JPH09155441A - Manufacture of gold foil - Google Patents

Manufacture of gold foil

Info

Publication number
JPH09155441A
JPH09155441A JP33411395A JP33411395A JPH09155441A JP H09155441 A JPH09155441 A JP H09155441A JP 33411395 A JP33411395 A JP 33411395A JP 33411395 A JP33411395 A JP 33411395A JP H09155441 A JPH09155441 A JP H09155441A
Authority
JP
Japan
Prior art keywords
gold
plating
nickel
foil
plating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP33411395A
Other languages
Japanese (ja)
Inventor
Shinji Abe
信二 阿部
Akira Nakabayashi
明 中林
Satoru Takayanagi
悟 高柳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority to JP33411395A priority Critical patent/JPH09155441A/en
Publication of JPH09155441A publication Critical patent/JPH09155441A/en
Withdrawn legal-status Critical Current

Links

Landscapes

  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Physical Vapour Deposition (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

PROBLEM TO BE SOLVED: To easily provide a dense gold foil having specular gloss by performing the specular gloss plating on the surface of a metallic base plate by the electric plating, executing the gold plating thereon, and melting and removing the base metal and the specular gloss plating layer. SOLUTION: After a copper plate is degreased, etching and pickling are performed, and the nickel gloss plating is executed on each surface of the copper plate using a watts nickel bath to which the brightener is added. After the gold plating is executed on each surface of the gloss plated nickel, the plate is dipped in the nitric acid solution to melt and remove the copper plate and the nickel plating to obtain two gold foils with gloss.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、基板表面に金メッ
キを施した後に該基板を除去して金メッキ膜を金箔とし
て回収する製造方法において、表面が光沢を有すると共
に緻密な金箔を製造する方法に関する。本発明の金箔は
装飾品、金カード、パネルなどの表面材として最適であ
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a dense gold foil having a glossy surface, in a method for producing a gold foil by collecting the gold plating film by removing the substrate after gold plating on the surface of the substrate. . The gold foil of the present invention is most suitable as a surface material for ornaments, gold cards, panels and the like.

【0002】[0002]

【従来技術とその課題】金箔を製造する方法として従来
から打展延法あるいは圧延法が知られている。ところ
が、これらの機械的製法は熟練を必要とし、しかも手間
がかかり大量生産に適さずコスト高を避けられない。そ
こで、これらの製法に代えて、プラスチックのシートを
基板とし、この表面に真空蒸着によって金メッキを施し
た後に基板を溶解除去することにより金箔を得る方法
(特公昭51-42054号、特開昭56-71518号)や、プラスチ
ックフィルム面から金の蒸着膜を剥離する方法(特開昭
48-11240号)が知られている。これらの製造方法によれ
ばフィルム状の基板表面に金の薄膜を直接に生成させる
ので、展延などの機械的手段が不要であり、効率良く金
箔を製造できる利点を有している。
2. Description of the Related Art As a method for producing a gold foil, a casting method or a rolling method has been conventionally known. However, these mechanical manufacturing methods require skill, are laborious, are not suitable for mass production, and are inevitably costly. Therefore, in place of these production methods, a plastic sheet is used as a substrate, and the surface is subjected to gold plating by vacuum vapor deposition, and then the substrate is dissolved and removed to obtain a gold foil (Japanese Patent Publication No. 51-42054 and Japanese Patent Laid-Open No. 5654/1979). -71518) or a method of peeling a vapor deposited film of gold from the surface of a plastic film
48-11240) is known. According to these manufacturing methods, since a gold thin film is directly formed on the surface of a film-like substrate, mechanical means such as spreading is not required, and gold foil can be manufactured efficiently.

【0003】しかしながら、真空蒸着を利用した上記製
造方法においては、プラスチックフィルムを基板に用い
るので、フィルム面に金の薄膜を形成する手段は真空蒸
着や化学メッキに限られ、電気メッキを利用できない。
このため光沢メッキが得られず、表面に鏡面光沢を有す
る金箔を得るのが難しいと云う問題がある。この場合、
プラスチックフィルムに予め化学メッキや真空蒸着を利
用して下地メッキを行い導電層を形成すれば、その上に
電気メッキによって金の被膜を形成することができる
が、この方法では電気メッキの他に化学メッキまたは真
空蒸着の設備を必要とし、設備の繁雑さを免れない。さ
らに真空蒸着によって形成した金属膜にはピンホールが
生じ易く、耐熱性が乏しい。また膜厚が薄過ぎ(1μ以
下)て取扱いが容易ではない。
However, since the plastic film is used as the substrate in the above-mentioned manufacturing method using vacuum vapor deposition, the means for forming a thin film of gold on the film surface is limited to vacuum vapor deposition or chemical plating, and electroplating cannot be used.
For this reason, there is a problem that it is difficult to obtain a bright plating and it is difficult to obtain a gold foil having a specular gloss on the surface. in this case,
If a plastic film is preliminarily plated by using chemical plating or vacuum deposition to form a conductive layer, a gold coating can be formed on it by electroplating. It requires plating or vacuum evaporation equipment, and the equipment is inevitable. Further, the metal film formed by vacuum vapor deposition is likely to have pinholes and has poor heat resistance. In addition, the film thickness is too thin (1 μm or less), and it is not easy to handle.

【0004】これらの製法の他に、金属箔の表面に化学
メッキまたは電気メッキにより金メッキを施す方法も開
示されている(特開昭48-11241号)。しかし、この製法
は下地の基板は取り除かれないため、金箔の断面は下地
金属を含む2層ないし3層構造になり、純金の箔を得る
ことができない。また金箔は基板よりも必然的に厚くな
るので、これより薄い金箔を製造することはできない。
しかも、薄い金箔を得るために極薄の金属箔を基板に用
いると基板の強度が弱く大型化できないなどの問題があ
る。
In addition to these manufacturing methods, a method of plating the surface of a metal foil with gold by chemical plating or electroplating is also disclosed (Japanese Patent Laid-Open No. 48-11241). However, since the underlying substrate is not removed in this manufacturing method, the cross section of the gold foil has a two-layer or three-layer structure containing the underlying metal, and a pure gold foil cannot be obtained. Further, since the gold foil is necessarily thicker than the substrate, it is impossible to manufacture a gold foil thinner than this.
Moreover, if an ultrathin metal foil is used for the substrate in order to obtain a thin gold foil, the strength of the substrate is weak and the size cannot be increased.

【0005】本発明の製造方法は従来の金箔の製造にお
ける上記問題を解決したものであって、製造が容易であ
り、しかも表面に光沢を有し、適度な膜厚であって組織
が緻密な金箔を製造する方法を提供することを目的とす
る。
The production method of the present invention solves the above problems in the production of conventional gold foil, is easy to produce, has a glossy surface, has an appropriate film thickness, and has a dense structure. It is an object to provide a method for manufacturing a gold leaf.

【0006】[0006]

【課題解決の手段】すなわち、本発明によれば請求項
1、2に記載する以下の金箔製造方法が提供される。 (1)金属基板の表面に電気メッキにより鏡面光沢メッ
キを施し、さらにその上に金メッキを施した後、下地の
金属基板および鏡面光沢メッキ層を溶解除去し、上記金
メッキ膜を金箔として回収することを特徴とする金箔の
製造方法。 (2)金属基板の表面に電気メッキにより鏡面光沢メッ
キを施し、さらにその上に金メッキを施した後に、下地
の金属基板から鏡面光沢メッキ層および金メッキ層を剥
離し、次いで鏡面光沢メッキ層を溶解除去して金メッキ
膜を金箔として回収することを特徴とする金箔の製造方
法。
That is, according to the present invention, the following gold foil manufacturing methods described in claims 1 and 2 are provided. (1) Mirror gloss plating is applied to the surface of the metal substrate by electroplating, and then gold plating is further applied, and then the underlying metal substrate and mirror gloss plating layer are dissolved and removed, and the gold plating film is recovered as a gold foil. A method for producing a gold leaf, characterized by: (2) The surface of the metal substrate is subjected to specular gloss plating by electroplating, and then gold plating is applied thereon. Then, the specular gloss plating layer and the gold plating layer are separated from the underlying metal substrate, and then the specular gloss plating layer is dissolved. A method for producing a gold foil, which comprises removing and recovering the gold plating film as a gold foil.

【0007】本発明の製造方法は電気メッキにより金属
基板の両面に下地の鏡面光沢メッキが施されるので、請
求項3に記載する以下の方法により、金属基板両面を利
用して効率よく金箔を製造することができる。 (3)金属基板の両面に鏡面光沢メッキを施した後にこ
れら鏡面光沢メッキ上に金メッキを施し、下地の金属基
板および鏡面光沢メッキ層を除去することにより金属基
板両面の金メッキ膜を同時に回収する上記(1) または
(2) に記載する金箔の製造方法。
[0007] In the manufacturing method of the present invention, since both surfaces of the metal substrate are subjected to specular luster plating of the base by electroplating, the following method described in claim 3 enables gold foil to be efficiently used by utilizing both surfaces of the metal substrate. It can be manufactured. (3) Mirror gloss plating is applied on both sides of the metal substrate, and then gold plating is applied on the mirror gloss plating, and the underlying metal substrate and the mirror gloss plating layer are removed to simultaneously recover the gold plating films on both sides of the metal substrate. (1) or
The method for producing a gold foil described in (2).

【0008】さらに、本発明の金箔製法は請求項4〜6
に記載する以下の具体的な態様で実施される。 (4) 銅薄板表面に鏡面光沢ニッケルを施し、その上
に電気メッキにより金メッキを施した後に硝酸溶液で銅
薄板および上記ニッケルメッキ層を溶解除去して金箔を
得る上記(1) または(3) に記載する金箔の製造方法。 (5) ステンレス薄板表面に鏡面光沢ニッケルを施
し、その上に電気メッキにより金メッキを施した後にス
テンレス薄板から金メッキ層を有するニッケルメッキ層
を剥離し、次いで硝酸溶液でニッケルメッキ層を溶解除
去して金箔を得る上記(2) または(3) に記載する金箔の
製造方法。 (6) アルミニウム薄板表面に鏡面光沢ニッケルを施
し、その上に電気メッキにより金メッキを施した後にア
ルミニウム薄板をアルカリ溶解し、さらにニッケルメッ
キを硝酸溶解して金箔を得る上記(1) または(3) に記載
する金箔の製造方法。
Further, the method for producing a gold foil of the present invention is defined by claims 4 to 6.
It is carried out in the following specific embodiments described in 1. (4) Specular bright nickel is applied to the surface of the copper thin plate, and then gold plating is applied by electroplating, and then the copper thin plate and the nickel plating layer are dissolved and removed with a nitric acid solution to obtain a gold foil. (1) or (3) The method for producing a gold foil described in. (5) Specular bright nickel is applied to the surface of the stainless steel thin plate, gold plating is applied on the surface of the stainless steel thin plate, the nickel plating layer having the gold plating layer is peeled from the stainless steel thin plate, and then the nickel plating layer is dissolved and removed with a nitric acid solution. Obtaining gold foil The method for producing gold foil according to the above (2) or (3). (6) Specular bright nickel is applied to the surface of the aluminum thin plate, gold is electroplated on the aluminum thin plate, the aluminum thin plate is alkali-dissolved, and the nickel plating is dissolved in nitric acid to obtain a gold foil (1) or (3) above. The method for producing a gold foil described in.

【0009】[0009]

【発明の実施形態】以下に本発明を実施例と共に具体的
に説明する。本発明の製造方法は、金属基板の表面に電
気メッキにより鏡面光沢メッキを施し、さらにその上に
金メッキを施した後、下地の金属基板および鏡面光沢メ
ッキ層を除去して上記金メッキ膜を金箔として回収する
方法である。
BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be specifically described below with reference to Examples. The manufacturing method of the present invention, the surface of the metal substrate is subjected to specular gloss plating by electroplating, and further after gold plating is performed, the underlying metal substrate and the specular gloss plating layer are removed to form the gold plating film as a gold foil. It is a method of collecting.

【0010】(I)金属基板 金属基板は金以外の金属薄板であればよく、メッキ後の
溶解性および経済性の点から銅、ステンレス、アルミニ
ウムの各薄板が適当である。板厚は必要な強度が保たれ
るように0.1〜1.0mm程度が使用し易い。なお、基
板の大きさは任意であり、メッキ後に適当な大きさに切
断しても良い。金属基板は前処理として脱脂、エッチン
グ、酸洗などを実施して表面を清浄化した後に鏡面光沢
メッキを施す。
(I) Metal Substrate The metal substrate may be a metal thin plate other than gold, and copper, stainless steel, and aluminum thin plates are suitable from the viewpoint of solubility after plating and economical efficiency. It is easy to use the plate thickness of about 0.1 to 1.0 mm so that the required strength is maintained. The size of the substrate is arbitrary, and it may be cut into an appropriate size after plating. As a pretreatment, the metal substrate is subjected to degreasing, etching, pickling, etc. to clean its surface, and then subjected to specular gloss plating.

【0011】(II)鏡面光沢メッキ 鏡面光沢メッキは光沢剤を添加したメッキ浴による電気
メッキにより行われ、ニッケルメッキなどに一般的に実
施されているが、本発明においてもこれを利用する。メ
ッキ浴およびメッキ条件の一例を以下に示す。なお鏡面
光沢メッキは以下のニッケルメッキに限らない。 メッキ浴:ワット浴(硫酸Ni 280g/l ,塩化Ni 45g/l,ほう酸 40g/l) 光沢剤(アサヒライトN-11 20ml/l, アサヒライトN-22 2ml/l) pH 4.2 メッキ条件:電流密度2〜4A/dm2、メッキ時間10〜20min 、浴温50℃
(II) Mirror surface gloss plating Mirror surface gloss plating is carried out by electroplating in a plating bath containing a brightening agent and is generally carried out for nickel plating and the like, but it is also used in the present invention. An example of the plating bath and plating conditions is shown below. The specular gloss plating is not limited to the following nickel plating. Plating bath: Watt bath (Ni sulfate 280g / l, Ni chloride 45g / l, boric acid 40g / l) Brightener (Asahilite N-11 20ml / l, Asahilite N-22 2ml / l) pH 4.2 Plating condition: current Density 2-4 A / dm 2 , plating time 10-20 min, bath temperature 50 ° C

【0012】(III) 金メッキ 光沢ニッケルメッキの後に、その上に金メッキを施す。
金メッキは電気メッキの他に化学メッキおよび真空蒸着
を利用することができる。なお、電気メッキによればメ
ッキ設備が簡略になるので好ましい。電気メッキによる
場合のメッキ浴およびメッキ条件の一例を以下に示す。 メッキ浴:シアン化金浴(シアン化第一金、オールナ55
8M) メッキ条件:電流密度0.5A/dm2 、メッキ時間20mi
n 、浴温60℃
(III) Gold Plating After bright nickel plating, gold plating is applied thereon.
Gold plating can utilize chemical plating and vacuum deposition in addition to electroplating. Note that electroplating is preferable because it simplifies the plating equipment. An example of the plating bath and plating conditions in the case of electroplating is shown below. Plating bath: Gold cyanide bath (Gold cyanide, Orna 55
8M) Plating conditions: Current density 0.5A / dm 2 , plating time 20mi
n, bath temperature 60 ℃

【0013】(IV)金属基板および下地メッキの除去 金メッキの後に下地の金属基板および鏡面光沢メッキ層
を除去して金メッキ膜を金箔として回収する。これらの
除去手段は下地金属の種類および鏡面光沢メッキの種類
に応じて選択される。例えば、(イ) 金属基板と下地メッ
キ層を同時に溶解除去する。または(ロ) 金メッキ層と共
に下地メッキ層を金属基板から機械的に剥離し、下地メ
ッキ層を溶解除去する。あるいは(ハ) 酸またはアルカリ
溶液を用いて金属基板と下地メッキ層を個別に溶解除去
する。これらの方法により下地メッキ層が溶解されても
金メッキ膜は化学的に安定なので溶解されず金箔として
回収することができる。
(IV) Removal of Metal Substrate and Undercoat Plating After gold plating, the underlying metal substrate and specular gloss plating layer are removed to recover the gold plating film as a gold foil. These removing means are selected according to the type of base metal and the type of specular gloss plating. For example, (a) the metal substrate and the base plating layer are simultaneously dissolved and removed. Alternatively, (b) the base plating layer together with the gold plating layer is mechanically peeled from the metal substrate, and the base plating layer is dissolved and removed. Alternatively, (c) the metal substrate and the base plating layer are individually dissolved and removed using an acid or alkali solution. Even if the base plating layer is dissolved by these methods, the gold plating film is chemically stable and can be recovered as a gold foil without being dissolved.

【0014】具体的には、銅薄板を金属基板とし、これ
に光沢ニッケルメッキを施したものは硝酸溶液により銅
薄板と光沢ニッケルメッキ層を同時に溶解除去すること
ができる。一例として、後述の実施例1に示すものは、
50 vol%の硝酸溶液により約3時間で金属基板および
下地の光沢ニッケルメッキ層が溶解される。なお実施例
1と同条件下で金属基板の片面のみに下地メッキと金メ
ッキを施したものは、約20分程度で金属基板と下地メ
ッキが溶解される。
Specifically, a thin copper plate is used as a metal substrate, and a thin nickel plate is plated on the thin metal plate, so that the thin copper plate and the bright nickel plating layer can be simultaneously removed by dissolution with a nitric acid solution. As an example, the one shown in Example 1 below is
A 50 vol% nitric acid solution dissolves the metal substrate and the underlying bright nickel plating layer in about 3 hours. In addition, under the same conditions as in Example 1, in the case where only one surface of the metal substrate is subjected to undercoating and gold plating, the metal substrate and the undercoating are dissolved in about 20 minutes.

【0015】また、ステンレス薄板を金属基板とし、こ
れに光沢ニッケルメッキを施したものは、ステンレス表
面からメッキ層が剥離し易いので、金メッキ膜を有する
光沢ニッケル層をステンレス薄板から機械的に剥離した
後にニッケルメッキ層を硝酸溶解して金メッキ膜を回収
することができる。具体的には、金メッキの後に、エア
スプレーなどを用い、ノズルから金属基板を吹き込むこ
とにより金メッキ膜を有する光沢ニッケルメッキ層を容
易に剥離することができる。この製造方法では基板両面
からメッキ層を剥離するので基板を溶解する必要がな
く、短時間に金箔を得ることができる。また基板を再利
用することができる。
In the case where a stainless steel thin plate is used as a metal substrate and is plated with bright nickel, the plated layer is easily peeled off from the stainless steel surface. Therefore, the bright nickel layer having the gold plating film is mechanically peeled off from the stainless thin plate. After that, the nickel plating layer can be dissolved in nitric acid to recover the gold plating film. Specifically, after the gold plating, the bright nickel plating layer having the gold plating film can be easily peeled off by blowing the metal substrate from the nozzle using an air spray or the like. In this manufacturing method, since the plating layers are peeled from both surfaces of the substrate, it is not necessary to dissolve the substrate, and the gold foil can be obtained in a short time. In addition, the substrate can be reused.

【0016】さらに、アルミニウム薄板を金属基板と
し、これに光沢ニッケルメッキを施したものは、アルミ
ニウム薄板をアルカリ溶解し、さらにニッケルメッキ層
を硝酸溶解して金メッキ膜を回収することができる。ア
ルカリ溶液としては20 vol%水酸化ナトリウム溶液な
どが用いられ、アルミニウム基板をアルカリ溶解した後
に回収したメッキ膜を水洗してアルカリ残液を除去し、
次いで50 vol%硝酸溶液を用いて光沢ニッケルメッキ
層を溶解する。
Further, when a thin aluminum plate is used as a metal substrate and bright nickel plating is applied to this, the thin aluminum plate can be dissolved in alkali, and the nickel plating layer can be dissolved in nitric acid to recover the gold plating film. A 20 vol% sodium hydroxide solution or the like is used as the alkaline solution. After the aluminum substrate is dissolved in the alkaline solution, the recovered plating film is washed with water to remove the residual alkaline solution.
The bright nickel plating layer is then dissolved using a 50 vol% nitric acid solution.

【0017】(V)金箔の回収等 下地の金属基板および下地の光沢メッキ層を除去した
後、得られた金箔を水洗して回収する。得られた金箔を
鏡面光沢を有し、しかも電気メッキないし化学メッキを
利用することにより組織は緻密な金箔が得られる。以上
の本発明による製造方法では、電気メッキにより金属基
板の両面に下地の鏡面光沢メッキが施されるので、これ
ら基板両面の下地メッキ上に金メッキを施すことにより
金属基板両面を利用して効率よく金箔を製造することが
できる。なお、基板両面が金メッキ層に被覆されていて
も、基板上端にメッキ層が無ければ、ここから基板の溶
解が進行するので最終的に金メッキ膜が得られる。この
場合、基板側端のメッキを掻落して側端部から基板の溶
解を促進させても良い。因みに、ステンレス板を基板に
用いる場合には、メッキ層を基板から剥離するので基板
を溶解する必要がなく、基板両面に金メッキを施す利点
が大きい。
(V) Recovery of Gold Foil, etc. After removing the underlying metal substrate and the underlying glossy plating layer, the obtained gold foil is washed with water and recovered. By using the obtained gold foil having a mirror gloss and using electroplating or chemical plating, a gold foil having a fine structure can be obtained. In the above-described manufacturing method of the present invention, since both surfaces of the metal substrate are subjected to specular gloss plating of the base by electroplating, gold plating is applied on the base plating on both sides of these substrates to efficiently utilize both surfaces of the metal substrate. Gold leaf can be manufactured. Even if both surfaces of the substrate are covered with the gold plating layer, if there is no plating layer on the upper end of the substrate, the dissolution of the substrate proceeds from here, so that the gold plating film is finally obtained. In this case, the plating on the side edge of the substrate may be scraped off to promote the dissolution of the substrate from the side edge. Incidentally, when a stainless steel plate is used as the substrate, the plating layer is peeled off from the substrate, so that it is not necessary to dissolve the substrate, and there is a great advantage that gold plating is performed on both surfaces of the substrate.

【0018】なお、先に述べたように、従来の製造方法
において、プラスチックフィルム上に金被膜を蒸着した
後に該プラスチックフィルムを溶解除去する方法や、下
地に金属箔を用いる方法が知られているが、下地のプラ
スチックフィルムを溶解除去するものは、プラスチック
表面から蒸着被膜が剥離し易いことを利用しており、ま
た、金属箔に金メッキを施したものは下地の金属箔とメ
ッキ層はプラスチック表面の場合よりも格段に密着性が
高いことに依存しており、下地の金属箔のみを選択的に
除去することは意図されていない。一方、本発明の方法
は、金属基板に鏡面光沢メッキを施し、その上に金メッ
キを設けた場合にも金メッキ層を損傷せずに下地金属な
いし下地メッキを効果的に除去できるようにしたもので
あって、従来の製造方法では得られない鏡面光沢を有す
る金箔を得ることができる。
As described above, in the conventional manufacturing method, a method of depositing a gold coating on a plastic film and then dissolving and removing the plastic film, and a method of using a metal foil as a base are known. However, the one that dissolves and removes the underlying plastic film utilizes the fact that the vapor-deposited coating easily peels off from the plastic surface, and the one in which the metal foil is plated with gold has the underlying metal foil and plating layer as the plastic surface. However, it is not intended to selectively remove only the underlying metal foil. On the other hand, the method of the present invention is such that even when the metal substrate is subjected to specular gloss plating and the gold plating is provided thereon, the underlying metal or the underlying plating can be effectively removed without damaging the gold plating layer. Therefore, it is possible to obtain a gold foil having a specular gloss that cannot be obtained by the conventional manufacturing method.

【0019】[0019]

【実施例】実施例1 銅板( 6.5×10.0mm、板厚0.1mm )を脱脂処理後、エッ
チングおよび酸洗を行い、光沢剤を添加したワット浴を
用いて両面にニッケル光沢メッキを行った。その後、光
沢ニッケルの両面に金メッキを施した後に硝酸溶液に浸
漬して銅板およびニッケルメッキを溶解除去し、光沢の
ある金箔2枚を得た。脱脂処理から金箔の回収に至る工
程および使用した溶液ないし処理条件を図1に示した。
Example 1 A copper plate (6.5 × 10.0 mm, plate thickness 0.1 mm) was degreased, then etched and pickled, and nickel bright plating was performed on both sides using a Watts bath to which a brightening agent was added. After that, both sides of the bright nickel were plated with gold and then immersed in a nitric acid solution to dissolve and remove the copper plate and the nickel plating to obtain two glossy gold foils. FIG. 1 shows the steps from the degreasing process to the recovery of the gold foil, the solution used and the processing conditions.

【0020】実施例2 ステンレス板( 6.5×10.0mm、板厚1.0mm )を脱脂処理
後、酸洗し、光沢剤を添加したワット浴を用いて両面に
ニッケル光沢メッキを行った。その後、光沢ニッケルの
両面に金メッキを施した後に基板から金メッキを有する
光沢ニッケルメッキ層を剥離し、このメッキ膜を硝酸溶
液に浸漬してニッケルメッキを溶解除去し、光沢のある
金箔2枚を得た。脱脂処理から金箔の回収に至る工程お
よび使用した溶液ないし処理条件を図2に示した。
Example 2 A stainless steel plate (6.5 × 10.0 mm, plate thickness 1.0 mm) was degreased, then pickled and nickel bright plating was performed on both sides using a Watts bath containing a brightening agent. After that, both sides of the bright nickel are plated with gold, and then the bright nickel plating layer having gold plating is peeled off from the substrate, and this plating film is immersed in a nitric acid solution to dissolve and remove the nickel plating, thereby obtaining two bright gold foils. It was FIG. 2 shows the steps from the degreasing process to the recovery of the gold foil and the solution or processing conditions used.

【0021】実施例3 アルミニウム板( 6.5×10.0mm、板厚0.1mm )を脱脂処
理後、エッチングおよび酸洗を行い、さらに亜鉛置換処
理(ジンケート)を施した後に、光沢剤を添加したワッ
ト浴を用いて両面にニッケル光沢メッキを行った。その
後、光沢ニッケルの両面に金メッキを施した後に、これ
を水酸化ナトリウム溶液に浸漬してアルミ基板を溶解
し、さらに、ニッケルメッキ層を硝酸溶液に浸漬してニ
ッケルメッキを溶解除去し、光沢のある金箔2枚を得
た。脱脂処理から金箔の回収に至る工程および使用した
溶液ないし処理条件を図3に示した。
Example 3 An aluminum plate (6.5 × 10.0 mm, plate thickness 0.1 mm) was degreased, etched and pickled, and then zinc-substituted (zincate), followed by a brightening agent-added Watt bath. Both sides were plated with nickel luster. After that, both sides of the bright nickel are plated with gold, then this is dipped in sodium hydroxide solution to dissolve the aluminum substrate, and the nickel plating layer is dipped in nitric acid solution to dissolve and remove the nickel plating. I got two gold leaf. FIG. 3 shows the steps from the degreasing process to the recovery of the gold foil, the solution used and the processing conditions.

【0022】[0022]

【発明の効果】本発明の製造方法によれば鏡面光沢を有
する金箔を容易に得ることができる。また、本発明の製
法は基板やメッキ膜の取い扱い、および処理が簡単であ
り、さらには大型の金箔の製造が容易であるうえ、メッ
キ膜を有する基板を任意の形状(文字やマーク)に加工
した後に下地基板および下地メッキを除去することによ
り、容易に任意の形状の金箔を得ることができる。
According to the manufacturing method of the present invention, a gold foil having a specular gloss can be easily obtained. In addition, the manufacturing method of the present invention makes it easy to handle and process the substrate and the plated film, and also facilitates the production of a large gold foil, and allows the substrate having the plated film to have an arbitrary shape (characters or marks). By removing the base substrate and the base plating after processing to, it is possible to easily obtain a gold foil of any shape.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 実施例1の製造工程を示すフローチャートFIG. 1 is a flowchart showing a manufacturing process according to a first embodiment.

【図2】 実施例2の製造工程を示すフローチャートFIG. 2 is a flowchart showing a manufacturing process of a second embodiment.

【図3】 実施例3の製造工程を示すフローチャートFIG. 3 is a flowchart showing a manufacturing process of a third embodiment.

─────────────────────────────────────────────────────
────────────────────────────────────────────────── ───

【手続補正書】[Procedure amendment]

【提出日】平成8年1月16日[Submission date] January 16, 1996

【手続補正1】[Procedure amendment 1]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0017[Correction target item name] 0017

【補正方法】変更[Correction method] Change

【補正内容】[Correction contents]

【0017】(V)金箔の回収等 下地の金属基板および下地の光沢メッキ層を除去した
後、得られた金箔を水洗して回収する。得られた金箔
鏡面光沢を有し、しかも電気メッキないし化学メッキを
利用することにより組織は緻密な金箔が得られる。以上
の本発明による製造方法では、電気メッキにより金属基
板の両面に下地の鏡面光沢メッキが施されるので、これ
ら基板両面の下地メッキ上に金メッキを施すことにより
金属基板両面を利用して効率よく金箔を製造することが
できる。なお、基板両面が金メッキ層に被覆されていて
も、基板上端にメッキ層が無ければ、ここから基板の溶
解が進行するので最終的に金メッキ膜が得られる。この
場合、基板側端のメッキを掻落して側端部から基板の溶
解を促進させても良い。因みに、ステンレス板を基板に
用いる場合には、メッキ層を基板から剥離するので基板
を溶解する必要がなく、基板両面に金メッキを施す利点
が大きい。
(V) Recovery of Gold Foil, etc. After removing the underlying metal substrate and the underlying glossy plating layer, the obtained gold foil is washed with water and recovered. The obtained gold foil has specular gloss, and by using electroplating or chemical plating, a gold foil having a fine structure can be obtained. In the above-described manufacturing method of the present invention, since both surfaces of the metal substrate are subjected to specular gloss plating of the base by electroplating, gold plating is applied on the base plating on both sides of these substrates to efficiently utilize both surfaces of the metal substrate. Gold leaf can be manufactured. Even if both surfaces of the substrate are covered with the gold plating layer, if there is no plating layer on the upper end of the substrate, the dissolution of the substrate proceeds from here, so that the gold plating film is finally obtained. In this case, the plating on the side edge of the substrate may be scraped off to promote the dissolution of the substrate from the side edge. Incidentally, when a stainless steel plate is used as the substrate, the plating layer is peeled off from the substrate, so that it is not necessary to dissolve the substrate, and there is a great advantage that gold plating is performed on both surfaces of the substrate.

【手続補正2】[Procedure amendment 2]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0019[Correction target item name] 0019

【補正方法】変更[Correction method] Change

【補正内容】[Correction contents]

【0019】[0019]

【実施例】実施例1 銅板(6.5×10.0cm、板厚0.1mm)を脱脂
処理後、エッチングおよび酸洗を行い、光沢剤を添加し
たワット浴を用いて両面にニッケル光沢メッキを行っ
た。その後、光沢ニッケルの両面に金メッキを施した後
に硝酸溶液に浸漬して銅板およびニッケルメッキを溶解
除去し、光沢のある金箔2枚を得た。脱脂処理から金箔
の回収に至る工程および使用した溶液ないし処理条件を
図1に示した。
Example 1 A copper plate (6.5 × 10.0 cm , plate thickness 0.1 mm) was degreased, then etched and pickled, and a Watts bath containing a brightener was used to apply nickel luster to both surfaces. It was plated. After that, both sides of the bright nickel were plated with gold and then immersed in a nitric acid solution to dissolve and remove the copper plate and the nickel plating to obtain two glossy gold foils. FIG. 1 shows the steps from the degreasing process to the recovery of the gold foil, the solution used and the processing conditions.

【手続補正3】[Procedure 3]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0020[Correction target item name] 0020

【補正方法】変更[Correction method] Change

【補正内容】[Correction contents]

【0020】実施例2 ステンレス板(6.5×10.0cm、板厚1.0m
m)を脱脂処理後、酸洗し、光沢剤を添加したワット浴
を用いて両面にニッケル光沢メッキを行った。その後、
光沢ニッケルの両面に金メッキを施した後に基板から金
メッキを有する光沢ニッケルメッキ層を剥離し、このメ
ッキ膜を硝酸溶液に浸漬してニッケルメッキを溶解除去
し、光沢のある金箔2枚を得た。脱脂処理から金箔の回
収に至る工程および使用した溶液ないし処理条件を図2
に示した。
Example 2 Stainless plate (6.5 × 10.0 cm , plate thickness 1.0 m)
m) was degreased, then pickled, and nickel bright plating was performed on both sides using a Watts bath to which a brightening agent was added. afterwards,
After both sides of the bright nickel were plated with gold, the bright nickel plated layer having gold plating was peeled from the substrate, and the plated film was immersed in a nitric acid solution to dissolve and remove the nickel plating to obtain two bright gold foils. Figure 2 shows the steps from degreasing to gold foil recovery and the solutions and processing conditions used.
It was shown to.

【手続補正4】[Procedure amendment 4]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0021[Correction target item name] 0021

【補正方法】変更[Correction method] Change

【補正内容】[Correction contents]

【0021】実施例3 アルミニウム板(6.5×10.0cm、板厚0.1m
m)を脱脂処理後、エッチングおよび酸洗を行い、さら
に亜鉛置換処理(ジンケート)を施した後に、光沢剤を
添加したワット浴を用いて両面にニッケル光沢メッキを
行った。その後、光沢ニッケルの両面に金メッキを施し
た後に、これを水酸化ナトリウム溶液に浸漬してアルミ
基板を溶解し、さらに、ニッケルメッキ層を硝酸溶液に
浸漬してニッケルメッキを溶解除去し、光沢のある金箔
2枚を得た。脱脂処理から金箔の回収に至る工程および
使用した溶液ないし処理条件を図3に示した。
Example 3 Aluminum plate (6.5 × 10.0 cm , plate thickness 0.1 m)
m) was subjected to degreasing treatment, followed by etching and pickling, and further subjected to zinc substitution treatment (zincate), and then nickel bright plating was performed on both sides using a Watts bath to which a brightening agent was added. After that, both sides of the bright nickel are plated with gold, then this is dipped in sodium hydroxide solution to dissolve the aluminum substrate, and the nickel plating layer is dipped in nitric acid solution to dissolve and remove the nickel plating. I got two gold leaf. FIG. 3 shows the steps from the degreasing process to the recovery of the gold foil, the solution used and the processing conditions.

【手続補正5】[Procedure Amendment 5]

【補正対象書類名】図面[Document name to be amended] Drawing

【補正対象項目名】全図[Correction target item name] All figures

【補正方法】変更[Correction method] Change

【補正内容】[Correction contents]

【図1】 FIG.

【図2】 [Fig. 2]

【図3】 [Figure 3]

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 FI 技術表示箇所 C25D 1/04 C25D 1/04 3/12 3/12 3/48 3/48 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Internal reference number FI technical display location C25D 1/04 C25D 1/04 3/12 3/12 3/48 3/48

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】 金属基板の表面に電気メッキにより鏡面
光沢メッキを施し、さらにその上に金メッキを施した
後、下地の金属基板および鏡面光沢メッキ層を溶解除去
し、上記金メッキ膜を金箔として回収することを特徴と
する金箔の製造方法。
1. A surface of a metal substrate is subjected to specular gloss plating by electroplating, and then gold plating is applied thereon, and then the underlying metal substrate and specular gloss plating layer are dissolved and removed, and the gold plating film is recovered as a gold foil. A method for producing a gold foil, comprising:
【請求項2】 金属基板の表面に電気メッキにより鏡面
光沢メッキを施し、さらにその上に金メッキを施した後
に、下地の金属基板から鏡面光沢メッキ層および金メッ
キ層を剥離し、次いで鏡面光沢メッキ層を溶解除去して
金メッキ膜を金箔として回収することを特徴とする金箔
の製造方法。
2. The surface of a metal substrate is subjected to specular gloss plating by electroplating, further gold plating is applied thereto, and then the specular gloss plating layer and the gold plating layer are peeled off from the underlying metal substrate, and then the specular gloss plating layer. And a gold plating film is recovered as a gold foil by dissolving and removing.
【請求項3】 金属基板の両面に鏡面光沢メッキを施し
た後にこれら鏡面光沢メッキ上に金メッキを施し、下地
の金属基板および鏡面光沢メッキ層を除去することによ
り金属基板両面の金メッキ膜を同時に回収する請求項1
または2に記載する金箔の製造方法。
3. A gold-plated film on both surfaces of a metal substrate is recovered at the same time by performing mirror-bright plating on both surfaces of the metal substrate and then gold-plating these mirror-bright plating to remove the underlying metal substrate and the mirror-bright plating layer. Claim 1
Alternatively, the method for producing a gold foil described in 2.
【請求項4】 銅薄板表面に鏡面光沢ニッケルを施し、
その上に電気メッキにより金メッキを施した後に硝酸溶
液で銅薄板および上記ニッケルメッキ層を溶解除去して
金箔を得る請求項1または3に記載する金箔の製造方
法。
4. A mirror-bright nickel is applied to the surface of the thin copper plate,
The method for producing a gold foil according to claim 1 or 3, wherein the copper foil and the nickel plating layer are dissolved and removed with a nitric acid solution after gold plating is applied thereon by electroplating.
【請求項5】 ステンレス薄板表面に鏡面光沢ニッケル
を施し、その上に電気メッキにより金メッキを施した後
にステンレス薄板から金メッキ層を有するニッケルメッ
キ層を剥離し、次いで硝酸溶液でニッケルメッキ層を溶
解除去して金箔を得る請求項2または3に記載する金箔
の製造方法。
5. The surface of a stainless steel thin plate is given a mirror-bright nickel, which is then electroplated with gold to remove the nickel plating layer having the gold plating layer from the stainless thin plate, and then the nickel plating layer is dissolved and removed with a nitric acid solution. The method for producing a gold foil according to claim 2 or 3, wherein the gold foil is obtained.
【請求項6】 アルミニウム薄板表面に鏡面光沢ニッケ
ルを施し、その上に電気メッキにより金メッキを施した
後にアルミニウム薄板をアルカリ溶解し、さらにニッケ
ルメッキを硝酸溶解して金箔を得る請求項1または3に
記載する金箔の製造方法。
6. The method according to claim 1 or 3, wherein the surface of the aluminum thin plate is provided with specular bright nickel, gold is electroplated on the aluminum thin plate, the aluminum thin plate is alkali-dissolved, and the nickel plating is nitric acid-dissolved. The method for producing a gold leaf described.
JP33411395A 1995-11-29 1995-11-29 Manufacture of gold foil Withdrawn JPH09155441A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33411395A JPH09155441A (en) 1995-11-29 1995-11-29 Manufacture of gold foil

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33411395A JPH09155441A (en) 1995-11-29 1995-11-29 Manufacture of gold foil

Publications (1)

Publication Number Publication Date
JPH09155441A true JPH09155441A (en) 1997-06-17

Family

ID=18273678

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33411395A Withdrawn JPH09155441A (en) 1995-11-29 1995-11-29 Manufacture of gold foil

Country Status (1)

Country Link
JP (1) JPH09155441A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007240196A (en) * 2006-03-06 2007-09-20 Fujitsu Ltd Standard plating film sample and inspection method of plating film
KR101476746B1 (en) * 2011-09-04 2014-12-29 포항공과대학교 산학협력단 Method of manufacturing flexible metal substrate, flexible electronic device and flexible metal substrate using a corrosion-resistant mother substrate
CN112593261A (en) * 2020-12-08 2021-04-02 深圳润福金技术开发有限公司 Gold foil manufacturing method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007240196A (en) * 2006-03-06 2007-09-20 Fujitsu Ltd Standard plating film sample and inspection method of plating film
KR101476746B1 (en) * 2011-09-04 2014-12-29 포항공과대학교 산학협력단 Method of manufacturing flexible metal substrate, flexible electronic device and flexible metal substrate using a corrosion-resistant mother substrate
CN112593261A (en) * 2020-12-08 2021-04-02 深圳润福金技术开发有限公司 Gold foil manufacturing method

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