JPH1013072A - Heat radiating structure of closed device - Google Patents
Heat radiating structure of closed deviceInfo
- Publication number
- JPH1013072A JPH1013072A JP8162612A JP16261296A JPH1013072A JP H1013072 A JPH1013072 A JP H1013072A JP 8162612 A JP8162612 A JP 8162612A JP 16261296 A JP16261296 A JP 16261296A JP H1013072 A JPH1013072 A JP H1013072A
- Authority
- JP
- Japan
- Prior art keywords
- holes
- heat
- sheet
- housing
- lower case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0213—Venting apertures; Constructional details thereof
- H05K5/0215—Venting apertures; Constructional details thereof with semi-permeable membranes attached to casings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は屋外使用の密閉型装
置の放熱構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat radiating structure for a closed type device used outdoors.
【0002】[0002]
【従来の技術】従来屋外で使用される密閉型装置の放熱
構造は、その筐体内部に集熱フィンおよび筐体外部に放
熱フィンを備えたヒートパイプを設置したヒートパイプ
式冷却器構造が採用されていた。図3(a)は、従来の
放熱構造の正面図であり、(b)は、図3(a)のIII
−III 線に沿った断面図、図4は、図3(a)のII−II
線に沿った断面図である。本例では、筐体1の上部には
各動作温度の異なる3本のヒートパイプ5が設けられ
る。ヒートパイプ5の筐体内部側には、集熱フィン4、
筐体外部側には、放熱フィン4aが取付けられる。この
ヒートパイプ5は予め集熱フィン4、放熱フィン4a、
断熱材1aおよび取付板7とともに一体的にヒートパイ
プ組立体として構成され、この組立体を筐体上部に設け
た上記組立体の断熱材1aの形状に対応する孔から挿入
し取付板7を筐体1にネジ止めし、さらには、例えば孔
の隙間に適当な樹脂を充填するなどして固定され、その
外側に日除け6が設けられている。このような無線機用
の密閉型のキャビネットの放熱構造が用いられていた。2. Description of the Related Art Conventionally, a heat-dissipating structure of a hermetically sealed device used outdoors employs a heat-pipe type cooler structure in which a heat collecting fin is provided inside a housing and a heat pipe having a heat fin is provided outside the housing. It had been. FIG. 3A is a front view of a conventional heat dissipation structure, and FIG.
FIG. 4 is a sectional view taken along the line III-III, and FIG.
It is sectional drawing along the line. In this example, three heat pipes 5 having different operating temperatures are provided in the upper part of the housing 1. The heat collecting fins 4 are provided inside the housing of the heat pipe 5.
A radiation fin 4a is attached to the outside of the housing. The heat pipe 5 has a heat collecting fin 4, a heat radiating fin 4a,
A heat pipe assembly is integrally formed with the heat insulating material 1a and the mounting plate 7, and this assembly is inserted into a hole corresponding to the shape of the heat insulating material 1a of the assembly provided at the upper part of the housing, and the mounting plate 7 is mounted. It is screwed to the body 1 and further fixed, for example, by filling the gaps between the holes with a suitable resin. Such a closed cabinet heat dissipation structure for a wireless device has been used.
【0003】[0003]
【発明が解決しようとする課題】このような従来技術に
おいては、筐体の内外部にまたがるようにヒートパイプ
が設置されているため、かなりのスペースが必要なので
密閉型装置の外形寸法が大きくなるという問題点があっ
た。さらに、高価なヒートパイプ式冷却器が用いられ、
その上、筐体の構成部品が多く、組立工数も増加するた
めコストが高くなるという問題点があった。In such a prior art, since the heat pipe is provided so as to extend over the inside and outside of the housing, a considerable space is required, so that the external dimensions of the sealed device become large. There was a problem. In addition, expensive heat pipe type coolers are used,
In addition, there are many components of the housing and the number of assembly steps is increased, so that the cost is increased.
【0004】本発明の目的は、ヒートパイプ冷却器を使
用しないで、実装スペースを必要とすることなく、装置
の外形を小さくすることができ、製造が容易で、部品点
数の少ない安価な屋外で使用する装置の放熱構造を提供
することにある。SUMMARY OF THE INVENTION It is an object of the present invention to reduce the outer shape of a device without using a heat pipe cooler and without requiring a mounting space, to manufacture the device easily, and to reduce the number of parts in an inexpensive outdoor environment. An object of the present invention is to provide a heat radiation structure of a device to be used.
【0005】[0005]
【課題を解決するための手段】本発明の放熱構造は、上
筐体と下筐体を組合せることにより防水性を保持する、
密閉型装置において、前記上筐体と下筐体に、それぞ
れ、複数の貫通穴が形成されており、多数の微孔を備え
たシートが、上筐体と下筐体のそれぞれに、前記貫通穴
の全てを覆うように装着されている。The heat radiation structure of the present invention maintains waterproofness by combining an upper housing and a lower housing.
In the closed type device, a plurality of through holes are formed in the upper housing and the lower housing, respectively, and a sheet having a large number of fine holes is provided in the upper housing and the lower housing, respectively. It is fitted to cover all of the holes.
【0006】貫通穴は一定の大きさを有し、一定の間隔
を置いて上筐体と下筐体の各々に設けることができ、そ
して、シートは多数の微細な網目を有する網状体を用い
ることができる。[0006] The through-hole has a fixed size, can be provided in each of the upper housing and the lower housing at a fixed interval, and the sheet uses a mesh having a large number of fine meshes. be able to.
【0007】[0007]
【発明の実施の形態】次に、本発明の一実施の形態につ
いて図面を参照して説明する。図1は本発明の密閉型装
置の放熱構造を示す図であり、(a)は平面図、(b)
は側面図である。図2(a)は図1(b)の部分断面を
示す図、図2(b)はシートの詳細を示す図である。Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a view showing a heat radiation structure of a sealed device of the present invention, wherein (a) is a plan view and (b).
Is a side view. 2A is a view showing a partial cross section of FIG. 1B, and FIG. 2B is a view showing details of a sheet.
【0008】図1(a),(b)に示すように、放熱構
造は、上筐体11と下筐体12と放熱の為のシート13
とからなり、前記上筐体11には、内部の熱を逃がす為
に一定の間隔Dで、一定の大きさdの貫通穴14が複数
箇形成されている。As shown in FIGS. 1 (a) and 1 (b), the heat dissipation structure comprises an upper housing 11, a lower housing 12, and a sheet 13 for heat dissipation.
The upper housing 11 is provided with a plurality of through holes 14 having a certain size d at a certain interval D for releasing internal heat.
【0009】下筐体12にも、図2(a)に示すよう
に、上筐体11と同構造となっており、複数の貫通穴1
4が設けられている。前記シート13は耐水性と通気性
を有する薄い材料からなり、図2(b)のように、多数
の微孔13aが形成されており、内部の熱は逃がすが、
外部から侵入する、水やホコリを遮断する構造になって
いる。微孔の大きさは1〜10ミクロンであることが望
ましく、水滴(普通の雨の大きさは約2000ミクロ
ン)の浸透を防ぎ、水蒸気(約0.001ミクロン)は
自由に放散させるようになっている。かつ、シート13
には、シート13を上筐体11および下筐体12の内面
に組付ける為の、粘着テープ13bが、貫通穴14をふ
さがないように一定幅wで全周に一体化されて設けられ
ている。組付けに当っては、上筐体11の天板の内面
に、全ての貫通穴14を塞ぐようにシート13を粘着テ
ープ13bにて貼付する。下筐体12においても同構造
である。さらに前記上筐体11と下筐体12を組合せる
ことにより密閉型装置を実現し、水やホコリの侵入を遮
断し、内部の熱を逃がすことができる。The lower housing 12 has the same structure as the upper housing 11 as shown in FIG.
4 are provided. The sheet 13 is made of a thin material having water resistance and air permeability. As shown in FIG. 2 (b), a large number of fine holes 13a are formed and heat inside is released.
It has a structure that blocks water and dust that enters from outside. The size of the pores is preferably between 1 and 10 microns, which prevents the penetration of water droplets (normal rain size is about 2000 microns) and allows the water vapor (about 0.001 microns) to dissipate freely. ing. And sheet 13
, An adhesive tape 13b for attaching the sheet 13 to the inner surfaces of the upper housing 11 and the lower housing 12 is provided integrally with the entire circumference with a constant width w so as not to cover the through holes 14. I have. In assembling, the sheet 13 is attached to the inner surface of the top plate of the upper housing 11 with an adhesive tape 13b so as to cover all the through holes 14. The lower housing 12 has the same structure. Further, by combining the upper housing 11 and the lower housing 12, a sealed device can be realized, intrusion of water and dust can be prevented, and internal heat can be released.
【0010】このように上、下筐体の天板と底板にそれ
ぞれ複数の貫通穴を設けてあるので、内部に発生した熱
を外部に逃がすことができる。しかも微細な多数の微孔
13aを有するシート13を、上、下筐体の内面に、貫
通穴14の全てを覆うように取付けてあるので、屋外装
置に求められる防水性が得られると共に、ほこりの侵入
も防ぐことができるが、シートが通気性を有するので、
筐体内部の放熱効果を維持することができる。As described above, since a plurality of through holes are provided in the top plate and the bottom plate of the upper and lower housings, heat generated inside can be released to the outside. Moreover, since the sheet 13 having a large number of fine holes 13a is attached to the inner surfaces of the upper and lower housings so as to cover all of the through holes 14, the waterproofness required for the outdoor device can be obtained and the dust can be obtained. Can be prevented, but since the sheet has air permeability,
The heat radiation effect inside the housing can be maintained.
【0011】[0011]
【発明の効果】上、下筐体に貫通穴を形成し、多数の微
孔を有するシートをこれら筐体の内面に貼着することに
より、ヒートパイプを用いることなく放熱効果を得るこ
とができるので、装置の小型化、簡単化と部品点数の最
少限化を図ることができる、安価で組立ても容易な放熱
構造を提供できる効果がある。According to the present invention, a through hole is formed in the upper and lower housings, and a sheet having a large number of fine holes is adhered to the inner surface of the housing, whereby a heat radiation effect can be obtained without using a heat pipe. Therefore, there is an effect that it is possible to provide a heat-dissipating structure which can be reduced in size and simplification of the apparatus and the number of parts can be minimized, and which can be inexpensively assembled easily.
【図1】(a)本発明の放熱構造の一実施の形態を示す
平面図。 (b)本発明の放熱構造の一実施の形態の側面図。FIG. 1A is a plan view showing an embodiment of a heat dissipation structure according to the present invention. (B) The side view of one embodiment of the heat dissipation structure of the present invention.
【図2】(a)図1(a)のA−A線部分断面を示す
図。 (b)本発明の放熱構造のシートを示す部分平面図。FIG. 2 (a) is a diagram showing a partial cross section taken along line AA of FIG. 1 (a). (B) Partial plan view showing a sheet of the heat dissipation structure of the present invention.
【図3】(a)従来の放熱構造の正面断面図。 (b)図3(a)のIII −III 線断面図。FIG. 3A is a front sectional view of a conventional heat dissipation structure. FIG. 3B is a sectional view taken along line III-III in FIG.
【図4】図3(a)のII−II線断面図。FIG. 4 is a sectional view taken along line II-II of FIG.
【符号の説明】 1 筐体 1a 断熱材 4 集熱フィン 4a 放熱フィン 5 ヒートパイプ 11 上筐体 12 下筐体 13 シート 13a 微孔 13b 粘着テープ 14 貫通穴 D 一定の間隔 d 大きさ w 一定幅[Description of Signs] 1 housing 1a heat insulating material 4 heat collecting fin 4a heat radiating fin 5 heat pipe 11 upper housing 12 lower housing 13 sheet 13a micro hole 13b adhesive tape 14 through hole D constant interval d size w constant width
Claims (3)
水性を保持する、密閉型装置の放熱構造において、 前記上筐体と下筐体に、それぞれ、複数の貫通穴が形成
されており、多数の微孔を備えたシートが、上筐体と下
筐体のそれぞれに、前記貫通穴の全てを覆うように装着
されていることを特徴とする密閉型装置の放熱構造。1. A heat dissipating structure for a hermetically sealed device that maintains waterproofness by combining an upper housing and a lower housing, wherein a plurality of through holes are formed in each of the upper housing and the lower housing. And a sheet having a large number of fine holes is mounted on each of the upper housing and the lower housing so as to cover all of the through holes.
定の間隔を置いて形成されている請求項1記載の密閉型
装置の放熱構造。2. The heat radiating structure for a sealed device according to claim 1, wherein each of the through holes has a fixed size and is formed at fixed intervals.
体からなる請求項1記載の密閉型装置の放熱構造。3. The heat radiating structure of a closed type device according to claim 1, wherein the sheet comprises a mesh having a large number of fine meshes.
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8162612A JP2861945B2 (en) | 1996-06-24 | 1996-06-24 | Heat dissipation structure of sealed device |
SG1997002097A SG54520A1 (en) | 1996-06-24 | 1997-06-19 | Heat radiation structure of closed type device |
CN97112183.4A CN1121133C (en) | 1996-06-24 | 1997-06-23 | Heat radiation structure of closed type device |
GB9713341A GB2314920B (en) | 1996-06-24 | 1997-06-24 | Heat dissipation device |
IDP972172A ID17159A (en) | 1996-06-24 | 1997-06-24 | STRUCTURED HEAT STRUCTURE TOOL CLOSED TYPE. |
HK98104711A HK1005538A1 (en) | 1996-06-24 | 1998-06-01 | Heat dissipation device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8162612A JP2861945B2 (en) | 1996-06-24 | 1996-06-24 | Heat dissipation structure of sealed device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH1013072A true JPH1013072A (en) | 1998-01-16 |
JP2861945B2 JP2861945B2 (en) | 1999-02-24 |
Family
ID=15757915
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8162612A Expired - Fee Related JP2861945B2 (en) | 1996-06-24 | 1996-06-24 | Heat dissipation structure of sealed device |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP2861945B2 (en) |
CN (1) | CN1121133C (en) |
GB (1) | GB2314920B (en) |
HK (1) | HK1005538A1 (en) |
ID (1) | ID17159A (en) |
SG (1) | SG54520A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19840761C1 (en) * | 1998-09-07 | 2000-05-04 | Daimler Chrysler Ag | Method of manufacturing a moisture-proof pressure compensation element for a housing |
JP2000353774A (en) | 1999-06-11 | 2000-12-19 | Mitsubishi Electric Corp | Water evaporating-type heating body cooling device |
JP2001044734A (en) * | 1999-07-26 | 2001-02-16 | Matsushita Electric Ind Co Ltd | Roadside radio equipment |
EP1799021B1 (en) * | 2005-12-14 | 2012-06-06 | Denso Corporation | Waterproof case |
FR2905511B1 (en) * | 2006-09-05 | 2008-10-24 | Radiotelephone Sfr | DEHUMIDIFIER DEVICE FOR RECHARGEABLE ELECTRONIC EQUIPMENT |
CN108415236A (en) * | 2018-04-13 | 2018-08-17 | 广东小天才科技有限公司 | Waterproof intelligent wearing equipment and casing thereof |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03141091A (en) * | 1989-10-25 | 1991-06-17 | Hitachi Ltd | Magnetic recording/reproducing device |
JPH06260789A (en) * | 1993-03-05 | 1994-09-16 | Fuji Xerox Co Ltd | Shield device for substrate |
JPH08124756A (en) * | 1994-10-19 | 1996-05-17 | Meidensha Corp | Dry transformer with heat radiating layer |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH336475A (en) * | 1957-06-08 | 1959-02-28 | El Re Ma S A Per Lo Sfruttamen | Electrical apparatus comprising contact parts enclosed in a non-airtight housing |
US4666479A (en) * | 1985-07-18 | 1987-05-19 | Tensho Electric Industrial Co., Ltd. | Semiconductor wafer container |
US4635709A (en) * | 1985-12-03 | 1987-01-13 | The United States Of America As Represented By The Secretary Of The Air Force | Dual mode heat exchanger |
EP0377067A1 (en) * | 1989-01-05 | 1990-07-11 | W.L. Gore & Associates GmbH | Shut off device for a sealed housing |
-
1996
- 1996-06-24 JP JP8162612A patent/JP2861945B2/en not_active Expired - Fee Related
-
1997
- 1997-06-19 SG SG1997002097A patent/SG54520A1/en unknown
- 1997-06-23 CN CN97112183.4A patent/CN1121133C/en not_active Expired - Fee Related
- 1997-06-24 ID IDP972172A patent/ID17159A/en unknown
- 1997-06-24 GB GB9713341A patent/GB2314920B/en not_active Expired - Fee Related
-
1998
- 1998-06-01 HK HK98104711A patent/HK1005538A1/en not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03141091A (en) * | 1989-10-25 | 1991-06-17 | Hitachi Ltd | Magnetic recording/reproducing device |
JPH06260789A (en) * | 1993-03-05 | 1994-09-16 | Fuji Xerox Co Ltd | Shield device for substrate |
JPH08124756A (en) * | 1994-10-19 | 1996-05-17 | Meidensha Corp | Dry transformer with heat radiating layer |
Also Published As
Publication number | Publication date |
---|---|
GB2314920B (en) | 2000-12-27 |
CN1121133C (en) | 2003-09-10 |
JP2861945B2 (en) | 1999-02-24 |
GB2314920A (en) | 1998-01-14 |
HK1005538A1 (en) | 1999-01-15 |
SG54520A1 (en) | 1998-11-16 |
ID17159A (en) | 1997-12-04 |
CN1171530A (en) | 1998-01-28 |
GB9713341D0 (en) | 1997-08-27 |
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