JPH10163605A - Electronic circuit device - Google Patents

Electronic circuit device

Info

Publication number
JPH10163605A
JPH10163605A JP31600596A JP31600596A JPH10163605A JP H10163605 A JPH10163605 A JP H10163605A JP 31600596 A JP31600596 A JP 31600596A JP 31600596 A JP31600596 A JP 31600596A JP H10163605 A JPH10163605 A JP H10163605A
Authority
JP
Japan
Prior art keywords
conductive adhesive
bonding agent
electrode
silicone group
circuit device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
JP31600596A
Other languages
Japanese (ja)
Inventor
Hiroki Tawara
浩樹 田原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP31600596A priority Critical patent/JPH10163605A/en
Publication of JPH10163605A publication Critical patent/JPH10163605A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PROBLEM TO BE SOLVED: To prevent breakage and degradation of the electrode of surface mounting type parts caused by a stress propagating in an adhesive material, by using, as a conductive bonding agent, a silicone group conductive bonding agent where a silicone group resin is mixed with a conductive filler. SOLUTION: An electrode 4 formed on both ends of a surface mounting type part 2 and a wiring film 3 of a printed board 1 are connected together with a silicone group conductive bonding agent 6. As for the silicone group conductive agent 6, a conductive filler, for example, a silver filler, is distributed in a silicone group resin to provide a conductivity, which is small in elastic modulus compared with a solder and an epoxy group conductive bonding agent. Thus, most of a force is absorbed by elasticity of the silicone group conductive bonding agent 6 itself, resulting in relaxed stress.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、電子回路装置、特
にプリント基板の配線膜に表面実装型部品の電極を導電
性接着材を介して接続した電子回路装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit device, and more particularly to an electronic circuit device in which electrodes of a surface-mounted component are connected to a wiring film of a printed circuit board via a conductive adhesive.

【０００２】[0002]

【従来の技術】従来において、プリント基板とそれに表
面実装される表面実装型部品との接続には半田を用いる
のが一般的である。図２はそのような従来例の一つを示
す断面図である。図面において、１はプリント基板、２
はそれに表面実装される表面実装型部品（例えばチップ
コンデンサ、チップ抵抗等）、３は該プリント基板１の
表面に形成された配線膜（部品ランド）、４は表面実装
型部品２の両端に形成された電極、５は該電極４とプリ
ント基板１の配線膜３との間を接続する半田である。2. Description of the Related Art Conventionally, solder is generally used to connect a printed circuit board to a surface-mounted component mounted on the surface of the printed circuit board. FIG. 2 is a sectional view showing one such conventional example. In the drawings, 1 is a printed circuit board, 2
Is a surface-mounted component (for example, a chip capacitor or a chip resistor) mounted on the surface thereof, 3 is a wiring film (component land) formed on the surface of the printed circuit board 1, and 4 is formed on both ends of the surface-mounted component 2. The electrodes 5 and 5 are solders for connecting between the electrodes 4 and the wiring film 3 of the printed circuit board 1.

【０００３】尚、半田に代えてエポキシ系の導電性接着
剤を用いる場合もある。エポキシ系の導電性接着剤はエ
ポキシ系の樹脂に銀フィラーを充填させて導電性を付与
したものである。In some cases, an epoxy-based conductive adhesive is used instead of solder. The epoxy-based conductive adhesive is obtained by filling a silver filler into an epoxy-based resin to impart conductivity.

【０００４】[0004]

【発明が解決しようとする課題】ところで、図２に示す
ような半田５をプリント基板１の配線膜３と表面実装型
部品２の電極４との接続に用いた電子回路装置には、プ
リント基板１に外部から力が加わったときその力が応力
となって半田５内を伝わり、その応力が大きい場合には
表面実装型部品の電極４部分の破壊を招いてしまうとい
う問題があった。また、図２に示すような電子回路装置
においては、半田による接続時に半田５の表面張力によ
り表面実装型部品２の電極４の下面とプリント基板１の
配線膜３との間の半田４の多くが電極４の表面実装型部
品２側面に当たる部分に引き寄せられてしまい、電極４
下面と配線膜３との間に存在する半田４の厚さが薄くな
るという問題もあった。というのは、実装する部品の特
性上、部品の電極以外の部分をプリント基板に接触させ
ないようにしたり、ある程度以上の間隙ｄを確保するこ
とが要望される場合がある。例えばＳＡＷフィルターの
ような部品を用いる場合がそれである。このような場合
には、半田４の電極４下面・配線膜３間における厚さを
厚くできないので、そのような要望には応えられないか
らである。An electronic circuit device using a solder 5 as shown in FIG. 2 for connecting the wiring film 3 of the printed circuit board 1 and the electrode 4 of the surface-mount type component 2 includes a printed circuit board. When a force is applied from the outside to 1, the force becomes a stress and is transmitted through the solder 5. If the stress is large, there is a problem that the electrode 4 portion of the surface mount type component is broken. Further, in the electronic circuit device as shown in FIG. 2, most of the solder 4 between the lower surface of the electrode 4 of the surface mount component 2 and the wiring film 3 of the printed board 1 due to the surface tension of the solder 5 at the time of connection by solder. Is attracted to the portion of the electrode 4 that is in contact with the side surface of the surface-mounted component 2,
There is also a problem that the thickness of the solder 4 existing between the lower surface and the wiring film 3 is reduced. This is because, due to the characteristics of the component to be mounted, there are cases where it is required to prevent a portion other than the electrode of the component from contacting the printed circuit board or to secure a gap d of a certain degree or more. This is the case, for example, when using components such as SAW filters. In such a case, since the thickness of the solder 4 between the lower surface of the electrode 4 and the wiring film 3 cannot be increased, such a demand cannot be satisfied.

【０００５】それに対して、半田に代えてエポキシ系導
電性接着剤を用いた場合には、接着剤の半田４の電極４
下面・配線膜３間における厚さを厚くできないという問
題は少ないが、しかし、エポキシ系導電性接着剤は約５
０００〜１００００ＭＰａ（５００〜１０００Ｋｇｆ／
ｍｍ2 ）程度の弾性率を有し、可撓性がきわめて少な
い。従って、半田を用いた場合に生じた問題、即ち、プ
リント基板１に外部から力が加わったときその力が応力
となって導電性接着剤内を伝わり、その応力が大きい場
合には表面実装型部品の電極４部分の破壊を招いてしま
うという問題は克服できないのである。On the other hand, when an epoxy-based conductive adhesive is used instead of the solder, the electrode 4 of the solder 4 of the adhesive is used.
Although there is little problem that the thickness between the lower surface and the wiring film 3 cannot be increased, however, about 5
000 to 10000 MPa (500 to 1000 kgf /
It has an elastic modulus of the order of mm 2 ) and very little flexibility. Therefore, a problem that occurs when solder is used, that is, when a force is applied to the printed circuit board 1 from the outside, the force becomes a stress and is transmitted through the conductive adhesive. The problem of destruction of the electrode 4 of the component cannot be overcome.

【０００６】本発明はこのような問題点を解決すべく為
されたものであり、プリント基板の配線膜に表面実装型
部品の電極を導電性接着材を介して接続した電子回路装
置において、外部からの力を受けたときその力により導
電性接着材に生じる応力を緩和し、以て接着材内を伝わ
る応力により例えば表面実装型部品の電極が破壊された
り、劣化したりすることを防止することを目的とする。SUMMARY OF THE INVENTION The present invention has been made to solve such a problem. In an electronic circuit device in which electrodes of a surface mount type component are connected to a wiring film of a printed board via a conductive adhesive, an external circuit device is provided. Reduces the stress generated in the conductive adhesive when the force is applied, thereby preventing, for example, the electrodes of the surface mount component from being broken or deteriorated by the stress transmitted through the adhesive. The purpose is to:

【０００７】[0007]

【課題を解決するための手段】請求項１の電子回路装置
は、導電性接着剤としてシリコーン系樹脂に導電性フィ
ラーを混ぜてなるシリコーン系導電性接着剤を用いてな
ることを特徴とする。従って、請求項１の電子回路装置
によれば、シリコーン系導電性接着剤がエポキシ系導電
性接着剤に比較してきわめて小さな弾性率、約２０ＭＰ
ａ（２Ｋｇｆ／ｍｍ2 ）を有し、可撓性があるので、外
部からの力を受けたときその力により導電性接着材に生
じる応力を緩和し、以て接着材内を伝わる応力により例
えば表面実装型部品の電極が破壊されたり、劣化したり
することを防止することができる。The electronic circuit device according to the present invention is characterized in that a silicone-based conductive adhesive obtained by mixing a silicone-based resin with a conductive filler is used as the conductive adhesive. Therefore, according to the electronic circuit device of the first aspect, the silicone-based conductive adhesive has an extremely small elastic modulus, about 20 MP, as compared with the epoxy-based conductive adhesive.
a ( 2 Kgf / mm 2 ), and is flexible, so that when an external force is applied, the stress generated in the conductive adhesive is reduced by the force. It is possible to prevent the electrodes of the surface mount component from being broken or degraded.

【０００８】[0008]

【発明の実施の形態】以下、本発明を図示実施の形態に
従って詳細に説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the illustrated embodiments.

【０００９】図１は本発明電子回路装置の第１の実施の
形態を示す断面図である。１はプリント基板、２はそれ
に表面実装される表面実装型部品（例えばチップコンデ
ンサ、チップ抵抗等）、３は該プリント基板１の表面に
形成された配線膜（部品ランド）、４は表面実装型部品
２の両端に形成された電極、６は該電極４とプリント基
板１の配線膜３との間を接続するシリコーン系の導電性
接着剤である。FIG. 1 is a sectional view showing a first embodiment of the electronic circuit device of the present invention. 1 is a printed circuit board, 2 is a surface-mounted component (for example, a chip capacitor or a chip resistor) mounted on the surface thereof, 3 is a wiring film (component land) formed on the surface of the printed circuit board 1, and 4 is a surface-mounted type. Electrodes 6 formed at both ends of the component 2 are silicone-based conductive adhesives connecting the electrodes 4 and the wiring film 3 of the printed circuit board 1.

【００１０】シリコーン系の導電性接着剤６はシリコー
ン系の樹脂に導電性フィラー、例えば銀フィラーを充分
に分散させて導電性を付与したものであり、半田やエポ
キシ系導電性接着剤に比較して弾性率が約２０ＭＰａ
（２Ｋｇｆ／ｍｍ2 ）ときわめて小さい。従って、プリ
ント基板１に外部から大きな力が加わった場合、半田や
エポキシ系導電性接着剤のように弾性率の小さいものの
ように加わった力の多くが接着剤自身を応力として伝わ
るようなことはなく、シリコーン系導電性接着剤６自身
の持つ可撓性により撓んで力の多くを吸収してしまい、
応力が著しく緩和される。The silicone-based conductive adhesive 6 is obtained by sufficiently dispersing a conductive filler, for example, a silver filler, in a silicone-based resin to impart conductivity, and is compared with a solder or an epoxy-based conductive adhesive. About 20MPa elastic modulus
( 2 kgf / mm 2 ), which is extremely small. Therefore, when a large force is applied to the printed circuit board 1 from the outside, most of the applied force, such as a solder or an epoxy-based conductive adhesive having a low elastic modulus, is transmitted as a stress by the adhesive itself. Instead, it flexes due to the flexibility of the silicone conductive adhesive 6 itself and absorbs much of the force,
Stress is relieved significantly.

【００１１】依って、プリント基板１に外部から力が加
わったときその力が応力となって導電性接着剤内を伝わ
り、その応力によって表面実装型部品の電極４部分の破
壊を招いてしまうという問題を解決することができる。Therefore, when a force is applied to the printed circuit board 1 from the outside, the force becomes a stress and is transmitted through the conductive adhesive, and the stress causes the destruction of the electrode 4 of the surface mount component. Can solve the problem.

【００１２】また、接着時における導電性接着剤６の表
面張力は半田の場合に比較してきわめて小さいので、図
２に示すような電子回路装置において存在していたとこ
ろの問題、即ち、半田による接続時に半田５の表面張力
により表面実装型部品２の電極４の下面とプリント基板
１の配線膜３との間の半田４の多くが電極４の表面実装
型部品２側面に当たる部分に引き寄せられてしまい、電
極４下面と配線膜３との間に存在する半田４の厚さが薄
くなるという問題も生じない。従って、シリコーン系導
電性接着剤６の厚みを適宜に厚くすることにより表面実
装型部品２とプリント基板１との間の隙間を必要な大き
さにすることができる。Further, since the surface tension of the conductive adhesive 6 at the time of bonding is extremely small as compared with the case of soldering, the problem existing in the electronic circuit device as shown in FIG. At the time of connection, most of the solder 4 between the lower surface of the electrode 4 of the surface mount component 2 and the wiring film 3 of the printed circuit board 1 is attracted to a portion of the electrode 4 which contacts the side surface of the surface mount component 2 due to the surface tension of the solder 5. Therefore, there is no problem that the thickness of the solder 4 existing between the lower surface of the electrode 4 and the wiring film 3 is reduced. Accordingly, by appropriately increasing the thickness of the silicone-based conductive adhesive 6, the gap between the surface-mounted component 2 and the printed board 1 can be made necessary.

【００１３】[0013]

【発明の効果】請求項１の電子回路装置によれば、シリ
コーン系導電性接着剤が半田やエポキシ系導電性接着剤
に比較してきわめて小さな弾性率、約２０ＭＰａ（２Ｋ
ｇｆ／ｍｍ2 ）を有し、可撓性があるので、外部からの
力を受けたときその力により導電性接着材に生じる応力
を緩和し、以て接着材内を伝わる応力により例えば表面
実装型部品の電極が破壊されたり、劣化したりすること
を防止することができる。According to the electronic circuit device of the first aspect, the silicone-based conductive adhesive has an extremely low elastic modulus, about 20 MPa (2K) as compared with the solder or epoxy-based conductive adhesive.
gf / mm 2 ) and is flexible, so that when an external force is applied, the stress generated in the conductive adhesive is relieved by the force. The electrode of the mold component can be prevented from being broken or deteriorated.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明電子回路装置の第１の実施の形態を示す
断面図である。FIG. 1 is a sectional view showing a first embodiment of an electronic circuit device of the present invention.

【図２】電子回路装置の従来例の一つを示す断面図であ
る。FIG. 2 is a cross-sectional view showing one conventional example of an electronic circuit device.

【符号の説明】[Explanation of symbols]

１・・・プリント基板、２・・・表面実装型部品、３・
・・配線膜、４・・・電極、６・・・シリコーン系導電
性接着材。DESCRIPTION OF SYMBOLS 1 ... Printed circuit board, 2 ... Surface mount type component, 3
..Wiring film, 4 ... electrode, 6 ... silicone conductive adhesive.

Claims (2)

【特許請求の範囲】[Claims] 【請求項１】 プリント基板の配線膜に表面実装型部品
の電極を導電性接着材を介して接続した電子回路装置に
おいて、 上記導電性接着剤としてシリコーン系樹脂に導電性フィ
ラーを混ぜてなるシリコーン系導電性接着剤を用いてな
ることを特徴とする電子回路装置1. An electronic circuit device in which electrodes of a surface-mounted component are connected to a wiring film of a printed circuit board via a conductive adhesive, wherein a silicone resin is mixed with a conductive filler as the conductive adhesive. Electronic circuit device characterized by using a system-based conductive adhesive 【請求項２】 導電性フィラーが銀フィラーであること
を特徴とする請求項１記載の電子回路装置2. The electronic circuit device according to claim 1, wherein the conductive filler is a silver filler.
JP31600596A 1996-11-27 1996-11-27 Electronic circuit device Abandoned JPH10163605A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP31600596A JPH10163605A (en) 1996-11-27 1996-11-27 Electronic circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31600596A JPH10163605A (en) 1996-11-27 1996-11-27 Electronic circuit device

Publications (1)

Publication Number Publication Date
JPH10163605A true JPH10163605A (en) 1998-06-19

Family

ID=18072190

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31600596A Abandoned JPH10163605A (en) 1996-11-27 1996-11-27 Electronic circuit device

Country Status (1)

Country Link
JP (1) JPH10163605A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1174462A1 (en) * 2000-07-20 2002-01-23 Dow Corning Corporation Silicone composition and electrically conductive silicone adhesive formed therefrom
WO2006093078A1 (en) * 2005-03-03 2006-09-08 Matsushita Electric Industrial Co., Ltd. Surface acoustic wave device
WO2008016140A1 (en) 2006-08-04 2008-02-07 Panasonic Corporation Bonding material, bonded portion and circuit board
JP2008544508A (en) * 2005-06-15 2008-12-04 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング Mechanically flexible conductive joint between electrical or electronic components
US7785500B2 (en) 2005-11-02 2010-08-31 Panasonic Corporation Electrically conductive adhesive
US8410377B2 (en) 2007-11-01 2013-04-02 Panasonic Corporation Mounted structure

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1174462A1 (en) * 2000-07-20 2002-01-23 Dow Corning Corporation Silicone composition and electrically conductive silicone adhesive formed therefrom
WO2006093078A1 (en) * 2005-03-03 2006-09-08 Matsushita Electric Industrial Co., Ltd. Surface acoustic wave device
US7474175B2 (en) 2005-03-03 2009-01-06 Panasonic Corporation Surface acoustic wave device
JP2008544508A (en) * 2005-06-15 2008-12-04 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング Mechanically flexible conductive joint between electrical or electronic components
US7785500B2 (en) 2005-11-02 2010-08-31 Panasonic Corporation Electrically conductive adhesive
WO2008016140A1 (en) 2006-08-04 2008-02-07 Panasonic Corporation Bonding material, bonded portion and circuit board
US8293370B2 (en) 2006-08-04 2012-10-23 Panasonic Corporation Bonding material, bonded portion and circuit board
US8679635B2 (en) 2006-08-04 2014-03-25 Panasonic Corporation Bonding material, bonded portion and circuit board
US8410377B2 (en) 2007-11-01 2013-04-02 Panasonic Corporation Mounted structure

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