JPH09172243A - Method of manufacturing electric inspection jig for wiring board - Google Patents
Method of manufacturing electric inspection jig for wiring boardInfo
- Publication number
- JPH09172243A JPH09172243A JP33176395A JP33176395A JPH09172243A JP H09172243 A JPH09172243 A JP H09172243A JP 33176395 A JP33176395 A JP 33176395A JP 33176395 A JP33176395 A JP 33176395A JP H09172243 A JPH09172243 A JP H09172243A
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- metal foil
- conductive metal
- wiring board
- synthetic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、印刷配線板の電気
的な導通試験に用いる電気検査治具の製造方法に係り、
さらに詳しくは高密度配線板なども信頼性の高い電気検
査が可能な配線板用電気検査治具の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an electrical inspection jig used for an electrical continuity test of a printed wiring board,
More specifically, the present invention relates to a method of manufacturing an electrical inspection jig for a wiring board, which enables highly reliable electrical inspection of high-density wiring boards and the like.
【０００２】[0002]
【従来の技術】周知のように印刷配線板は、各種の電子
機器類に広く使用されており、それら電子機器類の小型
化ないし回路部分のコンパクト化などに大きく寄与して
いる。ところで、印刷配線板においては、その印刷配線
板に形成されている回路パタ―ンが、所要の機能を有し
ているか否かは重要な問題である。すなわち、印刷配線
板は煩雑な工程ないし多段的な工程を経て製造されるた
め、回路パタ―ンの破断や回路パタ―ン間の接続不良な
どを起こす場合がある。2. Description of the Related Art As is well known, printed wiring boards are widely used in various electronic devices and greatly contribute to downsizing of these electronic devices and downsizing of circuit parts. By the way, in a printed wiring board, whether or not the circuit pattern formed on the printed wiring board has a required function is an important issue. That is, since the printed wiring board is manufactured through complicated steps or multi-step steps, the circuit pattern may be broken or the connection between the circuit patterns may be defective.
【０００３】このような回路パタ―ンの破断や接続不良
があると、印刷配線板は設計通りの機能に欠けることに
なるため、電子機器類の構成に用いた場合、その電子機
器類が所要の機能を発揮し得なくなる。If such a circuit pattern breaks or a connection failure occurs, the printed wiring board lacks the function as designed. Therefore, when used in the construction of electronic equipment, the electronic equipment is required. Will not be able to exert its function.
【０００４】こうした観点に立って、印刷配線板につい
ては、最終的な電気検査が行われており、たとえば TAB
実装など行う微細パターンの印刷配線板は、図２に要部
構成を断面的に示すような電気検査治具を用いて、所要
の電気検査を行っている。すなわち、電気的な導通孔１
を所定のピッチで設けた電気検査治具本体２の接触子３
を、図示されていない被検査用印刷配線板の所定位置
に、それぞれ対接させ電気的な導通を採って、所要の電
気検査を行っている。From this point of view, a final electrical inspection is performed on the printed wiring board, for example, TAB.
2. Description of the Related Art A printed circuit board having a fine pattern to be mounted or the like is subjected to a required electrical inspection by using an electrical inspection jig having a cross-sectional view of a main part configuration shown in FIG. That is, the electrical conduction hole 1
Of the electrical inspection jig body 2 in which the contacts are provided at a predetermined pitch
Are brought into contact with predetermined positions of a printed wiring board for inspection (not shown) to establish electrical continuity, and a required electrical inspection is performed.
【０００５】図２において、４は導通孔１を介して導通
検査機（図示せず）側と接触子３とを電気的に接続する
再配置用の導電体層であり、また、５は前記再配置用の
導電体層４を絶縁・保護するソルダーレジスト層であ
る。なお、前記構成においては、被検査用印刷配線板に
対して、常に一様な接触を確保し、信頼性の高い電気検
査を行うために、接触子３を再配置用の導電体層４面か
ら高さ約25〜 100μm 程度突設（突起）させた構成とし
ている。In FIG. 2, reference numeral 4 is a conductor layer for rearrangement for electrically connecting the contactor 3 and the contactor 3 through the conduction hole 1, and 5 is the above-mentioned. It is a solder resist layer that insulates and protects the conductor layer 4 for relocation. In the above configuration, in order to always ensure a uniform contact with the printed wiring board to be inspected and perform a highly reliable electrical inspection, the contactor 3 is placed on the surface of the conductor layer 4 for rearrangement. The height is about 25 to 100 μm.
【０００６】[0006]
【発明が解決しようとする課題】しかし、上記のような
電気検査治具の場合は、次のような不都合な問題があ
る。すなわち、被検査用印刷配線板に接触させる突起型
の接触子３は、一般的に電気メッキ法で形成されてお
り、ソルダーレジスト面から約75μm 程度突出させるこ
とが困難な場合がある。つまり、電気メッキ操作が煩雑
であるだけでなく、電気検査治具のパターン形状もしく
は配置などによっては、一定の厚さの電気メッキ層を形
成することが困難であるため、接触子３の高さにバラツ
キが生じ、結果的に電気的検査の不安定化もしくは信頼
性が低下するなどの問題を招来する。However, the electric inspection jig as described above has the following inconvenient problems. That is, the protrusion-type contactor 3 to be brought into contact with the printed wiring board to be inspected is generally formed by electroplating, and it may be difficult to project about 75 μm from the solder resist surface. That is, not only is the electroplating operation complicated, but it is difficult to form an electroplating layer having a constant thickness depending on the pattern shape or arrangement of the electrical inspection jig, so that the height of the contactor 3 is increased. Variations occur, resulting in instability of electrical inspection or deterioration of reliability.
【０００７】本発明は上記事情に対処してなされたもの
で、NC穴明け加工や電気メッキなど工程を省略しなが
ら、狭ピッチ・小径パッドの接触子を備えた配線板用電
気検査治具を製造できる製造方法の提供を目的とする。The present invention has been made in consideration of the above circumstances, and provides an electrical inspection jig for a wiring board, which is provided with contacts of a narrow pitch and a small diameter pad while omitting steps such as NC drilling and electroplating. It is intended to provide a manufacturing method that can be manufactured.
【０００８】[0008]
【課題を解決するための手段】本発明に係る配線板用電
気検査治具の製造方法は、第１の導電性金属箔主面の所
定位置面に、高さがほぼ一様な導電性バンプ群を形設す
る工程と、前記導電性バンプ群を形設した面に絶縁性合
成樹脂シートおよび第２の導電性金属箔を順次積層・配
置する工程と、前記積層体を加圧し、合成樹脂系シート
の厚さ方向に、導体バンプ先端部を貫挿させて第２の導
電性金属箔面に電気的に接続する導体配線部を形成する
工程と、 前記第１および第２の導電性金属箔にそれぞ
れ選択的なエッチング処理を施し、第１の導電性金属箔
を配線パターン化、第２の導電性金属箔を導体配線部の
突出端子化する工程とを備えたことを特徴とする。A method of manufacturing an electrical inspection jig for a wiring board according to the present invention is a conductive bump having a substantially uniform height on a predetermined position surface of a first conductive metal foil main surface. Forming a group, a step of sequentially laminating and arranging an insulating synthetic resin sheet and a second conductive metal foil on the surface on which the conductive bump group is formed, and pressing the laminated body to form a synthetic resin. Forming a conductor wiring portion electrically connecting to a second conductive metal foil surface by inserting a conductor bump tip portion in the thickness direction of the base sheet; and the first and second conductive metals. Each of the foils is subjected to a selective etching treatment to form a wiring pattern for the first conductive metal foil and to form a protruding terminal of the conductive wiring portion for the second conductive metal foil.
【０００９】本発明において、導電性バンプ群を形設具
備する第１の導電性金属箔（導電性シート）は、一般的
には１枚のシートであるが、予めパターン化されたもの
でもよい。また、導電性バンプ（導体バンプ群）は、た
とえば銀，金，銅，半田粉などの導電性粉末、これらの
合金粉末もしくは複合（混合）金属粉末と、たとえばポ
リカーボネート樹脂，ポリスルホン樹脂，ポリエステル
樹脂，フェノキシ樹脂，フェノール樹脂，ポリイミド樹
脂などのバインダー成分とを混合して調製された導電性
組成物で構成される。そして、前記導電性バンプの形設
は、たとえば比較的厚いメタルマスクを用いた印刷法に
より、アスペクト比の高い導電性バンプを形成でき、そ
の導電性バンプの高さは、一般的に、 100〜 400μm 程
度が望ましい。In the present invention, the first conductive metal foil (conductive sheet) having the conductive bump group formed therein is generally one sheet, but may be patterned in advance. . Further, the conductive bumps (group of conductive bumps) include, for example, conductive powder such as silver, gold, copper and solder powder, alloy powder or composite (mixed) metal powder of these, and polycarbonate resin, polysulfone resin, polyester resin, It is composed of a conductive composition prepared by mixing with a binder component such as a phenoxy resin, a phenol resin, or a polyimide resin. The conductive bumps can be formed by, for example, a printing method using a relatively thick metal mask to form conductive bumps having a high aspect ratio, and the conductive bumps generally have a height of 100 to About 400 μm is desirable.
【００１０】本発明において、前記導電性バンプ先端部
が貫挿し、貫通型の導体配線部を形成する合成樹脂系シ
ートとしては、たとえば熱可塑性樹脂フイルム（シー
ト）が挙げられ、またその厚さは導電性バンプの高さに
より決まる。つまり、対向配置される第２の導電性金属
箔（導電性シート）面に対して、導電性バンプの先端部
が塑性変形して十分な電気的な接続を構成する必要があ
るので、前記構成樹脂系シートの厚さよりも導電性バン
プの高さは大きく設定される。In the present invention, examples of the synthetic resin sheet which the conductive bump tip portion penetrates to form a through-type conductor wiring portion include a thermoplastic resin film (sheet), and its thickness is Determined by the height of the conductive bumps. That is, since the tips of the conductive bumps need to be plastically deformed to form a sufficient electrical connection with respect to the surface of the second conductive metal foil (conductive sheet) arranged to face each other, the above-mentioned configuration The height of the conductive bump is set to be larger than the thickness of the resin-based sheet.
【００１１】ここで、熱可塑性樹脂シートとしては、た
とえばポリカーボネート樹脂，ポリスルホン樹脂，熱可
塑性ポリイミド樹脂，４フッ化ポリエチレン樹脂，６フ
ッ化ポリプロピレン樹脂，ポリエーテルエーテルケトン
樹脂などのシート類が挙げられる。また、硬化前状態に
保持される熱硬化性樹脂シートとしては、エポキシ樹
脂，ビスマレイミドトリアジン樹脂，ポリイミド樹脂，
フェノール樹脂，ポリエステル樹脂，メラミン樹脂，あ
るいはブタジェンゴム，ブチルゴム，天然ゴム，ネオプ
レンゴム，シリコーンゴムなどの生ゴムのシート類が挙
げられる。これら合成樹脂は、単独でもよいが絶縁性無
機物や有機物系の充填物を含有してもよく、さらにガラ
スクロスやマット、有機合成繊維布やマット、あるいは
紙などの補強材と組み合わせて成るシートであってもよ
い。また、第２の導電性金属箔は、たとえば銅箔，アル
ミ箔などが挙げられ、これらは厚さ18〜75μm 程度のも
のが選ばれる。Examples of the thermoplastic resin sheet include sheets of polycarbonate resin, polysulfone resin, thermoplastic polyimide resin, tetrafluoropolyethylene resin, hexafluoropolypropylene resin, polyetheretherketone resin and the like. Further, as the thermosetting resin sheet that is kept in a pre-cured state, epoxy resin, bismaleimide triazine resin, polyimide resin,
Examples include phenolic resin, polyester resin, melamine resin, or raw rubber sheets such as butadiene rubber, butyl rubber, natural rubber, neoprene rubber, and silicone rubber. These synthetic resins may be used alone or may contain an insulating inorganic or organic filler, and are a sheet formed by combining with a reinforcing material such as glass cloth or mat, organic synthetic fiber cloth or mat, or paper. It may be. The second conductive metal foil includes, for example, copper foil and aluminum foil, and those having a thickness of about 18 to 75 μm are selected.
【００１２】本発明に係る製造方法では、いわゆる検電
ピン（もしくは接触子）が、ほぼ一定な高さの導体バン
プ群およびほぼ一定な膜厚の金属箔で形成されており、
かつこの導電性バンプ群は互いに絶縁・離隔し、先端部
を突出した形で絶縁体層に埋め込れている。そして、前
記導電性バンプ群は、位置・形状ともに精度よく形成で
きる。In the manufacturing method according to the present invention, a so-called detection pin (or contactor) is formed of a group of conductor bumps having a substantially constant height and a metal foil having a substantially constant film thickness.
In addition, the conductive bump groups are insulated and separated from each other, and are embedded in the insulator layer with their tips protruding. Then, the conductive bump group can be accurately formed in both position and shape.
【００１３】すなわち、導電性バンプは加圧成型の際、
形崩れや位置ずれなど起こさずに、その先端部が容易に
絶縁シート層を貫通（貫挿）し、絶縁シート層に積層・
配置した第２の導電性金属箔面に先端部を対接して、電
気的な接続を採るとともに、第２の導電性金属箔が対応
する突起型の接触子にエッチング加工される。つまり、
狭ピッチ・小径の検電ピンを高精度に、かつ確実に形成
できるため、狭ピッチ・小径パッドを対象とした印刷配
線板でも、高精度に所要の電気検査を行い得ることが可
能な電気検査治具を提供できることになる。That is, the conductive bumps are
The tip easily penetrates (inserts) the insulating sheet layer without causing deformation or displacement, and is laminated on the insulating sheet layer.
The tip portion is brought into contact with the arranged second conductive metal foil surface to make an electrical connection, and the second conductive metal foil is etched into a corresponding protrusion-type contact. That is,
Since electrical detection pins with a narrow pitch and small diameter can be formed with high accuracy and reliability, it is possible to perform the required electrical inspection with high accuracy even on printed wiring boards for narrow pitch and small diameter pads. It will be possible to provide a jig.
【００１４】[0014]
【発明の実施の形態】以下図１ (a)〜 (d)を参照して本
発明の実施例を説明する。DETAILED DESCRIPTION OF THE INVENTION An embodiment of the present invention will be described below with reference to FIGS.
【００１５】図１ (a)， (b)， (c)， (d)は、配線板用
電気検査治具のは製造工程の態様を模式的に示したもの
で、先ず、厚さ35μm の電解銅箔を第１の導電性金属箔
６′を用意する。なお、この第１の導電性金属箔６′
は、検査装置側の電極および配線部を形成するものであ
る。FIGS. 1 (a), 1 (b), 1 (c), and 1 (d) schematically show an embodiment of a manufacturing process of an electric inspection jig for a wiring board. First, a thickness of 35 μm An electrolytic copper foil is prepared as a first conductive metal foil 6 '. Incidentally, this first conductive metal foil 6 '
For forming electrodes and wiring portions on the inspection device side.
【００１６】次いで、前記第１の導電性金属箔６′の一
主面に、厚さ約 0.4mmのステンレス板を素材としたメタ
ルスクリーンを用いて、たとえば、ポリマータイプの銀
系の導電性ペースト（商品名，熱硬化性導電性ペースト
MS-7，東芝ケミカルKK）を印刷し、この印刷された導電
性ペーストが乾燥した後、同一マスクを用い同一位置に
印刷・乾燥する工程を３回繰り返し、最終的には 150℃
の熱風オーブン中で加熱して、図１ (a)に要部構成を断
面的に示すごとく、高さ 200〜 300μm の山形の導電性
パンプ７′を形成（形設）した。Then, a metal screen made of a stainless steel plate having a thickness of about 0.4 mm is used on one main surface of the first conductive metal foil 6 ', for example, a polymer type silver-based conductive paste. (Product name, thermosetting conductive paste
MS-7, Toshiba Chemical KK) is printed, and after this printed conductive paste is dried, the process of printing and drying at the same position using the same mask is repeated 3 times, and finally at 150 ° C.
By heating in a hot air oven as shown in Fig. 1 (a), a chevron-shaped conductive pump 7'having a height of 200 to 300 µm is formed (formed) as shown in the sectional view of the main structure.
【００１７】その後、前記導電性パンプ７′群を形成
（形設）した電解銅箔６′に対して、図１ (b)に断面的
に示すごとく、合成樹脂系シート８を、導電性バンプ
７′対向させて位置決め配置し、さらに、第２の導電性
金属箔９′として、たとえば厚さ75μm の銅箔を積層体
化した。なお、合成樹脂系シート８は、厚さ約 200μm
のガラスエポキシ系プリプレグである。Thereafter, as shown in a sectional view in FIG. 1 (b), a synthetic resin sheet 8 is formed on the conductive bumps 7'on which conductive bumps 7'are formed (formed). 7'opposed to each other and positioned, and a copper foil having a thickness of 75 μm, for example, was laminated as the second conductive metal foil 9 '. The synthetic resin sheet 8 has a thickness of about 200 μm.
This is a glass epoxy prepreg.
【００１８】次に、前記積層体化した第２の導電性金属
箔９′面に、アルミ箔やゴムシートなどを当て板として
積層・配置し（図示せず）、 170℃に保持した熱プレス
の熱板の間に配置し（図示せず）、合成樹脂系シート８
のガラス転移点以上の温度、好ましくは熱可塑化した状
態のとき、樹脂圧として40 MPaで加圧保持し、導電性パ
ンプ７′および合成樹脂系シート８の樹脂分を硬化さ
せ、冷却後取り出した。その後、アルミ箔やゴムシート
などをを剥離したところ、図１ (c)に断面的に示すごと
く、前記各導電性のバンプ７′先端が、合成樹脂系シー
ト８中に圧入し、さらに合成樹脂系シート８裏面側の第
２の導電性金属箔９′面に、先端部が貫通・接続し、か
つ互いに絶縁離隔する導体配線部７を備えた積層体を形
成した。Then, an aluminum foil, a rubber sheet or the like is laminated and arranged as a backing plate (not shown) on the surface of the laminated second conductive metal foil 9 '(not shown), and the hot press is maintained at 170 ° C. Placed between the heating plates (not shown), the synthetic resin sheet 8
When the temperature is equal to or higher than the glass transition point of, preferably in a thermoplasticized state, the resin pressure of 40 MPa is maintained as a resin pressure to cure the resin components of the conductive pump 7 ′ and the synthetic resin sheet 8 and then take out after cooling. It was Then, when the aluminum foil or the rubber sheet was peeled off, the tips of the conductive bumps 7 ′ were press-fitted into the synthetic resin sheet 8 as shown in a sectional view in FIG. On the back surface of the second conductive metal foil 9'on the back side of the system sheet 8, there was formed a laminated body having the conductor wiring portions 7 having the leading end portions penetrating and connecting with each other and insulated and separated from each other.
【００１９】前記作成した積層体の第１の導電性金属箔
６′および第２の導電性金属箔９′面に、通常のエッチ
ングレジストインク（商品名，PSR-4000 H，製造元：太
陽インキKK）をスクリーン印刷した。つまり、配線（導
体）パターン部６および突起型接触子９に対応する部分
をそれぞれマスクしてから、塩化第２銅をエッチング液
としてエッチング処理後、レジストマスク剥離して、図
１ (d)に要部構造を断面的に示す配線板用検査治具を得
た。On the surfaces of the first conductive metal foil 6'and the second conductive metal foil 9'of the laminate thus prepared, a usual etching resist ink (trade name, PSR-4000 H, manufacturer: Taiyo Ink KK ) Was screen printed. That is, after masking the portions corresponding to the wiring (conductor) pattern portion 6 and the protruding contact 9, the resist mask is peeled off after the etching treatment using cupric chloride as an etching solution, and then, as shown in FIG. An inspection jig for a wiring board having a cross-sectional view of the structure of a main part was obtained.
【００２０】前記において、突起型接触子９面を、たと
えば Ni-Auメッキ層で被覆して、安定性などの向上を図
ることもでき、さらに、配線パターン部６が複雑化する
場合など、前記導体配線部７で層間接続を行った多層配
線化することもできる。In the above description, the surface of the protrusion-type contactor 9 can be covered with, for example, a Ni-Au plating layer to improve stability, and further, in the case where the wiring pattern portion 6 becomes complicated, It is also possible to form a multi-layer wiring in which interlayer connection is performed in the conductor wiring portion 7.
【００２１】なお、本発明は上記実施例に限定されるも
のでなく、発明の趣旨を逸脱しない範囲でいろいろの変
形を採ることができる。The present invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit of the invention.
【００２２】[0022]
【発明の効果】上記のごとく、本発明に係る配線板用検
査治具の製造方法によれば、穴明けや電解メッキなどの
工程省略によりコストダウンを図れるだけでなく、突起
型の接触子も、ほぼ一定の高さで、かつ互いに確実に絶
縁・離隔して設置されるため、安定した電気検査を行う
ことができる配線板用検査治具が得られる。つまり、信
頼性が高く、したがって検査歩留まりも向上する配線板
の電気検査を実施できる配線板用検査治具を提供できる
ので、配線板の信頼性向上に大きく寄与するといえる。As described above, according to the method for manufacturing a wiring board inspection jig of the present invention, not only the cost can be reduced by omitting steps such as drilling and electrolytic plating, but also the projection type contactor can be used. Since they are installed at substantially constant heights and are reliably insulated and separated from each other, a wiring board inspection jig capable of performing stable electrical inspection can be obtained. That is, since it is possible to provide a wiring board inspection jig that can perform electrical inspection of a wiring board that is highly reliable and therefore also improves the inspection yield, it can be said that it greatly contributes to the improvement of the reliability of the wiring board.
【図１】本発明に係る配線板用電気検査治具の製造工程
例を模式的に示すもので、 (a)は第１の導電性金属箔面
に導体性バンプ群を設けた状態の断面図、 (b)は導電性
バンプ群を設けた導電性金属箔にを絶縁シートおよび第
２の導電性金属箔体を位置合わせ・積層する状態の断面
図、 (c)は加圧一体化により導電性バンプ群を絶縁体層
に貫挿させた状態の断面図、 (d)は両面の導電性金属箔
をパターニングして配線板用電気検査治具化した状態の
断面図。FIG. 1 schematically shows an example of a manufacturing process of an electric inspection jig for a wiring board according to the present invention, in which (a) is a cross section in a state where conductive bump groups are provided on a first conductive metal foil surface. Figure, (b) is a cross-sectional view of the state where the insulating sheet and the second conductive metal foil body are aligned and laminated on the conductive metal foil provided with the conductive bump group, and (c) is by pressure integration. A cross-sectional view of a state in which a conductive bump group is inserted into an insulating layer, and (d) is a cross-sectional view of a state in which conductive metal foils on both surfaces are patterned to form an electrical inspection jig for a wiring board.
【図２】従来の配線板用電気検査治具の要部構成を示す
断面図。FIG. 2 is a cross-sectional view showing a configuration of a main part of a conventional electrical inspection jig for a wiring board.
１……導通孔 ２……配線板用電気検査治具本体 ３……接触子 ４……導電体層 ５……ソルダーレジスト層 ６……配線パターン ６′……第１の導電性金属箔 ７……導体配線部 ７′……導電性バンプ ８……合成樹脂系シート ９……突起型接触子 ９′……第２の導電性金属箔 1 ... Conductive hole 2 ... Electrical inspection jig body for wiring board 3 ... Contact 4 ... Conductor layer 5 ... Solder resist layer 6 ... Wiring pattern 6 '... First conductive metal foil 7 ...... Conductor wiring part 7 '... Conductive bump 8 ... Synthetic resin sheet 9 ... Protrusion-type contactor 9' ... Second conductive metal foil
Claims (1)
に、高さがほぼ一様な導電性バンプ群を形設する工程
と、 前記導電性バンプ群を形設した面に絶縁性合成樹脂シー
トおよび第２の導電性金属箔を順次積層・配置する工程
と、 前記積層体を加圧し、合成樹脂系シートの厚さ方向に、
導体バンプ先端部を貫挿させて第２の導電性金属箔面に
電気的に接続する導体配線部を形成する工程と、 前記
第１および第２の導電性金属箔にそれぞれ選択的なエッ
チング処理を施し、第１の導電性金属箔を配線パターン
化、第２の導電性金属箔を導体配線部の突出端子化する
工程とを備えたことを特徴とする配線板用電気検査治具
の製造方法。1. A step of forming a conductive bump group having a substantially uniform height on a predetermined position surface of a first conductive metal foil main surface, and insulation on the surface on which the conductive bump group is formed. Step of sequentially laminating and arranging the synthetic resin sheet and the second conductive metal foil, and pressing the laminated body in the thickness direction of the synthetic resin sheet,
A step of inserting a conductor bump tip portion to form a conductor wiring portion electrically connected to the surface of the second conductive metal foil; and an etching treatment selective to the first and second conductive metal foils, respectively. And a step of forming the first conductive metal foil into a wiring pattern and making the second conductive metal foil into a protruding terminal of the conductor wiring portion. Method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33176395A JP3576297B2 (en) | 1995-12-20 | 1995-12-20 | Electrical inspection jig and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33176395A JP3576297B2 (en) | 1995-12-20 | 1995-12-20 | Electrical inspection jig and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09172243A true JPH09172243A (en) | 1997-06-30 |
| JP3576297B2 JP3576297B2 (en) | 2004-10-13 |
Family
ID=18247352
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33176395A Expired - Fee Related JP3576297B2 (en) | 1995-12-20 | 1995-12-20 | Electrical inspection jig and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3576297B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6237218B1 (en) | 1997-01-29 | 2001-05-29 | Kabushiki Kaisha Toshiba | Method and apparatus for manufacturing multilayered wiring board and multi-layered wiring board |
| US6353189B1 (en) | 1997-04-16 | 2002-03-05 | Kabushiki Kaisha Toshiba | Wiring board, wiring board fabrication method, and semiconductor package |
| US6705003B2 (en) | 2000-06-22 | 2004-03-16 | Kabushiki Kaisha Toshiba | Printed wiring board with plurality of interconnect patterns and conductor bumps |
-
1995
- 1995-12-20 JP JP33176395A patent/JP3576297B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6237218B1 (en) | 1997-01-29 | 2001-05-29 | Kabushiki Kaisha Toshiba | Method and apparatus for manufacturing multilayered wiring board and multi-layered wiring board |
| US6353189B1 (en) | 1997-04-16 | 2002-03-05 | Kabushiki Kaisha Toshiba | Wiring board, wiring board fabrication method, and semiconductor package |
| US6705003B2 (en) | 2000-06-22 | 2004-03-16 | Kabushiki Kaisha Toshiba | Printed wiring board with plurality of interconnect patterns and conductor bumps |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3576297B2 (en) | 2004-10-13 |
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