JP2002374068A - Method for manufacturing multilayered printed circuit board - Google Patents
Method for manufacturing multilayered printed circuit boardInfo
- Publication number
- JP2002374068A JP2002374068A JP2001180571A JP2001180571A JP2002374068A JP 2002374068 A JP2002374068 A JP 2002374068A JP 2001180571 A JP2001180571 A JP 2001180571A JP 2001180571 A JP2001180571 A JP 2001180571A JP 2002374068 A JP2002374068 A JP 2002374068A
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- wiring board
- resin
- conductive bump
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
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- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、多層プリント配線
板の製造方法に係り、さらに詳しくは、いわゆる導電性
バンプによる層間接続部を備えた多層プリント配線板の
製造方法に関する。The present invention relates to a method for manufacturing a multilayer printed wiring board, and more particularly, to a method for manufacturing a multilayer printed wiring board provided with an interlayer connection portion using so-called conductive bumps.
【０００２】[0002]
【従来の技術】マルチメディア時代に対応して、半導体
ＩＣの高集積化が一段と進んでおり、それに伴い、小型
化、薄型化、軽量化、高密度化、低コスト化など、プリ
ント配線板に対する要求もますます厳しいものとなって
きている。2. Description of the Related Art In response to the multimedia era, the integration of semiconductor ICs has been further advanced, and accordingly, printed circuit boards have been reduced in size, thickness, weight, density and cost. Demands are becoming increasingly demanding.
【０００３】このような要求に応えるものとして、ビル
ドアップ型多層プリント配線板と称する基板技術が開発
され、なかでも、銅箔に突起状の導電性バンプを形成
し、この導電性バンプを絶縁性のシートの厚さ方向に貫
通させて層間の電気的な接続を行う方式のものが注目さ
れている。In order to meet such a demand, a board technology called a build-up type multilayer printed wiring board has been developed. In particular, a protruding conductive bump is formed on a copper foil, and the conductive bump is insulated. Attention has been paid to a type in which electrical connection between layers is performed by penetrating the sheet in the thickness direction.
【０００４】図４に、この方式によるビルドアップ型多
層プリント配線板の代表的な製造工程を示す。同図に示
すように、この方式においては、まず、両面銅張積層板
などを用いて両面に第１および第２の配線層１０１、１
０２が設けられた配線基板１０３を用意する（図４
（ａ））。FIG. 4 shows a typical manufacturing process of a build-up type multilayer printed wiring board according to this method. As shown in FIG. 1, in this method, first, first and second wiring layers 101, 1 are formed on both sides using a double-sided copper-clad laminate or the like.
4 is prepared (see FIG. 4).
(A)).
【０００５】一方、銅箔１０４を用意し、その所定位置
に銀ペーストなどの導電性ペーストを印刷し硬化させて
導電性バンプ１０５を形成する（図４（ｂ））。On the other hand, a copper foil 104 is prepared, and a conductive paste such as a silver paste is printed at a predetermined position and cured to form a conductive bump 105 (FIG. 4B).
【０００６】次いで、この導電性バンプ１０５の形成面
上に絶縁シート（例えばプリプレグ）１０６を積層し加
圧して、導電性バンプ１０５を絶縁シート１０６に貫通
させるとともに、露出した導電性バンプ１０５の先端が
圧潰されるように塑性変形させる（図４（ｃ））。Next, an insulating sheet (for example, a prepreg) 106 is laminated on the surface on which the conductive bump 105 is formed and pressed to cause the conductive bump 105 to penetrate the insulating sheet 106 and to expose the tip of the exposed conductive bump 105. Is plastically deformed so as to be crushed (FIG. 4C).
【０００７】続いて、このように銅箔１０５と絶縁シー
ト１０６を一体化した積層体を、配線基板１０３と、導
電性バンプ１０５の先端と配線基板１０３に設けられた
第１の配線層１０１が対向するように積層し、加熱加圧
を行う（図４（ｄ））。この加熱加圧により、絶縁シー
ト１０６が硬化して、銅箔１０４および絶縁シート１０
６からなる積層体と配線基板１０３とが一体化されると
ともに、導電性バンプ１０５の先端が第１の配線層１０
１に接合される。[0007] Subsequently, the laminate obtained by integrating the copper foil 105 and the insulating sheet 106 is combined with the wiring board 103, the tip of the conductive bump 105, and the first wiring layer 101 provided on the wiring board 103. The layers are stacked so as to face each other, and heated and pressed (FIG. 4D). By this heating and pressurizing, the insulating sheet 106 is hardened, and the copper foil 104 and the insulating sheet 10 are hardened.
6 and the wiring substrate 103 are integrated, and the tip of the conductive bump 105 is connected to the first wiring layer 10.
1 is joined.
【０００８】この後、銅箔１０４に常法によりパターニ
ングを行い第３の配線層１０７を形成することにより、
第1の配線層１０１と第３の配線層１０７が導電性バン
プ１０５により層間接続された多層プリント配線板が得
られる（図４（ｅ））。Thereafter, patterning is performed on the copper foil 104 by a conventional method to form a third wiring layer 107.
A multilayer printed wiring board in which the first wiring layer 101 and the third wiring layer 107 are connected between the layers by the conductive bumps 105 is obtained (FIG. 4E).
【０００９】なお、より配線層の多い多層プリント配線
板を製造する場合には、配線基板１０３としてより多層
の配線基板を用いるか、あるいは、第２の配線層１０２
や第３の配線層１０７上に上記と同様にして第４、第５
……の配線層をさらに設ける。When a multilayer printed wiring board having a larger number of wiring layers is manufactured, a multilayer wiring board is used as the wiring board 103 or the second wiring layer 102 is used.
And the fourth and fifth wiring layers on the third wiring layer 107 in the same manner as described above.
A wiring layer of... Is further provided.
【００１０】このように形成される多層プリント配線板
は、配線層間の接続抵抗が小さく、また、ランドパター
ンの微細化を図ることができるため、高密度配線、高密
度実装が可能で、しかも、他の方式に比べ、製造工程や
その管理も容易であるなどの特徴を有している。[0010] The multilayer printed wiring board thus formed has a low connection resistance between wiring layers and a fine land pattern, so that high-density wiring and high-density mounting are possible. It has features such as easier manufacturing processes and easier management than other methods.
【００１１】[0011]
【発明が解決しようとする課題】しかしながら、前述し
たように、プリント配線板に対する高密度化などの要求
は、一段と厳しくなってきており、さらなる改善が求め
られている。すなわち、より高密度化を図ることができ
るうえ、製造工程もより簡略化することができる多層プ
リント配線板の製造方法が求められている。However, as described above, the demands for higher density of printed wiring boards are becoming more severe, and further improvements are required. That is, there is a need for a method of manufacturing a multilayer printed wiring board that can achieve higher density and can further simplify the manufacturing process.
【００１２】本発明はこのような要求に応えるべくなさ
れたもので、配線密度、実装密度をより向上させること
ができ、また、製造工程をより簡略化することができる
多層プリント配線板の製造方法を提供することを目的と
する。The present invention has been made to meet such a demand, and a method of manufacturing a multilayer printed wiring board capable of further improving wiring density and mounting density and further simplifying the manufacturing process. The purpose is to provide.
【００１３】[0013]
【課題を解決するための手段】本発明者らは、上記の目
的を達成するため鋭意研究を重ねた結果、配線基板に形
成された配線層上に層間接続のための導電性バンプを形
成するとともに、この導電性バンプの形成面に後述する
ような銅箔付き樹脂シートを積層して一体化させること
により、上記目的が達成されることを見出し、本発明を
完成したものである。Means for Solving the Problems The present inventors have made intensive studies to achieve the above object, and as a result, have formed conductive bumps for interlayer connection on a wiring layer formed on a wiring board. In addition, the inventors have found that the above object can be achieved by laminating and integrating a resin sheet with a copper foil as described later on the surface on which the conductive bumps are formed, thereby completing the present invention.
【００１４】すなわち、上記課題を解決するため、本願
の請求項１に記載された発明は、配線基板の一主面に形
成された第1の配線層上の所定位置に導電性バンプを形
成する工程と、前記導電性バンプ形成面上に、銅箔の一
主面に樹脂層を備えてなる銅箔付き樹脂シートを、前記
樹脂層側を前記導電性バンプ形成面側に向けて積層する
工程と、前記積層体を加熱加圧して、前記導電性バンプ
の先端が前記銅箔付き樹脂シートの樹脂層を貫通して前
記銅箔に接合した積層板を形成する工程と、前記銅箔を
エッチング処理して第２の配線層を形成する工程とを有
することを特徴とする多層プリント配線板の製造方法で
ある。That is, in order to solve the above problem, the invention described in claim 1 of the present application forms a conductive bump at a predetermined position on a first wiring layer formed on one main surface of a wiring board. And a step of laminating a resin sheet with a copper foil having a resin layer on one principal surface of a copper foil on the conductive bump forming surface, with the resin layer side facing the conductive bump forming surface side Heating and pressurizing the laminate, forming a laminate in which the tips of the conductive bumps penetrate the resin layer of the resin sheet with copper foil and are joined to the copper foil, and etching the copper foil And forming a second wiring layer by processing.
【００１５】上記課題を解決するため、本願の請求項２
に記載された発明は、配線基板の第１および第２の面に
それぞれ形成された第1および第２の配線層の各配線層
上の所定位置に導電性バンプを形成する工程と、前記各
導電性バンプ形成面上にそれぞれ、銅箔の一主面に樹脂
層を備えてなる銅箔付き樹脂シートを、前記各樹脂層側
を前記各導電性バンプ形成面側に向けて積層する工程
と、前記積層体を加熱加圧して、前記導電性バンプの先
端が前記各銅箔付き樹脂シートの樹脂層を貫通して前記
各銅箔に接合した積層板を形成する工程と、前記各銅箔
をエッチング処理して第３および第４の配線層を形成す
る工程とを有することを特徴とする多層プリント配線板
の製造方法である。[0015] In order to solve the above-mentioned problem, claim 2 of the present application.
Forming a conductive bump at a predetermined position on each of the first and second wiring layers formed on the first and second surfaces of the wiring board, respectively; A step of laminating a resin sheet with a copper foil comprising a resin layer on one principal surface of a copper foil on each of the conductive bump forming surfaces, with the respective resin layer sides facing the respective conductive bump forming surfaces. Heating and pressurizing the laminate to form a laminate in which the tips of the conductive bumps penetrate the resin layer of each of the resin sheets with copper foil and are joined to the copper foils; Forming a third and a fourth wiring layer by performing an etching process on the multi-layer printed wiring board.
【００１６】請求項１および請求項２記載の発明の多層
プリント配線板の製造方法においては、積層体を加熱加
圧して一体化する際、同時に導電性バンプが樹脂シート
を貫通して銅箔と接合される。したがって、従来のよう
に、導電性バンプの貫通工程を別工程で行う必要がな
く、製造工程を簡略化することができる。In the method for manufacturing a multilayer printed wiring board according to the first and second aspects of the present invention, when the laminate is integrated by heating and pressurizing, the conductive bumps simultaneously penetrate the resin sheet and form a copper foil. Joined. Therefore, unlike the related art, it is not necessary to perform the step of penetrating the conductive bump in a separate step, and the manufacturing process can be simplified.
【００１７】本発明において、前記配線基板は、請求項
３に記載したように、少なくとも1つの内層配線層を有
していてもよい。In the present invention, the wiring board may have at least one inner wiring layer.
【００１８】また、前記導電性バンプの形成は、請求項
４に記載したように、導電性ペーストをスクリーン印刷
し硬化させる方法を用いることができる。このような方
法によれば、銅箔との接合面積を従来より小さくするこ
とができ、ランド面積を縮小して配線パターンのさらな
るファインパターン化を図ることができる。The conductive bumps may be formed by a method of screen-printing and curing a conductive paste. According to such a method, the bonding area with the copper foil can be made smaller than before, the land area can be reduced, and the wiring pattern can be made even finer.
【００１９】[0019]
【発明の実施の形態】以下、本発明の実施の形態を図面
を参照しながら説明する。Embodiments of the present invention will be described below with reference to the drawings.
【００２０】図1は、本発明に係る多層プリント配線板
の製造方法の一実施形態を模式的に示す図である。FIG. 1 is a view schematically showing one embodiment of a method for manufacturing a multilayer printed wiring board according to the present invention.
【００２１】本実施形態においては、まず、両主面に配
線層１１、１２を有する配線基板１３の各配線層１１上
に、導電性ペーストをスクリーン印刷して円錐状の導電
性バンプ１４を形成する（図１（ａ））。In this embodiment, first, a conductive paste is screen-printed on each wiring layer 11 of a wiring board 13 having wiring layers 11 and 12 on both main surfaces to form conical conductive bumps 14. (FIG. 1A).
【００２２】配線基板１３としては、従来より多層プリ
ント配線板の材料として使用されている、両面に銅箔を
貼り合わせたガラスエポキシ銅張積層板やガラスポリイ
ミド銅張積層板などの両面銅張積層板の両面の銅箔に所
要の配線パターンを形成したもの、あるいは、その片面
もしくは両面に絶縁シートを介して銅箔をさらに積層一
体化して多層化し、それらの銅箔に所要の配線パターン
を形成したものなどが使用される。The wiring board 13 is a double-sided copper-clad laminate, such as a glass epoxy copper-clad laminate or a glass-polyimide copper-clad laminate, which has been conventionally used as a material for a multilayer printed wiring board and has copper foils bonded on both sides. The required wiring pattern is formed on the copper foil on both sides of the board, or the copper foil is further laminated and integrated on one or both sides via an insulating sheet to form a multilayer, and the required wiring pattern is formed on those copper foils What is done is used.
【００２３】また、導電性バンプ１４の形成に使用する
導電性ペーストとしては、銀、金、銅、ニッケル、白
金、タングステン、モリブデン、パラジウム、ロジウ
ム、半田粉などから選ばれた少なくとも1種の導電性粉
末と、ポリカーボネート樹脂、ポリスルホン樹脂、ポリ
エステル樹脂、フェノキシ樹脂、フェノール樹脂、ポリ
イミド樹脂などの樹脂系またはガラスフリット系のバイ
ンダ成分とを混合したものなどが挙げられる。The conductive paste used to form the conductive bumps 14 is at least one conductive paste selected from silver, gold, copper, nickel, platinum, tungsten, molybdenum, palladium, rhodium, solder powder and the like. And a mixture of a conductive powder and a resin-based or glass-frit-based binder component such as a polycarbonate resin, a polysulfone resin, a polyester resin, a phenoxy resin, a phenol resin, and a polyimide resin.
【００２４】なお、導電性バンプ１４は、上記のような
導電性ペーストをスクリーン印刷する方法の他、銅、
金、銀、錫、半田などの金属をメッキするいわゆる電鋳
法、同様の金属からなる層を設けエッチングするいわゆ
るエッチング法、同様の金属からなる細線を接合させる
方法などにより形成するようにしてもよい。The conductive bumps 14 may be formed by screen printing a conductive paste as described above, copper, or the like.
It may be formed by a so-called electroforming method of plating a metal such as gold, silver, tin, or solder, a so-called etching method of providing and etching a layer made of a similar metal, or a method of joining thin wires made of the same metal. Good.
【００２５】しかしながら、導電性ペーストをスクリー
ン印刷する方法では、導電性バンプ１４は、少なくとも
底面の面積が先端部より大きい形状（通常、円錐状）に
形成されるため、ランド面積を縮小することができ、そ
れにより配線パターンのさらなる微細化を図ることがで
きるため、高密度化の点でより有利である。However, in the method of screen-printing the conductive paste, the conductive bumps 14 are formed in a shape having at least a bottom surface area larger than a tip portion (usually a conical shape). Since it is possible to further reduce the size of the wiring pattern, it is more advantageous in terms of high density.
【００２６】次に、このように導電性バンプ１４が形成
された配線基板１３の導電性バンプ形成面１５、１６
に、銅箔１７ａ、１８ａの一主面に樹脂層１７ｂ、１８
ｂを設けた銅箔付き樹脂シート１７、１８を、樹脂層１
１７ｂ、１８ｂ側を導電性バンプ形成面１５、１６側に
それぞれ向けて積層し、加熱加圧して、導電性バンプ１
４の先端が各銅箔付き樹脂シート１７、１８の各樹脂層
１７ｂ、１８ｂを貫通して各銅箔１７ａ、１８ａに接合
した積層板を得る（図１（ｂ））。Next, the conductive bump forming surfaces 15, 16 of the wiring board 13 on which the conductive bumps 14 are formed as described above.
And resin layers 17b, 18 on one main surface of the copper foils 17a, 18a.
b, the resin sheets 17 and 18 provided with the copper foil are
The conductive bumps 1 and 2 are laminated with the sides 17b and 18b facing the conductive bump forming surfaces 15 and 16, respectively, and heated and pressed to form the conductive bump 1
A laminated board having the tip of 4 penetrating through the resin layers 17b and 18b of the resin sheets 17 and 18 with copper foil and joining to the copper foils 17a and 18a is obtained (FIG. 1B).
【００２７】銅箔付き樹脂シート１７、１８の樹脂層１
７ｂ、１８ｂは、例えば、半硬化状態に保持されたエポ
キシ樹脂、ポリイミド樹脂、これらの変性樹脂などの熱
硬化性樹脂、あるいは、ポリカーボネート樹脂、ポリス
ルホン樹脂、熱可塑性ポリイミド樹脂、４フッ化ポリエ
チレン樹脂、６フッ化ポリプロピレン樹脂、ポリエーテ
ルエーテルケトン樹脂などの熱可塑性樹脂から構成され
る。これらの樹脂層１７ｂ、１８ｂには、絶縁性の無機
系もしくは有機系の充填剤を含有していてもよい。Resin layer 1 of resin sheets 17 and 18 with copper foil
7b and 18b are, for example, a thermosetting resin such as an epoxy resin, a polyimide resin, or a modified resin thereof held in a semi-cured state, or a polycarbonate resin, a polysulfone resin, a thermoplastic polyimide resin, a tetrafluoroethylene resin, It is composed of a thermoplastic resin such as hexafluoropolypropylene resin and polyetheretherketone resin. These resin layers 17b and 18b may contain an insulating inorganic or organic filler.
【００２８】この後、上記積層板の各銅箔を常法により
パターニングして配線層１９、２０を形成し、多層プリ
ント配線板を得る（図１（ｃ））。Thereafter, the copper foils of the laminate are patterned by a conventional method to form wiring layers 19 and 20, thereby obtaining a multilayer printed wiring board (FIG. 1 (c)).
【００２９】このような製造方法においては、配線基板
１３と銅箔付き樹脂シート１７、１８を加熱加圧して一
体化する際、同時に配線基板１３の各配線層１１、１２
に形成された導電性バンプ１４が各樹脂層１７ｂ、１８
ｂを貫通して各銅箔１７ａ、１８ａと接合されるため、
従来のように導電性バンプ１４の貫通工程を別工程で行
う必要がなく、従来に比べ製造工程を簡略化することが
できる。In such a manufacturing method, when the wiring board 13 and the resin sheets 17 and 18 with copper foil are integrated by heating and pressing, the wiring layers 11 and 12 of the wiring board 13 are simultaneously formed.
The conductive bumps 14 formed on each of the resin layers 17b, 18
b to be joined to each of the copper foils 17a, 18a,
It is not necessary to perform the step of penetrating the conductive bumps 14 in a separate step as in the related art, and the manufacturing process can be simplified as compared with the related art.
【００３０】なお、以上説明した例では、配線基板１３
の両主面上に2つの配線層１９、２０を一括して多層化
しているが、本発明においては、まず、配線基板１３の
一方の配線層１１上に導電性バンプ１４を形成し、この
両導電性バンプ形成面１５に銅箔付き樹脂シート１７を
積層し一体化した後、他方の配線層１２上に同様に導電
性バンプ１４を形成し、この両導電性バンプ形成面１６
に銅箔付き樹脂シート１８を積層して一体化するように
してもよい。In the example described above, the wiring board 13
The two wiring layers 19 and 20 are collectively multi-layered on both main surfaces of the wiring board 13. In the present invention, first, the conductive bumps 14 are formed on one of the wiring layers 11 of the wiring board 13. After laminating and integrating a resin sheet 17 with copper foil on both conductive bump forming surfaces 15, conductive bumps 14 are similarly formed on the other wiring layer 12, and the both conductive bump forming surfaces 16 are formed.
Alternatively, a resin sheet 18 with a copper foil may be laminated and integrated.
【００３１】また、本発明においては、図２に示すよう
に、配線基板１３の一方の配線層１１上にのみ新たな配
線層１９を設けるようにしてもよい。In the present invention, as shown in FIG. 2, a new wiring layer 19 may be provided only on one wiring layer 11 of the wiring board 13.
【００３２】また、必要ならば、このようにして形成さ
れた配線層１９、２０上にさらに、上記と同様の工程を
繰り返すようにしてもよく、より配線層の多い多層プリ
ント配線板を得ることができる。図３は、このような方
法によって製造された多層プリント配線板の一例を示し
たもので、前記実施形態で得られた多層プリント配線板
の配線層１９、２０上にさらに配線層２１、２２が設け
られており、かつ、配線層１９と配線層２１間および配
線層２０と配線層２２間が、それぞれ配線層１９、２０
上に設けられた導電性バンプ１４によって電気的に接合
された構造を有している。If necessary, the same steps as described above may be repeated on the wiring layers 19 and 20 formed in this way, to obtain a multilayer printed wiring board having more wiring layers. Can be. FIG. 3 shows an example of a multilayer printed wiring board manufactured by such a method. Wiring layers 21 and 22 are further provided on wiring layers 19 and 20 of the multilayer printed wiring board obtained in the above embodiment. The wiring layers 19 and 20 are provided between the wiring layers 19 and 21 and between the wiring layers 20 and 22 respectively.
It has a structure electrically connected by the conductive bumps 14 provided thereon.
【００３３】[0033]
【実施例】次に、本発明を実施例によりさらに詳細に説
明する。Next, the present invention will be described in more detail with reference to examples.
【００３４】実施例１ 予めスルーホール形成された、銅箔厚さ18μｍ、板厚0.
4mmのガラスエポキシ両面銅張積層板（東芝ケミカル社
製 商品名TLC-555Ｍ）の各銅箔をパターニングして両
面に配線層を有する配線基板を作成した後、この両面配
線基板の各配線層上の所要位置に、導電性ペースト（東
芝ケミカル社製 商品名CT-2801）をスクリーン印刷
し、底面の直径約150μm、高さ約80μｍの円錐状の導電
性バンプを形成した。Example 1 A through-hole was previously formed in a copper foil having a thickness of 18 μm and a plate thickness of 0.1 μm.
After patterning each copper foil of 4mm glass epoxy double-sided copper-clad laminate (trade name: TLC-555M manufactured by Toshiba Chemical Co., Ltd.), a wiring board having wiring layers on both sides is created, and then on each wiring layer of this double-sided wiring board A conductive paste (trade name: CT-2801, manufactured by Toshiba Chemical Co., Ltd.) was screen-printed at a required position to form a conical conductive bump having a bottom diameter of about 150 μm and a height of about 80 μm.
【００３５】次いで、配線基板の各導電性バンプ形成面
上に、それぞれ厚さ18μｍの銅箔の片面にエポキシ樹脂
を塗布し半硬化させてなる厚さ0.1mmの銅箔付き樹脂シ
ート（東芝ケミカル社製 商品名TLD-152）を、それぞ
れの樹脂面を各導電性バンプ形成面に対向させて積層
し、加熱加圧プレス機を用いて、180℃、40kg/cm2の条
件で加熱加圧して一体化した後、両面の銅箔をパターニ
ングして、厚さ0.6mmの４層プリント配線板を得た。Next, a resin sheet with a 0.1 mm thick copper foil (Toshiba Chemical Co., Ltd.) formed by applying an epoxy resin to one side of a 18 μm thick copper foil and semi-curing it on each conductive bump forming surface of the wiring board. (Product name: TLD-152), each resin surface is opposed to each conductive bump forming surface, and heated and pressed at 180 ° C and 40 kg / cm 2 using a heating and pressing press. Then, the copper foils on both sides were patterned to obtain a four-layer printed wiring board having a thickness of 0.6 mm.
【００３６】得られた４層プリント配線板について、導
通試験を行ったところ、全ての接続に不具合は認められ
なかった。When a continuity test was performed on the obtained four-layer printed wiring board, no defect was found in any connection.
【００３７】実施例２ 予めスルーホール形成された、銅箔厚さ18μｍ、板厚0.
4mmのガラスエポキシ両面銅張積層板（東芝ケミカル社
製 商品名TLC-555Ｍ）の各銅箔をパターニングして両
面に配線層を有する配線基板を作成した後、この両面配
線基板の各配線層上の所要位置に、電鋳法により、直径
約100μｍ、高さ約50μｍの円柱状の導電性バンプを形
成した。Example 2 A copper foil having a thickness of 18 μm and a plate thickness of 0.1 μm was previously formed through holes.
After patterning each copper foil of 4mm glass epoxy double-sided copper-clad laminate (trade name: TLC-555M manufactured by Toshiba Chemical Co., Ltd.), a wiring board having wiring layers on both sides is created, and then on each wiring layer of this double-sided wiring board A columnar conductive bump having a diameter of about 100 .mu.m and a height of about 50 .mu.m was formed at a required position by electroforming.
【００３８】次いで、配線基板の各導電性バンプ形成面
上に、それぞれ厚さ18μｍの銅箔の片面にエポキシ樹脂
を塗布し半硬化させてなる厚さ0.1mmの銅箔付き樹脂シ
ート（東芝ケミカル社製 商品名TLD-152）を、それぞ
れの樹脂面を各導電性バンプ形成面に対向させて積層
し、加熱加圧プレス機を用いて、180℃、40kg/cm2の条
件で加熱加圧して一体化した後、両面の銅箔をパターニ
ングして、厚さ0.6mmの４層プリント配線板を得た。Next, a resin sheet with a copper foil having a thickness of 0.1 mm (Toshiba Chemical Co., Ltd.) is obtained by applying an epoxy resin to one side of a copper foil having a thickness of 18 μm and semi-curing the copper foil on each surface of the wiring board on which conductive bumps are formed. (Product name: TLD-152), each resin surface is opposed to each conductive bump forming surface, and heated and pressed at 180 ° C and 40 kg / cm 2 using a heating and pressing press. Then, the copper foils on both sides were patterned to obtain a four-layer printed wiring board having a thickness of 0.6 mm.
【００３９】得られた４層プリント配線板について、導
通試験を行ったところ、全ての接続に不具合は認められ
なかった。When a continuity test was performed on the obtained four-layer printed wiring board, no defect was found in any connection.
【００４０】実施例３ 予めスルーホール形成された、銅箔厚さ70μｍ、板厚0.
4mmのガラスエポキシ両面銅張積層板（東芝ケミカル社
製 商品名TLC-555Ｍ）の各銅箔をパターニングして両
面に配線層を有する配線基板を作成した後、この両面配
線基板の各配線層上の所要位置に、エッチング法によ
り、直径約100μｍ、高さ約70μｍの円柱状の導電性バ
ンプを形成した。Example 3 A through-hole was previously formed in a copper foil having a thickness of 70 μm and a plate thickness of 0.1 μm.
After patterning each copper foil of 4mm glass epoxy double-sided copper-clad laminate (trade name: TLC-555M manufactured by Toshiba Chemical Co., Ltd.), a wiring board having wiring layers on both sides is created, and then on each wiring layer of this double-sided wiring board A columnar conductive bump having a diameter of about 100 μm and a height of about 70 μm was formed at a required position by etching.
【００４１】次いで、配線基板の各導電性バンプ形成面
上に、それぞれ厚さ18μｍの銅箔の片面にエポキシ樹脂
を塗布し半硬化させてなる厚さ0.1mmの銅箔付き樹脂シ
ート（東芝ケミカル社製 商品名TLD-152）を、それぞ
れの樹脂面を各導電性バンプ形成面に対向させて積層
し、加熱加圧プレス機を用いて、180℃、40kg/cm2の条
件で加熱加圧して一体化した後、両面の銅箔をパターニ
ングして、厚さ0.6mmの４層プリント配線板を得た。Next, a resin sheet with a copper foil having a thickness of 0.1 mm (Toshiba Chemical Co., Ltd.) obtained by applying an epoxy resin to one side of a copper foil having a thickness of 18 μm and semi-curing the copper foil on each surface of the wiring board on which each conductive bump is formed. (Product name: TLD-152) are laminated with their respective resin surfaces facing each conductive bump forming surface, and heated and pressed at 180 ° C and 40 kg / cm 2 using a heating and pressing press. After the integration, the copper foil on both sides was patterned to obtain a four-layer printed wiring board having a thickness of 0.6 mm.
【００４２】得られた４層プリント配線板について、導
通試験を行ったところ、全ての接続に不具合は認められ
なかった。When a continuity test was conducted on the obtained four-layer printed wiring board, no defect was found in any connection.
【００４３】実施例４ 予めスルーホール形成された、銅箔厚さ18μｍ、板厚0.
4mmのガラスエポキシ両面銅張積層板（東芝ケミカル社
製 商品名TLC-555Ｍ）の各銅箔をパターニングして両
面に配線層を有する配線基板を作成した後、この両面配
線基板の各配線層表面に金メッキを施し、さらに、この
金メッキ層上に金ワイヤ（田中電子工業社製 商品名FA
50）を接合して、直径約50μｍ、高さ70μｍの円柱状の
導電性バンプを形成した。Example 4 A copper foil having a thickness of 18 μm and a plate thickness of 0.1 μm was previously formed through holes.
After patterning each copper foil of 4mm glass epoxy double-sided copper-clad laminate (trade name: TLC-555M, manufactured by Toshiba Chemical Co., Ltd.), a wiring board having wiring layers on both sides is created, and then the surface of each wiring layer of this double-sided wiring board And gold wire (Tanaka Denshi Kogyo Co., Ltd. product name FA
50) were joined to form a columnar conductive bump having a diameter of about 50 μm and a height of 70 μm.
【００４４】次いで、配線基板の各導電性バンプ形成面
上に、それぞれ厚さ18μｍの銅箔の片面にエポキシ樹脂
を塗布し半硬化させてなる厚さ0.1mmの銅箔付き樹脂シ
ート（東芝ケミカル社製 商品名TLD-152）を、それぞ
れの樹脂面を各導電性バンプ形成面に対向させて積層
し、加熱加圧プレス機を用いて、180℃、40kg/cm2の条
件で加熱加圧して一体化した後、両面の銅箔をパターニ
ングして、厚さ0.6mmの４層プリント配線板を得た。Next, a resin sheet with a copper foil of 0.1 mm thickness (Toshiba Chemical Co., Ltd.) formed by applying an epoxy resin to one side of a copper foil having a thickness of 18 μm and semi-curing it on each conductive bump forming surface of the wiring board. (Product name: TLD-152), each resin surface is opposed to each conductive bump forming surface, and heated and pressed at 180 ° C and 40 kg / cm 2 using a heating and pressing press. Then, the copper foils on both sides were patterned to obtain a four-layer printed wiring board having a thickness of 0.6 mm.
【００４５】得られた４層プリント配線板について、導
通試験を行ったところ、全ての接続に不具合は認められ
なかった。When a continuity test was performed on the obtained four-layer printed wiring board, no defect was found in any connection.
【００４６】なお、本発明は、上記実施例に限定される
ものではなく、発明の趣旨を逸脱しない範囲で変形して
実施することができることはいうまでもない。The present invention is not limited to the above embodiment, and it goes without saying that the present invention can be modified and carried out without departing from the spirit of the invention.
【００４７】[0047]
【発明の効果】以上説明したように、本発明の多層プリ
ント配線板の製造方法によれば、従来のように導電性バ
ンプの貫通工程を別工程で行う必要がないので、製造工
程をより簡略化することができる。As described above, according to the method for manufacturing a multilayer printed wiring board of the present invention, the step of penetrating the conductive bumps does not need to be performed in a separate step as in the prior art, so that the manufacturing step is simplified. Can be
【図１】本発明の多層プリント配線板の製造方法の一実
施形態を模式的に説明する図。FIG. 1 is a diagram schematically illustrating an embodiment of a method for manufacturing a multilayer printed wiring board according to the present invention.
【図２】本発明の他の実施形態による多層プリント配線
板の一例を示す概略断面図。FIG. 2 is a schematic sectional view showing an example of a multilayer printed wiring board according to another embodiment of the present invention.
【図３】本発明のさらに他の実施形態による多層プリン
ト配線板の一例を示す概略断面図。FIG. 3 is a schematic sectional view showing an example of a multilayer printed wiring board according to still another embodiment of the present invention.
【図４】従来の多層プリント配線板の製造方法を模式的
に説明する図。FIG. 4 is a diagram schematically illustrating a conventional method for manufacturing a multilayer printed wiring board.
１１、１２、１９、２０、２１、２２………配線層 １３………配線基板 １４………導電性バンプ １５、１６………導電性バンプ形成面 １７、１８………銅箔付き樹脂シート １７ａ、１８ａ………銅箔 １７ｂ、１８ｂ………樹脂層 11, 12, 19, 20, 21, 22 ... wiring layer 13 ... wiring board 14 ... conductive bumps 15, 16 ... conductive bump forming surface 17, 18 ... resin with copper foil Sheet 17a, 18a Copper foil 17b, 18b Resin layer
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 5E339 AB02 AC01 AD05 BC01 BC02 BD07 BE11 CF15 5E346 AA05 AA06 AA12 AA15 AA22 AA32 AA35 AA43 AA51 BB16 CC02 CC08 CC32 CC42 DD02 DD12 DD32 EE06 EE07 EE13 EE15 EE18 FF18 FF24 GG17 GG19 GG22 GG28 HH25 HH26 ──────────────────────────────────────────────────続 き Continued on the front page F-term (reference) 5E339 AB02 AC01 AD05 BC01 BC02 BD07 BE11 CF15 5E346 AA05 AA06 AA12 AA15 AA22 AA32 AA35 AA43 AA51 BB16 CC02 CC08 CC32 CC42 DD02 DD12 DD32 EE06 EE07 EE13 EE19 GG18 GG18 GG18 GG18 HH25 HH26
Claims (4)
線層上の所定位置に導電性バンプを形成する工程と、前
記導電性バンプ形成面上に、銅箔の一主面に樹脂層を備
えてなる銅箔付き樹脂シートを、前記樹脂層側を前記導
電性バンプ形成面側に向けて積層する工程と、前記積層
体を加熱加圧して、前記導電性バンプの先端が前記銅箔
付き樹脂シートの樹脂層を貫通して前記銅箔に接合した
積層板を形成する工程と、前記銅箔をエッチング処理し
て第２の配線層を形成する工程とを有することを特徴と
する多層プリント配線板の製造方法。A step of forming a conductive bump at a predetermined position on a first wiring layer formed on one main surface of a wiring board; and forming a conductive bump on one main surface of a copper foil on the conductive bump forming surface. A step of laminating a resin sheet with a copper foil comprising a resin layer, with the resin layer side facing the conductive bump forming surface side, and heating and pressurizing the laminate so that the tip of the conductive bump is A step of forming a laminate bonded to the copper foil by penetrating the resin layer of the resin sheet with copper foil, and a step of forming a second wiring layer by etching the copper foil. Manufacturing method of a multilayer printed wiring board.
ぞれ形成された第1および第２の配線層の各配線層上の
所定位置に導電性バンプを形成する工程と、前記各導電
性バンプ形成面上にそれぞれ、銅箔の一主面に樹脂層を
備えてなる銅箔付き樹脂シートを、前記各樹脂層側を前
記各導電性バンプ形成面側に向けて積層する工程と、前
記積層体を加熱加圧して、前記導電性バンプの先端が前
記各銅箔付き樹脂シートの各樹脂層を貫通して前記各銅
箔に接合した積層板を形成する工程と、前記各銅箔をエ
ッチング処理して第３および第４の配線層を形成する工
程とを有することを特徴とする多層プリント配線板の製
造方法。A step of forming a conductive bump at a predetermined position on each of the first and second wiring layers formed on the first and second main surfaces of the wiring board, respectively; A step of laminating a resin sheet with a copper foil comprising a resin layer on one principal surface of a copper foil on each of the conductive bump forming surfaces, with the respective resin layers facing the respective conductive bump forming surfaces. A step of heating and pressing the laminate to form a laminate in which the tips of the conductive bumps penetrate through each resin layer of each of the resin sheets with copper foil and are bonded to the copper foils; Forming a third and a fourth wiring layer by performing an etching process on the multilayer printed wiring board.
配線層を有することを特徴とする請求項1または２記載
の多層プリント配線板の製造方法。3. The method for manufacturing a multilayer printed wiring board according to claim 1, wherein the wiring board has at least one inner wiring layer.
ストをスクリーン印刷し硬化させることからなることを
特徴とする請求項1乃至３のいずれか１項記載の多層プ
リント配線板の製造方法。4. The method according to claim 1, wherein the conductive bumps are formed by screen-printing and curing a conductive paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001180571A JP2002374068A (en) | 2001-06-14 | 2001-06-14 | Method for manufacturing multilayered printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001180571A JP2002374068A (en) | 2001-06-14 | 2001-06-14 | Method for manufacturing multilayered printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002374068A true JP2002374068A (en) | 2002-12-26 |
Family
ID=19020973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001180571A Withdrawn JP2002374068A (en) | 2001-06-14 | 2001-06-14 | Method for manufacturing multilayered printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002374068A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7393720B2 (en) | 2004-09-29 | 2008-07-01 | Unimicron Technology Corp. | Method for fabricating electrical interconnect structure |
| JP2010212599A (en) * | 2009-03-12 | 2010-09-24 | Nec Tokin Corp | Electronic component-mounted body and method of manufacturing the same |
| KR100990567B1 (en) | 2008-05-15 | 2010-10-29 | 삼성전기주식회사 | A landless printed circuit board and a fabricating method of the same |
| KR101044103B1 (en) * | 2008-04-03 | 2011-06-28 | 삼성전기주식회사 | Multilayer printed circuit board and a fabricating method of the same |
| KR101062095B1 (en) | 2006-02-13 | 2011-09-02 | 산미나-에스씨아이 코포레이션 | How to embed conductive elements in a dielectric layer |
| CN103648231A (en) * | 2013-11-18 | 2014-03-19 | 无锡俊达测试技术服务有限公司 | Pcb |
-
2001
- 2001-06-14 JP JP2001180571A patent/JP2002374068A/en not_active Withdrawn
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7393720B2 (en) | 2004-09-29 | 2008-07-01 | Unimicron Technology Corp. | Method for fabricating electrical interconnect structure |
| KR101062095B1 (en) | 2006-02-13 | 2011-09-02 | 산미나-에스씨아이 코포레이션 | How to embed conductive elements in a dielectric layer |
| KR101044103B1 (en) * | 2008-04-03 | 2011-06-28 | 삼성전기주식회사 | Multilayer printed circuit board and a fabricating method of the same |
| KR100990567B1 (en) | 2008-05-15 | 2010-10-29 | 삼성전기주식회사 | A landless printed circuit board and a fabricating method of the same |
| JP2010212599A (en) * | 2009-03-12 | 2010-09-24 | Nec Tokin Corp | Electronic component-mounted body and method of manufacturing the same |
| CN103648231A (en) * | 2013-11-18 | 2014-03-19 | 无锡俊达测试技术服务有限公司 | Pcb |
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| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20080902 |