JPH0936692A - Piezoelectric vibrator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce mechanical strain generated when a piezoelectric vibrating element is manufactured by fitting metal lead plates onto both end parts of a substrate, fixing the piezoelectric vibrating element between the tip parts of the metal lead plates on the top side and further putting a cap on the top side, and using the metal lead plates as connection terminals on the reverse side. SOLUTION: This piezoelectric vibrator consists of one substrate 1 formed of an insulating material, the two metal lead plates 2 which are fitted cross this substrate 1 along the thickness, the piezoelectric vibrating element 3 which is provided between the two metal lead plates 2 on the top side of the substrate 1, the cap 4 which is put on the top side of the substrate 1 including the piezoelectric vibrating element 3, etc. The metal lead plates 2 appearing on the reverse side of the substrate 1 are used as the connection terminals. Gaps are left between the piezoelectric vibrating element 3, and the piezoelectric vibrating element 3 and cap 4. Further, the parts between the cap 4 and substrate 1, the cap 4 and metal lead plates 2, and the metal lead plates 2 and substrate 1 are sealed airtightly.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【発明の属する技術分野】本発明は、時計、パーソナル
コンピュータ、携帯電話機、無線選択呼出受信機、その
他小型電子機器の内部で周波数標準を発生するために利
用する。本発明は、水晶振動子、セラミックス振動子、
その他圧電効果を利用した振動子の実装構造の改良に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is used to generate a frequency standard inside a timepiece, a personal computer, a mobile phone, a radio selective call receiver, and other small electronic devices. The present invention provides a crystal oscillator, a ceramic oscillator,
In addition, the present invention relates to improvement of a mounting structure of a vibrator using a piezoelectric effect.

【０００２】[0002]

【従来の技術】従来例技術として、図２５に示す特開平
２−４１０１０号公報（松下電器）に開示された構造の
もの、あるいは、特開平２−１９９９０９号公報（松下
電器）に開示された構造のものが知られている。また、
図２６に示す実装構造、あるいは図２７（ａ）および
（ｂ）に示す実装構造の圧電振動子が、電子回路用の部
品として市場で多数取引されている。2. Description of the Related Art As a conventional example, the structure disclosed in Japanese Patent Application Laid-Open No. 2-41010 (Matsushita Electric) shown in FIG. 25 or that disclosed in Japanese Patent Application Laid-Open No. 2-199909 (Matsushita Electric). The thing of the structure is known. Also,
Many piezoelectric vibrators having the mounting structure shown in FIG. 26 or the mounting structure shown in FIGS. 27A and 27B are traded in the market as parts for electronic circuits.

【０００３】特開平２−４１０１０号公報に開示された
圧電振動子は、ケース９１の開口部端面全周に封着部分
９２が形成され、この封着部分９２上に水晶板９３に固
定された２本の帯状の電極９４が差し渡されて、この２
本の電極９４が封着部分９５に介在されて上蓋９６によ
り挟持される。In the piezoelectric vibrator disclosed in JP-A-2-41010, a sealing portion 92 is formed on the entire circumference of the opening end face of a case 91, and a quartz plate 93 is fixed on the sealing portion 92. Two strip-shaped electrodes 94 are crossed over,
The book electrode 94 is interposed in the sealing portion 95 and sandwiched by the upper lid 96.

【０００４】図２６に示す構造では、基板１０１がアル
ミナであり、基板１０１に電極１０２が直接焼付けら
れ、この焼付電極に圧電振動素子１０３がはんだなどの
導電性の接着材料により取付けられる。図示されていな
いが、この図２６に示す構造の圧電振動子は、一般にそ
の上表面にキャップが被せられ雰囲気が遮断された状態
で使用される。In the structure shown in FIG. 26, the substrate 101 is made of alumina, the electrode 102 is directly baked on the substrate 101, and the piezoelectric vibrating element 103 is attached to the baked electrode by a conductive adhesive material such as solder. Although not shown, the piezoelectric vibrator having the structure shown in FIG. 26 is generally used in a state where the upper surface thereof is covered with a cap and the atmosphere is shut off.

【０００５】図２７（ａ）および（ｂ）に示す構造のも
のでは、基板２０１に金属加工板２０７を載置し、その
金属加工板２０７には貫通孔２０５が設けられ、その貫
通孔２０５にガラスによりシールされ圧電振動素子２０
３に接続された電極リード線２０６が貫通する構造であ
る。この基板には金属製のキャップ２０４が被せられ
る。In the structure shown in FIGS. 27A and 27B, a metal working plate 207 is placed on a substrate 201, a through hole 205 is provided in the metal working plate 207, and the through hole 205 is formed in the through hole 205. Piezoelectric vibration element 20 sealed by glass
3 has a structure in which the electrode lead wire 206 connected to No. 3 penetrates. The substrate is covered with a metal cap 204.

【０００６】[0006]

【発明が解決しようとする課題】特開平２−４１０１０
号公報に開示された構造の圧電振動子は、水晶板９３が
ケース９１内に２本の帯状の電極９４により懸架された
状態に宙づりされているために、外部から振動を受けた
とき電極９４が振動を起しやすく、この振動により発振
周波数を変動させる欠点がある。DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention
In the piezoelectric vibrator having the structure disclosed in the publication, the crystal plate 93 is suspended in the case 91 in a state of being suspended by the two strip-shaped electrodes 94. Has a drawback that it easily causes vibrations and the oscillation frequency is changed by this vibration.

【０００７】また、一般に、絶縁基板には実装に際して
加えられる熱、回路に圧電振動子を取付けるときに加え
られる熱、経年変化による絶縁基板の劣化、その他の原
因により、絶縁基板に機械的なひずみが生じることが避
けられない。上記のような従来例構造では、この機械的
なひずみが圧電振動素子に応力を与えることになり、圧
電振動素子がわずかに変形することによりその発振周波
数が変動することになる。製造または回路への実装の時
に発振周波数が規格外になったものは不良品となり、製
造歩留りを悪くする。経年変化によって周波数が変化す
るものについては、コンピュータその他電子機器に搭載
されてから、ある年月を過ぎると部品交換を必要とする
ことになる。Further, in general, heat applied to the insulating substrate during mounting, heat applied when mounting the piezoelectric vibrator in a circuit, deterioration of the insulating substrate due to aging, and other causes cause mechanical strain on the insulating substrate. Is inevitable. In the conventional structure as described above, this mechanical strain gives a stress to the piezoelectric vibrating element, and a slight deformation of the piezoelectric vibrating element changes the oscillation frequency. If the oscillation frequency is out of the standard during manufacturing or mounting on a circuit, it becomes a defective product and the manufacturing yield deteriorates. If the frequency changes due to aging, it will be necessary to replace parts after a certain period of time since it was installed in a computer or other electronic device.

【０００８】本発明はこのような背景に行われたもので
あって、 圧電振動子の製造時に生じる機械的なひずみを小さ
くすることができる、 回路に実装するときに加えられる熱その他により発
振周波数の変動を小さくすることができる、 経年変化により生じる発振周波数の変動を小さくす
ることができる、 外径寸法を小さくできる、 製造歩留りを大きくすることができる、 製造コストをさらに低減することができる、 圧電振動子を提供することを目的とする。The present invention has been made against such a background, and it is possible to reduce the mechanical strain generated at the time of manufacturing the piezoelectric vibrator, and the oscillation frequency due to heat applied when the circuit is mounted and other factors. Can be reduced, fluctuation of oscillation frequency caused by aging can be reduced, outer diameter can be reduced, manufacturing yield can be increased, and manufacturing cost can be further reduced. An object is to provide a piezoelectric vibrator.

【０００９】[0009]

【課題を解決するための手段】本発明は、小型電子機器
に用いられる周波数標準を長期間にわたって正確に発生
させることができる構造を特徴とする。The present invention is characterized by a structure capable of accurately generating a frequency standard used in a small electronic device for a long period of time.

【００１０】すなわち、絶縁材料により形成された１枚
の基板両端部に、その表裏にまたがるように形成された
２個の金属リード板を嵌着し、基板の表側でこの２個の
金属リード板を突出させた先端部に圧電振動素子を架け
わたして固定する。さらに、この圧電振動素子を外気か
ら遮断するために基板の表側にキャップを被せ、基板の
裏側にあらわれた金属リード板を接続端子として回路基
板と電気的に接続する構造にする。That is, two metal lead plates formed so as to straddle the front and back are fitted to both ends of one substrate made of an insulating material, and the two metal lead plates are arranged on the front side of the substrate. Mount the piezoelectric vibrating element on the protruding tip and fix it. Further, in order to shield the piezoelectric vibrating element from the outside air, a cap is placed on the front side of the substrate, and a metal lead plate appearing on the back side of the substrate is used as a connection terminal to electrically connect to the circuit board.

【００１１】圧電振動素子と基板との間、および圧電振
動素子とキャップとの間には十分な空間を設けておき、
圧電振動素子に対して自由振動空間を与える。A sufficient space is provided between the piezoelectric vibrating element and the substrate, and between the piezoelectric vibrating element and the cap.
A free vibration space is given to the piezoelectric vibration element.

【００１２】キャップと基板との間およびキャップと金
属リード板との間ならびに金属リード板と基板との間に
はそれぞれ接着剤を充填するか、または封止材としてガ
ラスをぬってやきつけたものを固定し完全に気密封止す
る。A space between the cap and the substrate, between the cap and the metal lead plate, and between the metal lead plate and the substrate may be filled with an adhesive agent, or glass may be used as an encapsulating material and dipped into the space. Fix and completely hermetically seal.

【００１３】基板の材料としては樹脂またはセラミック
スを用い、キャップの材料としては樹脂、金属またはセ
ラミックスを用いる。セラミックスにはガラス材料を含
む。Resin or ceramics is used as the material of the substrate, and resin, metal or ceramics is used as the material of the cap. Ceramics include glass materials.

【００１４】このように、金属リード板がクリップ状に
基板に取り付けられているので、外部からの振動が圧電
振動素子に与える影響が少くなり、また、基板に変形を
生じてもその変形が金属リード板により吸収され、直接
に圧電振動素子を変形させることを防止することができ
る。さらに、部品形状が単純化しかつ部品点数が削減さ
れるので、回路基板の機械的ひずみおよび経年的な変形
の影響を受けにくくなり発振周波数の変動を小さくする
ことができ、全組立工程の自動化が可能となるので製造
工数を小さくし、製造コストを大幅に低減することがで
きる。As described above, since the metal lead plate is attached to the substrate in a clip shape, the influence of external vibration on the piezoelectric vibrating element is reduced, and even if the substrate is deformed, the deformation is caused by the metal. It is possible to prevent the piezoelectric vibration element from being directly deformed by being absorbed by the lead plate. Furthermore, since the part shape is simplified and the number of parts is reduced, it is less susceptible to the mechanical strain of the circuit board and the deformation over time, and it is possible to reduce the fluctuation of the oscillation frequency and automate the entire assembly process. Since this is possible, the number of manufacturing steps can be reduced and the manufacturing cost can be significantly reduced.

【００１５】[0015]

【実施例】次に、本発明実施例を図面に基づいて説明す
る。Next, an embodiment of the present invention will be described with reference to the drawings.

【００１６】（第一実施例）図１は、本発明第一実施例
の構成を示す組立状態斜視図、図２は本発明第一実施例
の構成を示す分解斜視図、図３は本発明第一実施例の構
成を示す図１のＡ−Ａ断面図、図４は本発明第一実施例
の構成を示す平面図、図５は本発明第一実施例の構成を
示す底面図、図６は本発明第一実施例の構成を示す側面
図、図７は本発明第一実施例における金属リード板と基
板との嵌着部の形状を示す分解斜視図である。(First Embodiment) FIG. 1 is an assembled perspective view showing the construction of the first embodiment of the present invention, FIG. 2 is an exploded perspective view showing the construction of the first embodiment of the present invention, and FIG. 3 is the present invention. 1 is a sectional view taken along the line AA of FIG. 1 showing the configuration of the first embodiment, FIG. 4 is a plan view showing the configuration of the first embodiment of the present invention, and FIG. 5 is a bottom view showing the configuration of the first embodiment of the present invention. 6 is a side view showing the configuration of the first embodiment of the present invention, and FIG. 7 is an exploded perspective view showing the shape of the fitting portion between the metal lead plate and the substrate in the first embodiment of the present invention.

【００１７】本発明第一実施例は、絶縁材料により形成
された１枚の基板１と、それぞれこの基板１の表裏にま
たがって嵌着された２個の金属リード板２と、この基板
１の表側でこの２個の金属リード板２の間に架けわたさ
れた圧電振動素子３と、この圧電振動素子３を内包する
ように基板１の表側に被せられたキャップ４とを備え、
基板１の裏側に表れる金属リード板２を接続端子２ａと
して使用する。In the first embodiment of the present invention, one substrate 1 made of an insulating material, two metal lead plates 2 fitted over the front and back of the substrate 1 respectively, and the substrate 1 The piezoelectric vibrating element 3 hung between the two metal lead plates 2 on the front side, and the cap 4 covered on the front side of the substrate 1 so as to include the piezoelectric vibrating element 3 are provided.
The metal lead plate 2 appearing on the back side of the substrate 1 is used as the connection terminal 2a.

【００１８】圧電振動素子３と基板１との間、および圧
電振動素子３とキャップ４との間に十分な空隙５および
６が設けられる。Sufficient gaps 5 and 6 are provided between the piezoelectric vibrating element 3 and the substrate 1 and between the piezoelectric vibrating element 3 and the cap 4.

【００１９】キャップ４と基板１との間およびキャップ
４と金属リード板２との間ならびに金属リード板２と基
板１との間は、それぞれ接着剤７または封止材８により
気密封止される。The space between the cap 4 and the substrate 1, the space between the cap 4 and the metal lead plate 2, and the space between the metal lead plate 2 and the substrate 1 are hermetically sealed with an adhesive 7 or a sealing material 8, respectively. .

【００２０】基板１の材料は樹脂またはセラミックスが
用いられ、キャップ４の材料は樹脂または金属もしくは
セラミックスが用いられる。セラミックスにはガラス材
料が含まれる。The material of the substrate 1 is resin or ceramics, and the material of the cap 4 is resin or metal or ceramics. Ceramics includes glass materials.

【００２１】また、金属リード板２の接続端子２ａの外
側には相手部品に係合する二つの凸部２ｂが設けられ、
その内側には一つの凸部２ｃが設けられる。基板１の長
手方向の端部には凸部２ｃが係合し接着剤７が充填され
る固定用溝１ａが形成される。キャップ４は基板１上に
封止材８を介在して固定される。On the outside of the connection terminal 2a of the metal lead plate 2, there are provided two convex portions 2b which engage with the mating parts.
One convex portion 2c is provided inside thereof. At the end of the substrate 1 in the longitudinal direction, a convex groove 2c is engaged and a fixing groove 1a filled with the adhesive 7 is formed. The cap 4 is fixed on the substrate 1 with the sealing material 8 interposed.

【００２２】ここで、このように構成される本発明第一
実施例の組立について説明する。まず、基板１の長手方
向両端部に設けられた固定用溝１ａそれぞれに金属リー
ド板２を図７の矢印で示すように内側に向けて差し込み
嵌着する。金属リード板２の下面に位置する接続端子２
ａの上面には凸部２ｃが形成されているので、この凸部
２ｃが基板１の下側に形成された固定用溝１ａに係合し
位置決めされる。次いで、基板１の上面に設けられた固
定用溝１ａに接着剤７を充填し、基板１と金属リード板
２とを固定する。Now, the assembling of the first embodiment of the present invention thus constructed will be described. First, the metal lead plates 2 are inserted and fitted inward in the fixing grooves 1a provided at both ends of the substrate 1 in the longitudinal direction, as shown by arrows in FIG. Connection terminal 2 located on the lower surface of metal lead plate 2
Since the convex portion 2c is formed on the upper surface of a, the convex portion 2c is engaged with the fixing groove 1a formed on the lower side of the substrate 1 and positioned. Next, the fixing groove 1 a provided on the upper surface of the substrate 1 is filled with the adhesive 7 to fix the substrate 1 and the metal lead plate 2.

【００２３】基板１に金属リード板２を取り付けたとき
に、金属リード板２の上面側先端部は図２に示すように
突出した状態となる。この先端部上面に圧電振動素子３
を貼着して固定し、封止材８を介在してキャップ４を基
板１上に被せる。圧電振動素子３はキャップ４および基
板１の間に十分な空隙５および６をもって固定される。
金属リード板２の接続端子２ａにはそれぞれ２個の凸部
２ｂが設けられているので、この凸部２ｂが実装基板に
係合し電気的に接続される。When the metal lead plate 2 is attached to the substrate 1, the top end portion of the metal lead plate 2 is in a protruding state as shown in FIG. The piezoelectric vibrating element 3
And is fixed, and the cap 4 is covered on the substrate 1 with the sealing material 8 interposed. The piezoelectric vibrating element 3 is fixed between the cap 4 and the substrate 1 with sufficient gaps 5 and 6.
Since each of the connection terminals 2a of the metal lead plate 2 is provided with two protrusions 2b, the protrusions 2b are engaged with the mounting board to be electrically connected.

【００２４】（第二実施例）図８は本発明第二実施例の
構成を示す平面図、図９は本発明第二実施例における金
属リード板と基板との嵌着部の形状を示す分解斜視図で
ある。(Second Embodiment) FIG. 8 is a plan view showing the structure of the second embodiment of the present invention, and FIG. 9 is an exploded view showing the shape of the fitting portion between the metal lead plate and the substrate in the second embodiment of the present invention. It is a perspective view.

【００２５】本発明第二実施例は、絶縁材料により形成
された１枚の基板１１と、それぞれこの基板１１の表裏
にまたがって嵌着された２個の金属リード板１２とが用
いられ、その他は第一実施例同様に構成される。本第二
実施例の場合は、金属リード板１２の基板１１の長手方
向両側端面に当接する面が広い面積をもって形成され、
基板１１もその面に対応する形状に形成される。そのた
めに金属リード板１２を基板１１に嵌着させたときに安
定して支持することができる利点がある。In the second embodiment of the present invention, one substrate 11 made of an insulating material and two metal lead plates 12 fitted over the front and back of each substrate 11 are used. Is constructed similarly to the first embodiment. In the case of the second embodiment, the surfaces of the metal lead plate 12 that come into contact with both end faces in the longitudinal direction of the substrate 11 are formed with a large area,
The substrate 11 is also formed in a shape corresponding to that surface. Therefore, there is an advantage that the metal lead plate 12 can be stably supported when it is fitted to the substrate 11.

【００２６】（第三実施例）図１０は本発明第三実施例
の構成を示す一部断面正面図、図１１は本発明第三実施
例における金属リード板と基板との嵌着部の形状を示す
分解斜視図である。(Third Embodiment) FIG. 10 is a partially sectional front view showing the configuration of the third embodiment of the present invention, and FIG. 11 is the shape of the fitting portion between the metal lead plate and the substrate in the third embodiment of the present invention. It is an exploded perspective view showing.

【００２７】本発明第三実施例は、第一実施例における
金属リード板２の接続端子２ａを山形に形成した金属リ
ード板２２が用いられ、その他は第一実施例同様に構成
される。本第三実施例の場合は、基板１に金属リード板
２２を嵌着させたときに接続端子２２ａの先端部に弾性
による付勢力が生じ、この付勢力により基板１と金属リ
ード板２２とが嵌着する。また、接続端子２２ａと回路
基板とはその付勢力により押圧された状態で接続され
る。The third embodiment of the present invention uses a metal lead plate 22 in which the connection terminals 2a of the metal lead plate 2 in the first embodiment are formed in a mountain shape, and the other configurations are similar to those of the first embodiment. In the case of the third embodiment, when the metal lead plate 22 is fitted on the substrate 1, an elastic biasing force is generated at the tip of the connection terminal 22a, and this biasing force causes the substrate 1 and the metal lead plate 22 to move. Fit in. Further, the connection terminal 22a and the circuit board are connected while being pressed by the urging force.

【００２８】（第四実施例）図１２は本発明第四実施例
の構成を示す一部断面正面図、図１３は本発明第四実施
例における金属リード板と基板との嵌着部の形状を示す
分解斜視図である。(Fourth Embodiment) FIG. 12 is a partially sectional front view showing the structure of the fourth embodiment of the present invention, and FIG. 13 is the shape of the fitting portion between the metal lead plate and the substrate in the fourth embodiment of the present invention. It is an exploded perspective view showing.

【００２９】本発明第四実施例は、第一実施例における
金属リード板２の接続端子２ａを内側に屈曲しバネ性を
もたせた金属リード板３２が用いられ、その他は第一実
施例同様に構成される。本第四実施例の場合も金属リー
ド板３２を基板１に嵌着させたときに接続端子３２ａに
弾性による付勢力が生じ、この付勢力により基板１と金
属リード板３２とが嵌着する。接続端子３２ａと回路基
板とはその付勢力により押圧された状態で接続される。The fourth embodiment of the present invention uses a metal lead plate 32 in which the connection terminal 2a of the metal lead plate 2 in the first embodiment is bent inward to have a spring property, and the others are the same as in the first embodiment. Composed. Also in the case of the fourth embodiment, when the metal lead plate 32 is fitted on the substrate 1, a biasing force due to elasticity is generated in the connection terminal 32a, and the substrate 1 and the metal lead plate 32 are fitted by this biasing force. The connection terminal 32a and the circuit board are connected while being pressed by the urging force.

【００３０】（第五実施例）図１４は本発明第五実施例
の構成を示す一部断面正面図、図１５は本発明第五実施
例における金属リード板と基板との嵌着部の形状を示す
分解斜視図である。(Fifth Embodiment) FIG. 14 is a partial sectional front view showing the structure of the fifth embodiment of the present invention, and FIG. 15 is the shape of the fitting portion between the metal lead plate and the substrate in the fifth embodiment of the present invention. It is an exploded perspective view showing.

【００３１】本発明第五実施例は、第一実施例における
金属リード板２の接続端子２ａに形成された凸部２ｃの
代わりに固定片４２ｄが形成された金属リード板４２が
用いられ、その他は第一実施例同様に構成される。本第
五実施例の場合は、金属リード板４２を基板１に嵌着さ
せたときに、固定片４２ｄが基板１の下面に形成された
固定用溝１ａ内に収容されるので安定した状態で嵌着さ
せることができる。In the fifth embodiment of the present invention, the metal lead plate 42 in which the fixing piece 42d is formed is used instead of the convex portion 2c formed in the connection terminal 2a of the metal lead plate 2 in the first embodiment. Is constructed similarly to the first embodiment. In the case of the fifth embodiment, when the metal lead plate 42 is fitted to the substrate 1, the fixing piece 42d is housed in the fixing groove 1a formed on the lower surface of the substrate 1, so that the fixing state is stable. Can be fitted.

【００３２】（第六実施例）図１６は本発明第六実施例
の構成を示す一部断面正面図、図１７は本発明第六実施
例における金属リード板と基板との嵌着部の形状を示す
分解斜視図である。(Sixth Embodiment) FIG. 16 is a partially sectional front view showing the structure of the sixth embodiment of the present invention, and FIG. 17 is the shape of the fitting portion between the metal lead plate and the substrate in the sixth embodiment of the present invention. It is an exploded perspective view showing.

【００３３】本発明第六実施例は、第五実施例における
金属リード板４２の接続端子４２ａを山形に形成した金
属リード板５２が用いられ、その他は第五実施例同様に
構成される。本第六実施例の場合は、基板１に金属リー
ド板５２を嵌着させたときに、接続端子５２ａの先端部
に弾性による付勢力が生じ、この付勢力により基板１と
金属リード板５２とを嵌着させるとともに、固定片５２
ｄが基板１の下面に形成された固定用溝１ａ内に収容さ
れ安定した状態で嵌着させることができる。The sixth embodiment of the present invention uses a metal lead plate 52 in which the connecting terminals 42a of the metal lead plate 42 in the fifth embodiment are formed in a mountain shape, and the other configurations are similar to those of the fifth embodiment. In the case of the sixth embodiment, when the metal lead plate 52 is fitted on the substrate 1, an elastic biasing force is generated at the tip of the connection terminal 52a, and this biasing force causes the substrate 1 and the metal lead plate 52 to And the fixing piece 52
d is housed in the fixing groove 1a formed on the lower surface of the substrate 1 and can be fitted in a stable state.

【００３４】（第七実施例）図１８は本発明第七実施例
の構成を示す一部断面正面図、図１９は本発明第七実施
例の構成を示す平面図、図２０は本発明第七実施例の構
成を示す底面図、図２１は本発明第七実施例の構成を示
す側面図、図２２は本発明第七実施例における金属リー
ド板と基板との嵌着部の形状を示す分解斜視図である。(Seventh Embodiment) FIG. 18 is a partially sectional front view showing the construction of the seventh embodiment of the present invention, FIG. 19 is a plan view showing the construction of the seventh embodiment of the present invention, and FIG. FIG. 21 is a bottom view showing the configuration of the seventh embodiment, FIG. 21 is a side view showing the configuration of the seventh embodiment of the present invention, and FIG. 22 shows the shape of the fitting portion between the metal lead plate and the substrate in the seventh embodiment of the present invention. It is an exploded perspective view.

【００３５】本発明第七実施例は、二つのリード部およ
び二つの固定片６２ｄが形成された金属リード板６２
と、この金属リード板６２の形状に対応する固定用溝２
１ａが形成された基板２１とが用いられ、その他は第一
実施例同様に構成される。本第七実施例の場合は、基板
１１に金属リード板６２が嵌着されたときに、二つのリ
ード部の先端が連結された形状になっているので、基板
１１の固定用溝１１ａに係合して離脱しにくくなるとと
もに、二つの固定片６２ｄも基板２１の固定用溝２１ａ
に収容されるので強固に嵌着させることができる。The seventh embodiment of the present invention is a metal lead plate 62 having two lead portions and two fixing pieces 62d.
And the fixing groove 2 corresponding to the shape of the metal lead plate 62.
The substrate 21 on which 1a is formed is used, and the others are configured similarly to the first embodiment. In the case of the seventh embodiment, when the metal lead plate 62 is fitted on the substrate 11, the two lead portions have a shape in which the tips of the lead parts are connected to each other. It becomes difficult to separate them together, and the two fixing pieces 62d are also fixed to the fixing groove 21a of the substrate 21.
Since it is housed in, it can be firmly fitted.

【００３６】（第八実施例）図２３は本発明第八実施例
の構成を示す一部断面正面図、図２４は本発明第八実施
例における金属リード板と基板との嵌着部の形状を示す
分解斜視図である。(Eighth Embodiment) FIG. 23 is a partial sectional front view showing the structure of the eighth embodiment of the present invention, and FIG. 24 is the shape of the fitting portion between the metal lead plate and the substrate in the eighth embodiment of the present invention. It is an exploded perspective view showing.

【００３７】本発明第八実施例は、第七実施例における
金属リード板６２の基板２１の端面に当接する部分が閉
塞された形状の金属リード板７２と、この金属リード板
７２の形状に対応する固定用溝３１ａが形成された基板
３１とが用いられ、その他は第一実施例同様に構成され
る。本第八実施例の場合も、基板３１に金属リード板７
２が嵌着されたときに、二つのリード部の先端が連結さ
れた形状になっているので、基板３１の固定用溝３１ａ
に係合して離脱しにくくなるとともに、二つの固定片７
２ｄも基板３１の固定用溝３１ａに収容されるので強固
に嵌着させることができる。The eighth embodiment of the present invention corresponds to the metal lead plate 72 in which the portion of the metal lead plate 62 in contact with the end face of the substrate 21 in the seventh embodiment is closed, and the shape of the metal lead plate 72. The substrate 31 on which the fixing groove 31a is formed is used, and the rest is configured similarly to the first embodiment. Also in the case of the eighth embodiment, the metal lead plate 7 is provided on the substrate 31.
Since the tip ends of the two lead portions are connected when the 2 is fitted, the fixing groove 31a of the substrate 31 is formed.
It becomes difficult to disengage by engaging with the two fixing pieces 7
Since 2d is also accommodated in the fixing groove 31a of the substrate 31, it can be firmly fitted.

【００３８】[0038]

【発明の効果】以上説明したように本発明によれば、外
部からの振動が圧電振動素子に与える影響を少くするこ
とができるとともに、基板に熱あるいは経年的に変形を
生じても直接にその変形が圧電振動素子に影響を与える
ことを防止することができ、長期間にわたって発振周波
数の変動を小さくすることができる。また、製造工程に
おける製造歩留りを大きくすることができるとともに、
全組立工程の自動化が可能になるので製造コストを大幅
に低減することができる。As described above, according to the present invention, it is possible to reduce the influence of external vibrations on the piezoelectric vibrating element, and even if the substrate is thermally or deformed over time, the The deformation can be prevented from affecting the piezoelectric vibrating element, and the fluctuation of the oscillation frequency can be reduced over a long period of time. In addition, it is possible to increase the manufacturing yield in the manufacturing process,
Since the entire assembling process can be automated, the manufacturing cost can be significantly reduced.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明第一実施例の構成を示す組立状態斜視
図。FIG. 1 is an assembled perspective view showing a configuration of a first embodiment of the present invention.

【図２】本発明第一実施例の構成を示す分解斜視図。FIG. 2 is an exploded perspective view showing the configuration of the first embodiment of the present invention.

【図３】本発明第一実施例の構成を示す図１のＡ−Ａ断
面図。FIG. 3 is a sectional view taken along the line AA of FIG. 1 showing the configuration of the first embodiment of the present invention.

【図４】本発明第一実施例の構成を示す平面図。FIG. 4 is a plan view showing the configuration of the first embodiment of the present invention.

【図５】本発明第一実施例の構成を示す底面図。FIG. 5 is a bottom view showing the configuration of the first embodiment of the present invention.

【図６】本発明第一実施例の構成を示す側面図。FIG. 6 is a side view showing the configuration of the first embodiment of the present invention.

【図７】本発明第一実施例における金属リード板と基板
との嵌着部の形状を示す分解斜視図。FIG. 7 is an exploded perspective view showing the shape of the fitting portion between the metal lead plate and the substrate in the first embodiment of the present invention.

【図８】本発明第二実施例の構成を示す平面図。FIG. 8 is a plan view showing the configuration of the second embodiment of the present invention.

【図９】本発明第二実施例における金属リード板と基板
との嵌着部の形状を示す分解斜視図。FIG. 9 is an exploded perspective view showing the shape of the fitting portion between the metal lead plate and the substrate in the second embodiment of the present invention.

【図１０】本発明第三実施例の構成を示す一部断面正面
図。FIG. 10 is a partial sectional front view showing the configuration of the third embodiment of the present invention.

【図１１】本発明第三実施例における金属リード板と基
板との嵌着部の形状を示す分解斜視図。FIG. 11 is an exploded perspective view showing the shape of the fitting portion between the metal lead plate and the substrate in the third embodiment of the present invention.

【図１２】本発明第四実施例の構成を示す一部断面正面
図。FIG. 12 is a partially sectional front view showing the configuration of the fourth embodiment of the present invention.

【図１３】本発明第四実施例における金属リード板と基
板との嵌着部の形状を示す分解斜視図。FIG. 13 is an exploded perspective view showing the shape of the fitting portion between the metal lead plate and the substrate in the fourth embodiment of the present invention.

【図１４】本発明第五実施例の構成を示す一部断面正面
図。FIG. 14 is a partial sectional front view showing the configuration of the fifth embodiment of the present invention.

【図１５】本発明第五実施例における金属リード板と基
板との結合部の形状を示す分解斜視図。FIG. 15 is an exploded perspective view showing the shape of the connecting portion between the metal lead plate and the substrate in the fifth embodiment of the present invention.

【図１６】本発明第六実施例の構成を示す一部断面正面
図。FIG. 16 is a partially sectional front view showing the configuration of the sixth embodiment of the present invention.

【図１７】本発明第六実施例における金属リード板と基
板との嵌着部の形状を示す分解斜視図。FIG. 17 is an exploded perspective view showing the shape of the fitting portion between the metal lead plate and the substrate in the sixth embodiment of the present invention.

【図１８】本発明第七実施例の構成を示す一部断面正面
図。FIG. 18 is a partial sectional front view showing the configuration of the seventh embodiment of the present invention.

【図１９】本発明第七実施例の構成を示す平面図。FIG. 19 is a plan view showing the configuration of the seventh embodiment of the present invention.

【図２０】本発明第七実施例の構成を示す底面図。FIG. 20 is a bottom view showing the configuration of the seventh embodiment of the present invention.

【図２１】本発明第七実施例の構成を示す側面図。FIG. 21 is a side view showing the configuration of the seventh embodiment of the present invention.

【図２２】本発明第七実施例における金属リード板と基
板との嵌着部の形状を示す分解斜視図。FIG. 22 is an exploded perspective view showing the shape of the fitting portion between the metal lead plate and the substrate in the seventh embodiment of the present invention.

【図２３】本発明第八実施例の構成を示す一部断面正面
図。FIG. 23 is a partial cross-sectional front view showing the configuration of the eighth embodiment of the present invention.

【図２４】本発明第八実施例における金属リード板と基
板との嵌着部の形状を示す分解斜視図。FIG. 24 is an exploded perspective view showing the shape of the fitting portion between the metal lead plate and the substrate in the eighth embodiment of the present invention.

【図２５】従来例の構成を示す分解斜視図。FIG. 25 is an exploded perspective view showing a configuration of a conventional example.

【図２６】従来例の構成を示す斜視図。FIG. 26 is a perspective view showing a configuration of a conventional example.

【図２７】（ａ）は従来例の構成を示す分解斜視図、
（ｂ）はそのＢ矢視図。FIG. 27 (a) is an exploded perspective view showing a configuration of a conventional example,
(B) is the B arrow view.

【符号の説明】[Explanation of symbols]

１、１１、２１、３１、１０１、２０１ 基板 １ａ、１１ａ、２１ａ、３１ａ 固定用溝 ２、１２、２２、３２、４２、５２、６２、７２ 金
属リード板 ２ａ、１２ａ、２２ａ、３２ａ、４２ａ、５２ａ、６２
ａ７２ａ 接続端子 ２ｂ、２ｃ、１２ｂ、１２ｃ、４２ｂ、６２ｂ、７２ｂ
凸部 ３、１０３、２０３ 圧電振動素子 ４、２０４ キャップ ５、６ 空隙 ７ 接着剤 ８ 封止材 ４２ｄ、５２ｄ、６２ｄ、７２ｄ 固定片 ９１ ケース ９２、９５ 封着部分 ９３ 水晶板 ９４、１０２ 電極 ９６ 上蓋 ２０５ 貫通孔 ２０６ 電極リード線 ２０７ 金属加工板1, 11, 21, 31, 31, 101, 201 Substrate 1a, 11a, 21a, 31a Fixing groove 2, 12, 22, 32, 42, 52, 62, 72 Metal lead plate 2a, 12a, 22a, 32a, 42a, 52a, 62
a72a connection terminal 2b, 2c, 12b, 12c, 42b, 62b, 72b
Convex part 3, 103, 203 Piezoelectric vibration element 4, 204 Cap 5, 6 Gap 7 Adhesive 8 Sealant 42d, 52d, 62d, 72d Fixing piece 91 Case 92, 95 Sealing part 93 Quartz plate 94, 102 Electrode 96 Upper lid 205 Through hole 206 Electrode lead wire 207 Metal processed plate

Claims (8)

【特許請求の範囲】[Claims] 【請求項１】 絶縁材料により形成された１枚の基板
と、それぞれこの基板の表裏にまたがって嵌着された２
個の金属リード板と、この基板の表側でこの２個の金属
リード板の間に架けわたされた圧電振動素子と、この圧
電振動素子を内包するように前記基板の表側に被せられ
たキャップとを備え、前記基板の裏側に表れる前記金属
リード板を接続端子とすることを特徴とする圧電振動
子。1. A single substrate made of an insulating material, and two substrates fitted over the front and back of each substrate.
A metal vibrating plate, a piezoelectric vibrating element that is hung between the two metal lead plates on the front side of the substrate, and a cap that covers the front side of the substrate so as to include the piezoelectric vibrating element. A piezoelectric vibrator, wherein the metal lead plate appearing on the back side of the substrate is used as a connection terminal. 【請求項２】 前記圧電振動素子と前記基板との間、お
よび前記圧電振動素子と前記キャップとの間に十分な空
隙が設けられた請求項１記載の圧電振動子。2. The piezoelectric vibrator according to claim 1, wherein sufficient gaps are provided between the piezoelectric vibrating element and the substrate and between the piezoelectric vibrating element and the cap. 【請求項３】 前記キャップと前記基板との間および前
記キャップと前記金属リード板との間ならびに前記金属
リード板と前記基板との間は、それぞれ接着剤または封
止材により気密封止された請求項１または２記載の圧電
振動子。3. The space between the cap and the substrate, the space between the cap and the metal lead plate, and the space between the metal lead plate and the substrate are hermetically sealed with an adhesive or a sealing material, respectively. The piezoelectric vibrator according to claim 1. 【請求項４】 前記基板の材料は樹脂またはその複合材
料である請求項１ないし３のいずれかに記載の圧電振動
子。4. The piezoelectric vibrator according to claim 1, wherein the material of the substrate is resin or a composite material thereof. 【請求項５】 前記基板の材料はセラミックスである請
求項１ないし３のいずれかに２記載の圧電振動子。5. The piezoelectric vibrator according to claim 1, wherein the material of the substrate is ceramics. 【請求項６】 前記キャップの材料は樹脂またはその複
合材料である請求項４または５記載の圧電振動子。6. The piezoelectric vibrator according to claim 4, wherein the material of the cap is resin or a composite material thereof. 【請求項７】 前記キャップの材料は金属である請求項
４または５記載の圧電振動子。7. The piezoelectric vibrator according to claim 4, wherein the material of the cap is metal. 【請求項８】 前記キャップの材料はセラミックスであ
る請求項４または５記載の圧電振動子。8. The piezoelectric vibrator according to claim 4, wherein the material of the cap is ceramics.