JPH09186456A - Multilayer printed wiring board and production thereof - Google Patents
Multilayer printed wiring board and production thereofInfo
- Publication number
- JPH09186456A JPH09186456A JP34376195A JP34376195A JPH09186456A JP H09186456 A JPH09186456 A JP H09186456A JP 34376195 A JP34376195 A JP 34376195A JP 34376195 A JP34376195 A JP 34376195A JP H09186456 A JPH09186456 A JP H09186456A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- insulating resin
- resin layer
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、アディティブ法に
よって製造する多層印刷配線板およびその製造方法に関
し、特に層間を接続する非貫通接続穴（Ｉ．Ｖ．Ｈ）の
構造およびその製造方法に関する。The present invention relates to a multilayer printed wiring board manufactured by an additive method and a method of manufacturing the same, and more particularly, to a structure of a non-through connection hole (IVH) connecting between layers and a method of manufacturing the same.
【０００２】[0002]
【従来の技術】図４は従来の多層印刷配線板の製造方法
を示す断面図で、同図に基づいて多層印刷配線板の製造
方法を説明する。まず、同図（ａ）に示すように、上下
２枚の銅張積層板２１，２２の一方の銅張積層板２１に
ドリルによって穴２３を穿孔し、電気めっきにより導体
部２４と非貫通接続穴を構成する接続導体部２５を形成
して両面板２６，２６とする。次に、同図（ｂ）に示す
ように、これら両面板２６，２６の対向する側の一方の
導体部２４にエッチングにより内層回路２７，２７を形
成する。そして、同図（ｃ）に示すように、両面板２
６，２６の内層回路２７，２７間にプリプレグとしての
ガラスクロス樹脂含浸布２８を挟み、加熱加圧プレスで
熱圧着する。しかる後、ドリルで貫通穴２９を穿孔し、
電気めっきにより導体部３０とスルーホールを構成する
接続導体部３１を形成する。さらに、同図（ｄ）に示す
ように、エッチングで外層回路３２を形成することによ
って、層間を接続する非貫通接続穴を備えた多層印刷配
線板が形成される。2. Description of the Related Art FIG. 4 is a sectional view showing a conventional method for manufacturing a multilayer printed wiring board. The method for manufacturing a multilayer printed wiring board will be described with reference to FIG. First, as shown in FIG. 3A, a hole 23 is drilled in one of the upper and lower two copper-clad laminates 21 and 22 by a drill, and non-penetrating connection with the conductor 24 is performed by electroplating. The connection conductor portion 25 that forms the hole is formed as the double-sided plates 26, 26. Next, as shown in FIG. 3B, inner layer circuits 27, 27 are formed on one conductor portion 24 on the opposite side of the double-sided plates 26, 26 by etching. Then, as shown in FIG.
A glass cloth resin impregnated cloth 28 as a prepreg is sandwiched between the inner layer circuits 27, 27 of the first and second circuits 26, 26, and thermocompression-bonded by a heating and pressing press. Then, drill a through hole 29 with a drill,
A connection conductor portion 31 forming a through hole with the conductor portion 30 is formed by electroplating. Further, as shown in FIG. 3D, by forming the outer layer circuit 32 by etching, a multilayer printed wiring board having non-through connection holes for connecting the layers is formed.
【０００３】図５は従来の別の多層印刷配線板の断面図
で、この例では、両面に内層回路２を形成した銅張積層
板１の両側にプライマー層３、絶縁樹脂層４および接着
剤５を形成し、めっきレジスト８を介して外層回路１１
を形成したのちに、ドリルにより非貫通穴６を凹設し、
そこに電気めっきで非貫通接続穴を構成する接続導体部
９を形成する。FIG. 5 is a cross-sectional view of another conventional multilayer printed wiring board. In this example, a primer layer 3, an insulating resin layer 4 and an adhesive are provided on both sides of a copper-clad laminate 1 having an inner layer circuit 2 formed on both sides. 5 is formed, and the outer layer circuit 11 is formed via the plating resist 8.
After forming, a non-through hole 6 is recessed by a drill,
The connection conductor 9 constituting the non-through connection hole is formed by electroplating there.
【０００４】[0004]
【発明が解決しようとする課題】上述した第１の従来例
では、両面板２６，２６どうしを張り合わせる構造とし
ているので、めっき工程は個々の銅張積層板２０，２１
で１回づつ計２回行い、両面板の張り合わせをして貫通
穴７を穿孔後に１回行うため、合計３回のめっきを行う
必要があり、このために製造コストが高かった。また、
第２の従来例では、ドリルの穿孔深さを制御しなければ
ならいため、穿孔のための作業時間が余計にかかり量産
に適さない。また、僅かな製造誤差によって導通が不確
実になるおそれがある。In the above-mentioned first conventional example, the double-sided plates 26, 26 have a structure in which the two plates 26, 26 are attached to each other.
In this case, plating is performed twice in total, and the double-sided boards are bonded together and the through-hole 7 is performed once after the perforation. Therefore, plating has to be performed three times in total, and the manufacturing cost is high. Also,
In the second conventional example, since the drilling depth of the drill has to be controlled, the work time for drilling is extra, which is not suitable for mass production. Also, conduction may become uncertain due to a slight manufacturing error.
【０００５】本発明は上記した従来の問題を解決するた
めになされたもので、その目的とするところは、製造コ
ストの低減と量産性の向上および品質の向上を図った多
層印刷配線板およびその製造方法を提供することにあ
る。The present invention has been made to solve the above-mentioned conventional problems, and an object of the present invention is to reduce a manufacturing cost, improve mass productivity, and improve quality, and a multilayer printed wiring board. It is to provide a manufacturing method.
【０００６】[0006]
【課題を解決するための手段】この目的を達成するため
に、本発明に係る多層印刷配線板は、触媒入り銅張積層
板の表面に形成した内層回路と、この内層回路を覆うよ
うに前記銅張積層板の表面に積層した触媒入り絶縁樹脂
層と、この絶縁樹脂層のみに凹設した非貫通穴と、この
非貫通穴および前記絶縁樹脂層に形成した導体接続部お
よび外層回路とを備えた多層印刷配線板であって、前記
非貫通穴を短パルスＣＯ2 レーザによって穿孔すること
により、穴の壁面を粗面に形成したものである。したが
って、非貫通穴の壁面と導体接続部との密着性が向上す
る。In order to achieve this object, a multilayer printed wiring board according to the present invention comprises an inner layer circuit formed on the surface of a copper clad laminate containing a catalyst and the inner layer circuit so as to cover the inner layer circuit. A catalyst-containing insulating resin layer laminated on the surface of the copper-clad laminate, a non-through hole recessed only in the insulating resin layer, a conductor connecting portion formed in the non-through hole and the insulating resin layer, and an outer layer circuit. A multilayer printed wiring board provided, wherein the wall surface of the hole is formed into a rough surface by punching the non-through hole with a short pulse CO 2 laser. Therefore, the adhesion between the wall surface of the non-through hole and the conductor connection portion is improved.
【０００７】[0007]
【発明の実施の形態】以下、本発明の実施の形態を図に
基づいて説明する。図１は本発明に係る多層印刷配線板
の製造方法を説明する図である。同図（ａ）において、
１はめっき触媒入りガラスエポキシ銅張積層板であっ
て、先ず、この銅張積層板１の両面にエッチングによっ
て内層回路２を形成する。次に、同図（ｂ）に示すよう
に、銅張積層板１の両面にプライマー層３を介して絶縁
樹脂と充填材からなる絶縁樹脂層４を積層し、絶縁樹脂
層４の表面に接着剤５を塗布する。このようにプライマ
ー層３によって絶縁樹脂層４と銅張積層板１との密着性
が向上する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram illustrating a method for manufacturing a multilayer printed wiring board according to the present invention. In FIG.
Reference numeral 1 denotes a glass epoxy copper-clad laminate containing a plating catalyst. First, an inner layer circuit 2 is formed on both surfaces of the copper-clad laminate 1 by etching. Next, as shown in FIG. 1B, an insulating resin layer 4 made of an insulating resin and a filler is laminated on both surfaces of the copper-clad laminate 1 with a primer layer 3 interposed therebetween, and adhered to the surface of the insulating resin layer 4. Apply agent 5. Thus, the adhesion between the insulating resin layer 4 and the copper clad laminate 1 is improved by the primer layer 3.
【０００８】そして、同図（ｃ）に示すように、短時間
に高いエネルギーで絶縁樹脂層４を炭化することなく切
削することができるパルス幅１０-4〜１０-8秒の範囲の
短パルスＣＯ2 レーザを一方の絶縁樹脂層４の上方から
内層回路２に向かって照射すると、短パルスＣＯ2レー
ザが内層回路２を貫通しないので、短パルスＣＯ2レー
ザによって接着剤５および絶縁樹脂層４のみに非貫通穴
６が凹設される。また、ドリルによって貫通穴７を穿設
する。さらに、同図（ｄ）に示すように、絶縁樹脂層４
の貫通穴７の穿設部分にスミア処理およびシーダ処理を
行ったのちに、外層回路１１と逆のパターンのめっきレ
ジスト層８を施す。しかる後、無電解銅めっきによって
非貫通穴６の壁面に導体接続部９を析出して非貫通接続
穴を形成するとともに、貫通穴７の壁面に導体接続部１
０を析出して貫通接続穴を形成し、かつこれら導体接続
部９，１０に導通する外層回路１１を形成する。Then, as shown in FIG. 3C, a short pulse having a pulse width in the range of 10 -4 to 10 -8 seconds, which can cut the insulating resin layer 4 with high energy in a short time without carbonizing. When the CO 2 laser is irradiated from above one of the insulating resin layers 4 toward the inner layer circuit 2, the short pulse CO 2 laser does not penetrate the inner layer circuit 2, so that the adhesive 5 and the insulating resin layer 4 are formed by the short pulse CO 2 laser. The non-penetrating hole 6 is recessed in only this. Further, a through hole 7 is formed by a drill. Further, as shown in FIG.
After performing a smear process and a seeder process on a portion where the through hole 7 is formed, a plating resist layer 8 having a pattern opposite to that of the outer layer circuit 11 is applied. Thereafter, a conductor connection portion 9 is deposited on the wall surface of the non-through hole 6 by electroless copper plating to form a non-through connection hole, and the conductor connection portion 1 is formed on the wall surface of the through hole 7.
0 is formed to form a through connection hole, and an outer layer circuit 11 which is electrically connected to the conductor connection portions 9 and 10 is formed.
【０００９】このように非貫通穴６を、銅張積層板１に
絶縁樹脂層４を積層した後、貫通穴７と同時に形成する
方法としたので、接続導体部９，１０および外層回路１
１とを一度の無電解めっきによって形成することがで
き、このためコストの低減を図ることができる。また、
絶縁樹脂層４をめっき触媒入りとし、接続導体部９，１
０および外層回路１１を無電解めっきで形成したことに
より、電解めっきで形成するときと比較して、めっき液
に浸漬させる工程が省略でき、コストの低減を図ること
ができる。Since the non-through holes 6 are formed simultaneously with the through holes 7 after the insulating resin layer 4 is laminated on the copper clad laminate 1, the connection conductors 9, 10 and the outer layer circuit 1 are formed.
1 and 1 can be formed by a single electroless plating, so that the cost can be reduced. Also,
The insulating resin layer 4 contains a plating catalyst, and the connection conductor portions 9 and 1
Since the 0 and the outer layer circuit 11 are formed by electroless plating, a step of immersion in a plating solution can be omitted as compared with the case of forming by electroless plating, and cost can be reduced.
【００１０】また、短パルスＣＯ2 レーザ光によって非
貫通穴６を凹設したので、非貫通穴６の壁面６ａが図２
に示すように極微的に見て凹凸状の粗面に形成される。
一般に、レーザ光によって非貫通穴６を凹設するときに
は、内層回路２の表面２ａに絶縁樹脂層４の樹脂が残存
し易く、このため接続導体部９と内層回路２との密着力
が低く、外部から衝撃等が加わると、接続導体部９と内
層回路２との間に応力が発生して、接続導体部９が内層
回路２から剥離して導通不良が発生する。上述したよう
に、非貫通穴６の壁面６ａが凹凸状の粗面に形成される
ことにより、接続導体部９と非貫通穴６の壁面６ａとの
密着性が向上して、接続導体部９と内層回路２との間に
発生する応力が緩和される。このため接続導体部９の内
層回路２からの剥離による導通不良が防止される。Since the non-through hole 6 is recessed by the short pulse CO 2 laser beam, the wall surface 6a of the non-through hole 6 is
As shown in (1), when viewed microscopically, it is formed on an uneven rough surface.
Generally, when the non-through hole 6 is recessed by the laser beam, the resin of the insulating resin layer 4 is likely to remain on the surface 2a of the inner layer circuit 2, so that the adhesion between the connection conductor 9 and the inner layer circuit 2 is low. When an impact or the like is applied from the outside, stress is generated between the connection conductor portion 9 and the inner layer circuit 2, and the connection conductor portion 9 peels off from the inner layer circuit 2 to cause conduction failure. As described above, since the wall surface 6a of the non-through hole 6 is formed in a rough surface with irregularities, the adhesion between the connection conductor 9 and the wall surface 6a of the non-through hole 6 is improved, and the connection conductor 9 And the stress generated between the inner layer circuit 2 and the inner layer circuit 2 are alleviated. For this reason, conduction failure due to the separation of the connection conductor portion 9 from the inner layer circuit 2 is prevented.
【００１１】この場合、接続導体部９と非貫通穴６の壁
面６ａとの密着力は、壁面６ａの凹凸の間隔に密接に関
係し、実験の結果から密着性を向上させるためには、凹
凸を４〜１５μｍの間隔に形成することが望ましいこと
がわかった。一方、この凹凸の間隔は、短パルスＣＯ2
レーザの発振波長に密接に関係し、発振波長の１／２の
間隔で凹凸が形成されることがわかっている。したがっ
て、密着性を向上させるための凹凸の間隔を４〜１５μ
ｍとするためには、発振波長が８〜３０μｍの範囲の短
パルスＣＯ2 レーザを使用するのが望ましく、本実施の
形態では、発振波長１０．６μｍのものを使用し、略
５．３μｍの間隔の凹凸が形成されている。In this case, the adhesion between the connecting conductor 9 and the wall surface 6a of the non-through hole 6 is closely related to the distance between the irregularities on the wall surface 6a. Was formed at intervals of 4 to 15 μm. On the other hand, the interval between the irregularities is a short pulse CO 2
It is known that the irregularities are closely related to the oscillation wavelength of the laser and are formed at intervals of 1/2 of the oscillation wavelength. Therefore, the interval between the irregularities for improving the adhesion is 4 to 15 μm.
In order to set m, it is desirable to use a short pulse CO 2 laser having an oscillation wavelength in the range of 8 to 30 μm. In this embodiment, a laser having an oscillation wavelength of 10.6 μm is used. The unevenness of the interval is formed.
【００１２】表１は本発明の非貫通接続穴と、図５で説
明した従来の非貫通接続穴との熱衝撃を与えたときの比
較結果である。この表から明らかなように、非貫通穴６
の壁面６ａを凹凸を有する粗面とした本発明の非貫通接
続穴の方が信頼性が高いことがわかる。なお、この表
は、米国軍用基準である「ＭＩＬ−ＳＴＤ−２０２Ｅ，
１０７Ｄ」に基づく熱衝撃試験を１０００サイクル行
い、その基準は、品質規格「ＭＩＬ−Ｐ−５５１１０
Ｃ」によるものである。また、サンプルはＪＩＳ Ｃ５
０１２ 両面プリン板用複合テストパターンにおいて、
試料Ｄを１層、２層に形成した多層板を作成し、１層〜
２層間距離８０μｍ、めっき厚さ３０μｍとしたもので
ある。サンプル数は１０００個で、非貫通接続穴の初期
抵抗値に対して、１０００サイクル後で１０％を越えた
サンプルをＮＧとして計数したものである。Table 1 shows a comparison result between the non-through connection hole of the present invention and the conventional non-through connection hole described with reference to FIG. As is clear from this table, the non-through hole 6
It can be seen that the non-penetrating connection hole of the present invention in which the wall surface 6a of FIG. This table is based on the U.S. military standard "MIL-STD-202E,
The thermal shock test based on “107D” is performed for 1000 cycles, and the standard is the quality standard “MIL-P-55110”
C ". The sample is JIS C5
012 In the composite test pattern for double-sided pudding board,
A multilayer board in which the sample D is formed in one layer or two layers is prepared, and
The distance between the two layers was 80 μm and the plating thickness was 30 μm. The number of samples was 1,000, and samples exceeding 10% after 1000 cycles with respect to the initial resistance value of the non-through connection hole were counted as NG.
【００１３】[0013]
【表１】 [Table 1]
【００１４】また、従来のように内層回路２と外層回路
１１との間に、レーザ光が乱反射するプリプレグとして
のガラスクロス樹脂含浸布が介在していないので、レー
ザ光による非貫通穴６の形成が良好に行われ、このため
非貫通穴６の壁面６ａには、接続導体部９と非貫通穴６
の壁面６ａとの密着性を向上させるための凹凸が形成さ
れる。Further, since there is no glass cloth resin impregnated cloth as a prepreg that reflects laser light irregularly between the inner layer circuit 2 and the outer layer circuit 11 as in the prior art, the non-through hole 6 is formed by laser light. The connection conductor portion 9 and the non-through hole 6
Unevenness is formed to improve the adhesion to the wall surface 6a of the.
【００１５】図３は本発明の第２の実施の形態を示す一
部を拡大した断面図である。この第２の実施の形態で
は、同心円状に環状に形成した小径の非貫通穴１５ａと
大径の非貫通穴１５ｂとを短パルスＣＯ2 レーザで形成
し、これら非貫通穴１５ａ，１５ｂに無電解銅めっきに
より接続導体部１６ａ，１６ｂを析出して非貫通穴接続
部を形成する。図６は大径の非貫通穴１５ｂの外径Ｒと
同じに形成された従来の非貫通穴６を示すもので、この
従来の非貫通穴６と、上述した第２の実施の形態の同心
円上に形成した非貫通穴１５ａ，１５ｂとの穴の外周長
を比較すると、第２の実施の形態の方が大きい。FIG. 3 is a partially enlarged sectional view showing a second embodiment of the present invention. In the second embodiment, a small-diameter non-through hole 15a and a large-diameter non-through hole 15b formed concentrically and annularly are formed by a short-pulse CO 2 laser, and the non-through holes 15a and 15b The connection conductor portions 16a and 16b are deposited by electrolytic copper plating to form a non-through hole connection portion. FIG. 6 shows a conventional non-through hole 6 formed to be the same as the outer diameter R of the large-diameter non-through hole 15b. The conventional non-through hole 6 and the concentric circle of the second embodiment described above. Comparing the outer peripheral lengths of the non-through holes 15a and 15b formed above, the second embodiment is larger.
【００１６】このため、第２の実施の形態における大径
の非貫通穴１５ｂと、従来の非貫通穴６との底面積が同
じにもかかわらず、第２の実施の形態の非貫通接続穴の
方が壁面の表面積が大きくなり、これによって接続のた
めの導通抵抗が小さくなる。表２は第２の実施の形態の
非貫通接続穴と図６に示した従来の非貫通接続穴との導
通抵抗を比較したもので、本発明の非貫通接続穴の方が
導通抵抗が低いことがわかる。なお、サンプルはＪＩＳ
Ｃ５０１２ 両面プリン板用複合テストパターンにお
いて、試料Ｄを１層、２層に形成した多層板を作成した
ものである。ただし、ライン幅を０．１ｍｍ、ランド径
２ｍｍに変更し、１層〜２層間距離８０μｍ、めっき厚
さ３０μｍとしたものである。Therefore, despite the fact that the large-diameter non-through hole 15b in the second embodiment and the conventional non-through hole 6 have the same bottom area, the non-through connection hole in the second embodiment does not. In this case, the surface area of the wall surface becomes larger, so that the conduction resistance for connection becomes smaller. Table 2 shows a comparison of conduction resistance between the non-through connection hole of the second embodiment and the conventional non-through connection hole shown in FIG. 6, and the non-through connection hole of the present invention has lower conduction resistance. You can see that. The sample is JIS
C5012 In the composite test pattern for a double-sided pudding board, a multilayer board was prepared in which the sample D was formed in one layer and two layers. However, the line width was changed to 0.1 mm, the land diameter was changed to 2 mm, the distance between the first and second layers was 80 μm, and the plating thickness was 30 μm.
【００１７】[0017]
【表２】 [Table 2]
【００１８】このような同心円状に環状に形成した非貫
通穴１５ａ，１５ｂを従来のようにドリルあるいはルー
ター加工によって形成すると加工コストが高くなるが、
第２の実施の形態のように短パルスＣＯ2 レーザで形成
するときには、非貫通穴１５ａ，１５ｂの穴形状を有す
るマスクを用いて短パルスＣＯ2 レーザを照射すればよ
いので、加工が容易で、加工コストの上昇を防止でき
る。If such non-through holes 15a and 15b formed concentrically in an annular shape are formed by drilling or router processing as in the prior art, the processing cost increases.
When forming the short pulse CO 2 laser as in the second embodiment, non-through hole 15a, since the short pulse CO 2 laser with a mask having a hole shape of 15b may be irradiated, the processing is easy In addition, an increase in processing cost can be prevented.
【００１９】なお、この第２の実施の形態では、非貫通
穴１５ａ，１５ｂを同心円状に形成したが、これに限定
されず、断面を矩形や星形としてもよく、要は非貫通穴
の底面積を増加させることなく、穴の外周長を長くし
て、穴の壁面の表面積を増大させるような形状とすれば
よい。In the second embodiment, the non-through holes 15a and 15b are formed concentrically. However, the present invention is not limited to this, and the cross section may be rectangular or star-shaped. The shape may be such that the outer peripheral length of the hole is increased and the surface area of the wall surface of the hole is increased without increasing the bottom area.
【００２０】[0020]
【実施例】スミア処理は、３８℃の無水クロム酸９５０
ｇ／ｌを使用して１８分間行う。粗化は、ＮａＦ１０ｇ
／ｌ，ＣｒＯ3１５ｇ／ｌ，Ｈ2ＳＯ4４００ｍｌ／ｌの
３成分からなる３６℃の粗化液を使用して５分間行う。EXAMPLE Smear treatment was performed using chromic anhydride 950 at 38 ° C.
Perform for 18 minutes using g / l. Roughening is NaF10g
/ L, 15 g / l of CrO 3 , 400 ml / l of H 2 SO 4 , using a roughening solution at 36 ° C consisting of three components for 5 minutes.
【００２１】[0021]
【発明の効果】以上説明したように本発明によれば、触
媒入り銅張積層板の表面に形成した内層回路と、この内
層回路を覆うように前記銅張積層板の表面に積層した触
媒入り絶縁樹脂層と、この絶縁樹脂層のみに凹設した非
貫通穴と、この非貫通穴および前記絶縁樹脂層に形成し
た導体接続部および外層回路とを備えた多層印刷配線板
であって、前記非貫通穴を短パルスＣＯ2 レーザによっ
て穿孔することにより、非貫通穴の壁面を粗面に形成し
たことにより、貫通穴の壁面と導体接続部との密着性が
向上し、外部からの衝撃に対しても剥離して導通不良と
なるようなことがなく、このため信頼性が向上する。As described above, according to the present invention, the inner layer circuit formed on the surface of the copper clad laminate with catalyst and the catalyst layer laminated on the surface of the copper clad laminate so as to cover the inner circuit. An insulating resin layer, a non-through hole recessed only in the insulating resin layer, a conductor connecting portion and an outer layer circuit formed in the non-through hole and the insulating resin layer, a multilayer printed wiring board, By forming the wall surface of the non-through hole into a rough surface by punching the non-through hole with a short pulse CO 2 laser, the adhesion between the wall surface of the through hole and the conductor connecting portion is improved, and it is possible to prevent external impact. Even if it is peeled off, it does not peel off to cause poor conduction, and therefore reliability is improved.
【００２２】また、本発明によれば、レーザ光を短パル
スＣＯ2 レーザとしたので、非貫通穴の壁面を微細な凹
凸に形成することができるとともに、非貫通穴の断面形
状を断面積に対して断面の外周の長さを大きくすること
ができるので、貫通穴の壁面と導体接続部との密着性が
向上し、外部からの衝撃に対しても剥離して導通不良と
なるようなことがなく、このため信頼性が向上する。Further, according to the present invention, since the laser light is a short-pulse CO 2 laser, the wall surface of the non-through hole can be formed with fine irregularities, and the cross-sectional shape of the non-through hole can be reduced to a cross-sectional area. On the other hand, the outer circumference of the cross section can be increased, so that the adhesion between the wall surface of the through-hole and the conductor connection part is improved, and it can be separated from external shocks and lead to poor conduction. And thus the reliability is improved.
【００２３】また、本発明によれば、非貫通穴を、穴の
底面積に対して穴の外周長を長くする断面形状となるよ
うにレーザによって穿孔し、非貫通穴の壁面の表面積を
増大させたことにより、加工が容易で加工コストを抑え
ることができるにもかかわらず、非貫通接続穴の導通抵
抗を小さくすることができる。According to the present invention, the non-through hole is drilled by a laser so as to have a cross-sectional shape in which the outer peripheral length of the hole is longer than the bottom area of the hole, so that the surface area of the wall surface of the non-through hole is increased. By doing so, it is possible to reduce the conduction resistance of the non-penetrating connection hole, although the processing is easy and the processing cost can be suppressed.
【図１】 本発明に係る多層印刷配線板の製造方法を説
明する断面図である。FIG. 1 is a cross-sectional view illustrating a method for manufacturing a multilayer printed wiring board according to the present invention.
【図２】 本発明に係る多層印刷配線板の非貫通穴を短
パルスＣＯ2 レーザで形成したときの非貫通穴の内壁の
顕微鏡写真であって、（ａ）は３００倍の倍率で撮影
し、（ｂ）は２０００倍の倍率で撮影したものである。FIG. 2 is a micrograph of the inner wall of the non-through hole when the non-through hole of the multilayer printed wiring board according to the present invention is formed by a short pulse CO 2 laser, and (a) is taken at a magnification of 300 times. , (B) are taken at a magnification of 2000 times.
【図３】 本発明に係る多層印刷配線板の第２の実施の
形態における要部を拡大した断面図である。FIG. 3 is an enlarged sectional view of a main part of a multilayer printed wiring board according to a second embodiment of the present invention.
【図４】 従来の多層印刷配線板の製造方法を説明する
断面図である。FIG. 4 is a cross-sectional view illustrating a conventional method for manufacturing a multilayer printed wiring board.
【図５】 従来の多層印刷配線板の第２の例の断面図で
ある。FIG. 5 is a sectional view of a second example of a conventional multilayer printed wiring board.
【図６】 従来の多層印刷配線板の要部を拡大した断面
図である。FIG. 6 is an enlarged sectional view of a main part of a conventional multilayer printed wiring board.
１…銅張積層板、２…内層回路、３…プライマー層、４
…触媒入り絶縁樹脂層、５…接着剤、６，１５ａ，１５
ｂ…非貫通穴、６ａ…内壁、７…貫通穴、８…めっきレ
ジスト層、９，１０，１６ａ，１６ｂ…接続導体部、１
１…外層回路。DESCRIPTION OF SYMBOLS 1 ... Copper-clad laminate, 2 ... Inner circuit, 3 ... Primer layer, 4
... Catalyst-containing insulating resin layer, 5 ... Adhesive, 6,15a, 15
b: non-through hole, 6a: inner wall, 7: through hole, 8: plating resist layer, 9, 10, 16a, 16b: connecting conductor, 1
1 ... Outer layer circuit.
─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成８年１２月２５日[Submission date] December 25, 1996
【手続補正１】[Procedure amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００４[Correction target item name] 0004
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【０００４】[0004]
【発明が解決しようとする課題】上述した第１の従来例
では、両面板２６，２６どうしを張り合わせる構造とし
ているので、めっき工程は個々の銅張積層板２１，２２
で１回づつ計２回行い、両面板の張り合わせをして貫通
穴７を穿孔後に１回行うため、合計３回のめっきを行う
必要があり、このために製造コストが高かった。また、
第２の従来例では、ドリルの穿孔深さを制御しなければ
ならいため、穿孔のための作業時間が余計にかかり量産
に適さない。また、僅かな製造誤差によって導通が不確
実になるおそれがある。In the above-mentioned first conventional example, the double-sided plates 26, 26 are bonded to each other, so that the plating process is performed on the individual copper-clad laminates 21, 22.
In this case, plating is performed twice in total, and the double-sided boards are bonded together and the through-hole 7 is performed once after the perforation. Therefore, plating has to be performed three times in total, and the manufacturing cost is high. Also,
In the second conventional example, since the drilling depth of the drill has to be controlled, the work time for drilling is extra, which is not suitable for mass production. Also, conduction may become uncertain due to a slight manufacturing error.
【手続補正２】[Procedure amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００８[Correction target item name] 0008
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【０００８】そして、同図（ｃ）に示すように、短時間
に高いエネルギーで絶縁樹脂層４を炭化することなく切
削することができる周波数１０４〜１０８Ｈｚの範囲の
短パルスＣＯ２レーザを一方の絶縁樹脂層４の上方から
内層回路２に向かって照射すると、短パルスＣＯ２レー
ザが内層回路２を貫通しないので、短パルスＣＯ２レー
ザによって接着剤５および絶縁樹脂層４のみに非貫通穴
６が凹設される。また、ドリルによって貫通穴７を穿設
する。さらに、同図（ｄ）に示すように、絶縁樹脂層４
の貫通穴７の穿設部分にスミア処理およびシーダ処理を
行ったのちに、外層回路１１と逆のパターンのめっきレ
ジスト層８を施す。しかる後、無電解銅めっきによって
非貫通穴６の壁面に導体接続部９を析出して非貫通接続
穴を形成するとともに、貫通穴７の壁面に導体接続部１
０を析出して貫通接続穴を形成し、かつこれら導体接続
部９，１０に導通する外層回路１１を形成する。 ─────────────────────────────────────────────────────
Then, as shown in FIG. 3C, a short pulse CO 2 laser having a frequency range of 10 4 to 10 8 Hz which can cut the insulating resin layer 4 with high energy in a short time without carbonizing. Is irradiated from above one of the insulating resin layers 4 toward the inner layer circuit 2, the short pulse CO 2 laser does not penetrate the inner layer circuit 2. Therefore, only the adhesive 5 and the insulating resin layer 4 are not covered by the short pulse CO 2 laser. The through hole 6 is recessed. Further, a through hole 7 is formed by a drill. Further, as shown in FIG.
After performing a smear process and a seeder process on a portion where the through hole 7 is formed, a plating resist layer 8 having a pattern opposite to that of the outer layer circuit 11 is applied. Thereafter, a conductor connection portion 9 is deposited on the wall surface of the non-through hole 6 by electroless copper plating to form a non-through connection hole, and the conductor connection portion 1 is formed on the wall surface of the through hole 7.
0 is formed to form a through connection hole, and an outer layer circuit 11 which is electrically connected to the conductor connection portions 9 and 10 is formed. ─────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成９年２月７日[Submission date] February 7, 1997
【手続補正１】[Procedure amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】特許請求の範囲[Correction target item name] Claims
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【特許請求の範囲】[Claims]
【請求項３】 触媒入り銅張積層板の表面に内層回路を
形成し、この内層回路を覆うように前記銅張積層板の表
面に触媒入り絶縁樹脂層を積層し、この絶縁樹脂層のみ
にレーザ光によって非貫通穴を凹設し、この非貫通穴お
よび前記絶縁樹脂層に非貫通接続穴および外層回路を形
成する多層印刷配線板の製造方法であって、前記レーザ
光を短パルスＣＯ２レーザとしたことを特徴とする多層
印刷配線板の製造方法。 3. An inner layer circuit is formed on the surface of the copper clad laminate containing a catalyst, and an insulating resin layer containing a catalyst is laminated on the surface of the copper clad laminate so as to cover the inner layer circuit, and only this insulating resin layer is formed. the non-through hole recessed by a laser beam, a the non-through hole and the method of manufacturing a multilayer printed wiring board to form a non-through connection holes and outer circuit to the insulating resin layer, the laser light short pulse CO 2 A method for manufacturing a multilayer printed wiring board, which is a laser.
【請求項４】 めっき触媒入り銅張積層板の表面にエッ
チングを施して内層回路を形成し、この内層回路を覆う
ように前記銅張積層板の表面にめっき触媒入り絶縁樹脂
層を積層し、この絶縁樹脂層の表面に接着剤層を塗布
し、この接着剤層および前記絶縁樹脂層のみにレーザに
よって非貫通穴を凹設し、スミア処理後、めっきレジス
ト層を形成し、粗化、無電解めっきによって外層回路お
よび非貫通接続穴を形成する多層印刷配線板の製造方法
であって、前記スミア処理液を濃度が７５０〜９５０ｇ
／ｌのクロム酸とするとともに、めっき前処理工程の粗
化液がＮａＦ、ＣｒＯ３、Ｈ２ＳＯ４の３成分系で、か
つＮａＦ、ＣｒＯ３を１０〜３０ｇ／ｌとし、Ｈ２ＳＯ
４を３００〜５００ｍｌ／ｌとしたことを特徴とする多
層印刷配線板の製造方法。 4. An inner layer circuit is formed by etching the surface of a copper clad laminate containing a plating catalyst, and an insulating resin layer containing a plating catalyst is laminated on the surface of the copper clad laminate so as to cover the inner layer circuit. An adhesive layer is applied to the surface of the insulating resin layer, a non-through hole is recessed by laser only in the adhesive layer and the insulating resin layer, and a smearing treatment is performed to form a plating resist layer, followed by roughening and no coating. A method for manufacturing a multilayer printed wiring board, wherein outer layer circuits and non-penetrating connection holes are formed by electrolytic plating, wherein the smear treatment liquid has a concentration of 750 to 950 g.
/ L with the chromic acid, roughening solution is NaF plating pretreatment step, the three-component system of CrO 3, H 2 SO 4, and NaF, the CrO 3 and 10 to 30 g / l, H 2 SO
4. The method for producing a multilayer printed wiring board, wherein 4 is 300 to 500 ml / l.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 岩崎 康弘 栃木県芳賀郡二宮町大字久下田1065 日立 エーアイシー株式会社内 (72)発明者 福里 健志郎 栃木県芳賀郡二宮町大字久下田1065 日立 エーアイシー株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yasuhiro Iwasaki 1065 Kushita, Ninomiya-cho, Haga-gun, Tochigi Prefecture Hitachi AIC Co., Ltd. In the company
Claims (4)
層回路と、この内層回路を覆うように前記銅張積層板の
表面に積層した触媒入り絶縁樹脂層と、この絶縁樹脂層
のみに凹設した非貫通穴と、この非貫通穴および前記絶
縁樹脂層に形成した導体接続部および外層回路とを備え
た多層印刷配線板であって、前記非貫通穴を短パルスＣ
Ｏ2 レーザによって穿孔することにより、穴の壁面を粗
面に形成したことを特徴とする多層印刷配線板。An inner circuit formed on the surface of a copper clad laminate containing a catalyst, an insulating resin layer containing a catalyst laminated on the surface of the copper clad laminate so as to cover the inner circuit, and only the insulating resin layer A multilayer printed wiring board comprising: a recessed non-through hole; and a conductor connection portion and an outer layer circuit formed in the non-through hole and the insulating resin layer.
A multilayer printed wiring board characterized in that the wall surface of the hole is formed into a rough surface by punching with an O 2 laser.
形成し、この内層回路を覆うように前記銅張積層板の表
面に触媒入り絶縁樹脂層を積層し、この絶縁樹脂層のみ
にレーザ光によって非貫通穴を凹設し、この非貫通穴お
よび前記絶縁樹脂層に非貫通接続穴および外層回路を形
成する多層印刷配線板の製造方法であって、前記レーザ
光を短パルスＣＯ2 レーザとしたことを特徴とする多層
印刷配線板の製造方法。2. An inner layer circuit is formed on the surface of a copper clad laminate containing a catalyst, and an insulating resin layer containing a catalyst is laminated on the surface of the copper clad laminate so as to cover the inner layer circuit, and only this insulating resin layer is formed. the non-through hole recessed by a laser beam, a the non-through hole and the method of manufacturing a multilayer printed wiring board to form a non-through connection holes and outer circuit to the insulating resin layer, the laser light short pulse CO 2 A method for manufacturing a multilayer printed wiring board, which is a laser.
チングを施して内層回路を形成し、この内層回路を覆う
ように前記銅張積層板の表面にめっき触媒入り絶縁樹脂
層を積層し、この絶縁樹脂層の表面に接着剤層を塗布
し、この接着剤層および前記絶縁樹脂層のみにレーザに
よって非貫通穴を凹設し、スミア処理後、めっきレジス
ト層を形成し、粗化、無電解めっきによって外層回路お
よび非貫通接続穴を形成する多層印刷配線板の製造方法
であって、前記スミア処理液を濃度が７５０〜９５０ｇ
／ｌのクロム酸とするとともに、めっき前処理工程の粗
化液がＮａＦ、ＣｒＯ3、Ｈ2ＳＯ4の３成分系で、かつ
ＮａＦ、ＣｒＯ3を１０〜３０ｇ／ｌとし、Ｈ2ＳＯ4を
３００〜５００ｍｌ／ｌとしたことを特徴とする多層印
刷配線板の製造方法。3. An inner layer circuit is formed by etching the surface of a copper clad laminate containing a plating catalyst, and an insulating resin layer containing a plating catalyst is laminated on the surface of the copper clad laminate so as to cover the inner layer circuit. An adhesive layer is applied to the surface of the insulating resin layer, a non-through hole is recessed by laser only in the adhesive layer and the insulating resin layer, and a smearing treatment is performed to form a plating resist layer, followed by roughening and no coating. A method for manufacturing a multilayer printed wiring board, wherein outer layer circuits and non-penetrating connection holes are formed by electrolytic plating, wherein the smear treatment liquid has a concentration of 750 to 950 g.
/ L with the chromic acid, roughening solution is NaF plating pretreatment step, the three-component system of CrO 3, H 2 SO 4, and NaF, the CrO 3 and 10 to 30 g / l, H 2 SO 4 Of 300 to 500 ml / l.
層回路と、この内層回路を覆うように前記銅張積層板の
表面に積層した触媒入り絶縁樹脂層と、この絶縁樹脂層
のみに凹設した非貫通穴と、この非貫通穴および前記絶
縁樹脂層に形成した導体接続部および外層回路とを備え
た多層印刷配線板であって、前記非貫通穴を、穴の底面
積に対して穴の外周長を長くする断面形状となるように
レーザによって穿孔し、非貫通穴の壁面の表面積を増大
させたことを特徴とする多層印刷配線板の製造方法。4. An inner layer circuit formed on the surface of a copper clad laminate containing a catalyst, an insulating resin layer containing a catalyst laminated on the surface of the copper clad laminate so as to cover the inner layer circuit, and only this insulating resin layer. A multilayer printed wiring board comprising a recessed non-through hole, a conductor connecting portion formed in the non-through hole and the insulating resin layer, and an outer layer circuit, wherein the non-through hole is formed with respect to the bottom area of the hole. A method for manufacturing a multi-layer printed wiring board, characterized in that the surface area of the wall surface of the non-penetrating hole is increased by perforating with a laser so as to have a cross-sectional shape that increases the outer peripheral length of the hole.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34376195A JP2773722B2 (en) | 1995-12-28 | 1995-12-28 | Multilayer printed wiring board and method of manufacturing the same |
| US08/768,426 US5826330A (en) | 1995-12-28 | 1996-12-18 | Method of manufacturing multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34376195A JP2773722B2 (en) | 1995-12-28 | 1995-12-28 | Multilayer printed wiring board and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09186456A true JPH09186456A (en) | 1997-07-15 |
| JP2773722B2 JP2773722B2 (en) | 1998-07-09 |
Family
ID=18364040
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP34376195A Expired - Fee Related JP2773722B2 (en) | 1995-12-28 | 1995-12-28 | Multilayer printed wiring board and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2773722B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000015015A1 (en) * | 1998-09-03 | 2000-03-16 | Ibiden Co., Ltd. | Multilayer printed wiring board and method for manufacturing the same |
| KR20190112079A (en) * | 2017-02-04 | 2019-10-02 | 닝보 써니 오포테크 코., 엘티디. | Camera Modules and Molded Circuit Board Assemblies, Circuit Boards and Applications |
-
1995
- 1995-12-28 JP JP34376195A patent/JP2773722B2/en not_active Expired - Fee Related
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000015015A1 (en) * | 1998-09-03 | 2000-03-16 | Ibiden Co., Ltd. | Multilayer printed wiring board and method for manufacturing the same |
| US6591495B2 (en) | 1998-09-03 | 2003-07-15 | Ibiden Co., Ltd. | Manufacturing method of a multilayered printed circuit board having an opening made by a laser, and using electroless and electrolytic plating |
| EP1121008A4 (en) * | 1998-09-03 | 2005-02-02 | Ibiden Co Ltd | Multilayer printed wiring board and method for manufacturing the same |
| EP1843650A2 (en) * | 1998-09-03 | 2007-10-10 | Ibiden Co., Ltd. | Multilayered printed circuit board and manufacturing method therefor |
| EP1843650A3 (en) * | 1998-09-03 | 2007-11-07 | Ibiden Co., Ltd. | Multilayered printed circuit board and manufacturing method therefor |
| US7415761B2 (en) | 1998-09-03 | 2008-08-26 | Ibiden Co., Ltd. | Method of manufacturing multilayered circuit board |
| KR100855529B1 (en) * | 1998-09-03 | 2008-09-01 | 이비덴 가부시키가이샤 | Multilayer printed wiring board and method for manufacturing the same |
| US7832098B2 (en) | 1998-09-03 | 2010-11-16 | Ibiden Co., Ltd. | Method of manufacturing a multilayered printed circuit board |
| US8148643B2 (en) | 1998-09-03 | 2012-04-03 | Ibiden Co., Ltd. | Multilayered printed circuit board and manufacturing method thereof |
| KR20190112079A (en) * | 2017-02-04 | 2019-10-02 | 닝보 써니 오포테크 코., 엘티디. | Camera Modules and Molded Circuit Board Assemblies, Circuit Boards and Applications |
| KR20210011079A (en) * | 2017-02-04 | 2021-01-29 | 닝보 써니 오포테크 코., 엘티디. | Camera module and molded circuit board assembly, circuit board and application thereof |
| US11039052B2 (en) | 2017-02-04 | 2021-06-15 | Ningbo Sunny Opotech Co., Ltd. | Camera module and molding circuit board assembly, circuit board and application thereof |
| US11451693B2 (en) | 2017-02-04 | 2022-09-20 | Ningbo Sunny Opotech Co., Ltd. | Camera module and molding circuit board assembly, circuit board and application thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2773722B2 (en) | 1998-07-09 |
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