JPH09245920A - Ic pressing mechanism of ic socket - Google Patents
Ic pressing mechanism of ic socketInfo
- Publication number
- JPH09245920A JPH09245920A JP7523096A JP7523096A JPH09245920A JP H09245920 A JPH09245920 A JP H09245920A JP 7523096 A JP7523096 A JP 7523096A JP 7523096 A JP7523096 A JP 7523096A JP H09245920 A JPH09245920 A JP H09245920A
- Authority
- JP
- Japan
- Prior art keywords
- socket
- terminal
- pressing
- contact
- actuator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Connecting Device With Holders (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明はＩＣをソケットに
接触させるに際し、ＩＣを押圧して接触を安定にするＩ
Ｃ押え機構に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention, when an IC is contacted with a socket, presses the IC to stabilize the contact.
C Pressing mechanism
【０００２】[0002]
【従来の技術】ＩＣ本体の下面から多数のＩＣ端子を剣
山状に突出して成るＰＧＡ形ＩＣにおいては、ソケット
本体の上面に沿い横動する移動板によってＩＣ端子とソ
ケットコンタクトとの接触及び接触解除を図る方法が採
られている。このＰＧＡ形ＩＣソケットにおいては、Ｉ
Ｃ端子をコンタクトで挟持しＩＣを拘束している。2. Description of the Related Art In a PGA type IC having a large number of IC terminals projecting from the lower surface of an IC body in the shape of a sword, contact and release of the contact between the IC terminal and the socket contact are made by a moving plate that moves along the upper surface of the socket body. Has been adopted. In this PGA type IC socket, I
The C terminal is clamped by the contact to hold the IC.
【０００３】又ＩＣ端子をＩＣ本体の対向する各側面か
ら突出して成るＩＣパッケージとしては、ＩＣ端子を二
段曲げして成るガルウィング形ＩＣ端子を持つガルウィ
ング形ＩＣパッケージ、又はＩＣ端子を水平に突出して
成るフラット形ＩＣパッケージ、或いはＩＣ端子をＪ形
に突出して成るＪベンド形ＩＣパッケージ等が存する。The IC package formed by projecting the IC terminals from the opposite side surfaces of the IC body is a gull-wing type IC package having a gull-wing type IC terminal formed by bending the IC terminal in two stages, or the IC terminal is projected horizontally. There is a flat type IC package formed by the above, or a J bend type IC package formed by projecting IC terminals in a J shape.
【０００４】これらＩＣパッケージ用のソケットにおい
ては該ソケットに保有させたコンタクトにＩＣ端子を載
接すると共に、ソケット本体に開閉可（回動可）に軸支
した押えカバーを閉合し、このカバーにロックレバーを
係止することにより、ＩＣ端子又はＩＣ本体を押圧し上
記ＩＣ端子とコンタクトとの接圧を確保する方法を採っ
ている。In these IC package sockets, an IC terminal is mounted on a contact held in the socket, and a holding cover pivotally supported to be openable / closable (rotatably) is closed on the socket body and locked to the cover. By locking the lever, the IC terminal or the IC body is pressed to secure the contact pressure between the IC terminal and the contact.
【０００５】又多数のＩＣ端子をＩＣ本体の下面に密着
配置した導電箔で形成したリードレス形ＩＣやＩＣ本体
の下面より半球形に突出したバンプによりＩＣ端子を形
成したＢＧＡ形ＩＣ等においても、上記と同様、ソケッ
ト本体に開閉可に軸支した押えカバーを閉合し、ロック
レバーを係止することによりＩＣ本体を押圧し上記ＩＣ
端子とコンタクトとの接圧を確保する方法を採ってい
る。Also, in a leadless type IC formed of a conductive foil in which a large number of IC terminals are closely arranged on the lower surface of the IC body, and a BGA type IC in which the IC terminals are formed by bumps protruding in a hemispherical shape from the lower surface of the IC body. Similarly to the above, the IC cover is pressed by closing the presser cover that is pivotally supported on the socket body, and locking the lock lever to press the IC body.
The method to secure the contact pressure between the terminal and the contact is adopted.
【０００６】[0006]
【発明が解決しようとする課題】上記の通りＰＧＡ形Ｉ
Ｃのソケットにおいては、ＩＣ端子をコンタクトにより
挟持しているが、外的衝撃により、この挟持摩擦力に抗
してＩＣの浮上りを生じＩＣ端子の表面を損傷する恐れ
や、ＩＣを傾いた不正常な姿勢で移動板上に搭載しＩＣ
端子とコンタクトとの接触を不安定にする問題点を有し
ている。As described above, PGA type I
In the socket of C, the IC terminal is sandwiched by the contacts, but due to an external impact, the IC may be lifted against the sandwiching frictional force to damage the surface of the IC terminal or the IC may be tilted. IC mounted on a moving board in an abnormal posture
There is a problem that the contact between the terminal and the contact becomes unstable.
【０００７】又ＰＧＡ形ＩＣにおいてはＩＣ本体の下面
に密着配置した接地用端子にソケット本体に設けた接地
用コンタクトを加圧接触し静電気を放流する方策が良く
採られているが、この場合には接地用コンタクトにより
ＩＣ本体を浮上らせんとする突上力がＩＣ本体に加わ
り、コンタクトとの接触を不安定にする問題を招来す
る。Further, in the PGA type IC, it is often adopted to discharge the static electricity by pressurizing the grounding contact provided on the socket body to the grounding terminal closely arranged on the lower surface of the IC body. Causes a problem that a thrust force that causes the IC body to float is applied to the IC body by the grounding contact, and the contact with the contact becomes unstable.
【０００８】以上の問題はガルウィング形ＩＣやフラッ
ト形ＩＣ、或いはＢＧＡ形ＩＣ等においても同様であ
る。The above problems also apply to gull-wing type ICs, flat type ICs, BGA type ICs and the like.
【０００９】殊に、これらＩＣ端子をコンタクトに載せ
接触を得る形式のガルウィング形ＩＣ用ソケット等にお
いては、ＩＣの浮上りは直ちに接触瑕疵を生ずる原因と
なる。又従来はこのＩＣの浮動を防止する手段として、
ソケット本体の一端にＩＣ押えカバーを回動可に軸支
し、このＩＣ押えカバーをソケット本体に対し閉合し、
これにソケット本体に設けたロックレバーを係合する機
構が採られているが、この押えカバーは回動軌跡上にお
いてＩＣを押圧するので、押えカバーの軸支側のＩＣ端
子と軸支側から離間したＩＣ端子に対する押圧タイミン
グにずれを生じがちであり、これによりＩＣが傾いた
り、ジャンプ或いは横ずれを来しコンタクトとＩＣ端子
の接触を損なう問題点を有している。Particularly, in a gull wing type IC socket of the type in which these IC terminals are mounted on a contact to make contact, the floating of the IC immediately causes a contact flaw. Further, conventionally, as a means for preventing the floating of this IC,
An IC pressing cover is rotatably supported on one end of the socket body, and the IC pressing cover is closed to the socket body.
A mechanism for engaging a lock lever provided in the socket body is adopted for this, but since the presser cover presses the IC on the rotation trajectory, the IC terminal on the shaft support side of the presser cover and the shaft support side There is a tendency that the pressing timings of the separated IC terminals tend to be deviated, which causes the IC to tilt, jump or laterally deviate, and impair the contact between the contact and the IC terminal.
【００１０】更にこのＩＣ押えカバーの閉合状態を保持
するためにソケット本体にロックレバーを付設せねばな
らない。又ＩＣの着脱の都度上記ソケット本体に回動可
に軸支した押えカバーとロックレバーの双方を回動操作
せねばならず、加えて単純に垂直に上下動するロボット
で開閉操作することができず、ＩＣ着脱の自動化を図る
上で支障となっている。Further, a lock lever must be attached to the socket body in order to maintain the closed state of the IC pressing cover. In addition, each time the IC is attached or detached, both the pressing cover and the lock lever, which are rotatably supported by the socket body, have to be rotated, and in addition, the robot can be simply opened and closed vertically. However, this is a hindrance to the automation of IC attachment / detachment.
【００１１】本発明は上記の如き問題点を解決するＩＣ
ソケットにおけるＩＣ押え機構を提供する。The present invention is an IC which solves the above problems.
An IC pressing mechanism for a socket is provided.
【００１２】[0012]
【課題を解決するための手段】ＰＧＡ形ＩＣ用のソケッ
トにおいては、該ＰＧＡ形ＩＣの本体の一端上面及び他
端上面を押圧する少なくとも一対の回動ラッチレバーを
設けると共に、この回動ラッチレバーを上記押圧方向に
付勢するバネ手段を設けてＩＣ端子とコンタクトの接触
を保持し、この回動ラッチレバーを上下動可に設けたア
クチュエーターの下動時に押圧解除方向へ回動せしめて
ＰＧＡ形ＩＣの装脱を行なうように構成する。In a socket for a PGA type IC, at least a pair of rotary latch levers for pressing the upper surface of one end and the upper surface of the other end of the body of the PGA type IC are provided, and the rotary latch levers are provided. Is provided with a spring means for urging the contact in the contact direction between the IC terminal and the contact, and the pivot latch lever is pivoted in the depression release direction when the actuator provided for up and down movement is moved downward to generate the PGA type. The IC is configured to be loaded and unloaded.
【００１３】又ガルウィング形ＩＣや、フラット形ＩＣ
や、Ｊベンド形ＩＣにおいてはＩＣ本体の対向する各側
面から突出するＩＣ端子をソケットのコンタクトに載接
しつつ、上記一側面から突出するＩＣ端子の上面と他側
面から突出するＩＣ端子の上面とを押圧する少なくとも
一対の回動ラッチレバーを設け、この回動ラッチレバー
を上記押圧方向に付勢するバネ手段を設けて上記ＩＣ端
子とコンタクトの接触を保持し、この回動ラッチレバー
を上下動可に設けたアクチュエーターの下動時に押圧解
除方向へ回動せしめて上記ＩＣの装脱を行なうように構
成する。A gull wing type IC or a flat type IC
Alternatively, in the J-bend type IC, the IC terminals projecting from the opposite side surfaces of the IC body are mounted on the socket contacts while the upper surface of the IC terminal projecting from the one side surface and the upper surface of the IC terminal projecting from the other side surface. Is provided with at least a pair of rotation latch levers, and spring means for urging the rotation latch levers in the pressing direction is provided to maintain contact between the IC terminal and the contact, and the rotation latch lever is moved up and down. When the actuator that is provided is moved downward, it is rotated in the pressing release direction to mount and dismount the IC.
【００１４】又ＩＣ本体の下面に多数のＩＣ端子を配置
したリードレス形ＩＣやＢＧＡ形ＩＣにおいては、該Ｉ
Ｃ端子をソケット本体のコンタクトに載接しつつ、該ソ
ケット本体の一端部上面と他端部上面とを下方へ向け押
圧する少なくとも一対の回動ラッチレバーを設けると共
に、該回動ラッチレバーを押圧方向に付勢するバネ手段
を設けて上記ＩＣ端子とコンタクトの接触を保持し、こ
の回動ラッチレバーをソケット本体の上位に上下動可に
設けたアクチュエーターの下動により押圧解除方向へ回
動せしめて上記ＩＣ装脱を行なうように構成する。In a leadless type IC or BGA type IC in which a large number of IC terminals are arranged on the lower surface of the IC body, the I
While mounting the C terminal on the contact of the socket body, at least a pair of rotating latch levers for pressing the upper surface of one end portion and the upper surface of the other end portion of the socket body downward are provided, and the rotating latch lever is pressed in the pressing direction. A spring means for urging the contact is held to hold the contact between the IC terminal and the contact, and the rotation latch lever is rotated in the pressing release direction by the downward movement of an actuator provided above the socket body and movable up and down. The IC is configured to be attached and detached.
【００１５】本発明によれば上記一対の回動ラッチレバ
ーがバネ手段によって押圧方向へ回動されつつＩＣ本体
の左右側方へ突出したＩＣ端子の上面又はＩＣ本体の上
面の両端を下方へ押圧してＩＣの浮動を抑止し、コンタ
クトとＩＣ端子の接触を確保することができると共に、
アクチュエーターの下降操作により上記回動ラッチレバ
ーを押圧解除方向に回動しＩＣの着脱が容易に行なえ
る。According to the present invention, the pair of rotary latch levers are rotated in the pressing direction by the spring means, and the upper surface of the IC terminal or both ends of the upper surface of the IC main body protruding laterally of the IC main body are pressed downward. The IC can be prevented from floating and the contact between the contact and the IC terminal can be ensured.
By lowering the actuator, the rotary latch lever is rotated in the pressing release direction, and the IC can be easily attached and detached.
【００１６】又単純に上下動するロボットをアクチュエ
ーターに作用させることにより一対の回動ラッチレバー
を容易に開閉でき、ＩＣ着脱の自動化に有効に資するこ
とができる。更に一対の回動ラッチレバーをＩＣ端子や
ＩＣ本体に対し同時に押圧力を与えるようにすることが
でき、押圧タイミングのずれによるＩＣのずれ等を有効
に防止できる。Further, the pair of rotary latch levers can be easily opened and closed by simply causing the actuator that moves up and down to act on the actuator, which can effectively contribute to automation of IC attachment / detachment. Further, the pair of rotary latch levers can simultaneously apply the pressing force to the IC terminal and the IC body, and the deviation of the IC due to the deviation of the pressing timing can be effectively prevented.
【００１７】[0017]
第１実施形態例（図１乃至図９参照） この例はＰＧＡ形ＩＣ用のＩＣソケットにおけるＩＣ押
え機構を示している。ＰＧＡ形ＩＣは前記の通り、ＩＣ
本体１の下面からピン端子から成る多数のＩＣ端子２を
突出している。First Embodiment Example (see FIGS. 1 to 9) This example shows an IC pressing mechanism in an IC socket for a PGA type IC. As mentioned above, PGA type IC is IC
A large number of IC terminals 2 formed of pin terminals are projected from the lower surface of the main body 1.
【００１８】他方ＩＣソケットはソケット本体３に上記
ＩＣ端子２に対応する多数のコンタクト４を保有すると
共に、ソケット本体３の上面に沿い横動可能な移動板５
を備えている。この移動板５には上記ＩＣ端子２及びコ
ンタクト４に対応する多数の貫通孔６が設けられてお
り、上記ＩＣ本体１が移動板５の上に搭載された時、Ｉ
Ｃ端子２は上記貫通孔６を貫通してコンタクト４との接
触に供される。On the other hand, the IC socket has a large number of contacts 4 corresponding to the IC terminals 2 in the socket body 3, and a movable plate 5 which can move laterally along the upper surface of the socket body 3.
It has. The moving plate 5 is provided with a large number of through holes 6 corresponding to the IC terminals 2 and the contacts 4, and when the IC body 1 is mounted on the moving plate 5, I
The C terminal 2 penetrates the through hole 6 and is used for contact with the contact 4.
【００１９】上記移動板５はソケット本体３の上面に沿
う一方向への横動によりコンタクト４の接片を開状態に
し、この開状態においてＩＣを移動板５上に搭載し、Ｉ
Ｃ本体１を移動板５の上面に支持すると共にＩＣ端子２
を移動板５に設けた貫通孔６を通しコンタクト４の接片
間へ無負荷挿入する。The moving plate 5 laterally moves in one direction along the upper surface of the socket body 3 to open the contact piece of the contact 4, and in this open state, the IC is mounted on the moving plate 5 and I
The C body 1 is supported on the upper surface of the moving plate 5 and the IC terminal 2
Through the through-hole 6 provided in the moving plate 5 and inserting it without load between the contact pieces of the contact 4.
【００２０】次にこの移動板５を他方向へ横動すること
によりコンタクト４の接片が閉状態になり、ＩＣ端子２
を弾力的に挟持する。例えば図３等に示すように、上記
コンタクト４の接片対の一方を移動板５に係止させて置
けば、移動板５の横動によってコンタクト４を開閉する
ことができる。Next, by laterally moving the moving plate 5 in the other direction, the contact piece of the contact 4 is closed, and the IC terminal 2 is closed.
Elastically clamps. For example, as shown in FIG. 3 and the like, if one of the contact piece pairs of the contact 4 is locked and placed on the moving plate 5, the contact 4 can be opened and closed by the lateral movement of the moving plate 5.
【００２１】この第１実施形態例においては、移動板５
がコンタクト４の接片と係合してこれを開閉する場合を
示しているが、他のＰＧＡ形ＩＣパッケージ用のソケッ
ト形式として、ＩＣ端子２を移動板５の貫通孔６を通し
てコンタクト４の側部に無負荷挿入し、次で移動板５を
横動することによって上記ＩＣ端子２を上記挿入位置か
ら移動板５と一緒に横動してコンタクト４の接片間に弾
力的に強制介入する方式のソケットが既知である。本発
明は上記何れの形式のソケットにも実施できる。In the first embodiment, the moving plate 5
Shows the case of engaging with the contact piece of the contact 4 to open and close the contact piece, but as another socket type for the PGA type IC package, the IC terminal 2 is passed through the through hole 6 of the moving plate 5 to the contact 4 side. By inserting the device into the contact portion without load, and then moving the moving plate 5 laterally, the IC terminal 2 is moved laterally together with the moving plate 5 from the insertion position to forcefully intervene between the contact pieces of the contacts 4. Scheme sockets are known. The present invention can be implemented in any type of socket described above.
【００２２】上記移動板５は工具を用いて横動させる
か、又は図２Ａ，Ｂに示す操作レバー７を用いる。図示
の操作レバー７は基端部を移動板５の側面とソケット本
体３の側面とに夫々軸９，１０によって枢支し、先端部
に移動板５の上位に上下動可に設けたアクチュエーター
８によって押圧される受圧端１１を形成している。The moving plate 5 is laterally moved by using a tool, or an operating lever 7 shown in FIGS. 2A and 2B is used. The operation lever 7 shown in the drawing has a base end pivotally supported on the side surface of the movable plate 5 and the side surface of the socket body 3 by shafts 9 and 10, respectively, and an actuator 8 provided at the tip end thereof above the movable plate 5 so as to be vertically movable. The pressure receiving end 11 is formed by being pressed by.
【００２３】上記操作レバー７はソケット本体３の一側
面に二本配置し、各レバーをソケット本体３と移動板５
の一端と他端に夫々軸支し、該軸支部から互いに対向方
向に延ばして先端部を交叉させ、受圧部１１を近接して
配置している。Two operation levers 7 are arranged on one side surface of the socket body 3, and each lever is arranged on the socket body 3 and the movable plate 5.
Are axially supported at one end and the other end, respectively, and extend from the axially supporting portions in mutually opposite directions so that the front ends cross each other, and the pressure receiving portions 11 are arranged in close proximity.
【００２４】この受圧端１１はアクチュエター８を図２
Ａの状態から図２Ｂの状態に下降することにより押下げ
られ、これにより操作レバー７が下方へ回動し、この回
動により軸１０が軸９を中心にして回動し、この軸１０
の回動により移動板５を一方向へ横動させ、前記ＩＣ端
子２とコンタクト４の接触解除又は接触が図られる。This pressure receiving end 11 is shown in FIG.
It is pushed down by being lowered from the state of A to the state of FIG. 2B, whereby the operation lever 7 is rotated downward, and this rotation causes the shaft 10 to rotate about the shaft 9,
The moving plate 5 is laterally moved in one direction by the rotation of, and contact release or contact between the IC terminal 2 and the contact 4 is achieved.
【００２５】上記アクチュエーター８は移動板５と対向
する中央開口２５を有する方形枠体によって形成され、
この枠フレームによって上記操作レバー７の受圧部１１
を押圧する加圧部１２を形成している。The actuator 8 is formed by a rectangular frame body having a central opening 25 facing the moving plate 5,
With this frame, the pressure receiving portion 11 of the operating lever 7
The pressurizing portion 12 for pressing is formed.
【００２６】上記ソケットにＩＣ本体１の一端部上面と
他端部上面とを下方へ向け押圧する少なくとも一対の回
動レバーから成るラッチレバー１３を具備させる。The socket is provided with a latch lever 13 composed of at least a pair of rotating levers for pressing the upper surface of one end and the upper surface of the other end of the IC body 1 downward.
【００２７】上記各回動ラッチレバー１３は図１又は図
３等に示すように、移動板５の一端部と他端部に夫々軸
１４により移動板５の上面に接近する方向（前方）と離
間する方向（後方）とに回動できるように枢支する。一
方の回動ラッチレバー１３は前方へ回動した時に移動板
５上に搭載されたＩＣ本体１の上面一端を下方へ押圧
し、他方の回動ラッチレバー１３は前方へ回動した時に
ＩＣ本体１の上面他端を下方へ押圧する。As shown in FIG. 1 or FIG. 3, each of the rotary latch levers 13 is separated from the direction (front) approaching the upper surface of the movable plate 5 by the shafts 14 at one end and the other end of the movable plate 5, respectively. It is pivotally supported so that it can rotate in the direction (backward). When one of the rotation latch levers 13 is rotated forward, one end of the upper surface of the IC body 1 mounted on the moving plate 5 is pressed downward, and the other rotation latch lever 13 is rotated when the IC body 1 is rotated forward. The other end of the upper surface of 1 is pressed downward.
【００２８】即ち、各回動ラッチレバー１３は互いに対
向方向に回動しＩＣ本体１の上面の両端を同時に下方へ
向け押圧する。That is, the rotary latch levers 13 rotate in opposite directions to press both ends of the upper surface of the IC body 1 downward at the same time.
【００２９】上記回動ラッチレバー１３に押圧力を付与
するため、各回動ラッチレバー１３を押圧方向に付勢す
るバネ手段１５を設ける。このバネ手段１５としては例
えば、図１，図３等に示す如き、軸１４に装着された二
又バネを用いる。この二又バネは金属線材から成り、回
動ラッチレバー１３の軸１４に巻装されたコイル部１６
とこのコイル部１６の両端から同方向に延ばされた弾性
アーム１７を有し、このアーム１７の端部を移動板５に
係止すると共に、図１に示すように上記コイル部１６の
中央部の線材部分で回動ラッチレバー１３に対する加圧
バネ部１８を形成している。In order to apply a pressing force to the rotary latch levers 13, spring means 15 for urging each rotary latch lever 13 in the pressing direction is provided. As the spring means 15, for example, a bifurcated spring mounted on the shaft 14 as shown in FIGS. 1 and 3 is used. The bifurcated spring is made of a metal wire and has a coil portion 16 wound around the shaft 14 of the rotary latch lever 13.
And an elastic arm 17 extending from both ends of the coil portion 16 in the same direction, the end portion of the arm 17 is locked to the moving plate 5, and the center of the coil portion 16 is formed as shown in FIG. A pressure spring portion 18 for the rotary latch lever 13 is formed by the wire rod portion of the portion.
【００３０】上記回動ラッチレバー１３はその自由端に
軸１４を中心に回動する押え部２０を有し、この押え部
２０を移動板５の辺に沿い延ばし、その両端に軸継手２
１を設け、該各軸継手２１の外側に移動板５と一体の軸
継手２２を設け、軸１４を上記軸継手２１，２２に挿通
して、軸継手２１間の軸延在部分に上記二又バネのコイ
ル部１６を巻装し、このコイル部１６の中央部に上記加
圧バネ部１８を形成する。The rotary latch lever 13 has a holding portion 20 at its free end that rotates about the shaft 14, and extends along the side of the moving plate 5 and has the shaft coupling 2 at both ends thereof.
1 is provided, a shaft joint 22 integral with the moving plate 5 is provided outside each of the shaft joints 21, and the shaft 14 is inserted into the shaft joints 21 and 22. Further, the coil portion 16 of the spring is wound, and the pressure spring portion 18 is formed in the central portion of the coil portion 16.
【００３１】上記各回動ラッチレバー１３は上記アクチ
ュエーター８を下降操作することにより、バネ手段１５
に抗して押圧解除方向（後方）へ回動され、ＩＣに対す
る拘束を解く。The rotating latch levers 13 are moved to the spring means 15 by lowering the actuator 8.
It is rotated in the pressing release direction (rearward) against the force to release the constraint on the IC.
【００３２】上記アクチュエーター８は前記の通りＩＣ
を装脱する中央開口２５を有し、該中央開口２５を画成
する枠フレームの縁部下面に上記回動ラッチレバー１３
を押圧解除方向へ回動せしめる加圧部２３を形成する。
従ってアクチュエーター８は移動板５を横動させるため
の操作レバー７と、ＩＣを押えるための回動ラッチレバ
ー１３の双方に作用する。The actuator 8 is an IC as described above.
Has a central opening 25 for mounting and dismounting, and the rotary latch lever 13 is provided on the lower surface of the edge portion of the frame frame defining the central opening 25.
The pressurizing portion 23 for rotating in the pressing release direction is formed.
Therefore, the actuator 8 acts on both the operation lever 7 for moving the moving plate 5 laterally and the rotary latch lever 13 for pressing the IC.
【００３３】以下図３乃至図９に基づいてアクチュエー
ター８と回動ラッチレバー１３と移動板５の動作につい
て説明する。The operation of the actuator 8, the rotary latch lever 13, and the moving plate 5 will be described below with reference to FIGS.
【００３４】図３乃至図６はアクチュエーター８を下降
操作した時の回動ラッチレバー１３と移動板５の動作状
態を示している。図示のように、アクチュエーター８を
下降すると、加圧部２３が回動ラッチレバー１３の後端
の受圧部２４を押圧し、回動ラッチレバー１３をバネ手
段１５に抗し後方へ回動しＩＣの押圧解除状態を形成す
る。3 to 6 show the operating states of the rotary latch lever 13 and the moving plate 5 when the actuator 8 is lowered. As shown in the drawing, when the actuator 8 is lowered, the pressing portion 23 presses the pressure receiving portion 24 at the rear end of the rotation latch lever 13, and the rotation latch lever 13 is rotated backward against the spring means 15 and IC To release the pressed state.
【００３５】上記回動ラッチレバー１３の受圧部２４は
軸１４の後方に存し、押え部２０は軸１４の前方に存す
る。回動ラッチレバー１３はアクチュエーター８の中央
開口２５の内域に配され、受圧部２４を加圧部２３の直
下に対向するように配置しており、アクチュエーター８
を下限まで下降した時、回動ラッチレバー１３は図６に
示すように中央開口２５内に略直立状態に回動し、押圧
解除状態を形成する。同時にアクチュエーター８の下降
により回動操作レバー７が下方へ回動され、移動板５が
一方向へ横動してコンタクト４の接片を開状態にする。
即ち中央開口２５を画成する枠フレームの縁部で回動ラ
ッチレバー１３背面の受圧部２４を押圧し、押え部２０
を中央開口２５内へ逃がしながら、回動せしめる構成で
ある。The pressure receiving portion 24 of the rotary latch lever 13 is located behind the shaft 14, and the holding portion 20 is located in front of the shaft 14. The rotary latch lever 13 is arranged in the inner area of the central opening 25 of the actuator 8, and the pressure receiving portion 24 is arranged directly below the pressurizing portion 23 so as to face the actuator 8.
When is lowered to the lower limit, the rotation latch lever 13 is rotated in the central opening 25 in a substantially upright state as shown in FIG. At the same time, the lowering of the actuator 8 causes the turning operation lever 7 to turn downward, the moving plate 5 laterally moves in one direction, and the contact piece of the contact 4 is opened.
That is, the pressure receiving portion 24 on the rear surface of the rotary latch lever 13 is pressed by the edge of the frame defining the central opening 25, and the pressing portion 20 is pressed.
It is configured so as to rotate while letting it escape into the central opening 25.
【００３６】上記回動ラッチレバー１３の押圧解除状態
において、ＩＣを中央開口２５を通し移動板上に搭載す
る。前記のとおりＩＣ本体１は移動板５の上面に支承さ
れ、ＩＣ端子２は貫通孔６を通して開状態にあるコンタ
クト４の接片間へ無負荷挿入される。When the rotation latch lever 13 is released, the IC is mounted on the movable plate through the central opening 25. As described above, the IC body 1 is supported on the upper surface of the moving plate 5, and the IC terminal 2 is inserted through the through hole 6 between the contact pieces of the contacts 4 in the open state without load.
【００３７】図６乃至図９に示すように、上記ＩＣ搭載
状態においてアクチュエーター８への押下力を解除する
と、移動板５はコンタクト４の接片の弾性復元力により
他方向へ横動してコンタクト４によるＩＣ端子２の挟持
状態を形成すると同時に、この移動板５の横動に追随し
て回動操作レバー７を上方へ復帰させ、この回動操作レ
バー７の上方への回動に伴ない、レバー７の受圧端１１
がアクチュエーター８の加圧部１２を押上げてアクチュ
エーターを上方へ復帰せしめる。As shown in FIGS. 6 to 9, when the pressing force to the actuator 8 is released in the IC mounted state, the moving plate 5 laterally moves in the other direction due to the elastic restoring force of the contact piece of the contact 4 and contacts. At the same time when the IC terminal 2 is sandwiched by 4, the turning operation lever 7 is returned upward following the lateral movement of the moving plate 5, and the turning operation lever 7 is turned upward. , Pressure receiving end 11 of lever 7
Pushes up the pressing portion 12 of the actuator 8 to return the actuator upward.
【００３８】又アクチュエーター８の上昇によって、図
８，図９に示すように回動ラッチレバー１３はバネ手段
１５の弾力に従い前方へ回動しＩＣ本体１の上面一端と
他端を下方向へ押圧する。この押圧によってＩＣの浮上
りを阻止し、ＩＣ端子２とコンタクト４との接触状態を
確保する。Further, as the actuator 8 is raised, the rotary latch lever 13 is pivoted forward in accordance with the elastic force of the spring means 15 as shown in FIGS. 8 and 9, and one end and the other end of the upper surface of the IC body 1 are pressed downward. To do. This pressing prevents the IC from rising and secures the contact state between the IC terminal 2 and the contact 4.
【００３９】図１においては、回動ラッチレバー１３を
移動板５の対向する端縁に取付けた場合を示したが、こ
のレバー１３をソケット本体３に取付けることができ
る。ソケット本体３の両端側部に、図３に仮想線で示す
如き軸継手２２′を設け、この軸継手２２′に軸１４を
支持し、この軸１４に回動ラッチレバー１３を枢支す
る。Although FIG. 1 shows the case where the rotary latch lever 13 is attached to the opposite edges of the movable plate 5, the lever 13 can be attached to the socket body 3. Shaft joints 22 'as shown by phantom lines in FIG. 3 are provided on both ends of the socket body 3, and the shaft 14 is supported by the shaft joints 22', and the rotary latch lever 13 is pivotally supported on the shaft 14.
【００４０】回動ラッチレバー１３を移動板５に付設し
た場合には、同レバー１３はＩＣ本体１を押圧した状態
のまま移動板５と一緒に横動するので移動板５の移動に
際しレバー１３の押え部２０がＩＣ本体１の上面を摺動
することがない。又同レバー１３をソケット本体３に付
設した場合には移動板５が単独で横動する。When the rotary latch lever 13 is attached to the movable plate 5, the lever 13 moves laterally together with the movable plate 5 while the IC body 1 is being pressed, so that the lever 13 moves when the movable plate 5 moves. The pressing portion 20 of the above does not slide on the upper surface of the IC body 1. Further, when the lever 13 is attached to the socket body 3, the moving plate 5 independently moves laterally.
【００４１】又本発明は上記回動ラッチレバー１３を左
右に二個設ける場合の他、移動板５の前後端縁に沿い二
個、左右端縁に沿い二個、計四個のレバー１３を設け、
これらをアクチュエーター８によって同時に開閉する場
合を含んでいる。Further, in the present invention, in addition to the case where the above-mentioned two rotary latch levers 13 are provided on the left and right, a total of four levers 13 are provided, two along the front and rear end edges of the movable plate 5, and two along the left and right end edges. Provided,
It includes the case where these are simultaneously opened and closed by the actuator 8.
【００４２】第２実施形態例（図１０乃至図１６参照）
この例はＩＣ本体１の対向する側面から多数のＩＣ端子
２を突出して成るＩＣと、このＩＣを搭載せるソケット
においてＩＣ押え機構を形成した場合を示している。Second embodiment (see FIGS. 10 to 16)
This example shows an IC formed by projecting a large number of IC terminals 2 from opposite side surfaces of an IC body 1 and a case in which an IC holding mechanism is formed in a socket on which the IC is mounted.
【００４３】上記ＩＣの代表例としてガルウィング形Ｉ
Ｃを用いた場合を示している。ガルウィング形ＩＣ端子
２は横方向に僅かに突出した基部２ａと縦方向に延びる
中間部２ｂと横方向に突出せる先端部２ｃを有してい
る。As a typical example of the above IC, a gull wing type I
The case where C is used is shown. The gull-wing IC terminal 2 has a base portion 2a slightly protruding in the horizontal direction, an intermediate portion 2b extending in the vertical direction, and a tip portion 2c protruding in the horizontal direction.
【００４４】他方ソケット本体３は上記ＩＣ端子２を載
接する多数のコンタクト４を保有する。このコンタクト
４は例えば上下に撓むことができる横方向に延ばされた
片持ち構造の弾性接片２６を有し、この弾性接片２６の
自由端に上向きに突設された突片２７を有しており、こ
の突片２７にＩＣ端子２の先端部２ｃを載せ接触を図
る。On the other hand, the socket body 3 has a large number of contacts 4 on which the IC terminals 2 are mounted. This contact 4 has, for example, a laterally extending cantilevered elastic contact piece 26 that can be bent up and down, and a free end of this elastic contact piece 26 is provided with a protruding piece 27 protruding upward. The front end portion 2c of the IC terminal 2 is placed on the protruding piece 27 to make contact therewith.
【００４５】上記ソケットにＩＣ本体１の一側方へ突出
されたＩＣ端子２の上面と、他側方へ突出されたＩＣ端
子２の上面とを下方へ向け押圧する少なくとも一対の回
動レバーから成るラッチレバー１３を具備させる。At least a pair of rotating levers for pressing downward the upper surface of the IC terminal 2 protruding to one side of the IC body 1 and the upper surface of the IC terminal 2 protruding to the other side of the socket. The latch lever 13 is provided.
【００４６】上記各回動ラッチレバー１３は図１０等に
示すように、ソケット本体３の一端部と他端部に夫々軸
１４によりソケット本体３の上面に接近する方向（前
方）と離間する方向（後方）とに回動できるように枢支
する。As shown in FIG. 10 and the like, each of the rotary latch levers 13 has a direction in which one end portion and the other end portion of the socket body 3 are approached (front) and separated from the upper surface of the socket body 3 by the shafts 14 (front). Be pivoted so that it can be rotated to the rear).
【００４７】一方の回動ラッチレバー１３は前方へ回動
した時にソケット本体３に搭載されたＩＣ本体１の一側
方へ突出するＩＣ端子２の上面を下方へ押圧し、他方の
回動ラッチレバー１３は前方へ回動した時にＩＣ本体１
の他側方へ突出するＩＣ端子２の上面を下方へ押圧す
る。即ち、各回動ラッチレバー１３は互いに対向方向に
回動し各列のＩＣ端子２の上面を同時に下方へ向け押圧
する。One of the rotation latch levers 13 pushes down the upper surface of the IC terminal 2 protruding to one side of the IC body 1 mounted on the socket body 3 when it rotates forward, and the other rotation latch lever 13. When the lever 13 rotates forward, the IC body 1
The upper surface of the IC terminal 2 protruding to the other side is pressed downward. That is, the respective rotation latch levers 13 rotate in the opposite directions to press the upper surfaces of the IC terminals 2 in each row downward simultaneously.
【００４８】上記回動ラッチレバー１３に押圧力を付与
するため、各回動ラッチレバー１３を押圧方向に付勢す
るバネ手段１５を設ける。このバネ手段１５としては例
えば、図１，図３等に示す如き、軸１４に装着された二
又バネを用いることができ、この二又バネと回動ラッチ
レバー１３の具体構造は既述の説明を援用する。In order to apply a pressing force to the rotary latch levers 13, spring means 15 for urging each rotary latch lever 13 in the pressing direction is provided. As the spring means 15, for example, a bifurcated spring mounted on the shaft 14 as shown in FIGS. 1 and 3 can be used, and the concrete structure of the bifurcated spring and the rotary latch lever 13 has been described above. Use the explanation.
【００４９】上記各回動ラッチレバー１３は上記アクチ
ュエーター８を下降操作することにより、バネ手段１５
に抗して押圧解除方向（後方）へ回動され、ＩＣに対す
る拘束を解く。The rotating latch levers 13 are moved to the spring means 15 by lowering the actuator 8.
It is rotated in the pressing release direction (rearward) against the force to release the constraint on the IC.
【００５０】上記アクチュエーター８は前記の通りＩＣ
を装脱する中央開口２５を有し、該中央開口２５を画成
する枠フレームの縁部に上記回動ラッチレバー１３を押
圧解除方向へ回動せしめる加圧部２３を形成する。The actuator 8 is an IC as described above.
There is a central opening 25 for mounting and dismounting, and a pressurizing portion 23 for rotating the rotary latch lever 13 in the pressing release direction is formed at the edge of the frame frame defining the central opening 25.
【００５１】以下図１０乃至図１６に基づいてアクチュ
エーター８と回動ラッチレバー１３と移動板５の動作に
ついて説明する。The operation of the actuator 8, the rotary latch lever 13, and the moving plate 5 will be described below with reference to FIGS.
【００５２】図１０乃至図１３はアクチュエーター８を
下降操作した時の回動ラッチレバー１３と移動板５の動
作状態を示している。図示のように、アクチュエーター
８を下降すると、加圧部２３が回動ラッチレバー１３の
後端の受圧部２４を押圧し、回動ラッチレバー１３をバ
ネ手段１５に抗し後方へ回動しＩＣ端子２に対する押圧
解除状態を形成する。10 to 13 show the operating states of the rotary latch lever 13 and the moving plate 5 when the actuator 8 is lowered. As shown in the drawing, when the actuator 8 is lowered, the pressing portion 23 presses the pressure receiving portion 24 at the rear end of the rotation latch lever 13, and the rotation latch lever 13 is rotated backward against the spring means 15 and IC The pressure release state for the terminal 2 is formed.
【００５３】上記回動ラッチレバー１３の受圧部２４は
軸１４の後方に存し、押え部２０は軸１４の前方に存す
る。回動ラッチレバー１３はアクチュエーター８の中央
開口２５の内域に配され、受圧部２４を加圧部２３の直
下に対向するように配置しており、アクチュエーター８
を下限まで下降した時、回動ラッチレバー１３は図１３
に示すように中央開口２５内に略直立状態に回動し、押
圧解除状態を形成する。The pressure receiving portion 24 of the rotary latch lever 13 is located behind the shaft 14, and the holding portion 20 is located in front of the shaft 14. The rotary latch lever 13 is arranged in the inner area of the central opening 25 of the actuator 8, and the pressure receiving portion 24 is arranged directly below the pressurizing portion 23 so as to face the actuator 8.
When the lever is lowered to the lower limit,
As shown in FIG. 3, the central opening 25 is rotated in a substantially upright state to form a pressed release state.
【００５４】即ち中央開口２５を画成する枠フレームの
縁部で回動ラッチレバー１３背面の受圧部２４を押圧
し、押え部２０を中央開口２５内へ逃がしながら、回動
せしめる構成である。上記回動ラッチレバー１３の押圧
解除状態において、ＩＣを中央開口２５を通しソケット
本体３上に搭載する。That is, the pressure receiving portion 24 on the rear surface of the rotary latch lever 13 is pressed by the edge of the frame defining the central opening 25, and the pressing portion 20 is rotated while being released into the central opening 25. When the rotation latch lever 13 is in the released state, the IC is mounted on the socket body 3 through the central opening 25.
【００５５】図１３乃至図１６に示すように、上記ＩＣ
搭載状態においてアクチュエーター８への押下力を解除
すると、図１３乃至図１６に示すように回動ラッチレバ
ー１３はバネ手段１５の弾力に従い前方へ回動し押え部
２０が一方のＩＣ端子２の先端部２ｃ上面と他方のＩＣ
端子２の先端部２ｃ上面を下方向へ同時に押圧する。As shown in FIGS. 13 to 16, the IC
When the pushing force on the actuator 8 is released in the mounted state, the turning latch lever 13 turns forward according to the elastic force of the spring means 15 as shown in FIGS. 13 to 16, and the holding portion 20 pushes the tip of one IC terminal 2. IC of the upper surface of the part 2c
The top surfaces of the tip portions 2c of the terminals 2 are simultaneously pressed downward.
【００５６】上記の如く回動ラッチレバー１３の押え部
２０がＩＣ端子２を押圧することによって弾性接片２６
を下方へ撓ませ、その復元力によってＩＣ端子２とコン
タクト４の接触圧を確保すると共に、ＩＣ端子２の先端
部２ｃを回動ラッチレバー１３の押え部２０とコンタク
ト４の突片２７間にしっかりと挟持しＩＣの浮上りを阻
止し、ＩＣ端子２とコンタクト４とを安定に接触せしめ
る。As described above, the pressing portion 20 of the rotary latch lever 13 presses the IC terminal 2 so that the elastic contact piece 26 is released.
Is bent downward, and the restoring force thereof secures the contact pressure between the IC terminal 2 and the contact 4, and the tip portion 2c of the IC terminal 2 is held between the pressing portion 20 of the rotary latch lever 13 and the protrusion 27 of the contact 4. The IC is firmly sandwiched to prevent the IC from rising, and the IC terminal 2 and the contact 4 are brought into stable contact with each other.
【００５７】本発明は上記回動ラッチレバー１３を左右
に二個設ける場合の他、ソケット本体３の前後と左右に
各二個、計四個のレバー１３を設け、これらをアクチュ
エーター８によって同時に開閉する場合を含んでいる。According to the present invention, in addition to the case where the two rotary latch levers 13 are provided on the left and right sides, four levers 13 are provided on the front and rear sides and the left and right sides of the socket body 3, and a total of four levers 13 are simultaneously opened and closed by the actuator 8. Including the case to do.
【００５８】図１７は上記回動ラッチレバー１３によっ
てガルウィング形ＩＣ端子２の基部２ａを下方へ押圧す
る例を開示している。詳述すると、ＩＣ端子２の先端部
２ｃ下面をコンタクト４に載接すると共に、ラッチレバ
ー１３の押え部２０をバネ手段１５の弾力によってＩＣ
端子２の基部２ａ上面に押し当て、ＩＣ端子２の先端部
２ｃ下面をコンタクト４の突片２７に押し付けて接触圧
を得るようにする。FIG. 17 discloses an example in which the base portion 2a of the gull wing type IC terminal 2 is pressed downward by the rotary latch lever 13. More specifically, the lower surface of the tip end portion 2c of the IC terminal 2 is placed on the contact 4 and the pressing portion 20 of the latch lever 13 is moved to the IC by the elastic force of the spring means 15.
The lower surface of the tip 2c of the IC terminal 2 is pressed against the upper surface of the base 2a of the terminal 2, and the lower surface of the tip 2c of the IC terminal 2 is pressed against the protruding piece 27 of the contact 4 to obtain contact pressure.
【００５９】この場合、押え部２０をＩＣ端子２の基部
２ａと中間部２ｂの折曲部に押し当てる場合も、本発明
の基部２ａに押し当てる例に包含される。In this case, the case where the pressing portion 20 is pressed against the bent portions of the base portion 2a and the intermediate portion 2b of the IC terminal 2 is also included in the example of pressing the base portion 2a of the present invention.
【００６０】上記バネ手段１５は弾性アーム１７の端部
をソケット本体３に係止し、加圧バネ部１８を回動ラッ
チレバー１３に作用させて前方回動力を与える。The spring means 15 locks the end portion of the elastic arm 17 with the socket body 3 and causes the pressure spring portion 18 to act on the rotary latch lever 13 to give forward turning power.
【００６１】又上記バネ手段１５は図示の如き線材から
成る二又バネを用いる他、板バネ等の他のバネ手段を用
いることができる。例えば図示しないが、回動ラッチレ
バー１３の後端に後方へ延びる薄肉の曲げ弾性を有する
尾部を一体合成樹脂成形し、この尾部の端部をソケット
本体３に係接し、アクチュエーター８の下降によって回
動ラッチレバー１３を後方へ回動させた時に、この尾部
を反り曲げて弾力を蓄え、この弾力によってレバー１３
に前方回動力を与えるように構成することができる。こ
の弾性尾部は第１実施形態例においても実施可能であ
る。The spring means 15 may be a bifurcated spring made of a wire material as shown in the figure, or may be another spring means such as a leaf spring. For example, although not shown, a thin bending elastic tail portion extending rearward is integrally formed with the rear end of the rotary latch lever 13 by synthetic resin molding, and the end portion of the tail portion is engaged with the socket body 3 and is rotated by lowering the actuator 8. When the dynamic latch lever 13 is rotated rearward, the tail portion is bent to store an elastic force, and this elastic force causes the lever 13 to move.
Can be configured to power the forward turn. This elastic tail can also be implemented in the first embodiment.
【００６２】更に図１６は上記第２実施形態例におい
て、ラッチレバー１３がＩＣ本体１の上面一端と同他端
を押圧する場合を示している。Further, FIG. 16 shows a case where the latch lever 13 presses one end and the other end of the upper surface of the IC body 1 in the second embodiment.
【００６３】前記ガルウィング形ＩＣ、Ｊベンド形Ｉ
Ｃ、フラット形ＩＣにおけるＩＣ端子２をコンタクト４
に載接する場合、例えばガルウィング形ＩＣにおいて、
ＩＣ端子２の先端２ｃをコンタクト４の突片２７に載接
する場合、図１６に仮想線で示すように回動ラッチレバ
ー１３の押え部２０によってＩＣ本体１の上面の一端と
他端を同時に下方へ押圧し、ＩＣ端子２をコンタクト４
に押し付け、これによりＩＣを回動ラッチレバー１３と
コンタクト４間にしっかりと保持しつつ、両者２，４の
接触圧を確保することができる。The gull wing type IC and the J bend type I
C, contact 4 for IC terminal 2 in flat type IC
When mounted on, for example, in gull wing type IC,
When the tip 2c of the IC terminal 2 is mounted on the projecting piece 27 of the contact 4, one end and the other end of the upper surface of the IC body 1 are simultaneously moved downward by the holding portion 20 of the rotary latch lever 13 as shown by phantom lines in FIG. , Press the IC terminal 2 to contact 4
It is possible to secure the contact pressure between the two and 4, while firmly holding the IC between the rotary latch lever 13 and the contact 4 by pressing the IC to the contact 4.
【００６４】第３実施形態例（図１８参照） ここではＩＣ本体１の下面に多数の薄箔から成る導電性
パッドを密着して配置した形式のＩＣや、ＩＣ本体１の
下面に多数の導電性球面形バンプを配置した形式のＩＣ
において前記押え機構を構成している。Third Embodiment (see FIG. 18) Here, an IC of the type in which a large number of conductive pads made of thin foil are arranged in close contact with the lower surface of the IC body 1 or a large number of conductive surfaces on the lower surface of the IC body 1 are used. Type IC with a spherical bump
In the above, the pressing mechanism is configured.
【００６５】上記薄箔パッドや球面形バンプをＩＣ端子
２とし、ソケット本体３には上記ＩＣ端子２に弾力的に
押し付けられる多数のコンタクト４が設けられている。The thin foil pad or the spherical bump is used as the IC terminal 2, and the socket body 3 is provided with a large number of contacts 4 which are elastically pressed against the IC terminal 2.
【００６６】上記ＩＣ用のソケット本体３にＩＣ本体１
の一端部上面と他端部上面とを下方へ向け押圧する少な
くとも一対の回動ラッチレバー１３を付設する。The IC body 1 is attached to the socket body 3 for the IC.
At least a pair of rotary latch levers 13 for pressing one end upper surface and the other end upper surface downward are provided.
【００６７】各回動ラッチレバー１３は上記押圧方向に
付勢するバネ手段１５によって弾持されており、アクチ
ュエーター８の上下動によって押圧解除位置と押圧位置
とに回動される。Each rotating latch lever 13 is elastically held by a spring means 15 which urges in the pressing direction, and is rotated between the pressing release position and the pressing position by the vertical movement of the actuator 8.
【００６８】このアクチュエーター８はソケット本体３
の上位に上下動操作可に設けられ、アクチュエーター８
を下降することによって上記各回動ラッチレバー１３を
バネ手段１５に抗し後方へ回動し押圧解除状態を形成
し、この押圧解除状態においてアクチュエーター８の中
央開口２５を通しＩＣの着脱を行なう。This actuator 8 is the socket body 3
The actuator 8 is installed on the upper part of
By lowering the rotary latch levers 13 against the spring means 15, the rotary latch levers 13 are rotated rearward to form a pressure release state. In this pressure release state, the IC is attached and detached through the central opening 25 of the actuator 8.
【００６９】又上記アクチュエーター８に対する押下力
を解除すると、コンタクト４の復元力により、アクチュ
エーター８が上方へ復帰し、これに伴ない回動ラッチレ
バー１３がバネ手段１５の復元力により前方へ回動し前
記押圧状態を形成する。When the pushing force on the actuator 8 is released, the restoring force of the contact 4 causes the actuator 8 to return upward, and the turning latch lever 13 is turned forward by the restoring force of the spring means 15 accordingly. Then, the pressed state is formed.
【００７０】各回動ラッチレバー１３はＩＣ本体１の一
端上面と他端上面を同時に下方向へ押圧し、ＩＣ本体１
の下面に配置されたＩＣ端子２をコンタクト４に押し付
ける。このコンタクト４としては上下に直線的に弾力的
に伸縮するコンタクトプローブを用いることができる。Each rotary latch lever 13 simultaneously presses the upper surface of one end and the upper surface of the other end of the IC body 1 downward,
The IC terminal 2 arranged on the lower surface of is pressed against the contact 4. As the contact 4, a contact probe that elastically expands and contracts vertically can be used.
【００７１】このコンタクトプローブの一例として、外
部スリーブ２８内にピン端子２９を挿入し、このピン端
子２９を外部スリーブ２８に内装したバネ３０によって
上方へ付勢し、ピン端子２９の先端を上記ＩＣ端子２に
押し付ける形式のもの等を用いることができる。As an example of this contact probe, a pin terminal 29 is inserted into the outer sleeve 28, and the pin terminal 29 is urged upward by a spring 30 incorporated in the outer sleeve 28, so that the tip of the pin terminal 29 is moved to the above IC. It is possible to use a type which is pressed against the terminal 2.
【００７２】上記回動ラッチレバー１３やバネ手段１５
の具体構造は第１実施形態例において詳述した通りであ
り、そこにおける説明を援用することができる。The rotating latch lever 13 and the spring means 15
The specific structure of is as described in detail in the first embodiment, and the description there can be incorporated.
【００７３】[0073]
【発明の効果】この発明によればアクチュエーターへの
押下力を解除することによって少なくとも一対の回動ラ
ッチレバーをバネ手段により押圧位置へ前方回動させ
て、ＩＣ本体の両端上面、又はＩＣ本体の対向する側面
から突出されたＩＣ端子の上面に同時に弾力的に押し当
てることができ、これによってＩＣ端子とコンタクトの
接触を良好に確保できると同時に、アクチュエーターを
押下げ操作し上記各回動レバーをバネ手段に抗し後方回
動させることにより回動ラッチレバーを同時に押圧解除
位置へ回動させて、ＩＣの着脱が容易に行なえる。According to the present invention, by releasing the pressing force applied to the actuator, at least a pair of rotating latch levers are rotated forward by the spring means to the pressing position, and the upper surfaces of both ends of the IC main body or the IC main body. It is possible to elastically press against the upper surface of the IC terminal projecting from the opposite side surface at the same time, which ensures good contact between the IC terminal and the contact, and at the same time, pushes down the actuator to spring the above-mentioned respective rotating levers. By rotating backwards against the means, the rotation latch lever is simultaneously rotated to the pressing release position, so that the IC can be easily attached and detached.
【００７４】又単に上下動するロボットをアクチュエー
ターに作用させることにより上記各回動ラッチレバーの
開閉が行なえるのでＩＣ着脱の自動化に適切に対応し得
る。Further, since each of the above-mentioned rotary latch levers can be opened and closed by simply causing the actuator that moves up and down to act, the automatic attachment / detachment of the IC can be appropriately handled.
【００７５】又各回動ラッチレバーをＩＣ本体の左右に
列設されたＩＣ端子やＩＣ本体の両端を同時に押圧でき
るので、押圧タイミングのずれによるＩＣのずれを有効
に防止し、ＩＣとソケットとを適切に接触させることが
できる。Further, since the respective rotation latch levers can simultaneously press the IC terminals arranged on the left and right of the IC body and both ends of the IC body, it is possible to effectively prevent the displacement of the IC due to the displacement of the pressing timing, and to separate the IC from the socket. Appropriate contact is possible.
【図１】ＰＧＡ形ＩＣに本発明を実施した場合を示すソ
ケットの平面図。FIG. 1 is a plan view of a socket showing a case where the present invention is applied to a PGA type IC.
【図２】Ａは同ソケットにおけるアクチュエーターの上
昇状態を示す側面図、Ｂは同アクチュエーターの下降状
態の側面図。FIG. 2A is a side view showing a raised state of the actuator in the socket, and B is a side view showing the lowered state of the actuator.
【図３】上記アクチュエーターを下降操作した時の回動
ラッチレバーと移動板の動作状態を説明するＩＣソケッ
ト断面図。FIG. 3 is an IC socket cross-sectional view for explaining an operation state of a rotary latch lever and a moving plate when the actuator is lowered.
【図４】上記アクチュエーターを下降操作した時の図３
に続く回動ラッチレバーと移動板の動作状態を説明する
ＩＣソケット断面図。[Fig. 4] Fig. 3 when the actuator is lowered.
FIG. 6 is an IC socket cross-sectional view for explaining an operation state of a rotation latch lever and a moving plate subsequent to FIG.
【図５】上記アクチュエーターを下降操作した時の図４
に続く回動ラッチレバーと移動板の動作状態を説明する
ＩＣソケット断面図。[Fig. 5] Fig. 4 when the actuator is lowered.
FIG. 6 is an IC socket cross-sectional view for explaining an operation state of a rotation latch lever and a moving plate subsequent to FIG.
【図６】上記アクチュエーターを下降操作した時の図５
に続く回動ラッチレバーと移動板の動作状態を説明する
ＩＣソケット断面図。FIG. 6 is a view when the actuator is lowered.
FIG. 6 is an IC socket cross-sectional view for explaining an operation state of a rotation latch lever and a moving plate subsequent to FIG.
【図７】上記アクチュエーターが上昇した時の回動ラッ
チレバーと移動板の動作状態を説明するＩＣソケット断
面図。FIG. 7 is a sectional view of an IC socket for explaining an operating state of a rotary latch lever and a moving plate when the actuator is raised.
【図８】上記アクチュエーターが上昇した時の図７に続
く回動ラッチレバーと移動板の動作状態を説明するＩＣ
ソケット断面図。FIG. 8 is an IC for explaining the operating states of the rotary latch lever and the moving plate following FIG. 7 when the actuator is raised.
Socket cross-sectional view.
【図９】上記アクチュエーターが上昇した時の図８に続
く回動ラッチレバーと移動板の動作状態を説明するＩＣ
ソケット断面図。FIG. 9 is an IC for explaining the operating states of the rotary latch lever and the moving plate following FIG. 8 when the actuator is raised.
Socket cross-sectional view.
【図１０】ガルウィング形ＩＣに本発明を実施した場合
を示すソケットの断面図であり、アクチュエーターを下
降操作した時の回動ラッチレバーの動作状態を説明する
ＩＣソケット断面図。FIG. 10 is a sectional view of a socket showing a case in which the present invention is applied to a gull wing type IC, and an IC socket sectional view for explaining an operating state of a rotary latch lever when an actuator is lowered.
【図１１】アクチュエーターを下降操作した時の図１０
に続く回動ラッチレバーの動作状態を説明するＩＣソケ
ット断面図。FIG. 11 is a diagram when the actuator is lowered.
6 is an IC socket cross-sectional view illustrating an operating state of the rotation latch lever subsequent to FIG.
【図１２】アクチュエーターを下降操作した時の図１１
に続く回動ラッチレバーの動作状態を説明するＩＣソケ
ット断面図。FIG. 12 is a diagram when the actuator is lowered.
6 is an IC socket cross-sectional view illustrating an operating state of the rotation latch lever subsequent to FIG.
【図１３】アクチュエーターを下降操作した時の図１２
に続く回動ラッチレバーの動作状態を説明するＩＣソケ
ット断面図。FIG. 13 is a view when the actuator is lowered.
6 is an IC socket cross-sectional view illustrating an operating state of the rotation latch lever subsequent to FIG.
【図１４】アクチュエーターが上昇した時の回動ラッチ
レバーの動作状態を説明するＩＣソケット断面図。FIG. 14 is an IC socket cross-sectional view illustrating an operating state of a rotation latch lever when an actuator is raised.
【図１５】アクチュエーターが上昇した時の図１４に続
く回動ラッチレバーの動作状態を説明するＩＣソケット
断面図。FIG. 15 is an IC socket cross-sectional view illustrating an operating state of the rotary latch lever subsequent to FIG. 14 when the actuator is raised.
【図１６】アクチュエーターが上昇した時の図１５に続
く回動ラッチレバーの動作状態を説明するＩＣソケット
断面図。FIG. 16 is an IC socket cross-sectional view illustrating an operating state of the rotary latch lever, which is subsequent to FIG. 15 when the actuator is raised.
【図１７】図１０乃至図１６の変形例を示すＩＣソケッ
ト断面図。FIG. 17 is an IC socket sectional view showing a modification of FIGS. 10 to 16;
【図１８】リードレス形ＩＣ又はＢＧＡ形ＩＣに本発明
を実施した場合を示すソケット断面図。FIG. 18 is a sectional view of a socket showing a case where the present invention is applied to a leadless type IC or a BGA type IC.
１ ＩＣ本体 ２ ＩＣ端子 ３ ソケット本体 ４ コンタクト ５ 移動板 ８ アクチュエーター １５ バネ手段 1 IC body 2 IC terminal 3 Socket body 4 Contact 5 Moving plate 8 Actuator 15 Spring means
Claims (8)
よりソケット本体が保有せるコンタクトと、移動板上に
搭載せるＩＣ本体の下面から突出せるＩＣ端子との接触
及び接触解除を図るようにしたＩＣソケットにおいて、
上記ＩＣ本体の一端部上面と他端部上面とを下方へ向け
押圧する少なくとも一対の回動ラッチレバーを備えると
共に、該各回動ラッチレバーを押圧方向に付勢するバネ
手段を備え、該各回動ラッチレバーをバネ手段に抗し押
圧解除方向へ回動せしめる移動板の上位に上下動可に設
けたアクチュエーターを備えることを特徴とするＩＣソ
ケットにおけるＩＣ押え機構。1. Contact and release of a contact held by a socket body by lateral movement of a moving plate along an upper surface of the socket body and an IC terminal projecting from a lower surface of an IC body mounted on the moving plate. In the IC socket
The IC main body is provided with at least a pair of rotary latch levers for pressing the upper surface of one end and the upper surface of the other end downward, and spring means for urging the rotary latch levers in the pressing direction. An IC pressing mechanism for an IC socket, comprising an actuator provided above and below a moving plate for rotating a latch lever against a spring means in a pressing release direction, the actuator being vertically movable.
に付設したことを特徴とする請求項１記載のＩＣソケッ
トにおけるＩＣ押え機構。2. The IC pressing mechanism for an IC socket according to claim 1, wherein each of the rotary latch levers is rotatably attached to a movable plate.
回動可に付設したことを特徴とする請求項１記載のＩＣ
ソケットにおけるＩＣ押え機構。3. The IC according to claim 1, wherein each of the rotary latch levers is rotatably attached to the socket body.
IC holding mechanism for socket.
対向する各側面から突出せるＩＣ端子をソケット本体に
設けたコンタクトに載接する構成としたＩＣソケットに
おいて、上記ＩＣ本体の一側面から突出するＩＣ端子の
上面と同他側面から突出するＩＣ端子の上面とを下方へ
向け押圧する回動ラッチレバーを備えると共に、該各回
動ラッチレバーを押圧方向に付勢するバネ手段を備え、
該各回動ラッチレバーをバネ手段に抗し押圧解除方向へ
回動せしめるソケット本体の上位に上下動可に設けたア
クチュエーターを備えることを特徴とするＩＣソケット
におけるＩＣ押え機構。4. An IC socket in which an IC is mounted on a socket body, and an IC terminal projecting from each side surface of the IC body is mounted on a contact provided on the socket body, the IC socket projecting from one side surface of the IC body. A top surface of the IC terminal and a top surface of the IC terminal protruding from the other side surface of the IC terminal, and a spring means for urging each of the rotation latch levers in the pressing direction.
An IC pressing mechanism in an IC socket, comprising: an actuator that is vertically movable above a socket body that rotates each of the rotation latch levers against a spring means in a pressing release direction.
あり、該ガルウィング形ＩＣ端子の先端部下面を上記コ
ンタクトに載接し、該先端部上面を上記回動ラッチレバ
ーで押圧する構成としたことを特徴とする請求項４記載
のＩＣソケットにおけるＩＣ押え機構。5. The IC terminal is a gull wing type IC terminal, the lower surface of the tip of the gull wing type IC terminal is placed in contact with the contact, and the upper surface of the tip is pressed by the rotary latch lever. An IC pressing mechanism for an IC socket according to claim 4, characterized in that:
Ｃ端子の基部上面を押圧することを特徴とする請求項５
記載のＩＣソケットにおけるＩＣ押え機構。6. The rotary latch lever is a gull wing type I.
6. The upper surface of the base of the C terminal is pressed.
An IC holding mechanism in the above described IC socket.
下面に配置されたＩＣ端子をソケット本体に設けたコン
タクトに載接する構成としたＩＣソケットにおいて、上
記ＩＣ本体の一端部上面と他端部上面とを下方へ向け押
圧する少なくとも一対の回動ラッチレバーを備えると共
に、該各回動ラッチレバーを押圧方向に付勢するバネ手
段を備え、該各回動ラッチレバーをバネ手段に抗し押圧
解除方向へ回動せしめるソケット本体の上位に上下動可
に設けたアクチュエーターを備えることを特徴とするＩ
ＣソケットにおけるＩＣ押え機構。7. An IC socket in which an IC is mounted on a socket main body, and an IC terminal arranged on the lower surface of the IC main body is mounted on a contact provided on the socket main body. At least a pair of rotation latch levers for pressing the upper surface of the portion downward are provided, and spring means for urging the respective rotation latch levers in the pressing direction are provided, and the rotation latch levers are pressed against the spring means to release the pressure. I is characterized in that an actuator provided vertically movable is provided above the socket body that can be rotated in any direction.
IC holding mechanism in C socket.
央開口を有し、該中央開口を画成する枠フレームに上記
回動ラッチレバーを押圧解除方向へ回動せしめる加圧部
を形成したことを特徴とする請求項１，４，７記載のＩ
Ｃ押え機構。8. The actuator has a central opening for loading and unloading an IC, and a frame portion defining the central opening is formed with a pressing portion for rotating the rotary latch lever in a pressing release direction. I according to claims 1, 4 and 7, characterized in that
C presser mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP08075230A JP3103760B2 (en) | 1996-03-05 | 1996-03-05 | IC holding mechanism in IC socket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP08075230A JP3103760B2 (en) | 1996-03-05 | 1996-03-05 | IC holding mechanism in IC socket |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09245920A true JPH09245920A (en) | 1997-09-19 |
| JP3103760B2 JP3103760B2 (en) | 2000-10-30 |
Family
ID=13570225
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP08075230A Expired - Fee Related JP3103760B2 (en) | 1996-03-05 | 1996-03-05 | IC holding mechanism in IC socket |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3103760B2 (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003078078A (en) * | 2001-09-04 | 2003-03-14 | Advanced Systems Japan Inc | Connecting terminal for electronic part, package using it, connector and manufacturing method therefor |
| US7118386B2 (en) | 2002-12-17 | 2006-10-10 | Yamaichi Electronics Co., Ltd. | Socket for semiconductor device |
| US7230830B2 (en) | 2004-04-16 | 2007-06-12 | Yamaichi Electronics Co., Ltd. | Semiconductor device socket |
| US7335030B2 (en) | 2005-03-10 | 2008-02-26 | Yamaichi Electronics Co., Ltd. | Cartridge for contact terminals and semiconductor device socket provided with the same |
| JP2009139156A (en) * | 2007-12-04 | 2009-06-25 | Ueno Seiki Kk | Electronic component measuring instrument, its control method, and control program |
| KR100913802B1 (en) * | 2001-09-11 | 2009-08-26 | 센사타 테크놀로지스 매사추세츠, 인크. | Burn-in test socket |
| US7618277B2 (en) | 2004-08-31 | 2009-11-17 | Yamaichi Electronics Co., Ltd. | Method of mounting and demounting a semiconductor device, device for mounting and demounting a semiconductor device using the same, and socket for a semiconductor device |
| WO2010045043A2 (en) * | 2008-10-17 | 2010-04-22 | 3M Innovative Properties Company | Ic socket |
| JP2012109178A (en) * | 2010-11-19 | 2012-06-07 | Sensata Technologies Massachusetts Inc | Socket |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4151908B2 (en) | 2005-08-31 | 2008-09-17 | 日本航空電子工業株式会社 | Electrical socket |
-
1996
- 1996-03-05 JP JP08075230A patent/JP3103760B2/en not_active Expired - Fee Related
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003078078A (en) * | 2001-09-04 | 2003-03-14 | Advanced Systems Japan Inc | Connecting terminal for electronic part, package using it, connector and manufacturing method therefor |
| KR100913802B1 (en) * | 2001-09-11 | 2009-08-26 | 센사타 테크놀로지스 매사추세츠, 인크. | Burn-in test socket |
| US7118386B2 (en) | 2002-12-17 | 2006-10-10 | Yamaichi Electronics Co., Ltd. | Socket for semiconductor device |
| US7165978B2 (en) | 2002-12-17 | 2007-01-23 | Yamichi Electronics Co., Ltd. | Socket for semiconductor device |
| US7204708B2 (en) | 2002-12-17 | 2007-04-17 | Yamaichi Electronics Co., Ltd. | Socket for semiconductor device |
| US7278868B2 (en) | 2002-12-17 | 2007-10-09 | Yamaichi Electronics Co., Ltd. | Socket for semiconductor device |
| US7230830B2 (en) | 2004-04-16 | 2007-06-12 | Yamaichi Electronics Co., Ltd. | Semiconductor device socket |
| US7618277B2 (en) | 2004-08-31 | 2009-11-17 | Yamaichi Electronics Co., Ltd. | Method of mounting and demounting a semiconductor device, device for mounting and demounting a semiconductor device using the same, and socket for a semiconductor device |
| US7335030B2 (en) | 2005-03-10 | 2008-02-26 | Yamaichi Electronics Co., Ltd. | Cartridge for contact terminals and semiconductor device socket provided with the same |
| JP2009139156A (en) * | 2007-12-04 | 2009-06-25 | Ueno Seiki Kk | Electronic component measuring instrument, its control method, and control program |
| WO2010045043A2 (en) * | 2008-10-17 | 2010-04-22 | 3M Innovative Properties Company | Ic socket |
| WO2010045043A3 (en) * | 2008-10-17 | 2010-07-15 | 3M Innovative Properties Company | Ic socket |
| JP2012109178A (en) * | 2010-11-19 | 2012-06-07 | Sensata Technologies Massachusetts Inc | Socket |
| CN102544913A (en) * | 2010-11-19 | 2012-07-04 | 森萨塔科技麻省公司 | Socket |
| CN102544913B (en) * | 2010-11-19 | 2015-11-25 | 森萨塔科技麻省公司 | Socket |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3103760B2 (en) | 2000-10-30 |
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