GB2314920A - A watertight casing and heat dissipation device - Google Patents

A watertight casing and heat dissipation device Download PDF

Info

Publication number
GB2314920A
GB2314920A GB9713341A GB9713341A GB2314920A GB 2314920 A GB2314920 A GB 2314920A GB 9713341 A GB9713341 A GB 9713341A GB 9713341 A GB9713341 A GB 9713341A GB 2314920 A GB2314920 A GB 2314920A
Authority
GB
United Kingdom
Prior art keywords
holes
casing
heat
heat dissipation
dissipation device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB9713341A
Other versions
GB9713341D0 (en
GB2314920B (en
Inventor
Kazuo Komatsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of GB9713341D0 publication Critical patent/GB9713341D0/en
Publication of GB2314920A publication Critical patent/GB2314920A/en
Application granted granted Critical
Publication of GB2314920B publication Critical patent/GB2314920B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/02Details
    • H05K5/0213Venting apertures; Constructional details thereof
    • H05K5/0215Venting apertures; Constructional details thereof with semi-permeable membranes attached to casings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

In a closed type device composed of upper and lower casings 11, 12, a plurality of through holes 14 having a predetermined size d are formed at predetermined intervals in the upper and lower casings, the through holes serving to release heat from the interior of the device. A thin sheet 13 having water repellent property and air permeability and having a plurality of fine holes is adhesively attached to the inner surfaces of the upper and lower casings so as to cover all of the through holes.

Description

A WATERTIGHT CASING AND HEAT DISSIPATION DEVICE The present invention relates to a watertight casing and a heat dissipation device, in particular to a heat radiation structure for a closed type device, in particular for such a device for use in the open air.
As a heat radiation structure for a closed type device for use in the open air, a cooler structure of the heat pipe type has been adopted, in which heat pipes having heat collecting fins are provided in a casing of the heat radiation structure and heat pipes having heat radiation fins are provided outside the casing of the structure. For example, in Japanese Patent Publication No. 5943115, a cabinet for an electronic device, which keeps temperatures in the device approximateiy constant using a heat pipe, is disclosed. Fig. 1A is a front view of the heat radiation structure, Fig. 1B is a section view taken along the line Ill-Ill of Fig. IA, and Fig. 1C is a section view taken along the line ll-ll of Fig. 1A. In this prior art, three heat pipes 5, each operating at different temperatures, are provided in the upper zone of a casing 1. Heat collecting fins 4 are mounted to the portions of the heat pipes 5 located inside the casing 1 and heat radiation fins 4a are mounted to the portions thereof located outside the casing 1. The heat pipes 5 are integrally assembled beforehand to the heat collecting fins 4, heat radiation fins 4a, heat insulating material la and mounting plate 7 to constitute a heat pipe assembly body. The assembly body is fixed to the casing 1 in the following manner.
The assembly body is inserted into the casing 1 through a hole formed in the upper part of the assembly body so as to correspond to the shape of the heat insulating material la, and the mounting plate 7 is fixed to the casing 1 by means of screw. Then, a gap around the hole is filled with suitable resin to fix the assembly body to the casing 1. Further, a sunshade 6 is provided outside the assembly body. Such heat radiation structure of the closed cabinet type far radio equipment has been used.
In the prior art as described above, since the heat pipe is disposed across the casing, there is a problem that a relatively large space is required to mount the assembly body and hence the size of the closed type device becomes larger. Furthermore, since expensive heat pipe coolers are used and many constituent parts are used, construction man-hours increase, resulting in increased cost.
An object of at least the preferred embodiment of the present invention is to provide a heat radiation structure of a device for use in the open air at low cost, without using heat pipe coolers, in which no mounting space is required and the size of device can be reduced, and heating structures can be easily manufactured and the number of parts can be reduced.
Accordingly, in a first aspect the present invention provides a watertight casing adapted to dissipate heat from within, comprising at least one aperture closed by a membrane which is permeable to air but impermeable to water droplets.
In a second aspect, the present invention provides a heat dissipation device comprising an upper casing, a lower casing, a plurality of through holes being formed in said upper and lower casings, and sheet material covering the holes and having a plurality of holes formed therein to prevent water droplets from entering said device whilst permitting the passage of air.
A preferred embodiment of the present invention provides a heat radiation structure for a closed device in which upper and lower casings are combined to provide watertightness and in which a plurality of through holes are formed in the upper and lower casings and a sheet having therein many fine holes is mounted to the upper and lower casings, respectively, so as to cover all of the through holes.
A plurality of through holes having a predetermined size may be formed in the upper and lower casings at predetermined intervals and a sheet may be formed of a network having a large number of meshes.
Preferred features of the present invention will now be described, purely by way of example only, with reference to the accompanying drawings, in which:- FIG. lA is a front section view of a conventional heat radiation structure; FIG. lB is a section view taken along the line Ill-Ill of FIG. lA; FIG. lC is a section view taken along the line II-II of FIG. lA; FIG. 2A is a plan view showing an embodiment of a heat radiation structure FIG. 2B is a side view of the embodiment of the heat radiation structure FIG. 2C is a partial section view taken along the line A-A of FIG. 2A; and FIG. 3 is a partial plan view showing a sheet of the heat radiation structure FIGS. 2A, 2B and 2C show a heat radiation structure of a closed type device of the present invention. FIG. 2A is a plan view, and FIG. 2B is a side view. FIG. 2C and FIG. 2B are a partial section view, and FIG. 3 shows a sheet in detail.
As shown in FIGS. 2A and 2B, the heat radiation structure of the present invention consists of an upper casing 11, a lower casing 12 and a sheet 13 for heat radiation. The foregoing upper casing 11 is provided with a plurality of through holes 14 having a predetermined size d at predetermined intervals, to dissipate the heat inside the heat radiation structure.
As shown in FIG. 2C, the lower casing 12 has the same structure and a plurality of through holes 14 are formed therein. The foregoing sheet 13 is formed of a thin material having water resistance property and air permeability. As shown in FIG. 3, the sheet 13 is provided with a plurality of fine holes 13a and has a structure such that heat inside the casings is allowed to radiate through the holes 13a, but water and dusts coming from the outside are prevented from getting into the casings. Sizes of the fine holes should preferably be 1 to 10 microns, and the fine holes serve to prevent the invasion of water drops but allow vapor to freely pass therethrough, where, sizes of water drops, that is rain, are generally about 2000 microns and sizes of vapor are about 0.001 microns. An adhesive tape 13b, having a width w, is adhered to the periphery of the sheet 13 to attach the sheet 13 integrally to the inner surfaces of the casings 11 and 12 so as not to cover the holes 14. To attach the sheet 13 to the upper casing 11, the sheet 13 is attached to the inside surface of the upper casing 11 using the adhesive tape 13b so that all the holes 14 are covered with the sheet 13. In the case of the lower casing 12, the same process as described above can be taken. By combining the upper casing 11 with the lower casing 12, a closed type device can be obtained, so that invasion of water and dusts can be prevented and heat in the device can be freely released to the outside.
As described above, since the plurality of through holes are provided in the top and bottom plates of the upper and lower- casings, heat generated in the device can be radiated to the outside. In addition, since the sheet 13 having the plurality of fine through holes 13b is attached to the inside surface of the upper and lower casings 11 and 12 so as to cover all of the through holes 14, watertightness required for an outdoor device can be obtained and invasion of dusts can be prevented. Since the sheet has air permeability, heat radiation effect within the casings can be maintained.
The through holes are formed in the upper and lower casings and the sheet having a plurality of fine holes is adhesively attached to the inside surfaces thereof, and hence heat radiation effect can be obtained without using heat pipes. Therefore, an inexpensive heat radiation structure -able to achieve miniaturization and simplicity of the device as well as reduction of the number of parts can be provided, and the structure can be easily assembled.
Although the preferred embodiment of the present invention has been described in detail, it should be understood that various changes, substitutions and alteration can be made therein without departing from the scope of the invention as defined by the appended claims.
Each feature disclosed in this specification (which term includes the claims) and/or shown in the drawings may be incorporated in the invention independently of other disclosed and/or illustrated features.
The text of the abstract filed herewith is repeated here as part of the specification.
In a closed type device composed of upper and lower casings 11, 12, a plurality of through holes 14 having a predetermined size d are formed at predetermined intervals in the upper and lower casings, the through holes serving to release heat from the interior of the device. A thin sheet 13 having water repellent property and air permeability and having a plurality of fine holes is adhesively attached to the inner surfaces of the upper and lower casings so as to cover all of the through holes.

Claims (7)

1. A watertight casing adapted to dissipate heat from within, comprising at least one aperture closed by a membrane which is permeable to air but impermeable to water droplets.
2. A casing according to Claim 1, comprising upper and lower casings and a plurality of said apertures formed in said upper and lower casings to permit air to pass through the casing.
3. A casing according to Claim 1 or 2, wherein said membrane comprises at least one mesh.
4. A heat dissipation device comprising an upper casing1 a lower casing, a plurality of through holes being formed in said upper and lower casings, and sheet material covering the holes and having a plurality of holes formed therein to prevent water droplets from entering said device whilst permitting the passage of air.
5. A heat dissipation device according to Claim 4, wherein said through holes are formed at predetermined intervals.
6. A heat dissipation device according to Claims 4 or 5, wherein said sheet is formed from a network body comprising a large number of fine meshes.
7. A watertight casing or heat dissipation device substantially as herein described with reference to and as shown in Figures 2 and 3 of the accompanying drawings.
GB9713341A 1996-06-24 1997-06-24 Heat dissipation device Expired - Fee Related GB2314920B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8162612A JP2861945B2 (en) 1996-06-24 1996-06-24 Heat dissipation structure of sealed device

Publications (3)

Publication Number Publication Date
GB9713341D0 GB9713341D0 (en) 1997-08-27
GB2314920A true GB2314920A (en) 1998-01-14
GB2314920B GB2314920B (en) 2000-12-27

Family

ID=15757915

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9713341A Expired - Fee Related GB2314920B (en) 1996-06-24 1997-06-24 Heat dissipation device

Country Status (6)

Country Link
JP (1) JP2861945B2 (en)
CN (1) CN1121133C (en)
GB (1) GB2314920B (en)
HK (1) HK1005538A1 (en)
ID (1) ID17159A (en)
SG (1) SG54520A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0986290A2 (en) * 1998-09-07 2000-03-15 DaimlerChrysler AG Method for manufacturing a moisture impermeable element for pressure compensation in housing
FR2794851A1 (en) * 1999-06-11 2000-12-15 Mitsubishi Electric Corp Device for cooling heat-producing unit by water evaporation, for cooling electronic components
EP1073142A2 (en) * 1999-07-26 2001-01-31 Matsushita Electric Industrial Co., Ltd. Radio apparatus for transmitting and receiving data for a roadside communication system
FR2905511A1 (en) * 2006-09-05 2008-03-07 Radiotelephone Sfr DEHUMIDIFIER DEVICE FOR RECHARGEABLE ELECTRONIC EQUIPMENT
EP1799021A3 (en) * 2005-12-14 2009-03-11 Denso Corporation Waterproof case

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108415236A (en) * 2018-04-13 2018-08-17 广东小天才科技有限公司 Waterproof intelligent wearable device and its casing

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4635709A (en) * 1985-12-03 1987-01-13 The United States Of America As Represented By The Secretary Of The Air Force Dual mode heat exchanger

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH336475A (en) * 1957-06-08 1959-02-28 El Re Ma S A Per Lo Sfruttamen Electrical apparatus comprising contact parts enclosed in a non-airtight housing
US4666479A (en) * 1985-07-18 1987-05-19 Tensho Electric Industrial Co., Ltd. Semiconductor wafer container
EP0377067A1 (en) * 1989-01-05 1990-07-11 W.L. Gore & Associates GmbH Shut off device for a sealed housing
JPH03141091A (en) * 1989-10-25 1991-06-17 Hitachi Ltd Magnetic recording/reproducing device
JP3232748B2 (en) * 1993-03-05 2001-11-26 富士ゼロックス株式会社 PCB shield device
JPH08124756A (en) * 1994-10-19 1996-05-17 Meidensha Corp Dry transformer with heat radiating layer

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4635709A (en) * 1985-12-03 1987-01-13 The United States Of America As Represented By The Secretary Of The Air Force Dual mode heat exchanger

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0986290A2 (en) * 1998-09-07 2000-03-15 DaimlerChrysler AG Method for manufacturing a moisture impermeable element for pressure compensation in housing
EP0986290A3 (en) * 1998-09-07 2000-11-15 DaimlerChrysler AG Method for manufacturing a moisture impermeable element for pressure compensation in housing
FR2794851A1 (en) * 1999-06-11 2000-12-15 Mitsubishi Electric Corp Device for cooling heat-producing unit by water evaporation, for cooling electronic components
US6282913B1 (en) 1999-06-11 2001-09-04 Mitsubishi Denki Kabushiki Kaisha Water vaporization type cooling apparatus for heat-generating unit
EP1073142A2 (en) * 1999-07-26 2001-01-31 Matsushita Electric Industrial Co., Ltd. Radio apparatus for transmitting and receiving data for a roadside communication system
EP1073142A3 (en) * 1999-07-26 2002-09-25 Matsushita Electric Industrial Co., Ltd. Radio apparatus for transmitting and receiving data for a roadside communication system
EP1799021A3 (en) * 2005-12-14 2009-03-11 Denso Corporation Waterproof case
US7667973B2 (en) 2005-12-14 2010-02-23 Denso Corporation Waterproof case
FR2905511A1 (en) * 2006-09-05 2008-03-07 Radiotelephone Sfr DEHUMIDIFIER DEVICE FOR RECHARGEABLE ELECTRONIC EQUIPMENT
EP1898610A1 (en) * 2006-09-05 2008-03-12 Societé Française du Radiotéléphone Dehumidifier device for rechargeable electronic equipment
US7659695B2 (en) 2006-09-05 2010-02-09 Societe Francaise Du Radiotelephone Dehumidifying device for rechargeable electronic equipment

Also Published As

Publication number Publication date
CN1121133C (en) 2003-09-10
GB9713341D0 (en) 1997-08-27
GB2314920B (en) 2000-12-27
HK1005538A1 (en) 1999-01-15
JPH1013072A (en) 1998-01-16
JP2861945B2 (en) 1999-02-24
SG54520A1 (en) 1998-11-16
ID17159A (en) 1997-12-04
CN1171530A (en) 1998-01-28

Similar Documents

Publication Publication Date Title
US6778388B1 (en) Water-resistant electronic enclosure having a heat sink
US3987258A (en) Water-proof sound apparatus
US6144556A (en) Heat dissipating housing for electronic components
JP3125345U (en) Power supply
CA2212772A1 (en) Temperature and passive infrared sensor module
JP2574258Y2 (en) Waterproof housing
JP2009200912A (en) Camera
US20080248841A1 (en) Ventilation For a Portable Electronic Device
GB2314920A (en) A watertight casing and heat dissipation device
CN112702480B (en) Camera and communication equipment
JP2008020132A (en) Outdoor unit for air conditioner
KR100874037B1 (en) Infrared camera for cctv
JP2005150376A (en) Case for containing electronic circuit board
JP2019140191A (en) Electronic control equipment
JP2020195124A (en) Electronic apparatus
WO2010070796A1 (en) Electronic apparatus storing container and method for assembling electronic apparatus storing container
EP3364664B1 (en) Microphone unit
JP2572957Y2 (en) Waterproof lighting equipment
JPH1041679A (en) Electromagnetic wave shielding material and enclosure for electronic component
JPH09191190A (en) Housing for electronic device
JP2002353645A (en) Enclosure for electronic equipment
JP2007324621A (en) Cabinet for outdoor installation
JP2001184939A (en) Lighting fixture
CN100587880C (en) Contact adhesive sheet and input apparatus
JP2010093129A (en) Electronic device

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20120624