JPH0434549A - Screen printing mask - Google Patents
Screen printing maskInfo
- Publication number
- JPH0434549A JPH0434549A JP2142755A JP14275590A JPH0434549A JP H0434549 A JPH0434549 A JP H0434549A JP 2142755 A JP2142755 A JP 2142755A JP 14275590 A JP14275590 A JP 14275590A JP H0434549 A JPH0434549 A JP H0434549A
- Authority
- JP
- Japan
- Prior art keywords
- pads
- mask
- screen printing
- cream solder
- mask hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007650 screen-printing Methods 0.000 title claims abstract description 26
- 229910000679 solder Inorganic materials 0.000 claims abstract description 21
- 239000006071 cream Substances 0.000 claims abstract description 20
- 230000001105 regulatory effect Effects 0.000 claims abstract description 9
- 238000007639 printing Methods 0.000 abstract description 8
- 230000002093 peripheral effect Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 101100269850 Caenorhabditis elegans mask-1 gene Proteins 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Landscapes
- Printing Plates And Materials Therefor (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
この発明は、電子部品が実装される印刷配線板のパッド
上にクリームはんだを供給するためのスクリーン印刷マ
スクに関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a screen printing mask for supplying cream solder onto pads of a printed wiring board on which electronic components are mounted.
［従来の技ｖＲ］ 従来のスクリーン印刷マスクを第２図、第３図に示す。[Traditional technique vR] Conventional screen printing masks are shown in FIGS. 2 and 3.
各回において、１は印刷配線板で、表面上には電極パッ
ド２．配線パターン３．レジスト４及びシルク印刷５が
施されている。６はスクリーン印刷マスク、７はペース
ト状のクリームはんだ、８はスキージである。第２図に
おいて、９は印刷配線板１の位置を決めるテーブル、１
０はスクリーン印刷マスク６を保持するマスク枠である
。In each round, 1 is a printed wiring board, and electrode pads 2. Wiring pattern 3. A resist 4 and silk printing 5 are applied. 6 is a screen printing mask, 7 is paste cream solder, and 8 is a squeegee. In FIG. 2, reference numeral 9 denotes a table for determining the position of the printed wiring board 1;
0 is a mask frame that holds the screen printing mask 6.
次に動作について説明する。スクリーン印刷法は、テー
ブル９に位置決めされた印刷配線板１上に形成された所
定の電極パッド２上にクリームはんだ７を供給する際に
、電極パッド２に対応してマスク孔６ａが設けられたス
クリーン印刷マスク６を上記印刷配線板１上にセットし
、その後、スクリーン印刷マスク６の上に供給したクリ
ームはんだ７をマスク孔６ａより電極パッド２上に転写
する方法をいう、クリームはんだ７は、スクリーン印刷
マスク６と印刷配線板１との密着を保った状態で樹脂製
のスキージ８を第２図の矢印方向に移動させることによ
りマスク孔６ａより供給され、電極パッド２上に転写さ
れる。実際には、第３図に示すように、印刷配線板１上
の配線パターン３の上には電気的絶縁を行なうためのレ
ジスト４、さらには電子部品の種名、電極パッド２の番
号表示、印刷配線板１の表示等のシルク印刷５が施され
ている。このシルク印刷５の高さは電極パッド２より高
い位置に印刷されている。Next, the operation will be explained. In the screen printing method, when cream solder 7 is supplied onto predetermined electrode pads 2 formed on a printed wiring board 1 positioned on a table 9, mask holes 6a are provided corresponding to the electrode pads 2. The cream solder 7 refers to a method in which the screen printing mask 6 is set on the printed wiring board 1, and then the cream solder 7 supplied onto the screen printing mask 6 is transferred onto the electrode pad 2 through the mask hole 6a. By moving a resin squeegee 8 in the direction of the arrow in FIG. 2 while maintaining close contact between the screen printing mask 6 and the printed wiring board 1, it is supplied through the mask hole 6a and transferred onto the electrode pad 2. In reality, as shown in FIG. 3, on the wiring pattern 3 on the printed wiring board 1, there is a resist 4 for electrical insulation, and furthermore, the type name of the electronic component and the number of the electrode pad 2 are displayed. Silk printing 5 such as a display on the printed wiring board 1 is applied. The height of this silk printing 5 is printed at a higher position than the electrode pad 2.
［発明が解決しようとする課題］
しかしながら、上記従来のスクリーン印刷マスクによれ
ば、シルク印刷５の位置が電極パッド２より高い位置に
あるため、第３図に示すように。[Problems to be Solved by the Invention] However, according to the above conventional screen printing mask, the position of the silk printing 5 is higher than the electrode pad 2, as shown in FIG.
スクリーン印刷マスク６の裏面６ｂとシルク印刷５とが
当接して、マスク孔６ａの裏側と電極パッド２との間に
は隙間りが発生してしまうため、マスク孔６ａには所定
のはんだ供給量より多くのクリームはんだ７が供給され
、クリームはんだ７は隙間りを介して電極パッド２上よ
りはみ出してしまう。このため、クリームはんだ７は電
極パッド２上よりはみ出した状態に転写されてしまい、
隣接する電極パッド間の短絡の要因となる等の問題点が
あった。Since the back side 6b of the screen printing mask 6 and the silk printing 5 come into contact with each other, and a gap is generated between the back side of the mask hole 6a and the electrode pad 2, a predetermined amount of solder is supplied to the mask hole 6a. More cream solder 7 is supplied, and the cream solder 7 protrudes from above the electrode pad 2 through the gap. For this reason, the cream solder 7 is transferred to a state where it protrudes from the top of the electrode pad 2,
There were problems such as short circuits between adjacent electrode pads.
本発明は上記問題点を解消するためになされたもので、
スクリーン印刷の際に、クリームはんだをパッド上から
はみ出さないように供給することができ、隣接するパッ
ド間の短絡を防ぐことができるスクリーン印刷マスクを
提供することを目的とする。The present invention was made to solve the above problems, and
To provide a screen printing mask capable of supplying cream solder without overflowing from pads during screen printing and preventing short circuits between adjacent pads.
［課題を解決するための手段］
この発明にかかるスクリーン印刷マスクは、マスク孔の
周縁下部より突出して先端がパッドの表面に接地する漏
れ規制枠を設けた。[Means for Solving the Problems] A screen printing mask according to the present invention is provided with a leakage regulating frame that protrudes from the lower portion of the periphery of the mask hole and whose tip is in contact with the surface of the pad.
［作用］
漏九規制枠の先端がパッドの表面に確実に密着してマス
ク孔がパッドの表面に連通ずるため、マスク孔を介して
供給されるクリームはんだはパッド上からはみ出すこと
がなく、パッド上に所定量のクリームはんだを供給でき
る。[Function] Since the tip of the leakage control frame is firmly attached to the pad surface and the mask hole communicates with the pad surface, the cream solder supplied through the mask hole does not protrude from the top of the pad, and the pad A predetermined amount of cream solder can be supplied on top.
［発明の実施例コ
以下、この発明のスクリーン印刷マスクを第１図に基づ
いて説明する。尚、第２図、第３図の従来例と同じもの
は同一符号を付しその説明を省略する。[Embodiment of the Invention] A screen printing mask of the present invention will be described below with reference to FIG. Components that are the same as those in the conventional example shown in FIGS. 2 and 3 are designated by the same reference numerals, and their explanation will be omitted.
同図において、１６は本発明のスクリーン印刷マスクで
、これは従来のマスク孔６ａの周縁下部より突設された
漏れ規制枠１７を有するものである。この漏れ規制枠１
７の突出長さＨは［シルク印刷５の高さ一電極パッド２
の高さ］より長く設定さ九ている６よって９本願のマス
ク孔１６ａは漏れ規制枠１７の突出長さ分だけ延長する
３上記構成により、漏れ規制枠１７の先端１７ｔを電極
パッド２の表面に接地させてスクリーン印刷マスク１６
をセットし、クリームはんだ７をマスク孔１６ａを介し
て供給することにより、電極パッド２上に転写する。In the figure, 16 is a screen printing mask of the present invention, which has a leakage regulating frame 17 projecting from the lower peripheral edge of the conventional mask hole 6a. This leakage control frame 1
The protrusion length H of 7 is [height of silk printing 5 - electrode pad 2
Therefore, the mask hole 16a of the present application is extended by the protruding length of the leakage control frame 17.3 With the above configuration, the tip 17t of the leakage control frame 17 is set to be longer than the surface of the electrode pad 2. Ground to screen printing mask 16
is transferred onto the electrode pad 2 by supplying the cream solder 7 through the mask hole 16a.
上記実施例によれば、スクリーン印刷マスク１６を印刷
配線板１上に設置したときに、スクリーン印刷マスク１
６の裏面１６ｂとシルク印刷５とが当接せず、漏れ規制
枠１７の先端１７ｔが電極パッド２の表面に確実に密着
してマスク孔１６ａが電極パッド２の表面に連通ずるた
め、クリームはんだ７は電極パッド２上からはみ出すこ
となく、電極パッド２上に所定量のクリームはんだ７を
供給でき、隣接する電極パッド間の短絡を防ぐことがで
きる。According to the above embodiment, when the screen printing mask 16 is installed on the printed wiring board 1, the screen printing mask 1
The back surface 16b of the mask 6 does not come into contact with the silk printing 5, and the tip 17t of the leakage regulating frame 17 firmly contacts the surface of the electrode pad 2, so that the mask hole 16a communicates with the surface of the electrode pad 2. A predetermined amount of cream solder 7 can be supplied onto the electrode pad 2 without protruding from the top of the electrode pad 2, and short circuits between adjacent electrode pads can be prevented.
［発明の効果］
以上説明したように、本発明のスクリーン印刷マスクに
よれば、マスク孔の周縁下部より突出して先端がパッド
の表面に接地する漏れ規制枠を設けたので、クリームは
んだをバット上からはみ出さないように供給することが
でき、隣接するパッド間の短絡を防ぐことができる。[Effects of the Invention] As explained above, according to the screen printing mask of the present invention, since the leakage control frame is provided which protrudes from the lower part of the periphery of the mask hole and whose tip is grounded on the surface of the pad, cream solder is not applied onto the bat. This can prevent short circuits between adjacent pads.
第１図は本発明のスクリーン印刷マスクの一実施例を示
す動作説明図、第２図、第３図は従来のスクリーン印刷
マスクを示す動作説明図である。
１・・・印刷配線板、２・・・電極パッド、７・・・ク
リームはんだ、１６・・・スクリーン印刷マスク、１６
ａ・・・マスク孔、１７・・・漏れ規制枠、１７ｔ・・
・先端。
代理人 弁理士 宮 園 純 −
第１
図
第２図FIG. 1 is an operational explanatory diagram showing one embodiment of the screen printing mask of the present invention, and FIGS. 2 and 3 are operational explanatory diagrams showing a conventional screen printing mask. DESCRIPTION OF SYMBOLS 1... Printed wiring board, 2... Electrode pad, 7... Cream solder, 16... Screen printing mask, 16
a...Mask hole, 17...Leakage control frame, 17t...
・Tip. Agent Patent Attorney Jun Miyazono - Figure 1 Figure 2
Claims (1)
マスク孔を有し、このマスク孔よりクリームはんだを供
給してパッド上にクリームはんだを被着するようにした
スクリーン印刷マスクにおいて、 上記マスク孔の周縁下部より突出して先端がパッドの表
面に接地する漏れ規制枠を設けたことを特徴とするスク
リーン印刷マスク。[Claims] A mask hole is provided corresponding to a predetermined pad attached to the surface of the printed wiring board, and cream solder is supplied from the mask hole to coat the cream solder on the pad. A screen printing mask characterized in that a leakage regulating frame is provided which protrudes from the lower periphery of the mask hole and whose tip is grounded on the surface of the pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2142755A JPH0434549A (en) | 1990-05-31 | 1990-05-31 | Screen printing mask |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2142755A JPH0434549A (en) | 1990-05-31 | 1990-05-31 | Screen printing mask |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0434549A true JPH0434549A (en) | 1992-02-05 |
Family
ID=15322824
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2142755A Pending JPH0434549A (en) | 1990-05-31 | 1990-05-31 | Screen printing mask |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0434549A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05270161A (en) * | 1991-07-08 | 1993-10-19 | Dainippon Screen Mfg Co Ltd | Screen printing plate |
| JP2003249518A (en) * | 2002-02-26 | 2003-09-05 | Kyocera Corp | Method of manufacturing flip-chip ic |
| JP2011235510A (en) * | 2010-05-10 | 2011-11-24 | Bonmaaku:Kk | Metal mask for screen printing |
-
1990
- 1990-05-31 JP JP2142755A patent/JPH0434549A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05270161A (en) * | 1991-07-08 | 1993-10-19 | Dainippon Screen Mfg Co Ltd | Screen printing plate |
| JP2003249518A (en) * | 2002-02-26 | 2003-09-05 | Kyocera Corp | Method of manufacturing flip-chip ic |
| JP2011235510A (en) * | 2010-05-10 | 2011-11-24 | Bonmaaku:Kk | Metal mask for screen printing |
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