JPH09262573A - Resource recycling method from electronic part-mounted waste printed circuit board - Google Patents
Resource recycling method from electronic part-mounted waste printed circuit boardInfo
- Publication number
- JPH09262573A JPH09262573A JP7358696A JP7358696A JPH09262573A JP H09262573 A JPH09262573 A JP H09262573A JP 7358696 A JP7358696 A JP 7358696A JP 7358696 A JP7358696 A JP 7358696A JP H09262573 A JPH09262573 A JP H09262573A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- printed wiring
- tank
- separated
- pyrolysis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 32
- 239000002699 waste material Substances 0.000 title claims description 19
- 238000004064 recycling Methods 0.000 title 1
- 229910000679 solder Inorganic materials 0.000 claims abstract description 125
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 38
- 239000004576 sand Substances 0.000 claims abstract description 33
- 238000002844 melting Methods 0.000 claims abstract description 22
- 230000008018 melting Effects 0.000 claims abstract description 22
- 229910052742 iron Inorganic materials 0.000 claims abstract description 19
- 238000009835 boiling Methods 0.000 claims description 39
- 238000000197 pyrolysis Methods 0.000 claims description 36
- 239000011347 resin Substances 0.000 claims description 28
- 229920005989 resin Polymers 0.000 claims description 28
- 239000002184 metal Substances 0.000 claims description 26
- 229910052751 metal Inorganic materials 0.000 claims description 26
- 238000005979 thermal decomposition reaction Methods 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 22
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 20
- 229910052801 chlorine Inorganic materials 0.000 claims description 20
- 239000000460 chlorine Substances 0.000 claims description 20
- 150000002739 metals Chemical class 0.000 claims description 20
- 229910000831 Steel Inorganic materials 0.000 claims description 14
- 239000010959 steel Substances 0.000 claims description 14
- 229910052755 nonmetal Inorganic materials 0.000 claims description 13
- 238000011084 recovery Methods 0.000 claims description 12
- 150000002843 nonmetals Chemical class 0.000 claims description 11
- 238000010992 reflux Methods 0.000 claims description 7
- 239000003208 petroleum Substances 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 2
- 239000000696 magnetic material Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 abstract description 18
- 238000010438 heat treatment Methods 0.000 abstract description 17
- 238000000926 separation method Methods 0.000 abstract description 6
- 238000005304 joining Methods 0.000 abstract description 3
- 238000007885 magnetic separation Methods 0.000 abstract 1
- 239000003921 oil Substances 0.000 description 53
- 239000007789 gas Substances 0.000 description 22
- 238000002474 experimental method Methods 0.000 description 15
- 238000003860 storage Methods 0.000 description 11
- 238000010828 elution Methods 0.000 description 10
- 239000011521 glass Substances 0.000 description 8
- 239000004744 fabric Substances 0.000 description 7
- 239000003365 glass fiber Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 5
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 4
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 4
- 239000000920 calcium hydroxide Substances 0.000 description 4
- 239000006148 magnetic separator Substances 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 3
- 238000002309 gasification Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003480 eluent Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- -1 ferrous metals Chemical class 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 230000005389 magnetism Effects 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000002893 slag Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000295 fuel oil Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000007873 sieving Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
Landscapes
- Processing Of Solid Wastes (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、パーソナルコンピ
ュータ，ワークステーシヨン，ワードプロセッサなどに
使用される電子部品搭載プリント配線基板の廃品から有
価物を回収する資源回収方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resource recovery method for recovering valuables from scraps of printed wiring boards mounted with electronic components used in personal computers, workstations, word processors and the like.
【０００２】[0002]
【従来の技術】電子機器の普及に伴い、その廃品から有
価物を回収する資源回収方法が盛んに研究されている。
電子部品搭載プリント配線基板には、電子部品の他に、
配線材料やハンダ，樹脂，ガラス類等の有価物が含まれ
ているので、その効率的な資源回収方法を見出すべく多
くの方法が研究されている。2. Description of the Related Art With the spread of electronic devices, resource recovery methods for recovering valuable materials from their waste products have been actively researched.
In addition to electronic parts, printed wiring boards with electronic parts
Since valuable materials such as wiring materials, solders, resins, and glasses are contained, many methods have been studied to find an efficient resource recovery method.
【０００３】電子機器或いは電子部品搭載プリント配線
基板からの資源回収方法としては、例えば特開昭56−37
693 号公報に、プリント基板等のスクラップをハンダの
溶融温度以上に加熱して基板からハンダを剥離し、その
後、基板と有価金属とを分離処理する方法が記載されて
いる。特開昭56−3769号公報には、スクラップ化された
プリント基板を加熱された回転筒に落下させ、基板の衝
撃でハンダを分離することが記載されている。特開昭56
−115683号公報には、廃家電機器をライン上で連続的に
各構成部品に粗分解し、粗分解された各構成部品をグル
ープに分けて各グループに適した手段で回収することに
より、再利用可能な資源として回収することが記載され
ている。特開平6−226242 号公報には、廃家電品及びＯ
Ａ機器を処理する方法として、熱分解炉で廃棄物構成材
中の合成樹脂類を熱分解して溶融残渣と金属類との混合
物に分離し、その後乾留ガスを油化工程で処理し、他の
混合物を破砕工程，選別工程で処理して各種物質に分別
することが記載されている。A method for recovering resources from a printed wiring board on which electronic equipment or electronic parts are mounted is disclosed in, for example, Japanese Patent Laid-Open No. 56-37.
Japanese Patent No. 693 describes a method in which scrap of a printed circuit board or the like is heated above the melting temperature of the solder to remove the solder from the board, and then the board and the valuable metal are separated. Japanese Unexamined Patent Publication No. 56-3769 describes that a scrapped printed circuit board is dropped onto a heated rotary cylinder and the solder is separated by the impact of the circuit board. JP 56
In the −115683 publication, waste household electrical appliances are continuously roughly decomposed into respective components on the line, and the roughly decomposed components are divided into groups and recovered by means suitable for each group. It describes that it should be recovered as an available resource. Japanese Unexamined Patent Publication No. 6-226242 discloses waste electric appliances and O
As a method for treating the equipment A, the synthetic resins in the waste constituent materials are pyrolyzed in a pyrolysis furnace to separate them into a mixture of molten residues and metals, and then the carbonization gas is treated in an oiling process, and the like. It is described that the mixture of 1 is treated in a crushing step and a sorting step to be separated into various substances.
【０００４】[0004]
【発明が解決しようとする課題】電子部品搭載プリント
配線基板の廃品から資源を回収する方法においては、電
子部品と基板とを接合するハンダを分離，回収するのが
大変に難しい。ハンダには鉛が含まれているので、ハン
ダを分離しないと廃棄することもできない。In the method of recovering resources from the waste products of the electronic component mounted printed wiring board, it is very difficult to separate and recover the solder that joins the electronic component and the board. Since the solder contains lead, it cannot be discarded without separating the solder.
【０００５】電子部品搭載プリント配線基板をハンダの
溶融温度に加熱してハンダを溶融させて分離することは
非常に有効な方法ではあるが、ハンダの厚みが非常に薄
いので、簡単には溶融分離させることができない。Although it is a very effective method to melt the solder by separating it by heating the printed wiring board with electronic parts to the melting temperature of the solder, the thickness of the solder is very thin, so that the melt separation is easy. I can't let you do it.
【０００６】従って、本発明は、廃電子部品搭載プリン
ト配線基板からハンダを効率良く分離回収する方法を提
供することにある。Therefore, the present invention is to provide a method for efficiently separating and collecting solder from a printed wiring board on which waste electronic components are mounted.
【０００７】次に、本発明は、電子部品搭載プリント配
線基板の廃品から他の有価物を有効に回収する方法を提
供することにある。[0007] Another object of the present invention is to provide a method for effectively recovering other valuables from waste electronic printed circuit boards.
【０００８】[0008]
【課題を解決するための手段】本発明は、電子部品搭載
プリント配線基板の廃品から有価物を回収する資源回収
方法において、前記電子部品搭載プリント配線基板の破
砕物を鉄砂，鋼砂あるいは土砂からなるハンダ擦り媒体
と混合し、振動体あるいは回転体の中に入れて振動ある
いは回転を加えながら、電子部品とプリント配線基板と
を接合するハンダの溶融温度に加熱してハンダを溶融分
離し回収することを特徴とする廃電子部品搭載プリント
配線基板からの資源回収方法にある。SUMMARY OF THE INVENTION The present invention provides a resource recovery method for recovering valuables from scraps of electronic component mounted printed wiring boards, wherein the crushed material of the electronic component mounted printed wiring boards is iron sand, steel sand or earth and sand. It is mixed with a solder rubbing medium consisting of and is placed in a vibrating body or a rotating body to vibrate or rotate while it is heated to the melting temperature of the solder that joins the electronic component and the printed wiring board, and the solder is melted and separated and collected. According to another aspect of the present invention, there is provided a method of recovering resources from a printed wiring board on which waste electronic components are mounted.
【０００９】ハンダ擦り媒体として磁性材料を使用し、
ハンダとハンダ擦り媒体とを混合した状態で分離，回収
したのち磁気選別することにより、ハンダをハンダ擦り
媒体から分離することが容易になる。A magnetic material is used as a solder rubbing medium,
It is easy to separate the solder from the solder rubbing medium by separating and collecting the solder and the solder rubbing medium in a mixed state and then magnetically sorting.
【００１０】本発明はまた、電子部品搭載プリント配線
基板の破砕物からまずハンダを分離回収したならば、残
りを熱分解槽に入れてプリント配線基板を構成する樹脂
分を熱分解ガス化し、この熱分解残渣から金属類と非金
属類の分離，回収を行うことを特徴とする。Further, according to the present invention, if the solder is first separated and recovered from the crushed material of the printed wiring board on which the electronic parts are mounted, the rest is put in a thermal decomposition tank to thermally decompose and gasify the resin component constituting the printed wiring board. It is characterized by separating and recovering metals and non-metals from the pyrolysis residue.
【００１１】熱分解槽で樹脂分を熱分解ガス化する際
に、沸点が２８０℃を超える熱分解油或いは石油系油を
熱分解槽に供給し、熱分解油の存在下で樹脂分を熱分解
ガス化することが望ましい。When the resin component is pyrolyzed and gasified in the pyrolysis tank, pyrolysis oil or petroleum-based oil having a boiling point of more than 280 ° C. is supplied to the pyrolysis tank to heat the resin component in the presence of the pyrolysis oil. Decomposition gasification is desirable.
【００１２】また、熱分解槽で樹脂分をガス化したなら
ば、熱分解ガスを還流槽に入れて沸点が３００℃を超え
るガスを液化して熱分解槽に戻し、沸点が３００℃以下
のガスを加熱された濾過器に通して沸点２８０℃を超え
るガスを液化するとともに同伴する金属類を除去し、沸
点が２８０℃以下のガスを塩素固定化槽に入れて塩素を
除去したのち冷却して低沸点油として回収することが望
ましい。If the resin component is gasified in the pyrolysis tank, the pyrolysis gas is put in a reflux tank to liquefy the gas having a boiling point of more than 300 ° C. and returned to the pyrolysis tank. The gas is passed through a heated filter to liquefy the gas having a boiling point of more than 280 ° C and remove entrained metals, and the gas having a boiling point of 280 ° C or less is placed in a chlorine immobilization tank to remove chlorine and then cooled. It is desirable to recover it as a low boiling point oil.
【００１３】電子部品搭載プリント配線基板を破砕して
からハンダの溶融温度に加熱するため、ハンダを溶融さ
せやすい。また、振動体あるいは回転体の中に入れて加
熱撹拌する過程で鉄砂，鋼砂あるいは土砂などのハンダ
擦り媒体によってハンダがこすられるため破砕物から剥
離しやすくなる。これらの作用が組み合わされてハンダ
が容易に分離回収される。また、分離されたハンダの回
収率向上を図るために鉄砂，鋼砂などの磁性を有する擦
り媒体を用いれば、磁気選別によりハンダと擦り媒体の
分離が容易となり、ハンダの回収の向上が図れる。Since the printed wiring board on which the electronic parts are mounted is crushed and then heated to the melting temperature of the solder, the solder can be easily melted. Further, since the solder is rubbed by a solder rubbing medium such as iron sand, steel sand or earth and sand in the process of heating and stirring in a vibrating body or a rotating body, it is easy to separate from the crushed material. By combining these actions, the solder is easily separated and collected. Further, if a rubbing medium having magnetism such as iron sand and steel sand is used in order to improve the recovery rate of the separated solder, it becomes easy to separate the solder and the rubbing medium by magnetic sorting, and the recovery of the solder can be improved. .
【００１４】電子部品搭載プリント配線基板の廃品の中
に再利用可能な電子部品があったならば、電子部品搭載
プリント配線基板を破砕する前に予め分離することが望
ましい。再利用可能な電子部品を分離しやすくするため
に、電子部品搭載プリント配線基板をハンダの溶融温度
に加熱しておくこともよい。If there is a reusable electronic component among the scraps of the electronic component-mounted printed wiring board, it is desirable to separate it in advance before crushing the electronic component-mounted printed wiring board. In order to facilitate the separation of reusable electronic components, the electronic component-mounted printed wiring board may be heated to the melting temperature of the solder.
【００１５】電子部品搭載プリント配線基板の廃品の破
砕処理は、大まかに破砕する程度でよく、１０mmないし
２０mm角に粗破砕すれば十分である。The crushing process of the scraps of the printed wiring board on which the electronic parts are mounted may be roughly crushing, and it is sufficient to roughly crush into 10 mm to 20 mm square.
【００１６】プリント配線基板を構成する樹脂を熱分解
した残渣を金属類と非金属類とに分離する方法として
は、非金属類は主にガラスクロス，ガラス繊維などであ
ることから、水の流れを利用して比重の軽い非金属類を
浮上させて分離するのが有効である。As a method for separating the residue, which is obtained by thermally decomposing the resin constituting the printed wiring board, into metal and nonmetal, since nonmetal is mainly glass cloth, glass fiber, etc. It is effective to levitate and separate non-metallics having a low specific gravity by using.
【００１７】樹脂分の熱分解処理において、電子部品搭
載プリント配線基板の破砕物のみを単独で加熱し樹脂を
熱分解すると、プリント配線基板に使用されている樹脂
は熱硬化性樹脂であるため、ワックス状の油が生成さ
れ、管閉塞の原因となる。本発明は、熱分解手段からの
分解ガスを冷却し高沸点成分を凝縮し液化油としてガス
状低沸点成分と分離したのち、高沸点液化油を熱分解手
段に還流し、この還流高沸点液化油、あるいは他の石油
系油を用いて粗破砕部品搭載基板に投入・混合して一緒
に熱分解するため、管閉塞の原因となるワックス状油の
生成が防止できる。さらに、熱分解時に蒸発する含有金
属類は高沸点液化油に凝縮し易くなり、高沸点液化油か
ら分離回収されるため、有害金属類の系外への排出も防
止できる。さらに、残渣から分離回収した非金属類を高
温で溶融スラグ化することにより、減容化，無害化が図
れる。In the thermal decomposition treatment of the resin component, when only the crushed material of the printed wiring board with electronic components is heated alone to thermally decompose the resin, the resin used for the printed wiring board is a thermosetting resin, A waxy oil is produced which causes tube obstruction. The present invention cools the cracked gas from the thermal decomposition means, condenses the high boiling point component and separates it as a liquefied oil from the gaseous low boiling point component. Since oil or other petroleum-based oil is put into and mixed with the substrate for coarsely crushed parts and pyrolyzed together, it is possible to prevent the formation of wax-like oil that causes blockage of the pipe. Furthermore, the contained metals that evaporate during thermal decomposition are likely to condense into the high-boiling liquefied oil and are separated and recovered from the high-boiling liquefied oil, so that it is possible to prevent the harmful metals from being discharged out of the system. Furthermore, by converting the non-metals separated and recovered from the residue into molten slag at a high temperature, the volume can be reduced and harmless.
【００１８】[0018]
【発明の実施の形態】以下、本発明の実施例を図面を用
いて説明する。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.
【００１９】図１には、本発明の実施例による資源回収
処理プロセスを示す。FIG. 1 shows a resource recovery processing process according to an embodiment of the present invention.
【００２０】図１に示した処理プロセスの構成は、電子
部品搭載基板１，加熱溶融分離機２，電子部品要否判定
機４，粗破砕機８，ハンダ溶離機９，ハンダ分離機１
０，熱分解槽１２，残渣破砕機１４，分別機１５，磁選
機１７，加熱溶融槽２０，高温溶融槽２４，還流槽２
６，濾過器２７，塩素固定化槽２８，冷却器２９，低沸
点油貯留槽３０，送油ポンプ３１，バルブ３２，３４，
３５，３６，３７，高沸点油貯留槽３３などからなる。The structure of the treatment process shown in FIG. 1 is as follows: electronic component mounting substrate 1, heating and melting separator 2, electronic component necessity judgment device 4, coarse crusher 8, solder eluator 9, solder separator 1.
0, thermal decomposition tank 12, residue crusher 14, sorter 15, magnetic separator 17, heating and melting tank 20, high temperature melting tank 24, reflux tank 2
6, filter 27, chlorine fixation tank 28, cooler 29, low boiling point oil storage tank 30, oil feed pump 31, valves 32, 34,
35, 36, 37, a high boiling point oil storage tank 33 and the like.
【００２１】次に、動作について説明する。図１におい
て、電子部品搭載基板１はまず加熱溶融分離機２に入れ
られる。加熱溶融分離機２は、電子部品搭載基板に使用
されているハンダが溶融する温度に加熱されている。こ
こで、分離可能な電子部品をプリント基板から剥離して
分離する。このときハンダは剥離された電子部品或いは
基板に付着したままで残る。分離された電子部品３は電
子部品要否判定機４にて再利用の要否が判定され、再利
用可能な電子部品５は回収されて再使用される。再利用
不可能な電子部品６は、加熱溶融分離機２から送られて
きたプリント基板７とともに粗破砕機８にて１０mmない
し２０mm角程度に破砕される。次いで、破砕物は鉄砂あ
るいは鋼砂などのハンダ擦り媒体が充填され、かつ、温
度３２０℃程度に加熱された振動体あるいは回転体から
なるハンダ溶離機９に投入され、加熱撹拌される。これ
により電子部品とプリント基板とを接合するハンダが鉄
砂あるいは鋼砂により擦られハンダの殆どが溶融分離さ
れる。溶融分離されたハンダはハンダ分離機１０に入れ
られ、磁気選別により鉄砂あるいは鋼砂とハンダとを分
離し、ハンダ１１を回収する。擦り媒体である鉄砂ある
いは鋼砂は、ハンダとの分離後、ライン５１を経てハン
ダ溶離機９に返送される。Next, the operation will be described. In FIG. 1, the electronic component mounting substrate 1 is first put in the heating and melting separator 2. The heating / melting separator 2 is heated to a temperature at which the solder used in the electronic component mounting board melts. Here, the separable electronic component is separated from the printed circuit board by separation. At this time, the solder remains attached to the peeled electronic component or substrate. The separated electronic component 3 is determined by the electronic component necessity determination device 4 to be reused, and the reusable electronic component 5 is collected and reused. The non-reusable electronic component 6 is crushed into about 10 mm to 20 mm square by the coarse crusher 8 together with the printed circuit board 7 sent from the heating and melting separator 2. Next, the crushed material is charged with a solder rubbing medium such as iron sand or steel sand, and is charged into a solder eluator 9 including a vibrating body or a rotating body heated to a temperature of about 320 ° C. and heated and stirred. As a result, the solder that joins the electronic component and the printed circuit board is rubbed with iron sand or steel sand, and most of the solder is melted and separated. The melted and separated solder is put into a solder separator 10, and magnetic sand is used to separate iron sand or steel sand from the solder, and the solder 11 is recovered. The iron sand or steel sand as the rubbing medium is returned to the solder elution machine 9 through the line 51 after being separated from the solder.
【００２２】ハンダを分離した破砕物は、温度５００℃
に加熱された熱分解槽１２に投入される。ここには、予
め廃プラスチック，プリント基板などから熱分解により
生成した沸点２８０℃を超える熱分解油が高沸点油貯留
槽３３から送油ポンプ３１によりバルブ３２を介して供
給される。これにより破砕物は熱分解油と一緒に熱分解
ガス化されることになり、破砕物のみの単独熱分解では
ワックス状の熱分解油が生成され、管閉塞の原因となる
フェノール樹脂やエポキシ樹脂などの熱硬化性樹脂は容
易にガス化されると共に高沸点油により希釈されてワッ
クス状の熱分解油の生成が抑制される。The crushed material from which the solder has been separated has a temperature of 500.degree.
It is put into the thermal decomposition tank 12 which is heated to. Pyrolysis oil having a boiling point of more than 280 ° C., which is previously generated by thermal decomposition from waste plastic, a printed circuit board, or the like, is supplied from the high boiling point oil storage tank 33 by the oil feed pump 31 via the valve 32. As a result, the crushed material is pyrolyzed and gasified together with the pyrolyzed oil, and the wax-like pyrolyzed oil is generated by the independent pyrolysis of only the crushed material, and the phenol resin or epoxy resin that causes pipe blockage. The thermosetting resin such as is easily gasified and diluted with the high boiling point oil to suppress the production of waxy pyrolyzed oil.
【００２３】熱分解ガスは３００℃に加熱された還流槽
２６に供給され、沸点が３００℃を超えるガスは液化さ
れて熱分解槽１２に還流される。この操作を繰り返して
沸点が３００℃を超えるガスは熱分解が促進されて軽質
化される。沸点が３００℃以下のガスは還流槽２６から
２８０℃に加熱された濾過器２７に供給され、沸点が２
８０℃を超えるガスは液化されて高沸点油貯留槽３３に
貯留される。沸点が２８０℃以下のガスは粒状の水酸化
カルシウムが充填され、かつ、２８０℃に加熱された塩
素固定化槽２８に供給され、熱分解ガス中の塩素が除去
される。塩素が除去された熱分解ガスは冷却器２９によ
り水冷凝縮され、液化されて低沸点油貯留槽３０に貯留
される。この低沸点油はバルブ３４を介して熱分解槽１
２，還流槽２６，濾過器２７及び塩素固定化槽２８など
の系内要素機器の加熱源に利用される。The pyrolysis gas is supplied to the reflux tank 26 heated to 300 ° C., and the gas whose boiling point exceeds 300 ° C. is liquefied and refluxed to the pyrolysis tank 12. By repeating this operation, the gas having a boiling point of higher than 300 ° C. is promoted in the thermal decomposition to be lightened. The gas having a boiling point of 300 ° C. or lower is supplied from the reflux tank 26 to the filter 27 heated to 280 ° C.
Gases exceeding 80 ° C. are liquefied and stored in the high boiling point oil storage tank 33. The gas having a boiling point of 280 ° C. or less is filled with granular calcium hydroxide and is supplied to the chlorine immobilization tank 28 heated to 280 ° C. to remove chlorine in the pyrolysis gas. The pyrolysis gas from which chlorine has been removed is water-cooled and condensed by the cooler 29, liquefied and stored in the low boiling point oil storage tank 30. This low boiling point oil is passed through the valve 34 to the thermal decomposition tank 1
2, it is used as a heating source for in-system element devices such as the reflux tank 26, the filter 27 and the chlorine fixing tank 28.
【００２４】一方、熱分解槽１２で熱分解されなかった
残渣（未分解物）１３は熱分解槽１２から排出されたの
ち、残渣破砕機１４により破砕され、樹脂炭化物，ガラ
スクロス，ガラス繊維などの非金属類と金属類とに剥離
される。これらの粗破砕残渣物は分別機１５において、
非金属類と金属類とに分別される。分別機１５は、たと
えば容器内に水を落下供給し、水の対流を利用してガラ
スクロス，ガラス繊維，樹脂炭化物などの非金属類を浮
上させ、金属類を沈降させて分別する型式のものであ
る。分別された金属類１６は磁選機１７により鉄等の磁
性を有する金属類１８とその他の非磁性金属類１９とに
分別される。非磁性金属類１９は３５０℃に加熱された
加熱溶融槽２０に投入され、ハンダ溶離機９で回収仕切
れなかった残りのハンダ２１を溶融し、ハンダ以外の非
磁性金属類２２と分離する。分別機１５で分離されたガ
ラスクロス，ガラス繊維，樹脂炭化物などの非金属類２
３は乾燥されたのち、高温溶融槽２４により温度１５０
０℃程度に加熱され溶融して溶融スラグ２５となり、減
容化，無害化される。On the other hand, the residue (undecomposed material) 13 that has not been thermally decomposed in the thermal decomposition tank 12 is discharged from the thermal decomposition tank 12 and then crushed by the residue crusher 14 to obtain resin carbide, glass cloth, glass fiber, etc. Are separated into non-metals and metals. These coarsely crushed residues are separated by the separator 15
It is separated into non-metals and metals. The sorter 15 is of a type in which, for example, water is dropped and supplied into a container, non-metals such as glass cloth, glass fibers, and resin carbide are floated by utilizing convection of water, and metals are allowed to settle and sorted. Is. The separated metals 16 are separated by a magnetic separator 17 into metals 18 having magnetism such as iron and other non-magnetic metals 19. The non-magnetic metal 19 is put into a heating and melting tank 20 heated to 350 ° C., and the remaining solder 21 which is not recovered by the solder eluator 9 is melted and separated from the non-magnetic metal 22 other than the solder. Non-metals such as glass cloth, glass fiber, resin carbide, etc. separated by the sorter 15
3 was dried and then heated to a temperature of 150 by the high temperature melting tank 24.
It is heated to about 0 ° C. and melted to become molten slag 25, which is reduced in volume and harmless.
【００２５】実験１：本発明による効果を確認するため
に、電子部品搭載基板の接合ハンダの溶離率を求める実
験を行った。実験は、ハンダが接合されていない電子部
品と大きさが３００mm角程度のプリント基板とを用い、
まず重量を測定したのち、ハンダゴテを用いて電子部品
とプリント基板とを接合した。接合ハンダの重量はハン
ダ接合後の電子部品とプリント基板の重量からハンダ接
合前に測定した電子部品とプリント基板の重量を差し引
いて求めた。ハンダの接合量は１０.５ｇ である。Experiment 1: In order to confirm the effect of the present invention, an experiment for obtaining the elution rate of the bonding solder of the electronic component mounting board was conducted. The experiment uses an electronic component with no solder bonded and a printed circuit board with a size of about 300 mm square,
First, after measuring the weight, the electronic component and the printed circuit board were joined using a soldering iron. The weight of the solder joint was determined by subtracting the weights of the electronic component and the printed circuit board measured before the solder joint from the weights of the electronic component and the printed circuit board after the solder joint. The amount of solder bonded is 10.5 g.
【００２６】ハンダ接合後の電子部品搭載基板を粗破砕
機により３０mm角程度の大きさに破砕した。そしてハン
ダ擦り媒体として粒度１mm前後の鋼砂が充填され、温度
320℃程度に加熱されたハンダ溶離機９に破砕物を投入
して、ハンダ溶離機９を５分間振動して接合ハンダを溶
離した。溶離したハンダには鋼砂が混ざるが、篩い分け
により電子部品搭載基板と鋼砂とを分離したのち、溶離
ハンダと鋼砂とをハンダ分離機１０により磁気選別し
た。これにより、溶離ハンダと鋼砂との分離率は１００
％であった。分離回収したハンダの重量を測定したとこ
ろ接合ハンダの溶離率は初期接合ハンダの重量比で７２
重量％(７.５６ｇ）であった。The electronic component mounting substrate after soldering was crushed into a size of about 30 mm square by a coarse crusher. Then, steel sand with a grain size of about 1 mm is filled as a solder rubbing medium, and the temperature is
The crushed material was put into the solder eluent 9 heated to about 320 ° C., and the solder eluent 9 was vibrated for 5 minutes to elute the bonded solder. Although steel sand is mixed in the eluted solder, the electronic component mounting substrate and the steel sand were separated by sieving, and then the eluted solder and the steel sand were magnetically separated by the solder separator 10. As a result, the separation ratio between the eluting solder and the steel sand is 100.
%Met. When the weight of the separated and recovered solder was measured, the elution rate of the joining solder was 72 in terms of the weight ratio of the initial joining solder.
It was weight% (7.56 g).
【００２７】実験２：次に、接合ハンダの擦り媒体して
粒度１mm以下の鉄砂を用いて、前述と同様の方法で接合
ハンダの溶離率を測定した。ハンダの接合量は１１.４
ｇ である。Experiment 2: Next, the elution rate of the bonding solder was measured by the same method as described above, using iron sand having a grain size of 1 mm or less as a rubbing medium for the bonding solder. Solder amount is 11.4
g.
【００２８】溶離ハンダと鉄砂との分離率は１００％で
あった。接合ハンダの溶離率は電子部品とプリント基板
の初期接合ハンダ重量比で７５重量％(８.５５ｇ）であ
った。The separation rate of the eluting solder and iron sand was 100%. The elution rate of the bonding solder was 75% by weight (8.55 g) based on the weight ratio of the initial bonding solder between the electronic component and the printed circuit board.
【００２９】比較実験１：比較例として、電子部品搭載
基板を破砕せずに、そのまま温度３２０℃に加熱された
加熱溶融分離機２に入れて電子部品とプリント基板を分
離した時に除去される接合ハンダの溶離率を調べた。用
いた電子部品とプリント基板の条件例えば大きさ，重量
等は本発明の実施例のときと同じである。接合ハンダの
重量は１０.１ｇ である。電子部品とプリント基板とを
分離したのち、分離した電子部品とプリント基板との重
量を測定した。この結果は、ハンダ接合後の電子部品搭
載基板の初期重量と同程度であり、接合ハンダの溶離率
は極めて低かった。COMPARATIVE EXPERIMENT 1: As a comparative example, the electronic component mounting substrate is not crushed, but is put into the heating and melting separator 2 heated to 320 ° C. as it is, and is removed when the electronic component and the printed circuit board are separated. The elution rate of the solder was examined. The conditions of the electronic components and the printed circuit board used, such as size and weight, are the same as in the embodiment of the present invention. The weight of the solder joint is 10.1 g. After separating the electronic component and the printed circuit board, the weight of the separated electronic component and the printed circuit board was measured. The result was about the same as the initial weight of the electronic component mounting board after soldering, and the elution rate of the solder was extremely low.
【００３０】比較実験２：次の比較実験では、電子部品
とプリント基板の接合ハンダを熱分解時に加熱溶離する
方法を実施した。接合ハンダの重量は１２.８ｇ であ
る。粗破砕機８により予め３０mm角程度の大きさに破砕
した電子部品搭載基板を、直接５００℃に加熱した熱分
解槽１２に投入し１時間加熱し樹脂を熱分解ガス化し
た。熱分解終了後、常温まで冷却したのち残渣（未分解
物）を取り出し、残渣破砕機１４により粗破砕した。次
いで、この粗破砕物を分別機１５により金属類１６と非
金属類２３とに分離分別した。回収した金属類中のハン
ダ（鉛，錫成分）含有量を蛍光Ｘ線分析装置により求め
た。Comparative Experiment 2: In the next comparative experiment, a method of heating and eluting the joint solder between the electronic component and the printed circuit board during thermal decomposition was carried out. The weight of the solder joint is 12.8 g. The electronic component mounting substrate, which had been crushed in advance to a size of about 30 mm square by the coarse crusher 8, was directly put into the thermal decomposition tank 12 heated to 500 ° C. and heated for 1 hour to thermally decompose the resin into gas. After completion of the thermal decomposition, the residue (undecomposed material) was taken out after cooling to room temperature and roughly crushed by a residue crusher 14. Then, the coarsely crushed material was separated and separated into the metals 16 and the non-metals 23 by the separator 15. The content of solder (lead and tin components) in the recovered metals was determined by a fluorescent X-ray analyzer.
【００３１】この結果、接合ハンダの初期重量の８５％
(１０.８８ｇ）が、回収された金属類中に含まれてい
た。このことは、１５重量％(１.９２ｇ）のハンダが熱
分解時の加熱により溶離されたことを示す。なお、ここ
では、初期ハンダに含有されている接合剤などの熱分解
によるガス化分重量を無視した。As a result, 85% of the initial weight of the solder joint is obtained.
(10.88 g) was contained in the recovered metals. This indicates that 15% by weight (1.92 g) of the solder was eluted by the heating during the thermal decomposition. Here, the weight of the gasification component due to the thermal decomposition of the bonding agent or the like contained in the initial solder was ignored.
【００３２】以上の実験結果から、本発明の方法により
接合ハンダの溶離率の向上が図れることがわかった。From the above experimental results, it was found that the method of the present invention can improve the elution rate of the bonding solder.
【００３３】実験３：ここでは、実験１及び２でハンダ
を溶離した残りの破砕物を熱分解槽１２に入れて熱分解
した場合について述べる。ハンダ溶離機９で処理した電
子部品搭載基板の破砕物５００ｇを温度５００℃に加熱
した熱分解槽１２に投入した。次いで、熱分解槽に予め
廃プラスチック，プリント基板などの高分子化合物を熱
分解して生成した沸点２８０℃を超える熱分解油を高沸
点油貯留槽３３から送油ポンプ３１により熱分解槽１２
に１リットル供給し、熱分解油の存在下でプリント基板
を構成する樹脂分の熱分解ガス化を実施した。これによ
り、温度が低い冷却器２９において凝縮液化しても管閉
塞は見られず、電子部品搭載基板の樹脂分から油を回収
できた。回収油は投入した電子部品搭載基板の重量５０
０ｇ当り１４.５重量％，残渣(未分解物）が７１.４重
量％，未凝縮ガスが１４.１重量％であった。未凝縮ガ
スの重量は初期投入重量５００ｇから生成油，残渣の重
量を差し引いて求めた。さらに、これらの値は、高沸点
油単独で熱分解した時に生成された油，残渣の重量を求
めておき、それぞれの重量を差し引いて求めた。Experiment 3: Here, a case will be described in which the remaining crushed material from which the solder was eluted in Experiments 1 and 2 was placed in the thermal decomposition tank 12 and thermally decomposed. 500 g of the crushed material of the electronic component mounting substrate processed by the solder eluator 9 was put into the thermal decomposition tank 12 heated to a temperature of 500 ° C. Then, the thermal decomposition oil having a boiling point of 280 ° C. or higher generated by previously thermally decomposing a polymer compound such as waste plastic or a printed circuit board in the thermal decomposition tank from the high boiling point oil storage tank 33 by the oil feed pump 31
1 liter was supplied to the resin, and the pyrolysis gasification of the resin component constituting the printed circuit board was carried out in the presence of pyrolysis oil. As a result, even if the condenser 29 was condensed and liquefied in the cooler 29 having a low temperature, the pipe was not blocked, and the oil could be recovered from the resin component of the electronic component mounting substrate. The recovered oil weighs 50 weight of the electronic component mounting board.
The content (04.5 g) was 14.5% by weight, the residue (undecomposed product) was 71.4% by weight, and the uncondensed gas was 14.1% by weight. The weight of the uncondensed gas was determined by subtracting the weight of the produced oil and the residue from the initial input weight of 500 g. Further, these values were obtained by obtaining the weights of the oil and the residue produced when pyrolyzing the high boiling point oil alone, and subtracting the respective weights.
【００３４】実験４：ここでは、実験３で用いた高沸点
油の替わりに石油系油として重油を用いて電子部品搭載
基板の樹脂を熱分解した場合について述べる。実験の条
件は実験３のときと同じである。管閉塞は見られなかっ
た。回収油は、投入した電子部品搭載基板の重量５００
ｇ当り１４.１重量％，残渣（未分解物）が７０.６重量
％，未凝縮ガスが１５.３ 重量％であった。Experiment 4: Here, a case will be described in which the resin of the electronic component mounting substrate is thermally decomposed using heavy oil as petroleum oil instead of the high boiling point oil used in Experiment 3. The conditions of the experiment are the same as in the experiment 3. No tube obstruction was seen. The recovered oil is the weight of the electronic component mounting board that is input is 500.
The amount was 14.1% by weight, the residue (undecomposed matter) was 70.6% by weight, and the uncondensed gas was 15.3% by weight.
【００３５】比較実験３：ここでは、熱分解槽に熱分解
油を入れないで電子部品の破砕物のみを単独で熱分解し
た。この結果、低沸点油貯留槽３３に回収できた油は電
子部品搭載基板の重量５００ｇ当り６.２ 重量％で、残
りはワックス状の熱分解油で管内に凝縮固化してしまっ
た。Comparative Experiment 3: Here, only pyrolyzed products of electronic parts were pyrolyzed alone without putting pyrolysis oil in the pyrolysis tank. As a result, the amount of oil recovered in the low boiling point oil storage tank 33 was 6.2% by weight per 500 g of the electronic component mounting substrate, and the rest was wax-like pyrolyzed oil which was condensed and solidified in the pipe.
【００３６】これより、高沸点油及び石油系油の存在下
で熱分解することにより、管閉塞の原因となるフェノー
ル樹脂やエポキシ樹脂などの熱硬化性樹脂を容易にガス
化できる共にワックス状の熱分解油の生成を抑制できる
ことがわかった。As a result, thermosetting resins such as phenol resin and epoxy resin, which cause tube clogging, can be easily gasified by thermal decomposition in the presence of high boiling point oil and petroleum-based oil, and also wax-like It was found that the generation of pyrolysis oil can be suppressed.
【００３７】実験５：ここでは、電子部品搭載基板の廃
品から有価物を回収する一連の処理を行った場合につい
て述べる。ここでも、電子部品とプリント基板の接合ハ
ンダの溶離率を把握するため、ハンダが接合されていな
い電子部品と大きさが３００mm角程度のプリント基板を
用い、重量を測定したのち、ハンダゴテを用いて電子部
品とプリント基板とを接合した。接合ハンダの重量はハ
ンダ接合後の電子部品とプリント基板の重量からハンダ
接合前に測定した電子部品とプリント基板の重量を差し
引いて求めた。接合ハンダの重量は１１.６ｇ である。Experiment 5: Here, a case will be described in which a series of processes for recovering a valuable material from a waste product of an electronic component mounting substrate is performed. Again, in order to grasp the elution rate of the solder joint of the electronic component and the printed circuit board, the electronic component with no solder and the printed circuit board of about 300 mm square are used, the weight is measured, and then the soldering iron is used. The electronic component and the printed circuit board were joined. The weight of the solder joint was determined by subtracting the weights of the electronic component and the printed circuit board measured before the solder joint from the weights of the electronic component and the printed circuit board after the solder joint. The weight of the solder joint is 11.6 g.
【００３８】この電子部品搭載基板を５００ｇ粗破砕機
８により３０mm角程度に破砕し、破砕物を温度３２０℃
程度に加熱維持したハンダ溶離機９に投入した。擦り媒
体として鋼砂を用いた結果、接合ハンダはハンダ分離機
１０において電子部品搭載基板の接合ハンダ重量当り７
２.５ 重量％回収できた。ハンダを分離した残りの破砕
物機を熱分解槽１２に入れ、沸点が２８０℃を超える熱
分解油の存在下で樹脂を熱分解した。回収油は投入した
電子部品搭載基板の重量５００ｇ当り１４.５重量％，
残渣（未分解物）が７１.４重量％，未凝縮ガスが１４.
１重量％であった。沸点２８０℃を超える熱分解油は高
沸点油貯留槽３３にて電子部品搭載基板の重量当り６.
１ 重量％，沸点２８０℃以下の熱分解油は高沸点油貯
留槽３３にて電子部品搭載基板の重量当り８.４ 重量％
回収できた。塩素固定化槽２８には水酸化カルシウム２
００ｇを充填し、熱分解ガス中の塩素を除去した。この
場合、電子部品搭載基板の重量５００ｇ中には５０ｇの
塩化ビニールを混合した。用いた塩化ビニール中の塩素
含有率は４８重量％であり、塩化ビニール中の塩素含有
率は２５ｇとなる。塩素固定化槽２８出口の塩素濃度を
イオンクロマト分析計で測定した結果、ガス中の塩素濃
度は３０ppm であった。また、水酸化カルシウム中の塩
素含有率をイオンクロマト分析計で調べた結果、塩素の
合計量２５ｇ中の８３重量％の塩素が水酸化カルシウム
で固定化できた。This electronic component mounting substrate was crushed into pieces of about 30 mm square by a 500 g coarse crusher 8 and the crushed material was heated to 320 ° C.
It was put into the solder eluator 9 which was heated and maintained to a certain degree. As a result of using steel sand as the rubbing medium, the joint solder is 7 in weight per joint solder weight of the electronic component mounting board in the solder separator 10.
It was possible to recover 2.5% by weight. The remaining crusher from which the solder was separated was placed in the pyrolysis tank 12, and the resin was pyrolyzed in the presence of pyrolysis oil having a boiling point of higher than 280 ° C. The collected oil is 14.5% by weight for every 500 g of the electronic component mounting board weighed in,
Residue (undecomposed) 71.4% by weight, uncondensed gas 14.
It was 1% by weight. Pyrolysis oil having a boiling point of 280 ° C or higher is stored in the high boiling point oil storage tank 33 per weight of the electronic component mounting board.
1% by weight, pyrolysis oil with a boiling point of 280 ° C or less is 8.4% by weight in the high boiling point oil storage tank 33, based on the weight of the electronic component mounting board.
Collected. Calcium hydroxide 2 in the chlorine fixing tank 28
00g was filled and chlorine in the pyrolysis gas was removed. In this case, 50 g of vinyl chloride was mixed with 500 g of the electronic component mounting substrate. The chlorine content in the vinyl chloride used was 48% by weight, and the chlorine content in the vinyl chloride was 25 g. As a result of measuring the chlorine concentration at the outlet of the chlorine fixing tank 28 with an ion chromatograph, the chlorine concentration in the gas was 30 ppm. In addition, as a result of examining the chlorine content in calcium hydroxide with an ion chromatograph, 83% by weight of chlorine in the total amount of chlorine of 25 g could be immobilized by calcium hydroxide.
【００３９】一方、熱分解残渣（未分解物）１３を熱分
解槽１２から排出し残渣破砕機１４により樹脂炭化物，
ガラスクロス，ガラス繊維などの非金属類と金属類に剥
離分離した。これにより、熱分解残渣（未分解物）１３
(回収率７１.４重量％）のうち、金属類１６が２３.５
重量％，樹脂炭化物，ガラスクロス，ガラス繊維などの
非金属類２３が４５.５重量％回収できた。残り２.４重
量％は回収できなかった。金属類１６から磁選機１７に
より鉄分を２３.５ 重量％回収でき、金属類１６のうち
の１０.５ 重量％回収できた。残りは非鉄金属類であ
り、この中からハンダ溶離機９及びハンダ分離機１０で
回収できなかった残りのハンダ２１（１００−７２.５
＝２７.５重量％）を４５０℃に加熱した加熱溶融槽２
０にて回収した。非鉄金属類中に含有するハンダは電子
部品搭載基板の初期重量当り２７.５重量％(３.１９
ｇ）である。ハンダ２１の回収量は１.２ｇで電子部品
搭載基板の初期重量当り１０.３ 重量％であった。これ
より、接合ハンダの回収量は電子部品搭載基板の初期重
量当り８２.８ 重量％となり、本発明によれば接合ハン
ダの回収が向上できることがわかった。On the other hand, the pyrolysis residue (undecomposed matter) 13 is discharged from the pyrolysis tank 12 and a residue crusher 14 is used to remove resin carbide,
Separated and separated into non-metals such as glass cloth and glass fiber and metals. As a result, the thermal decomposition residue (undecomposed) 13
Of the (recovery rate: 71.4% by weight), the metals 16 are 23.5%
By weight, 45.5% by weight of non-metals 23 such as resin carbide, glass cloth and glass fiber could be recovered. The remaining 2.4% by weight could not be recovered. 23.5% by weight of iron was recovered from the metals 16 by the magnetic separator 17, and 10.5% by weight of the metals 16 could be recovered. The rest is non-ferrous metals, and the remaining solder 21 (100-72.5) that could not be recovered by the solder eluator 9 and the solder separator 10 from this.
= 27.5% by weight) heated to 450 ° C
It was collected at 0. Solder contained in non-ferrous metals is 27.5% by weight (3.19%) based on the initial weight of the electronic component mounting board.
g). The recovered amount of the solder 21 was 1.2 g, which was 10.3% by weight based on the initial weight of the electronic component mounting board. From this, it was found that the recovery amount of the bonding solder was 82.8% by weight based on the initial weight of the electronic component mounting board, and the recovery of the bonding solder could be improved according to the present invention.
【００４０】また、分別機１５で分離した非金属類２３
を高温溶融槽２４において１５００℃で処理した結果、
樹脂炭化物，ガラスクロス，ガラス繊維等をスラグ化で
き、減容化，無害化できることがわかった。The non-metals 23 separated by the sorter 15
Was treated at 1500 ° C. in the high temperature melting tank 24,
It was found that resin carbide, glass cloth, glass fiber, etc. can be slagged, and volume can be reduced and harmless.
【００４１】[0041]
【発明の効果】本発明によれば、電子部品搭載プリント
配線基板の廃品から効率良くハンダを分離回収すること
ができる。According to the present invention, it is possible to efficiently separate and collect solder from a waste product of a printed wiring board on which an electronic component is mounted.
【００４２】また、本発明の他の方法によれば、プリン
ト配線基板を構成する熱硬化性樹脂を熱分解ガス化する
際に、管閉塞の原因となるワックス状油の生成を防止で
き、かつ生成油の回収率の向上を図ることができる。Further, according to another method of the present invention, when the thermosetting resin constituting the printed wiring board is pyrolyzed and gasified, it is possible to prevent the formation of wax-like oil which causes the blockage of the pipe, and The recovery rate of produced oil can be improved.
【図１】本発明の一実施例を示す廃電子部品搭載プリン
ト配線基板から有価物を回収する処理プロセスのフロー
図。FIG. 1 is a flow chart of a processing process for recovering valuables from a printed wiring board on which waste electronic components are mounted according to an embodiment of the present invention.
１…電子部品搭載基板、２…加熱溶融分離機、４…電子
部品要否判定機、８…粗破砕機、９…ハンダ溶離機、１
０…ハンダ分離機、１２…熱分解槽、１４…残渣破砕
機、１５…分別機、１７…磁選機、２０…加熱溶融槽、
２４…高温溶融槽、２６…還流槽、２７…濾過器、２８
…塩素固定化槽、２９…冷却器、３０…低沸点油貯留
槽、３１…送油ポンプ、３２，３４，３５，３６，３７
…バルブ、３３…高沸点油貯留槽。DESCRIPTION OF SYMBOLS 1 ... Electronic component mounting substrate, 2 ... Heating / melting separator, 4 ... Electronic component necessity determination machine, 8 ... Coarse crusher, 9 ... Solder elution machine, 1
0 ... Solder separator, 12 ... Pyrolysis tank, 14 ... Residual crusher, 15 ... Separator, 17 ... Magnetic separator, 20 ... Heating / melting tank,
24 ... High temperature melting tank, 26 ... Reflux tank, 27 ... Filter, 28
... chlorine fixing tank, 29 ... cooler, 30 ... low boiling point oil storage tank, 31 ... oil pump, 32, 34, 35, 36, 37
… Valve, 33… High boiling point oil storage tank.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 山下 寿生 茨城県日立市大みか町七丁目１番１号 株 式会社日立製作所日立研究所内 (72)発明者 小豆畑 茂 茨城県日立市大みか町七丁目１番１号 株 式会社日立製作所日立研究所内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hisao Yamashita 7-1, 1-1 Omika-cho, Hitachi-shi, Ibaraki Hitachi Ltd. Hitachi Research Laboratory (72) Inventor Shigeru Shodohata 7-chome, Omika-cho, Hitachi, Ibaraki No. 1 Hitachi Ltd. Hitachi Research Laboratory
Claims (5)
有価物を回収する資源回収方法において、前記電子部品
搭載プリント配線基板の破砕物を鉄砂，鋼砂あるいは土
砂からなるハンダ擦り媒体と混合し、振動体あるいは回
転体の中に入れて振動あるいは回転を加えながら、電子
部品とプリント配線基板とを接合材するハンダの溶融温
度に加熱してハンダを溶融分離し回収することを特徴と
する廃電子部品搭載プリント配線基板からの資源回収方
法。1. A resource recovery method for recovering valuables from scraps of printed wiring boards with electronic components, wherein crushed materials of the printed wiring boards with electronic components are mixed with a solder rubbing medium composed of iron sand, steel sand or earth and sand. A waste characterized by being placed in a vibrating body or a rotating body and being vibrated or rotated while being heated to the melting temperature of the solder that joins the electronic component and the printed wiring board to melt and separate the solder A method for recovering resources from printed wiring boards with electronic components.
して磁性を有する材料を使用し、ハンダとハンダ擦り媒
体とを混合した状態で回収したのち磁気選別によりハン
ダを分離することを特徴とする廃電子部品搭載プリント
配線基板からの資源回収方法。2. The waste according to claim 1, wherein a magnetic material is used as the solder rubbing medium, the solder and the solder rubbing medium are collected in a mixed state, and then the solder is separated by magnetic sorting. A method for recovering resources from printed wiring boards with electronic components.
載プリント配線基板の破砕物からハンダを分離回収した
残りを熱分解槽に入れてプリント配線基板を構成する樹
脂分を熱分解ガス化し、この熱分解残渣から金属類と非
金属類の分離，回収を行うことを特徴とする廃電子部品
搭載プリント配線基板からの資源回収方法。3. The resin component constituting the printed wiring board according to claim 1 or 2, wherein the residue obtained by separating and recovering the solder from the crushed material of the printed wiring board on which the electronic parts are mounted is put into a thermal decomposition tank to be thermally decomposed and gasified, A method for recovering resources from a printed wiring board on which waste electronic components are mounted, characterized by separating and recovering metals and non-metals from the thermal decomposition residue.
ス化する際に、沸点が２８０℃を超える熱分解油或いは
石油系油を熱分解槽に供給し、該熱分解油の存在下で樹
脂分を熱分解ガス化することを特徴とする廃電子部品搭
載プリント配線基板からの資源回収方法。4. The pyrolysis oil or petroleum oil having a boiling point of more than 280 ° C. is supplied to the pyrolysis tank when the resin content is pyrolyzed and gasified, and the pyrolysis oil is present in the presence of the pyrolysis oil. A method for recovering resources from a printed wiring board mounted with waste electronic components, characterized in that the resin component is pyrolyzed and gasified by.
た熱分解ガスを還流槽に入れて沸点が３００℃を超える
ガスを液化して前記熱分解槽に戻し、沸点が３００℃以
下のガスを加熱された濾過器に通して沸点２８０℃を超
えるガスを液化するとともに同伴する金属類を除去し、
沸点２８０℃以下のガスを塩素固定化槽に入れて塩素を
除去したのち冷却して低沸点油として回収することを特
徴とする廃電子部品搭載プリント配線基板からの資源回
収方法。5. The pyrolysis gas produced in the pyrolysis tank according to claim 4, wherein the pyrolysis gas is put into a reflux tank to liquefy a gas having a boiling point of more than 300 ° C. and returned to the pyrolysis tank. The gas is passed through a heated filter to liquefy the gas having a boiling point of more than 280 ° C. and remove entrained metals,
A method for recovering resources from a waste electronic component mounted printed wiring board, which comprises putting a gas having a boiling point of 280 ° C. or lower into a chlorine fixing tank to remove chlorine, then cooling and recovering it as a low boiling point oil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7358696A JPH09262573A (en) | 1996-03-28 | 1996-03-28 | Resource recycling method from electronic part-mounted waste printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7358696A JPH09262573A (en) | 1996-03-28 | 1996-03-28 | Resource recycling method from electronic part-mounted waste printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09262573A true JPH09262573A (en) | 1997-10-07 |
Family
ID=13522571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7358696A Pending JPH09262573A (en) | 1996-03-28 | 1996-03-28 | Resource recycling method from electronic part-mounted waste printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09262573A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11314084A (en) * | 1998-02-17 | 1999-11-16 | Matsushita Electric Ind Co Ltd | Method and apparatus for treating circuit substrate |
| WO1999058599A1 (en) * | 1998-05-08 | 1999-11-18 | Nkk Corporation | Method for waste plastics disposal and apparatus used therein |
| US7540078B1 (en) | 1999-01-11 | 2009-06-02 | Panasonic Corporation | Method for recycling wastes of an electrical appliance |
| JP2013230437A (en) * | 2012-04-27 | 2013-11-14 | Astec Irie Co Ltd | Method for processing printed circuit board |
| EP2750489A4 (en) * | 2012-04-16 | 2015-07-08 | Chinese Acad Inst Chemistry | Method for dismantling electronic components on a circuit board by fine sand |
| CN106345794A (en) * | 2016-11-03 | 2017-01-25 | 四川长虹电器股份有限公司 | Waste circuit board microwave anaerobic splitting treatment method |
| CN112517601A (en) * | 2020-11-12 | 2021-03-19 | 逄中胜 | Decomposition and recovery device of automatic circuit board processor |
-
1996
- 1996-03-28 JP JP7358696A patent/JPH09262573A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11314084A (en) * | 1998-02-17 | 1999-11-16 | Matsushita Electric Ind Co Ltd | Method and apparatus for treating circuit substrate |
| WO1999058599A1 (en) * | 1998-05-08 | 1999-11-18 | Nkk Corporation | Method for waste plastics disposal and apparatus used therein |
| US7540078B1 (en) | 1999-01-11 | 2009-06-02 | Panasonic Corporation | Method for recycling wastes of an electrical appliance |
| EP2750489A4 (en) * | 2012-04-16 | 2015-07-08 | Chinese Acad Inst Chemistry | Method for dismantling electronic components on a circuit board by fine sand |
| JP2013230437A (en) * | 2012-04-27 | 2013-11-14 | Astec Irie Co Ltd | Method for processing printed circuit board |
| CN106345794A (en) * | 2016-11-03 | 2017-01-25 | 四川长虹电器股份有限公司 | Waste circuit board microwave anaerobic splitting treatment method |
| CN112517601A (en) * | 2020-11-12 | 2021-03-19 | 逄中胜 | Decomposition and recovery device of automatic circuit board processor |
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