JPH09186042A - Laminated electronic component - Google Patents
Laminated electronic componentInfo
- Publication number
- JPH09186042A JPH09186042A JP8000897A JP89796A JPH09186042A JP H09186042 A JPH09186042 A JP H09186042A JP 8000897 A JP8000897 A JP 8000897A JP 89796 A JP89796 A JP 89796A JP H09186042 A JPH09186042 A JP H09186042A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- laminated
- circuit board
- laminated electronic
- laminated body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Coils Or Transformers For Communication (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、回路要素を内部に
配置した積層電子部品に関し、特に、積層電子部品を構
成している積層体の構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated electronic component having circuit elements arranged therein, and more particularly to a structure of a laminated body constituting the laminated electronic component.
【０００２】[0002]
【従来の技術】例えば、積層コンデンサ、積層インダク
タ、多層回路基板、多層複合電子部品で代表される積層
電子部品は、導電膜、抵抗膜のような回路要素を内部に
介在させた状態で複数の絶縁性シートが積層されてなる
積層体を有する。絶縁性シートとしては、代表的なもの
として、セラミックシートが用いられる。2. Description of the Related Art For example, a multilayer electronic component typified by a multilayer capacitor, a multilayer inductor, a multilayer circuit board, and a multilayer composite electronic component has a plurality of circuit elements such as a conductive film and a resistive film, which are provided inside. It has a laminated body in which insulating sheets are laminated. A ceramic sheet is typically used as the insulating sheet.
【０００３】図１０は、従来の積層電子部品５０の外観
を示す斜視図である。積層電子部品５０は、内部回路要
素（図示せず）を介在させた状態で複数の絶縁性シート
が積層されてなる積層体５１を有する。積層体５１の相
対する２つの側面に、外部電極５２が形成される。これ
ら外部電極５２は、積層体５１の内部に位置する内部回
路要素と電気的に接続され、適当な金属ペーストを、積
層体５１の２つの側面の特定箇所に付与することにより
形成されるが、このとき、積層体５１の相対する２つの
主面にも、外部電極５２の一部が形成される。また、図
１０には図示されていないが、積層体５１の一方主面ま
たは他方主面に回路配線が施され、Ｌ、Ｃ、Ｒあるいは
半導体等の電子部品が実装されている積層電子部品も含
まれる。FIG. 10 is a perspective view showing the appearance of a conventional laminated electronic component 50. The laminated electronic component 50 has a laminated body 51 in which a plurality of insulating sheets are laminated with an internal circuit element (not shown) interposed. External electrodes 52 are formed on two opposing side surfaces of the stacked body 51. These external electrodes 52 are electrically connected to the internal circuit elements located inside the laminated body 51, and are formed by applying a suitable metal paste to specific positions on the two side surfaces of the laminated body 51. At this time, a part of the external electrode 52 is also formed on the two opposing main surfaces of the stacked body 51. Although not shown in FIG. 10, a laminated electronic component in which circuit wiring is provided on one main surface or the other main surface of the laminated body 51 and electronic components such as L, C, R or semiconductors are mounted is also provided. included.
【０００４】図１１に示すように、これら積層電子部品
５０は、チップ状の状態で、外部電極５２を介して例え
ばプリント基板等の回路基板５３上にはんだ付けにより
表面実装される。そして、回路基板５３のランド５４上
に、はんだのフィレット５５が形成される。この際、積
層体５１の回路基板５３側に向けられる面、すなわち積
層電子部品５０の実装面５０ａが平坦なため、積層電子
部品５０の実装面５０ａと回路基板５３の表面５３ａの
間隔（δ）が、ほとんどゼロとなるように接合される。
そして、実装時やハンドリング時に、回路基板５３にた
わみ曲げ応力（σ）が働いた場合、フィレット５５部の
はんだの延性によって固着した状態が保たれる。As shown in FIG. 11, these laminated electronic components 50 are surface-mounted by soldering on a circuit board 53 such as a printed circuit board via external electrodes 52 in a chip state. Then, a solder fillet 55 is formed on the land 54 of the circuit board 53. At this time, since the surface of the laminated body 51 facing the circuit board 53 side, that is, the mounting surface 50a of the laminated electronic component 50 is flat, the gap (δ) between the mounting surface 50a of the laminated electronic component 50 and the surface 53a of the circuit board 53. However, it is joined so that it becomes almost zero.
When a flexural bending stress (σ) acts on the circuit board 53 during mounting or handling, the ductility of the solder in the fillet 55 portion maintains the fixed state.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、図１２
に示すように、上述した従来の積層電子部品５０におい
ては、回路基板５３がたわみ量ｈ１でたわむと、回路基
板５３の表面５３ａが、積層電子部品５０のほぼ中央部
で実装面５０ａと接触し、突き上げ力Ｐを発生させる。
そして、図１３に示すように、回路基板５３がたわみ量
ｈ２でさらに大きくたわみ、突き上げ力Ｐがはんだのフ
ィレット５５部の限界応力を越えると、積層電子部品５
０は回路基板５３より離脱するという問題点があった。However, FIG.
As shown in FIG. 5, in the above-described conventional laminated electronic component 50, when the circuit board 53 bends by the deflection amount h1, the surface 53a of the circuit board 53 comes into contact with the mounting surface 50a at the substantially central portion of the laminated electronic component 50. , Generate thrust force P.
Then, as shown in FIG. 13, when the circuit board 53 is further flexed by the flexure amount h2 and the push-up force P exceeds the critical stress of the solder fillet 55, the laminated electronic component 5
There was a problem that 0 was separated from the circuit board 53.
【０００６】また、図１４に示すように、はんだのフィ
レット５５部の限界応力よりも積層電子部品５０の積層
体５１を構成しているセラミックの曲げ強度が小さい
と、積層体５１が破断するという問題点もあった。Further, as shown in FIG. 14, if the bending strength of the ceramic constituting the laminated body 51 of the laminated electronic component 50 is smaller than the critical stress of the fillet 55 of the solder, the laminated body 51 will be broken. There were also problems.
【０００７】本発明は、このような問題点を解決するた
めになされたものであり、回路基板のたわみに対する強
度を強くした積層電子部品を提供することを目的とす
る。The present invention has been made in order to solve such problems, and an object thereof is to provide a laminated electronic component in which the strength against bending of the circuit board is increased.
【０００８】[0008]
【課題を解決するための手段】上述の問題点を解決する
ため、本発明は、内部に回路要素を介在させた状態で複
数の絶縁性シートを積層して、相対する主面と該主面間
を連結する側面からなる積層体を構成し、該積層体の外
表面に、前記回路要素に電気的に接続された複数の外部
電極を備え、該外部電極を介して回路基板に実装される
積層電子部品において、前記積層体の前記回路基板側に
向けられる面の少なくとも略中央部に凹部を設けること
を特徴とする。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention has a structure in which a plurality of insulating sheets are laminated with a circuit element inside, and a main surface facing each other and the main surface facing each other. A laminated body composed of side surfaces connecting the two is formed, and an outer surface of the laminated body is provided with a plurality of external electrodes electrically connected to the circuit elements, and is mounted on a circuit board via the external electrodes. In the laminated electronic component, a concave portion is provided at least in a substantially central portion of a surface of the laminated body facing the circuit board side.
【０００９】また、前記凹部を前記積層体の相対する１
組の側面の一方側面から他方側面にかけて設けることを
特徴とする。In addition, the concave portion of the laminated body is opposed to the concave portion 1.
It is characterized in that it is provided from one side surface to the other side surface of the set.
【００１０】また、前記凹部を前記積層体の相対する別
の１組の側面の一方側面から他方側面にかけて設けるこ
とを特徴とする。Further, the recess is provided from one side surface to the other side surface of another pair of side surfaces facing each other of the laminated body.
【００１１】本発明の積層電子部品によれば、積層体が
有する回路基板に向けられる面、すなわち積層電子部品
の実装面の略中央部に凹部を設けているため、回路基板
がたわんでも、回路基板の表面と積層電子部品の実装面
とが接することがなく、回路基板からの突き上げ力
（Ｐ）を積層電子部品が受けなくなる。According to the laminated electronic component of the present invention, since the concave portion is provided in the surface of the laminated body facing the circuit board, that is, in the substantially central portion of the mounting surface of the laminated electronic component, even if the circuit board bends, the circuit The surface of the substrate and the mounting surface of the laminated electronic component do not come into contact with each other, and the thrust force (P) from the circuit board is not received by the laminated electronic component.
【００１２】[0012]
【発明の実施の形態】以下、図面を参照して本発明の実
施例を説明する。なお、各実施例中において、第１の実
施例と同一もしくは同等の部分には同一番号を付し、そ
の詳細な説明は省略する。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. In each of the embodiments, the same or equivalent parts as those in the first embodiment are designated by the same reference numerals, and detailed description thereof will be omitted.
【００１３】図１及び図２は、本発明に係る積層電子部
品の第１の実施例を示す斜視図及び下面図である。な
お、積層電子部品１０は、図示したチップ状の形態で適
宜の回路基板上に実装されるが、図１では、積層体の回
路基板側に向けられる面、すなわち積層電子部品１０の
実装面を上方に向けた状態で図示されている。1 and 2 are a perspective view and a bottom view showing a first embodiment of a laminated electronic component according to the present invention. Although the laminated electronic component 10 is mounted on an appropriate circuit board in the form of the illustrated chip, in FIG. 1, the surface of the laminated body facing the circuit board side, that is, the mounting surface of the laminated electronic component 10 is shown. It is shown in a state of facing upward.
【００１４】積層電子部品１０は、回路要素（図示せ
ず）を内部に介在させた状態で複数の絶縁性シートが積
層されてなる積層体１１を有する。そして、積層体１１
の一方主面である回路基板側に向けられる面、すなわち
積層電子部品１０の実装面１２の略中央部に凹部１３を
設け、第１の面１２ａと、第１の面１２ａに比べて凹ま
せてある第２の面１２ｂを形成する。すなわち、実装面
１２の第１の面１２ａが実装面１２の外周に沿って略ロ
字状に形成されている。また、第１の面１２ａ及び側面
１１ａ、１１ｂには、外部電極１４が形成される。The laminated electronic component 10 has a laminated body 11 in which a plurality of insulating sheets are laminated with a circuit element (not shown) interposed inside. And the laminated body 11
The surface facing toward the circuit board, which is the one main surface, that is, the recessed portion 13 is provided in a substantially central portion of the mounting surface 12 of the multilayer electronic component 10, and the first surface 12a and the first surface 12a are recessed as compared with the first surface 12a. The second surface 12b is formed. That is, the first surface 12 a of the mounting surface 12 is formed in a substantially square shape along the outer periphery of the mounting surface 12. Further, the external electrodes 14 are formed on the first surface 12a and the side surfaces 11a and 11b.
【００１５】図３は、図１に示す積層電子部品１０を回
路基板に実装した場合を示す断面図である。図３に示す
ように、積層電子部品１０は、チップ状の状態で、外部
電極１４を介して例えばプリント基板等の回路基板１６
上にはんだ付けにより表面実装される。この際、回路基
板１６のランド１７上に、はんだのフィレット１８が形
成される。このとき、積層電子部品１０の実装面１２に
凹部１３を設けているため、積層電子部品１０の実装面
１２の第２の面１２ｂと回路基板１６の表面１６ａの間
隔（δ）が、数百μｍ〜数ｍｍになる。FIG. 3 is a sectional view showing a case where the laminated electronic component 10 shown in FIG. 1 is mounted on a circuit board. As shown in FIG. 3, the laminated electronic component 10 is in the form of a chip and has a circuit board 16 such as a printed board via the external electrodes 14 therebetween.
Surface mounted by soldering on top. At this time, the solder fillet 18 is formed on the land 17 of the circuit board 16. At this time, since the recess 13 is provided in the mounting surface 12 of the multilayer electronic component 10, the distance (δ) between the second surface 12b of the mounting surface 12 of the multilayer electronic component 10 and the surface 16a of the circuit board 16 is several hundreds. μm to several mm.
【００１６】上述したように、第１の実施例によれば、
積層電子部品１０の実装面１２の略中央部に凹部１３を
設けているため、図４に示すように、回路基板１６がた
わみ量ｈ１で山状にたわんでも、回路基板１６の表面１
６ａが、積層電子部品１０の実装面１２の第２の面１２
ｂと接触しない。すなわち、凹部１３が回路基板１６か
らの突き上げ力Ｐの逃げとして作用し、突き上げ力Ｐが
積層電子部品１０に直接伝わらない。As described above, according to the first embodiment,
Since the concave portion 13 is provided in the substantially central portion of the mounting surface 12 of the multilayer electronic component 10, even if the circuit board 16 is bent in a mountain shape with a deflection amount h1 as shown in FIG.
6a is the second surface 12 of the mounting surface 12 of the multilayer electronic component 10.
No contact with b. That is, the recess 13 acts as a relief of the push-up force P from the circuit board 16, and the push-up force P is not directly transmitted to the laminated electronic component 10.
【００１７】また、図５に示すように、回路基板１６が
たわみ量ｈ２で山状にさらに大きくたわんでも、回路基
板１６の表面１６ａが、積層電子部品１０の実装面１２
の第２の面１２ｂと接触しないように、凹部１３の深さ
を選択しているため、図４の場合と同様に、突き上げ力
Ｐが積層電子部品１０に直接伝わらない。Further, as shown in FIG. 5, even if the circuit board 16 is further flexed in the shape of a mountain with a deflection amount h2, the surface 16a of the circuit board 16 has the mounting surface 12 of the laminated electronic component 10 mounted thereon.
Since the depth of the recess 13 is selected so as not to come into contact with the second surface 12b of the above, the push-up force P is not directly transmitted to the laminated electronic component 10 as in the case of FIG.
【００１８】従って、回路基板が真上にたわんだ場合に
は、積層電子部品の回路基板からの離脱や積層電子部品
を構成する積層体の破断といった不良がなくなる。特
に、回路基板の山状のたわみに有効である。Therefore, when the circuit board is bent right above, defects such as separation of the laminated electronic component from the circuit board and breakage of the laminated body constituting the laminated electronic component are eliminated. In particular, it is effective for the mountain-shaped flexure of the circuit board.
【００１９】また、凹部に他の部品を実装することがで
きるため、この積層電子部品を搭載する回路基板の小形
化に加えて、電子機器の小形化が可能となる。Further, since other components can be mounted in the recess, it is possible to miniaturize the electronic device in addition to the miniaturization of the circuit board on which the laminated electronic component is mounted.
【００２０】さらに、積層電子部品からの発熱が問題と
なる場合には、凹部が放熱用として働くことができる。Further, when the heat generated from the laminated electronic component poses a problem, the concave portion can serve as a heat radiation.
【００２１】図６及び図７は、本発明に係る積層電子部
品の第２の実施例を示す斜視図及び下面図である。な
お、積層電子部品２０は、積層電子部品１０の場合と同
様に積層電子部品２０の実装面を上方に向けた状態で図
示されている。6 and 7 are a perspective view and a bottom view showing a second embodiment of the laminated electronic component according to the present invention. The laminated electronic component 20 is illustrated with the mounting surface of the laminated electronic component 20 facing upward, as in the case of the laminated electronic component 10.
【００２２】積層電子部品２０は、第１の実施例の積層
電子部品１０と比較して、積層体２１の実装面２２に積
層体２１の相対する１組の側面の一方側面２１ａから他
方側面２１ｂにかけて凹部２３を設け、実装面２２の相
対する１組の辺の近傍に形成された第１の面２２ａと、
第１の面２２ａに比べて凹ませてある第２の面２２ｂを
形成し、第１の面２２ａが略二の字状になる点で異な
る。The laminated electronic component 20 is different from the laminated electronic component 10 of the first embodiment in that the mounting surface 22 of the laminated body 21 has a pair of side surfaces facing each other from one side surface 21a to the other side surface 21b. And a first surface 22a formed in the vicinity of a pair of opposing sides of the mounting surface 22,
It differs from the first surface 22a in that a concave second surface 22b is formed, and the first surface 22a has a substantially two-character shape.
【００２３】そして、第１の実施例の積層電子部品１０
と同様に、実装面２２の相対する１組の辺の近傍に形成
された第１の面２２ａ及び側面２１ｃ、２１ｄに外部電
極１４を設け、チップ状の状態で、外部電極１４を介し
て適宜のプリント基板等の回路基板（図示せず）上に表
面実装される。Then, the laminated electronic component 10 of the first embodiment
Similarly, the external electrodes 14 are provided on the first surface 22a and the side surfaces 21c and 21d formed in the vicinity of a pair of opposite sides of the mounting surface 22, and the external electrodes 14 are appropriately provided in a chip-like state via the external electrodes 14. Surface-mounted on a circuit board (not shown) such as a printed circuit board.
【００２４】上述したように、第２の実施例によれば、
凹部を積層体の相対する１組の側面の一方側面から他方
側面にかけて設けているため、第１の実施例と同様の効
果に加えて、特に回路基板に生じる凹部と直交する方向
（図中Ｌ方向）のたわみに有効である。As described above, according to the second embodiment,
Since the recesses are provided from one side surface to the other side surface of the pair of opposed side surfaces of the laminate, in addition to the same effect as that of the first embodiment, in particular, a direction orthogonal to the recesses formed in the circuit board (L in the drawing). It is effective for bending (direction).
【００２５】また、積層電子部品に対して凹部が比較的
簡単に作製できるため、低コスト化が可能となる。Further, since the recess can be relatively easily formed in the laminated electronic component, the cost can be reduced.
【００２６】図８及び図９は、本発明に係る積層電子部
品の第３の実施例を示す斜視図及び下面図である。な
お、積層電子部品３０は、積層電子部品１０の場合と同
様に積層電子部品３０の実装面を上方に向けた状態で図
示されている。8 and 9 are a perspective view and a bottom view showing a third embodiment of the laminated electronic component according to the present invention. The laminated electronic component 30 is illustrated with the mounting surface of the laminated electronic component 30 facing upward as in the case of the laminated electronic component 10.
【００２７】積層電子部品３０は、第１の実施例の積層
電子部品１０と比較して、積層体３１の実装面３２に積
層体３１の相対する１組の側面の一方側面３１ａから他
方側面３１ｂにかけて第１の凹部３３ａを設け、相対す
る別の１組の側面の一方側面３４ａから他方側面３４ｂ
にかけて第２の凹部３３ｂを設け、実装面３２の四隅に
形成された第１の面３５ａと、第１の面３５ａに比べて
凹ませてある第２の面３５ｂを形成し、第２の面３５ｂ
が略十字状になる点で異なる。The laminated electronic component 30 is different from the laminated electronic component 10 of the first embodiment in that the mounting surface 32 of the laminated body 31 has a pair of side surfaces facing each other from one side surface 31a to the other side surface 31b. The first concave portion 33a is provided over the first side surface 34b, and the other side surface 34b from the other side surface 34b
The second concave portion 33b is provided to cover the first surface 35a formed at the four corners of the mounting surface 32, and the second surface 35b which is recessed compared to the first surface 35a is formed. 35b
Differs in that it becomes a cross shape.
【００２８】そして、第１の実施例の積層電子部品１０
と同様に、実装面３２の四隅に形成された第１の面３５
ａ及び側面３４ａ、３４ｃに外部電極１４を設け、チッ
プ状の状態で、外部電極１４を介して適宜のプリント基
板等の回路基板（図示せず）上に表面実装される。Then, the laminated electronic component 10 of the first embodiment
Similarly to the first surface 35 formed at the four corners of the mounting surface 32,
The external electrodes 14 are provided on the a and the side surfaces 34a and 34c, and in a chip-like state, they are surface-mounted on a circuit board (not shown) such as an appropriate printed board via the external electrodes 14.
【００２９】上述したように、第３の実施例によれば、
第１の凹部を積層体の相対する１組の側面の一方側面か
ら他方側面にかけて、第２の凹部を相対するもう１組の
側面の一方側面から他方側面にかけて設けているため、
第１の実施例と同様の効果に加えて、特に、回路基板に
生じる２つの凹部と直交する方向（図中Ｌ１、Ｌ２方
向）、すなわち縦横両方向のたわみに有効である。As described above, according to the third embodiment,
Since the first concave portion is provided from one side surface to the other side surface of the pair of opposed side surfaces of the laminated body, and the second concave portion is provided from one side surface to the other side surface of the other opposed side surface,
In addition to the effects similar to those of the first embodiment, it is particularly effective for bending in the directions (L1 and L2 directions in the drawing) orthogonal to the two recesses formed in the circuit board, that is, in both vertical and horizontal directions.
【００３０】なお、第１及び第２の実施例では、実装面
に設ける第２の面（凹み部分）の形状が略四角形状の場
合について説明したが、円形状、楕円形状、多角形状、
あるいはそれらを組合わせた形のいずれでもよい。In the first and second embodiments, the case where the shape of the second surface (recessed portion) provided on the mounting surface is substantially quadrangular has been described, but it is circular, elliptical, polygonal,
Alternatively, any of a combination of them may be used.
【００３１】また、第３の実施例では、実装面に設ける
第２の面として２つの凹部が直交し、第２の面が略十字
状になっている場合について説明したが、２つの凹部は
直交していなくてもよい。In the third embodiment, the case where the two recesses are orthogonal to each other as the second surface provided on the mounting surface and the second surface has a substantially cross shape has been described. It does not have to be orthogonal.
【００３２】さらに、第１及び第２の実施例において、
第１の面から、積層体の厚み方向に向け溝を設けてもよ
い。この場合には、積層体自体の弾性たわみで、積層電
子部品の回路基板からの離脱や積層電子部品を構成する
積層体の破断を防ぐこともできる。Further, in the first and second embodiments,
You may provide a groove | channel toward the thickness direction of a laminated body from a 1st surface. In this case, elastic bending of the laminated body itself can prevent detachment of the laminated electronic component from the circuit board and breakage of the laminated body constituting the laminated electronic component.
【００３３】さらに、第２の面としての凹部の断面形状
としては、隅部に丸みやテーパがあってもよい。Further, the cross-sectional shape of the concave portion as the second surface may be rounded or tapered at the corners.
【００３４】また、凹部の形成は、積層体の焼成前、焼
成後のどちらでも行ってもよい。The recesses may be formed either before or after firing the laminate.
【００３５】さらに、凹部の深さは、積層体の大きさに
あわせて、数百μｍ〜数ｍｍの範囲で選択される。Further, the depth of the recess is selected in the range of several hundreds μm to several mm according to the size of the laminated body.
【００３６】[0036]
【発明の効果】請求項１の積層電子部品によれば、積層
体の回路基板側に向けられる面に凹部を設けているた
め、回路基板がたわんでも、凹部が回路基板からの突き
上げ力の逃げとして作用し、突き上げ力が積層電子部品
に直接伝わらない。従って、積層電子部品の回路基板か
らの離脱や積層電子部品を構成する積層体の破断といっ
た不良がなくなる。特に、回路基板の山状のたわみに有
効である。According to the laminated electronic component of the first aspect, since the concave portion is provided on the surface of the laminated body facing the circuit board side, even if the circuit board bends, the concave portion escapes the pushing force from the circuit board. As a result, the thrust force is not directly transmitted to the laminated electronic component. Therefore, defects such as separation of the laminated electronic component from the circuit board and breakage of the laminated body constituting the laminated electronic component are eliminated. In particular, it is effective for the mountain-shaped flexure of the circuit board.
【００３７】また、凹部に他の部品を実装することがで
きるため、回路基板の小形化に加えて、電子機器の小形
化が可能となる。Further, since other parts can be mounted in the recess, it is possible to miniaturize the electronic device in addition to miniaturizing the circuit board.
【００３８】さらに、積層電子部品からの発熱が問題と
なる場合には、凹部が放熱用として働くことができる。Further, when the heat generated from the laminated electronic component becomes a problem, the concave portion can serve as a heat radiation.
【００３９】請求項２の積層電子部品によれば、凹部を
積層体の相対する１組の側面の一方側面から他方側面に
かけて設けているため、特に回路基板の凹部と直交する
方向のたわみに有効である。According to the laminated electronic component of the second aspect, since the concave portion is provided from one side surface to the other side surface of the pair of opposed side surfaces of the laminated body, it is particularly effective for bending in a direction orthogonal to the concave portion of the circuit board. Is.
【００４０】また、凹部が比較的簡単に作製できるた
め、低コスト化が可能となる。Further, since the recess can be produced relatively easily, the cost can be reduced.
【００４１】請求項３の積層電子部品によれば、第１の
凹部を積層体の相対する１組の側面の一方側面から他方
側面にかけて、第２の凹部を相対するもう１組の側面の
一方側面から他方側面にかけて設けているため、回路基
板の凹部と直交する２方向のたわみに有効である。According to the third aspect of the laminated electronic component, the first concave portion extends from one side surface of the pair of opposing side surfaces of the laminated body to the other side surface thereof, and the second concave portion of one side surface of the other pair of opposing side surfaces. Since it is provided from the side surface to the other side surface, it is effective for bending in two directions orthogonal to the concave portion of the circuit board.
【図１】本発明の積層電子部品に係る第１の実施例の斜
視図である。FIG. 1 is a perspective view of a first embodiment of a laminated electronic component according to the present invention.
【図２】図１に示した積層電子部品を実装面側から見た
場合の平面図である。FIG. 2 is a plan view of the laminated electronic component shown in FIG. 1 when viewed from the mounting surface side.
【図３】図１に示した積層電子部品を回路基板に実装し
た場合の断面図である。FIG. 3 is a cross-sectional view when the laminated electronic component shown in FIG. 1 is mounted on a circuit board.
【図４】図３にて実装基板がたわんだ場合の断面図であ
る。FIG. 4 is a cross-sectional view when the mounting substrate is bent in FIG.
【図５】図３にて実装基板がさらにたわんだ場合の断面
図である。5 is a cross-sectional view when the mounting substrate is further flexed in FIG.
【図６】本発明の積層電子部品に係る第２の実施例の斜
視図である。FIG. 6 is a perspective view of a second embodiment of the laminated electronic component according to the present invention.
【図７】図６に示した積層電子部品を実装面側から見た
場合の平面図である。7 is a plan view of the laminated electronic component shown in FIG. 6 as viewed from the mounting surface side.
【図８】本発明の積層電子部品に係る第３の実施例の斜
視図である。FIG. 8 is a perspective view of a third embodiment of the laminated electronic component according to the present invention.
【図９】図８に示した積層電子部品を実装面側から見た
場合の平面図である。9 is a plan view of the laminated electronic component shown in FIG. 8 as viewed from the mounting surface side.
【図１０】従来の積層電子部品の示す斜視図である。FIG. 10 is a perspective view showing a conventional laminated electronic component.
【図１１】図１０に示した積層電子部品を回路基板に実
装した場合の断面図である。FIG. 11 is a cross-sectional view when the laminated electronic component shown in FIG. 10 is mounted on a circuit board.
【図１２】図１１にて実装基板がたわんだ場合の断面図
である。12 is a cross-sectional view when the mounting board is bent in FIG.
【図１３】図１１にて積層電子部品が回路基板からの離
脱した場合の断面図である。13 is a cross-sectional view when the laminated electronic component is separated from the circuit board in FIG.
【図１４】図１１にて積層電子部品の積層体が破断した
場合の断面図である。FIG. 14 is a cross-sectional view when the laminated body of the laminated electronic component in FIG. 11 is broken.
１０、２０、３０ 積層電子部品 １１、２１、３１ 積層体 １２、２２、３２ 実装面（積層体の回路基板側に
向けられる面） １３、２３、３３ａ、３３ｂ 凹部 １４ 外部電極 ２１ａ、３１ａ、３４ａ 一方側面 ２１ｂ、３１ｂ、３４ｂ 他方側面10, 20, 30 laminated electronic component 11, 21, 31 laminated body 12, 22, 32 mounting surface (surface facing the circuit board side of laminated body) 13, 23, 33a, 33b recess 14 external electrode 21a, 31a, 34a One side surface 21b, 31b, 34b The other side surface
Claims (3)
の絶縁性シートを積層して、相対する主面と該主面間を
連結する側面からなる積層体を構成し、該積層体の外表
面に、前記回路要素に電気的に接続された複数の外部電
極を備え、該外部電極を介して回路基板に実装される積
層電子部品において、 前記積層体の前記回路基板側に向けられる面の少なくと
も略中央部に凹部を設けることを特徴とする積層電子部
品。1. A laminated body comprising a plurality of insulating sheets laminated with circuit elements inside to form a laminated body composed of opposing main surfaces and side surfaces connecting the principal surfaces, In a laminated electronic component, which is provided on its outer surface with a plurality of external electrodes electrically connected to the circuit element, and is mounted on a circuit board via the external electrodes, a surface of the laminated body facing the circuit board side. A laminated electronic component, characterized in that a concave portion is provided at least substantially in the center thereof.
側面の一方側面から他方側面にかけて設けることを特徴
とする請求項１に記載の積層電子部品。2. The laminated electronic component according to claim 1, wherein the recess is provided from one side surface to the other side surface of the pair of opposed side surfaces of the laminated body.
組の側面の一方側面から他方側面にかけて設けることを
特徴とする請求項２に記載の積層電子部品。3. Another one of the concave portions of the laminated body facing each other.
The laminated electronic component according to claim 2, which is provided from one side surface to the other side surface of the set.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8000897A JPH09186042A (en) | 1996-01-08 | 1996-01-08 | Laminated electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8000897A JPH09186042A (en) | 1996-01-08 | 1996-01-08 | Laminated electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09186042A true JPH09186042A (en) | 1997-07-15 |
Family
ID=11486483
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8000897A Pending JPH09186042A (en) | 1996-01-08 | 1996-01-08 | Laminated electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09186042A (en) |
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| JPWO2007058096A1 (en) * | 2005-11-18 | 2009-04-30 | 日本電気株式会社 | Mounting board and electronic equipment |
| WO2009057276A1 (en) * | 2007-10-31 | 2009-05-07 | Panasonic Corporation | Inductive component and method for manufacturing the same |
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| JPWO2007058096A1 (en) * | 2005-11-18 | 2009-04-30 | 日本電気株式会社 | Mounting board and electronic equipment |
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| US8625296B2 (en) | 2005-11-18 | 2014-01-07 | Nec Corporation | Mount board and electronic device |
| JP2008311275A (en) * | 2007-06-12 | 2008-12-25 | Denso Corp | Printed-circuit board manufacturing method, printed-circuit board, and film member used for printed-circuit board |
| WO2009057276A1 (en) * | 2007-10-31 | 2009-05-07 | Panasonic Corporation | Inductive component and method for manufacturing the same |
| US8284005B2 (en) | 2007-10-31 | 2012-10-09 | Panasonic Corporation | Inductive component and method for manufacturing the same |
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| JP2018107411A (en) * | 2016-12-28 | 2018-07-05 | 株式会社村田製作所 | Method for manufacturing laminated electronic component and laminated electronic component |
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| CN108305760A (en) * | 2016-12-28 | 2018-07-20 | 株式会社村田制作所 | The manufacturing method and laminated electronic component of laminated electronic component |
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