JPH09292431A - Method and device for inspecting board having lead terminal - Google Patents
Method and device for inspecting board having lead terminalInfo
- Publication number
- JPH09292431A JPH09292431A JP8105721A JP10572196A JPH09292431A JP H09292431 A JPH09292431 A JP H09292431A JP 8105721 A JP8105721 A JP 8105721A JP 10572196 A JP10572196 A JP 10572196A JP H09292431 A JPH09292431 A JP H09292431A
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- JP
- Japan
- Prior art keywords
- substrate
- shape
- sandwiching
- signal
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明はリード端子を有する
基板の検査方法及びその検査装置に関し、詳しくは混成
集積回路等の基板に取り付けられたリード端子の取付状
態を容易に検査する方法及びその検査装置の構成に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for inspecting a substrate having lead terminals and an inspection apparatus therefor, and more particularly, to a method for easily inspecting an attachment state of lead terminals attached to a substrate such as a hybrid integrated circuit and its inspection. Regarding the configuration of the device.
【０００２】[0002]
【従来の技術】従来、図４及び図５に一例を示すような
混成集積回路装置（以下「混成基板」と称す）１及び
１″では、トランジスタ、抵抗及びＩＣ等の個別部品を
搭載する基板の少なくとも一辺に図示しない他のメイン
基板に挿入接続するための挿入実装用のリード端子が複
数取り付けられている。2. Description of the Related Art Conventionally, in a hybrid integrated circuit device (hereinafter referred to as a "hybrid substrate") 1 and 1 "as an example shown in FIGS. 4 and 5, a substrate on which individual parts such as transistors, resistors and ICs are mounted. A plurality of lead terminals for insertion mounting for inserting and connecting to another main board (not shown) are attached to at least one side of.
【０００３】図４の各図は混成基板１の外形形状例を示
し、図４（ａ）は個別部品１ｂが搭載されている平面を
上方から見た状態を示し、図４（ｂ）は図４（ａ）の線
Ｘ１−Ｘ１に沿う部分付近を側面から見た状態でリード
端子２の取り付けが正常な状態を示し、図４（ｃ）は図
４（ａ）の線Ｘ２−Ｘ２に沿う部分付近を側面から見た
状態でリード端子２′の取り付けが正常でない状態（以
下「端子つぶれ」と称す）の一例を示している。また、
図５は他の外形形状例としての混成基板１″を示してい
る。4A and 4B show examples of the outer shape of the hybrid substrate 1, FIG. 4A shows a state in which the individual component 1b is mounted and is viewed from above, and FIG. 4 (a) shows a state in which the lead terminal 2 is normally attached when the vicinity of the portion along the line X1-X1 of FIG. 4 (a) is viewed from the side, and FIG. 4 (c) is along the line X2-X2 of FIG. 4 (a). This shows an example of a state in which the lead terminal 2'is not properly attached (hereinafter referred to as "terminal crush") when the vicinity of the portion is viewed from the side. Also,
FIG. 5 shows a hybrid substrate 1 ″ as another external shape example.
【０００４】混成基板１の構成について説明する。混成
基板１は、セラミック基板１ａの表面にプリント配線１
ｃが形成され、その配線上の予め決められた位置に個別
部品１ｂが搭載されて回路を形成しているとともに、基
板１ａの一辺に複数のリード端子２及び２′が一定間隔
で取り付けられて混成基板１の入出力端子となってい
る。そして、各リード端子は、その一端に基板１ａの端
部を両面から挟持するように略Ｕ字状に形成された挟持
部２ａ及び２ａ′が形成されているとともに、それぞれ
のリード端子の他端にはメイン基板に挿入接続するため
の挿入部２ｂが形成され、各挟持部を基板１ａの側面か
ら挿入して取り付けられて配線接続されている。尚、図
５は、リード端子２″が基板部１ａ″をメイン基板と平
行に挿入実装できるように基板部平面に対して垂直方向
に取り付けられている以外は、図４と同様なので詳しい
説明を割愛する。The structure of the hybrid substrate 1 will be described. The hybrid substrate 1 has the printed wiring 1 on the surface of the ceramic substrate 1a.
c is formed, the individual component 1b is mounted at a predetermined position on the wiring to form a circuit, and a plurality of lead terminals 2 and 2'are attached to one side of the substrate 1a at regular intervals. It serves as an input / output terminal of the hybrid substrate 1. Further, each lead terminal is provided at one end thereof with substantially U-shaped holding portions 2a and 2a 'which hold the end portion of the substrate 1a from both sides, and the other end of each lead terminal is formed. An insertion portion 2b for inserting and connecting to the main board is formed on the board, and each holding portion is inserted and attached from the side surface of the board 1a to be connected by wiring. Note that FIG. 5 is the same as FIG. 4 except that the lead terminals 2 ″ are mounted in a direction perpendicular to the plane of the board so that the board 1a ″ can be inserted and mounted in parallel with the main board. Omit.
【０００５】尚、端子つぶれの形状例としては、図４
（ｃ）に示すような折れ曲がりや同図（ａ）に示すよう
な開き曲がり等、挿入接続した後に各挟持部を半田付け
したときに配線との間に半田が十分に付かないような形
状がある。このように構成された混成基板１は、挿入部
２ｂをメイン基板に挿脱することを繰り返ししたり、メ
イン基板に一度取り付けた後に振動等による不要な外部
応力が各挟持部にかかったりした場合、図４（ｂ）や図
５に示すような正常な挟持部２ａはその接続強度が十分
にあるので挟持部２ａが外れて断線してしまうことは無
いが、図４（ｃ）に示すような端子つぶれした挟持部２
ａ′は接続強度が十分になく半田が外れて断線したり基
板１ａからリード端子２が離脱したりすることがあっ
た。このように、端子つぶれした挟持部２ａ′はメイン
基板に取り付けた後に接続不良を起こし易く、混成基板
１を用いた製品の動作不良等の致命的な不良の原因とな
ることが多かった。従って、このような端子つぶれのあ
る基板は確実に選別する必要があり、各リード端子を取
り付け後に基板の両面から目視による検査を行うか、フ
ァイバセンサ装置等を用いた光学装置による検査を行う
かして選別するようにしていた。As an example of the shape of the crushed terminal, see FIG.
A shape such as a bend as shown in (c) or an open bend as shown in (a) of the figure is such that solder is not sufficiently attached to the wiring when the holding portions are soldered after the insertion and connection. is there. In the hybrid substrate 1 configured as described above, when the insertion portion 2b is repeatedly inserted into and removed from the main substrate, or when unnecessary external stress due to vibration or the like is applied to each holding portion after being attached to the main substrate once. As shown in FIG. 4 (c), the normal holding portion 2a as shown in FIG. 4 (b) and FIG. 5 has sufficient connection strength so that the holding portion 2a does not come off and disconnect. Clamping part 2 with flat terminals
In the case of a ', the connection strength was not sufficient, and the solder sometimes came off and the wire was broken, or the lead terminal 2 sometimes separated from the substrate 1a. As described above, the pinched terminal portion 2a 'is apt to cause a connection failure after being mounted on the main board, and often causes a fatal failure such as an operation failure of a product using the hybrid board 1. Therefore, it is necessary to surely select the board with such crushed terminals. Whether to inspect by visual inspection from both sides of the board after attaching each lead terminal or by an optical device using a fiber sensor device etc. I was trying to sort out.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、目視に
よる検査は自動化できないので人為的ミスを防ぐことが
できず、光学装置による検査は高価な装置を使用するに
もかかわらず光の当て方や挟持部の形状等によって光の
反射の仕方が異なることから基板の両面に設置されたセ
ンサが相互干渉を受ける等して誤認識してしまうことが
あるという問題があった。従って、いづれの方法でも端
子つぶれを十分に選別することができず、出荷された端
子つぶれの有る混成基板を搭載した携帯機器等の応用製
品が動作不良になってしまうことがあるという問題もあ
った。However, since the visual inspection cannot be automated, human error cannot be prevented, and the inspection by the optical device requires the use of an expensive device to irradiate the light and the sandwiching portion. There is a problem in that the sensors installed on both sides of the substrate may be erroneously recognized due to mutual interference, etc., because the manner of light reflection differs depending on the shape and the like. Therefore, there is also a problem that terminal crushing cannot be adequately selected by any of the methods, and applied products such as portable devices equipped with shipped hybrid boards with crushed terminals may malfunction. It was
【０００７】そこで本発明はこれらの問題を解決し、リ
ード端子を有する基板の端子つぶれ不良を確実に選別で
きる簡単な検査装置及び検査方法を提供することによ
り、端子つぶれのない基板を容易に提供するとともにそ
の応用製品の信頼性を向上できるようにすることを目的
とする。Therefore, the present invention solves these problems and provides a simple inspection apparatus and inspection method capable of reliably selecting a crushed terminal defect of a board having a lead terminal, thereby easily providing a crushed board. The purpose is to improve the reliability of the applied products.
【０００８】[0008]
【課題を解決するための手段】上述の問題を解決するた
めに、請求項１に記載のリード端子を有する基板の検査
方法は、表面に配線１ｃのパターンが形成された基板部
１ａと、基板部１ａの端部を挟持するように略Ｕ字状に
形成された挟持部２ａと他の基板に挿入接続するように
形成された挿入部２ｂが設けられたリード端子２と、を
有し、基板部１ａの少なくとも一辺に複数のリード端子
２が取り付けられて配線１ｃと接続するように形成され
た基板１の挟持部２ａの取り付け状態を検査する検査方
法であって、良品形状に形成された挟持部２ａに近接ま
たは接触することによって信号を出力する検出器２１を
用いて挟持部２ａの形状を確認する工程と、信号の有無
により挟持部２ａ形状が良品形状でない（２ａ′）と判
定されたときに対応する挿入部２ｂの形状を加工する工
程と、を有することを特徴とする。In order to solve the above-mentioned problems, a method of inspecting a substrate having lead terminals according to claim 1 is a substrate portion 1a having a pattern of wiring 1c formed on the surface thereof, and a substrate. A sandwiching portion 2a formed in a substantially U shape so as to sandwich an end portion of the portion 1a, and a lead terminal 2 provided with an inserting portion 2b formed so as to be inserted and connected to another substrate, A method for inspecting the attachment state of a holding portion 2a of a substrate 1 which is formed so that a plurality of lead terminals 2 are attached to at least one side of the substrate portion 1a and is connected to a wiring 1c. A step of confirming the shape of the sandwiching portion 2a using a detector 21 that outputs a signal when the sandwiching portion 2a is brought close to or in contact with the sandwiching portion 2a, and the presence or absence of a signal determines that the sandwiching portion 2a is not a good shape (2a '). When A step of processing the shape of the insertion portion 2b which is characterized by having a.
【０００９】また、請求項２に記載のリード端子を有す
る基板の検査装置２０は、表面に配線パターン１ｃが形
成された基板部１ａと、基板部１ａの両面を挟持するよ
うに形成された略Ｕ字状の挟持部２ａと他の基板に挿入
接続するように形成された挿入部２ｂが設けられたリー
ド端子２と、を有し基板部１ａの少なくとも一辺に配線
１ｃと接続するように複数のリード端子２が取り付けら
れた挟持部２ａの取り付け状態を検査するための検査装
置であって、挟持部２ａが一定範囲内に近接することに
より挟持部２ａの形状が良品形状であることを示す信号
を出力する検出部（２１ａ及び２１ｂ）と、検出部から
の信号がないときに挿入部２ｂの形状を加工する端子加
工部（２２及び２３）と、検出部（２１ａ及び２１ｂ）
からの信号に応じて基板１の搬送制御または端子加工部
（２２及び２３）の動作制御を行う制御回路部２４と、
を有することを特徴とする。A board inspection device 20 having lead terminals according to a second aspect of the present invention includes a board portion 1a having a wiring pattern 1c formed on the surface thereof, and a board portion 1a formed so as to sandwich both surfaces of the board portion 1a. A U-shaped holding portion 2a and a lead terminal 2 provided with an insertion portion 2b formed so as to be inserted and connected to another substrate, and a plurality of wiring terminals 1c are provided on at least one side of the substrate portion 1a. It is an inspection device for inspecting the attachment state of the holding part 2a to which the lead terminal 2 is attached, and shows that the holding part 2a has a non-defective shape when the holding part 2a comes close to a certain range. Detection units (21a and 21b) that output signals, terminal processing units (22 and 23) that process the shape of the insertion unit 2b when there is no signal from the detection units, and detection units (21a and 21b).
A control circuit section 24 that controls the transfer of the substrate 1 or the operation of the terminal processing sections (22 and 23) according to a signal from
It is characterized by having.
【００１０】請求項３に記載のリード端子を有する基板
の検査装置２０′は、表面に配線パターン１ｃが形成さ
れた基板部１ａと、基板部１ａの両面を挟持するように
形成された略Ｕ字状の挟持部２ａと他の基板に挿入接続
するように形成された挿入部２ｂが設けられたリード端
子２と、を有し基板部１ａの少なくとも一辺に配線１ｃ
と接続するように複数のリード端子２が取り付けられた
挟持部２ａの取り付け状態を検査するための検査装置で
あって、一定範囲内にある挟持部２ａに接触することに
より挟持部２ａの形状が良品形状であることを示す信号
を出力する検出部（２１ａ及び２１ｂ）と、検出部から
の信号がないときに挿入部２ｂの形状を加工する端子加
工部（２２及び２３）と、検出部（２１ａ及び２１ｂ）
からの信号に応じて基板１の搬送制御または前記端子加
工部の動作制御を行う制御回路部２４と、を有すること
を特徴とする。According to a third aspect of the present invention, there is provided an inspecting device 20 'for a substrate having lead terminals, wherein a substrate portion 1a having a wiring pattern 1c formed on a surface thereof and a substantially U-shaped portion sandwiching both sides of the substrate portion 1a. The wire-shaped holding portion 2a and the lead terminal 2 provided with the insertion portion 2b formed so as to be inserted and connected to another substrate, and the wiring 1c on at least one side of the substrate portion 1a.
It is an inspection device for inspecting the attachment state of the sandwiching part 2a to which a plurality of lead terminals 2 are attached so as to be connected with the sandwiching part 2a. A detection unit (21a and 21b) that outputs a signal indicating that the shape is a non-defective product, a terminal processing unit (22 and 23) that processes the shape of the insertion unit 2b when there is no signal from the detection unit, and a detection unit ( 21a and 21b)
And a control circuit section 24 which controls the transfer of the substrate 1 or the operation of the terminal processing section according to a signal from the control circuit section 24.
【００１１】本発明のような検査方法及びその検査装置
を用いることにより、挟持部の両面から同時に形状検査
を行っても検出部間で著しい相互干渉等を起こすことが
なくなるとともに、端子つぶれのあるリード端子の挿入
部の形状が加工されるようになる。By using the inspection method and the inspection apparatus thereof according to the present invention, even if the shape inspection is performed from both sides of the sandwiching portion at the same time, no significant mutual interference occurs between the detection portions and the terminals are crushed. The shape of the insertion portion of the lead terminal is processed.
【００１２】[0012]
【実施形態】以下、本発明の実施形態を図面を参照しな
がら詳細に説明する。尚、本明細書では全図面を通し
て、同一または同様の構成要素には同一の符号を付して
説明を簡略化するようにしている。図１は、本発明の検
査装置２０を用いて混成基板１の端子つぶれを検査して
いる状態を示す説明図で、図１（ａ）はその要部側面拡
大図を示し、図１（ｂ）は図１（ａ）の矢印Ｄの方向か
ら見た要部側面図を示している。Embodiments of the present invention will be described in detail below with reference to the drawings. Throughout the drawings, the same or similar components are denoted by the same reference symbols throughout the drawings to simplify the description. FIG. 1 is an explanatory view showing a state in which a crushed terminal of a hybrid substrate 1 is inspected by using an inspection apparatus 20 of the present invention, and FIG. 1 (a) shows an enlarged side view of a main part thereof, and FIG. 1) shows a side view of the main part as seen from the direction of arrow D in FIG.
【００１３】図１について説明する。混成基板１は、厚
さが１ｍｍ程度のセラミック板でその表面にプリント配
線１ｃが形成された基板部１ａと、プリント配線１ｃ上
の搭載位置に搭載されて回路を形成するトランジスタや
抵抗やＩＣ等の個別部品１ｂと、銅や合金等の導電性金
属からなり基板部１ａの一辺に、例えば、１．７７８ｍ
ｍや２．５４ｍｍの端子間距離（「端子ピッチ」とい
う）で複数個並列に取り付けられて回路の入出力端子と
なるリード端子２及び２′と、から構成されている。更
に、各リード端子は、基板部１ａに数ｍｍ挿入されて基
板部１ａを挟持する略Ｕ字状（チューリップ形状）に形
成された挟持部と、図示しないメイン基板に挿入接続す
るための挿入部２ｂとから構成されている。Referring to FIG. The hybrid substrate 1 is a ceramic plate having a thickness of about 1 mm, a substrate portion 1a having a printed wiring 1c formed on the surface thereof, and a transistor, a resistor, an IC or the like mounted at a mounting position on the printed wiring 1c to form a circuit. Of the individual component 1b and a conductive metal such as copper or alloy on one side of the substrate portion 1a, for example, 1.778m
A plurality of lead terminals 2 and 2'that are attached in parallel at a distance between terminals (referred to as "terminal pitch") of 2.5 m or 2.54 mm and serve as input / output terminals of the circuit. Further, each lead terminal is inserted into the board portion 1a by a few millimeters and has a substantially U-shaped (tulip-shaped) holding portion for holding the board portion 1a, and an insertion portion for inserting and connecting to a main board (not shown). 2b and.
【００１４】検査装置２０は、各挟持部が一定距離以内
に接近した場合に磁界の変化を信号として出力する近接
スイッチからなる検出部２１ａ及び２１ｂと、挿入部２
ｂの一部を押さえて検査位置を固定したり混成基板１を
端子ピッチ等の一定距離搬送したりするための押さえロ
ーラ２２と、挿入部２ｂの一部を切断するカッタとして
の金型２３と、押さえローラ２２による搬送や金型２３
による切断動作等の制御を各検出部からの信号の有無に
応じて制御する制御回路部２４と、基板１ａを支持する
とともに各検出部が予め設置された搬送シュータ２５と
から構成されている。尚、個別部品を搭載した側の検出
部２１ｂは図４（ａ）の斜線で示す検出領域Ｓの上方に
設置されており、挟持部が検出領域Ｓ内に十分入ってい
る場合のみに信号出力するようになっている。また、同
様に、反対側の検出部２１ａは下側の挟持部の金属部分
の直上で検出領域Ｓと同様な大きさの範囲を検出するよ
うに設置されている。The inspection device 20 includes the detectors 21a and 21b, which are proximity switches that output a change in the magnetic field as a signal when the sandwiching parts approach within a certain distance, and the insertion part 2.
A pressing roller 22 for pressing a part of b to fix the inspection position or conveying the hybrid substrate 1 at a constant distance such as a terminal pitch, and a mold 23 as a cutter for cutting a part of the insertion part 2b. , Conveying by pressing roller 22 and die 23
The control circuit section 24 controls the cutting operation and the like according to the presence / absence of a signal from each detection section, and the transfer shooter 25 that supports the substrate 1a and has each detection section installed in advance. The detection unit 21b on the side where the individual parts are mounted is installed above the detection area S indicated by the diagonal lines in FIG. 4A, and the signal output is performed only when the sandwiching section is sufficiently inside the detection area S. It is supposed to do. Similarly, the detection section 21a on the opposite side is installed so as to detect a range having the same size as the detection area S immediately above the metal portion of the lower holding section.
【００１５】検査動作について説明する。まづ、各リー
ド端子が取り付けられた混成基板１を搬送シュータ２５
上に載せ、各挟持部が検出部２１ａ及び２１ｂの直下に
来るように矢印Ａの方向に移動する。このとき、各挟持
部の形状が図４（ｂ）で示したような形状（良品形状）
の場合には、各挟持部が十分に検出領域Ｓ内に入るので
各検出部と各挟持部との距離が約１ｍｍ以内に最接近す
ることになり、近接スイッチから信号が出力される。一
方、各挟持部に図４（ｃ）に示したような端子つぶれが
ある場合には、挟持部２ａ′と検出部２１ｂとの距離が
数ｍｍ離れることになり、最接近した状態でも近接スイ
ッチから信号出力はされない。The inspection operation will be described. First, the transfer chute 25
It is placed on the top and moved in the direction of arrow A so that the sandwiching parts come directly under the detecting parts 21a and 21b. At this time, the shape of each holding portion is the shape as shown in FIG. 4B (non-defective shape).
In this case, since each sandwiching portion is sufficiently within the detection area S, the distance between each detecting portion and each sandwiching portion comes to the closest within about 1 mm, and a signal is output from the proximity switch. On the other hand, when the pinching portion has a crushed terminal as shown in FIG. 4C, the pinching portion 2a ′ and the detecting portion 21b are separated by several mm, and even if they are closest to each other, the proximity switch No signal is output from.
【００１６】従って、制御回路２４では、各検出部から
信号が共に有った場合には各挟持部が良品形状をしてい
ると判断し、混成基板１を端子ピッチ距離だけ移動して
次の挟持部２ａの形状を検査するように各部を制御す
る。そして、信号出力が一方でも無い場合にはそのリー
ド端子の挟持部には端子つぶれがある形状不良と判断
し、金型２３を波線の位置から矢印Ｂの方向に移動させ
て挿入部２ｂの一部を切断してから、挟持部が良品形状
の場合と同様に、混成基板１を端子ピッチ距離だけ移動
して次の挟持部２ａの形状を検査するように各部を制御
する。このような検査動作を繰り返すことにより全ての
挟持部の形状を確認するように動作する。Accordingly, the control circuit 24 judges that each sandwiching portion has a non-defective shape when there is a signal from each detecting portion, and moves the hybrid substrate 1 by the terminal pitch distance to move to the next step. Each part is controlled so as to inspect the shape of the holding part 2a. If there is no signal output on either side, it is determined that the pinching portion of the lead terminal has a crushed terminal, and the die 23 is moved from the position of the wavy line in the direction of the arrow B to move the part of the insertion portion 2b. After the section is cut, as in the case where the sandwiching section has a non-defective shape, the hybrid substrate 1 is moved by the terminal pitch distance to control each section so as to inspect the shape of the next sandwiching section 2a. By repeating such an inspection operation, it operates so as to confirm the shapes of all the sandwiching portions.
【００１７】図１は、本発明の検査装置２０を用いて混
成基板１の端子つぶれを検査している状態を示す説明図
で、図１（ａ）はその要部側面拡大図を示し、図１
（ｂ）は図１（ａ）の矢印Ｄの方向から見た要部側面図
を示している。図２は、本発明の他の検査装置２０′を
用いた検査状態を示す説明図で、液晶表示パネル１″の
リード端子の取付状態を検査しているときの主要部を図
１（ａ）と同様な方向から見た状態示している。FIG. 1 is an explanatory view showing a state in which a crushed terminal of a hybrid substrate 1 is inspected by using an inspection apparatus 20 of the present invention, and FIG. 1 (a) is an enlarged side view of an essential part thereof. 1
FIG. 1B shows a side view of the main part as seen from the direction of arrow D in FIG. FIG. 2 is an explanatory view showing an inspection state using another inspection apparatus 20 'of the present invention. FIG. 1 (a) shows a main part when inspecting the attachment state of the lead terminal of the liquid crystal display panel 1 ". Shown from the same direction as.
【００１８】その構成は、次のような構成を除いて図１
と同様な構成となっているので、相違部分についてのみ
説明する。即ち、近接スイッチ１１ａ及び１１ｂの代わ
りに検出端子１１ｃ及び１１ｄが設置され、挿入部２ｂ
の一部を折り曲げるための金型２３ｂが挿入部２ｂの上
方に配置され、液晶表示パネル１″が基板部１ｄの内部
に文字や記号等の表示パターンが形成されているととも
に基板部１ｄの内部から表面へ配線１ｅが導出されてい
る。尚、検出端子は、上下の検出端子が挟持部に共に接
触したときに、各挟持部を介して各検出端子間に信号が
出力されるような構成になっている。The structure is shown in FIG. 1 except for the following structure.
Since the configuration is the same as the above, only different parts will be described. That is, the detection terminals 11c and 11d are installed instead of the proximity switches 11a and 11b, and the insertion portion 2b
A mold 23b for bending a part of the liquid crystal display panel 1 ″ is arranged above the insertion portion 2b, and the liquid crystal display panel 1 ″ has a display pattern such as characters and symbols formed inside the substrate portion 1d and inside the substrate portion 1d. The wiring 1e is led to the surface from the detection terminals.When the upper and lower detection terminals come into contact with the sandwiching portion, a signal is output between the respective detection terminals via the sandwiching portions. It has become.
【００１９】また、その検査動作は、次のような点を除
いて図１の場合と同様な動作を行うので、相違部分につ
いてのみ説明する。即ち、検査位置に設置された各挟持
部の上方から検出端子２１ｃ及び２１ｄが良品形状の各
挟持部に接触する距離だけそれぞれ近づくことにより、
各挟持部が良品形状の場合には、各検出端子とリード端
子とがそれぞれ接触することにより挟持部２ａ′を介し
て検出端子２１ｃから２１ｄへの回路が形成されて信号
が出力され、制御回路２４では各挟持部の形状が良品形
状をしていると判定する。一方、各挟持部の一方でも端
子つぶれしている場合には、各検出端子とリード端子と
が同時に接触することがなく検出端子２１ｃから２１ｄ
への回路が形成されず信号も出力されないので、制御回
路４はその挟持部が端子つぶれしていると判定し、金型
２３ｂを矢印Ｃの方向に移動させて挿入部２ｂを途中で
折り曲げるように制御する。Since the inspection operation is the same as that in the case of FIG. 1 except for the following points, only different points will be described. That is, the detection terminals 21c and 21d come closer to each other from the upper side of the sandwiching portion installed at the inspection position by a distance to contact each sandwiching portion of good shape,
When each sandwiching portion is of a non-defective shape, a circuit is formed from the detection terminals 21c to 21d via the sandwiching portion 2a 'by contacting each detection terminal and the lead terminal, and a signal is output, and the control circuit At 24, it is determined that the shape of each holding portion is a non-defective shape. On the other hand, if one of the holding portions has a crushed terminal, the detection terminals 21c to 21d do not come into contact with the detection terminals at the same time.
Since no circuit is formed and no signal is output, the control circuit 4 determines that the pinching portion is crushed, moves the mold 23b in the direction of arrow C, and bends the insertion portion 2b in the middle. To control.
【００２０】尚、全てのリード端子の検査を終えた後、
液晶表示パネル（以下「パネル基板」と称す）１″の搬
送時に折り曲げられた挿入部２ｂを引っかけて選別する
ようにすれば、自動的に形状不良のあるパネル基板を確
実に取り除くことができ、選別されたパネル基板の端子
つぶれのあるリード端子のみを取り代えて良品になるよ
うにすれば、パネル基板の歩留まりを向上できるように
なる。After all lead terminals have been inspected,
When the liquid crystal display panel (hereinafter, referred to as “panel substrate”) 1 ″ is conveyed, the bent insertion portion 2b is hooked to perform sorting, so that the panel substrate having a defective shape can be automatically and reliably removed. The yield of the panel substrate can be improved by replacing only the lead terminals having the terminal collapse of the selected panel substrate so as to obtain a good product.
【００２１】図３は本発明の検査装置２０の全体構成を
示し、混成基板またはパネル基板等の各基板を支持する
とともに搬送するための搬送シュータ２５と、検出部２
１が内蔵されるとともに搬送シュータ２５の上下の検出
位置にそれぞれ設置されたホルダ２６と、検出部２１で
挟持部の形状を検査中の各基板を固定するための押さえ
ローラ２７と、各基板を搬送シュータ２５に沿って搬送
するための搬送ローラ２８と、検出部２１で形状を検査
した結果に応じて各挿入部の形状加工を行うための上金
型２３ａ及び下金型２３ｂからなる端子加工部と、上金
型２３ａを空気圧で上下に移動させるためのエアシリン
ダ２９とから構成されている。尚、制御回路４は汎用の
制御装置やテスタ等を使用すれば良いので図示していな
い。FIG. 3 shows the overall construction of the inspection apparatus 20 of the present invention, which includes a transfer chute 25 for supporting and carrying each substrate such as a hybrid substrate or a panel substrate, and a detecting section 2.
1 and a holder 26 installed in each of the upper and lower detection positions of the transfer shooter 25, a holding roller 27 for fixing each substrate whose shape is being inspected by the detection unit 21 under inspection, and each substrate. Terminal processing including a transport roller 28 for transporting along the transport shooter 25, and an upper die 23a and a lower die 23b for shaping the shape of each insertion portion according to the result of the shape inspection by the detection unit 21. And an air cylinder 29 for moving the upper die 23a up and down by air pressure. The control circuit 4 is not shown because a general-purpose control device or a tester may be used.
【００２２】このような構成により、次の点を除いて図
１の検査動作と同様にして各挟持部の形状検査を行うよ
うになっている。即ち、検出部での形状検査と一緒に各
挿入部の端子加工を行うのではなく、一旦各基板の全て
の挟持部の形状検査を行った後に各基板を端子加工部ま
で搬送し、上金型２３ａをエアシリンダ２９で下方に移
動して上金型２３ａ及び下金型２３ｂを用いて挿入部を
切断したり折り曲げたりするようになっている。With such a configuration, the shape inspection of each holding portion is performed in the same manner as the inspection operation of FIG. 1 except for the following points. That is, instead of performing the terminal processing of each insertion portion together with the shape inspection at the detection portion, once the shape inspection of all the sandwiching portions of each substrate is performed, each substrate is conveyed to the terminal processing portion and the upper metal The die 23a is moved downward by the air cylinder 29, and the upper die 23a and the lower die 23b are used to cut or bend the insertion portion.
【００２３】尚、本発明は上述の実施形態に限定される
ものではなく、リード端子を有する基板は、その表面に
抵抗等が印刷されたネットワーク抵抗器用の基板でも構
わない。また、基板の材質はガラスエポキシ基板やエポ
キシ基板等でも構わないとともに、表面のみに配線が形
成された単層配線基板でも配線層が多層に形成された多
層配線基板でも構わない。各近接スイッチは挟持部の金
属が近づくことにより変動する容量の変化を検出して信
号を出力するものでも構わないし、磁気や容量の変化を
増幅して出力する近接センサを近接スイッチの代わりに
用いて制御回路２４でそのレベルを判定するようにして
も構わない。更に、好ましくは、その接続強度を向上す
るために、各挟持部の端子形状を検査した後に挟持部を
半田付けしたり接着樹脂で固定したりするとともに、基
板及び部品の上部をエポキシ等の樹脂で封止するように
しても良い。The present invention is not limited to the above embodiment, and the substrate having the lead terminal may be a substrate for a network resistor having a resistance or the like printed on the surface thereof. Further, the material of the substrate may be a glass epoxy substrate, an epoxy substrate, or the like, and may be a single-layer wiring substrate in which wiring is formed only on the surface or a multilayer wiring substrate in which wiring layers are formed in multiple layers. Each proximity switch may be one that outputs a signal by detecting a change in capacitance that fluctuates when the metal of the sandwiching part approaches, or a proximity sensor that amplifies and outputs a change in magnetism or capacitance is used instead of the proximity switch. Alternatively, the control circuit 24 may determine the level. Further, preferably, in order to improve the connection strength, after the terminal shape of each holding portion is inspected, the holding portion is soldered or fixed with an adhesive resin, and the upper portion of the board and the component is made of resin such as epoxy. You may make it seal with.
【００２４】また、以上の検査動作では、一つの挟持部
を基板の上下から同時に検査するようになっているが、
片側づつ検査したり、複数の挟持部を同時に測定するよ
うにしたりしても良い。また、端子つぶれが一個でも有
れば他の挟持部の形状検査を中断し、次の基板の挟持部
を検査するようにしても良い。Further, in the above inspection operation, one sandwiching portion is inspected from above and below the substrate at the same time.
It is also possible to inspect each side or to measure a plurality of sandwiching portions at the same time. Further, if there is even one crushed terminal, the shape inspection of the other sandwiching portion may be interrupted and the sandwiching portion of the next substrate may be inspected.
【００２５】[0025]
【発明の効果】以上説明したように本発明のようなリー
ド端子を有する基板の検査方法及びその検査装置を用い
れば、人為的ミスや検出器の相互干渉等によって挟持部
の形状を誤認識することがなくなり形状判別をより確実
に行えるようになるという効果がある。また、端子つぶ
れのあるリード端子の挿入部の形状を加工するので、挟
持部の形状が不良と判断された基板が良品基板に混入し
て出荷され難くなるとともに、万一出荷されて携帯機器
等の応用製品の基板として用いられた場合でも確実に動
作不良となるので、不良基板を用いた応用製品が出荷さ
れた後、使用者が応用製品を使用中に動作不良になった
りすることが無くなり信頼性が向上するという効果があ
る。As described above, by using the inspection method and the inspection apparatus for a substrate having lead terminals as in the present invention, the shape of the sandwiching portion is erroneously recognized due to human error or mutual interference of detectors. This has the effect that the shape determination can be performed more reliably. In addition, since the shape of the insertion part of the lead terminal with a crushed terminal is processed, it is difficult to mix the board with the pinch shape determined to be defective with a good board, and it is difficult to ship. Even if it is used as a board of the applied product, the operation will definitely fail.Therefore, after the applied product using the defective board is shipped, the user does not have a malfunction while using the applied product. This has the effect of improving reliability.
【図１】 本発明の検査装置を用いた検査状態を示す説
明図、FIG. 1 is an explanatory view showing an inspection state using an inspection device of the present invention,
【図２】 本発明の他の検査装置を用いた検査状態を示
す説明図、FIG. 2 is an explanatory view showing an inspection state using another inspection device of the present invention,
【図３】 本発明の検査装置の全体構成を示す説明図、FIG. 3 is an explanatory diagram showing the overall configuration of the inspection device of the present invention,
【図４】 リード端子を有する基板（混成基板）を示す
説明図、FIG. 4 is an explanatory view showing a substrate (hybrid substrate) having lead terminals,
【図５】 他のリード端子形状を有する基板を示す説明
図である。FIG. 5 is an explanatory diagram showing a substrate having another lead terminal shape.
１ ：リード端子を有する基板（混成集積回路） １ａ ：基板部 １ｂ ：電子部品 ２ ：リード端子 ２ａ ：（所定形状の）挟持部 ２ａ′ ：（端子つぶれの有る）挟持部 ２ｂ ：挿入部 ２０ ：検査装置 ２１ａ、２１ｂ：検出部（近接スイッチ） ２２ ：押さえローラ ２３ ：金型（カッタ） ２４ ：制御回路部 ２５ ：搬送シュータ 1: substrate having a lead terminal (hybrid integrated circuit) 1a: substrate portion 1b: electronic component 2: lead terminal 2a: holding portion 2a '(having a predetermined shape) holding portion 2b: insertion portion 20: Inspection device 21a, 21b: Detection unit (proximity switch) 22: Pressing roller 23: Mold (cutter) 24: Control circuit unit 25: Conveyor shooter
Claims (3)
部と、前記基板部の端部を挟持するように略Ｕ字状に形
成された挟持部と他の基板に挿入接続するように形成さ
れた挿入部が設けられたリード端子と、を有し、前記基
板部の少なくとも一辺に複数の前記リード端子が取り付
けられて前記配線と接続するように形成された基板の前
記挟持部の取り付け状態を検査する検査方法であって、
良品形状に形成された前記挟持部に近接または接触する
ことによって信号を出力する検出器を用いて前記挟持部
の形状を確認する工程と、前記信号の有無により前記挟
持部形状が良品形状でないと判定されたときに対応する
前記挿入部の形状を加工する工程と、を有することを特
徴とするリード端子を有する基板の検査方法。1. A substrate portion having a wiring pattern formed on its surface, and a sandwiching portion formed in a substantially U shape so as to sandwich an end portion of the substrate portion and formed so as to be inserted and connected to another substrate. A lead terminal provided with the inserted insertion portion, and a mounting state of the holding portion of the substrate formed so as to be connected to the wiring by mounting the plurality of lead terminals on at least one side of the substrate portion. An inspection method for inspecting
A step of confirming the shape of the sandwiching portion by using a detector that outputs a signal by approaching or contacting the sandwiching portion formed in a non-defective shape; and if the sandwiching portion shape is not a non-defective shape depending on the presence or absence of the signal. And a step of processing the shape of the insertion part corresponding to the determination, the method for inspecting a substrate having a lead terminal.
部と、前記基板部の両面を挟持するように形成された略
Ｕ字状の挟持部と他の基板に挿入接続するように形成さ
れた挿入部が設けられたリード端子と、を有し、前記基
板部の少なくとも一辺に前記配線と接続するように複数
の前記リード端子が取り付けられた基板の前記挟持部の
取り付け状態を検査するための検査装置であって、前記
挟持部が一定範囲内に近接することにより前記挟持部の
形状が良品形状であることを示す信号を出力する検出部
と、前記検出部からの信号がないときに前記挿入部の形
状を加工する端子加工部と、前記検出部からの信号に応
じて前記基板の搬送制御または前記端子加工部の動作制
御を行う制御回路部と、を有することを特徴とするリー
ド端子を有する基板の検査装置。2. A substrate portion having a wiring pattern formed on the surface thereof, and a substantially U-shaped holding portion formed so as to sandwich both surfaces of the substrate portion and formed so as to be inserted and connected to another substrate. A lead terminal provided with an insertion portion, and inspecting an attachment state of the sandwiching portion of the substrate having a plurality of the lead terminals attached to at least one side of the substrate portion so as to be connected to the wiring. In the inspection device, the detection unit that outputs a signal indicating that the shape of the sandwiching unit is a non-defective shape due to the sandwiching unit approaching within a certain range, and when there is no signal from the detector. A lead, comprising: a terminal processing part that processes the shape of the insertion part; and a control circuit part that controls the transfer of the substrate or the operation of the terminal processing part in accordance with a signal from the detection part. Board with terminals Inspection equipment.
と、前記基板部の両面を挟持するように形成された略Ｕ
字状の挟持部と他の基板に挿入接続するように形成され
た挿入部が設けられたリード端子と、を有し前記基板部
の少なくとも一辺に前記配線と接続するように複数の前
記リード端子が取り付けられた基板の前記挟持部の取り
付け状態を検査するための検査装置であって、一定範囲
内にある前記挟持部に接触することにより前記挟持部の
形状が良品形状であることを示す信号を出力する検出部
と、前記検出部からの信号がないときに前記挿入部の形
状を加工する端子加工部と、前記検出部からの信号に応
じて前記基板の搬送制御または前記端子加工部の動作制
御を行う制御回路部と、を有することを特徴とするリー
ド端子を有する基板の検査装置。3. A substrate portion having a wiring pattern formed on the surface thereof, and a substantially U formed so as to sandwich both sides of the substrate portion.
A plurality of lead terminals having a letter-shaped holding portion and a lead terminal provided with an insertion portion formed so as to be inserted and connected to another substrate and connected to the wiring on at least one side of the substrate portion. An inspection device for inspecting the attachment state of the sandwiching part of a substrate to which is attached, the signal indicating that the sandwiching part has a non-defective shape by contacting the sandwiching part within a certain range. A detection unit that outputs a signal, a terminal processing unit that processes the shape of the insertion unit when there is no signal from the detection unit, and a transfer control of the substrate or the terminal processing unit according to the signal from the detection unit. An inspection apparatus for a substrate having a lead terminal, comprising: a control circuit section that controls operation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10572196A JP3657346B2 (en) | 1996-04-25 | 1996-04-25 | Inspection method and inspection apparatus for substrate having lead terminals |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10572196A JP3657346B2 (en) | 1996-04-25 | 1996-04-25 | Inspection method and inspection apparatus for substrate having lead terminals |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09292431A true JPH09292431A (en) | 1997-11-11 |
| JP3657346B2 JP3657346B2 (en) | 2005-06-08 |
Family
ID=14415198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10572196A Expired - Fee Related JP3657346B2 (en) | 1996-04-25 | 1996-04-25 | Inspection method and inspection apparatus for substrate having lead terminals |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3657346B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010203933A (en) * | 2009-03-04 | 2010-09-16 | Hioki Ee Corp | Circuit board inspection apparatus |
-
1996
- 1996-04-25 JP JP10572196A patent/JP3657346B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010203933A (en) * | 2009-03-04 | 2010-09-16 | Hioki Ee Corp | Circuit board inspection apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3657346B2 (en) | 2005-06-08 |
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