JPH01313908A - Laminated electronic part and adjusting method of inductance thereof - Google Patents
Laminated electronic part and adjusting method of inductance thereofInfo
- Publication number
- JPH01313908A JPH01313908A JP14501488A JP14501488A JPH01313908A JP H01313908 A JPH01313908 A JP H01313908A JP 14501488 A JP14501488 A JP 14501488A JP 14501488 A JP14501488 A JP 14501488A JP H01313908 A JPH01313908 A JP H01313908A
- Authority
- JP
- Japan
- Prior art keywords
- laminated
- inductance
- magnetic
- magnetic material
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 17
- 239000000696 magnetic material Substances 0.000 claims abstract description 40
- 239000012212 insulator Substances 0.000 claims abstract description 12
- 239000000126 substance Substances 0.000 claims abstract 6
- 239000003990 capacitor Substances 0.000 claims description 10
- 238000010030 laminating Methods 0.000 claims description 5
- 239000004020 conductor Substances 0.000 abstract description 26
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 239000002131 composite material Substances 0.000 description 8
- 239000002003 electrode paste Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000009966 trimming Methods 0.000 description 4
- 239000002002 slurry Substances 0.000 description 3
- 229910000859 α-Fe Inorganic materials 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 238000007606 doctor blade method Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Landscapes
- Coils Or Transformers For Communication (AREA)
Abstract
Description
【発明の詳細な説明】
［Ｍ梁上の利用分野］
本発明は、磁性材積層焼結体を複数積層し、その層間に
印刷配線をスパイラル状に接続してコイルを形成した積
層型電子部品及び積層型電子部品の調整方法に関し、さ
らには、その主面上にさらに誘電体積層焼結体を複数積
層し、その層間に前記誘電体層を介して対向する電極層
を設けてコンデンサを形成した積層型電子部品及びその
インダクタンス調整方法に関する。[Detailed Description of the Invention] [Field of Application on M Beams] The present invention provides a laminated electronic component in which a plurality of laminated sintered magnetic materials are laminated and printed wiring is spirally connected between the layers to form a coil. and a method for adjusting a laminated electronic component, furthermore, a capacitor is formed by further laminating a plurality of dielectric laminated sintered bodies on the main surface thereof, and providing electrode layers facing each other with the dielectric layer interposed between the layers. The present invention relates to a multilayer electronic component and a method for adjusting its inductance.
［従来の技術］
従来、インダクタさらにはコンデンサを焼結積層体の層
間に形成してなるいわゆる積層型電子部品、は既に知ら
れている。例えば実公昭６０−５００１６号公報等によ
れば、磁性材積層焼結体を複数積層し、この積層体の層
間にコイル導体をスパイラル状に形成してインダクタと
しでいる。また、この積層型インダクタンスチップ部品
の表面上にさらに誘電体積層焼結体を複数積層し、その
層間に前記ｒｆ４電体層を介して矩形の対向電極を設け
てコンデンサを形成し、もっていわゆる積層型ＬＣ複合
部品としている。[Prior Art] Conventionally, so-called multilayer electronic components in which an inductor and furthermore a capacitor are formed between the layers of a sintered multilayer body are already known. For example, according to Japanese Utility Model Publication No. 60-50016, an inductor is produced by laminating a plurality of laminated sintered bodies of magnetic materials and forming a coil conductor in a spiral shape between the layers of the laminated body. Further, a plurality of dielectric laminated sintered bodies are further laminated on the surface of this laminated inductance chip component, and a rectangular counter electrode is provided between the layers with the RF4 electric layer interposed therebetween to form a capacitor. It is a type LC composite part.
そして、前記の積層型ＬＣ複合部品をフィルターとして
使用するに当たり、所望の共振周波数を得るためには、
前記インダクタンス部のインダクタと前記コンデンサ部
の静電容量との少なくとも何かを調整することが必要で
ある。このうち、特にそのインダクタンスを調整する手
段として、前記の実公昭６０−５００１６号公報によれ
ば、前記コイル導体を設けた磁性体層の一部を、例えば
サンドブラストトリミング装置やレーザトリミング装置
を用いて削って、いわゆる穴を形成し、これによって磁
気回路の断面積を減少させて調整することが行われてい
る。When using the above-mentioned laminated LC composite component as a filter, in order to obtain the desired resonance frequency,
It is necessary to adjust at least some of the inductor of the inductance section and the capacitance of the capacitor section. Among these methods, as a means for particularly adjusting the inductance, according to the above-mentioned Japanese Utility Model Publication No. 60-50016, a part of the magnetic layer provided with the coil conductor is removed using, for example, a sandblast trimming device or a laser trimming device. This is done by cutting to form so-called holes, thereby reducing and adjusting the cross-sectional area of the magnetic circuit.
［発明が解決しようとする課題］
しかしながら、前記の従来技術になる積層型電子部品で
は、そのインダクタンス調整のため、磁性体層の一部を
削って穴を形成する際、前記磁性材積層体の内部に形成
したコイル導体の一部が露出されてしまう場合がある。[Problems to be Solved by the Invention] However, in the multilayer electronic component according to the prior art described above, when forming a hole by cutting a part of the magnetic material layer in order to adjust the inductance, the magnetic material laminate is A part of the coil conductor formed inside may be exposed.
この場合、前記トリミング部を回路基板面に向けて前記
積層型電子部品を半田付けする際に、前記コイル導体部
分に、いわゆる半田喰われよる断線が生じたり、あるい
は、前記の露出したコイル導体部分に半田が何日して短
絡してしまい、所望のインダクタンスが得られないと言
う等の問題点が発生していた。In this case, when the multilayer electronic component is soldered with the trimming portion facing the circuit board surface, the coil conductor portion may be broken due to so-called solder bite, or the exposed coil conductor portion may be broken. Problems such as the solder short circuiting after a few days and the inability to obtain the desired inductance have occurred.
そこで、本発明は前記の従来技術における問題点に鑑み
て成されたものであり、まず、本発明の第１の目的は、
前記従来技術の様にコイル導体が露出することがなく、
かつコイル導体の断線や短絡などが生ぜず、もって正確
なインダクタンスのＰＩ整が可能な積層型電子部品を提
供することにある。Therefore, the present invention has been made in view of the problems in the prior art described above, and the first object of the present invention is to:
Unlike the prior art, the coil conductor is not exposed,
Another object of the present invention is to provide a laminated electronic component that does not cause disconnection or short-circuiting of the coil conductor and allows accurate PI adjustment of inductance.
また、本発明の第２の目的は、積層型電子部品の調整の
際、コイル導体の断線や短絡などの発生を防止しながら
、所望のインダクタンスを得ることが可能な積層型電子
部品の調整方法を提供することにある。A second object of the present invention is to provide a method for adjusting a laminated electronic component that can obtain a desired inductance while preventing disconnection or short circuits of coil conductors when adjusting the laminated electronic component. Our goal is to provide the following.
［Ｂ題を解決するための手段］
すなわち、前記本発明の第１の目的は、磁性材積層焼結
体を複数積層し、その居間に設けられた印刷配線をスパ
イラル状に接続して前記磁性材積層体の内部にコイルを
形成してインダクタンス部とし、前記インダクタンス部
の印刷配線コイルの端部にそれぞれ接続する一対の外部
電極とを備えて成る積層型電子部品において、前記磁性
材積層体の一部に予め設けられた凹部に、磁性体を含有
する絶縁物が充填されていることを特徴とする積層型電
子部品によって達成される。[Means for Solving Problem B] That is, the first object of the present invention is to laminate a plurality of laminated sintered magnetic materials and connect printed wiring provided in the living room in a spiral shape to A laminated electronic component comprising a coil formed inside the magnetic material laminate to serve as an inductance section, and a pair of external electrodes respectively connected to the ends of the printed wiring coil of the inductance section. This is achieved by a laminated electronic component characterized in that a part of a pre-provided recess is filled with an insulator containing a magnetic material.
また、前記本発明の第２の目的は、磁性材積層焼結体を
複数積層し、その居間に設けられた印刷配線をスパイラ
ル状に接続して前記磁性材積層体の内部にコイルを形成
してインダクタンス部とし、前記インダクタンス部の印
刷配線コイルの端部にそれぞれ接続する一対の外部電極
とを備えて成る積層型電子部品の調整方法にお−１で、
前記磁性材積層体の一部に凹部を設ける工程と、前記磁
性材積層体の凹部内に、磁性体を含有する絶縁物を注入
する工程と、前記磁性材積層体の凹部に注入された前記
磁性体を含有する絶縁物を固化する工程とを有するとを
特徴とする積層型電子部品の調整方法によって達成され
る。Further, the second object of the present invention is to form a coil inside the magnetic material laminate by laminating a plurality of magnetic material laminate sintered bodies and connecting printed wiring provided in the living room in a spiral shape. A method for adjusting a laminated electronic component comprising an inductance section and a pair of external electrodes respectively connected to the ends of a printed wiring coil of the inductance section,
a step of providing a recess in a part of the magnetic material laminate; a step of injecting an insulator containing a magnetic material into the recess of the magnetic material laminate; This is achieved by a method for adjusting a laminated electronic component, which is characterized by comprising a step of solidifying an insulator containing a magnetic material.
［作 用コ
前記本発明に成る積層型電子部品及びその調整方法によ
れば、磁性材積層体の一部に予め設けられた凹部に、磁
性体を含有する絶縁物を充填することによってインダク
タンスを調整することが可能となることから、磁性体層
の一部を削る必要がな（なる。従って、前記磁性体層の
内部に設けられたコイル導体が露出することなく、ジイ
ル導体の断線や短絡などが生じる事もない。また、前記
凹部に充填する絶縁物の磁性材の量及び密度等に応じて
前記インダクタンス部のインダクタンス値を増加するこ
とも出来、その調整も所望の値に正確に行うことが可能
となる。[Function] According to the multilayer electronic component and adjustment method thereof according to the present invention, inductance is increased by filling a recess previously provided in a part of the magnetic material laminate with an insulator containing a magnetic material. Since the adjustment can be made, there is no need to remove a part of the magnetic layer (therefore, the coil conductor provided inside the magnetic layer is not exposed, and disconnections and short circuits of the coil conductor can be avoided). In addition, the inductance value of the inductance part can be increased depending on the amount and density of the insulating magnetic material filled in the recess, and the adjustment can be made accurately to the desired value. becomes possible.
［実 施 例］
以下、本発明の実施例について、添付の図面を参照しな
がら説明する。[Examples] Examples of the present invention will be described below with reference to the accompanying drawings.
添付の第１図において、積層型電子部品である積層型チ
ップインダクタ１は、その製造工程を後に詳細に説明す
るが、積層された磁性材積層焼結体１１の層間に導電体
をスパイラル状に形成したインダクタンス部を有してお
り、その対向する両側面には外部電極１２．１２が設け
られている。そして、図にも明らかなように、この磁性
材積層体を構成する前記各磁性材積層焼結体１１の一部
の略中央には開口部１３が設けられ、これらを積層した
状態において前記積層体の中央部に凹部１４が形成され
る。In the attached FIG. 1, a multilayer chip inductor 1, which is a multilayer electronic component, has a manufacturing process that will be explained in detail later, but a conductor is spirally inserted between the layers of a laminated magnetic material sintered body 11. It has a formed inductance section, and external electrodes 12.12 are provided on both opposing sides thereof. As is clear from the figure, an opening 13 is provided approximately in the center of a part of each of the magnetic material laminate sintered bodies 11 constituting this magnetic material laminate, and when the magnetic material laminate is laminated, the laminate is A recess 14 is formed in the center of the body.
この様な積層型電子部品は、その後そのインダクタンス
を調整する場合、その外部電極１２．１２にインピーダ
ンスアナライザ２の測定端子を当て、前記積層型チップ
インダクタｌのインダクタンスを測定し、例えば、コン
ピュータを利用したデイスペンサー注入ｍコントローラ
３によって磁性体含有樹脂用デイスペンサー４を制御し
ながら、前記積層体の中央部に設けられた凹部１４に磁
性体含有樹脂１５を注入する。When the inductance of such a multilayer electronic component is subsequently adjusted, the measurement terminal of the impedance analyzer 2 is applied to the external electrode 12. While controlling the dispenser 4 for magnetic material-containing resin by the dispenser injection controller 3, the magnetic material-containing resin 15 is injected into the recess 14 provided in the center of the laminate.
そして、所望のインダクタンスになるまで前記磁性体含
有樹脂１５を前記凹部１４に充填した後、この積層型チ
ップインダクタ１を例えば炉の中で焼成する。After filling the recess 14 with the magnetic material-containing resin 15 until a desired inductance is achieved, the multilayer chip inductor 1 is fired, for example, in a furnace.
次に、前記積層型チップインダクタの製造方法及びその
内部構造の詳細について第２図を参照しながら説明する
。Next, a method for manufacturing the multilayer chip inductor and details of its internal structure will be described with reference to FIG. 2.
まず、フェライトを主成分とする磁性体にポリビニルブ
チラールを主成分とするバインダーを混合してスラリー
を作り、これをドクターブレード法によりシート状に成
形して複数の磁性体シート２１を作った。そして、得ら
れた前記の磁性体シート２１の内の所定の枚数（例えば
本実施例では１０枚）について、それぞれ所定の、箇所
（例えば、本実施例では前記磁性体シートの略中央部）
に外周が円形の開口部２２を形成した。First, a slurry was prepared by mixing a magnetic material mainly composed of ferrite with a binder mainly composed of polyvinyl butyral, and a plurality of magnetic sheets 21 were formed by forming the slurry into a sheet shape using a doctor blade method. Then, for a predetermined number of the obtained magnetic sheets 21 (for example, 10 sheets in this example), a predetermined location (for example, approximately the center of the magnetic sheet in this example) is applied.
An opening 22 having a circular outer periphery was formed in the opening 22 .
次に、前記１０枚の開口部２２を設けた磁性体シート２
１のうちの４枚について、それぞれのシートの一方の主
面上に、前記開口部２２を取り囲む位置に、略Ｕ字状に
Ａｇ電極ペースト２３を塗布してインダクタンス部を形
成した。Next, the magnetic sheet 2 provided with the ten openings 22 is
For four of the sheets, an inductance portion was formed by applying Ag electrode paste 23 in a substantially U-shape on one main surface of each sheet at a position surrounding the opening 22.
すなわち、まず前記４枚のシートの内の３枚について、
それぞれ所定の箇所にいわゆるスルーホールを形成する
為の貫通孔２４を設け、さらに前記貫通孔２４の内壁面
及び前記４枚のシートの一方の主面上に、ぞの一端が前
記貫通孔２４と接する様に、０字状にＡｇ電極ペースト
２３を塗布した。その後、これら磁性体シート２１を乾
燥し、いわゆるコイル導体印刷シートを得た。That is, first, for three of the four sheets,
A through hole 24 for forming a so-called through hole is provided at each predetermined location, and one end of the through hole 24 is formed on the inner wall surface of the through hole 24 and on the main surface of one of the four sheets. Ag electrode paste 23 was applied in a 0-shape so that they were in contact with each other. Thereafter, these magnetic sheets 21 were dried to obtain a so-called coil conductor printed sheet.
前記の様に０字状にＡｇ電極ペースト２３を塗布した前
記コイル導体印刷シートを４枚、それぞれのＵ字状電極
２３及び前記スルーホール導体が順次連結してスパイラ
ル状のコイル導体を形成するよう積石し、このスパイラ
ル状のコイル導体のそれぞれの端部が前記積層体の互い
に対向する端部に導出するようにした。これと共に、前
記積層体の一方の主面には前記中央部に開口部２２を設
けた磁性体シート２１を６枚、他方の主面には開口部を
設けていない磁性体シート２１を８枚積層し、こうして
得られた積層体を１２０℃、３００ ｋｇ ／ Ｏ■２
で圧着し、もってインダクタンス部を形成する磁性体シ
ート積層体を作った。この磁性体シート積層体は、前記
からも明らかなように、その一方の主面上に前記開口部
２２によって凹部１４が形成される。The four coil conductor printed sheets coated with the Ag electrode paste 23 in a 0 shape as described above are arranged so that the respective U-shaped electrodes 23 and the through-hole conductors are successively connected to form a spiral coil conductor. The spiral coil conductors were stacked together so that each end of the spiral coil conductor was led out to the mutually opposing ends of the laminate. Along with this, there are six magnetic sheets 21 having an opening 22 in the center on one main surface of the laminate, and eight magnetic sheets 21 without an opening on the other main surface. The resulting laminate was heated at 120°C and 300 kg/O2
A magnetic sheet laminate that forms an inductance section was created by pressing the two together. As is clear from the above, this magnetic sheet laminate has a recess 14 formed by the opening 22 on one main surface thereof.
この様にして得られた磁性体シート積層体の対向する一
対の端面上に、前記端面に導出されたコイル導体の端部
に接続するようにＡｇ電極ペーストを塗布し、もって外
部電極１２．１２を形成した。そして、得られた前記磁
性体シート積層体を大気中において９００℃の温度で焼
成し、その磁性体の主面に凹部１４を有する、いわゆる
積層型チップインダクタｌを得た。Ag electrode paste is applied onto a pair of opposing end faces of the magnetic sheet laminate thus obtained so as to be connected to the ends of the coil conductor led out to the end faces, thereby forming external electrodes 12.12. was formed. Then, the obtained magnetic sheet laminate was fired in the atmosphere at a temperature of 900° C. to obtain a so-called multilayer chip inductor 1 having a recess 14 on the main surface of the magnetic material.
以上の工程によって製作された積７ｚｌチップインダク
タ１は、そのインダクタンスの調整工程において、上述
のようにその一対の外部電極１２．１２にインピーダン
スアナライザ２の測定ＺＭｆ子を当て、そのインダクタ
ンス値を測定しながら、磁性体を含有する樹脂１５を前
記凹部１４に充填する。前記の実施例では、例えばフェ
ライト粉末を７０＊ｔ％含有するエポキシ系樹脂を既述
のデイスペンサー４によって前記凹部１４の内部に所望
のインダクタンスが得られるまで充填した後、この積層
型チップインダクタ１を１２０℃の温度で３０＊ｉｎ、
熱処理し、積層型チップインダクタ■を完成した。In the inductance adjustment process of the 7zl chip inductor 1 manufactured by the above process, the measurement ZMf element of the impedance analyzer 2 is applied to the pair of external electrodes 12, 12 as described above, and the inductance value is measured. At the same time, the recess 14 is filled with resin 15 containing a magnetic material. In the embodiment described above, for example, after filling the inside of the recess 14 with the epoxy resin containing 70*t% of ferrite powder using the dispenser 4 described above until the desired inductance is obtained, the laminated chip inductor 1 30*in at a temperature of 120℃,
After heat treatment, a multilayer chip inductor■ was completed.
次に、本発明になる他の実施例について以下に説明する
。この他の実施例は、前記積層型チップインダクタｌに
さらに積層型チップコンデンサ５を積層したいわゆる積
層型ＬＣｍ合部品１′である。Next, other embodiments of the present invention will be described below. Another embodiment is a so-called multilayer LCm composite component 1' in which a multilayer chip capacitor 5 is further laminated on the multilayer chip inductor l.
まず、前記第２図と同様にして磁性体シート、コイル導
体印刷シートそして磁性体シート積層体を作成し、次い
で、Ｔｉ０ａを主成分とするセラミック材料粉末にポリ
ビニルブチラールを主成分とするバインダーを混合して
スラリーを作り、これをやはりドクターブレード法によ
ってシート状に成形し、複数の誘電体シート３１を作っ
た。そして、得られた複数の前記の誘電体シート３１の
内の３枚について、それぞれのシートの一方の主面上の
所定の位置にＡｇ電極ペーストを印刷し、矩形の電極３
２を有する電極印刷誘電体シートを得た。First, a magnetic sheet, a printed coil conductor sheet, and a magnetic sheet laminate are created in the same manner as in FIG. A slurry was prepared, and this was also formed into a sheet shape by the doctor blade method to form a plurality of dielectric sheets 31. Then, for three of the obtained plurality of dielectric sheets 31, an Ag electrode paste is printed at a predetermined position on one main surface of each sheet, and a rectangular electrode 3 is printed.
An electrode-printed dielectric sheet having No. 2 was obtained.
前記Ａｇ電極ペーストを矩形に印刷した電極３２を存す
る電極印刷誘電体シート３１を３枚、それぞれの矩形電
極３２が前記誘電体シート３１を介してコンデンサを形
成するよう互いに対向させて積層し、これら対向する矩
形電極３２の一端を前記ｆａ層体の互いに対向する端面
に導出すると共に、前記電極印刷誘電体シート積面体の
両主面に、前記で得た他の誘電体シート３１をそれぞれ
２枚ずつ積層してコンデンサ部を形成した。Three electrode-printed dielectric sheets 31 each having a rectangular electrode 32 printed with the Ag electrode paste are stacked facing each other so that each rectangular electrode 32 forms a capacitor with the dielectric sheet 31 in between. One end of the opposing rectangular electrodes 32 is led out to the mutually opposing end surfaces of the fa layer, and two other dielectric sheets 31 obtained above are placed on each of both main surfaces of the electrode-printed dielectric sheet laminate. A capacitor portion was formed by laminating each layer.
そして、得られた前記コンデンサ部を構成する積層体の
上部に前記インダクタンス部を構成する積層体を積層し
、こうして得られた積層体を１２０℃、３００ｋｇ ／
ａｍ”で圧若した。さらに、前記積層体の対向するそ
れぞれの端面上に、前記端部に導出されたコイル導体の
端部及びコンデンサ矩形電極の端部をそれぞれ電気的に
接続するようにＡｇ電極ペーストを塗布し、外部電極１
２’、１２’ とし、これを大気中にお〜）で９００℃
で焼成して積層型ＬＣ複合部品１″を得た。Then, the laminate constituting the inductance section was laminated on top of the obtained laminate constituting the capacitor section, and the laminate thus obtained was heated at 120° C. and weighed at 300 kg/kg.
Further, on each of the opposing end surfaces of the laminate, Ag was applied so as to electrically connect the end of the coil conductor and the end of the capacitor rectangular electrode led out to the end. Apply electrode paste and connect external electrode 1
2' and 12', and heated it in the atmosphere at 900°C.
A laminated LC composite part 1'' was obtained by firing.
以上の様にして製作された積層型ＬＣ複合部品１′は、
その共振周波数特性の調整工程において、第４図にも示
すように、その一対の外部電極１２’、１２’にインピ
ーダンスアナライザ２の測定端子を当で、そのインダク
タンス値を測定しながら磁性体シート１１１１５を前記
凹部１４に充填する。この他の実施例では、例えばフェ
ライト粉末を７０ｗｔ％含存するエポキシ系樹脂を既述
のデイスペンサーによって前記凹部１４の内部に所望の
インダクタンスが得られるまで充填したのち、この積層
型ＬＣ複合部品１″を１２０℃で３０ｍＩｎ、熱処理し
、積層型ＬＣ複合部品１′を完成した。The laminated LC composite part 1' manufactured as described above is as follows:
In the process of adjusting the resonant frequency characteristics, as shown in FIG. is filled into the recess 14. In another embodiment, for example, after filling the inside of the recess 14 with the epoxy resin containing 70 wt% of ferrite powder using the dispenser described above until the desired inductance is obtained, the laminated LC composite component 1'' was heat-treated at 120° C. for 30 ml to complete a laminated LC composite part 1'.
前記他の実施例では、その共振周波数特性の調整をする
ため、積層型Ｌ Ｃ１Ｍ合部品１′のインダクタンス値
を調整することが示されているが、さらに、例えば前記
その主面上に一対の櫛歯状電極を対向して設けた容量調
整部をさらに設け、とのａ歯状電極の一部をトリミング
作業によって切り込み、前記インダクタンス値を調整す
ると共にその対向面積を調整してその容量値を調整して
前記共振周波数特性を調整することも可能である。In the other embodiments, it is shown that the inductance value of the multilayer L C1M composite part 1' is adjusted in order to adjust its resonant frequency characteristics. A capacitance adjusting section is further provided in which the comb-shaped electrodes are arranged facing each other, and a part of the a-toothed electrodes is cut by a trimming operation to adjust the inductance value and the opposing area to adjust the capacitance value. It is also possible to adjust the resonant frequency characteristic by adjusting.
［発明の効果コ
以上の説明からも明らかなように、本発明になる積層型
電子部品によれば、磁性材積層体の一部に予め設けられ
た凹部に、少なくとも樹脂を含有する絶縁物を充填する
ことによってそのインダクタンスを調整することが可能
となることから、磁性体層の一部を削る必要がない。こ
れによって、前記磁性体層の内部に設けられたコイル導
体の露出やコイル導体の断線、短絡等を生じる事もなく
、前記凹部に充填する樹脂含有絶縁物の磁性材のＭ及び
密度等に応じて前記インダクタンス部のインダクタンス
値を所望の値に正確に調整することが可能となり、以て
優れた特性の積層型電子部品を確実に提供することが可
能となる。[Effects of the Invention] As is clear from the above description, according to the multilayer electronic component of the present invention, an insulator containing at least a resin is applied to a recess previously provided in a part of the magnetic material laminate. Since the inductance can be adjusted by filling, there is no need to shave off part of the magnetic layer. As a result, there is no exposure of the coil conductor provided inside the magnetic material layer, disconnection of the coil conductor, short circuit, etc., and the M and density of the magnetic material of the resin-containing insulator filled in the recess are eliminated. This makes it possible to accurately adjust the inductance value of the inductance portion to a desired value, thereby making it possible to reliably provide a laminated electronic component with excellent characteristics.
第１図は本発明の実施例になる積層型電子部品の構造及
びその調整方法を示すための図、第２図は前記第１図に
示す積層型電子部品の製造工程及び内部構造の詳細を示
すための展開図、第３図は本発明の他の実施例になる積
層型電子部品の製造工程及び内部構造の詳細を示すため
の展開図、そして第４図は第３図に示す積層型電子部品
の構造及びその調整方法を示すための図である。FIG. 1 is a diagram showing the structure and adjustment method of a multilayer electronic component according to an embodiment of the present invention, and FIG. 2 shows details of the manufacturing process and internal structure of the multilayer electronic component shown in FIG. 1. 3 is a developed view showing details of the manufacturing process and internal structure of a multilayer electronic component according to another embodiment of the present invention, and FIG. 4 is a developed view showing the multilayer electronic component shown in FIG. 3. It is a figure for showing the structure of an electronic component, and its adjustment method.
Claims (3)
られた印刷配線をスパイラル状に接続して前記磁性材積
層体の内部にコイルを形成してインダクタンス部とし、
前記インダクタンス部の印刷配線コイルの端部にそれぞ
れ接続する一対の外部電極とを備えて成る積層型電子部
品において、前記磁性材積層体の一部に予め設けられた
凹部に、磁性体を含有する絶縁物が充填されていること
を特徴とする積層型電子部品。(1) A plurality of laminated sintered magnetic materials are laminated, printed wiring provided between the layers is connected in a spiral shape, and a coil is formed inside the magnetic laminated body to form an inductance portion;
A laminated electronic component comprising a pair of external electrodes each connected to an end of a printed wiring coil of the inductance section, wherein a recess provided in advance in a part of the magnetic material laminate contains a magnetic material. A laminated electronic component characterized by being filled with an insulator.
において、前記積層された磁性材積層体の表面上に、さ
らに、積層された誘電体積層焼結体の層間に設けられ、
前記誘電体層を介して対向する電極層から成るコンデン
サ部を積層したことを特徴とする積層型電子部品。(2) In the laminated electronic component according to claim 1, on the surface of the laminated magnetic material laminate, further provided between the layers of the laminated dielectric laminated sintered body,
A laminated electronic component characterized in that a capacitor portion comprising electrode layers facing each other with the dielectric layer interposed therebetween is laminated.
られた印刷配線をスパイラル状に接続して前記磁性材積
層体の内部にコイルを形成してインダクタンス部とし、
前記インダクタンス部の印刷配線コイルの端部にそれぞ
れ接続する一対の外部電極とを備えて成る積層型電子部
品のインダクタンス調整方法において、前記磁性材積層
体の一部に凹部を設ける工程と、前記磁性材積層体の凹
部内に、磁性体を含有する絶縁物を注入する工程と、前
記磁性材積層体の凹部に注入された前記磁性体を含有す
る絶縁物を固化する工程とを有するとを特徴とする積層
型電子部品の調整方法。(3) laminating a plurality of laminated sintered bodies of magnetic materials, connecting printed wiring provided between the layers in a spiral shape to form a coil inside the magnetic laminated body to form an inductance part;
A method for adjusting the inductance of a multilayer electronic component comprising a pair of external electrodes respectively connected to ends of a printed wiring coil of the inductance section, the method comprising: providing a recess in a part of the magnetic material laminate; It is characterized by comprising the steps of injecting an insulator containing a magnetic substance into the recesses of the magnetic material laminate, and solidifying the insulator containing the magnetic substance injected into the recesses of the magnetic material laminate. A method for adjusting laminated electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14501488A JPH01313908A (en) | 1988-06-13 | 1988-06-13 | Laminated electronic part and adjusting method of inductance thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14501488A JPH01313908A (en) | 1988-06-13 | 1988-06-13 | Laminated electronic part and adjusting method of inductance thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01313908A true JPH01313908A (en) | 1989-12-19 |
Family
ID=15375445
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14501488A Pending JPH01313908A (en) | 1988-06-13 | 1988-06-13 | Laminated electronic part and adjusting method of inductance thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01313908A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0476006U (en) * | 1990-11-16 | 1992-07-02 | ||
| WO1994022281A1 (en) * | 1993-03-19 | 1994-09-29 | Fujitsu Limited | Laminated circuit board |
| US5910755A (en) * | 1993-03-19 | 1999-06-08 | Fujitsu Limited | Laminate circuit board with selectable connections between wiring layers |
| JP2015216336A (en) * | 2014-05-07 | 2015-12-03 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | Chip electronic component and manufacturing method for the same |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62134227A (en) * | 1985-12-06 | 1987-06-17 | Toyoda Gosei Co Ltd | Manufacturing of mole for decoration and protection |
-
1988
- 1988-06-13 JP JP14501488A patent/JPH01313908A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62134227A (en) * | 1985-12-06 | 1987-06-17 | Toyoda Gosei Co Ltd | Manufacturing of mole for decoration and protection |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0476006U (en) * | 1990-11-16 | 1992-07-02 | ||
| WO1994022281A1 (en) * | 1993-03-19 | 1994-09-29 | Fujitsu Limited | Laminated circuit board |
| US5910755A (en) * | 1993-03-19 | 1999-06-08 | Fujitsu Limited | Laminate circuit board with selectable connections between wiring layers |
| JP2015216336A (en) * | 2014-05-07 | 2015-12-03 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | Chip electronic component and manufacturing method for the same |
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