JPH09137299A - Plating liquid preparing vessel - Google Patents
Plating liquid preparing vesselInfo
- Publication number
- JPH09137299A JPH09137299A JP29014395A JP29014395A JPH09137299A JP H09137299 A JPH09137299 A JP H09137299A JP 29014395 A JP29014395 A JP 29014395A JP 29014395 A JP29014395 A JP 29014395A JP H09137299 A JPH09137299 A JP H09137299A
- Authority
- JP
- Japan
- Prior art keywords
- plating solution
- storage tank
- plating
- tank
- plating liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、コンパクトディス
クや、ビデオディスク等の光ディスクのメタルマスター
を作製するめっき処理槽に供給するめっき液を調整す
る、めっき液調整槽に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plating solution adjusting tank for adjusting a plating solution supplied to a plating processing tank for producing a metal master of an optical disc such as a compact disc or a video disc.
【０００２】[0002]
【従来の技術】コンパクトディスクや、ビデオディスク
等の光ディスクを製造するためのメタルマスターは、例
えば、以下のようにして作製されている。すなわち、ま
ず、表面が平滑なガラス基板にポジ型フォトレジストを
均一な厚さとなるようにコートし、乾燥後にレーザー光
線を用いてフォトレジスト層に情報信号に従った感光部
分を形成する。次いで、これを現像液で現像することに
より感光部分を溶解させて情報信号ピットを形成し、情
報記録原盤を得る。次いで、無電解ニッケルめっきを施
して情報記録原盤表面を導電化処理し、その後、約６０
℃に設定されためっき液内に浸漬してニッケル層を電鋳
により形成する。そして、電鋳後に基板を引き上げて、
めっき液を洗い流し、乾燥後に形成したニッケル層を剥
離して所定コート処理を行い、目的とするメタルマスタ
ーを得ている。2. Description of the Related Art A metal master for producing an optical disc such as a compact disc or a video disc is produced as follows, for example. That is, first, a glass substrate having a smooth surface is coated with a positive photoresist to have a uniform thickness, and after drying, a laser beam is used to form a photosensitive portion according to an information signal on the photoresist layer. Then, by developing this with a developing solution, the photosensitive portion is dissolved to form information signal pits, and an information recording master is obtained. Next, electroless nickel plating is applied to the surface of the information recording master plate to make it conductive, and then about 60
The nickel layer is formed by electroforming by immersing it in a plating solution set to ℃. Then, after electroforming, pull up the substrate,
The plating solution is washed away, the nickel layer formed after drying is peeled off, and a predetermined coating treatment is performed to obtain the intended metal master.
【０００３】斯かるマスタリング工程を一連に行う装置
に関する従来技術としては、特開平６−１９５７６４号
公報に記載のマスタリング装置が知られている。このマ
スタリング装置は、上記のメタルマスターの作製工程を
各工程毎に行う複数のユニットを、一つの密封されたハ
ウジング内に配設するとともに、その内部を無塵状態に
保つクリーナー及び上記各ユニット間に渡って基材を搬
送する自動搬送機構を付設し、省力化を図るとともに生
産性を向上させるものである。As a prior art relating to an apparatus for performing such a mastering process in series, a mastering apparatus described in Japanese Patent Laid-Open No. 6-195764 is known. In this mastering device, a plurality of units that perform the above-described metal master manufacturing steps for each step are arranged in one sealed housing, and a cleaner that keeps the inside of the housing dust-free and the unit An automatic transport mechanism for transporting the base material over the entire length is attached to save labor and improve productivity.
【０００４】上記マスタリング装置において、基板に上
記ニッケル層を形成する電鋳ユニット（電鋳装置）は、
ニッケル塊を充填したアノードボックスが配設されため
っき処理槽と、該めっき処理槽にめっき液を随時供給す
るめっき液調整槽と、先端部において基板周縁部を挟持
し且つ上記めっき処理槽内に出し入れ自在に傾倒するよ
うに設けられたカソード治具と、上記カソード治具で挟
持された基板に洗浄液を吹き付ける洗浄機とを備えてい
る。そして、上記カソード治具を傾倒させて上記基板を
めっき浴内に浸漬し、カソード治具を回転させながら基
板にニッケル層を形成した後に、上記洗浄機で洗浄し、
乾燥後に上記ニッケル層を基板から剥がして所定コート
処理を行い、メタルマスターを得ている。In the mastering device, the electroforming unit (electroforming device) for forming the nickel layer on the substrate is
A plating treatment tank in which an anode box filled with a lump of nickel is disposed, a plating solution adjusting tank for supplying a plating solution to the plating treatment tank at any time, and a peripheral portion of the substrate at the tip portion is sandwiched and is placed in the plating treatment tank. It is provided with a cathode jig that is tilted so that it can be freely taken in and out, and a cleaning machine that sprays a cleaning liquid onto the substrate sandwiched by the cathode jig. Then, the cathode jig is tilted to immerse the substrate in a plating bath, a nickel layer is formed on the substrate while rotating the cathode jig, and then washed with the washing machine,
After drying, the nickel layer is peeled from the substrate and a predetermined coating process is performed to obtain a metal master.
【０００５】[0005]
【発明が解決しようとする課題】ところで、上述の電鋳
ユニットにおいては、電鋳過程において、アノードボッ
クス内のニッケル塊が、徐々に溶解してニッケルイオン
となるが、このニッケルの溶解が不均一に起こるため、
ニッケル塊が完全に溶解し終わる前に小片や微小粒とな
って崩れ落ち、めっき液中を浮遊していた。そして、斯
かるニッケル小片や微小粒が、カソード治具で挟持され
た基板に付着し、形成中のメタルマスターの裏面に凹凸
を形成し、成形時の裏面の凹凸が表面に現れるため、記
録不良（転写不良）を生じさせていた。また、ニッケル
塊には、当該ニッケルの溶解能を高める目的で、０．０
２ｗｔ％のＳ（硫黄）を含有させているが、斯かる硫黄
を含むニッケル小片又は微小粒がメタルマスターに含ま
れると、内部応力により、当該メタルマスターを用いた
射出成形に支障を来すおそれがあった。By the way, in the electroforming unit described above, in the electroforming process, the nickel mass in the anode box gradually dissolves into nickel ions. Because it happens to
Before the nickel lumps were completely dissolved, they fell into small pieces or fine particles and collapsed, floating in the plating solution. Then, such small nickel pieces or fine particles adhere to the substrate sandwiched by the cathode jig and form unevenness on the back surface of the metal master being formed, and the unevenness of the back surface at the time of molding appears on the surface. (Transfer failure). In addition, in order to enhance the dissolving ability of the nickel, the nickel ingot has 0.0
Although it contains 2 wt% of S (sulfur), if nickel small pieces or fine particles containing such sulfur are contained in the metal master, internal stress may hinder injection molding using the metal master. was there.
【０００６】斯かるニッケル小片又は微小粒等の磁性微
粒子を除去する技術として、特開平６−２２０６９８号
公報に記載の除去装置が提案されている。この除去装置
は、めっき処理槽からめっき液調整槽にめっき液を循環
させる通液管の外側に、リング上の磁石を配設し、該磁
石を配設した通液管内を通過するめっき液内の磁性微粒
子を捕獲・除去するものである。しかしながら、この方
法は、めっき液循環量が少なく、循環速度が低速の場合
には有効であると考えられるが、配管径が太く循環量が
多い場合や流速が速い場合には、上記ニッケル小片又は
微小粒の吸着が難しくなる欠点を有していた。As a technique for removing such magnetic fine particles such as nickel particles or fine particles, a removing device described in JP-A-6-220698 has been proposed. In this removing device, a magnet on a ring is arranged outside a liquid passage pipe that circulates the plating liquid from a plating treatment bath to a plating liquid adjustment bath, and a plating liquid inside the liquid passage pipe in which the magnet is arranged is passed. It captures and removes the magnetic fine particles. However, this method is considered to be effective when the plating solution circulation amount is small and the circulation speed is low, but when the pipe diameter is large and the circulation amount is large or when the flow velocity is high, the nickel small pieces or It has a drawback that it becomes difficult to adsorb fine particles.
【０００７】従って、本発明の目的は、めっき液の循環
量や循環速度に関わらず、めっき液中の磁性微粒子を安
定的且つ確実に除去することが可能な、めっき液調整槽
を提供することにある。Therefore, an object of the present invention is to provide a plating solution adjusting tank which can stably and surely remove the magnetic fine particles in the plating solution regardless of the circulation amount and the circulation speed of the plating solution. It is in.
【０００８】[0008]
【課題を解決するための手段】本発明の請求項１に記載
の発明は、めっき処理槽に供給するめっき液を調整する
めっき液調整槽であって、上記めっき処理槽から循環さ
れるめっき液を一旦貯留する第１貯留槽と、該第１貯留
槽との間に堰を介して連設された第２貯留槽とを備えて
おり、上記第１貯留槽に該第１貯留槽内のめっき液中の
磁性微粒子を吸着する磁石を配設したことを特徴とする
めっき液調整槽を提供することにより、上記目的を達成
したものである。The invention according to claim 1 of the present invention is a plating solution adjusting tank for adjusting the plating solution to be supplied to the plating processing tank, wherein the plating solution is circulated from the plating processing tank. And a second storage tank that is continuously provided via a weir between the first storage tank and the first storage tank. The above object is achieved by providing a plating solution adjusting tank which is provided with a magnet for adsorbing magnetic fine particles in the plating solution.
【０００９】また、本発明の請求項２に記載の発明は、
請求項１に記載のめっき液調整槽において、上記磁石
を、上記堰に配設したことを特徴とするめっき液調整槽
を提供するものである。Further, the invention according to claim 2 of the present invention provides:
The plating solution adjusting tank according to claim 1, wherein the magnet is disposed in the weir, and the plating solution adjusting tank is provided.
【００１０】また、本発明の請求項３に記載の発明は、
請求項２に記載のめっき液調整槽において、上記堰に、
上記第１貯留槽から上記第２貯留槽に向けて登り勾配を
有する傾斜面及び該傾斜面に連続する略水平な水平面を
設け、該傾斜面及び／又は水平面に上記磁石を配設した
ことを特徴とするめっき液調整槽を提供するものであ
る。[0010] Further, the invention according to claim 3 of the present invention provides:
In the plating solution adjusting tank according to claim 2, in the weir,
An inclined surface having an ascending slope from the first storage tank to the second storage tank and a substantially horizontal horizontal surface continuous to the inclined surface are provided, and the magnet is arranged on the inclined surface and / or the horizontal surface. A characteristic plating solution adjusting tank is provided.
【００１１】本発明の請求項１に記載のめっき液調整槽
においては、めっき処理槽から循環されためっき液を上
記第１貯留槽で一旦貯留し、当該第１貯留槽内において
磁石によってめっき液中の磁性微粒子を吸着するため、
めっき液中の磁性微粒子を安定的且つ確実に除去するこ
とができる。In the plating solution adjusting tank according to claim 1 of the present invention, the plating solution circulated from the plating processing tank is temporarily stored in the first storage tank, and the plating solution is magnetized in the first storage tank. In order to adsorb the magnetic particles inside,
The magnetic fine particles in the plating solution can be removed stably and reliably.
【００１２】本発明の請求項２に記載のめっき液調整槽
においては、上記堰に磁石が配設されているので、上記
第１貯留槽から上記第２貯留槽へ移動するめっき液中の
磁性微粒子を確実に除去することができる。In the plating solution adjusting tank according to the second aspect of the present invention, since the magnet is arranged in the weir, the magnetic property in the plating solution moving from the first storage tank to the second storage tank. The fine particles can be reliably removed.
【００１３】本発明の請求項３に記載のめっき液調整槽
においては、上記堰に、上記第１貯留槽から上記第２貯
留槽に向けて登り勾配を有する傾斜面及び該傾斜面に連
続する略水平な水平面が設けられており、該傾斜面及び
／又は水平面に上記磁石が配設されているので、比較的
大きな磁性微粒子は、傾斜面の下方部側で捕獲され、め
っき液中を浮遊しやすい磁性微粒子は、液層が薄く且つ
流れが緩やかになった傾斜面の上方部及び水平面上で確
実に捕獲される。In the plating solution adjusting tank according to claim 3 of the present invention, the weir is continuous with an inclined surface having an ascending slope from the first storage tank toward the second storage tank and the inclined surface. Since a substantially horizontal horizontal surface is provided and the magnets are arranged on the inclined surface and / or the horizontal surface, relatively large magnetic fine particles are trapped on the lower side of the inclined surface and float in the plating solution. The magnetic fine particles that are easily formed are reliably captured on the upper part of the inclined surface where the liquid layer is thin and the flow is gentle and on the horizontal plane.
【００１４】[0014]
【発明の実施の形態】以下、本発明の実施形態を添付図
面を参照しながら詳細に説明する。Embodiments of the present invention will be described below in detail with reference to the accompanying drawings.
【００１５】図１は、本発明に係るめっき液調整槽の一
実施形態をコンパクトディスクの電鋳装置におけるめっ
き液調整槽に適用した状態を示したものである。同図に
おいて、符号１はめっき液調整槽、１０はめっき処理
槽、Ｃは基板を挟持するカソード治具、Ａはカソード治
具Ｃとの対向面にイオン透過膜又は微細な布Ｍが張設さ
れ且つニッケル塊が充填されたアノードボックスを示し
ている。FIG. 1 shows a state in which an embodiment of the plating solution adjusting tank according to the present invention is applied to a plating solution adjusting tank in a compact disc electroforming apparatus. In the figure, reference numeral 1 is a plating solution adjusting tank, 10 is a plating treatment tank, C is a cathode jig for sandwiching a substrate, and A is an ion-permeable film or a fine cloth M stretched on the surface facing the cathode jig C. 2 shows an anode box that has been filled and filled with a nickel mass.
【００１６】図１に示したように、上記めっき液調整槽
１と上記めっき処理槽１０との間には、２本の通液管１
１、１２が配管されており、当該めっき液調整槽１及び
めっき処理槽１０の間でめっき液が順次循環できるよう
になしてある。なお、通液管１１の下端部には、フィル
ターＦ１が取り付けられており、また、通液管１２に
は、ポンプＰ及びフィルターＦ２が介装されている。As shown in FIG. 1, two liquid passage tubes 1 are provided between the plating solution adjusting tank 1 and the plating treatment tank 10.
Pipes 1 and 12 are arranged so that the plating solution can be sequentially circulated between the plating solution adjusting tank 1 and the plating treatment tank 10. A filter F1 is attached to the lower end of the liquid passage pipe 11, and a pump P and a filter F2 are provided in the liquid passage pipe 12.
【００１７】上記めっき液調整槽１は、上記めっき処理
槽１０から循環されためっき液を一旦貯留する第１貯留
槽２と、第１貯留槽２との間に堰３を介して連設された
第２貯留槽４とを備えている。The plating solution adjusting tank 1 is connected between a first storage tank 2 for temporarily storing the plating solution circulated from the plating treatment tank 10 and a first storage tank 2 via a weir 3. And a second storage tank 4.
【００１８】上記第１貯留槽２内には、二つの防波板２
０が設置されており、上記通液管１１を通じて循環され
るめっき液が、当該第１貯留槽２内に注がれたときに生
じる波が、第１貯留槽２全体に拡がらないようになして
ある。また、第１貯留槽２の底部には、ドレイン管２１
が配管されており、バルブＶを開くことによって当該第
１貯留槽２内のめっき液を廃液できるようになしてあ
る。In the first storage tank 2, two wave preventing plates 2 are provided.
0 is installed so that the wave generated when the plating solution circulated through the liquid passage pipe 11 is poured into the first storage tank 2 does not spread to the entire first storage tank 2. Yes. Further, at the bottom of the first storage tank 2, the drain pipe 21
Is arranged so that the plating solution in the first storage tank 2 can be drained by opening the valve V.
【００１９】上記堰３は、断面台形状の塩化ビニル、ポ
リプロピレン、又はＰＶＤＦ等の樹脂製の堰本体３０を
主体として構成されており、この堰本体３０には、上記
第１貯留槽２から上記第２貯留槽３に向けて登り勾配を
有する傾斜面３０ａ及びこの傾斜面３０ａに連続する水
平面３０ｂが設けられている。そして、これら傾斜面３
０ａ及び水平面３０ｂに、上記第１貯留槽２内のめっき
液中の磁性微粒子を吸着する磁石５が配設されている。
上記傾斜面３０ａの角度θは、１０°〜４５°とするこ
とが好ましく、また、堰３の幅（図１の紙面を垂直に貫
く方向の幅）は、循環させるめっき液の流量に応じて適
宜変更することが可能であるが、当該堰３を通過すると
きのめっき液の厚さ（深さ）が１ｍｍ程度となるように
設定することが磁性微粒子を確実に捕獲する上で好まし
い。The weir 3 is mainly composed of a resin main body 30 having a trapezoidal cross section and made of a resin such as vinyl chloride, polypropylene, or PVDF. An inclined surface 30a having an ascending slope toward the second storage tank 3 and a horizontal surface 30b continuous with the inclined surface 30a are provided. And these inclined surfaces 3
A magnet 5 for adsorbing the magnetic fine particles in the plating solution in the first storage tank 2 is arranged on the horizontal plane 0a and the horizontal plane 30b.
The angle θ of the inclined surface 30a is preferably 10 ° to 45 °, and the width of the weir 3 (width in the direction perpendicular to the paper surface of FIG. 1) depends on the flow rate of the plating solution to be circulated. Although it can be appropriately changed, it is preferable to set the thickness (depth) of the plating solution when passing through the weir 3 to be about 1 mm in order to reliably capture the magnetic fine particles.
【００２０】上記磁石５は、サマリウムコバルト磁石が
複数に配列されたブロック（図示せず）であり、上記傾
斜面３０ａ及び水平面３０ｂに対して略垂直方向の磁界
を発生できるようになしてある。この磁石５は、ブロッ
クを構成する複数個のサマリウムコバルト磁石の向きを
９０度回転させて各磁石のＮＳ極を対向させることによ
って、上記磁界を必要に応じて簡単に消磁できるように
なしてある。The magnet 5 is a block (not shown) in which a plurality of samarium-cobalt magnets are arranged, and can generate a magnetic field in a direction substantially perpendicular to the inclined surface 30a and the horizontal surface 30b. The magnet 5 is configured so that the magnetic field can be easily demagnetized as necessary by rotating the directions of a plurality of samarium-cobalt magnets forming a block by 90 degrees so that the NS poles of the magnets face each other. .
【００２１】また、上記磁石５は、ＰＶＤＦ製の被覆板
３１で覆われており、当該磁石５をめっき液による腐食
から保護できるようになしてある。なお、上記被覆膜３
１は、耐食性を有するものであれば、他の材質、例え
ば、ポリテトラフルオロエチレン、塩化ビニル、ポリプ
ロピレン製のものを使用することができる。The magnet 5 is covered with a PVDF coating plate 31 so that the magnet 5 can be protected from corrosion by the plating solution. The coating film 3
Other materials, such as those made of polytetrafluoroethylene, vinyl chloride, and polypropylene, can be used as 1 as long as they have corrosion resistance.
【００２２】次に、上記めっき液調整槽１の動作を図１
を参照しながら説明する。Next, the operation of the plating solution adjusting tank 1 will be described with reference to FIG.
This will be described with reference to FIG.
【００２３】まず、上記磁石５のスイッチを入れ、上記
傾斜面３０ａ及び水平面３０ｂと垂直方向の磁界を発生
させておく。そして、上記ポンプＰを作動させてめっき
液の循環を開始するポンプＰによる循環量は、めっきの
仕上がりに応じて調整することが望ましい。ポンプＰに
よって吸い上げられためっき液は、上記フィルターＦ２
を通過してめっき処理槽１０内に供給される。First, the magnet 5 is turned on to generate a magnetic field perpendicular to the inclined surface 30a and the horizontal surface 30b. Then, the circulation amount by the pump P that starts the circulation of the plating solution by operating the pump P is preferably adjusted according to the finish of the plating. The plating liquid sucked up by the pump P is used as the filter F2.
And is supplied into the plating treatment tank 10.
【００２４】めっき処理槽１０内のめっき液は、上記ア
ノードボックスＡを通じてその下方部から通液管１１に
導かれ、フィルターＦ１で濾過されて上記第１貯留槽２
内に導かれる。The plating liquid in the plating treatment tank 10 is introduced from the lower part thereof into the liquid passage pipe 11 through the anode box A, filtered by the filter F1 and then the first storage tank 2 described above.
Guided inside.
【００２５】そして、第１貯留槽２内において、粒径が
１００μｍ〜数ｍｍ程度の比較的粒径の大きな磁性微粒
子は、傾斜面３０ａの下方部底部側の磁石５で捕獲され
る。また、めっき液中を浮遊しやすい、粒径が１μｍ〜
数十μｍ程度の微細な磁性微粒子は、液層が薄く且つ流
れが緩やかな傾斜面３０ａの上方部及び水平面３０ｂ上
において、上記磁石５によって確実に捕獲される。In the first storage tank 2, the magnetic fine particles having a relatively large particle diameter of about 100 μm to several mm are captured by the magnet 5 on the lower bottom side of the inclined surface 30a. In addition, the particle size is 1 μm or more, which easily floats in the plating solution.
The fine magnetic particles of about several tens of μm are reliably captured by the magnet 5 above the horizontal surface 30b and above the inclined surface 30a where the liquid layer is thin and the flow is gentle.
【００２６】上記堰３を超えて上記第２貯留槽４内に貯
留されためっき液は、所望の濃度調整がなされた後、通
液管１２に介装されたポンプＰによって、当該通液管１
２を通じて再びめっき処理槽１０に供給される。The plating solution stored in the second storage tank 4 beyond the weir 3 is subjected to a desired concentration adjustment, and thereafter, the pump P provided in the liquid passage 12 causes the passage of the liquid passage. 1
It is again supplied to the plating treatment tank 10 through 2.
【００２７】捕獲した磁性微粒子は、例えば、当該めっ
き液調整槽１の運転を停止しメンテナンス作業を行う際
などに、上記磁石５のスイッチをオフにして磁界を消磁
した状態で洗浄し、上記ドレイン管２１を通じて排出す
ることができる。The captured magnetic fine particles are washed with the magnetic field demagnetized by turning off the switch of the magnet 5 when, for example, the operation of the plating solution adjusting tank 1 is stopped and maintenance work is performed. It can be discharged through the pipe 21.
【００２８】このように、本実施形態に係るめっき液調
整槽１によれば、めっき液の循環量や循環速度に関わら
ず、めっき液中の磁性微粒子を安定的且つ確実に除去す
ることが可能である。As described above, according to the plating solution adjusting tank 1 of the present embodiment, the magnetic fine particles in the plating solution can be stably and surely removed regardless of the circulation amount and the circulation speed of the plating solution. Is.
【００２９】本発明に係るめっき液調整槽は、上記実施
形態のめっき液調整槽１に限定されるものではなく、本
発明の目的を逸脱しない範囲において、その寸法、形状
等を適宜変更することができる。The plating solution adjusting tank according to the present invention is not limited to the plating solution adjusting tank 1 of the above-described embodiment, and its size, shape, etc. may be appropriately changed without departing from the object of the present invention. You can
【００３０】例えば、上記実施形態のめっき液調整槽１
では、堰３を介して第１貯留槽２及び第２貯留槽４を連
設したが、例えば、堰３をさらに設けて貯留槽の数を増
やし、より確実に磁性微粒子を除去できるようにしても
よい。For example, the plating solution adjusting tank 1 of the above embodiment
Then, although the 1st storage tank 2 and the 2nd storage tank 4 were connected in series through the weir 3, for example, the weir 3 was further provided and the number of storage tanks was increased, and it was made to remove magnetic fine particles more reliably. Good.
【００３１】また、本発明に係るめっき液調整槽は、上
記実施形態のめっき液調整槽１におけるように、堰３に
傾斜面３０ａ及び該傾斜面３０ａに連続する水平面３０
ｂを設けて、当該傾斜面３０ａ及び水平面３０ｂに磁石
５を配設することが好ましいが、上記傾斜面又は水平面
のいずれか一方に磁石を配設しても良い。また、ポリテ
トラフルオロエチレン等の耐食性樹脂で被覆した磁石を
第１貯留槽の底部に沈めておき、当該第１貯留槽内のめ
っき液中の磁性微粒子を除去するようにしても良い。Further, the plating solution adjusting tank according to the present invention has the inclined surface 30a on the weir 3 and the horizontal surface 30 continuous to the inclined surface 30a as in the plating solution adjusting tank 1 of the above embodiment.
It is preferable that the magnet 5 is provided on the inclined surface 30a and the horizontal surface 30b by providing b, but the magnet may be provided on either the inclined surface or the horizontal surface. Alternatively, a magnet coated with a corrosion resistant resin such as polytetrafluoroethylene may be immersed in the bottom of the first storage tank to remove the magnetic fine particles in the plating solution in the first storage tank.
【００３２】また、本発明に係るめっき液調整槽は、上
記実施形態におけるような、コンパクトディスクマスタ
リング装置の電鋳装置への適用に限定されるものではな
く、レーザーディスクその他の光ディスクの電鋳装置に
も適用できることはいうまでもない。Further, the plating solution adjusting tank according to the present invention is not limited to the application to the compact disk mastering apparatus electroforming apparatus as in the above-mentioned embodiment, and the electroforming apparatus for laser disks and other optical disks. It goes without saying that it can also be applied to.
【００３３】[0033]
【発明の効果】本発明に係るめっき液調整槽によれば、
めっき液の循環量や循環速度に関わらず、めっき液中の
磁性微粒子を安定的且つ確実に除去することが可能であ
る。According to the plating solution adjusting tank of the present invention,
It is possible to stably and surely remove the magnetic fine particles in the plating solution regardless of the circulation amount and circulation rate of the plating solution.
【図１】本発明に係る電鋳装置の一実施形態をコンパク
トディスクマスタリング装置の電鋳装置におけるめっき
液調整槽に適用した例を示す要部概略断面図である。FIG. 1 is a schematic cross-sectional view of essential parts showing an example in which an embodiment of an electroforming apparatus according to the present invention is applied to a plating solution adjusting tank in an electroforming apparatus of a compact disc mastering apparatus.
１ めっき液調整槽 １０ めっき処理槽 ２ 第１貯留槽 ３ 堰 ３０ａ 傾斜面 ３０ｂ 水平面 ４ 第２貯留槽 ５ 磁石 DESCRIPTION OF SYMBOLS 1 Plating solution adjustment tank 10 Plating treatment tank 2 1st storage tank 3 Weir 30a Inclined surface 30b Horizontal surface 4 Second storage tank 5 Magnet
Claims (3)
調整するめっき液調整槽であって、 上記めっき処理槽１０から循環されるめっき液を一旦貯
留する第１貯留槽２と、該第１貯留槽２との間に堰３を
介して連設された第２貯留槽４とを備えており、上記第
１貯留槽２に該第１貯留槽２内のめっき液中の磁性微粒
子を吸着する磁石５を配設したことを特徴とするめっき
液調整槽。1. A plating solution adjusting tank for adjusting a plating solution to be supplied to the plating processing tank 10, wherein a first storage tank 2 for temporarily storing the plating solution circulated from the plating processing tank 10 and the first storage tank 2 are provided. A second storage tank 4 that is connected to the storage tank 2 via a weir 3 is provided, and the first storage tank 2 adsorbs magnetic fine particles in the plating solution in the first storage tank 2. A plating solution adjusting tank, characterized in that a magnet 5 is provided.
を特徴とする請求項１に記載のめっき液調整槽。2. The plating solution adjusting tank according to claim 1, wherein the magnet 5 is arranged in the weir 3.
第２貯留槽４に向けて登り勾配を有する傾斜面３０ａ及
び該傾斜面３０ａに連続する略水平な水平面３０ｂを設
け、該傾斜面３０ａ及び／又は水平面３０ｂに上記磁石
５を配設したことを特徴とする請求項２に記載のめっき
液調整槽。3. The weir 3 is provided with an inclined surface 30a having an upward slope from the first storage tank 2 toward the second storage tank 4 and a substantially horizontal horizontal surface 30b continuous with the inclined surface 30a, The plating solution adjusting tank according to claim 2, wherein the magnet 5 is arranged on the inclined surface 30a and / or the horizontal surface 30b.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29014395A JPH09137299A (en) | 1995-11-08 | 1995-11-08 | Plating liquid preparing vessel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29014395A JPH09137299A (en) | 1995-11-08 | 1995-11-08 | Plating liquid preparing vessel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09137299A true JPH09137299A (en) | 1997-05-27 |
Family
ID=17752346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29014395A Pending JPH09137299A (en) | 1995-11-08 | 1995-11-08 | Plating liquid preparing vessel |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09137299A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006070452A1 (en) * | 2004-12-28 | 2006-07-06 | Renesas Technology Corp. | Method for manufacturing semiconductor device |
| JP2007146286A (en) * | 2005-10-25 | 2007-06-14 | Ebara Corp | Electroless plating apparatus and electroless plating method |
-
1995
- 1995-11-08 JP JP29014395A patent/JPH09137299A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006070452A1 (en) * | 2004-12-28 | 2006-07-06 | Renesas Technology Corp. | Method for manufacturing semiconductor device |
| JPWO2006070452A1 (en) * | 2004-12-28 | 2008-08-07 | 株式会社ルネサステクノロジ | Manufacturing method of semiconductor device |
| JP2007146286A (en) * | 2005-10-25 | 2007-06-14 | Ebara Corp | Electroless plating apparatus and electroless plating method |
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