JPH10123541A - Production for liquid crystal display element - Google Patents
Production for liquid crystal display elementInfo
- Publication number
- JPH10123541A JPH10123541A JP29328696A JP29328696A JPH10123541A JP H10123541 A JPH10123541 A JP H10123541A JP 29328696 A JP29328696 A JP 29328696A JP 29328696 A JP29328696 A JP 29328696A JP H10123541 A JPH10123541 A JP H10123541A
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- Prior art keywords
- substrate
- air
- substrates
- liquid crystal
- crystal display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は液晶表示素子の製造
方法に関し、さらに詳しく言えば、透明電極が形成され
た一対の透明基板をそれらの間に空セルとなる所定のギ
ャップを残して一体的に貼合わせる液晶表示素子の製造
方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a liquid crystal display device, and more particularly, to a method of integrally forming a pair of transparent substrates on which transparent electrodes are formed, leaving a predetermined gap between them as empty cells. The present invention relates to a method for manufacturing a liquid crystal display element to be attached to a liquid crystal display device.
【０００２】[0002]
【従来の技術】液晶表示素子は、図４に例示されている
ように、片面にそれぞれ透明電極が形成された一対の透
明基板１，２の内の一方の電極面側に例えばエポキシ系
樹脂からなる熱硬化性シール材３を塗布し、それにギャ
ップ制御のためのスペーサ材を撒布した他方の電極面側
を対向させて重ね合わせてなる重ね合わせ基板４を加熱
加圧してシール材３を硬化させて得られる空セルの透明
基板１，２間のギャップ内に液晶を封入した形を基本的
な構成としている。2. Description of the Related Art As shown in FIG. 4, a liquid crystal display element is made of, for example, an epoxy resin on one electrode surface side of a pair of transparent substrates 1 and 2 each having a transparent electrode formed on one surface. A thermosetting sealing material 3 is applied, and the sealing material 3 is cured by applying heat and pressure to a superimposed substrate 4 which is formed by superposing the other electrode surface side on which a spacer material for gap control is scattered. The liquid crystal is sealed in the gap between the transparent substrates 1 and 2 of the empty cell obtained as described above.
【０００３】ここで、そのギャップ幅を均一にするため
には、それを加熱してシール材３を硬化させるまで重ね
合わせ基板４に均一な圧力をかける必要がある。Here, in order to make the gap width uniform, it is necessary to apply a uniform pressure to the superposed substrate 4 until it is heated and the sealing material 3 is cured.
【０００４】そこで、従来においては図５に示されてい
るように、一対の熱定盤５，５間に重ね合わせ基板４を
挟み込み、その両側から所定の圧力を加えながら加熱す
るようにしている。これとは別に図６に示されているよ
うに、下側の熱定盤５上に重ね合わせ基板４を載置し、
その上からエアーバック（またはダイアフラム）６ａを
備えた上型６を配置し、そのエアーバック６ａを膨らま
せて重ね合わせ基板４を加圧する方法も知られている。Therefore, conventionally, as shown in FIG. 5, a superposed substrate 4 is sandwiched between a pair of heat platens 5 and 5, and heating is performed while applying a predetermined pressure from both sides. . Separately, as shown in FIG. 6, the superimposed substrate 4 is placed on the lower heat platen 5,
There is also known a method in which an upper die 6 having an airbag (or diaphragm) 6a is arranged from above, and the airbag 6a is inflated to press the overlapping substrate 4.
【０００５】しかしながら、いずれにしても熱定盤５や
エアーバック６ａを重ね合わせ基板４に直接接触させて
加圧するものであるため、均一な加圧状態を得ることは
困難である。また、その加圧面にゴミなどの異物が付着
していると、その部分に圧力が集中しギャップむらの原
因となる。However, in any case, since the heat platen 5 and the airbag 6a are brought into direct contact with the superposed substrate 4 and pressurized, it is difficult to obtain a uniform pressurized state. Further, if foreign matter such as dust adheres to the pressurized surface, pressure is concentrated on the portion, which causes gap unevenness.
【０００６】[0006]
【発明が解決しようとする課題】このような問題は重ね
合わせ基板４を非接触で加熱加圧することにより解決さ
れる。この種の非接触式加熱加圧装置としては、例えば
株式会社ロプコ製の空気膜圧着方式による圧着機があ
り、図７にはその構成が概略的に図解されている。Such a problem can be solved by heating and pressing the superposed substrate 4 in a non-contact manner. As this type of non-contact type heating / pressing apparatus, for example, there is a crimping machine based on an air film crimping method manufactured by Lopco Co., Ltd., and the configuration is schematically illustrated in FIG.
【０００７】すなわち、この非接触式加熱加圧装置は多
数の空気噴出孔を有する上下一対のノズル盤７，７を備
えている。この場合、各ノズル盤７，７の空気噴出孔面
は水平面とされており、重ね合わせ基板４を加熱加圧す
るにあたっては、その下側のノズル盤７上に重ね合わせ
基板４を載置する。そして、各ノズル盤７，７より高温
の高圧空気を重ね合わせ基板４に対して垂直に均一に吹
き付ける。これにより、重ね合わせ基板４は空中に浮揚
した状態で、すなわち非接触状態で加熱加圧されること
になる。That is, the non-contact heating and pressurizing device includes a pair of upper and lower nozzle plates 7, 7 having a large number of air ejection holes. In this case, the surfaces of the air ejection holes of the nozzle boards 7, 7 are horizontal surfaces. When heating and pressurizing the superposed substrate 4, the superposed substrate 4 is placed on the lower nozzle board 7. Then, high-pressure air having a higher temperature than the nozzle boards 7 and 7 is blown uniformly and vertically onto the superposed substrate 4. As a result, the superposed substrate 4 is heated and pressed while floating in the air, that is, in a non-contact state.
【０００８】しかしながら、この空気膜圧着方式によっ
ても、なおも次のような問題が指摘されている。すなわ
ち、加熱加圧操作時の重ね合わせ基板４とノズル盤７，
７の間隙（空気膜厚さ）は数１０μｍ程度ときわめて小
さいものであるのに対して、重ね合わせ基板４の外側に
はその厚みが加わって数１０００μｍの間隙が存在する
ため、図８に示されているように、加熱加圧空気がその
開口から逃げることになる。したがって、重ね合わせ基
板４の周端面部分にかけられる圧力はその中央部分に比
べて低くなる。However, the following problems are still pointed out by this air film pressure bonding method. That is, the superimposed substrate 4 and the nozzle board 7,
7 is very small, about several tens of μm, whereas a gap of several thousand μm is present outside the superimposed substrate 4 due to its thickness. As described above, the heated and pressurized air escapes from the opening. Therefore, the pressure applied to the peripheral end surface of the superposed substrate 4 is lower than that of the central portion.
【０００９】このため、図９に誇張して描かれているよ
うに、シール材３の硬化に伴なって、貼合わせ基板４ａ
の周端面側の圧縮が不十分なまま固定され、同図のよう
に一対の貼合わせ基板４ａが１個のセルに対応する１個
取りの場合には、周端面に近いシール近傍のギャップ幅
が目標値よりも大きくなって、面内でのギャップ幅の不
均一の原因となり、また、一対の貼合わせ基板から複数
個のセルを切り出す多数個取りの場合には、その貼合わ
せ基板の周端面に近い部分に位置するシール部分を含む
セルについて、ギャップ不均一の問題に加えてその部分
でのシール不良、さらにはシール材に導電性ビーズを混
入させ、これによって基板間の導電接続を図る構造のセ
ルについては抵抗値の増大、導電不良などの不都合も発
生する。[0009] For this reason, as shown in an exaggerated manner in FIG.
In the case where the pair of bonded substrates 4a is one-piece corresponding to one cell as shown in the figure, the gap width near the seal near the peripheral end face is fixed while the compression on the peripheral end face side is insufficient. Becomes larger than the target value, causing non-uniformity of the gap width in the plane.In the case of multi-cavity in which a plurality of cells are cut out from a pair of bonded substrates, the periphery of the bonded substrate is Regarding the cell including the seal portion located near the end face, in addition to the problem of non-uniform gap, poor sealing at that portion, and mixing conductive beads into the sealing material, thereby achieving conductive connection between the substrates In the case of a cell having a structure, inconveniences such as an increase in resistance value and poor conductivity also occur.
【００１０】本発明は、このような問題を解決するため
になされたもので、その目的は、空気膜圧着方式による
にしても、簡単な追加的構成によって貼合わせ基板のギ
ャップ幅をより均一にすることができるようにした液晶
表示素子の製造方法を提供することにある。The present invention has been made in order to solve such a problem, and an object of the present invention is to make the gap width of a bonded substrate more uniform by a simple additional configuration even if an air film bonding method is used. It is an object of the present invention to provide a method of manufacturing a liquid crystal display element which can perform the above-mentioned operations.
【００１１】[0011]
【課題を解決するための手段】上記目的を達成するた
め、請求項１の発明では、一方の面にそれぞれ透明電極
が形成された一対の透明基板を、それらの透明電極面間
に硬化性シール材および所望によりスペーサ材を介在さ
せて対向させて重ね合わせ、位置合わせしてからその重
ね合わせ基板を水平に配置し、その上方および下方から
基板面に対して垂直に高圧空気を吹き付けることによ
り、上記重ね合わせ基板を空中に浮揚させて所定のギャ
ップが生ずるように加圧した状態で、上記シール材を硬
化させることにより、上記透明基板同士を一体的に貼合
わせる液晶表示素子の製造方法において、上記重ね合わ
せ基板の周端面全周にわたって同重ね合わせ基板とほぼ
同じ厚みを有するダミー基板を密接的に取り付け、上記
ダミー基板と上記重ね合わせ基板とを一体として空中に
浮揚させて、上記重ね合わせ基板を加圧することを特徴
としている。また、請求項２の発明では、請求項１の発
明においてシール材が熱硬化性であり、その硬化を加熱
により行なうことを特徴としている。In order to achieve the above object, according to the first aspect of the present invention, a pair of transparent substrates each having a transparent electrode formed on one surface thereof is provided with a curable seal between the transparent electrode surfaces. By overlapping and facing each other with a material and a spacer material interposed therebetween, if necessary, by aligning the overlapped substrate horizontally, and blowing high-pressure air vertically on the substrate surface from above and below, In a method for manufacturing a liquid crystal display element in which the transparent substrates are integrally bonded by curing the sealing material in a state where the overlapping substrate is floated in the air and pressurized so that a predetermined gap is generated, A dummy substrate having substantially the same thickness as the superimposed substrate is closely attached over the entire peripheral end surface of the superimposed substrate, and A Align substrate levitated in the air as an integral, is characterized by pressurizing the substrate superposed above. According to a second aspect of the present invention, in the first aspect, the sealing material is thermosetting, and the curing is performed by heating.
【００１２】これによれば、重ね合わせ基板の周縁の延
長線上にダミー基板が存在するため、重ね合わせ基板の
周端面にも、他の部分（中央部分）と同じく高圧の空気
が均一に吹き付けられることになるため、重ね合わせ基
板の周端面部分に圧力不足が生ずることがなく、したが
って貼合わせ基板全体としてより均一なギャップ幅が得
られる。According to this, since the dummy substrate is present on an extension of the peripheral edge of the superposed substrate, high-pressure air is uniformly blown to the peripheral end surface of the superposed substrate similarly to the other portion (center portion). As a result, there is no pressure shortage at the peripheral end surface of the superposed substrate, so that a more uniform gap width can be obtained as the whole bonded substrate.
【００１３】[0013]
【発明の実施の形態】次に、本発明の技術的思想をより
よく理解する上で、図１ないし図３を参照しながら、熱
硬化性のシール材を使用する場合を例にとって、その実
施の形態について説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In order to better understand the technical concept of the present invention, referring to FIGS. 1 to 3, an example in which a thermosetting sealing material is used will be described. The embodiment will be described.
【００１４】図１に例示されているように、本発明にお
いても空気膜圧着方式にしたがい、先に説明した重ね合
わせ基板４を一対のノズル盤７，７間に配置し、同ノズ
ル盤７，７よりその重ね合わせ基板４に対して高温の高
圧空気を垂直かつ均一に吹き付けて、同重ね合わせ基板
４を空中に浮揚させて加熱加圧するのであるが、この場
合、重ね合わせ基板４の周端面全周にわたってダミー基
板１０が密接的に取り付けられる。As shown in FIG. 1, according to the present invention, in accordance with the air film bonding method, the above-described superposed substrate 4 is disposed between a pair of nozzle plates 7, 7, and the nozzle plates 7, 7, high-temperature high-pressure air is blown vertically and evenly onto the superposed substrate 4 so that the superposed substrate 4 is floated in the air and heated and pressurized. In this case, the peripheral end surface of the superposed substrate 4 is used. The dummy substrate 10 is closely mounted over the entire circumference.
【００１５】このダミー基板１０は、図２に示されてい
るように、内部に重ね合わせ基板４とほぼ同じ大きさの
空間部１０ａを有するフレームからなり、重ね合わせ基
板４の厚みとほぼ等しい厚みを備えている。ここで、重
ね合わせ基板４の厚みとは透明基板１，２およびシール
材３を含めた厚みである。ダミー基板１０の材質は特に
限定されないが、重ね合わせ基板４とともに空中に浮揚
されることを考慮すると、透明基板１，２と同じ材質
（一般的にはガラス）であることが好ましい。As shown in FIG. 2, the dummy substrate 10 is formed of a frame having a space 10a having substantially the same size as the superposed substrate 4 inside, and has a thickness substantially equal to the thickness of the superposed substrate 4. It has. Here, the thickness of the superposed substrate 4 is a thickness including the transparent substrates 1 and 2 and the sealing material 3. The material of the dummy substrate 10 is not particularly limited, but is preferably the same material (generally, glass) as the transparent substrates 1 and 2 in consideration of floating in the air together with the superimposed substrate 4.
【００１６】ダミー基板１０は、その空間部１０ａ内に
重ね合わせ基板４を嵌合することにより、同重ね合わせ
基板４の周端面全周にわたって配置されるが、装着を完
全にし、また取り外しを容易にする目的で、重ね合わせ
基板４の周端面と接する内側端面に凹凸や傾斜を設ける
ことができる。空気膜圧着方式によれば、上方および下
方から垂直にしかも均一に空気が吹き付けられるため、
基本的には両基板４，１０はその対向関係を保った状態
で空中に浮揚されるが、両者の間隙が０に近くほとんど
無いような場合には、ダミー基板１０は貼合わせ基板４
に対してその摩擦係合により、空中での浮揚状態におい
てもより確実に保持される。The dummy substrate 10 is arranged over the entire peripheral end surface of the superposed substrate 4 by fitting the superposed substrate 4 into the space 10a, but the mounting is complete and the removal is easy. For this purpose, irregularities or inclinations can be provided on the inner end surface that is in contact with the peripheral end surface of the superposed substrate 4. According to the air film pressure bonding method, air is blown vertically and uniformly from above and below,
Basically, both substrates 4 and 10 are levitated in the air while maintaining their facing relationship. However, when the gap between them is almost zero and there is almost no gap, the dummy substrate 10 is attached to the bonded substrate 4.
By the frictional engagement, it is more reliably held even in a floating state in the air.
【００１７】このように、重ね合わせ基板４の周囲にダ
ミー基板１０を配置することで、図３に矢印で示されて
いるように、重ね合わせ基板４の周辺部にも他の部分と
同様、高温の高圧空気が均一かつ整然と吹き付けられる
ことになるため、透明基板１，２間のギャップ幅の均一
化が図れる。以上、熱硬化性シール材を使用する場合を
例に説明したが、本発明はこれに限定されるものでな
く、例えば紫外線硬化性シール材を使用し、紫外線透過
性の材料からなるノズル板を通して加圧状態で紫外線を
照射しシール材を硬化させる場合などにも適用可能であ
る。As described above, by arranging the dummy substrate 10 around the superimposed substrate 4, as shown by the arrow in FIG. Since the high-temperature high-pressure air is blown uniformly and orderly, the gap width between the transparent substrates 1 and 2 can be made uniform. As described above, the case where a thermosetting sealing material is used has been described as an example, but the present invention is not limited to this. For example, using an ultraviolet curing sealing material, passing through a nozzle plate made of an ultraviolet transmitting material The present invention can also be applied to a case where ultraviolet rays are irradiated in a pressurized state to cure the sealing material.
【００１８】[0018]
《実施例１》透明導電膜を有する縦３００ｍｍ×横３５
０ｍｍ×厚み０．７ｍｍの一対のガラス基板のそれぞれ
に、画面サイズ１１４ｍｍ×１５２ｍｍのＳＴＮセル４
個の表示電極に対応するストライプ状のパターニングを
行ない、配向膜形成およびラビリンス処理を行なった
後、一方の基板の電極を有する面の４個のセルのシール
を形成する部分にエポキシ系の熱硬化性シール材を印刷
し、他方の基板の電極側の面には面内スペーサとして、
平均粒径６．０μｍの樹脂ビーズを撒布した。そして、
両基板の電極面を対向させて重ね合わせ、位置合わせし
た状態で仮止めして、重ね合わせ基板とした。この重ね
合わせ基板の周囲に厚み１．４ｍｍのダミー基板を配置
し、株式会社ロプコ製の空気膜圧着方式の圧着機で、上
方および下方からそれぞれ１５０℃の高温空気を０．６
ｋｇ／平方ｃｍの圧力で１０分間吹き付けて加熱圧着し
た。このようにして得られた貼合わせ基板の４個の単位
セルの各４辺に相当する部分のシール部分、計１６個所
におけるシールギャップを測定したところ、どの部分の
値も測定感度の限界である０．０１μｍ以内で一致し、
均一なギャップ制御が達成されていることが確認され
た。Example 1 300 mm × 35 having a transparent conductive film
An STN cell 4 having a screen size of 114 mm × 152 mm is placed on each of a pair of glass substrates having a size of 0 mm × 0.7 mm.
After performing patterning in a stripe shape corresponding to one display electrode, forming an alignment film and performing a labyrinth treatment, an epoxy-based thermosetting is applied to a portion of the surface having electrodes on one of the substrates to form a seal for four cells. Printing a conductive sealant, and as an in-plane spacer on the electrode side surface of the other substrate,
Resin beads having an average particle size of 6.0 μm were sprayed. And
The two substrates were superposed with their electrode surfaces facing each other, and temporarily fixed in a state where they were aligned to obtain a superposed substrate. A dummy substrate having a thickness of 1.4 mm was placed around the superposed substrate, and 150 ° C. high-temperature air was applied from above and below by 0.6 mm by using an air film crimping type crimping machine manufactured by Lopco Corporation.
The mixture was sprayed at a pressure of kg / square cm for 10 minutes to perform thermocompression bonding. When the sealing gaps at a total of 16 sealing portions corresponding to the four sides of the four unit cells of the bonded substrate thus obtained were measured, the value of any portion was the limit of the measurement sensitivity. Match within 0.01 μm,
It was confirmed that uniform gap control was achieved.
【００１９】〈比較例１〉実施例１と同様の重ね合わせ
基板を、その周囲にダミー基板を配置することなく、実
施例１と同様の条件で加熱圧着し貼合わせ基板とした。
この貼合わせ基板について、実施例１と同様のギャップ
測定を行なったところ、上記１６個所中、貼合わせ基板
の周端面に近接する８個所の値が内側の８個所の値より
も０．０５μｍ高くなっていた。<Comparative Example 1> A laminated substrate similar to that of Example 1 was heated and pressed under the same conditions as in Example 1 without disposing a dummy substrate around the laminated substrate to obtain a bonded substrate.
When the same gap measurement as in Example 1 was performed on this bonded substrate, the value of eight of the sixteen locations close to the peripheral end surface of the bonded substrate was 0.05 μm higher than the value of the eight inner locations. Had become.
【００２０】[0020]
【発明の効果】以上説明したように、本発明によれば、
貼合わせ基板を空気膜圧着方式にて圧着するにあたっ
て、重ね合わせ基板の周囲にダミー基板を配置すること
により、貼合わせ基板全体としてそのギャップ幅をより
均一にすることができる。したがって、シール周辺のギ
ャップ幅が部分的に高くなることによる表示画面周辺部
の色むら現象が回避できる。As described above, according to the present invention,
In bonding the bonded substrate by the air film bonding method, by disposing the dummy substrate around the overlapped substrate, the gap width of the entire bonded substrate can be made more uniform. Therefore, it is possible to avoid the color unevenness at the periphery of the display screen due to the partial increase in the gap width around the seal.
【図１】空気膜圧着方式による本発明の実施例を説明す
るための模式図。FIG. 1 is a schematic diagram for explaining an embodiment of the present invention using an air film pressure bonding method.
【図２】同実施例に適用されるダミー基板の平面図。FIG. 2 is a plan view of a dummy substrate applied to the embodiment.
【図３】本発明の作用を説明するための要部拡大断面
図。FIG. 3 is an enlarged sectional view of a main part for describing the operation of the present invention.
【図４】本発明が圧着対象とする重ね合わせ基板の断面
図。FIG. 4 is a cross-sectional view of a superposed substrate to be subjected to pressure bonding according to the present invention.
【図５】従来の加熱圧着法を説明するための模式図。FIG. 5 is a schematic view for explaining a conventional thermocompression bonding method.
【図６】従来の別の加熱圧着法を説明するための模式
図。FIG. 6 is a schematic diagram for explaining another conventional thermocompression bonding method.
【図７】空気膜圧着方式による圧着法を説明するための
模式図。FIG. 7 is a schematic diagram for explaining a crimping method using an air film crimping method.
【図８】図７における要部を拡大した断面図。FIG. 8 is an enlarged sectional view of a main part in FIG. 7;
【図９】図７の空気膜圧着方式により圧着された貼合わ
せ基板を誇張して示した断面図。FIG. 9 is an exaggerated cross-sectional view of the bonded substrate pressed by the air film pressing method of FIG. 7;
１，２ 透明基板 ３ シール材 ４ 重ね合わせ基板 ４ａ 貼合わせ基板 ７ ノズル盤 １０ ダミー基板 １０ａ 空間部 Reference numerals 1 and 2 Transparent substrate 3 Sealing material 4 Laminated substrate 4a Laminated substrate 7 Nozzle panel 10 Dummy substrate 10a Space
───────────────────────────────────────────────────── フロントページの続き (72)発明者 菊川 信也 広島県三次市四拾貫町91番地 広島オプト 株式会社内 (72)発明者 久保田 知可治 広島県三次市四拾貫町91番地 広島オプト 株式会社内 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Shinya Kikugawa 91 Hiroshima Opto, Miyoshi City, Miyoshi City Hiroshima Opto Co., Ltd. Inside the corporation
Claims (2)
た一対の透明基板を、それらの透明電極面間に硬化性シ
ール材および所望によりスペーサ材を介在させて対向さ
せて重ね合わせ、位置合わせしてからその重ね合わせ基
板を水平に配置し、その上方および下方から基板面に対
して垂直に高圧空気を吹き付けることにより、上記重ね
合わせ基板を空中に浮揚させて所定のギャップが生ずる
ように加圧した状態で上記シール材を硬化させることに
より、上記透明基板同士を一体的に貼合わせる液晶表示
素子の製造方法において、上記重ね合わせ基板の周端面
全周にわたって同重ね合わせ基板とほぼ同じ厚みを有す
るダミー基板を密接的に取り付け、上記ダミー基板と上
記重ね合わせ基板とを一体として空中に浮揚させて、上
記重ね合わせ基板を加圧することを特徴とする液晶表示
素子の製造方法。1. A pair of transparent substrates, each having a transparent electrode formed on one surface thereof, facing each other with a curable sealing material and, if desired, a spacer material interposed between the transparent electrode surfaces so as to be overlapped and aligned. Then, the superposed substrate is placed horizontally, and high-pressure air is blown vertically from above and below the substrate surface, so that the superposed substrate is floated in the air and a predetermined gap is formed. By curing the sealing material in a pressed state, in the method of manufacturing a liquid crystal display element in which the transparent substrates are integrally bonded to each other, in the method of manufacturing the liquid crystal display element, substantially the same thickness as the overlapping substrate is provided over the entire peripheral end surface of the overlapping substrate. The dummy substrate having the dummy substrate and the superimposed substrate are closely attached, and the dummy substrate and the superimposed substrate are integrally floated in the air, and the superimposed substrate is A method for manufacturing a liquid crystal display element, comprising applying pressure.
化を加熱により行なう請求項１に記載の液晶表示素子の
製造方法。2. The method according to claim 1, wherein the sealing material is thermosetting, and the curing is performed by heating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29328696A JPH10123541A (en) | 1996-10-15 | 1996-10-15 | Production for liquid crystal display element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29328696A JPH10123541A (en) | 1996-10-15 | 1996-10-15 | Production for liquid crystal display element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10123541A true JPH10123541A (en) | 1998-05-15 |
Family
ID=17792873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29328696A Withdrawn JPH10123541A (en) | 1996-10-15 | 1996-10-15 | Production for liquid crystal display element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10123541A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020010111A (en) * | 2000-07-28 | 2002-02-02 | 다카노 야스아키 | Fabricating method of liquid crystal display panel, and buffer plate for seal curing |
| KR100448849B1 (en) * | 2001-03-08 | 2004-09-16 | 코닉시스템 주식회사 | Pressure apparatus for joining process of LCD cell |
| JP2006184807A (en) * | 2004-12-28 | 2006-07-13 | Shibaura Mechatronics Corp | Apparatus for laminating substrate and method for laminating substrate |
| CN100456092C (en) * | 2002-03-22 | 2009-01-28 | 乐金显示有限公司 | Substrate binding appts. of LCD and its driving method |
-
1996
- 1996-10-15 JP JP29328696A patent/JPH10123541A/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020010111A (en) * | 2000-07-28 | 2002-02-02 | 다카노 야스아키 | Fabricating method of liquid crystal display panel, and buffer plate for seal curing |
| KR100448849B1 (en) * | 2001-03-08 | 2004-09-16 | 코닉시스템 주식회사 | Pressure apparatus for joining process of LCD cell |
| CN100456092C (en) * | 2002-03-22 | 2009-01-28 | 乐金显示有限公司 | Substrate binding appts. of LCD and its driving method |
| JP2006184807A (en) * | 2004-12-28 | 2006-07-13 | Shibaura Mechatronics Corp | Apparatus for laminating substrate and method for laminating substrate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
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