JPH09246080A - Method of manufacturing base material of chip electronic component - Google Patents
Method of manufacturing base material of chip electronic componentInfo
- Publication number
- JPH09246080A JPH09246080A JP5627896A JP5627896A JPH09246080A JP H09246080 A JPH09246080 A JP H09246080A JP 5627896 A JP5627896 A JP 5627896A JP 5627896 A JP5627896 A JP 5627896A JP H09246080 A JPH09246080 A JP H09246080A
- Authority
- JP
- Japan
- Prior art keywords
- shaped
- rod
- kneading
- binder
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、インダクタ、抵抗
及びコンデンサ又はそれらのアレイ並びにフィルタなど
の電子部品の素地を製造するチップ状電子部品素地の製
造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a chip-shaped electronic component base for manufacturing a base of an electronic component such as an inductor, a resistor and a capacitor or an array thereof and a filter.
【０００２】[0002]
【従来の技術】従来、例えば、磁性、誘電性又は絶縁性
或いは低誘電性の焼成された成形体に複数の直線状又は
コイル状導線又は抵抗線を内蔵した小型なチップ状電子
部品が提案されている。2. Description of the Related Art Conventionally, for example, a small chip-shaped electronic component has been proposed in which a plurality of linear or coil-shaped conductor wires or resistance wires are built in a fired molded body of magnetic, dielectric, insulating or low dielectric. ing.
【０００３】[0003]
【発明が解決しようとする課題】本発明の課題は、上記
した従来のチップ状電子部品を低廉なコストで量産でき
る電子部品素地の製造方法を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a method of manufacturing an electronic component base which enables mass production of the above-mentioned conventional chip-shaped electronic components at a low cost.
【０００４】[0004]
【課題を解決するための手段】本発明は、上記の課題を
解決するために、請求項１に記載のように、磁性、誘電
性又は絶縁性或いは低誘電性の原料粉末と結合材を混練
した混練材を送出する押出し成形機により直線状又はコ
イル状の導線又は抵抗線を内蔵する混練材から成る断面
方形の複数の棒状成形体を形成し、該複数の棒状成形体
をその側面において互いに接合し、次いで焼成し、焼成
した成形体をその長さ方向に沿って切断して複数の電子
部品素地を製造することを特徴とする。複数の棒状成形
体の接合時にその側面に接合材を塗布するか、或いは、
前記結合材の溶媒を塗布する。前記複数の棒状成形体の
接合時に、該棒状成形体を加熱、加熱・加圧又は加圧・
振動の内の少なくとも一つを行うことができる。前記混
練材に含まれる結合材として熱軟化性の結合材を用いて
もよく、この結合材を用いたとき、複数の棒状成形体の
接合時に棒状成形体を加熱、加熱・加圧又は加圧・振動
の少なくとも一つを行うことが好ましく、このとき、接
合材又は結合材の溶媒を棒状成形体の側面に塗布しなく
てもよい。In order to solve the above-mentioned problems, according to the present invention, as described in claim 1, a magnetic, dielectric or insulating or low-dielectric raw material powder and a binder are kneaded. An extruding machine for delivering the kneaded material forms a plurality of rod-shaped moldings each having a rectangular cross-section and made of the kneading material containing a linear or coil-shaped conductor wire or resistance wire, and the plurality of rod-shaped moldings are provided on their side surfaces. It is characterized by joining, then firing, and cutting the fired molded body along its length to produce a plurality of electronic component bases. When joining a plurality of rod-shaped molded bodies, apply a bonding material to the side surface, or
A solvent for the binder is applied. When the plurality of rod-shaped compacts are joined, the rod-shaped compacts are heated, heated / pressurized, or pressed / pressed.
At least one of the vibrations can be performed. A heat-softening binder may be used as the binder contained in the kneading material, and when this binder is used, the rod-shaped compact is heated, heated / pressurized or pressed when a plurality of rod-shaped compacts are joined. It is preferable to perform at least one of the vibrations, and at this time, the solvent of the bonding material or the bonding material does not have to be applied to the side surface of the rod-shaped molded body.
【０００５】前記複数の棒状成形体は、インダクタ又は
インダクタ・アレイの場合には、いずれも磁性原料粉末
と結合材を混練した混練材から成り直線状又はコイル状
導線を内蔵する棒状成形体であり、抵抗又は抵抗アレイ
の場合には、いずれも絶縁性又は低誘電性の原料粉末と
結合材を混練した混練材から成り直線状又はコイル状抵
抗線を内蔵する棒状成形体であり、コンデンサ、コンデ
ンサ・アレイの場合には、いずれも誘電性原料粉末と結
合材を混練した混練材から成り直線状又はコイル状導線
を内蔵する棒状成形体であり、インダクタ及びコンデン
サから成る複合部品である場合には、磁性原料粉末と結
合材を混練した混練材から成り直線状又はコイル状の導
線を内蔵する棒状成形体と、誘電性原料粉末と結合材を
混練した混練材から成り直線状又はコイル状導線を内蔵
する棒状成形体の組合わせであり、抵抗及びコンデンサ
から成る複合部品である場合には、前記抵抗の棒状成形
体とコンデンサの棒状成形体の組合わせである。インダ
クタ・アレイの場合、前述したインダクタ又はインダク
タ・アレイの複数の棒状成形体を、その側面に該成形体
の磁性原料粉末よりも透磁率の低い磁性原料粉末または
非磁性原料粉末と結合材を混練した混練材から成る薄板
状成形体を介在させて相互に接合して成形体を作成する
ことが好ましい。In the case of an inductor or an inductor array, each of the plurality of rod-shaped compacts is a rod-shaped compact made of a kneading material obtained by kneading a magnetic raw material powder and a binder, and incorporating a linear or coiled conductor. In the case of a resistor or a resistor array, each is a rod-shaped molded body containing a linear or coiled resistance wire made of a kneading material obtained by kneading an insulating or low-dielectric raw material powder and a binder, and a capacitor or a capacitor. In the case of an array, each is a rod-shaped molded body made of a kneading material obtained by kneading a dielectric raw material powder and a binder, and having a linear or coil-shaped conducting wire built-in. A rod-shaped molded body made of a kneading material obtained by kneading a magnetic raw material powder and a binder and having a linear or coil-shaped conducting wire, and a kneading material obtained by kneading the dielectric raw material powder and the binder. A straight or a combination of the rod shaped molded body incorporating a coiled conductive wire made, if the resistance and a composite component comprising a capacitor is a combination of the rod shaped molded body of the rod shaped molded body and the capacitor resistor. In the case of an inductor array, a plurality of rod-shaped compacts of the above-mentioned inductor or inductor array are kneaded on their side surfaces with a magnetic raw material powder or a non-magnetic raw material powder having a lower magnetic permeability than the magnetic raw material powder of the compacts and a binder. It is preferable that a thin plate-shaped molded body made of the above kneaded material is interposed and bonded to each other to form a molded body.
【０００６】請求項１に記載のチップ状電子部品素地の
製造方法によれば、磁性、誘電性又は絶縁性或いは低誘
電性の原料粉末と結合材を混練した混練材を送出する押
出し成形機により直線状又はコイル状の導線又は抵抗線
を内蔵する混練材から成る断面方形の複数の棒状成形体
を形成し、該複数の棒状成形体をその側面において互い
に接合し、次いで焼成し、焼成した成形体をその長さ方
向に沿って切断して複数の電子部品素地を製造するの
で、複数の電子部品素地を低廉なコストで量産すること
ができる。前記複数の棒状成形体の接合時に、加熱、加
熱・加圧又は加圧・振動の内少なくともその一つを行う
ときは、前記成形体同士の接合力が増大する。結合材と
して熱軟化性のものを用い、前記複数の棒状成形体の接
合時に、加熱、加熱・加圧又は加圧・振動の内少なくと
もその一つを行うときは、接合材や結合材の溶媒を用い
なくても接合することができるので、工数が少なくなる
と共に材料が節約することができる。前記複数の棒状成
形体を、その側面に該棒状成形体の磁性原料粉末よりも
透磁率の低い磁性原料粉末または非磁性原料粉末と結合
材を混練した混練材から成る薄板状成形体を介在させて
相互に接合し、次いで、焼成し、焼成した成形体をその
長さ方向に沿って切断して製造された複数の電子部品素
地は、インダクタ・アレイとして用いた場合、インダク
タが相互に干渉しなくなるので、小型に形成することが
できる。According to the method for manufacturing a chip-shaped electronic component substrate according to claim 1, an extrusion molding machine for delivering a kneading material obtained by kneading a magnetic, dielectric or insulating or low dielectric raw material powder and a binder is used. Forming a plurality of rod-shaped compacts each having a rectangular cross section and made of a kneading material containing a linear or coil-shaped conducting wire or resistance wire, and joining the plurality of rod-shaped compacts to each other on their side faces, followed by firing and firing Since the plurality of electronic component bases are manufactured by cutting the body along the length direction, the plurality of electronic component bases can be mass-produced at low cost. When at least one of heating, heating / pressurizing, or pressurizing / vibrating is performed at the time of joining the plurality of rod-shaped compacts, the joining force between the compacts increases. When using a heat-softening material as the binder, and when performing at least one of heating, heating / pressurizing, or pressurizing / vibrating at the time of joining the plurality of rod-shaped molded bodies, a solvent of the joining material or the binder. Since they can be joined without using, the number of steps can be reduced and the material can be saved. The plurality of rod-shaped compacts are provided on the side surface thereof with a thin plate-shaped compact made of a kneading material obtained by kneading a magnetic raw material powder or a non-magnetic raw material powder having a lower magnetic permeability than the magnetic raw material powder of the rod-shaped compact and a binder. When used as an inductor array, a plurality of electronic component bases manufactured by firing, then firing, and cutting the fired molded body along the length of the inductors interfere with each other. Since it is eliminated, it can be formed in a small size.
【０００７】[0007]
【発明の実施の形態】以下に本発明の実施の形態を図面
を参照して説明する。Embodiments of the present invention will be described below with reference to the drawings.
【０００８】図１は、チップ状インダクタの１例を示
す。FIG. 1 shows an example of a chip-shaped inductor.
【０００９】同図において、１は、直方体形状のフェラ
イトから成る磁性コアで、これには例えば、４本の直線
状導線２1、２2、２3、２4が所定間隔で並列に配置され
て埋設され、該導線２1及び２2の端末が磁性コア１の後
面に形成された接続電極３1により、導線２2及び２3の
端末が磁性コア１の前面に形成された接続電極３2によ
り、導線２3及び２4の端末が磁性コア１の後面に形成さ
れた接続電極３3によりそれぞれ接続されてこれらの導
線２1〜２4が直列に接続され、両端の直線状導線２1、
２4の端末が磁性コア１の左右両端面に形成された外部
電極４1及び４2に接続されている。このインダクタの構
成によれば、直線状導線２1、２2、２3、２4がすべて磁
性コア１に埋設され、長い導線によって生じる磁束が磁
性コア１内に流れ、外部に漏洩することがないので、イ
ンピーダンスが大きく、小型のインダクタが得られる。In the figure, 1 is a magnetic core made of rectangular parallelepiped ferrite, for example, four linear conductors 2 1 , 2 2 , 2 3 , 2 4 are arranged in parallel at a predetermined interval. embedded Te, conductor lines 2 1 and 2 2 of the terminal by the connection electrodes 3 1 formed on the rear surface of the magnetic core 1, conductor 2 2 and 2 3 of the connection electrodes 3 the terminal is formed on the front surface of the magnetic core 1 2 , the ends of the conductors 2 3 and 2 4 are connected by the connection electrode 3 3 formed on the rear surface of the magnetic core 1, and these conductors 2 1 to 2 4 are connected in series, and the linear conductors 2 at both ends are connected. 1 ,
2 4 terminals are connected to external electrodes 4 1 and 4 2 formed on both left and right end surfaces of the magnetic core 1. According to this inductor configuration, the linear conductors 2 1 , 2 2 , 2 3 , 2 4 are all embedded in the magnetic core 1, and the magnetic flux generated by the long conductor flows into the magnetic core 1 and leaks to the outside. Since it does not have a large impedance, a small inductor can be obtained.
【００１０】次に、このインダクタに適用された本発明
実施の電子部品素地の製造方法を説明する。Next, a method of manufacturing the electronic component base according to the present invention applied to this inductor will be described.
【００１１】図２に示すように、長尺の直線状導線５を
押出し成形機６の透孔７に挿通し、磁性体原料粉末Ｂと
水又はアルコール及びグリセリン・メチルセルロースか
ら成る結合材Ｓを混練機８で均等に混練した混練材９を
押出し成形機６に加圧送入すると、その断面方形の金型
口金から、導線５を包囲する混練材９から成る断面方形
の外被体が形成されて成形体１０が送出される。この成
形体１０は乾燥した後、焼成炉の大きさ又は、下に敷く
セッタの形状に合わせて成形体１０の長さ方向に沿って
切断し棒状成形体１１を得る。図３（Ａ）に示すよう
に、この棒状成形体１１を複数個例えば４個作成して、
この４個の棒状成形体１１の接合面１２にそれぞれ、水
又はアルコールとグリセリン・メチルセルロースから成
る接合材を霧状にして塗布又は筆（刷毛）等により塗
布、孔版印刷法により塗布、浸漬法により塗布或いはス
ポンジなどを押し当て転写法により塗布し、図３（Ｂ）
に示すように、４個の棒状成形体１１を側面の接合面１
２において互いに接触させ加圧して接合する。その後に
６００〜１０００℃、例えば９００℃で焼成し、図３
（Ｃ）に示すように、個々のインダクタの寸法に合わせ
てカッタで切断する。切断された個々のインダクタ素地
１３は、バレル粉と水とでバレル研磨して、角部にアー
ルを付ける。次いで、図１に示すように、銀ペーストを
インダクタ素地１３の磁性コア１の前後両面及び左右両
端面に銀粉末と溶剤とから成る銀ペーストを塗布し焼き
付けて接続電極３1、３2、３3及び外部電極４1、４2を
形成する。かくして、インダクタンス素地１３の４個の
直線状導線２1、２2、２3、２4は直列に接続されて外部
電極４1、４2に接続される。外部電極４1、４2の銀層上
には、ニッケル・メッキと半田メッキとが施される。As shown in FIG. 2, a long linear wire 5 is inserted into a through hole 7 of an extrusion molding machine 6, and a magnetic material powder B and a binder S composed of water or alcohol and glycerin / methylcellulose are kneaded. When the kneading material 9 uniformly kneaded by the machine 8 is fed into the extrusion molding machine 6 under pressure, a square die cross-section covering the conductor 5 is formed from the die die having the square cross section. The molded body 10 is delivered. After this molded body 10 is dried, a rod-shaped molded body 11 is obtained by cutting along the length direction of the molded body 10 according to the size of the firing furnace or the shape of the setter laid thereunder. As shown in FIG. 3A, a plurality of, for example, four rod-shaped molded bodies 11 are prepared,
The bonding surface 12 of each of the four rod-shaped molded bodies 11 is sprayed with a bonding material composed of water or alcohol and glycerin / methylcellulose, or applied by a brush (brush) or the like, applied by a stencil printing method, and dipped by a dipping method. Apply or apply a sponge or the like by the transfer method, as shown in FIG.
As shown in FIG.
In step 2, they are brought into contact with each other and pressed to bond them. After that, baking is performed at 600 to 1000 ° C., for example, 900 ° C., and FIG.
As shown in (C), it is cut with a cutter according to the size of each inductor. Each of the cut inductor bodies 13 is barrel-polished with barrel powder and water to have rounded corners. Next, as shown in FIG. 1, a silver paste is applied to the front and rear surfaces and both left and right surfaces of the magnetic core 1 of the inductor base 13 by applying a silver paste made of silver powder and a solvent and baking it to form the connection electrodes 3 1 , 3 2 , 3 3 and external electrodes 4 1 and 4 2 are formed. Thus, the four linear conductors 2 1 , 2 2 , 2 3 , 2 4 of the inductance element 13 are connected in series and are connected to the external electrodes 4 1 , 4 2 . Nickel plating and solder plating are applied on the silver layers of the external electrodes 4 1 , 4 2 .
【００１２】図４は、インダクタ・アレイの１例を示
す。FIG. 4 shows an example of an inductor array.
【００１３】これは、図３（Ｃ）に示されるインダクタ
素地１３の磁性コア１の前面及び後面に、露出した各直
線状導線２1、２2、２3、２4の端末に接続される外部電
極４1、４2、４3、４4が形成されている。This is connected to the ends of the exposed linear conductors 2 1 , 2 2 , 2 3 , 2 4 on the front and rear surfaces of the magnetic core 1 of the inductor body 13 shown in FIG. 3C. External electrodes 4 1 , 4 2 , 4 3 , 4 4 are formed.
【００１４】このインダクタ・アレイの構成によれば、
前記直線状導線２1、２2、２3、２4がすべて磁性コア１
に埋設され、該導線２1、２2、２3、２4によって生じる
磁束が磁性コア１内に流れ、外部に漏洩することがない
ので、各導線２1〜２4のインピーダンスが大きく、小型
のインダクタ・アレイが得られる。According to the configuration of this inductor array,
The straight conductors 2 1 , 2 2 , 2 3 , 2 4 are all magnetic cores 1.
Since the magnetic flux generated by the conductors 2 1 , 2 2 , 2 3 , 2 4 flows inside the magnetic core 1 and does not leak to the outside, the impedance of each conductor 2 1 to 2 4 is large and small. Inductor array is obtained.
【００１５】前記棒状成形体１１は、図２に示される押
出し成形機６で作成したが、複数の金型口金と長尺の導
線を挿通する複数の透孔を有する押出し成形機を用いて
複数個の棒状成形体１１を同時に作成することもでき
る。The rod-shaped molded body 11 was produced by the extrusion molding machine 6 shown in FIG. 2, but a plurality of extrusion molding machines having a plurality of die caps and a plurality of through holes for inserting long conductor wires were used. It is also possible to simultaneously create the individual rod-shaped molded bodies 11.
【００１６】図５は、図４に示すインダクタ・アレイの
他の例を示す。FIG. 5 shows another example of the inductor array shown in FIG.
【００１７】このインダクタ・アレイの磁性コア１は、
各インダクタの磁性コア部分の間に該磁性コア部分の例
えば主成分が酸化鉄から成るＮｉーＺｎ系の磁性材の透
磁率（μ：８００）より低い例えば同主成分から成る透
磁率（μ：２０）の磁性コア層又は例えばアルミナ（Ａ
ｌ2Ｏ3）から成る絶縁層１ａが介在されたものであり、
この構成によれば、各直線状導線２1、２2、２3、２4に
流れる電流による磁束は、それぞれ磁性コア層１ａで遮
られるためインダクタ同志が相互干渉を起こさないの
で、各インダクタを近接して配置することができ、一層
小型に形成することができる。The magnetic core 1 of this inductor array is
Between the magnetic core portions of the inductors, for example, the magnetic permeability (μ: 800) of the magnetic core portion is lower than the magnetic permeability (μ: 800) of the Ni-Zn magnetic material whose main component is iron oxide, for example. 20) magnetic core layer or eg alumina (A
an insulating layer 1a made of l 2 O 3 ) is interposed,
According to this structure, the magnetic fluxes caused by the currents flowing through the linear conductors 2 1 , 2 2 , 2 3 , and 2 4 are blocked by the magnetic core layer 1a, so that the inductors do not interfere with each other. They can be arranged close to each other and can be made smaller.
【００１８】このインダクタ・アレイは、、前述した４
個の棒状成形体１１の接合面間に前記磁性コア層又は絶
縁層１ａを形成する薄板状成形体を介在させて、前記製
造方法と同じように４個の棒状成形体１１を接合面に接
合材を塗布し加圧して接合し、その後に焼成し、次い
で、個々のインダクタの寸法に合わせてカッタで切断す
ることによりインダクタ・アレイ素地が得られ、これに
外部電極４1〜４4を前述のように形成することによりイ
ンダクタ・アレイが得られる。This inductor array is based on the above-mentioned 4
Similar to the manufacturing method, the four rod-shaped molded bodies 11 are bonded to the bonding surface by interposing the thin plate-shaped molded body forming the magnetic core layer or the insulating layer 1a between the bonded surfaces of the individual rod-shaped molded bodies 11. The inductor array base material is obtained by applying the materials, pressurizing and joining, then firing, and then cutting with a cutter according to the dimensions of the individual inductors, to which the external electrodes 4 1 to 4 4 are formed as described above. An inductor array can be obtained by forming as described above.
【００１９】図６は、チップ状インダクタ・アレイの他
の例を示す。FIG. 6 shows another example of the chip-shaped inductor array.
【００２０】同図において、１は、直方体形状のフェラ
イトから成る磁性コアで、これには例えば、４本のコイ
ル状導線２ａ1、２ａ2、２ａ3、２ａ4が所定間隔で並列
に配置されて埋設され、該コイル状導線２ａ1、２ａ2、
２ａ3、２ａ4の各両端末が磁性コア１の前面及び後面に
形成された外部電極４1、４2、４3、４4に接続されてい
る。外部電極４1、４2、４3、４4は、配線基板に搭載し
たときその導電パッドに接続することが容易であるよう
に、それぞれ上下面にまで延設することが望ましい。こ
のインダクタ・アレイの構成によれば、コイル状導線２
1、２2、２3、２4がすべて磁性コア１に埋設され、コイ
ル状導線２1、２2、２3、２4によって生じる磁束が磁性
コア１内に流れ、外部に漏洩することがないので、図５
に図示のものよりインピーダンスが大きく、小型なイン
ダクタ・アレイが得られる。In the figure, 1 is a magnetic core made of ferrite in the shape of a rectangular parallelepiped, for example, four coiled conductors 2a 1 , 2a 2 , 2a 3 , 2a 4 are arranged in parallel at a predetermined interval. Embedded in the coil-shaped conductors 2a 1 , 2a 2 ,
Both ends of 2a 3 and 2a 4 are connected to external electrodes 4 1 , 4 2 , 4 3 , 4 4 formed on the front and rear surfaces of the magnetic core 1. The external electrodes 4 1 , 4 2 , 4 3 , 4 4 are preferably extended to the upper and lower surfaces, respectively, so that they can be easily connected to the conductive pads when mounted on the wiring board. According to the configuration of this inductor array, the coiled conductor 2
Since 1 , 2 2 , 2 3 , 2 4 are all embedded in the magnetic core 1, the magnetic flux generated by the coil-shaped conductors 2 1 , 2 2 , 2 3 , 2 4 may flow into the magnetic core 1 and leak to the outside. Since there is no,
The impedance is higher than that shown in the figure, and a small inductor array is obtained.
【００２１】次に、このチップ状インダクタ・アレイに
適用された本発明実施の電子部品素地の製造方法を図７
により説明する。Next, a method of manufacturing an electronic component base according to the present invention applied to this chip-shaped inductor array will be described with reference to FIG.
This will be described below.
【００２２】図７に示すように、磁性体原料粉末Ｂと結
合材Ｓを混練機８で均等に混練した混練材９を一次押出
し成形機６ａに加圧送入すると、その金型口金から混練
材から成る棒状の巻芯１４が送出され、乾燥後この巻芯
１４に導線１５を巻線機１６によりコイル状に巻回す
る。この導線１５を巻回した巻芯１４を、混練材が加圧
送入される二次押出し成形機６ｂに挿入し送出させる
と、導線１５を巻回した巻芯１４を包囲して混練材から
成る断面方形の外被体が被覆され、成形体１７が形成さ
れる。この成形体１７は、乾燥した後、焼成炉の大きさ
又は、下に敷くセッタの形状に合わせて成形体１７の長
さ方向に沿って切断し複数の棒状成形体１８を得る。以
後は、図３に示す前記製造方法と同様の工程を経て図６
に示すインダクタ・アレイが製造される。この製造方法
によれば、巻芯１４の磁性体の焼成時の収縮率が外被体
の磁性体の収縮率より大きいか等しい場合、焼成時に外
被体の磁性体の収縮による応力が巻芯の磁性体に加わら
ないので、インピーダンス特性が劣化しない。このイン
ダクタ・アレイについても、図５に示すインダクタ・ア
レイと同様に各インダクタの磁性コア部分の間に該磁性
コア部分の透磁率よりも低い磁性コア層又は絶縁層を介
在させることができる。As shown in FIG. 7, when the kneading material 9 in which the magnetic material powder B and the binder S are evenly kneaded by the kneading machine 8 is fed under pressure to the primary extrusion molding machine 6a, the kneading material is ejected from the die die. A rod-shaped winding core 14 composed of is delivered, and after drying, a conductor 15 is wound around the winding core 14 in a coil shape by a winding machine 16. When the winding core 14 around which the conducting wire 15 is wound is inserted into the secondary extrusion molding machine 6b into which the kneading material is fed under pressure and sent out, the winding core 14 around which the conducting wire 15 is wound is surrounded by the kneading material. A jacket 17 having a rectangular cross section is coated to form a molded body 17. After this molded body 17 is dried, a plurality of rod-shaped molded bodies 18 are obtained by cutting along the length direction of the molded body 17 according to the size of the firing furnace or the shape of the setter laid thereunder. Thereafter, the same steps as those of the manufacturing method shown in FIG.
The inductor array shown in is manufactured. According to this manufacturing method, when the shrinkage rate of the magnetic body of the winding core 14 during firing is greater than or equal to the shrinkage rate of the magnetic body of the outer sheath, the stress due to the shrinkage of the magnetic body of the outer sheath is increased during firing. Since it is not added to the magnetic substance, the impedance characteristics do not deteriorate. Also in this inductor array, similarly to the inductor array shown in FIG. 5, a magnetic core layer or an insulating layer having a magnetic permeability lower than the magnetic permeability of the magnetic core portions can be interposed between the magnetic core portions of each inductor.
【００２３】図７に示す成形体１８を用いて図３に示す
前記実施例と同様の工程を経て図６に示すインダクタ素
地を形成し、これに図１に示すように接続電極及び外部
電極を形成することにより、チップ状インダクタを製造
することができる。The molded body 18 shown in FIG. 7 is used to form the inductor body shown in FIG. 6 through the same steps as those of the embodiment shown in FIG. 3, and the connecting electrode and the external electrode are formed thereon as shown in FIG. By forming it, a chip-shaped inductor can be manufactured.
【００２４】前記導線及び混練材に代えてＣｒーＮｉ；
ＣｕーＮｉ；ＣｕーＭｎなどから成る抵抗線及び例えば
アルミナ等の低誘電率の誘電性原料粉末や絶縁性原料粉
末と結合材を混練した混練材を用い、図２又は図７と図
３に示す前記製造方法と同様の工程を経ることにより図
１に示される構造の抵抗又はコイル状抵抗線を内蔵する
抵抗並びに図４及び図６に示される構造の抵抗アレイを
製造することができる。 図８は、コンデンサ・アレイ
を示す。Cr-Ni in place of the conductor and the kneading material;
A resistance wire made of Cu-Ni; Cu-Mn or the like and a kneading material obtained by kneading a binder material with a dielectric material powder or insulating material powder having a low dielectric constant such as alumina are used. By performing the same steps as the above-described manufacturing method, it is possible to manufacture the resistor having the structure shown in FIG. 1 or the resistor having the coiled resistance wire built therein and the resistor array having the structure shown in FIGS. 4 and 6. FIG. 8 shows a capacitor array.
【００２５】同図において、コンデンサ素地１９は、直
方体形状の誘電性コア２０の内部に複数の直線状導線２
1〜２4が内蔵されたもので、コンデンサ・アレイは、誘
電性コア２０の外面に該導線２1〜２4にそれぞれ対向し
て該導線２1〜２4間でそれぞれ静電容量を形成するグラ
ンド電極２１及び各導線２1〜２4の両端に接続する外部
電極４1〜４4が被着されて形成されて構成される。In the figure, the capacitor body 19 includes a plurality of linear conductors 2 inside a rectangular parallelepiped dielectric core 20.
21 to 24 in which is incorporated, the capacitor array, forms a capacitance respectively between conductor lines 2 1 to 2 4, respectively oppose the conductor lines 2 1 to 2 4 to the outer surface of the dielectric core 20 The external electrodes 4 1 to 4 4 connected to both ends of the ground electrode 21 and the conductors 2 1 to 2 4 are attached and formed.
【００２６】コンデンサ素地１９は、導線並びに例え
ば、チタン酸バリウム等の高誘電率の誘電性原料粉末及
び結合材を混練した混練材を用いて図２及び図３に示す
前記実施例と同様な工程を経ることにより製造される。
コイル状導線を内蔵するコンデンサ素地の場合には、図
７及び図３に示す前記実施例と同様な工程を経ることに
より製造される。The capacitor base 19 is made of a conductive wire and, for example, a kneading material obtained by kneading a dielectric raw material powder having a high dielectric constant such as barium titanate and a binder, and the same steps as those in the above-described embodiment shown in FIGS. 2 and 3. It is manufactured by going through.
In the case of a capacitor body containing a coil-shaped conductor, it is manufactured by going through the same steps as those of the embodiment shown in FIGS. 7 and 3.
【００２７】図９は、ＬＣフィルタを示す。FIG. 9 shows an LC filter.
【００２８】同図において、電子部品素地であるＬＣフ
ィルタ素地２２は、一体に結合されたインダクタ素地２
３とコンデンサ素地２４とから成る。このＬＣフィルタ
素地２２は、導線と、磁性原料粉末と結合材を混練した
混練材を用いて図２（又は図７）に示すような工程で直
線状（又はコイル状）導線２を内蔵するインダクタ素地
２３用の棒状成形体を作成し、導線と、誘電性原料粉末
と結合材を混練した混練材を用いて図２（又は図７）に
示すような工程で直線状（又はコイル状）導線２を内蔵
するコンデンサ素地２４用の棒状成形体を作成し、該２
個の棒状成形体をその側面の接合面に接合材を前記製造
方法と同じように塗布し加圧して接合し、次いで焼成
し、焼成した成形体をその長さ方向に沿って切断するこ
とにより製造される。ＬＣフィルタは、このＬＣフィル
タ素地２２の１側面にインダクタ素地２３の導線２及び
コンデンサ素地２４の導線２に共通に接続する外部電極
４ａを形成し、インダクタ素地２３側の他側面に外部電
極４ｂを形成し、又、中間部の周面にグランド電極４ｃ
をそれぞれ形成して製造される。図９において、外部電
極４ｂを入力側とすると、低域通過フィルタ回路が形成
される。In the figure, an LC filter substrate 22 which is an electronic component substrate is an inductor substrate 2 which is integrally connected.
3 and a capacitor body 24. This LC filter base 22 is an inductor that incorporates a linear (or coiled) conductor 2 in a process as shown in FIG. 2 (or FIG. 7) using a conductor and a kneading material obtained by kneading a magnetic raw material powder and a binder. A rod-shaped molded body for the base material 23 is prepared, and a linear wire (or a coil-shaped) conductive wire is manufactured in a process as shown in FIG. A rod-shaped molded body for the capacitor base 24 containing 2 is prepared, and
By applying a bonding material to the joint surface on the side surface of each individual rod-shaped molded body, pressing and bonding in the same manner as in the above-mentioned manufacturing method, then firing, and cutting the fired molded body along its length direction. Manufactured. In the LC filter, an external electrode 4a commonly connected to the conductor wire 2 of the inductor material 23 and the conductor wire 2 of the capacitor material 24 is formed on one side surface of the LC filter material 22, and the external electrode 4b is formed on the other side surface of the inductor material 23 side. Formed, and the ground electrode 4c on the peripheral surface of the intermediate portion.
Are manufactured respectively. In FIG. 9, when the external electrode 4b is on the input side, a low pass filter circuit is formed.
【００２９】抵抗線と、絶縁性又は低誘電率の原料粉末
と結合材を混練した混練材を用いて図２又は図７に示す
ような工程で直線状又はコイル状導線を内蔵する抵抗素
地用の棒状成形体を作成し、これを前述のように作成さ
れた図９に示すコンデンサ素地用の棒状成形体と、その
接合面において接合材を前記製造方法のように塗布し加
圧して接合し、次いで焼成し、焼成した成形体をその長
さ方向に沿って切断することによりＲＣ複合部品用の電
子部品素地が製造される。このＲＣ複合部品用の電子部
品素地の１側面に、２つの直線状導線に共通に接続する
外部電極を形成してそれを絶縁物で被覆し、電子部品素
地の他側面及び中間部の周面に図９に示すようにそれぞ
れ外部電極を形成することにより、抵抗とコンデンサが
直列接続されたスナバ回路が形成される。この回路は、
スイッチ素子、整流素子或いはトランスなどに並列に挿
入接続される。For a resistance substrate having a built-in linear or coiled conductive wire in a process as shown in FIG. 2 or 7 using a resistance wire, a kneading material obtained by kneading an insulating or low dielectric constant raw material powder and a binder. The rod-shaped molded body of No. 1 was prepared, and the rod-shaped molded body for capacitor substrate shown in FIG. Then, it is fired, and the fired molded body is cut along the lengthwise direction to manufacture an electronic component base for an RC composite component. An external electrode commonly connected to the two linear conductors is formed on one side surface of the electronic component base for this RC composite component, and the external electrode is covered with an insulator, and the other side face of the electronic component base and the peripheral surface of the intermediate portion are formed. By forming external electrodes respectively as shown in FIG. 9, a snubber circuit in which a resistor and a capacitor are connected in series is formed. This circuit is
It is inserted and connected in parallel with a switch element, a rectifying element, a transformer, or the like.
【００３０】図１０は、他のフィルタを示す。FIG. 10 shows another filter.
【００３１】同図において、フィルタ素地２２ａは、一
体に結合された２つのコンデンサ素地２４、２４から成
る。このフィルタ素地２２ａは、導線と、誘電性原料粉
末と結合材を混練した混練材を用いて図７に示すような
工程でコイル状導線２ａを内蔵するコンデンサ素地２４
用の棒状成形体を２個作成し、該２個の棒状成形体をそ
の側面の接合面に接合材を前記製造方法のように塗布し
加圧して接合し、次いで焼成し、焼成した成形体をその
長さ方向に沿って切断することにより製造される。フィ
ルタは、このフィルタ素地２２ａの１側面にコンデンサ
素地２４，２４のコイル状導線２ａ、２ａにそれぞれ接
続する外部電極４ａ，４ａを形成し、フィルタ素地２２
ａのほぼ全周面にグランド電極４ｃを形成し、又、フィ
ルタ素地２２ａの他側面にコイル状導線２ａ、２ａを相
互に接続する接続電極（図示せず）を形成することによ
り製造される。尚、図示の例ではコンデンサ素地２４の
２個でフィルタ素地を形成したが、２個以上のコンデン
サ素地２４でフィルタ素地を形成してもよいことは勿論
である。In the figure, the filter body 22a is composed of two capacitor bodies 24, 24 that are integrally connected. This filter substrate 22a is made of a conductive material and a kneading material obtained by kneading a dielectric raw material powder and a binder, and the capacitor material 24 containing the coil-shaped conductive wire 2a in a process as shown in FIG.
Two rod-shaped compacts are formed, and the two rod-shaped compacts are applied to the joint surfaces on the side surfaces thereof with a bonding material as in the above-mentioned manufacturing method, pressure-bonded, then fired, and fired Is manufactured by cutting along the length direction. The filter has external electrodes 4a and 4a connected to the coil-shaped conductors 2a and 2a of the capacitor bodies 24 and 24 on one side surface of the filter body 22a.
It is manufactured by forming the ground electrode 4c on almost the entire circumferential surface of a and forming a connection electrode (not shown) for connecting the coil-shaped conductive wires 2a, 2a to each other on the other side surface of the filter base 22a. In the illustrated example, the two filter bodies 24 form the filter body, but it is needless to say that the filter body may be formed by two or more capacitor bodies 24.
【００３２】上述した本発明実施の電子部品素地の製造
方法においては、混練材に含まれる結合材と複数の棒状
成形体を接合する接合材に同じ材料を用いたが、異なる
材料を用いてもよく、又、複数の棒状成形体を単に圧力
をかけて接合材により接着したが、圧力をかけると共に
更に例えば、４０ｋＨｚの周波数の超音波振動を加えて
接合してもよく、この方法によると、棒状成形体と接合
材との一体化が促進され、接合力が増大される。In the above-described method for manufacturing an electronic component substrate according to the present invention, the same material is used as the bonding material for bonding the plurality of rod-shaped compacts and the bonding material contained in the kneading material, but different materials may be used. Well, a plurality of rod-shaped moldings are simply bonded together by pressure to bond them together, but they may be bonded together by applying pressure and ultrasonic vibration at a frequency of 40 kHz, for example. The integration of the rod-shaped molded body and the joining material is promoted, and the joining force is increased.
【００３３】又、前記混練材に含まれる結合材として例
えばポリビニルブチラール等の熱軟化性のものを用い、
接合面に接合材を塗布しないで複数の棒状成形体を例え
ば１００℃で加熱しながら例えば１００ｋｇ／ｃｍ2の
圧力をかけて互いに接触させ、該接合面に軟化した前記
結合材を染み出させて該結合材で複数の棒状成形体を接
合させてもよい。この場合、複数の棒状成形体を接触さ
せ、加圧しないで例えば、１００℃に加熱して接合して
もよく、或いは接合面に所定の圧力を掛けると共に超音
波振動を加えて接合してもよい。又、熱軟化性の結合材
を用いた場合でも、接合面に熱軟化性の接合材を塗布
し、同様の工程を経て複数の棒状成形体を接合してもよ
いことは勿論である。As the binder contained in the kneading material, for example, a heat softening agent such as polyvinyl butyral is used.
Without applying a bonding material to the bonding surface, a plurality of rod-shaped molded bodies are heated at, for example, 100 ° C. and brought into contact with each other by applying a pressure of, for example, 100 kg / cm 2 to exude the softened bonding material to the bonding surface. A plurality of rod-shaped molded bodies may be joined with the binder. In this case, a plurality of rod-shaped molded bodies may be brought into contact with each other and heated to, for example, 100 ° C. to be joined without applying pressure, or a predetermined pressure may be applied to the joint surface and ultrasonic vibration may be applied to join them. Good. Even when a heat-softening binder is used, it is needless to say that a heat-softening bonding material may be applied to the bonding surface and a plurality of rod-shaped compacts may be bonded through the same steps.
【００３４】[0034]
【発明の効果】本発明は、上述の構成によるときは、焼
成された磁性、誘電性又は絶縁性或いは低誘電性の成形
体内に複数の直線状又はコイル状の導線又は抵抗線を内
蔵するチップ状電子部品が安価に量産することができる
という効果を有する。According to the present invention, according to the above-mentioned structure, a chip in which a plurality of linear or coiled conductive wires or resistance wires are built in a fired magnetic, dielectric or insulating or low dielectric molded body. This has the effect that the electronic components can be mass-produced at low cost.
【図１】 直線状導線を用いたチップ状インダクタの斜
視図。FIG. 1 is a perspective view of a chip-shaped inductor using a linear conductor wire.
【図２】 図１に示すチップ状インダクタに適用された
本発明実施の電子部品素地の製造方法の一工程の説明
図。FIG. 2 is an explanatory view of a step of a method of manufacturing an electronic component base according to the present invention, which is applied to the chip-shaped inductor shown in FIG.
【図３】 （Ａ）（Ｂ）（Ｃ）はそれぞれ図２に示す工
程に続いて行われる工程の説明図。3 (A), (B), and (C) are explanatory views of a process performed subsequent to the process shown in FIG.
【図４】 直線状導線を用いたチップ状インダクタ・ア
レイの斜視図。FIG. 4 is a perspective view of a chip-shaped inductor array using a linear conductor wire.
【図５】 図４に示すチップ状インダクタ・アレイの改
良例の斜視図。FIG. 5 is a perspective view of an improved example of the chip-shaped inductor array shown in FIG.
【図６】 コイル状導線を用いたインダクタ・アレイの
斜視図。FIG. 6 is a perspective view of an inductor array using a coiled wire.
【図７】 図６に示すインダクタ・アレイに適用された
本発明実施の電子部品素地の製造方法の一工程の説明
図。7 is an explanatory view of a step of a method for manufacturing an electronic component base according to the present invention, which is applied to the inductor array shown in FIG.
【図８】 直線状導線を用いたコンデンサ・アレイの斜
視図。FIG. 8 is a perspective view of a capacitor array using a linear conductor wire.
【図９】 直線状導線を用いたＬＣフィルタの斜視図。FIG. 9 is a perspective view of an LC filter using a linear conductor wire.
【図１０】コイル状導線を用いたフィルタの他例の斜視
図。FIG. 10 is a perspective view of another example of a filter using a coiled wire.
１ 磁性コア ２1〜２4 直線状導線 ２ａ1〜２ａ4 コイル状導線 ４1〜４2
外部電極 ６、６ａ、６ｂ 押出し成形機 ９
混練材 １１ 棒状成形体 １２ 接合面 １３ インダクタ素地 １８ 棒状成形
体 １９ コンデンサ素地 ２２ ＬＣフィ
ルタ素地 ２２ａ フィルタ素地1 magnetic core 2 1 to 2 4 linear conductor wire 2a 1 to 2a 4 coiled conductor wire 4 1 to 4 2
External electrodes 6, 6a, 6b Extrusion molding machine 9
Kneading material 11 Rod-shaped body 12 Bonding surface 13 Inductor base 18 Bar-shaped molded body 19 Capacitor base 22 LC filter base 22a Filter base
Claims (11)
の原料粉末と結合材を混練した混練材を送出する押出し
成形機により直線状又はコイル状の導線又は抵抗線を内
蔵する混練材から成る断面方形の複数の棒状成形体を形
成し、該複数の棒状成形体をその側面において互いに接
合し、次いで焼成し、焼成した成形体をその長さ方向に
沿って切断して複数の電子部品素地を製造することを特
徴とするチップ状電子部品素地の製造方法。1. A kneading material containing a linear or coiled conductor wire or a resistance wire by an extrusion molding machine for delivering a kneading material prepared by kneading a magnetic, dielectric, insulating or low dielectric raw material powder and a binder. A plurality of rod-shaped molded bodies each having a rectangular cross section, joined together at their side surfaces, then fired, and the fired molded bodies are cut along the lengthwise direction to form a plurality of electronic components. A method for manufacturing a chip-shaped electronic component base, which comprises manufacturing a base.
塗布することを特徴とする請求項１に記載のチップ状電
子部品素地の製造方法。2. The method for manufacturing a chip-shaped electronic component base according to claim 1, wherein a bonding material is applied to the side surfaces of the plurality of rod-shaped molded bodies.
材の溶媒を塗布することを特徴とする請求項１に記載の
チップ状電子部品素地の製造方法。3. The method for manufacturing a chip-shaped electronic component base according to claim 1, wherein the solvent of the binder is applied to the side surfaces of the plurality of rod-shaped molded bodies.
熱、加熱・加圧又は加圧・振動の内の少なくとも一つを
行うことを特徴とする請求項１乃至３のいずれかに記載
のチップ状電子部品素地の製造方法。4. The method according to claim 1, wherein at least one of heating, heating / pressurizing, or pressurizing / vibrating is performed at the time of joining the plurality of rod-shaped molded bodies. Manufacturing method of chip-shaped electronic component substrate.
いることを特徴とする請求項４に記載のチップ状電子部
品素地の製造方法。5. The method for manufacturing a chip-shaped electronic component substrate according to claim 4, wherein a heat-softening binder is used as the binder.
原料粉末と結合材を混練した混練材から成り直線状又は
コイル状導線を内蔵する成形体であることを特徴とする
請求項１乃至５のいずれかに記載のチップ状電子部品素
地の製造方法。6. The rod-shaped molded body is a molded body which is made of a kneading material obtained by kneading a magnetic raw material powder and a binder, and has a linear or coil-shaped conductive wire built therein. 6. The method for manufacturing a chip-shaped electronic component substrate according to any one of 5 above.
棒状成形体の磁性原料粉末よりも透磁率の低い磁性原料
粉末または非磁性原料粉末と結合材を混練した混練材か
ら成る薄板状成形体を介在させて相互に接合したことを
特徴とする請求項６に記載のチップ状電子部品素地の製
造方法。7. A thin plate-like member formed by kneading a plurality of rod-shaped compacts on a side surface thereof with a magnetic raw material powder or a non-magnetic raw material powder having a lower magnetic permeability than the magnetic raw material powder of the rod-shaped compacts and a binder. The method for manufacturing a chip-shaped electronic component substrate according to claim 6, wherein the molded bodies are bonded to each other.
性又は低誘電性の原料粉末と結合材を混練した混練材か
ら成り直線状又はコイル状抵抗線を内蔵する成形体であ
ることを特徴とする請求項１乃至５のいずれかに記載の
チップ状電子部品素地の製造方法。8. Each of the plurality of rod-shaped molded bodies is a molded body made of a kneading material obtained by kneading an insulating or low-dielectric raw material powder and a binder, and incorporating a linear or coiled resistance wire. The method for manufacturing a chip-shaped electronic component base according to any one of claims 1 to 5.
性原料粉末と結合材を混練した混練材から成り直線状又
はコイル状導線を内蔵する棒状成形体であることを特徴
とする請求項１乃至５のいずれかに記載のチップ状電子
部品素地の製造方法。9. The rod-shaped molded body is made of a kneading material obtained by kneading a dielectric raw material powder and a binder, and each of the plurality of bar-shaped molded bodies is a rod-shaped molded body containing a linear or coil-shaped conductor. 6. A method for manufacturing a chip-shaped electronic component substrate according to any one of 1 to 5.
末と結合材を混練した混練材から成り直線状又はコイル
状の導線を内蔵する棒状成形体と、誘電性原料粉末と結
合材を混練した混練材から成り直線状又はコイル状導線
を内蔵する棒状成形体の組み合わせであることを特徴と
する請求項１乃至５のいずれかに記載のチップ状電子部
品素地の製造方法。10. The rod-shaped molded body is made of a kneading material obtained by kneading a magnetic raw material powder and a binder, and a rod-shaped molded body containing a linear or coil-shaped conductive wire, and a dielectric raw material powder and a binder are kneaded. 6. A method for manufacturing a chip-shaped electronic component substrate according to claim 1, which is a combination of rod-shaped molded bodies made of the above kneaded material and having a linear or coil-shaped conducting wire built therein.
低誘電性の原料粉末と結合材を混練した混練材から成り
直線状又はコイル状の抵抗線を内蔵する棒状成形体と、
誘電性原料粉末と結合材を混練した混練材から成り直線
状又はコイル状導線を内蔵する棒状成形体の組み合わせ
であることを特徴とする請求項１乃至５のいずれかに記
載のチップ状電子部品素地の製造方法。11. The rod-shaped molded body is made of a kneading material obtained by kneading an insulating or low-dielectric raw material powder and a binder, and a rod-shaped molded body containing a linear or coiled resistance wire.
6. A chip-shaped electronic component according to claim 1, which is a combination of rod-shaped molded bodies made of a kneading material obtained by kneading a dielectric raw material powder and a binder, and incorporating a linear or coil-shaped conducting wire. Manufacturing method of substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5627896A JP3236949B2 (en) | 1996-03-13 | 1996-03-13 | Manufacturing method of chip-shaped electronic component substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5627896A JP3236949B2 (en) | 1996-03-13 | 1996-03-13 | Manufacturing method of chip-shaped electronic component substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09246080A true JPH09246080A (en) | 1997-09-19 |
| JP3236949B2 JP3236949B2 (en) | 2001-12-10 |
Family
ID=13022629
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5627896A Expired - Fee Related JP3236949B2 (en) | 1996-03-13 | 1996-03-13 | Manufacturing method of chip-shaped electronic component substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3236949B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000036414A (en) * | 1998-05-12 | 2000-02-02 | Murata Mfg Co Ltd | Inductor and manufacture thereof |
| WO2004010731A1 (en) * | 2002-07-19 | 2004-01-29 | Matsushita Electric Industrial Co., Ltd. | Voice coil of speaker |
| US6950006B1 (en) * | 1998-09-29 | 2005-09-27 | Murata Manufacturing Co., Ltd. | Composite inductor element |
| CN112635182A (en) * | 2020-11-23 | 2021-04-09 | 深圳市信维通信股份有限公司 | Inductor and preparation method thereof |
| JP2021077714A (en) * | 2019-11-06 | 2021-05-20 | 株式会社村田製作所 | Inductor array component |
-
1996
- 1996-03-13 JP JP5627896A patent/JP3236949B2/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000036414A (en) * | 1998-05-12 | 2000-02-02 | Murata Mfg Co Ltd | Inductor and manufacture thereof |
| US6950006B1 (en) * | 1998-09-29 | 2005-09-27 | Murata Manufacturing Co., Ltd. | Composite inductor element |
| WO2004010731A1 (en) * | 2002-07-19 | 2004-01-29 | Matsushita Electric Industrial Co., Ltd. | Voice coil of speaker |
| US7050601B2 (en) | 2002-07-19 | 2006-05-23 | Matsushita Electric Industrial Co., Ltd. | Voice coil of speaker |
| JP2021077714A (en) * | 2019-11-06 | 2021-05-20 | 株式会社村田製作所 | Inductor array component |
| CN112635182A (en) * | 2020-11-23 | 2021-04-09 | 深圳市信维通信股份有限公司 | Inductor and preparation method thereof |
| CN112635182B (en) * | 2020-11-23 | 2021-10-22 | 深圳市信维通信股份有限公司 | Inductor and preparation method thereof |
| WO2022105064A1 (en) * | 2020-11-23 | 2022-05-27 | 深圳市信维通信股份有限公司 | Inductor and preparation method therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3236949B2 (en) | 2001-12-10 |
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