JPH09260194A - Laminated electronic part - Google Patents
Laminated electronic partInfo
- Publication number
- JPH09260194A JPH09260194A JP6858596A JP6858596A JPH09260194A JP H09260194 A JPH09260194 A JP H09260194A JP 6858596 A JP6858596 A JP 6858596A JP 6858596 A JP6858596 A JP 6858596A JP H09260194 A JPH09260194 A JP H09260194A
- Authority
- JP
- Japan
- Prior art keywords
- external electrode
- element body
- electrode
- external
- internal electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【０００１】[0001]
【発明が属する技術分野】本発明は、積層コンデンサ等
の積層電子部品に関し、特に小型の積層電子部品に関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated electronic component such as a laminated capacitor, and more particularly to a small laminated electronic component.
【０００２】[0002]
【従来の技術】図２乃至図４に従来の積層電子部品の一
例としての積層コンデンサを示す。図２は分解斜視図、
図３は平面図、図４は図３のＡ−Ａ線矢視方向断面図で
ある。2. Description of the Related Art FIGS. 2 to 4 show a multilayer capacitor as an example of conventional multilayer electronic components. 2 is an exploded perspective view,
3 is a plan view and FIG. 4 is a sectional view taken along the line AA of FIG.
【０００３】図において、１０は積層コンデンサで、誘
電体層１１と内部電極１２とを交互に積層してなる素体
１３と、素体１３の両端部において内部電極を交互に並
列に接続している一対の外部電極１４とから構成されて
いる。[0003] In the drawing, reference numeral 10 denotes a multilayer capacitor in which a dielectric body 13 formed by alternately laminating dielectric layers 11 and internal electrodes 12 and internal electrodes are alternately connected in parallel at both ends of the dielectric body 13. And a pair of external electrodes 14.
【０００４】内部電極１２は、誘電体層１１の中央領域
付近に設けられた内部電極片１２ａと、外部電極１４に
沿って外部電極１４に接続した状態で設けられた内部電
極引出部１２ｂとから成り、内部電極片１２ａは内部電
極引出部１２ｂを介して外部電極１４に接続されてい
る。The internal electrode 12 is composed of an internal electrode piece 12a provided near the central region of the dielectric layer 11 and an internal electrode lead portion 12b provided along the external electrode 14 and connected to the external electrode 14. The internal electrode piece 12a is connected to the external electrode 14 via the internal electrode lead-out portion 12b.
【０００５】誘電体層１１は矩形のシート上のセラミッ
ク焼結体からなり、セラミック焼結体は、例えばチタン
酸バリウム等を主成分とする誘電体磁器材料から形成さ
れている。内部電極１２は金属ペーストを焼結させた金
属薄膜からなり、金属ペーストとしては、例えばＰｄや
Ａｇ−Ｐｄのような貴金属材料を主成分とするものが使
用されている。外部電極１４も内部電極１２と同様の材
料により形成され、表面には半田濡れ性をよくするため
に半田メッキが施されている。[0005] The dielectric layer 11 is formed of a ceramic sintered body on a rectangular sheet, and the ceramic sintered body is formed of a dielectric ceramic material containing, for example, barium titanate as a main component. The internal electrode 12 is formed of a metal thin film obtained by sintering a metal paste. As the metal paste, for example, an electrode mainly containing a noble metal material such as Pd or Ag-Pd is used. The external electrode 14 is also formed of the same material as the internal electrode 12, and the surface is plated with solder to improve solder wettability.
【０００６】[0006]
【発明が解決しようとする課題】ところで、近年、小型
の移動通信機器等が急速に普及してきており、これに伴
って移動通信機器等に使用される積層コンデンサも小型
化への対応を余儀なくされている。By the way, in recent years, small mobile communication devices and the like have been rapidly spread, and along with this, the multilayer capacitors used in the mobile communication devices and the like are inevitably required to be downsized. ing.
【０００７】しかしながら、形状を小型にした場合、静
電容量の大きな積層コンデンサを製造するのに限界が生
じていた。However, when the shape is made small, there is a limit in manufacturing a multilayer capacitor having a large capacitance.
【０００８】本発明の目的は上記の問題点に鑑み、小型
であり静電容量の増大が可能な積層電子部品を提供する
ことにある。In view of the above problems, it is an object of the present invention to provide a laminated electronic component which is small in size and capable of increasing electrostatic capacitance.
【０００９】[0009]
【課題を解決するための手段】本発明は上記の目的を達
成するために、絶縁体層と内部電極層とを交互に積層し
てなる直方体形状の素体と、該素体の両端部において該
内部電極層に形成された内部電極を交互に並列に接続し
ている一対の外部電極とからなる積層電子部品であっ
て、一方の外部電極に接続された内部電極が最外層に形
成されると共に、他方の外部電極は、前記素体の少なく
とも上下面の一部を覆うように前記一方の外部電極より
も長く形成されている積層電子部品を提案する。In order to achieve the above object, the present invention provides a rectangular parallelepiped shaped element body in which insulating layers and internal electrode layers are alternately laminated, and both end portions of the element body. A laminated electronic component comprising a pair of external electrodes in which the internal electrodes formed in the internal electrode layer are alternately connected in parallel, wherein the internal electrode connected to one external electrode is formed in the outermost layer. At the same time, there is proposed a laminated electronic component in which the other external electrode is formed longer than the one external electrode so as to cover at least a part of the upper and lower surfaces of the element body.
【００１０】該積層電子部品によれば、一方の外部電極
に接続された内部電極が最外層に形成され、さらに、他
方の外部電極は、前記素体の少なくとも上下面の一部を
覆うように前記一方の外部電極よりも長く形成されてい
るので、前記最外層の内部電極と前記他方の外部電極と
の間にも静電容量を得ることができる。According to the laminated electronic component, the internal electrode connected to one external electrode is formed in the outermost layer, and the other external electrode covers at least a part of the upper and lower surfaces of the element body. Since it is formed longer than the one external electrode, a capacitance can be obtained between the outermost internal electrode and the other external electrode.
【００１１】[0011]
【発明の実施の形態】以下、図面に基づいて本発明の一
実施形態を説明する。図１は本発明の一実施形態の積層
コンデンサを示す外観斜視図、図５は側面断面図であ
る。図において、２０は積層コンデンサで、誘電体層２
１と内部電極２２とを交互に積層してなる素体２３と、
素体２３の両端部において内部電極２２を交互に並列に
接続している一対の外部電極２４ａ，２４ｂとから構成
されている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is an external perspective view showing a multilayer capacitor of one embodiment of the present invention, and FIG. 5 is a side sectional view. In the figure, reference numeral 20 denotes a multilayer capacitor, which is a dielectric layer 2
Element body 23 formed by alternately laminating 1 and internal electrodes 22;
It is composed of a pair of external electrodes 24a and 24b which alternately connect the internal electrodes 22 in parallel at both ends of the element body 23.
【００１２】誘電体層２１は、矩形のシート状のセラミ
ック焼結体からなり、焼結体は例えばチタン酸バリウム
を主成分とするグリーンシートを焼成して形成した誘電
体磁器材料からなる。The dielectric layer 21 is made of a rectangular sheet-shaped ceramic sintered body, and the sintered body is made of a dielectric ceramic material formed by firing a green sheet containing barium titanate as a main component, for example.
【００１３】誘電体層２１を介して隣り合う一対の内部
電極２２のそれぞれは矩形になっており、内部電極２２
の長辺は外部電極２４に対して略直角になっている。ま
た、各内部電極２２の幅は各々等しく形成されている。Each of the pair of internal electrodes 22 adjacent to each other with the dielectric layer 21 in between has a rectangular shape.
The long side of is substantially perpendicular to the external electrode 24. The width of each internal electrode 22 is formed to be equal.
【００１４】さらに、一方の外部電極２４ａに接続され
た内部電極２２が最外層に位置するように内部電極２２
の配置が設定されている。Furthermore, the internal electrode 22 connected to one external electrode 24a is positioned so that the internal electrode 22 is located in the outermost layer.
Is set.
【００１５】また、他方の外部電極２４ｂは、素体２３
の上下及び両側面の所定範囲を覆うように、一方の外部
電極２４ａよりも長く形成されている。The other external electrode 24b is made up of the element body 23.
Is formed longer than one external electrode 24a so as to cover a predetermined range on the upper and lower sides and both side surfaces.
【００１６】一方、前述の内部電極２２は導電性ペース
トの薄膜を焼結させた金属薄膜からなり、導電性ペース
トとしては、例えばパラジウム粉末を主成分とするもの
が使用されている。また、外部電極２４も内部電極２２
と同様の材料により形成され、表面には半田濡れ性をよ
くするために半田メッキが施されている。On the other hand, the above-mentioned internal electrode 22 is made of a metal thin film obtained by sintering a thin film of a conductive paste, and as the conductive paste, for example, one containing palladium powder as a main component is used. In addition, the external electrode 24 is also the internal electrode 22.
It is formed of the same material as the above, and the surface is plated with solder in order to improve solder wettability.
【００１７】この積層コンデンサは次のようにして製造
した。まず、誘電体の原料粉末に有機バインダーを１５
重量％添加し、さらに水を５０重量％加え、これらをボ
ールミルに入れて十分に混合し、誘電体磁器原料のスラ
リーを作成した。This multilayer capacitor was manufactured as follows. First, an organic binder was added to the dielectric raw material powder.
% By weight, and further 50% by weight of water, and these were put into a ball mill and mixed well to prepare a slurry of a dielectric ceramic raw material.
【００１８】次に、このスラリーを真空脱泡器に入れて
脱泡した後、リバースロールコーターに入れ、ポリエス
テルフィルム上にこのスラリーからなる薄膜を形成し、
この薄膜をポリエステルフィルム上で１００℃に加熱し
て乾燥させ、これを打ち抜いて、１０ｃｍ角、厚さ約２
０μｍのグリーンシートを得た。Next, after putting this slurry in a vacuum defoamer to defoam it, put it in a reverse roll coater to form a thin film of this slurry on a polyester film,
This thin film is dried by heating to 100 ° C. on a polyester film, punched out, and 10 cm square, about 2 mm thick.
A green sheet of 0 μm was obtained.
【００１９】一方、平均粒径が１．５μｍのパラジウム
粉末１０ｇと、エチルセルロース０．９ｇをブチルカル
ビトール９．１ｇに溶解させたものとを攪拌器に入れ、
１０時間攪拌することにより内部電極用の導電性ペース
トを得た。On the other hand, 10 g of palladium powder having an average particle size of 1.5 μm and 0.9 g of ethyl cellulose dissolved in 9.1 g of butyl carbitol were placed in a stirrer.
By stirring for 10 hours, a conductive paste for an internal electrode was obtained.
【００２０】この後、上述した内部電極のパターンを５
０個有する各スクリーンを用いて、上記グリーンシート
の片面にこの導電性ペーストからなる内部電極のパター
ンを各々印刷し、これを乾燥させた。After that, the above-mentioned internal electrode pattern is formed into 5
Using each of the screens having zero, a pattern of the internal electrode made of the conductive paste was printed on one surface of the green sheet, and dried.
【００２１】次に、上記印刷面を上にしてグリーンシー
トを複数枚積層し、さらにこの積層物の上下両面に印刷
の施されていないグリーンシートを積層した。次いで、
この積層物を約５０℃の温度で厚さ方向に約４０トンの
圧力を加えて圧着させた。この後、この積層物を格子状
に裁断し、約５０個の積層チップを得た。Next, a plurality of green sheets were laminated with the printed surface facing upward, and further unprinted green sheets were laminated on the upper and lower surfaces of this laminate. Then
This laminate was pressed at a temperature of about 50 ° C. by applying a pressure of about 40 tons in the thickness direction. Thereafter, the laminate was cut into a lattice to obtain about 50 laminated chips.
【００２２】次に、この積層チップを雰囲気焼成可能な
炉に入れ、大気中で６００℃まで加熱して、有機バイン
ダーを焼成させ、その後、炉の雰囲気を大気中雰囲気と
し、積層体チップの加熱温度を６００℃から焼成温度の
１１５０℃（最高温度）を３時間保持した。この後、１
００℃／ｈｒの速度で６００℃まで降温し、室温まで冷
却して、焼結体チップを得た。Next, this laminated chip is placed in a furnace capable of firing in an atmosphere and heated to 600 ° C. in the atmosphere to fire the organic binder, and then the atmosphere in the oven is set to the atmosphere in the atmosphere to heat the laminated chip. The temperature was maintained at 600 ° C. to 1150 ° C. (maximum temperature), which is the firing temperature, for 3 hours. After this, 1
The temperature was lowered to 600 ° C. at a rate of 00 ° C./hr and cooled to room temperature to obtain a sintered body chip.
【００２３】次いで、内部電極が露出する焼結体チップ
の側面に銀とガラスフリットとビヒクルからなる導電性
ペーストを塗布して乾燥させ、これを大気中で８００℃
の温度で１５分間焼き付け、銀電極層を形成し、さらに
この上に銅を無電解メッキで被着させ、この上に電気メ
ッキ法でＰｂ−Ｓｎ半田層を設けて、一対の外部電極を
形成した。これによって積層コンデンサが得られた。Then, a conductive paste composed of silver, glass frit and vehicle is applied to the side surface of the sintered body chip where the internal electrodes are exposed and dried, and this is dried in air at 800 ° C.
Baking at a temperature of 15 minutes to form a silver electrode layer, further depositing copper thereon by electroless plating, and providing a Pb-Sn solder layer thereon by electroplating to form a pair of external electrodes did. As a result, a multilayer capacitor was obtained.
【００２４】前述の構成よりなる積層コンデンサ２０に
よれば、一方の外部電極２４ａに接続された内部電極２
２が最外層に形成され、さらに、他方の外部電極２４ｂ
は、素体２３の上下及び両側面の一部を覆うように一方
の外部電極２４ａよりも長く形成されているので、最外
層の内部電極２２と他方の外部電極２４ｂとの間にも静
電容量を得ることができ、小型の積層コンデンサ２０を
を構成した場合にも、静電容量の増大を図ることができ
る。According to the multilayer capacitor 20 having the above-described structure, the internal electrode 2 connected to the external electrode 24a on one side is
2 is formed on the outermost layer, and the other external electrode 24b
Is formed to be longer than one external electrode 24a so as to cover the upper and lower parts of the element body 23 and a part of both side surfaces thereof. Capacitance can be obtained, and electrostatic capacitance can be increased even when a small multilayer capacitor 20 is configured.
【００２５】また、素体２３の表面を外部電極２４ｂが
覆っているので、素体２３へのクラック等の発生を防止
することができると共に、内部電極２２と任意の外部導
体との間のリークの発生を防止することができる。Further, since the surface of the element body 23 is covered with the external electrodes 24b, it is possible to prevent the occurrence of cracks or the like in the element body 23, and to leak between the internal electrode 22 and any external conductor. Can be prevented.
【００２６】尚、これらの実施形態は一例であり本発明
がこれに限定されることはない。These embodiments are merely examples, and the present invention is not limited to these.
【００２７】[0027]
【発明の効果】以上説明したように本発明によれば、一
方の外部電極に接続された内部電極が最外層に形成さ
れ、さらに、他方の外部電極は、素体の上下及び両側面
の一部を覆うように一方の外部電極よりも長く形成され
ているので、最外層の内部電極と他方の外部電極との間
にも静電容量を得ることができ、小型の積層コンデンサ
をを構成した場合にも、静電容量の増大を図ることがで
きる。As described above, according to the present invention, the inner electrode connected to one outer electrode is formed in the outermost layer, and the other outer electrode is formed on the upper and lower sides and both side surfaces of the element body. Since it is formed so as to be longer than one external electrode so as to cover the part, it is possible to obtain capacitance between the outermost internal electrode and the other external electrode, thus forming a small multilayer capacitor. Also in this case, the capacitance can be increased.
【図１】本発明の一実施形態の積層コンデンサを示す外
観斜視図FIG. 1 is an external perspective view showing a multilayer capacitor according to an embodiment of the present invention.
【図２】従来例の積層コンデンサを示す分解斜視図FIG. 2 is an exploded perspective view showing a conventional multilayer capacitor.
【図３】従来例の積層コンデンサを示す平断面図FIG. 3 is a cross-sectional plan view showing a conventional multilayer capacitor.
【図４】図３のＡ−Ａ線矢視方向断面図FIG. 4 is a sectional view taken along line AA of FIG. 3;
【図５】本発明の一実施形態の積層コンデンサを示す側
面断面図FIG. 5 is a side sectional view showing a multilayer capacitor according to an embodiment of the present invention.
２０…積層コンデンサ、２１…誘電体層、２２…内部電
極、２３…素体、２４ａ，２４ｂ…外部電極。20 ... Multilayer capacitor, 21 ... Dielectric layer, 22 ... Internal electrode, 23 ... Element body, 24a, 24b ... External electrode.
Claims (1)
てなる直方体形状の素体と、該素体の両端部において該
内部電極層に形成された内部電極を交互に並列に接続し
ている一対の外部電極とからなる積層電子部品であっ
て、 一方の外部電極に接続された内部電極が最外層に形成さ
れると共に、 他方の外部電極は、前記素体の少なくとも上下面の一部
を覆うように前記一方の外部電極よりも長く形成されて
いることを特徴とする積層電子部品。1. A rectangular parallelepiped element body in which insulator layers and internal electrode layers are alternately laminated and internal electrodes formed on the internal electrode layers at both ends of the element body are alternately connected in parallel. In the laminated electronic component including a pair of external electrodes, the internal electrode connected to one external electrode is formed in the outermost layer, and the other external electrode is at least the upper and lower surfaces of the element body. A laminated electronic component, characterized in that it is formed longer than the one external electrode so as to cover a part thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6858596A JPH09260194A (en) | 1996-03-25 | 1996-03-25 | Laminated electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6858596A JPH09260194A (en) | 1996-03-25 | 1996-03-25 | Laminated electronic part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09260194A true JPH09260194A (en) | 1997-10-03 |
Family
ID=13378027
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6858596A Withdrawn JPH09260194A (en) | 1996-03-25 | 1996-03-25 | Laminated electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09260194A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002203734A (en) * | 2000-12-27 | 2002-07-19 | Ibiden Co Ltd | Capacitor, multilayered printed wiring board, and method of manufacturing the same |
| JP2003257784A (en) * | 2002-02-28 | 2003-09-12 | Tdk Corp | Electronic component |
| JP2016219741A (en) * | 2015-05-26 | 2016-12-22 | 京セラ株式会社 | Laminated capacitor and mounting structure thereof |
| US20190139707A1 (en) * | 2016-04-26 | 2019-05-09 | Epcos Ag | Multilayer Component and Use of Outer Electrodes |
-
1996
- 1996-03-25 JP JP6858596A patent/JPH09260194A/en not_active Withdrawn
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002203734A (en) * | 2000-12-27 | 2002-07-19 | Ibiden Co Ltd | Capacitor, multilayered printed wiring board, and method of manufacturing the same |
| JP2003257784A (en) * | 2002-02-28 | 2003-09-12 | Tdk Corp | Electronic component |
| KR100964043B1 (en) * | 2002-02-28 | 2010-06-16 | 티디케이가부시기가이샤 | Electronic component |
| JP2016219741A (en) * | 2015-05-26 | 2016-12-22 | 京セラ株式会社 | Laminated capacitor and mounting structure thereof |
| US20190139707A1 (en) * | 2016-04-26 | 2019-05-09 | Epcos Ag | Multilayer Component and Use of Outer Electrodes |
| US11145461B2 (en) * | 2016-04-26 | 2021-10-12 | Tdk Electronics Ag | Multilayer component and use of outer electrodes |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20030603 |