単に分離させて回収することがで
きる。According to the present invention, electronic components and solder can be easily separated and recovered from a printed circuit board.
【図１】プリント基板からの電子部品および半田の分離
装置の側面図FIG. 1 is a side view of an apparatus for separating electronic components and solder from a printed circuit board.
【図２】プリント基板からの電子部品および半田の分離
装置の側面図FIG. 2 is a side view of an apparatus for separating electronic components and solder from a printed circuit board.
【図３】プリント基板からの電子部品および半田の分離
装置の側面図FIG. 3 is a side view of an apparatus for separating electronic components and solder from a printed circuit board.
１ 容器 ２ 熱媒体液 ３ 加熱手段 ４ プリント基板 ５，６ 電子部品 ７ 半田 ８ クランパ ９ ブロック １１ スキージ １２ シリンダ DESCRIPTION OF SYMBOLS 1 Container 2 Heat medium liquid 3 Heating means 4 Printed circuit board 5, 6 Electronic component 7 Solder 8 Clamper 9 Block 11 Squeegee 12 Cylinder
Claims (2)
も比重が小さい熱媒体液を貯溜する容器と、この熱媒体
液を半田の溶融温度以上に加熱する加熱手段とを備えた
ことを特徴とするプリント基板からの電子部品および半
田の分離装置。1. A container for storing a heat medium liquid having a specific gravity larger than that of an electronic component and a specific gravity smaller than that of solder, and a heating means for heating the heat medium liquid to a temperature higher than a melting temperature of the solder. A device for separating electronic components and solder from a printed circuit board.
きくまた半田よりも比重が小さい熱媒体液を加熱手段に
より半田の溶融温度以上に加熱し、この熱媒体液中に電
子部品が接着されたプリント基板を浸漬し、電子部品お
よび半田に外力付与手段により外力を付与して電子部品
および半田をプリント基板から分離し、熱媒体液中に浮
遊する電子部品と熱媒体液中に沈澱する半田を別々に回
収することを特徴とするプリント基板からの電子部品お
よび半田の分離方法。2. A heating medium having a specific gravity greater than that of the electronic components stored in the container and a specific gravity lower than that of the solder is heated to a temperature equal to or higher than a melting temperature of the solder by a heating means, and the electronic components are bonded to the heating medium. The printed circuit board is immersed, and an external force is applied to the electronic component and the solder by an external force applying unit to separate the electronic component and the solder from the printed circuit board, and settle in the electronic component and the heating medium liquid that float in the heating medium liquid. A method for separating electronic components and solder from a printed circuit board, wherein solder is separately collected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31910696A JP3460480B2 (en) | 1996-11-29 | 1996-11-29 | Apparatus and method for separating electronic components and solder from printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31910696A JP3460480B2 (en) | 1996-11-29 | 1996-11-29 | Apparatus and method for separating electronic components and solder from printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10163625A true JPH10163625A (en) | 1998-06-19 |
| JP3460480B2 JP3460480B2 (en) | 2003-10-27 |
Family
ID=18106537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31910696A Expired - Fee Related JP3460480B2 (en) | 1996-11-29 | 1996-11-29 | Apparatus and method for separating electronic components and solder from printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3460480B2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030055727A (en) * | 2001-12-27 | 2003-07-04 | 엘지전자 주식회사 | solder removal method and device for chip mount reworking |
| JP2007294648A (en) * | 2006-04-25 | 2007-11-08 | Denso Corp | Method and apparatus for removing solder of substrate |
| CN100427273C (en) * | 2003-08-26 | 2008-10-22 | 宏达国际电子股份有限公司 | Electronic component carrier and method for shattering and loading electronic components on circuit board |
| CN105327934A (en) * | 2015-12-11 | 2016-02-17 | 珠海格力电器股份有限公司 | Waste circuit board element removing system and process |
| US10362720B2 (en) | 2014-08-06 | 2019-07-23 | Greene Lyon Group, Inc. | Rotational removal of electronic chips and other components from printed wire boards using liquid heat media |
| CN111607768A (en) * | 2020-06-08 | 2020-09-01 | 福建阿石创新材料股份有限公司 | Planar target material unbinding device and method |
| CN115138938A (en) * | 2022-09-05 | 2022-10-04 | 江苏华频电子科技有限公司 | Conveying device for cleaning circuit board of angle grinder and working method thereof |
-
1996
- 1996-11-29 JP JP31910696A patent/JP3460480B2/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030055727A (en) * | 2001-12-27 | 2003-07-04 | 엘지전자 주식회사 | solder removal method and device for chip mount reworking |
| CN100427273C (en) * | 2003-08-26 | 2008-10-22 | 宏达国际电子股份有限公司 | Electronic component carrier and method for shattering and loading electronic components on circuit board |
| JP2007294648A (en) * | 2006-04-25 | 2007-11-08 | Denso Corp | Method and apparatus for removing solder of substrate |
| US10362720B2 (en) | 2014-08-06 | 2019-07-23 | Greene Lyon Group, Inc. | Rotational removal of electronic chips and other components from printed wire boards using liquid heat media |
| US11343950B2 (en) | 2014-08-06 | 2022-05-24 | Greene Lyon Group, Inc. | Rotational removal of electronic chips and other components from printed wire boards using liquid heat media |
| CN105327934A (en) * | 2015-12-11 | 2016-02-17 | 珠海格力电器股份有限公司 | Waste circuit board element removing system and process |
| CN111607768A (en) * | 2020-06-08 | 2020-09-01 | 福建阿石创新材料股份有限公司 | Planar target material unbinding device and method |
| CN115138938A (en) * | 2022-09-05 | 2022-10-04 | 江苏华频电子科技有限公司 | Conveying device for cleaning circuit board of angle grinder and working method thereof |
| CN115138938B (en) * | 2022-09-05 | 2022-12-23 | 江苏华频电子科技有限公司 | Conveying device for cleaning circuit board of angle grinder and working method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3460480B2 (en) | 2003-10-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |