JPH09213742A - Manufacture of semiconductor device and manufacturing equipment - Google Patents
Manufacture of semiconductor device and manufacturing equipmentInfo
- Publication number
- JPH09213742A JPH09213742A JP8015539A JP1553996A JPH09213742A JP H09213742 A JPH09213742 A JP H09213742A JP 8015539 A JP8015539 A JP 8015539A JP 1553996 A JP1553996 A JP 1553996A JP H09213742 A JPH09213742 A JP H09213742A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- ball
- solder
- balls
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
Landscapes
- Wire Bonding (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明はＬＳＩパッケージ，
特にＢＧＡ（Ｂａｌｌ Ｇｒｉｄ Ａｒｒａｙ）パッケ
ージに関するものであり、ＢＧＡパッケージにおける実
装不良を解消するためパッケージ基板に接続突起（半田
ボール）を、その頭を揃えて接合する方法およびその装
置に関するものである。The present invention relates to an LSI package,
In particular, the present invention relates to a BGA (Ball Grid Array) package, and relates to a method and an apparatus for bonding connection protrusions (solder balls) to a package substrate with their heads aligned in order to eliminate mounting defects in the BGA package.
【０００２】[0002]
【従来の技術】ＬＳＩパッケージには様々な形態がある
が、そのなかでもＢＧＡパッケージは高速・高消費電力
のＬＳＩに適し、また実装する際の不良率も、他の形態
のものよりは小さいとされている。しかし、以下に述べ
る理由である程度の実装不良が避けられず、一層の改良
が望まれていた。2. Description of the Related Art There are various forms of LSI packages. Among them, BGA packages are suitable for high-speed and high-power-consumption LSIs, and the failure rate when mounted is smaller than that of other forms. Has been done. However, some mounting defects cannot be avoided for the reasons described below, and further improvements have been desired.
【０００３】ＢＧＡパッケージにおける基板の入出力部
に半田ボールを接合する際、従来は図２に示すように、
パッケージ基板１０の所定の位置に設けたパッドの上に
半田ペースト１１を印刷し、その面を上向きにしてパッ
ケージ基板を定置する。When solder balls are joined to the input / output portions of a board in a BGA package, conventionally, as shown in FIG.
The solder paste 11 is printed on the pads provided at predetermined positions on the package substrate 10, and the package substrate is placed with its surface facing upward.
【０００４】次にこの基板の上に平板状の位置決め治具
３０を載せる。この治具には、半田ボール２０が楽に通
る大きさの孔３１が、基板１０の半田ボール接合箇所に
対応する位置に設けられている。なお治具の周辺部の縁
３２は、基板と治具との位置合わせのためのものであ
る。次いで孔３１に半田ボール２０を挿入してリフロー
すれば、基板上の所定の位置に半田ボールが接合されて
ＢＧＡパッケージが出来上がる訳である。Next, a flat plate-shaped positioning jig 30 is placed on this substrate. This jig is provided with a hole 31 having a size that allows the solder ball 20 to easily pass therethrough, at a position corresponding to a solder ball bonding portion of the substrate 10. The edge 32 at the peripheral portion of the jig is for aligning the substrate and the jig. Then, when the solder balls 20 are inserted into the holes 31 and reflowed, the solder balls are bonded to predetermined positions on the substrate, and the BGA package is completed.
【０００５】[0005]
【発明が解決しようとする課題】このＢＧＡパッケージ
をプリント基板に実装する際には、全ての半田ボールが
プリント基板上のそれぞれの電極に確実に半田付けされ
る必要があり、そのためにはパッケージ基板に接合され
た半田ボールの頭が全て揃っていることが望ましく、仮
に不揃いでもそのバラツキが許容範囲内（ボールの頭と
プリント基板との間に生じる隙間が溶融した半田で充填
可能な狭さ）でなければならない。しかしこれは、図２
の工程を基本とする従来の方法では容易なことではなか
った。When mounting this BGA package on a printed circuit board, it is necessary to surely solder all the solder balls to the respective electrodes on the printed circuit board. For that purpose, the package board is required. It is desirable that all of the solder ball heads that are joined to the solder ball have the same head, and even if the heads are uneven, the variation is within the allowable range (the gap between the head of the ball and the printed board is narrow enough to be filled with molten solder) Must. However, this is
It was not easy with the conventional method based on the above process.
【０００６】即ち図２の工程から得られたＢＧＡパッケ
ージを例示する図３において、半田ボールの頭が揃うと
いうことは、全てのボールが直線５０で示される仮想平
面に接することである。この仮想平面はまた、現実には
実装する相手部材のプリント基板などを意味する。That is, in FIG. 3 exemplifying the BGA package obtained from the process of FIG. 2, that the heads of the solder balls are aligned means that all the balls are in contact with an imaginary plane indicated by a straight line 50. This virtual plane also means a printed circuit board or the like of a mating member to be actually mounted.
【０００７】一方、図２から明らかなように従来の方法
ではパッケージ基板の上にボールを載せてハンダ付けす
るので、パッケージ基板の底面からボールの頭までの距
離は個々のボールの直径およびパッケージ基板に印刷さ
れた半田ペースト１１の量のバラツキ，パッケージ基板
の板厚および基板自体の反りや歪みの如何等の要因の総
和に左右されるため、ボール個々の頭の高さが不揃いに
なる。その結果図３の曲線（曲面）５１に示すように、
仮想平面５０に対して個々のボール毎に異なる大きさの
偏差５２（この値が大きいほど面としての平坦度が劣る
ことになる）を生じることは避けられない。On the other hand, as is apparent from FIG. 2, in the conventional method, the balls are placed on the package substrate and soldered. Therefore, the distance from the bottom surface of the package substrate to the head of the ball depends on the diameter of each ball and the package substrate. The head height of each ball is not uniform because it depends on the total amount of factors such as the variation in the amount of the solder paste 11 printed on the board, the thickness of the package board, and the warp and distortion of the board itself. As a result, as shown by the curve (curved surface) 51 in FIG.
It is inevitable that a deviation 52 having a different magnitude from the virtual plane 50 (a larger value means a lower flatness as a surface) for each ball.
【０００８】そして、この偏差が前述の許容範囲を超え
た箇所では、ボールとプリント基板との半田付け（電気
的接続）がなされないことになる。これが実装不良を生
じる原因の一つであり、製品歩留まりの上で大きな問題
になっていた。Then, at a place where this deviation exceeds the above-mentioned allowable range, soldering (electrical connection) between the ball and the printed circuit board is not performed. This is one of the causes of mounting failure, and has been a major problem in terms of product yield.
【０００９】[0009]
【課題を解決するための手段】本発明は、図２の従来方
式を上下転倒させてみるという逆転の発想に基づいて従
来の問題点を一挙に解消したものであって、即ち本発明
は、表面が平坦で滑らかに仕上げられている定盤上の所
定の位置に半田ボールを配列させておき、その上にパッ
ケージ基板を半田ペーストの印刷面を下向きに載せ、そ
の状態で加熱してボールをパッケージ基板に半田付けす
ることを骨子とするものである。SUMMARY OF THE INVENTION The present invention is to solve the conventional problems all at once based on the idea of reversing that the conventional method of FIG. 2 is turned upside down. The solder balls are arranged at predetermined positions on the surface plate whose surface is flat and smooth, and the package substrate is placed on top of it with the printed surface of the solder paste facing downward, and the balls are heated by heating in that state. The main idea is to solder to the package substrate.
【００１０】[0010]
【発明の実態の形態】以下本発明を、その一実施例につ
いて詳細に説明する。図１において、４０は定盤で、そ
の表面は所要の精度で平坦に，且つ滑らかに仕上げられ
ている。半田ボール２０は直接この定盤の上に配列され
るが、その位置決めのため、平板状の位置決め治具３０
を用いる。この治具にはパッケージ基板１０の半田ボー
ル接合箇所に対応する位置に孔３１が設けられている
が、図２の従来方式における治具の場合とは次の点で異
なっている。DETAILED DESCRIPTION OF THE INVENTION The present invention will be described in detail below with reference to an embodiment thereof. In FIG. 1, reference numeral 40 is a surface plate, the surface of which is finished flat and smooth with required accuracy. Although the solder balls 20 are directly arranged on the surface plate, a flat plate-shaped positioning jig 30 is used for positioning them.
Is used. This jig is provided with a hole 31 at a position corresponding to the solder ball bonding portion of the package substrate 10, but it is different from the case of the conventional jig shown in FIG. 2 in the following points.
【００１１】即ち本発明における治具３０は、孔３１の
形状が図示の如く直円筒状の場合はその板厚を半田ボー
ルの半径より小さく，孔３１の形状が漏斗状の場合は板
厚を半田ボールの直径より小さく作られ、また、孔３１
は半田ボールが通過できない大きさに、且つ、半田ボー
ルが定盤４０に接した状態で孔３１の縁または内面と半
田ボールとの間に僅かな遊びがある大きさに作られる。That is, the jig 30 of the present invention has a plate thickness smaller than the radius of the solder ball when the hole 31 is in the shape of a right cylinder as shown in the figure, and a plate thickness when the hole 31 is in the shape of a funnel. It is made smaller than the diameter of the solder ball, and the hole 31
Is formed in such a size that the solder balls cannot pass therethrough, and has a small play between the solder ball and the edge or inner surface of the hole 31 in the state where the solder ball is in contact with the surface plate 40.
【００１２】図１の例では位置決め治具３０が定盤４０
に密接し、孔３１の形状が直円筒状になっているが、治
具の板厚および孔の大きさが前記の条件を満たす限り、
治具と定盤との間に足を設けて治具のみを浮かせること
も可能であり、孔が直円筒状以外の形状でも差し支えな
い。なお定盤４０の周辺部の縁４１は基板と治具との位
置合わせのためのものであるが、これを治具に設けても
よく、別個の固定手段を用いてもよい。In the example of FIG. 1, the positioning jig 30 is a surface plate 40.
, And the shape of the hole 31 is a right cylinder, but as long as the plate thickness of the jig and the size of the hole satisfy the above conditions,
It is also possible to provide feet between the jig and the surface plate so that only the jig floats, and the hole may have a shape other than the right cylindrical shape. The peripheral edge 41 of the surface plate 40 is used for aligning the substrate and the jig, but this may be provided on the jig or a separate fixing means may be used.
【００１３】作業の段取りは先ずこの治具の上に半田ボ
ールを整列させるが、それにはこの治具３０に多数の半
田ボールを載せて揺動するのが簡便で、所要数の半田ボ
ールが孔３１にそれぞれ納まり過剰のものは治具から落
ちる。この状態で治具３０を定盤４０に載せれば、全て
の半田ボールがその頭（図１では下側）を定盤４０に当
接させ、平坦に揃った状態で整列する。次いで、その上
にパッケージ基板１０を、半田ペースト印刷面を下向き
に載せて加熱すれば、半田ボールのパッケージ基板への
半田付けが完了する。In the work setup, first, the solder balls are aligned on the jig. It is easy to place a large number of solder balls on the jig 30 and swing them. Each of them is stored in 31 and the excess one falls from the jig. When the jig 30 is placed on the surface plate 40 in this state, all the solder balls have their heads (lower side in FIG. 1) brought into contact with the surface plate 40 and are aligned in a flat state. Next, the package substrate 10 is placed on the package substrate 10 so that the printed surface of the solder paste faces downward and heated, whereby soldering of the solder balls to the package substrate is completed.
【００１４】この際、半田ボールの頭は定盤に倣って平
坦に揃っている半面、基板と個々の半田ボールとの間隔
には、前述の諸要因によるバラツキがある。しかし、基
板に印刷される半田ペーストの厚みは通常１５０μｍ前
後，半田付け後の基板と半田ボールとの間隔は平均３０
μｍ程度であり、しかも半田ペーストが半田ボールの上
に位置して溶融するので間隔のバラツキは問題なく吸収
され、各半田ボールと基板が確実に接合される。At this time, the heads of the solder balls are evenly arranged along the surface plate, and the intervals between the substrate and the individual solder balls have variations due to the various factors mentioned above. However, the thickness of the solder paste printed on the board is normally around 150 μm, and the distance between the board and the solder ball after soldering is 30 on average.
Since the solder paste is located on the solder balls and melts, the variations in the intervals are absorbed without any problem, and the solder balls and the substrate are reliably bonded.
【００１５】また、万一接合しない半田ボールがあって
も、基板を取り出した後の治具上に残るので容易に発見
され、その時点で対策することができる。従ってこの方
法においては、不良のまま次工程に送られることは殆ど
ない。Further, even if there is a solder ball that is not bonded, it remains on the jig after the substrate is taken out, so that it can be easily found and a countermeasure can be taken at that time. Therefore, in this method, defective products are hardly sent to the next process.
【００１６】次いで基板１０を持ち上げれば位置決め治
具３０は定盤４０の上に残り、完成したＢＧＡパッケー
ジが取り出される。この取り出し作業も、図２の従来方
式の場合は半田ボールと治具の孔３１とが嵌め合いにな
っているため、治具と基板の分離に細心の注意を要する
のに対して、本発明の場合には基板に接合された半田ボ
ールは治具の孔に乗っているに過ぎないので、容易に取
り出すことができる。また段取りに際して、図２の従来
方式では基板の上に半田ボールを並べる関係で基板の先
行準備を要するのに対して、本発明では基板と関係な
く、別のラインで段取りを進めることができる。Then, when the substrate 10 is lifted, the positioning jig 30 remains on the surface plate 40, and the completed BGA package is taken out. In the case of the conventional method of FIG. 2 as well, the solder ball and the hole 31 of the jig are fitted to each other in the taking-out work, so that the jig and the substrate must be separated with great care, whereas the present invention In this case, the solder ball bonded to the substrate is only on the hole of the jig, so that it can be easily taken out. Further, in the case of setup, in the conventional method of FIG. 2, the preparation of the board is required because solder balls are arranged on the board, whereas in the present invention, setup can be performed on another line regardless of the board.
【００１７】この様にして得られたＢＧＡパッケージの
平坦度を調べたところ、図２の従来方式による製品の±
１００μｍ以下に対して、±５０μｍ以下と半減してい
た。この値は前述の許容範囲に余裕をもって収まる値で
あり、この結果、半田ボール（接続突起）の不揃いに起
因する実装不良をほぼ皆無とすることができた。When the flatness of the BGA package thus obtained was investigated, it was found that the flatness of the conventional product shown in FIG.
It was half that of ± 50 μm or less with respect to 100 μm or less. This value is a value that can be accommodated within the above-mentioned permissible range with a margin, and as a result, it was possible to substantially eliminate mounting defects due to unevenness of the solder balls (connection protrusions).
【００１８】[0018]
【発明の効果】以上詳述したように、本発明はＢＧＡパ
ッケージ等の半導体装置における接続突起の高さの不揃
いを解消して実装信頼性を高め、併せて段取り工程の合
理化，製品取り出しの容易さなど製造工程の効率化にも
寄与するものである。従って、本発明の実施による製品
の品質面，ならびに経済上の利益は極めて大きい。As described above in detail, the present invention eliminates the unevenness of the heights of the connection protrusions in a semiconductor device such as a BGA package to improve the mounting reliability, and also rationalizes the setup process and facilitates product removal. It also contributes to the efficiency of the manufacturing process. Therefore, the quality of the product as well as the economic benefit of the implementation of the present invention are extremely large.
【図１】本発明の接合方法およびその装置を説明する図
面である。FIG. 1 is a diagram illustrating a joining method and an apparatus therefor according to the present invention.
【図２】従来の接合方法およびその装置を説明する図面
である。FIG. 2 is a diagram illustrating a conventional joining method and a conventional joining method.
【図３】従来の方法における問題点を説明する図面であ
る。FIG. 3 is a diagram illustrating a problem in a conventional method.
１０…パッケージ基板，１１…半田ペースト ２０…半田ボール（接続突起） ３０…位置合わせ治具，３１…孔，３２…縁 ４０…定盤，４１…縁 ５０…仮想平面，５１…仮想曲面 10 ... Package substrate, 11 ... Solder paste 20 ... Solder ball (connection protrusion) 30 ... Positioning jig, 31 ... Hole, 32 ... Edge 40 ... Surface plate, 41 ... Edge 50 ... Virtual plane, 51 ... Virtual curved surface
Claims (2)
状の接続突起をその頭を揃えて接合する方法において、
上面が平滑な定盤の上に基板の接続突起接合箇所に対応
する位置に孔を備えその板厚がボール状接続突起の径よ
り薄い平板状の位置決め治具を載せ、この治具の孔に載
せた接続突起の頭が定盤に当接した状態でその上に基板
を、その半田ペースト付着面を下向きに重ねて加熱する
ことを特徴とする半導体装置の製造方法。1. A method for joining ball-shaped connecting protrusions at predetermined positions on a substrate of a semiconductor device by aligning their heads,
On the surface plate with a smooth upper surface, place a flat plate-shaped positioning jig with holes at the positions corresponding to the connection protrusion joints on the board and the thickness of the plate is smaller than the diameter of the ball-shaped connection protrusion. A method for manufacturing a semiconductor device, comprising: heating a substrate on which a head of the connection protrusion is in contact with a surface plate, the substrate on which the solder paste is attached is stacked downward.
状の接続突起をその頭を揃えて接合する装置において、
上面が平滑な定盤と、接続突起を載せてこの定盤上の所
定の位置に配列させる孔開き平板状の位置決め治具と、
この位置決め治具と接続突起の上に半田ペースト付着面
を下に向けて重ねた基板との横ずれを防止する拘束手段
とからなり、位置決め治具に設けた孔はボール状の接続
突起の頭が定盤に当接する大きさであり、定盤で頭の揃
った接続突起を半田ペーストにより基板に接合するよう
構成されたことを特徴とする、半導体装置の製造装置。2. A device for bonding a ball-shaped connecting protrusion with its head aligned at a predetermined position on a substrate of a semiconductor device,
A platen having a flat upper surface, and a positioning jig in the form of a perforated plate on which a connection protrusion is placed and arranged at a predetermined position on the platen,
It consists of this positioning jig and restraint means to prevent the lateral displacement of the board overlaid with the solder paste attachment surface facing down on the connection projection, and the hole of the positioning jig has the head of the ball-shaped connection projection. An apparatus for manufacturing a semiconductor device, characterized in that it is configured to be joined to a substrate with a solder paste, the connection protrusions having a size that comes into contact with a surface plate and whose heads are aligned on the surface plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8015539A JPH09213742A (en) | 1996-01-31 | 1996-01-31 | Manufacture of semiconductor device and manufacturing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8015539A JPH09213742A (en) | 1996-01-31 | 1996-01-31 | Manufacture of semiconductor device and manufacturing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09213742A true JPH09213742A (en) | 1997-08-15 |
Family
ID=11891609
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8015539A Pending JPH09213742A (en) | 1996-01-31 | 1996-01-31 | Manufacture of semiconductor device and manufacturing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09213742A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19990051221A (en) * | 1997-12-19 | 1999-07-05 | 김영환 | How to Form Solder Balls in a Ball Grid Array Package |
| WO2011161514A3 (en) * | 2010-05-03 | 2012-03-15 | A. Raymond Et Cie | Pick and bond method for attachment of adhesive element to substrate |
-
1996
- 1996-01-31 JP JP8015539A patent/JPH09213742A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19990051221A (en) * | 1997-12-19 | 1999-07-05 | 김영환 | How to Form Solder Balls in a Ball Grid Array Package |
| WO2011161514A3 (en) * | 2010-05-03 | 2012-03-15 | A. Raymond Et Cie | Pick and bond method for attachment of adhesive element to substrate |
| CN103069177A (en) * | 2010-05-03 | 2013-04-24 | 阿雷蒙公司 | Pick and bond method for attachment of adhesive element to substrate |
| CN103080568A (en) * | 2010-05-03 | 2013-05-01 | 阿雷蒙公司 | Pick and bond method and apparatus for transferring adhesive element to substrate |
| US20130112351A1 (en) * | 2010-05-03 | 2013-05-09 | A. Raymond Et Cie | Pick And Bond Method For Attachment Of Adhesive Element To Substrate |
| US9266689B2 (en) * | 2010-05-03 | 2016-02-23 | A. Raymond Et Cie | Pick and bond method for attachment of adhesive element to substrate |
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