TWI615015B - Lighting module and image capture apparatus - Google Patents
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Abstract
本創作提供一種光源模組及一種取像裝置;光源模組包含一基板、一光導桿及複數發光二極體;光導桿具有一入光面及一出光面,出光面鄰接於入光面。發光二極體沿著一第一軸線排列於基板上並朝向入光面投射光線,且各該發光二極體之一光軸與該第一軸線之間的距離不大於0.5毫米。取像裝置包含前述光源模組、一基座、一成像模組及一感測模組,光源模組安裝於基座中並朝向一物件發出光線;成像模組安裝於基座中,並用以將物件反射之光線成像於位在基座另一側之感測模組。The present invention provides a light source module and an image capturing device. The light source module includes a substrate, a light guiding rod and a plurality of light emitting diodes. The light guiding rod has a light incident surface and a light emitting surface, and the light emitting surface is adjacent to the light incident surface. The light emitting diodes are arranged on the substrate along a first axis and project light toward the light incident surface, and a distance between an optical axis of each of the light emitting diodes and the first axis is not more than 0.5 mm. The image capturing device includes the light source module, a base, an imaging module and a sensing module. The light source module is mounted in the base and emits light toward an object; the imaging module is mounted in the base and used for The light reflected by the object is imaged on a sensing module located on the other side of the base.
Description
本創作是關於用於閱讀或識別印刷或書寫文字或者用於識別圖形之方法或裝置,且特別是有關於線型影像感測器。This creation relates to a method or apparatus for reading or recognizing printed or written text or for recognizing a graphic, and in particular to a line image sensor.
接觸式影像感測器(contact image sensor)為線型影像感測器的一種,主要應用於掃描器、傳真機以及多功能事務機,以將平面的圖像或文件掃描成電子格式,以便於儲存、顯示或傳輸。A contact image sensor is a type of line image sensor mainly used in scanners, fax machines, and multifunction printers to scan flat images or documents into an electronic format for storage. , display or transfer.
接觸式影像感測器的工作原理是將光源所產生的光線照射到待掃描的稿件上,經過稿件反射光線,並利用一鏡片組將該反射光線聚集於感光件上;利用感光件將光的訊號改變為電的訊號,進而產生類比或數位畫素(pixel)資料。The working principle of the contact image sensor is to irradiate the light generated by the light source onto the manuscript to be scanned, reflect the light through the manuscript, and focus the reflected light on the photosensitive member by using a lens group; The signal is changed to an electrical signal, which in turn produces analog or digital pixel data.
目前市面上一般用於接觸式影像感測裝置中的光源主要提供一白光以照射物件;然而,以藍光發光晶粒搭配黃色螢光粉來產生白光的發光二極體因演色性不佳將致使成像品質不佳。At present, the light source generally used in the contact image sensing device on the market mainly provides a white light to illuminate the object; however, the light-emitting diode with the blue light-emitting crystal grain and the yellow fluorescent powder to generate white light may cause color rendering due to poor color rendering. The image quality is poor.
依據本發明提供一種光源模組,供應用於取像裝置中;光源模組包含一基板、一光導桿及複數發光二極體。光導桿具有一入光面及一出光面,出光面鄰接於入光面。發光二極體設於基板上並沿著一第一軸線排列並朝向入光面投射光線,每個發光二極體之一光軸與第一軸線之間的距離不大於0.5毫米。其次,第一軸線平行於出光面之一法線。According to the present invention, a light source module is provided for use in an image taking device; the light source module includes a substrate, a light guiding rod and a plurality of light emitting diodes. The light guiding rod has a light incident surface and a light emitting surface, and the light emitting surface is adjacent to the light incident surface. The light emitting diodes are disposed on the substrate and arranged along a first axis and project light toward the light incident surface, and a distance between an optical axis of each of the light emitting diodes and the first axis is not more than 0.5 mm. Second, the first axis is parallel to one of the normals of the light exit surface.
在本創作之一實施方式中,光源模組中的發光二極體配合產生一白色光線,且在光源模組的發光二極體中,排列最鄰近出光面的發光二極體供產生波長介於606~626奈米的光線,排列次鄰近於出光面的發光二極體供產生波長介於508~555奈米的光線,排列最遠離出光面的發光二極體供產生波長介於450~480奈米的光線。In one embodiment of the present invention, the light-emitting diodes in the light source module cooperate to generate a white light, and in the light-emitting diode of the light source module, the light-emitting diodes disposed closest to the light-emitting surface are arranged to generate wavelengths. In the light of 606~626 nm, the light-emitting diodes adjacent to the light-emitting surface are arranged to generate light having a wavelength of 508-555 nm, and the light-emitting diodes arranged farthest from the light-emitting surface are generated for a wavelength of 450~ 480 nm of light.
在本創作之一實施方式中,光導桿複數微棱鏡,形成於光導桿的一底面上,底面相對於出光面;微棱鏡的佈設密度與其佈設位置所接收到之光線強度呈反比。In one embodiment of the present invention, the plurality of microprisms of the light guiding rod are formed on a bottom surface of the light guiding rod, and the bottom surface is opposite to the light emitting surface; the density of the microprism is inversely proportional to the intensity of the light received by the laying position.
在本創作之一實施方式中,光源模組更包含一反射件,安裝於基板上,反射件之一側壁環繞該等發光二極體,側壁的內徑隨著遠離該基板而增加。In one embodiment of the present invention, the light source module further includes a reflective member mounted on the substrate, and one side wall of the reflective member surrounds the light emitting diodes, and an inner diameter of the sidewall increases as the distance from the substrate increases.
在本創作之一實施方式中,反射件更包含一底壁,連接於側壁鄰近於基板之一側,發光二極體設於底壁上。In one embodiment of the present invention, the reflective member further includes a bottom wall connected to the side wall adjacent to one side of the substrate, and the light emitting diode is disposed on the bottom wall.
在本創作之一實施方式中,光源模組更包含一接合件,發光二極體及反射件設於接合件之一側,光導桿安裝於接合件之另一側以接收發光二極體配合產生的白色光線。In an embodiment of the present invention, the light source module further includes a joint member, the light emitting diode and the reflector are disposed on one side of the joint member, and the light guide rod is mounted on the other side of the joint member to receive the light emitting diode. The white light produced.
在本創作之一實施方式中,光源模組更包含一保護件,部份包覆光導桿,入光面及出光面露出保護件之外。In one embodiment of the present invention, the light source module further includes a protective member, and some of the light guiding rods are covered, and the light incident surface and the light emitting surface expose the protective member.
根據本發明另提供一種取像裝置,用以擷取一物件的影像;取像裝置包含前述的光源模組、一基座、一感測模組及一成像模組。基座包含一容置槽及一穿槽,光源模組設於容置槽中,物件位於基座之一側。感測模組位於基座之另一側,並包含沿著一第二軸線排列之複數感光件。成像模組安裝於穿槽中,並用以將物件的影像成像於感光件。According to the present invention, an image capturing device is provided for capturing an image of an object; the image capturing device comprises the foregoing light source module, a base, a sensing module and an imaging module. The base includes a receiving slot and a through slot, and the light source module is disposed in the receiving slot, and the object is located on one side of the base. The sensing module is located on the other side of the base and includes a plurality of photosensitive members arranged along a second axis. The imaging module is mounted in the slot and is used to image the image of the object to the photosensitive member.
在本創作之一實施方式中,第一軸線與感光件之一光軸的夾角介於35~65度之間。In one embodiment of the present invention, the angle between the first axis and the optical axis of one of the photosensitive members is between 35 and 65 degrees.
本創作的取像裝置透過適當地排列光源模組中供產生藍光、綠光及紅光之發光二極體及其等與出光面的相對位置,來提供高演色性的白光光源以照射物件,達到提高成像品質的效果。The image capturing device of the present invention provides a high color rendering white light source to illuminate an object by appropriately arranging the light emitting diodes of the light source module for generating blue, green and red light and their relative positions with the light emitting surface. Achieve improved imaging quality.
圖1繪示依照本創作之取像裝置之立體分解圖,圖2繪示依照本創作之取像裝置之局部分解圖。在圖1及圖2中,取像裝置1用以感測一(平面)物件的影像,並將物件的光學影像轉換為類比或數位電子信號以利於儲存及傳輸。取像裝置1包含一座體10、一光源模組12、一成像模組14及一感測模組16。1 is a perspective exploded view of the image capturing apparatus according to the present invention, and FIG. 2 is a partially exploded view of the image capturing apparatus according to the present invention. In FIG. 1 and FIG. 2, the image capturing device 1 is configured to sense an image of a (planar) object and convert the optical image of the object into an analog or digital electronic signal for storage and transmission. The image capturing device 1 includes a body 10, a light source module 12, an imaging module 14, and a sensing module 16.
座體10包含一頂面100、一相對於頂面100的底面102、一容置槽104及一穿槽106;底面102大致平行於頂面100。容置槽104形成在頂面100並朝向底面102的方向凹陷,穿槽106為貫穿頂面100及底面102的槽孔結構。座體10可使用塑膠或其它高分子材料利用射出成型或鑄模技術製作而成。座體10可呈黑色或其它不具反光效果的深色材料製程,藉以避免經物件反射而產生的光學影像受到座體10反射而影響成像對比度。換言之,座體10不建議使用白色或銀色等具有反光效果的材料來製造。The base 10 includes a top surface 100, a bottom surface 102 opposite to the top surface 100, a receiving groove 104, and a through groove 106. The bottom surface 102 is substantially parallel to the top surface 100. The accommodating groove 104 is formed on the top surface 100 and is recessed toward the bottom surface 102. The through groove 106 is a slot structure penetrating the top surface 100 and the bottom surface 102. The body 10 can be fabricated using injection molding or molding techniques using plastic or other polymeric materials. The body 10 can be black or other non-reflective dark material process to avoid reflection of the optical image generated by the object reflection by the body 10 to affect the imaging contrast. In other words, the base 10 is not recommended to be made of a material having a reflective effect such as white or silver.
光源模組12供產生一線性光線以照射物件。光源模組12包含一基板120、一光導桿122、一反光件124及複數發光二極體126B、126G、126R。基板120可為印刷電路板(printed circuit board)或軟性電路板(flexible print circuit);其中,軟性電路板可有效地降低光源模組12的體積及重量。The light source module 12 is configured to generate a linear light to illuminate the object. The light source module 12 includes a substrate 120, a light guiding rod 122, a reflecting member 124, and a plurality of light emitting diodes 126B, 126G, and 126R. The substrate 120 can be a printed circuit board or a flexible print circuit. The flexible circuit board can effectively reduce the volume and weight of the light source module 12.
光導桿122可透光,並包含一入光面1220及一出光面1222;入光面1220用以接收發光二極體126B、126G、126R產生的光線,出光面1222鄰接於入光面1220,並用以供光線射出。The light guiding rod 122 can transmit light and include a light incident surface 1220 and a light emitting surface 1222. The light incident surface 1220 is configured to receive light generated by the light emitting diodes 126B, 126G, and 126R, and the light emitting surface 1222 is adjacent to the light incident surface 1220. And used to emit light.
光導桿122的底面(未另標號)可形成複數微棱鏡1226, 其等用以使得由入光面1220進入光導桿122的光線得以傳遞至遠光側(即遠離入光面1220處);底面鄰接於入光面1220並可與出光面1222相對。微棱鏡1226的佈設數量隨著其佈設位置所接受到的光線強度而改變,並可例如呈非線性變化;藉此,可讓出光面1222輸出之線性光線的均勻亮度。The bottom surface of the light guiding rod 122 (not labeled) may form a plurality of microprisms 1226, such as to enable light entering the light guiding rod 122 from the light incident surface 1220 to be transmitted to the high beam side (ie, away from the light incident surface 1220); Adjacent to the light incident surface 1220 and opposite to the light exit surface 1222. The number of the microprisms 1226 is varied depending on the intensity of the light received by the placement position, and may vary, for example, in a non-linear manner; thereby, the uniform brightness of the linear light output from the light-emitting surface 1222 can be made.
更具體言之,在鄰近入光面1220處,每單位面積中,微棱鏡1226的佈設數量低(即低密度);在遠離入光面1220之處,每單位面積中,微棱鏡1226的佈設數量高(即高密度);申言之,微棱鏡1226的佈設密度與其佈設位置所接收到之光線強度呈反比。More specifically, at a portion adjacent to the light incident surface 1220, the number of microprisms 1226 is low (i.e., low density) per unit area; at a distance from the light incident surface 1220, the microprisms 1226 are disposed per unit area. The number is high (ie, high density); in other words, the placement density of the microprism 1226 is inversely proportional to the intensity of the light received by its placement position.
反光件124設置於基板120並包含一側壁1240及一底壁1242;反光件124可為白色或銀色等具備高反光效果的顏色製成。側壁1240的內徑隨著遠離基板120而增加,藉以改變發光二極體126B、126G、126R產生之大角度光線的傳遞路徑,據此大角度光線能夠順利地耦合至光導桿122,達到提高光利用率的效果。底壁1242連接於側壁1240鄰近基板120之一側,供承載發光二極體126B、126G、126R。The reflector 124 is disposed on the substrate 120 and includes a sidewall 1240 and a bottom wall 1242. The reflector 124 can be made of a color having a high reflective effect such as white or silver. The inner diameter of the sidewall 1240 increases as it moves away from the substrate 120, thereby changing the transmission path of the large-angle light generated by the LEDs 126B, 126G, and 126R, whereby the large-angle light can be smoothly coupled to the light guiding rod 122 to improve the light. The effect of utilization. The bottom wall 1242 is connected to one side of the side wall 1240 adjacent to the substrate 120 for carrying the light emitting diodes 126B, 126G, 126R.
反光件124還包含複數連接件1244,其等之一端可設於底壁1242,並供與發光二極體126B、126G、126R形成電性連接;另一端突出於底壁1242之外,以供與基板120形成電性連接。The reflector 124 further includes a plurality of connectors 1244, one end of which may be disposed on the bottom wall 1242 and electrically connected to the LEDs 126B, 126G, 126R; the other end protrudes beyond the bottom wall 1242 for Electrical connection is made to the substrate 120.
請參見圖3;發光二極體126B、126G、126R沿著一第一軸線A排列於底壁1242上,側壁1240圍繞發光二極體126B、126G、126R。每個發光二極體126B、126G、126R的光軸I與第一軸線A之間的距離不大於0.5毫米;其中,光軸C為每個發光二極體126B、126G、126R所發出之光線在空間中光強度分布的對稱軸。Referring to FIG. 3, the LEDs 126B, 126G, and 126R are arranged along the first axis A on the bottom wall 1242, and the sidewalls 1240 surround the LEDs 126B, 126G, and 126R. The distance between the optical axis I of each of the light-emitting diodes 126B, 126G, and 126R and the first axis A is not more than 0.5 mm; wherein the optical axis C is the light emitted by each of the light-emitting diodes 126B, 126G, and 126R The axis of symmetry of the light intensity distribution in space.
發光二極體126B、126G、126R可分別在不同的時間點發光;在本創作中,發光二極體126B供產生波長介於450~480奈米的藍光,發光二極體126G供產生波長介於508~555奈米的綠光,發光二極體126R供產生波長介於606~626奈米的紅光。The light-emitting diodes 126B, 126G, and 126R can respectively emit light at different time points; in the present creation, the light-emitting diode 126B is used to generate blue light having a wavelength of 450 to 480 nm, and the light-emitting diode 126G is used for generating a wavelength. In the green light of 508~555 nm, the light-emitting diode 126R is used to generate red light with a wavelength between 606 and 626 nm.
請參見圖4;當發光極體126B、126G、126R與光導桿122完成組裝後,第一軸線A平行於與出光面1222之一法線;發光二極體126R排列在最鄰近出光面1222,發光二極體126G排列次靠近出光面1222,發光二極體126B排列最遠離出光面1222;換言之,發光二極體126G排列在發光二極體126R和126B之間。據此,可以提高成像品質。在實際實施時,發光二極體126B、126G、126R與出光面1222的相對位置可依實際需求來調整。Referring to FIG. 4, after the light emitting body 126B, 126G, 126R and the light guiding rod 122 are assembled, the first axis A is parallel to one of the normal lines of the light emitting surface 1222; the light emitting diode 126R is arranged at the nearest light emitting surface 1222. The light-emitting diodes 126G are arranged next to the light-emitting surface 1222, and the light-emitting diodes 126B are arranged farthest from the light-emitting surface 1222; in other words, the light-emitting diodes 126G are arranged between the light-emitting diodes 126R and 126B. According to this, the image quality can be improved. In actual implementation, the relative positions of the LEDs 126B, 126G, and 126R and the light-emitting surface 1222 can be adjusted according to actual needs.
在此要特別說明的是,發光二極體126B、126G、126R也可直接地安裝於基板120上。在前述狀態下,反光件124僅包含側壁1240以供圍繞發光二極體126B、126G、126R來改變其等發出之大角度光線的傳遞路徑。換言之,當發光二極體126B、126G、126R直接在裝在基板120時,反光件124可不包含在前所述的底壁1242;據此可降低光源模組12的整體長度。It should be particularly noted that the light-emitting diodes 126B, 126G, and 126R may be directly mounted on the substrate 120. In the foregoing state, the reflector 124 includes only the side wall 1240 for changing the transmission path of the large-angle light emitted from the light-emitting diodes 126B, 126G, 126R. In other words, when the light-emitting diodes 126B, 126G, 126R are directly mounted on the substrate 120, the reflector 124 may not include the bottom wall 1242 described above; accordingly, the overall length of the light source module 12 may be reduced.
光源模組12還可包含一保護件128及一接合件130。保護件128局部地包覆光導桿122,並至少露出入光面1220及出光面1222;保護件128主要用於保護光導桿122,避免光導桿122於組裝或運送時因無支撐而斷裂。保護件128可使用白色或銀色等具有反光效果的材料製作而成,據此可反射非由光導桿122的出光面1222出射的部份光線,達到提高光線使用效率的效果。The light source module 12 can also include a protection member 128 and a joint member 130. The protective member 128 partially covers the light guiding rod 122 and exposes at least the light incident surface 1220 and the light emitting surface 1222. The protective member 128 is mainly used for protecting the light guiding rod 122 to prevent the light guiding rod 122 from being broken due to no support during assembly or transportation. The protective member 128 can be made of a material having a reflective effect such as white or silver, and can reflect part of the light that is not emitted by the light-emitting surface 1222 of the light guiding rod 122, thereby improving the efficiency of light use.
接合件130的一端設有反光件124及發光二極體126B、126G、126R,光導桿122設於接合件130的另一端以接收發光二極體126B、126G、126R各別產生的藍色光線、綠色光線、紅色光線。換言之,接合件130之中心設有適當孔徑之一開口(圖中未示)以供發光二極體126B、126G、126R個別產生的藍色光線、綠色光線、紅色光線能順利耦合至光導桿122。申言之,接合件130可提供光導桿122及發光二極體126B、126G、126R定位及提高光耦合率的效果。接合件130供容設發光二極體126B、126G、126R之一側表面上還形成有複數凸肋132,其等穿設形成在基板120上的貫孔1200來達到定位效果。進一步地,藉由控制發光二極體126B、126G、126R個別產生的藍色光線、綠色光線、紅色光線的時序,可讓出光面1222射出的光線為經混光後人眼可視白光。One end of the engaging member 130 is provided with a reflector 124 and LEDs 126B, 126G, 126R. The light guiding rod 122 is disposed at the other end of the engaging member 130 to receive blue light generated by the LEDs 126B, 126G, and 126R. , green light, red light. In other words, the center of the engaging member 130 is provided with an opening of a suitable aperture (not shown) for the blue light, the green light, and the red light generated by the light-emitting diodes 126B, 126G, and 126R to be smoothly coupled to the light guiding rod 122. . In other words, the bonding member 130 can provide the effect of positioning the light guiding rod 122 and the LEDs 126B, 126G, and 126R and increasing the optical coupling ratio. The joint member 130 is further provided with a plurality of ribs 132 on one side surface of the accommodating light-emitting diodes 126B, 126G, and 126R, and the through holes 1200 formed in the substrate 120 are penetrated to achieve a positioning effect. Further, by controlling the timings of the blue light, the green light, and the red light generated by the light-emitting diodes 126B, 126G, and 126R, the light emitted from the light-emitting surface 1222 can be made visible to the human eye after being mixed.
復參見圖1;成像模組14容設於穿槽106中,用以使物件的影像得以成像於感測模組16;成像模組14可例如包含複數折射率漸變透鏡。Referring to FIG. 1 , the imaging module 14 is disposed in the through slot 106 for imaging an image of the object to the sensing module 16 . The imaging module 14 can include, for example, a complex refractive index progressive lens.
感測模組16設置於座體10的一側,並包含一電路板160及複數個感光件162。電路板160可例如(但不限定)為印刷電路板;基板120上的複數導電部1202可與電路板160上的複數連接墊164電性連接以擷取發光二極體126B、126G、126R發光所需電力。The sensing module 16 is disposed on one side of the base 10 and includes a circuit board 160 and a plurality of photosensitive members 162. The circuit board 160 can be, for example, but not limited to, a printed circuit board; the plurality of conductive portions 1202 on the substrate 120 can be electrically connected to the plurality of connection pads 164 on the circuit board 160 to illuminate the LEDs 126B, 126G, and 126R. Required power.
感光件162沿著一第二軸線排列在電路板160上並與電路板160形成電性連接;感光件160之一光軸與第一軸線A的夾角θ可介於35~65度之間(如圖5所示),且感光件162對應於穿槽106排列,以接收物件反射光源模組12產生之光線所產生的光學影像,進一步地將光學影像轉換為類比或數位電子信號。感光件162可為電荷耦合元件、互補式金屬氧化物半導體元件或其他具有光電轉換特性之元件。The photosensitive member 162 is arranged on the circuit board 160 along a second axis and is electrically connected to the circuit board 160. The angle θ between the optical axis of the photosensitive member 160 and the first axis A may be between 35 and 65 degrees ( As shown in FIG. 5, the photosensitive member 162 is arranged corresponding to the through groove 106 to receive the optical image generated by the object reflecting the light generated by the light source module 12, and further convert the optical image into an analog or digital electronic signal. The photosensitive member 162 may be a charge coupled device, a complementary metal oxide semiconductor device, or other element having photoelectric conversion characteristics.
本創作的取像裝置1的發光二極體126B、126G、126R經適當地定位可增加出射光線的均勻度;再者,透過適當地排列光源模組12中供產生藍光、綠光及紅光之發光二極體126B、126G、126R及其等與出光面1222的相對位置,來達到提高成像品質的效果。The light-emitting diodes 126B, 126G, and 126R of the image capturing apparatus 1 of the present invention are appropriately positioned to increase the uniformity of the emitted light; and further, the light source module 12 is appropriately arranged to generate blue light, green light, and red light. The relative positions of the light-emitting diodes 126B, 126G, and 126R and the light-emitting surface 1222 are used to improve the image quality.
雖然本創作已以實施方式揭露如上,然其並非用以限定本創作,任何熟習此技藝者,在不脫離本創作的精神和範圍內,當可作各種的更動與潤飾,因此本創作的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any person skilled in the art can make various changes and refinements without departing from the spirit and scope of the present creation. The scope is subject to the definition of the scope of the patent application.
1‧‧‧取像裝置1‧‧‧Image capture device
10‧‧‧座體10‧‧‧ body
100‧‧‧頂面100‧‧‧ top surface
102‧‧‧底面102‧‧‧ bottom
104‧‧‧容置槽104‧‧‧ accommodating slots
106‧‧‧穿槽106‧‧‧through slot
12‧‧‧光源模組12‧‧‧Light source module
120‧‧‧基板120‧‧‧Substrate
1200‧‧‧貫孔1200‧‧‧through holes
1202‧‧‧導電部1202‧‧‧Electrical Department
122‧‧‧光導桿122‧‧‧Light guide rod
1220‧‧‧入光面1220‧‧‧Into the glossy surface
1222‧‧‧出光面1222‧‧‧Glossy surface
1226‧‧‧微棱鏡1226‧‧‧Microprism
124‧‧‧反光件124‧‧‧Reflecting parts
1240‧‧‧側壁1240‧‧‧ side wall
1242‧‧‧底壁1242‧‧‧ bottom wall
126B、126G、126R‧‧‧發光二極體126B, 126G, 126R‧‧‧Light Emitting Diodes
128‧‧‧保護件128‧‧‧protection
130‧‧‧接合件130‧‧‧Joint parts
132‧‧‧凸肋132‧‧‧ ribs
14‧‧‧成像模組14‧‧‧ imaging module
16‧‧‧感測模組16‧‧‧Sensor module
160‧‧‧電路板160‧‧‧ boards
162‧‧‧感光件162‧‧‧Photosensitive parts
164‧‧‧連接墊164‧‧‧Connecting mat
A‧‧‧第一軸線A‧‧‧first axis
C‧‧‧光軸C‧‧‧ optical axis
圖1繪示依照本創作之取像裝置之立體分解圖;1 is an exploded perspective view of the image taking device according to the present invention;
圖2繪示依照本創作之取像裝置之局部分解圖;2 is a partial exploded view of the image taking device according to the present invention;
圖3繪示依照本創作之基板、反光件及發光二極體之俯視圖;3 is a top plan view of a substrate, a light reflecting member, and a light emitting diode according to the present invention;
圖4繪示依照本創作之光源模組之立體組合圖;以及4 is a perspective assembled view of a light source module according to the present invention;
圖5繪示依照本創作之取像裝置之剖視圖。Figure 5 is a cross-sectional view of the image taking device in accordance with the present invention.
12‧‧‧光源模組 12‧‧‧Light source module
120‧‧‧基板 120‧‧‧Substrate
1200‧‧‧貫孔 1200‧‧‧through holes
122‧‧‧光導桿 122‧‧‧Light guide rod
1222‧‧‧出光面 1222‧‧‧Glossy surface
124‧‧‧反光件 124‧‧‧Reflecting parts
126B、126G、126R‧‧‧發光二極體 126B, 126G, 126R‧‧‧Light Emitting Diodes
128‧‧‧保護件 128‧‧‧protection
130‧‧‧接合件 130‧‧‧Joint parts
132‧‧‧凸肋 132‧‧‧ ribs
A‧‧‧第一軸線 A‧‧‧first axis
C‧‧‧光軸 C‧‧‧ optical axis
Claims (9)
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TW106117815A TWI615015B (en) | 2017-05-31 | 2017-05-31 | Lighting module and image capture apparatus |
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TW201904259A TW201904259A (en) | 2019-01-16 |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200827852A (en) * | 2006-12-28 | 2008-07-01 | Ind Tech Res Inst | Coupling device |
TW201005388A (en) * | 2008-07-31 | 2010-02-01 | Univ Nat Chunghsing | Flexible backlight module |
TWM470454U (en) * | 2013-09-12 | 2014-01-11 | Creative Sensor Inc | Contact image sensor device |
TWI496450B (en) * | 2010-04-07 | 2015-08-11 | Creative Sensor Inc | Lighting module and the contact image sensor using the same |
TWI580018B (en) * | 2015-05-29 | 2017-04-21 | 菱光科技股份有限公司 | Wafer-level lens for contact type image sensor |
TWM548238U (en) * | 2017-05-31 | 2017-09-01 | 菱光科技股份有限公司 | Lighting module and image capture apparatus |
-
2017
- 2017-05-31 TW TW106117815A patent/TWI615015B/en not_active IP Right Cessation
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200827852A (en) * | 2006-12-28 | 2008-07-01 | Ind Tech Res Inst | Coupling device |
TW201005388A (en) * | 2008-07-31 | 2010-02-01 | Univ Nat Chunghsing | Flexible backlight module |
TWI496450B (en) * | 2010-04-07 | 2015-08-11 | Creative Sensor Inc | Lighting module and the contact image sensor using the same |
TWM470454U (en) * | 2013-09-12 | 2014-01-11 | Creative Sensor Inc | Contact image sensor device |
TWI580018B (en) * | 2015-05-29 | 2017-04-21 | 菱光科技股份有限公司 | Wafer-level lens for contact type image sensor |
TWM548238U (en) * | 2017-05-31 | 2017-09-01 | 菱光科技股份有限公司 | Lighting module and image capture apparatus |
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