JPH09188582A - Production of metal-ceramic composite substrate and brazing material used therefor - Google Patents
Production of metal-ceramic composite substrate and brazing material used thereforInfo
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- JPH09188582A JPH09188582A JP30385496A JP30385496A JPH09188582A JP H09188582 A JPH09188582 A JP H09188582A JP 30385496 A JP30385496 A JP 30385496A JP 30385496 A JP30385496 A JP 30385496A JP H09188582 A JPH09188582 A JP H09188582A
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- Prior art keywords
- brazing material
- metal
- weight
- powder
- substrate
- Prior art date
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、金属とセラミック
スとを接合して複合基板と成す製造方法と、その接合に
用いる接合特性に優れたろう材に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a composite substrate by bonding metal and ceramics, and a brazing material having excellent bonding characteristics used for the bonding.
【０００２】[0002]
【従来の技術】従来より、金属としての銅板とセラミッ
クス基板として窒化アルミニウム（ＡｌＮ）基板とを接
合する方法として、特開昭６０−１６６１６５号公報記
載の「窒化物系セラミックスと金属との接合方法」に開
示する活性金属ろう接法や、銅板と窒化アルミニウム基
板表面を改質させて直接接合するＤＢＣ法（例えば特開
昭５６−１６３０９３号公報）等が知られている。2. Description of the Related Art Conventionally, as a method for joining a copper plate as a metal and an aluminum nitride (AlN) substrate as a ceramic substrate, there is disclosed a method for joining a nitride-based ceramic and a metal described in JP-A-60-166165. And the DBC method (for example, JP-A-56-163093) in which the surfaces of a copper plate and an aluminum nitride substrate are modified and directly bonded.
【０００３】このうち活性金属ろう接法は、ＤＢＣ法に
比較して接合強度が高く、得られた接合体はヒートサイ
クルに対して耐久性が高い等の特性を有することから、
酸化物系セラミックス基板以外の例えば窒化物セラミッ
クス基板と銅板との接合に多用されるようになった。Among them, the active metal brazing method has higher bonding strength than the DBC method, and the obtained bonded body has characteristics such as high durability against heat cycle.
It has come to be widely used for bonding, for example, a nitride ceramics substrate and a copper plate other than the oxide ceramics substrate.
【０００４】上記活性金属ろう接法に使用されるろう材
としては、Ａｇ−Ｃｕ−活性金属（Ｔｉ、Ｚｒ、Ｈｆの
いずれか１種）からなるろう材（特開昭６０−１６６１
６５号公報）や、Ａｇ−Ｃｕ−水素化チタンからなる活
性金属ペースト材（特開平３−１０１１５３号公報）が
実用化されている。As a brazing material used in the above-mentioned active metal brazing method, a brazing material comprising Ag-Cu-active metal (any one of Ti, Zr and Hf) (Japanese Patent Application Laid-Open No. 60-1661)
No. 65) and an active metal paste material composed of Ag—Cu—titanium hydride (Japanese Patent Application Laid-Open No. 3-101153).
【０００５】[0005]
【発明が解決しようとする課題】上記ろう材を用いて窒
化アルミニウム基板の上下面に銅板を接合して回路基板
を形成することは実用化されているが、近年の回路用基
板には、大電力化に対応できるよう、放熱性、電気絶縁
性に加え、より高強度でかつ熱衝撃性に優れた基板が望
まれていた。Although it has been put into practical use to form a circuit board by bonding a copper plate to the upper and lower surfaces of an aluminum nitride substrate using the above brazing material, it has been widely used in recent circuit boards. A substrate having higher strength and excellent thermal shock resistance in addition to heat dissipation and electric insulation has been desired so as to be compatible with electric power generation.
【０００６】したがって本発明の目的は従来のろう材よ
りもパワーモジュール基板としての諸特性値を向上させ
得るろう材を提供するとともに、このろう材を用いて行
う金属−セラミックス複合基板の製造方法を提供するこ
とにある。Therefore, an object of the present invention is to provide a brazing material capable of improving various characteristic values as a power module substrate as compared with a conventional brazing material, and a method for producing a metal-ceramic composite substrate using the brazing material. To provide.
【０００７】[0007]
【課題を解決するための手段】本発明者らは上記目的を
達成すべく鋭意研究した結果、従来公知の活性金属ろう
材の組成に特定の酸化物を添加すると、耐ヒートサイク
ル特性が向上することを見いだし本発明に到達した。Means for Solving the Problems As a result of intensive studies conducted by the present inventors to achieve the above object, the addition of a specific oxide to the composition of a conventionally known active metal brazing material improves the heat cycle resistance. The present invention has been discovered and the present invention has been reached.
【０００８】すなわち、本発明は第１に、金属板とセラ
ミックス基板とをろう材で接合して複合基板を製造する
方法において、固体分が重量％で、Ａｇ：６０〜９４．
２５％，Ｃｕ：５〜３０％，活性金属：０．５〜４．５
％，酸化チタン：０．２５〜０．９％からなるろう材を
セラミックス基板上に塗布する第１工程、次いで該ろう
材上に金属板を重ね、加熱接合して金属板−セラミック
ス基板接合体を得る第２工程、および得られた接合体の
金属板上にエッチングレジストにより回路パターンを形
成した後、エッチング処理により金属回路を形成する第
３工程からなることを特徴とする金属−セラミックス複
合基板の製造方法：第２に、金属板とセラミックス基板
とをろう材で接合して複合基板を製造する方法におい
て、固体分が重量％で、Ａｇ粉：６０〜９４．２５％，
Ｃｕ粉：５〜３０％，活性金属粉：０．５〜４．５％，
酸化チタン粉：０．２５〜０．９％からなる粉体１００
重量部に対し、１０〜１４重量部のビヒクルを添加混練
してペースト状のろう材をセラミックス基板上に塗布す
る第１工程、次いで該ろう材上に金属板を重ね、加熱接
合して金属板−セラミックス基板接合体を得る第２工
程、および得られた接合体の金属板上にエッチングレジ
ストにより回路パターンを形成した後、エッチング処理
により金属回路を形成する第３工程からなることを特徴
とする金属−セラミックス複合基板の製造方法：第３
に、金属板とセラミックス基板とを接合させるろう材で
あって、その組成が、重量％で、Ａｇ：６０〜９４．２
５％，Ｃｕ：５〜３０％，活性金属：０．５〜４．５
％，酸化チタン：０．２５〜０．９％からなることを特
徴とするろう材：第４に、金属板とセラミックス基板と
を接合させるろう材であって、その組成が、重量％で、
Ａｇ粉：６０〜９４．２５％，Ｃｕ粉：５〜３０％，活
性金属粉：０．５〜４．５％，酸化チタン粉：０．２５
〜０．９％からなる粉体１００重量部に対し、１０〜１
４重量部のビヒクルを添加混練してペースト状としたこ
とを特徴とするろう材を提供するものである。That is, the present invention is, firstly, in a method for manufacturing a composite substrate by joining a metal plate and a ceramic substrate with a brazing material, in which the solid content is% by weight and Ag: 60-94.
25%, Cu: 5-30%, active metal: 0.5-4.5
%, Titanium oxide: a first step of applying a brazing material composed of 0.25 to 0.9% on a ceramic substrate, and then a metal plate is placed on the brazing material and heat-bonded to the metal plate-ceramic substrate bonded body. And a third step of forming a circuit pattern on the metal plate of the obtained joined body with an etching resist, and then forming a metal circuit by an etching treatment. Manufacturing method: Secondly, in a method of manufacturing a composite substrate by joining a metal plate and a ceramic substrate with a brazing material, the solid content is% by weight, Ag powder: 60 to 94.25%,
Cu powder: 5-30%, active metal powder: 0.5-4.5%,
Titanium oxide powder: Powder 100 consisting of 0.25 to 0.9%
A first step of adding and kneading 10 to 14 parts by weight of a vehicle to parts by weight and applying a paste-like brazing material on a ceramic substrate, and then laminating a metal plate on the brazing material and heating and bonding the metal plate. A second step of obtaining a ceramics substrate bonded body, and a third step of forming a metal circuit by etching after forming a circuit pattern with an etching resist on a metal plate of the obtained bonded body. Manufacturing method of metal-ceramic composite substrate: third
A brazing material for joining a metal plate and a ceramics substrate, the composition of which is% by weight, Ag: 60-94.2.
5%, Cu: 5-30%, active metal: 0.5-4.5
%, Titanium oxide: 0.25 to 0.9% brazing material: Fourthly, a brazing material for joining a metal plate and a ceramic substrate, the composition of which is wt%,
Ag powder: 60 to 94.25%, Cu powder: 5 to 30%, active metal powder: 0.5 to 4.5%, titanium oxide powder: 0.25
10 to 1 to 100 parts by weight of powder consisting of 0.9%
The present invention provides a brazing material, characterized in that 4 parts by weight of a vehicle is added and kneaded to form a paste.
【０００９】[0009]
【発明の実施の形態】本発明において使用するろう材の
組成範囲は、Ａｇが６０〜９４．２５重量％である。こ
れは６０重量％未満および９４．２５重量％を超えると
接着力が弱まるので好ましくないからである。またＣｕ
分は５〜３０重量％の範囲であるが、これは５重量％未
満および３０重量％を超えると耐熱衝撃力が低下するた
め好ましくないからである。BEST MODE FOR CARRYING OUT THE INVENTION The composition range of the brazing filler metal used in the present invention is 60 to 94.25% by weight of Ag. This is because if it is less than 60% by weight or more than 94.25% by weight, the adhesive strength is weakened, which is not preferable. Cu
The content is in the range of 5 to 30% by weight, because if it is less than 5% by weight or exceeds 30% by weight, the thermal shock resistance is lowered, which is not preferable.
【００１０】本発明において使用し得る活性金属として
はＴｉ、Ｚｒ、Ｈｆなど周期律表のIVａ族の元素のうち
の少なくとも１種であり、添加形態としては金属体とし
て、あるいは水素化合物として用いてもよく、添加量と
しては０．５〜４．５重量％の範囲が好ましい。これは
０．５重量％未満では生成される窒化物層が少なくなり
接着強度がなく、一方、４．５重量％を超えると逆に接
着強度は高くなるものの、接合後にクラックが発生しや
すいという欠点があるからである。The active metal that can be used in the present invention is at least one of the elements of Group IVa of the Periodic Table such as Ti, Zr, Hf, etc., and is added as a metal body or as a hydrogen compound. The addition amount is preferably in the range of 0.5 to 4.5% by weight. If it is less than 0.5% by weight, the nitride layer produced is small and the adhesive strength is low. On the other hand, if it exceeds 4.5% by weight, the adhesive strength is high, but cracks tend to occur after joining. This is because it has drawbacks.
【００１１】酸化チタンの形態としてはＴｉＯやＴｉＯ
2 を用いて０．２５〜０．９重量％の範囲で添加され
る。また、これらは非晶質であっても結晶質のものであ
っても構わない。The form of titanium oxide is TiO or TiO.
2 is added in the range of 0.25 to 0.9% by weight. Further, these may be amorphous or crystalline.
【００１２】これらの範囲の酸化チタンを上記組成のろ
う材に添加することによって耐ヒートサイクル性、抗折
強度、たわみ量、通炉耐量等の特性向上に寄与すること
を本発明者の実験によって確認することができた。この
理由として、ＴｉＯ2 はろう材中に均一に分散されるこ
とにより応力の集中が緩和されるためと考えられる。Experiments conducted by the present inventor have shown that the addition of titanium oxide in the above range to the brazing filler metal having the above composition contributes to the improvement of the characteristics such as heat cycle resistance, bending strength, deflection amount, and furnace resistance. I was able to confirm. It is considered that this is because TiO 2 is uniformly dispersed in the brazing filler metal, so that concentration of stress is relaxed.
【００１３】ろう材組成として上記範囲の合金をそのま
ま、あるいは有機溶剤と混合してペースト状にして用い
るが、この場合、金属部材とセラミックス部材を単に接
合する場合には合金材を板状や箔状にして使用できる
他、セラミックス基板上に電子回路を形成する場合に
は、ペーストろう材を用いた方が好ましい。As the brazing material composition, the alloy in the above range is used as it is or in the form of a paste by mixing with an organic solvent. In this case, when the metal member and the ceramic member are simply joined, the alloy material is a plate or foil. Besides being usable in the form of a paste, it is preferable to use a paste brazing material when forming an electronic circuit on a ceramic substrate.
【００１４】上記ペースト状ろう材は、テレピネオー
ル、トルエン、メチルセロソルブ、エチルセロソルブ等
の有機溶剤５５〜７５容量部と、ＰＭＭＡ、メチルセル
ローズ、エチルセルローズ等の有機結合剤２５〜４５容
量部とを混合して得たビヒクルを、上記混合粉末１００
重量部当り１０〜１４重量部の割合に添加して混練した
ものを用いた。The paste-like brazing material is prepared by mixing 55 to 75 parts by volume of an organic solvent such as terpineol, toluene, methyl cellosolve and ethyl cellosolve and 25 to 45 parts by volume of an organic binder such as PMMA, methyl cellulose and ethyl cellulose. The vehicle obtained by
What was added and kneaded at a ratio of 10 to 14 parts by weight per part by weight was used.
【００１５】この場合１０〜１４重量部の割合としたの
は、１０％以下だとペーストの粘度が高いため印刷時に
かすれやすく、逆に１４％を越えるとペーストの粘度が
低いため印刷に印刷形状が流れやすいことによる。In this case, the ratio of 10 to 14 parts by weight is set so that if the content is 10% or less, the viscosity of the paste is high, so that the ink tends to be faint during printing. Is easy to flow.
【００１６】以下、実施例をもって詳しく説明するが本
発明の範囲はこれらに限定されるものではない。Hereinafter, the present invention will be described in detail with reference to Examples, but the scope of the present invention is not limited to these.
【００１７】[0017]
【実施例１】セラミックス基板として５３×２９mmのＡ
ｌＮ基板に、固形分がＡｇ粉 ７０．０重量％、Ｃｕ粉
２７．０重量％、Ｔｉ粉 ２．５重量％、ＴｉＯ2 粉
０．５重量％からなる粉体１００重量部に対して、１
２．４重量部となるビヒクルを添加混練してろう材ペー
ストを全面塗布した後、金属板としての厚みが０．３mm
と０．２５mmの銅板を重ねて接合炉中において８３０℃
で焼成し、接合体を得た。[Example 1] A of 53 x 29 mm as a ceramic substrate
On an IN substrate, 100 parts by weight of a powder having a solid content of 70.0% by weight of Ag powder, 27.0% by weight of Cu powder, 2.5% by weight of Ti powder and 0.5% by weight of TiO 2 powder, 1
2.4 parts by weight of vehicle is added and kneaded to apply the brazing material paste over the entire surface, and then the thickness of the metal plate is 0.3 mm.
And 0.25mm copper plate are piled up and 830 ℃
Then, it was fired to obtain a joined body.
【００１８】得られた接合体の特性を調べるため、ヒー
トサイクル特性、抗折強度、たわみ量および通炉耐量に
ついて試験を行い、その結果を表１に示した。In order to investigate the characteristics of the obtained joined body, heat cycle characteristics, flexural strength, flexural amount and through-flow resistance were tested, and the results are shown in Table 1.
【００１９】[0019]
【比較例１】実施例１と同様なＡｌＮ基板に、従来公知
の固形分がＡｇ ７０重量％、Ｃｕ２７．５重量％、Ｔ
ｉ ２．５重量％の金属活性ペーストろう材を用いた他
は実施例１と同一条件で接合体（基板）を得、同様にヒ
ートサイクル特性などの試験を行い結果を表１に示し
た。COMPARATIVE EXAMPLE 1 An AlN substrate similar to that used in Example 1 was used.
i A bonded body (substrate) was obtained under the same conditions as in Example 1 except that 2.5% by weight of the metal active paste brazing material was used, and the heat cycle characteristics and other tests were similarly conducted. The results are shown in Table 1.
【００２０】[0020]
【表１】 [Table 1]
【００２１】表１の結果から本発明によるろう材を用い
て接合した接合基板のヒートサイクル性は従来のろう材
を用いた基板の２倍以上の耐性を示し、抗折強度やたわ
み量についてもヒートサイクル５０回以降の数値が従来
のものに比し極めて高くなっていることが確認された。From the results shown in Table 1, the heat cycle property of the joined substrate joined by using the brazing material according to the present invention is more than twice as high as that of the substrate using the conventional brazing material, and the bending strength and the amount of bending are also high. It was confirmed that the value after 50 heat cycles was extremely higher than that of the conventional one.
【００２２】[0022]
【実施例２】実施例１に示す金属板としての銅板の厚み
を０．３mmと０．１５mmの２枚に代えた他は実施例１と
全く同一の条件で接合基板を得、実施例１と同様の特性
を試験しその結果を表２に示した。Example 2 A bonded substrate was obtained under exactly the same conditions as in Example 1 except that the thickness of the copper plate as the metal plate shown in Example 1 was changed to two of 0.3 mm and 0.15 mm. The same characteristics as above were tested, and the results are shown in Table 2.
【００２３】[0023]
【比較例２】実施例２に示したＡｌＮ基板に、比較例１
に示した従来公知のＡｇ−Ｃｕ−Ｔｉの合金ろう材を用
いた他は実施例２と同じ条件で接合体（基板）を得、同
様にヒートサイクル特性などの試験を行い結果を表２に
示した。[Comparative Example 2] On the AlN substrate shown in Example 2, Comparative Example 1
A joint body (substrate) was obtained under the same conditions as in Example 2 except that the conventionally known Ag-Cu-Ti alloy brazing material shown in FIG. Indicated.
【００２４】[0024]
【表２】 [Table 2]
【００２５】表２の結果から、本発明に基づくろう材を
用いた場合の特性はいずれも公知のＡｇ−Ｃｕ−Ｔｉ合
金ろう材を用いた場合よりも向上していることが判明し
た。From the results shown in Table 2, it was found that the characteristics when the brazing material according to the present invention was used were all improved as compared with the case where the known Ag-Cu-Ti alloy brazing material was used.
【００２６】[0026]
【実施例３】実施例１に示した条件と同じ条件で接合し
て得た接合基板の銅板表面に所定の電子回路パターンを
エッチングレジストにより形成させた後、塩化第二鉄を
主成分とするエッチング液で銅の不要部分を除去し、次
いでエッチングレジスト膜を除去することによって銅回
路を有する窒化アルミニウム基板を形成した。[Embodiment 3] A predetermined electronic circuit pattern is formed on a copper plate surface of a bonded substrate obtained by bonding under the same conditions as those in Embodiment 1, by using an etching resist, and then ferric chloride is used as a main component. An unnecessary portion of copper was removed with an etching solution, and then the etching resist film was removed to form an aluminum nitride substrate having a copper circuit.
【００２７】[0027]
【実施例４】ろう材へのＴｉＯ2 の添加量によるピール
強度を調べるため、ろう材組成をＡｇ ７０重量％、Ｃ
ｕ ２７．５重量％、Ｔｉ ２．５重量％と一定とした
ろう材にＴｉＯ2 の添加量を０、０．２５、０．５、
０．７５、０．９、１．０重量％に変えて金属−セラミ
ックス接合基板を得て、得られたピール強度の値を図１
に、ヒートサイクル５０回後の抗折強度の値を図２に示
した。Example 4 In order to investigate the peel strength depending on the amount of TiO 2 added to the brazing material, the brazing material composition was Ag 70% by weight, C
u 27.5% by weight and Ti 2.5% by weight, and the addition amount of TiO 2 was 0, 0.25, 0.5,
A metal-ceramic bonding substrate was obtained by changing to 0.75, 0.9 and 1.0% by weight, and the obtained peel strength values are shown in FIG.
Further, the values of the bending strength after 50 heat cycles are shown in FIG.
【００２８】ピール強度が１０kg/cm 以上である０．９
重量％以下の範囲が好ましいことがわかった。Peel strength of 10 kg / cm or more 0.9
It has been found that a range of less than or equal to wt% is preferred.
【００２９】また、同様に図２の結果からＴｉＯ2 量
０．２５重量％ではヒートサイクル５０回後の抗折強度
が、銅厚０．３／０．１５（mm）の（実線で示す）場合
は２７kgf/mm2 であり、銅厚０．３／０．２５（mm）の
（一点鎖線で示す）場合は２２kgf/mm2 であり、実用的
には、０．２５重量％以上であれば好ましいことがわか
った。これら図１および図２の結果から、酸化チタンの
量は０．２５〜０．９重量％が適正であることが判明し
た。Similarly, from the result of FIG. 2, the amount of TiO 2 is
At 0.25% by weight, the bending strength after 50 heat cycles is 27 kgf / mm 2 when the copper thickness is 0.3 / 0.15 (mm) (shown by the solid line), and the copper thickness is 0.3 / In the case of 0.25 (mm) (shown by the one-dot chain line), it was 22 kgf / mm 2 , and it was found that 0.25% by weight or more is preferable for practical use. From these results shown in FIGS. 1 and 2, it was found that an appropriate amount of titanium oxide is 0.25 to 0.9% by weight.
【００３０】[0030]
【実施例５】ろう材へのＴｉの添加量によるピール強度
を調べるため、ろう材組成をＡｇ粉７０重量部、Ｃｕ粉
２７．５重量部と一定とした銀銅ろう材に、活性金属
としてＴｉ粉を０．５、１．０、１．５、２．０、２．
５、３．０、４．０重量％に変えて金属−セラミックス
接合基板を得て、得られたピール強度の値を図３に示し
た。この結果からＴｉ粉の適正添加量は、０．５〜４．
０重量％が好ましいことが判明した。[Example 5] In order to examine the peel strength depending on the amount of Ti added to the brazing filler metal, a silver copper brazing filler metal having a constant brazing filler metal composition of 70 parts by weight of Ag powder and 27.5 parts by weight of Cu powder was used as an active metal. Ti powder 0.5, 1.0, 1.5, 2.0, 2.
A metal-ceramic bonding substrate was obtained by changing the amount to 5, 3.0 and 4.0% by weight, and the obtained peel strength values are shown in FIG. From this result, the proper addition amount of Ti powder is 0.5 to 4.
It has been found that 0% by weight is preferred.
【００３１】[0031]
【実施例６】Ａｇ ７０．０重量％、Ｃｕ ２７．５重
量％からなる合金ろう材を粉砕した後、Ｔｉ粉 ２．５
重量％、ＴｉＯ2 粉 ０．５重量％とを混合したものを
加熱溶解して４成分の合金ろう材箔を得た。これを５３
×２９mmのＡｌＮ基板の両面に接触させた後、金属板と
しての厚みが０．３mmと０．２５mmの銅板を重ねて接合
炉中において焼成し、接合体を得た。Example 6 After brazing an alloy brazing material composed of Ag 70.0% by weight and Cu 27.5% by weight, Ti powder 2.5
A mixture of 1% by weight and 0.5% by weight of TiO 2 powder was melted by heating to obtain a four-component alloy brazing material foil. 53 this
After contacting both surfaces of an AlN substrate having a size of 29 mm, copper plates having thicknesses of 0.3 mm and 0.25 mm as metal plates were stacked and fired in a bonding furnace to obtain a bonded body.
【００３２】得られた接合体の特性を調べるため、ヒー
トサイクル特性、抗折強度、たわみ量および通炉耐量に
ついて試験を行い、その結果を表３に示した。In order to examine the characteristics of the obtained joined body, heat cycle characteristics, bending strength, flexural amount and through-flow resistance were tested, and the results are shown in Table 3.
【００３３】[0033]
【実施例７】Ａｇ粉 ７０．０重量％、Ｃｕ粉 ２７．
５重量％、Ｔｉ粉 ２．５重量％、ＴｉＯ2 粉 ０．５
重量％からなる粉体を混合した後、加熱溶解して４成分
系合金ろう材箔を得た。この合金ろう材箔を用いた他
は、実施例６に示す手段と同一な方法でヒートサイクル
特性や抗折強度等を調べ、その結果を表３に併せて示し
た。Example 7 Ag powder 70.0% by weight, Cu powder 27.
5% by weight, Ti powder 2.5% by weight, TiO 2 powder 0.5
After mixing the powder consisting of wt%, it was heated and melted to obtain a four-component alloy brazing material foil. The heat cycle characteristics, bending strength, etc. were examined by the same method as in Example 6 except that this alloy brazing foil was used, and the results are also shown in Table 3.
【００３４】表３の結果から、実施例１〜実施例５に示
す本発明ペーストろう材に比べると抗折強度やたわみ量
が若干劣るものの、従来のろう材よりは諸特性がはるか
に優れていることが判明した。From the results shown in Table 3, although the bending strength and the amount of flexure are slightly inferior to the paste brazing materials of the present invention shown in Examples 1 to 5, the properties are far superior to the conventional brazing materials. It turned out that
【００３５】[0035]
【表３】 [Table 3]
【００３６】[0036]
【発明の効果】以上説明したように、本発明のろう材は
従来公知のＡｇ−Ｃｕ−Ｔｉ系ろう材に酸化物（酸化チ
タン）を適量添加することによってＡｇ−Ｃｕ−Ｔｉ−
ＴｉＯ2 系ろう材として得られるので、これを用いて金
属−セラミックス複合基板を製造することにより、ヒー
トサイクル性など大電力化に対応可能な特性が向上した
複合基板とすることができる。As described above, the brazing material of the present invention is prepared by adding an appropriate amount of an oxide (titanium oxide) to a conventionally known Ag-Cu-Ti based brazing material.
Since it is obtained as a TiO 2 -based brazing filler metal, a metal-ceramic composite substrate can be manufactured using this to provide a composite substrate with improved characteristics such as heat cycle property that can cope with high power consumption.
【図面の簡単な説明】[Brief description of the drawings]
【図１】Ａｇ−Ｃｕ−Ｔｉ系ろう材におけるＴｉＯ2 の
添加量と金属−セラミックス複合基板のピール強度との
関係を調べたグラフである。FIG. 1 is a graph showing the relationship between the amount of TiO 2 added to an Ag—Cu—Ti brazing material and the peel strength of a metal-ceramic composite substrate.
【図２】Ａｇ−Ｃｕ−Ｔｉ系ろう材におけるＴｉＯ2 の
添加量と金属−セラミックス複合基板のヒートサイクル
５０回後の抗折強度との関係を調べたグラフである。FIG. 2 is a graph showing the relationship between the addition amount of TiO 2 in an Ag—Cu—Ti brazing material and the bending strength of a metal-ceramic composite substrate after 50 heat cycles.
【図３】Ａｇ−Ｃｕ−Ｔｉ系ろう材におけるＴｉ量を変
化させた場合のヒートサイクル特性を調べたグラフであ
る。FIG. 3 is a graph in which heat cycle characteristics are examined when the amount of Ti in the Ag—Cu—Ti based brazing material is changed.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 小野 隆司 東京都千代田区丸の内１丁目８番２号 同 和鉱業株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Takashi Ono 1-2-8 Marunouchi, Chiyoda-ku, Tokyo Dowa Mining Co., Ltd.
Claims (4)
接合して複合基板を製造する方法において、固体分が重
量％で、 Ａｇ：６０〜９４．２５％， Ｃｕ： ５〜３０％， 活性金属：０．５〜４．５％， 酸化チタン：０．２５〜０．９％ からなるろう材をセラミックス基板上に塗布する第１工
程、次いで該ろう材上に金属板を重ね、加熱接合して金
属板−セラミックス基板接合体を得る第２工程、および
得られた接合体の金属板上にエッチングレジストにより
回路パターンを形成した後、エッチング処理により金属
回路を形成する第３工程からなることを特徴とする金属
−セラミックス複合基板の製造方法。1. A method for producing a composite substrate by bonding a metal plate and a ceramic substrate with a brazing material, wherein the solid content is% by weight, Ag: 60 to 94.25%, Cu: 5 to 30%, activity. First step of applying a brazing material composed of metal: 0.5 to 4.5% and titanium oxide: 0.25 to 0.9% on a ceramic substrate, then overlaying a metal plate on the brazing material and heating and bonding And a third step of forming a circuit pattern on the metal plate of the obtained joined body by an etching resist, and then forming a metal circuit by an etching treatment. A method for producing a metal-ceramic composite substrate, comprising:
接合して複合基板を製造する方法において、固体分が重
量％で、 Ａｇ粉：６０〜９４．２５％， Ｃｕ粉： ５〜３０％， 活性金属粉：０．５〜４．５％， 酸化チタン粉：０．２５〜０．９％ からなる粉体１００重量部に対し、１０〜１４重量部の
ビヒクルを添加混練して得たペースト状のろう材をセラ
ミックス基板上に塗布する第１工程、次いで該ろう材上
に金属板を重ね、加熱接合して金属板−セラミックス基
板接合体を得る第２工程、および得られた接合体の金属
板上にエッチングレジストにより回路パターンを形成し
た後、エッチング処理により金属回路を形成する第３工
程からなることを特徴とする金属−セラミックス複合基
板の製造方法。2. A method for manufacturing a composite substrate by joining a metal plate and a ceramic substrate with a brazing material, wherein the solid content is% by weight, Ag powder: 60 to 94.25%, Cu powder: 5 to 30%. Obtained by adding and kneading 10 to 14 parts by weight of a vehicle to 100 parts by weight of a powder composed of active metal powder: 0.5 to 4.5% and titanium oxide powder: 0.25 to 0.9%. A first step of applying a paste-like brazing material on a ceramic substrate, then a second step of stacking a metal plate on the brazing material and heat-bonding to obtain a metal plate-ceramic substrate bonded body, and the bonded body obtained. 3. A method for producing a metal-ceramic composite substrate, comprising the third step of forming a circuit pattern on the metal plate with an etching resist and then forming a metal circuit by etching.
るろう材であって、その組成が、重量％で、 Ａｇ：６０〜９４．２５％， Ｃｕ： ５〜３０％， 活性金属：０．５〜４．５％， 酸化チタン：０．２５〜０．９％ からなることを特徴とするろう材。3. A brazing material for joining a metal plate and a ceramics substrate, the composition of which, by weight%, is Ag: 60 to 94.25%, Cu: 5 to 30%, active metal: 0.5. .About.4.5%, titanium oxide: 0.25 to 0.9%.
るろう材であって、その組成が、重量％で、 Ａｇ粉：６０〜９４．２５％， Ｃｕ粉： ５〜３０％， 活性金属粉：０．５〜４．５％， 酸化チタン粉：０．２５〜０．９％ からなる粉体１００重量部に対し、１０〜１４重量部の
ビヒクルを添加混練してペースト状としたことを特徴と
するろう材。4. A brazing material for joining a metal plate and a ceramics substrate, the composition of which is% by weight, Ag powder: 60 to 94.25%, Cu powder: 5 to 30%, active metal powder: It is characterized by adding and kneading 10 to 14 parts by weight of a vehicle to 100 parts by weight of a powder composed of 0.5 to 4.5% and titanium oxide powder: 0.25 to 0.9% to form a paste. Brazing material.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30385496A JP3896432B2 (en) | 1995-11-08 | 1996-10-30 | Method for producing metal-ceramic composite substrate and brazing material used therefor |
| US08/850,183 US5955686A (en) | 1996-10-30 | 1997-05-02 | Brazing materials for producing metal-ceramics composite substrates |
| DE69710021T DE69710021T2 (en) | 1996-10-30 | 1997-05-05 | Method of manufacturing a ceramic-metal composite substrate and brazing material for use in this method |
| EP97107391A EP0839598B1 (en) | 1996-10-30 | 1997-05-05 | Processes for producing metal-ceramics composite substrates and brazing materials for use in such processes |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31469195 | 1995-11-08 | ||
| JP7-314691 | 1995-11-08 | ||
| JP30385496A JP3896432B2 (en) | 1995-11-08 | 1996-10-30 | Method for producing metal-ceramic composite substrate and brazing material used therefor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09188582A true JPH09188582A (en) | 1997-07-22 |
| JP3896432B2 JP3896432B2 (en) | 2007-03-22 |
Family
ID=26563662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30385496A Expired - Lifetime JP3896432B2 (en) | 1995-11-08 | 1996-10-30 | Method for producing metal-ceramic composite substrate and brazing material used therefor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3896432B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0868961A1 (en) * | 1997-03-12 | 1998-10-07 | Dowa Mining Co., Ltd. | Metal-ceramic composite substrates, producing methods thereof and brazing materials for use in such method |
| JP2008521613A (en) * | 2004-11-30 | 2008-06-26 | ザ、リージェンツ、オブ、ザ、ユニバーシティ、オブ、カリフォルニア | Brazing system with suitable thermal expansion coefficient |
| US8287673B2 (en) | 2004-11-30 | 2012-10-16 | The Regents Of The University Of California | Joining of dissimilar materials |
| KR101431174B1 (en) * | 2012-05-25 | 2014-08-18 | 주식회사 케이씨씨 | Solder Paste And metal bonded Ceramic Substrates |
| WO2021200242A1 (en) * | 2020-03-31 | 2021-10-07 | Ｄｏｗａメタルテック株式会社 | Brazing material, method for producing same, and method for producing metal-ceramics bonded substrate |
-
1996
- 1996-10-30 JP JP30385496A patent/JP3896432B2/en not_active Expired - Lifetime
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0868961A1 (en) * | 1997-03-12 | 1998-10-07 | Dowa Mining Co., Ltd. | Metal-ceramic composite substrates, producing methods thereof and brazing materials for use in such method |
| US6221511B1 (en) | 1997-03-12 | 2001-04-24 | Dowa Mining Co. Ltd. | Metal-ceramic composite substrates, producing methods thereof and brazing materials for use in such method |
| US6354484B1 (en) * | 1997-03-12 | 2002-03-12 | Dowa Mining Co., Ltd. | Process for producing a metal-ceramic composite substrate |
| US6399019B1 (en) | 1997-03-12 | 2002-06-04 | Dowa Mining Co., Ltd. | Brazing material for use in joining a metal plate to a ceramic substrate |
| EP1295671A1 (en) * | 1997-03-12 | 2003-03-26 | Dowa Mining Co., Ltd. | Metal-ceramic composite substrates, producing methods thereof and brazing materials for use in such method |
| JP2008521613A (en) * | 2004-11-30 | 2008-06-26 | ザ、リージェンツ、オブ、ザ、ユニバーシティ、オブ、カリフォルニア | Brazing system with suitable thermal expansion coefficient |
| US8287673B2 (en) | 2004-11-30 | 2012-10-16 | The Regents Of The University Of California | Joining of dissimilar materials |
| KR101431174B1 (en) * | 2012-05-25 | 2014-08-18 | 주식회사 케이씨씨 | Solder Paste And metal bonded Ceramic Substrates |
| WO2021200242A1 (en) * | 2020-03-31 | 2021-10-07 | Ｄｏｗａメタルテック株式会社 | Brazing material, method for producing same, and method for producing metal-ceramics bonded substrate |
| CN115151371A (en) * | 2020-03-31 | 2022-10-04 | 同和金属技术有限公司 | Brazing material, method for producing same, and method for producing metal-ceramic bonded substrate |
| EP4130308A4 (en) * | 2020-03-31 | 2024-05-01 | Dowa Metaltech Co Ltd | Brazing material, method for producing same, and method for producing metal-ceramics bonded substrate |
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| Publication number | Publication date |
|---|---|
| JP3896432B2 (en) | 2007-03-22 |
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