JPH09186179A - Module for ic card - Google Patents

Module for ic card

Info

Publication number
JPH09186179A
JPH09186179A JP3096A JP3096A JPH09186179A JP H09186179 A JPH09186179 A JP H09186179A JP 3096 A JP3096 A JP 3096A JP 3096 A JP3096 A JP 3096A JP H09186179 A JPH09186179 A JP H09186179A
Authority
JP
Japan
Prior art keywords
adhesive
chip
groove
card module
holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3096A
Other languages
Japanese (ja)
Inventor
Takashi Noguchi
高 野口
Yuji Niimura
裕二 新村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP3096A priority Critical patent/JPH09186179A/en
Publication of JPH09186179A publication Critical patent/JPH09186179A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/3205—Shape
    • H01L2224/32057—Shape in side view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PROBLEM TO BE SOLVED: To diminish apparent thickness of an adhesive material, to raise thickness precision, and to reduce the deformation and breaking of a metallic thin wire, when molding a sealed object. SOLUTION: External terminals 12 to come into contact with an external appliance is provided on a base material 11, and electrodes 13 are provided on its opposite side surface to these external terminals 12. And the external terminals 12 and the electrodes 13 are connected through via holes 14. And latticelike grooves 21 are carved in the bottom of a recessed part of the opposite side surface to the external terminals 12, and an IC chip 16 is fixed with an adhesive agent 17 caused to flow into the latticelike grooves 21. And the electrodes 18 of the IC chip 16 are connected to the electrodes 13 with a metallic thin wire 19, and sealing by a sealing substance 20 is performed for protecting the IC chip 16.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【発明の属する技術分野】本発明は、ＩＣカード用モジ
ュールの構造に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the structure of an IC card module.

【０００２】[0002]

【従来の技術】従来、このような分野の技術としては、
以下に示すようなものがあった。図７は従来のＩＣカー
ド用モジュールの構成図であり、図７（ａ）はそのＩＣ
カード用モジュールの平面図、図７（ｂ）はそのＩＣカ
ード用モジュールの断面図である。2. Description of the Related Art Conventionally, techniques in such a field include:
There were the following. FIG. 7 is a block diagram of a conventional IC card module, and FIG. 7A shows the IC.
FIG. 7 (b) is a plan view of the card module, and FIG. 7 (b) is a sectional view of the IC card module.

【０００３】これらの図に示すように、基材１上に外部
機器と接する外部端子２、この外部端子２とは反対側の
面に電極３を設け、外部端子２と電極３の間をバイアホ
ール４により接続し、外部端子２とは反対側の面の座ぐ
り部５にＩＣチップ６を接着材７により固定し、ＩＣチ
ップ６の電極８と電極３とを金属細線９にて接続し、Ｉ
Ｃチップ６を保護するための封止体１０を備えている。
このＩＣカード用モジュールの総厚は、０．６ｍｍ前後
と薄い。As shown in these drawings, an external terminal 2 which is in contact with an external device is provided on a base material 1, an electrode 3 is provided on the surface opposite to the external terminal 2, and a via is provided between the external terminal 2 and the electrode 3. The IC chip 6 is fixed to the counterbore 5 on the side opposite to the external terminal 2 with the adhesive 7, and the electrode 8 and the electrode 3 of the IC chip 6 are connected with the thin metal wire 9. , I
A sealing body 10 for protecting the C chip 6 is provided.
The total thickness of this IC card module is as thin as about 0.6 mm.

【０００４】[0004]

【発明が解決すべき課題】しかしながら、上記した従来
のＩＣカード用モジュールの接着材７の塗れ性は調整し
づらいため、上記のような構造ではＩＣチップ６の固定
位置がばらつくという問題が生じる。つまり、ＩＣカー
ド用モジュールが薄いため、接着材７の量が多い場合
は、ＩＣチップ６及び金属細線９の位置が高くなり、封
止体１０の成形時に使用する金型が金属細線９に接触
し、変形、断線という問題が生じる。また、接着材７が
少ない場合は、ＩＣチップ６の剥がれ等の恐れが生じ
る。However, since the wettability of the adhesive 7 of the conventional IC card module described above is difficult to adjust, the fixing position of the IC chip 6 varies in the above structure. That is, since the IC card module is thin, when the amount of the adhesive 7 is large, the positions of the IC chip 6 and the metal thin wire 9 are high, and the mold used for molding the sealing body 10 contacts the metal thin wire 9. However, problems such as deformation and disconnection occur. Further, when the amount of the adhesive 7 is small, the IC chip 6 may be peeled off.

【０００５】本発明は、上記問題点を除去し、接着材の
見かけ上の厚みをなくし、厚さ精度を向上させ、封止体
を成形する際の金属細線の変形、断線を低減することが
できるＩＣカード用モジュールを提供することを目的と
する。The present invention eliminates the above-mentioned problems, eliminates the apparent thickness of the adhesive, improves the thickness accuracy, and reduces the deformation and disconnection of the thin metal wires when molding the sealing body. It is an object of the present invention to provide an IC card module that can be used.

【０００６】[0006]

【課題を解決するための手段】本発明は、上記目的を達
成するために、 〔１〕絶縁性基板の一方の面に外部接続用端子となる導
体を、もう一方の面にＩＣチップとＩＣチップを搭載す
るための領域及び前記ＩＣチップと接続するための電極
となる導体を有し、前記領域内に前記ＩＣチップを固定
する接着材を保持する溝を設けるようにしたものであ
る。In order to achieve the above object, the present invention [1] has a conductor serving as an external connection terminal on one surface of an insulating substrate and an IC chip and an IC on the other surface. It has a region for mounting a chip and a conductor to be an electrode for connecting with the IC chip, and a groove for holding an adhesive material for fixing the IC chip is provided in the region.

【０００７】したがって、接着材の見かけ上の厚みをな
くし、厚さ精度を向上させ、封止体を成形する際の金属
細線の変形、断線を低減することができる。また、接着
材の塗れ性も向上するので、ＩＣチップの剥がれも低減
することができる。 〔２〕上記〔１〕記載のＩＣカード用モジュールにおい
て、前記接着材を保持する溝が前記絶縁性基板を削るこ
とにより形成される座ぐり部を設けるようにしたもので
ある。Therefore, it is possible to eliminate the apparent thickness of the adhesive, improve the thickness accuracy, and reduce the deformation and disconnection of the thin metal wire when molding the sealing body. Moreover, since the wettability of the adhesive material is also improved, the peeling of the IC chip can be reduced. [2] In the IC card module according to the above [1], a groove for holding the adhesive is provided with a counterbore formed by cutting the insulating substrate.

【０００８】このように、接着材を保持する溝は絶縁性
基板を削ることにより形成するようにしたので、接着材
を保持する溝を容易に形成することができる。 〔３〕上記〔１〕記載のＩＣカード用モジュールにおい
て、前記接着材を保持する溝が樹脂により形成されるよ
うにしたものである。このように、接着材を保持する溝
は樹脂により形成されるようにしたので、ＩＣチップの
搭載を容易に行うことができる。Since the groove for holding the adhesive is formed by shaving the insulating substrate, the groove for holding the adhesive can be easily formed. [3] In the IC card module described in [1] above, the groove for holding the adhesive is formed of resin. In this way, the groove for holding the adhesive is made of resin, so that the IC chip can be easily mounted.

【０００９】〔４〕上記〔１〕、〔２〕又は〔３〕記載
のＩＣカード用モジュールにおいて、前記接着材を保持
する溝に前記接着材を注入するための注入口を設けるよ
うにしたものである。このように、接着材を保持する溝
に前記接着材を注入するための注入口を設け、ＩＣチッ
プを設置した後、接着材を流し込むようにしたので、Ｉ
Ｃチップの剥がれを低減することができる。[4] The IC card module according to the above [1], [2] or [3], wherein an injection port for injecting the adhesive is provided in a groove for holding the adhesive. Is. In this way, the groove for holding the adhesive is provided with the injection port for injecting the adhesive, and after the IC chip is installed, the adhesive is poured.
The peeling of the C chip can be reduced.

【００１０】〔５〕上記〔５〕記載のＩＣカード用モジ
ュールにおいて、更に、前記接着材を保持する溝に該溝
内の空気を排出するための排気口を設けるようにしたも
のである。このように、接着材を保持する溝に前記接着
材を注入するための注入口およびその溝内の空気を排出
するための排気口を設けるようにしたので、、ＩＣチッ
プを設置した後、必要十分な量の接着材を流し込むこと
ができ、よりＩＣチップの剥がれを低減することができ
るとともに、接着材の注入時間を低減することができ
る。[5] In the IC card module according to the above [5], the groove for holding the adhesive is further provided with an exhaust port for discharging the air in the groove. As described above, since the inlet for injecting the adhesive and the outlet for exhausting the air in the groove are provided in the groove for holding the adhesive, it is necessary after the IC chip is installed. A sufficient amount of the adhesive can be poured in, the peeling of the IC chip can be further reduced, and the time for injecting the adhesive can be reduced.

【００１１】[0011]

【発明の実施の形態】以下、本発明の実施例について図
面を参照しながら詳細に説明する。図１は本発明の第１
実施例を示すＩＣカード用モジュールの断面図、図２は
そのＩＣカード用モジュールの基材の構成図であり、図
２（ａ）はそのＩＣカード用モジュール基材の平面図、
図２（ｂ）はそのＩＣカード用モジュール基材の断面図
である。Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 shows the first embodiment of the present invention.
FIG. 2 is a sectional view of an IC card module showing an embodiment, FIG. 2 is a configuration diagram of a base material of the IC card module, and FIG. 2A is a plan view of the IC card module base material.
FIG. 2B is a sectional view of the IC card module base material.

【００１２】これらの図に示すように、基材１１上に外
部機器と接する外部端子１２、外部端子１２とは反対側
の面に電極１３を設け、外部端子１２と電極１３の間を
バイヤホール１４により接続し、外部端子１２とは反対
側の面の座ぐり部１５の底部に格子状の溝２１を刻み、
格子状の溝２１に流し込んだ接着材１７によりＩＣチッ
プ１６を固定し、ＩＣチップ１６の電極１８と電極１３
とを金属細線１９にて接続し、ＩＣチップ１６を保護す
るための封止体２０で封止するようにしている。As shown in these figures, an external terminal 12 in contact with an external device is provided on a base material 11, an electrode 13 is provided on a surface opposite to the external terminal 12, and a via hole is provided between the external terminal 12 and the electrode 13. 14, and a grid-shaped groove 21 is formed in the bottom of the counterbore 15 on the surface opposite to the external terminal 12,
The IC chip 16 is fixed by the adhesive 17 poured into the grid-shaped grooves 21, and the electrodes 18 and 13 of the IC chip 16 are fixed.
And the metal thin wire 19 are connected to each other, and the IC chip 16 is sealed with a sealing body 20 for protection.

【００１３】上記のように、第１実施例によれば、座ぐ
り部１５の底部に格子状の溝２１を設けることにより、
接着材１７の見かけ上の厚みがなくなり厚さの精度が向
上するため、封止体２０を成形する際の金属細線１９の
変形、断線を低減することができる。また、接着材１７
の塗れ性も向上するので、ＩＣチップ１６の剥がれも低
減することができる。As described above, according to the first embodiment, the lattice-shaped grooves 21 are provided in the bottom portion of the counterbore portion 15.
Since the apparent thickness of the adhesive 17 is eliminated and the accuracy of the thickness is improved, it is possible to reduce the deformation and disconnection of the thin metal wire 19 when the sealing body 20 is molded. Also, the adhesive 17
Since the wettability of the IC chip is also improved, peeling of the IC chip 16 can be reduced.

【００１４】次に、本発明の第２実施例について説明す
る。図３は本発明の第２実施例を示すＩＣカード用モジ
ュールの断面図、図４はそのＩＣカード用モジュール基
材の構成図であり、図４（ａ）はそのＩＣカード用モジ
ュール基材の平面図、図４（ｂ）はそのＩＣカード用モ
ジュール基材の断面図である。Next, a second embodiment of the present invention will be described. FIG. 3 is a sectional view of an IC card module showing a second embodiment of the present invention, FIG. 4 is a configuration diagram of the IC card module base material, and FIG. 4A is a sectional view of the IC card module base material. A plan view and FIG. 4B are sectional views of the IC card module base material.

【００１５】これらの図に示すように、基材１１上に外
部機器と接する外部端子１２、この外部端子１２とは反
対側の面に電極１３を設け、外部端子１２と電極１３の
間をバイヤホール１４により接続し、外部端子１２とは
反対側の面の座ぐり部１５の底部に格子状の溝２１及び
接着材１７を注入するための注入口２２を刻み、ＩＣチ
ップ１６を設置した後、注入口２２から格子状の溝２１
に接着材１７を流し込み、ＩＣチップ１６を固定し、Ｉ
Ｃチップ１６の電極１８と電極１３とを金属細線１９に
て接続し、ＩＣチップ１６を保護するための封止体２０
で封止するようにしている。As shown in these figures, an external terminal 12 that contacts an external device is provided on a base material 11, an electrode 13 is provided on the surface opposite to the external terminal 12, and a via is provided between the external terminal 12 and the electrode 13. After the IC chip 16 is installed, the holes are connected to each other, and the grid-shaped grooves 21 and the injection port 22 for injecting the adhesive 17 are formed in the bottom of the counterbore 15 on the surface opposite to the external terminal 12 after the IC chip 16 is installed. , The inlet 22 to the grid-like groove 21
The adhesive 17 is poured onto the IC chip 16, the IC chip 16 is fixed, and I
A sealing body 20 for protecting the IC chip 16 by connecting the electrode 18 of the C chip 16 and the electrode 13 with a thin metal wire 19.
It is designed to be sealed with.

【００１６】上記したように、第２実施例によれば、Ｉ
Ｃチップ１６を設置した後、接着材１７を注入口２２か
ら流し込むため、必要十分な量の接着材１７を流し込む
ことができ、第１実施例に比べ、よりＩＣチップ１６の
剥がれを低減することができる。図５は本発明の第３実
施例示すＩＣカード用モジュールの断面図、図６はその
ＩＣカード用モジュールの基材の構成図であり、図６
（ａ）はそのＩＣカード用モジュール基材の平面図、図
６（ｂ）はそのＩＣカード用モジュール基材の断面図で
ある。As described above, according to the second embodiment, I
Since the adhesive 17 is poured from the injection port 22 after the C chip 16 is installed, a necessary and sufficient amount of the adhesive 17 can be poured, and peeling of the IC chip 16 can be further reduced as compared with the first embodiment. You can FIG. 5 is a sectional view of an IC card module showing a third embodiment of the present invention, and FIG. 6 is a block diagram of a base material of the IC card module.
FIG. 6A is a plan view of the IC card module base material, and FIG. 6B is a sectional view of the IC card module base material.

【００１７】図５に示すように、基材１１上の外部機器
と接する外部端子１２、この外部端子１２とは反対側の
面に電極１３を設け、外部端子１２と電極１３の間をバ
イヤホール１４により接続し、外部端子１２とは反対側
の面の座ぐり部１５の底部に格子状の溝２１、接着材１
７を注入するための注入口２２及び排気するための排気
口２３を刻み、ＩＣチップ１６を設置した後、注入口２
２から格子状の溝２１に接着材１７を流し込み、ＩＣチ
ップ１６を固定し、ＩＣチップ１６の電極１８と電極１
３とを金属細線１９にて接続し、ＩＣチップ１６を保護
するための封止体２０で封止するようにしている。As shown in FIG. 5, an external terminal 12 in contact with an external device on the base material 11, an electrode 13 is provided on a surface opposite to the external terminal 12, and a via hole is provided between the external terminal 12 and the electrode 13. 14, the grid-shaped grooves 21 and the adhesive 1 are provided on the bottom of the counterbore 15 on the surface opposite to the external terminal 12.
The injection port 22 for injecting 7 and the exhaust port 23 for exhausting are carved, and after the IC chip 16 is installed, the injection port 2
The adhesive 17 is poured from 2 into the grid-shaped groove 21, the IC chip 16 is fixed, and the electrode 18 of the IC chip 16 and the electrode 1
3 and 3 are connected by a thin metal wire 19 and sealed with a sealing body 20 for protecting the IC chip 16.

【００１８】このように、この実施例によれば、接着材
１７を保持する溝２１に接着材１７を注入するための注
入口２２およびその溝内の空気を排出するための排気口
２３を設けるようにしたので、ＩＣチップ１６を設置し
た後、注入口２２から接着材１７を流し込むため、必要
十分な量の接着材１７を流し込むことができ、よりＩＣ
チップ１６の剥がれを低減することができるとともに、
排気口２３からは溝内の空気を排出するようにしたの
で、接着材１７の注入時間を低減することができる。Thus, according to this embodiment, the groove 21 for holding the adhesive 17 is provided with the inlet 22 for injecting the adhesive 17 and the exhaust port 23 for exhausting the air in the groove. Since the adhesive 17 is poured from the injection port 22 after the IC chip 16 is installed, a sufficient amount of the adhesive 17 can be poured.
The peeling of the chip 16 can be reduced, and
Since the air in the groove is exhausted from the exhaust port 23, the time for injecting the adhesive 17 can be reduced.

【００１９】なお、第１実施例〜第３実施例では座ぐり
部がある基材で説明したが、座ぐり部がない基材にも適
用可能である。また、第１実施例〜第３実施例では格子
状の溝を設けた例で説明したが、どのような形状の溝で
もよい。さらに、第１実施例〜第３実施例では格子状の
溝を刻んだ例で説明したが、樹脂で格子状の溝を形成し
てもよい。In the first to third embodiments, the base material having the spot facing portion has been described, but the present invention is also applicable to the base material having no spot facing portion. Further, in the first to third embodiments, the example in which the grid-shaped grooves are provided has been described, but the grooves may have any shape. Furthermore, in the first to third embodiments, the grid-shaped grooves are carved, but the grid-shaped grooves may be formed of resin.

【００２０】また、第２実施例〜第３実施例では注入口
や排気口を外部端子とは反対側の面に設けた例で説明し
たが、外部端子側の面に設けてもよい。さらに、第２実
施例〜第３実施例では注入口や排気口を複数箇所に設け
てもよい。なお、本発明は上記実施例に限定されるもの
ではなく、本発明の趣旨に基づいて種々の変形が可能で
あり、これらを本発明の範囲から排除するものではな
い。In the second to third embodiments, the inlet and the outlet are provided on the surface opposite to the external terminals, but they may be provided on the surface on the external terminal side. Further, in the second to third embodiments, the injection port and the exhaust port may be provided at a plurality of places. It should be noted that the present invention is not limited to the above embodiment, and various modifications can be made based on the gist of the present invention, and these are not excluded from the scope of the present invention.

【００２１】[0021]

【発明の効果】以上、詳細に説明したように、本発明に
よれば、次のような効果を奏することができる。 （１）請求項１記載の発明によれば、ＩＣチップを固定
する絶縁性基板の一部に接着材を保持する溝を設けるよ
うにしたので、接着材の見かけ上の厚みをなくし、厚さ
精度を向上させ、封止体を成形する際の金属細線の変
形、断線を低減することができる。As described above, according to the present invention, the following effects can be obtained. (1) According to the invention described in claim 1, since the groove for holding the adhesive is provided in a part of the insulating substrate for fixing the IC chip, the apparent thickness of the adhesive is eliminated, and the thickness is reduced. It is possible to improve accuracy and reduce deformation and disconnection of the metal thin wire when molding the sealed body.

【００２２】また、接着材の塗れ性も向上するので、Ｉ
Ｃチップの剥がれも低減することができる。 （２）請求項２記載の発明によれば、接着材を保持する
溝は絶縁性基板を削ることにより形成するようにしたの
で、接着材を保持する溝を容易に形成することができ
る。Since the wettability of the adhesive is also improved, I
The peeling of the C chip can also be reduced. (2) According to the invention of claim 2, the groove for holding the adhesive is formed by shaving the insulating substrate, so that the groove for holding the adhesive can be easily formed.

【００２３】（３）請求項３記載の発明によれば、接着
材を保持する溝は樹脂により形成するようにしたので、
ＩＣチップの搭載を容易に行うことができる。 （４）請求項４記載の発明によれば、接着材を保持する
溝に前記接着材を注入するための注入口を設け、ＩＣチ
ップを設置した後、接着材を流し込むようにしたので、
接着材を流し込むことができ、ＩＣチップの剥がれを低
減することができる。(3) According to the third aspect of the invention, the groove for holding the adhesive is formed of resin.
The IC chip can be easily mounted. (4) According to the invention described in claim 4, since the injection hole for injecting the adhesive is provided in the groove for holding the adhesive and the IC chip is installed, the adhesive is poured.
The adhesive can be poured, and peeling of the IC chip can be reduced.

【００２４】（５）請求項５記載の発明によれば、接着
材を保持する溝に前記接着材を注入するための注入口お
よびその溝内の空気を排出するための排気口を設け、Ｉ
Ｃチップを設置した後、接着材を注入口より流し込むよ
うにしたので、必要十分な量の接着材を流し込むことが
でき、よりＩＣチップの剥がれを低減することができる
とともに、前記溝内の空気を排気口より排出することに
より、接着材の注入時間を低減することができる。(5) According to the invention described in claim 5, an inlet for injecting the adhesive and an exhaust outlet for exhausting air in the groove are provided in the groove for holding the adhesive, and
Since the adhesive is poured from the inlet after the C chip is installed, a necessary and sufficient amount of the adhesive can be poured, the peeling of the IC chip can be further reduced, and the air in the groove can be reduced. By discharging the adhesive from the exhaust port, it is possible to reduce the adhesive injection time.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明の第１実施例を示すＩＣカード用モジュ
ールの断面図である。FIG. 1 is a sectional view of an IC card module showing a first embodiment of the present invention.

【図２】本発明の第１実施例を示すＩＣカード用モジュ
ール基材の構成図である。FIG. 2 is a configuration diagram of an IC card module substrate showing a first embodiment of the present invention.

【図３】本発明の第２実施例を示すＩＣカード用モジュ
ールの断面図である。FIG. 3 is a sectional view of an IC card module showing a second embodiment of the present invention.

【図４】本発明の第２実施例を示すＩＣカード用モジュ
ールの基材の構成図である。FIG. 4 is a configuration diagram of a base material of an IC card module showing a second embodiment of the present invention.

【図５】本発明の第３実施例示すＩＣカード用モジュー
ルの断面図である。FIG. 5 is a sectional view of an IC card module according to a third embodiment of the present invention.

【図６】本発明の第３実施例示すＩＣカード用モジュー
ルの基材の構成図である。FIG. 6 is a configuration diagram of a base material of an IC card module showing a third embodiment of the present invention.

【図７】従来のＩＣカード用モジュールの構成図であ
る。FIG. 7 is a configuration diagram of a conventional IC card module.

【符号の説明】[Explanation of symbols]

１１ 基材 １２ 外部端子 １３ 電極 １４ バイヤホール １５ 座ぐり部 １６ ＩＣチップ １７ 接着材 １８ 電極 １９ 金属細線 ２０ 封止体 ２１ 格子状の溝 ２２ 注入口 ２３ 排気口 11 Base Material 12 External Terminal 13 Electrode 14 Bayer Hole 15 Counterbore 16 IC Chip 17 Adhesive 18 Electrode 19 Metal Fine Wire 20 Sealing Body 21 Lattice-like Groove 22 Pouring Port 23 Exhaust Port

Claims (5)

【特許請求の範囲】[Claims] 【請求項１】 絶縁性基板の一方の面に外部接続用端子
となる導体を、もう一方の面にＩＣチップとＩＣチップ
を搭載するための領域及び前記ＩＣチップと接続するた
めの電極となる導体を有し、前記領域内に前記ＩＣチッ
プを固定する接着材を保持する溝を設けたことを特徴と
するＩＣカード用モジュール。1. An insulating substrate is provided with a conductor serving as an external connection terminal on one surface, and an IC chip and a region for mounting the IC chip and an electrode for connecting with the IC chip on the other surface. An IC card module having a conductor, wherein a groove for holding an adhesive material for fixing the IC chip is provided in the area. 【請求項２】 請求項１記載のＩＣカード用モジュール
において、前記接着材を保持する溝が前記絶縁性基板を
削ることにより形成されることを特徴とするＩＣカード
用モジュール。2. The IC card module according to claim 1, wherein the groove for holding the adhesive is formed by shaving the insulating substrate. 【請求項３】 請求項１記載のＩＣカード用モジュール
において、前記接着材を保持する溝が樹脂により形成さ
れていることを特徴とするＩＣカード用モジュール。3. The IC card module according to claim 1, wherein the groove for holding the adhesive is formed of resin. 【請求項４】 請求項１、２又は３記載のＩＣカード用
モジュールにおいて、前記接着材を保持する溝に前記接
着材を注入するための注入口を設けたことを特徴とする
ＩＣカード用モジュール。4. The IC card module according to claim 1, 2 or 3, wherein a groove for holding the adhesive is provided with an injection port for injecting the adhesive. . 【請求項５】 請求項４記載のＩＣカード用モジュール
において、前記接着材を保持する溝に該溝内の空気を排
出するための排気口を設けたことを特徴とするＩＣカー
ド用モジュール。5. The IC card module according to claim 4, wherein a groove for holding the adhesive is provided with an exhaust port for discharging air in the groove.
JP3096A 1996-01-04 1996-01-04 Module for ic card Pending JPH09186179A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3096A JPH09186179A (en) 1996-01-04 1996-01-04 Module for ic card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3096A JPH09186179A (en) 1996-01-04 1996-01-04 Module for ic card

Publications (1)

Publication Number Publication Date
JPH09186179A true JPH09186179A (en) 1997-07-15

Family

ID=11462970

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3096A Pending JPH09186179A (en) 1996-01-04 1996-01-04 Module for ic card

Country Status (1)

Country Link
JP (1) JPH09186179A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100586049B1 (en) * 1997-10-07 2006-09-06 드라뤼 카르트 에 시스템 Integrated circuit boards combined with external contact areas and antennas and their manufacturing processes
JP2008251540A (en) * 2003-10-16 2008-10-16 Samsung Sdi Co Ltd Pouch type secondary battery

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100586049B1 (en) * 1997-10-07 2006-09-06 드라뤼 카르트 에 시스템 Integrated circuit boards combined with external contact areas and antennas and their manufacturing processes
JP2008251540A (en) * 2003-10-16 2008-10-16 Samsung Sdi Co Ltd Pouch type secondary battery
US8822068B2 (en) 2003-10-16 2014-09-02 Samsung Sdi Co., Ltd. Pouch type secondary battery

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