JPH09191176A - Method and apparatus for mounting printed circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a printed circuit board from being deformed by the heat in a reflow step by attaching a flat support plate to the board with electronic components mounted at executing the reflow step. SOLUTION: A combination board 1 combines four printed circuit boards P into a unified block by four pairs of couplers 12 on the right and left sides. A support plate 3 is laid on the back side of the board 1 and pressure welded thereto with two pins 31 inserted into corresponding two waste holes 13 to position the plate 3 to the back side of the board 1 owing to the pins 31 and holes 13 at the right and left and top and bottom corners, thereby tightly coupling them. Heating at about 150deg.C for soldering softens the board 1, however, the board 1 can be prevented from being deformed when the load of electronic components is applied to it.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【発明の属する技術分野】一般に、比較的小型で同一形
状の多数のプリント基板をコンベア・システムにより製
造するような場合は、複数個のプリント基板を纏めて処
理できる所謂ゆる連基板が利用される。複数個のプリン
ト基板を連結部で連結した連基板を利用すれば、単一の
プリント基板を実装作業内で工程順に個々に搬送する場
合に比較して多量生産的で生産能率を向上できる利点が
ある。BACKGROUND OF THE INVENTION Generally, in the case of manufacturing a large number of relatively small printed circuit boards having the same shape by a conveyor system, a so-called continuous board capable of collectively processing a plurality of printed circuit boards is used. . The use of a continuous board in which a plurality of printed boards are connected by a connecting portion has the advantage that mass production can be improved and production efficiency can be improved as compared with the case where a single printed board is individually conveyed in the order of steps in the mounting work. is there.

【０００２】本発明はプリント基板の実装方法及び装置
に係り、さらに詳しくは単一のプリント基板または連基
板のリフロー工程における加熱による変形を防止したプ
リント基板の実装方法及び装置に関するものである。The present invention relates to a method and apparatus for mounting a printed circuit board, and more particularly to a method and apparatus for mounting a printed circuit board in which deformation of a single printed circuit board or a continuous circuit board due to heating is prevented.

【０００３】[0003]

【従来の技術】図５は従来のプリント基板の実装方法及
び装置を説明するための連基板の構成を示す平面図、図
６は模式的な動作説明図である。図５において、１は連
基板、２は電子部品である。２１は電子部品２のリード
脚で、連基板１上の導電パターンにハンダ付けされる。2. Description of the Related Art FIG. 5 is a plan view showing a structure of a continuous board for explaining a conventional printed board mounting method and apparatus, and FIG. 6 is a schematic operation explanatory view. In FIG. 5, 1 is a continuous board and 2 is an electronic component. Reference numeral 21 is a lead leg of the electronic component 2, which is soldered to the conductive pattern on the continuous board 1.

【０００４】このような構成の連基板１は、このまま実
装作業装置内で駆動されるコンベア・システムに投入さ
れる。コンベア・システムに投入された連基板１は、
片面印刷→電子部品２の載置→リフローの〜の
各工程を経て片面側に電子部品２がハンダ付けされる。
次に、裏面側の処理に移されて、再び裏面印刷→電
子部品２の載置→リフローの順に搬送されて、電子部
品２の連基板１への両面実装が終了するようになってい
る。The continuous board 1 having such a configuration is put into the conveyor system driven in the mounting work device as it is. The continuous board 1 put into the conveyor system is
The electronic component 2 is soldered on one side through the steps of single-sided printing, placement of the electronic component 2, and reflow.
Next, the process is performed on the back side, and the back side printing is performed again, the electronic component 2 is placed, and the reflow is carried in order, and the double-side mounting of the electronic component 2 on the continuous board 1 is completed.

【０００５】[0005]

【発明が解決しようとする課題】このような工程を経て
電子部品２を連基板１に実装する従来の方式によれば、
リフロー工程のハンダ付けの加熱で連基板１が軟化す
る。軟化した連基板１の表面には電子部品２が載置され
ているので、載置部分に局部的な荷重が加わり変形した
まま冷却されて次工程に移されることになる。したがっ
て、図６(a) で模式的に示すように電子部品２の片面実
装の終了後に垂れ下り、連基板１に“反り”や“捩じ
れ”等の変形が発生することが多い。特に、厚さが薄い
連基板１や大きい連基板１が、変形し易い。この結果、
従来の実装方式によれば、裏面側の〜の各工程の処
理に支障を与える等の問題点があった。According to the conventional method of mounting the electronic component 2 on the continuous board 1 through the above steps,
The continuous board 1 is softened by the heating for soldering in the reflow process. Since the electronic component 2 is mounted on the surface of the softened continuous board 1, a local load is applied to the mounting portion to cool it while it is deformed and it is transferred to the next step. Therefore, as shown schematically in FIG. 6 (a), the electronic component 2 often hangs down after the one-side mounting is completed, and deformation such as "warp" or "twist" occurs in the continuous board 1. Particularly, the thin continuous board 1 and the large continuous board 1 are easily deformed. As a result,
According to the conventional mounting method, there is a problem that it hinders the processing of each of the steps 1 to 3 on the back surface side.

【０００６】本発明は、このような従来のプリント基板
の実装方式の問題点を解消するためになされたもので、
リフロー工程の熱によるプリント板の変形を防止できる
プリント基板の実装方法及び装置を実現することを目的
とするものである。The present invention has been made to solve the problems of the conventional mounting method of the printed circuit board.
An object of the present invention is to realize a method and apparatus for mounting a printed circuit board that can prevent the printed board from being deformed due to heat in the reflow process.

【０００７】[0007]

【課題を解決するための手段】この発明は、導電プリン
トを施したプリント基板の実装面に電子部品を載置して
リード脚をリフロー工程で導電プリントにハンダ付けし
て、電子部品をプリント基板の実装面に実装するプリン
ト基板の実装方法において、電子部品を載置したプリン
ト基板に偏平な添着板を添着してリフロー工程を実施す
るプリント基板の実装方法を採用したものである。ま
た、電子部品を複数個の同一形状のプリント基板を連結
した連基板に実装するプリント基板の実装方法を採用し
たものである。SUMMARY OF THE INVENTION According to the present invention, an electronic component is placed on a mounting surface of a printed circuit board on which a conductive print is applied, and a lead leg is soldered to the conductive print in a reflow process to mount the electronic component on the printed circuit board. In the method of mounting a printed circuit board mounted on the mounting surface, a method of mounting a printed circuit board, in which a flat adhesive plate is attached to a printed circuit board on which electronic components are mounted and a reflow process is performed, is adopted. In addition, a method of mounting a printed circuit board in which an electronic component is mounted on a continuous circuit board in which a plurality of printed circuit boards having the same shape are connected is adopted.

【０００８】また、この発明は、実装面に導電プリント
を施したプリント基板と、プリント基板上に載置されて
リフロー工程によりリード脚が導電プリントにハンダ付
けされる電子部品と、プリント基板にリフロー工程にお
いて添着される偏平な添着板とを備えたプリント基板の
実装装置を構成したものである。また、添着板に中空部
を設けたプリント基板の実装装置を構成したものであ
る。また、添着板とプリント基板との相対位置を定める
係止手段を設けたプリント基板の実装装置を構成したも
のである。さらに、添着板を不変鋼で構成したプリント
基板の実装装置を構成したものである。Further, according to the present invention, a printed circuit board having a conductive print on its mounting surface, electronic components mounted on the printed circuit board and having lead legs soldered to the conductive print by a reflow process, and reflowed to the printed circuit board. A mounting device for a printed circuit board, which comprises a flat attachment plate attached in the process, is configured. In addition, a mounting device for a printed circuit board in which a hollow portion is provided in the attachment plate is configured. Further, the mounting apparatus for the printed circuit board is provided with locking means for determining the relative position between the attachment plate and the printed circuit board. Further, a mounting device for a printed circuit board in which the attachment plate is made of invariant steel is configured.

【０００９】[0009]

【発明の実施の形態】BEST MODE FOR CARRYING OUT THE INVENTION

実施形態１．以下、この発明の実施形態を、図面により
説明する。図１はこの発明の実施形態１の添着板の構成
説明図、図２は添着板の添着状態を示す平面図である。
本発明の実施形態においても従来例と同様に両面実装の
場合が例示されているが、ここではやや詳しく説明す
る。図１と図２において、連基板１と電子部品２及びリ
ード脚２１には、図５と図６の場合と同じ符号が付され
ている。Embodiment 1 FIG. Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a configuration explanatory view of an attachment plate according to Embodiment 1 of the present invention, and FIG. 2 is a plan view showing an attached state of the attachment plate.
Also in the embodiment of the present invention, the case of double-sided mounting is illustrated as in the conventional example, but it will be described in a little more detail here. 1 and 2, the continuous board 1, the electronic component 2, and the lead leg 21 are denoted by the same reference numerals as those in FIGS. 5 and 6.

【００１０】３は添着板で、この添着板３により本発明
の要部が構成される。添着板３には図１の(a) ，(b) に
示されているように、連基板１の輪郭形状に対応させた
角型で、それより幾分大きい偏平な板材が用いられてい
る。添着板３の材質には、３６％程度のニッケルを含む
ニッケル−鉄合金からなるアンバー（indar ）のように
低熱膨張係数を備えた不変鋼が適す。３１は２本のピン
で、添着板３の一方の添着面に突設されている。Reference numeral 3 denotes an attachment plate, and the attachment plate 3 constitutes a main part of the present invention. As shown in FIGS. 1 (a) and 1 (b), the attachment plate 3 is a rectangular plate corresponding to the contour shape of the continuous substrate 1, and a flat plate material which is slightly larger than that is used. . The material of the attachment plate 3 is preferably invariant steel having a low coefficient of thermal expansion such as indar made of nickel-iron alloy containing about 36% nickel. Reference numeral 31 denotes two pins, which are provided so as to project from one attachment surface of the attachment plate 3.

【００１１】１１は連基板１に形成されたコ字形の貫通
溝、１２は小孔を設けた連結部、１３は捨て孔、１４は
左右の側辺部である。また、Ｘ−Ｘは切断線である。連
基板１に設けられた捨て孔１３は、添着板３に突設され
た２本のピン３１に嵌め合される大きさに作られてい
る。そして、この連基板１は斜線で示されたように、連
結部１２を介して左右の側辺部１４の位置で４個のプリ
ント基板Ｐを連結した４連型の連基板１が一体に構成さ
れている。３３は添着面に形成された凹部または貫通し
た小孔で、凹部の場合は連基板１との添着状態で境界域
に股がる位置に設けられている。Reference numeral 11 is a U-shaped through groove formed in the connecting board 1, 12 is a connecting portion having a small hole, 13 is a discard hole, and 14 is a left and right side portion. XX is a cutting line. The discarding hole 13 provided in the connecting board 1 is sized to fit into the two pins 31 protruding from the attachment plate 3. Then, as shown by the diagonal lines, this continuous board 1 is integrally formed with a four-series continuous board 1 in which four printed circuit boards P are connected at the positions of the left and right side portions 14 via the connecting portions 12. Has been done. Reference numeral 33 denotes a recess formed in the attachment surface or a small hole penetrating therethrough, and in the case of the recess, it is provided at a position where it claws in the boundary region in the attachment state with the continuous substrate 1.

【００１２】このような構成の本発明の実施形態１の動
作を、次に説明する。予め、エポキシ樹脂等の合成樹脂
の板材を用いて、両表層面に導電パターン（図示されて
いない）を形成した両面銅張積層板からなる連基板１が
作られているものとする。準備された連基板１は図２に
示されたように、片側４か所の連結部１２で左右の側辺
部１４に連結された４個のプリント基板Ｐが一体に形成
されている。また、アンバー等の金属材を機械加工し
て、図１に示されたような構造の添着板３も複数製作さ
れているものとする。The operation of the first embodiment of the present invention having such a configuration will be described below. It is assumed that a continuous substrate 1 made of a double-sided copper-clad laminate having a conductive pattern (not shown) formed on both surface layers is made in advance using a synthetic resin plate material such as an epoxy resin. As shown in FIG. 2, the prepared continuous board 1 is integrally formed with four printed boards P that are connected to the left and right side portions 14 by the connecting portions 12 at four locations on one side. It is also assumed that a plurality of attachment plates 3 having the structure shown in FIG. 1 are manufactured by machining a metal material such as amber.

【００１３】準備された連基板１の裏面側に添着板３を
添わせながら圧接し、２本のピン３１を対応する２つの
捨て孔１３に挿入（圧入）する。左右・上下の隅部にお
けるピン３１と捨て孔１３との嵌合により、連基板１の
裏面に添着板３が位置決めされながら密着して結合され
る。連基板１と添着板３との結合状態では、ピン３１の
頭が捨て孔１３から飛び出ないようになっている。The back plate side of the prepared continuous board 1 is pressed against the backing plate 3 while the attachment plate 3 is attached, and the two pins 31 are inserted (pressed) into the corresponding two discarding holes 13. By fitting the pins 31 and the discard holes 13 at the left, right, upper and lower corners, the attachment plate 3 is positioned and closely attached to the back surface of the continuous board 1. When the connecting board 1 and the attachment plate 3 are connected to each other, the head of the pin 31 does not protrude from the discard hole 13.

【００１４】ここで、裏面に添着板３を添着した連基板
１が、コンベア・システムの自動搬送ラインに投入され
て搬送方向に沿って順次セットされる。そして、先ず、
前述した第工程の片面（表面）印刷で、連基板１の一
方の実装面上の導電パターンの所定の位置にペースト状
のハンダが塗布される。ハンダが塗布された連基板１に
は、次工程ので電子部品２のリード脚２１がペースト
の塗布位置に載置されて浸漬する。続くのリフロー工
程でハンダ付け用の熱が加えられ、溶融したペーストを
介してリード脚２１が導電パターンに“ろー付け”され
る。Here, the continuous substrate 1 having the attachment plate 3 attached to the back surface thereof is put into an automatic conveyance line of the conveyor system and sequentially set in the conveyance direction. And first,
In the one-sided (front) printing of the above-described step, paste-like solder is applied to predetermined positions of the conductive pattern on one mounting surface of the continuous board 1. In the next step, the lead leg 21 of the electronic component 2 is placed at the paste application position and immersed in the continuous board 1 to which the solder has been applied. In the subsequent reflow step, heat for soldering is applied, and the lead legs 21 are “rolled” to the conductive pattern via the molten paste.

【００１５】この際、ハンダ付けの為の１５０℃程度の
加熱により、連基板１が軟化する。しかしながら、裏面
に添着板３が密着して添着されているので、たとえ電子
部品２の荷重等が加えられても連基板１が変形するよう
なことがない。このときの状態が、図６(b) に示されて
いる。また、コ字形の貫通溝１１や小孔のある連結部１
２を形成していて歪み易い構造の連基板１が、裏面に添
着された添着板３により搬送状態で常時補強されるよう
になっている。At this time, the continuous board 1 is softened by heating at about 150 ° C. for soldering. However, since the attachment plate 3 is attached in close contact with the back surface, the continuous board 1 is not deformed even if the load of the electronic component 2 is applied. The state at this time is shown in FIG. 6 (b). In addition, a U-shaped through groove 11 and a connecting portion 1 having a small hole
The continuous board 1 having the structure 2 and having a structure that is easily distorted is always reinforced in the conveyed state by the attachment plate 3 attached to the back surface.

【００１６】さらに、連基板１に密着した金属の添着板
３がリフロー工程で加えられた熱の伝達媒体の機能を果
たして、連基板１の全体を一様に加熱することになる。
このため、連基板１の局部的な熱膨脹が少なくなり、連
基板１の熱的な変形が一層防止される効果も生じる。こ
のようにして電子部品２の片面実装の後に、連基板１に
添着された添着板３が取外されて表裏が反転されて裏面
側の実装に移行される。このとき、添着面の境界線の内
外に亘って設けられた凹部や小孔３３にドライバが差込
まれて、連基板１と添着板３が簡単に分離される。Further, the metal attachment plate 3 which is in close contact with the continuous substrate 1 functions as a heat transfer medium for the heat added in the reflow process and uniformly heats the entire continuous substrate 1.
Therefore, the local thermal expansion of the continuous board 1 is reduced, and the thermal deformation of the continuous board 1 is further prevented. In this way, after the electronic component 2 is mounted on one side, the attachment plate 3 attached to the continuous board 1 is removed, the front and back are reversed, and the back side is mounted. At this time, the driver is inserted into the recesses and the small holes 33 provided inside and outside the boundary line of the attachment surface, and the connecting board 1 and the attachment plate 3 are easily separated.

【００１７】実施形態２．裏面側の実装には、図３に示
されたような添着板３が用いられる。図３において、３
２は添着板３に設けられた中空部である。中空部３２は
既にハンダ付けした表面側の実装領域よりやや大きく穿
設され、裏面側に添着板３を添着したときに実装済みの
電子部品２が中空部３２から露出して連基板１の裏面の
密着に支障がないように作られている。Embodiment 2 FIG. The mounting plate 3 as shown in FIG. 3 is used for mounting on the back surface side. In FIG. 3, 3
Reference numeral 2 is a hollow portion provided on the attachment plate 3. The hollow portion 32 is formed to be slightly larger than the mounting area on the front surface side already soldered, and when the attachment plate 3 is attached to the back surface side, the mounted electronic component 2 is exposed from the hollow portion 32 and the back surface of the serial board 1 is exposed. It is made so that it does not hinder the close contact of the.

【００１８】そして、表面側と同様な裏面印刷→電
子部品２の載置→リフローの３工程を経て裏面に電子
部品２がハンダ付けされて、実装工程が終了する。裏面
側の実装に使われる実施形態２の添着板３についても、
連基板１の変形防止と補強作用の効果が生じることには
変わりがない。その後、図２に示された切断線Ｘ−Ｘに
沿って連基板１が切断されて、電子部品２の実装済みの
４個のフリント基板Ｐが完成されることになる。Then, the electronic component 2 is soldered to the back surface through three steps of printing on the back surface, placing the electronic component 2 on the same side as the front side, and reflowing, and the mounting process is completed. Regarding the attachment plate 3 of Embodiment 2 used for mounting on the back side,
There is no change in that the deformation preventing effect and the reinforcing effect of the continuous board 1 are produced. After that, the continuous board 1 is cut along the cutting line XX shown in FIG. 2, and the four flint boards P on which the electronic components 2 have been mounted are completed.

【００１９】なお、上述の本発明の実施形態では４個の
プリント基板Ｐよりなる４連形の連基板の場合を例示し
て説明したが、連基板を構成するプリント基板Ｐの個数
は適宜増減してもよく、単一のプリント板の場合も本発
明を適用することができる。また、実施形態２では中央
に１つの中空部を設けた升形の添着板を図示して説明し
たが、格子状等にしてもよく、実装作業を進める連基板
の表面側の実装状況に合わせて適宜の形状を選択するこ
ともできる。In the above-described embodiment of the present invention, the case where the four continuous printed circuit boards P are formed has been described as an example. However, the number of the printed circuit boards P constituting the serial printed circuit board is appropriately increased or decreased. However, the present invention can be applied to the case of a single printed board. Further, in the second embodiment, a box-shaped attachment plate having one hollow portion in the center is illustrated and described, but it may be a grid-like attachment plate or the like, and may be formed in a lattice shape or the like according to the mounting condition on the front surface side of the serial board where the mounting work is advanced. It is also possible to select an appropriate shape.

【００２０】[0020]

【発明の効果】この発明は、導電プリントを施したプリ
ント基板の実装面に電子部品を載置してリード脚をリフ
ロー工程で導電プリントにハンダ付けして、電子部品を
プリント基板の実装面に実装するプリント基板の実装方
法において、電子部品を載置したプリント基板に偏平な
添着板を添着してリフロー工程を実施するプリント基板
の実装方法を採用した。また、電子部品を複数個の同一
形状のプリント基板を連結した連基板に実装するプリン
ト基板の実装方法を採用した。According to the present invention, an electronic component is placed on a mounting surface of a printed circuit board on which a conductive print is applied, and a lead leg is soldered to the conductive print in a reflow process so that the electronic component is mounted on the mounting surface of the printed circuit board. In the method of mounting the printed circuit board to be mounted, a method of mounting the printed circuit board in which a flat mounting plate is attached to the printed circuit board on which the electronic component is mounted and the reflow process is performed is adopted. In addition, a printed circuit board mounting method is used in which electronic components are mounted on a continuous circuit board in which a plurality of printed circuit boards of the same shape are connected.

【００２１】また、この発明は、実装面に導電プリント
を施したプリント基板と、プリント基板上に載置されて
リフロー工程によりリード脚が導電プリントにハンダ付
けされる電子部品と、プリント基板にリフロー工程にお
いて添着される偏平な添着板とを備えたプリント基板の
実装装置を構成した。また、添着板に中空部を設けたプ
リント基板の実装装置を構成した。また、添着板とプリ
ント基板との相対位置を定める係止手段を設けたプリン
ト基板の実装装置を構成した。さらに、添着板を不変鋼
で構成したプリント基板の実装装置を構成した。Further, according to the present invention, a printed circuit board having a conductive print on its mounting surface, electronic components placed on the printed circuit board and having lead legs soldered to the conductive print by a reflow process, and reflow soldered on the printed circuit board. A mounting apparatus for a printed circuit board was configured with a flat attachment plate attached in the process. Further, a mounting device for a printed circuit board in which a hollow portion is provided on the attachment plate is configured. Further, a mounting apparatus for the printed circuit board is provided which is provided with a locking means for determining the relative position between the attachment plate and the printed circuit board. Furthermore, a mounting device for a printed circuit board in which the attachment plate is made of invariant steel was constructed.

【００２２】この結果、従来のようにプリント基板や連
基板の反りや捩じれがなく、裏面実装作業に影響を与え
るようなことがない。また、貫通溝等を形成した構造の
連基板が搬送中に工具や他の部品類に接触するようなこ
とがあっても、一方の面に密着している添着板が保護し
て変形や破損を防止することができる。よって、本発明
によれば、反りや捩じれがなく、製品歩留まりの高いプ
リント基板の実装方法及び装置を提供することができ
る。As a result, there is no warp or twist of the printed circuit board or the continuous circuit board as in the conventional case, and the back surface mounting work is not affected. In addition, even if the continuous board with the structure where the through groove is formed may come into contact with tools and other parts during transportation, the attachment plate that is in close contact with one surface protects and deforms or damages it. Can be prevented. Therefore, according to the present invention, it is possible to provide a method and apparatus for mounting a printed circuit board that does not warp or twist and has a high product yield.

【図面の簡単な説明】[Brief description of the drawings]

【図１】この発明の実施形態１の添着板の構成説明図で
ある。FIG. 1 is a configuration explanatory view of an attachment plate according to a first embodiment of the present invention.

【図２】実施形態１の添着板の添着状態を示す平面図で
ある。FIG. 2 is a plan view showing an attached state of an attachment plate according to the first embodiment.

【図３】この発明の実施形態２の添着板の構成説明図で
ある。FIG. 3 is a structural explanatory view of an attachment plate according to a second embodiment of the present invention.

【図４】実施形態２の添着板の添着状態を示す平面図で
ある。FIG. 4 is a plan view showing an attached state of an attachment plate according to a second embodiment.

【図５】従来の実装を説明するための連基板の構成を示
す平面図である。FIG. 5 is a plan view showing a configuration of a continuous board for explaining conventional mounting.

【図６】模式的な動作説明図である。FIG. 6 is a schematic operation explanatory diagram.

【符号の説明】[Explanation of symbols]

１ 連基板 ２ 電子部品 ３ 添着板 １１ 貫通溝 １２ 連結部 １３ 捨て孔 １４ 側辺部 ２１ リード脚 ３１ ピンで ３２ 中空部 ３３ 凹部 Ｐ プリント基板 Ｘ−Ｘ 切断線 DESCRIPTION OF SYMBOLS 1 continuous board 2 electronic component 3 attachment plate 11 through groove 12 connecting part 13 discarding hole 14 side part 21 lead leg 31 with pin 32 hollow part 33 concave part P printed board XX cutting line

Claims (6)

【特許請求の範囲】[Claims] 【請求項１】 導電プリントを施したプリント基板の実
装面に電子部品を載置してリード脚をリフロー工程で導
電プリントにハンダ付けして、前記電子部品をプリント
基板の実装面に実装するプリント基板の実装方法におい
て、 前記電子部品を載置したプリント基板に偏平な添着板を
添着して前記リフロー工程を実施することを特徴とする
プリント基板の実装方法。1. A print for mounting an electronic component on a mounting surface of a printed circuit board on which a conductive print is applied, soldering lead legs to the conductive print in a reflow process, and mounting the electronic component on the mounting surface of the printed circuit board. A method of mounting a printed circuit board, comprising: mounting a flat mounting plate on the printed circuit board on which the electronic component is mounted and performing the reflow step. 【請求項２】 前記電子部品を複数個の同一形状のプリ
ント基板を連結した連基板に実装することを特徴とする
請求項１記載のプリント基板の実装方法。2. The method of mounting a printed circuit board according to claim 1, wherein the electronic component is mounted on a continuous circuit board in which a plurality of printed circuit boards having the same shape are connected. 【請求項３】 実装面に導電プリントを施したプリント
基板と、該プリント基板上に載置されてリフロー工程に
よりリード脚が前記導電プリントにハンダ付けされる電
子部品と、前記プリント基板にリフロー工程において添
着される偏平な添着板とを備えたことを特徴とするプリ
ント基板の実装装置。3. A printed circuit board having a conductive print on its mounting surface, an electronic component mounted on the printed circuit board and having lead legs soldered to the conductive print by a reflow process, and a reflow process for the printed circuit board. And a flat attachment plate attached to the printed circuit board. 【請求項４】 前記添着板に中空部を設けたことを特徴
とする請求項３に記載のプリント基板の実装装置。4. The printed circuit board mounting apparatus according to claim 3, wherein the attachment plate is provided with a hollow portion. 【請求項５】 前記添着板とプリント基板との相対位置
を定める係止手段を設けたことを特徴とする請求項３ま
たは４に記載のプリント基板の実装装置。5. The printed circuit board mounting apparatus according to claim 3, further comprising locking means for determining a relative position between the attachment plate and the printed circuit board. 【請求項６】 前記添着板を不変鋼で構成したことを特
徴とする請求項３乃至５のいずれかに記載のプリント基
板の実装装置。6. The printed circuit board mounting apparatus according to claim 3, wherein the attachment plate is made of invariant steel.