JPH09219413A - Mold for encapsulating semiconductor device with resin - Google Patents

Mold for encapsulating semiconductor device with resin

Info

Publication number
JPH09219413A
JPH09219413A JP2266996A JP2266996A JPH09219413A JP H09219413 A JPH09219413 A JP H09219413A JP 2266996 A JP2266996 A JP 2266996A JP 2266996 A JP2266996 A JP 2266996A JP H09219413 A JPH09219413 A JP H09219413A
Authority
JP
Japan
Prior art keywords
push
cut surface
resin
gate
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2266996A
Other languages
Japanese (ja)
Inventor
Tsutomu Seito
勉 清塘
Yasuki Kawamura
耕樹 川村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Japan Semiconductor Corp
Original Assignee
Toshiba Corp
Iwate Toshiba Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Iwate Toshiba Electronics Co Ltd filed Critical Toshiba Corp
Priority to JP2266996A priority Critical patent/JPH09219413A/en
Publication of JPH09219413A publication Critical patent/JPH09219413A/en
Pending legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PROBLEM TO BE SOLVED: To make a load, which is applied to outer lead parts, heavier than a prescribed weight and to contrive to make uniform the distribution of the pressure, which is exerted on the parts, by a method wherein dummy force-cutting surfaces are provided on the side of the smaller pressing area between the pressing area on a gate side and the pressing area on the opposite side to the gate side in such a way that the pressing area on the gate side and the pressing area on the opposite side to the gate side are made equal to each other. SOLUTION: A gate part force-cutting surface 6 prevents a resin from flowing out from an encapsulating resin flow path to the surface and rear of a lead frame. The width of the surface 6 is formed into a width of 0.3mm and is made narrower than that of the gate part force-cutting surface of a resin sealing metal mold of a conventional structure. A runner part force-cutting surface 7 is one which prevents a resin, which flows out on the side surfaces of the lead frame, from leaking out to the surface and rear of the lead frame. The total pressing area of the surfaces 6 and 7 is assumed (a). Then, the width W2 of force-cutting surfaces 8 on the opposite side to a gate side is similarly formed into a width of 0.3mm and the pressing area of the surface 8 at that time is assumed (b). In this case, the difference between the pressure areas becomes a>b, but dummy force-cutting surfaces 9 having an area of a-b equal to the difference between the (a) and the (b) are additionally arranged. In such a way, the total pressing area (a) on the gate side is made as small as possible by the force-cutting surfaces other than outer lead part force-cutting surfaces.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【発明の属する技術分野】本発明は、半導体素子の樹脂
封止金型に係わるもので、特に熱硬化性樹脂等の合成樹
脂を用いて封止される半導体装置の樹脂封止金型に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin encapsulating mold for a semiconductor element, and more particularly to a resin encapsulating mold for a semiconductor device which is encapsulated with a synthetic resin such as a thermosetting resin.

【０００２】[0002]

【従来の技術】図２は、従来の半導体素子を樹脂封止す
る際の状態を模式的に示す。図３は、樹脂金型の押し切
り面の配置を模式的に示したものである。半導体素子を
装着したリードフレーム１は、金型４を構成する上下の
金型４ａ，４ｂの相互間に配置され、上下の型により型
締めされる。型締め完了後、封止樹脂が金型４内に投入
され、ゲート２を通してキャビティ３内に充填される。
また、キャビティ３の外縁に位置する上下の型４ａ，４
ｂに押し切り面５が設けられ、型締めの際にはこの押し
切り面５に荷重が加えられ、リードフレーム１を若干押
しつぶすことにより、樹脂の充填の際にアウターリード
へ樹脂が流出すること、すなわち樹脂バリの発生を防止
している。2. Description of the Related Art FIG. 2 schematically shows a state in which a conventional semiconductor element is sealed with a resin. FIG. 3 schematically shows an arrangement of push-cut surfaces of a resin mold. The lead frame 1 on which the semiconductor element is mounted is arranged between the upper and lower molds 4a and 4b forming the mold 4, and is clamped by the upper and lower molds. After completion of the mold clamping, the sealing resin is put into the mold 4 and filled in the cavity 3 through the gate 2.
In addition, the upper and lower molds 4a, 4 located at the outer edge of the cavity 3
b is provided with a push-cut surface 5, a load is applied to the push-cut surface 5 at the time of mold clamping, and the lead frame 1 is slightly crushed, so that the resin flows out to the outer lead when the resin is filled, that is, Prevents the generation of resin burr.

【０００３】[0003]

【発明が解決しようとする課題】図４は、従来の半導体
素子の樹脂封止金型において、型締めを行う際の状態を
示す。型締めの際に荷重を受けるのは、アウターリード
部押し切り面５、ゲート部押し切り面６、ランナー部押
し切り面７、反ゲート側押し切り面８であるが、樹脂バ
リの発生防止において重要であるのは、アウターリード
押し切り面５の部分である。FIG. 4 shows a state in which a conventional resin-sealed mold for a semiconductor element is clamped. It is the outer lead portion push-cut surface 5, the gate portion push-cut surface 6, the runner portion push-cut surface 7, and the non-gate side push-cut surface 8 that receive the load during mold clamping, but it is important in preventing the occurrence of resin burr. Is a portion of the outer lead push-cut surface 5.

【０００４】従来の構造では、アウターリード部押し切
り面５の面積に対し、その他の部分の押し切り面６、
７、８の総面積が大きい。すなわち、ゲート部押し切り
面６の幅は、通常１〜２ｍｍ程度あり、またランナー部
押し切り面７では、幅は０．５ｍｍ程度と小さいものの
その長さはフレーム全長にわたっているため、６、７、
８の総面積が大きくなっている。そのため、アウターリ
ード部押し切り面５に加わる型締め圧力が十分でなく、
樹脂バリが発生する可能性がある。In the conventional structure, with respect to the area of the outer lead portion push-cut surface 5, the other portion of the push-cut surface 6,
The total area of 7 and 8 is large. That is, the width of the gate pushing surface 6 is usually about 1 to 2 mm, and the width of the runner pushing surface 7 is as small as about 0.5 mm, but the length extends over the entire length of the frame.
The total area of 8 is large. Therefore, the mold clamping pressure applied to the outer lead pressing surface 5 is not sufficient,
Resin burr may occur.

【０００５】さらにパッケージのゲート側と反ゲート側
でアウターリード部押し切り面以外の加圧面積を比べる
と、前述のようにゲート部押し切り面とランナー部押し
切り面の面積が大きいことから、明らかにゲート側が大
きくなっている。そのため、型締め時の金型内の圧力分
布が不均一となる。その結果、アウターリード部押し切
り面５に加わる圧力も不均一となり、圧力の低くなるゲ
ート側では樹脂バリが発生する可能性がある。また圧力
の高くなる反ゲート側では必要以上に高い圧力で型締め
が行われた場合、アウターリードのつぶれ量が大きくな
って強度が低下し、リード折損等が発生する可能性があ
る。Further, comparing the pressure areas other than the outer lead pressing surface on the gate side and the non-gate side of the package, the area of the gate pressing surface and the runner pressing surface is large as described above. The side is getting bigger. Therefore, the pressure distribution in the mold during mold clamping becomes non-uniform. As a result, the pressure applied to the outer lead pressing surface 5 becomes non-uniform, and resin burrs may occur on the gate side where the pressure becomes low. Further, if the mold is clamped at a pressure higher than necessary on the side opposite to the gate where the pressure is increased, the outer lead may be crushed to have a large amount and the strength may be reduced, and lead breakage or the like may occur.

【０００６】図５は、実際に樹脂封止金型で型締めを行
い、アウターリードの押し切り面におけるつぶれ量（塑
性変形量）を測定した結果を示す。４フレーム取りの樹
脂封止金型を用いて、アウターリード部分のゲート側の
つぶれ量と反ゲート側のつぶれ量を単位をμｍとして金
型内の位置毎に示した。図４から、反ゲート側のつぶれ
量に比べ、ゲート側のつぶれ量が明らかに小さいことが
わかる。この場合の加圧面の面積比率は、アウターリー
ド部を１．００とした場合、アウターリード部以外のゲ
ート側が２．０６、反ゲート側が０．３０とゲート側の
加圧面積がきわめて大きくなっており、アウターリード
部においてはゲート側にのみ樹脂バリが発生している。[0006] FIG. 5 shows the result of measuring the crush amount (plastic deformation amount) on the push-cut surface of the outer lead by actually performing mold clamping with a resin sealing mold. Using a resin-sealed mold with four frames, the crush amount on the gate side and the crush amount on the anti-gate side of the outer lead portion are shown in units of μm for each position in the mold. It can be seen from FIG. 4 that the amount of collapse on the gate side is clearly smaller than that on the side opposite to the gate. The area ratio of the pressing surface in this case is 2.06 on the gate side other than the outer lead section and 0.30 on the non-gate side when the outer lead section is 1.00, and the pressing area on the gate side becomes extremely large. In the outer lead part, resin burr is generated only on the gate side.

【０００７】本発明は、上記課題に鑑み、半導体素子の
樹脂封止金型において、型締めの際にリードフレームの
アウターリード部分に加わる荷重を所定の大きさ以上に
し、なおかつ該当部分における圧力分布を均一に保つこ
とにより、樹脂バリの発生、アウターリードの強度低下
等を防止することを目的とする。In view of the above problems, the present invention makes a load applied to an outer lead portion of a lead frame in a resin-sealed mold for a semiconductor element a predetermined magnitude or more at the time of mold clamping, and a pressure distribution in the corresponding portion. The purpose is to prevent the occurrence of resin burrs and the reduction of the strength of the outer leads by keeping the temperature uniform.

【０００８】[0008]

【課題を解決するための手段】リードフレーム上に装着
された半導体素子を樹脂封止する際に用いる樹脂封止金
型において、型締めにより加圧される部分をアウターリ
ード部分とその他の部分に分け、アウターリード部以外
の加圧面積がパッケージのゲート側と反ゲート側とで等
しくなるよう配置し、なおかつアウターリード部以外の
総加圧面積がアウターリード部の総加圧面積未満となる
ような構造にする。アウターリード部分以外の押し切り
面において、ゲート側と反ゲート側の加圧面積を等しく
するよう面積の小さい方にダミーの押し切り面を設け
る。In a resin-sealed mold used for resin-sealing a semiconductor element mounted on a lead frame, a portion to be pressed by die clamping is used as an outer lead portion and other portions. Separately, arrange so that the pressure area other than the outer lead portion is equal on the gate side and the non-gate side of the package, and the total pressure area other than the outer lead portion is less than the total pressure area of the outer lead portion. Make a structure. On the push-cut surface other than the outer lead portion, a dummy push-cut surface is provided in the smaller area so that the pressure areas on the gate side and the non-gate side are equalized.

【０００９】[0009]

【発明の実施の形態】図１は、本発明の実施例を示す。
ゲート部押し切り面６は、封止樹脂の流路からリードフ
レーム表裏面へ樹脂が流出することを防ぐものである。
その幅を０．３ｍｍと従来の構造よりも小さくした。ラ
ンナー部押し切り面７は、リードフレーム側面に流出し
た樹脂がリードフレーム表裏面へ漏出するのを防止する
ものである。本実施例では、ランナー部押し切り面を断
続的に配置し、通常数ｍｍ程度であるリードフレーム側
面での樹脂の流動距離を考慮し、その長さＬを５ｍｍと
した。また、押し切り面６同様、その幅Ｗ１を０．３ｍ
ｍとした。このように配置した押し切り面６、７の総加
圧面積をａとする。FIG. 1 shows an embodiment of the present invention.
The gate push-out surface 6 prevents the resin from flowing out of the flow path of the sealing resin to the front and back surfaces of the lead frame.
Its width is 0.3 mm, which is smaller than that of the conventional structure. The runner portion push-cut surface 7 prevents the resin flowing out to the side surface of the lead frame from leaking to the front and back surfaces of the lead frame. In this embodiment, the runner portion push-cut surface is intermittently arranged, and the length L thereof is set to 5 mm in consideration of the resin flow distance on the side surface of the lead frame, which is usually about several mm. Also, like the push-cut surface 6, its width W1 is 0.3 m.
m. The total pressing area of the push-cut surfaces 6 and 7 arranged in this way is defined as a.

【００１０】次に、反ゲート側押し切り面８の幅Ｗ２を
同様に０．３ｍｍとし、その際の加圧面積をｂとする。
この場合、加圧面積はａ＞ｂとなるが、その差にあたる
ａ−ｂの面積をもつダミーの押し切り面９を新たに配置
した。Next, the width W2 of the non-gate side push-cut surface 8 is similarly set to 0.3 mm, and the pressing area at that time is set to b.
In this case, the pressing area is a> b, but a dummy push-cut surface 9 having an ab area corresponding to the difference is newly arranged.

【００１１】このようにしてアウターリード部以外の押
し切り面において、ゲート側の総加圧面積ａをできる限
り小さくし、また反ゲート側の総加圧面積をもａとして
アウターリード部以外の押し切り面の加圧面積の総和２
ａをアウターリード部押し切り面の加圧面積の総和より
も小さくする。In this way, in the push-cut surface other than the outer lead portion, the total pressure area a on the gate side is made as small as possible, and the total pressure area on the non-gate side is also set as a, and the push-cut surface other than the outer lead portion is set. 2 of total pressure area
a is made smaller than the sum of the pressing areas of the outer lead pressing surface.

【００１２】また、各押し切り面の幅および長さの典型
的な値を以下に述べる。ランナー部の押し切り面の幅
は、０．２ｍｍないし０．５ｍｍであり、長さは、５ｍ
ｍないし２０ｍｍである。また、ゲート部の押し切り面
の幅は、０．２ｍｍないし０．５ｍｍであり、長さはリ
ードフレームとパッケージのサイズにより決まる。さら
に、反ゲート側の押し切り面の幅は、０．２ｍｍ以上で
あり、最大値には特に規定はない。Further, typical values of the width and the length of each push-cut surface will be described below. The width of the push-cut surface of the runner is 0.2 mm to 0.5 mm, and the length is 5 m.
m to 20 mm. The width of the push-cut surface of the gate portion is 0.2 mm to 0.5 mm, and the length is determined by the size of the lead frame and the package. Further, the width of the push-cut surface on the side opposite to the gate is 0.2 mm or more, and there is no particular limitation on the maximum value.

【００１３】また、ダミー押し切り面は、反ゲート側に
のみ設けられるものではなく、ゲート側に設けられる場
合もある。以上の内容は、パッケージにおいて対向する
２辺にのみアウターリードを有するＤＩＰ、ＳＯＰ等の
タイプに適用されるものであるが、パッケージの４辺す
べてにアウターリードを有するＱＦＰタイプの場合は、
反ゲート側押し切り面が存在しないため、反ゲート側に
配置するダミーの押し切り面９の総加圧面積をａとす
る。Further, the dummy push-cut surface may be provided not only on the side opposite to the gate but also on the gate side. The above contents are applied to types such as DIP and SOP which have outer leads only on two sides facing each other in the package, but in the case of the QFP type which has outer leads on all four sides of the package,
Since there is no anti-gate-side push-cut surface, the total pressure area of the dummy push-cut surface 9 arranged on the anti-gate side is set to a.

【００１４】[0014]

【発明の効果】以上、詳述したように、本発明によれ
ば、アウターリード部分の押し切り面積がそれ以外の押
し切り面積の総和よりも大きく、かつアウターリード部
分以外の押し切り面に関してゲート側と反ゲート側の面
積が等しくなっているので、型締め時のアウターリード
部分への加圧を効果的にかつバランス良く行うことが可
能となる。したがって、アウターリード部分での樹脂バ
リの発生を防止して、樹脂封止製品の歩留まり低下を抑
制することができる。As described above in detail, according to the present invention, the push-cut area of the outer lead portion is larger than the sum of the push-cut areas other than that, and the push-cut surface other than the outer lead portion is opposite to the gate side. Since the areas on the gate side are the same, it is possible to effectively and well balance the pressure applied to the outer lead portion during mold clamping. Therefore, it is possible to prevent the occurrence of resin burrs in the outer lead portion and suppress the reduction in the yield of resin-sealed products.

【００１５】また、封止工程後における樹脂バリの除去
工程を省略することができ工数の削減が可能となる。ま
た、荷重の局部集中が回避できるため、必要以上にアウ
ターリードを押しつぶすことがなく、リードの強度の低
下が起こりにくくなる。さらに、型締め時の総加圧面積
が小さくなるため、型締めを行う樹脂封止装置の小型
化、軽量化が可能となる。Further, the step of removing the resin burr after the sealing step can be omitted and the number of steps can be reduced. In addition, since local concentration of the load can be avoided, the outer leads are not crushed more than necessary, and the reduction in the strength of the leads hardly occurs. Further, since the total pressing area at the time of mold clamping becomes small, it is possible to reduce the size and weight of the resin sealing device for performing mold clamping.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の樹脂封止金型で押し切り面の配置を模
式的に示す図。FIG. 1 is a diagram schematically showing an arrangement of push-cut surfaces in a resin-sealed mold of the present invention.

【図２】従来の樹脂封止金型にリードフレームをセット
し、その後型締めを行った状態を示す図。FIG. 2 is a view showing a state in which a lead frame is set in a conventional resin-sealed mold and then the mold is clamped.

【図３】従来の樹脂封止金型の押し切り面の配置を示す
図。FIG. 3 is a diagram showing an arrangement of push-cut surfaces of a conventional resin-sealing mold.

【図４】従来の樹脂封止金型の押し切り面の配置を示す
図。FIG. 4 is a view showing an arrangement of push-cut surfaces of a conventional resin-sealed mold.

【図５】従来の４フレーム取り樹脂封止金型でリードフ
レームの型締めを行い、アウターリードの押し切り面に
おけるつぶれ量を測定した結果を金型内の位置ごとに記
載した図。FIG. 5 is a diagram showing the result of measuring the amount of crushing on the push-cut surface of the outer lead by clamping the lead frame with a conventional four-frame taking resin-sealed mold, for each position in the mold.

【符号の説明】[Explanation of symbols]

１…リードフレーム、 ２…ゲート、 ３…キャビティ、 ４…押し切り面、 ５…アウターリード部押し切り面、 ６…ゲート部押し切り面、 ７…ランナー部押し切り面、 ８…反ゲート側押し切り面、 ９…ダミーの押し切り面、 １０…リードフレーム（または半導体パッケージ）のア
ウターリード、 １１…ランナー。1 ... Lead frame, 2 ... Gate, 3 ... Cavity, 4 ... Push face, 5 ... Outer lead push face, 6 ... Gate push face, 7 ... Runner push face, 8 ... Anti-gate push face, 9 ... Push-cut surface of dummy, 10 ... Outer lead of lead frame (or semiconductor package), 11 ... Runner.

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｂ２９Ｌ 31:34 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 6 Identification number Agency reference number FI Technical display location B29L 31:34

Claims (6)

【特許請求の範囲】[Claims] 【請求項１】 リードフレーム上に載置された半導体素
子を樹脂で封止する樹脂封止金型において、リードフレ
ームのアウターリード部以外に配置された押し切り面の
総面積が、アウターリード部に配置された押し切り面の
面積よりも小さく、かつ、アウターリード部以外の押し
切り面において、ゲート側の押し切り面の総面積と反ゲ
ート側の押し切り面の総面積が等しくなるようにダミー
の押し切り面を設けたことを特徴とする半導体素子の樹
脂封止金型。1. A resin encapsulation mold for encapsulating a semiconductor element mounted on a lead frame with a resin, wherein a total area of a push-cut surface other than the outer lead portion of the lead frame is equal to an outer lead portion. If the dummy push-cut surface is smaller than the area of the push-cut surface that is placed and the push-cut surface other than the outer lead part has the same total area of the gate-side push-cut surface and the opposite gate-side push-cut surface. A resin-sealed mold for a semiconductor element, which is provided. 【請求項２】 前記ダミーの押し切り面は、反ゲート側
に設けられることを特徴とする請求項１記載の半導体素
子の樹脂封止金型。2. The resin-sealed mold for a semiconductor element according to claim 1, wherein the dummy push-cut surface is provided on the side opposite to the gate. 【請求項３】 前記アウターリード部以外の押し切り面
の一つであるランナー部押し切り面は、ランナーに沿っ
て分離されていることを特徴とする請求項１記載の半導
体素子の樹脂封止金型。3. The resin encapsulation mold for a semiconductor element according to claim 1, wherein a runner portion push-cut surface, which is one of the push-cut surfaces other than the outer lead portion, is separated along the runner. . 【請求項４】 前記ランナー部押し切り面は、樹脂の流
動距離よりも長い長さで設置されていることを特徴とす
る請求項３記載の半導体素子の樹脂封止金型。4. The resin encapsulation mold for a semiconductor element according to claim 3, wherein the runner portion push-cut surface is installed with a length longer than a flow distance of the resin. 【請求項５】 リードフレーム上に載置された半導体素
子が収容されるキャビティに連通されたゲート部に配置
された第１の押し切り面と、 前記ゲート部と連通するランナー部に沿って配置された
第２の押し切り面と、 前記キャビティの反ゲート側の縁に沿って配置された第
３の押し切り面と、 前記キャビティの反ゲート側近傍に配置され、前記第３
の押し切り面の面積との和が前記第１の押し切り面の面
積と前記第２の押し切り面との和に等しくなるような面
積を有するダミーの押し切り面と、 前記リードフレームのアウターリードが配置される前記
キャビティの縁に沿って配置され、前記第１の押し切り
面と前記第２の押し切り面と前記第３の押し切り面と前
記ダミー押し切り面の総面積の総和よりも大きな面積を
有する押し切り面とを具備することを特徴とする半導体
措置の樹脂封止金型。5. A first push-cut surface arranged on a gate portion communicating with a cavity for accommodating a semiconductor element mounted on a lead frame, and arranged along a runner portion communicating with the gate portion. A second push-cut surface, a third push-cut surface arranged along an edge of the cavity on the side opposite to the gate, and a third push-cut surface disposed near the side of the cavity opposite to the gate.
A dummy push-cut surface having an area such that the sum of the area of the push-cut surface of the lead frame is equal to the sum of the area of the first push-cut surface and the second push-cut surface, and the outer lead of the lead frame is arranged. A push face having a larger area than the sum of the total areas of the first push face, the second push face, the third push face and the dummy push face arranged along the edge of the cavity. A resin-sealed mold for a semiconductor device, comprising: 【請求項６】 前記ゲート部の押し切り面の幅は、０．
２ｍｍないし０．５ｍｍであり、 前記ランナー部の押し切り面の幅は、０．２ｍｍないし
０．５ｍｍであり、長さは、５ｍｍないし２０ｍｍであ
り、 前記反ゲート側の押し切り面の幅は、０．２ｍｍ以上で
あることを特徴とする請求項５記載の半導体装置の樹脂
封止金型。6. The width of the push-cut surface of the gate portion is 0.
2 mm to 0.5 mm, the width of the push-cut surface of the runner portion is 0.2 mm to 0.5 mm, the length is 5 mm to 20 mm, and the width of the push-cut surface on the side opposite to the gate is 0. The resin-molded mold for a semiconductor device according to claim 5, wherein the mold is 0.2 mm or more.
JP2266996A 1996-02-08 1996-02-08 Mold for encapsulating semiconductor device with resin Pending JPH09219413A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2266996A JPH09219413A (en) 1996-02-08 1996-02-08 Mold for encapsulating semiconductor device with resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2266996A JPH09219413A (en) 1996-02-08 1996-02-08 Mold for encapsulating semiconductor device with resin

Publications (1)

Publication Number Publication Date
JPH09219413A true JPH09219413A (en) 1997-08-19

Family

ID=12089266

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2266996A Pending JPH09219413A (en) 1996-02-08 1996-02-08 Mold for encapsulating semiconductor device with resin

Country Status (1)

Country Link
JP (1) JPH09219413A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011020295A (en) * 2009-07-14 2011-02-03 Mitsubishi Electric Corp Mold for insert molding and method for manufacturing composite part using the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011020295A (en) * 2009-07-14 2011-02-03 Mitsubishi Electric Corp Mold for insert molding and method for manufacturing composite part using the same

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