JPH09120852A - Semiconductor device with connector built in case - Google Patents
Semiconductor device with connector built in caseInfo
- Publication number
- JPH09120852A JPH09120852A JP7280773A JP28077395A JPH09120852A JP H09120852 A JPH09120852 A JP H09120852A JP 7280773 A JP7280773 A JP 7280773A JP 28077395 A JP28077395 A JP 28077395A JP H09120852 A JPH09120852 A JP H09120852A
- Authority
- JP
- Japan
- Prior art keywords
- connector
- power
- case
- semiconductor device
- partition plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】この発明は、ユーザの使用に便利
な、コネクタをケース内に内蔵する半導体装置に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device having a connector built in a case, which is convenient for a user to use.
【0002】[0002]
【従来の技術】従来の大電力半導体装置の外観は、例え
ば、図9或いは図10で示される。図9は、電力端子1
01と信号端子102とが半導体装置本体の表面上に引
き出された構成例を示し、信号端子102としては、図
示する雄側の端子に対し雌側のファストン端子が装着さ
れ電気的に接続される場合を示している。2. Description of the Related Art The appearance of a conventional high power semiconductor device is shown, for example, in FIG. 9 or FIG. FIG. 9 shows the power terminal 1
01 and the signal terminal 102 are drawn out on the surface of the semiconductor device body. As the signal terminal 102, a female faston terminal is attached to and electrically connected to a male terminal shown in the figure. The case is shown.
【0003】この図9に示す公知例は、例えば、文献
“大電力1700V IGBT”東芝レビュー199
3、Vol.48,No.12,p875〜p878、
又は、“TOSHIBA IGBT DATA BOO
K 1995”p28〜p34、に開示されている。The known example shown in FIG. 9 is, for example, the document "Large Power 1700V IGBT" Toshiba Review 199.
3, Vol. 48, No. 12, p875-p878,
Or, "TOSHIBA IGBT DATA BOO
K 1995 "p28-p34.
【0004】図10は、電力端子101に対し信号端子
202は、ピン端子として半導体装置本体の側面に植立
し、プリント基板203の配線と半田付けによって接続
される。In FIG. 10, the signal terminal 202 is erected on the side surface of the semiconductor device body as a pin terminal with respect to the power terminal 101, and is connected to the wiring of the printed board 203 by soldering.
【0005】この図10に示す公知例は、例えば、文献
“三菱インテリジェントパワーモジュール”三菱電機技
報、Vol.67,No.9,1993,p107に開
示されている。しかしながら、図9に示す実施例におい
ては、外部装置との接続をするに際しては必要な雌側の
ファストン端子を、対応する雄側の端子に個々に接続し
て行く作業を必要としユーザにとって面倒であった。
又、図10の実施例においては、一旦、ピン端子をプリ
ント基板に半田付けしてしまうと、半導体装置が故障し
た場合などに取り替えが困難であった。The known example shown in FIG. 10 is disclosed, for example, in the document "Mitsubishi Intelligent Power Module", Mitsubishi Electric Technical Report, Vol. 67, No. 9, 1993, p107. However, in the embodiment shown in FIG. 9, when connecting with an external device, it is necessary to individually connect the necessary female Faston terminals to the corresponding male terminals, which is troublesome for the user. there were.
Further, in the embodiment of FIG. 10, once the pin terminals are soldered to the printed circuit board, it is difficult to replace them when the semiconductor device fails.
【0006】[0006]
【発明が解決しようとする課題】この発明は、上述の問
題点を解決し、半導体装置の信号線を外部装置に接続す
るに際し、ユーザの使用に便利な、コネクタをケース内
に内蔵する半導体装置を提供することを目的とする。SUMMARY OF THE INVENTION The present invention solves the problems described above, and a semiconductor device having a connector inside a case, which is convenient for the user to connect the signal line of the semiconductor device to an external device. The purpose is to provide.
【0007】[0007]
【課題を解決するための手段】上記目的を達成する為、
この発明のコネクタをケース内に内蔵する半導体装置
は、電力素子収納部とコネクタ収納部とより成り、前記
電力素子収納部は、金属ベースと、前記金属ベースを囲
み、前記電力素子収納部と前記コネクタ収納部とを形成
する仕切り板を有するケースと、前記電力素子収納部に
収納される金属ベース上の絶縁性基板に載置される少な
くとも1個の、電極を有する電力半導体素子と、前記絶
縁性基板に支持体を介して支持されるホルダー上に固定
される複数の電力端子と、前記電力半導体素子の絶縁性
を確保のため前記ケース内に注入されるポッティング剤
と、前記コネクタ収納部に本体が収納され、前記ケース
を貫通して装着され一部が外部に連絡される信号配線接
続用コネクタと、前記仕切り板を挟んで前記電力半導体
素子と前記コネクタとを接続する接続手段と、より構成
される。In order to achieve the above object,
A semiconductor device having a connector of the present invention built in a case comprises a power element housing portion and a connector housing portion, the power element housing portion surrounding a metal base and the metal base, and the power element housing portion and the power element housing portion. A case having a partition plate that forms a connector accommodating portion, at least one power semiconductor element having an electrode mounted on an insulating substrate on a metal base accommodated in the power element accommodating portion, and the insulation Power terminals fixed on a holder supported by a flexible substrate via a support, a potting agent injected into the case for ensuring insulation of the power semiconductor element, and a connector accommodating portion. A signal wiring connecting connector in which a main body is housed, mounted through the case and partially connected to the outside, and the power semiconductor element and the connector with the partition plate interposed therebetween. And connection means for connecting, more composed.
【0008】[0008]
【発明の実施の形態】以下、図面を参照しながら、この
発明の第1の実施の形態を説明する。図1は、この発明
のコネクタをケース内に内蔵する半導体装置の外観斜視
図を示し、図2は、図1のII−II線矢視部分断面図であ
り、両図を参照しながら説明する。金属ベース301上
には、複数個、例えば2個の絶縁性基板302が実装さ
れ、夫々の基板302上には電力半導体素子303が実
装される。DETAILED DESCRIPTION OF THE INVENTION A first embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is an external perspective view of a semiconductor device in which the connector of the present invention is incorporated in a case, and FIG. 2 is a partial sectional view taken along the line II-II of FIG. 1, which will be described with reference to both figures. . A plurality of, for example, two insulating substrates 302 are mounted on the metal base 301, and a power semiconductor element 303 is mounted on each substrate 302.
【0009】前記電力半導体素子303の電極と前記基
板302とはボンディングワイヤ320を用いて接続さ
れている。前記金属ベース301をケース304を用い
て囲み、前記電力半導体素子303をケース内に収容す
る。前記ケース304は、仕切り板307を用いて電力
半導体素子収納部308とコネクタ収納部309とを形
成する 電力半導体素子収納部308において、複数の電力端子
305は、ホルダー306に固定される。ホルダー30
6は、支持体321によって前記基板302に支持され
る。The electrodes of the power semiconductor element 303 and the substrate 302 are connected to each other using bonding wires 320. The metal base 301 is surrounded by a case 304, and the power semiconductor element 303 is housed in the case. The case 304 forms a power semiconductor device housing 308 and a connector housing 309 using a partition plate 307. In the power semiconductor device housing 308, a plurality of power terminals 305 are fixed to a holder 306. Holder 30
6 is supported on the substrate 302 by a support 321.
【0010】前記電力半導体素子収納部308を形成す
る前記ケース304内に、前記電力半導体素子303の
絶縁性を確保のためポッティング剤310が注入され
る。前記複数の電力端子305とホルダー306との機
械的強度を高める為にポッティング剤310の上に、更
にエポキシ樹脂315が注入される。A potting agent 310 is injected into the case 304 forming the power semiconductor device housing 308 to secure the insulation of the power semiconductor device 303. An epoxy resin 315 is further injected on the potting material 310 to increase the mechanical strength of the power terminals 305 and the holder 306.
【0011】尚、注入されるのは前記ポッティング剤3
10のみであって、前記エポキシ樹脂315は、省いて
もよい。信号配線接続用コネクタ317は、コネクタ収
納部309を形成するケース側壁に取り付けられ、コネ
クタ317の一部は前記ケース304を貫通して外部に
連絡されている。The potting agent 3 is injected.
Only 10 and the epoxy resin 315 may be omitted. The signal wire connecting connector 317 is attached to a side wall of the case forming the connector housing 309, and a part of the connector 317 penetrates the case 304 to communicate with the outside.
【0012】前記仕切り坂307の下地は導電体316
がモールドされ、前記電力素子収納部308とコネクタ
収納部309との電気的接続部とされる。前記仕切り板
307を挟み前記導電体316を通して前記電力素子収
納部308と前記コネクタ収納部309との夫々にピン
311及び312が導出される。前記ピン311は、ジ
ャンパー線313を介して前記電力半導体素子部308
の基板302に接続され、前記ピン312は、ジャンパ
ー線314を介して前記コネクタ317に接続される。The base of the partition slope 307 is a conductor 316.
Is molded to form an electrical connection portion between the power element storage portion 308 and the connector storage portion 309. Pins 311 and 312 are led out to the power device housing 308 and the connector housing 309, respectively, through the conductor 316 with the partition plate 307 interposed therebetween. The pin 311 is connected to the power semiconductor device unit 308 via a jumper wire 313.
, And the pins 312 are connected to the connectors 317 via jumper wires 314.
【0013】前記コネクタ317は、ケース304の外
側に露出していて、ユーザーの要望に見合うプラグを外
側から前記コネクタ317に挿入することで所望の外部
装置を前記コネクタ317を介して前記電力素子収納部
308の任意の前記電力半導体素子303に接続でき
る。The connector 317 is exposed to the outside of the case 304, and a desired external device is accommodated through the connector 317 by inserting a plug matching the user's request from the outside into the connector 317. It can be connected to any of the power semiconductor elements 303 of section 308.
【0014】前記仕切り板307を用いることにより、
コネクタ収納部309内にはポッティング剤310や、
エポキシ樹脂315などが入り込まないので、コネクタ
317の装脱が容易にできる。By using the partition plate 307,
In the connector housing 309, potting agent 310,
Since the epoxy resin 315 and the like do not enter, the connector 317 can be easily attached and detached.
【0015】前記電力素子収納部308内の前記半導体
素子部分は、ポッティング剤310や、エポキシ樹脂3
15が熱硬化処理されるので耐熱性の高い材質が選ばれ
るが、コネクタ317は、熱硬化処理後にコネクタ収納
部309のケース304に取り付ければよい為、コネク
タのハウジングは、耐熱性の低い材質でよく、市販され
ているコネクタを使用できる。次に、図3の断面図を参
照して、この発明の半導体装置の第2の実施の形態を説
明する。The semiconductor element portion in the power element housing 308 has a potting agent 310 and an epoxy resin 3.
A material with high heat resistance is selected because 15 is heat-cured, but the connector 317 may be attached to the case 304 of the connector housing 309 after heat-cured, so the housing of the connector is made of a material with low heat resistance. Of course, commercially available connectors can be used. Next, a second embodiment of the semiconductor device of the present invention will be described with reference to the sectional view of FIG.
【0016】尚、図2に示す構成と同一部分は同一符号
を付けその構成の説明は省略する。前記コネクタ収納部
309において、前記ピン312とコネクターのアウタ
ーリード402は、プリント基板401を介して電気的
に接続される。The same parts as those shown in FIG. 2 are designated by the same reference numerals, and the description thereof will be omitted. In the connector housing 309, the pin 312 and the outer lead 402 of the connector are electrically connected via the printed board 401.
【0017】図4は、この発明の半導体装置の第3の実
施の形態を説明する断面図を示し、図2及び図3に示す
ピンやジャンパー線を省き、前記仕切り板307にリー
ド線501を貫通させ、このリード線の端子を直接、電
力半導体素子素子を載置する基板302及びコネクタ3
17に接続する。この場合、前記仕切り板307とリー
ド線501との間に隙間が生じるのを防ぐ為、接着剤を
塗布する。FIG. 4 is a sectional view for explaining a third embodiment of the semiconductor device of the present invention. Pins and jumper wires shown in FIGS. 2 and 3 are omitted, and a lead wire 501 is provided on the partition plate 307. The substrate 302 and the connector 3 on which the terminals of this lead wire are directly passed and the power semiconductor element is mounted.
Connect to 17. In this case, an adhesive is applied to prevent a gap from being formed between the partition plate 307 and the lead wire 501.
【0018】その他の構成は図2に示す構成と同一であ
り、その構成の説明は省略する。図5は、この発明の半
導体装置の第4の実施の形態を説明する断面図を示し、
図4に示すリード線501に替えフレキシブルプリント
基板601を用いることもできる。The other structure is the same as that shown in FIG. 2, and the description of the structure is omitted. FIG. 5 is a sectional view illustrating a fourth embodiment of the semiconductor device of the present invention,
A flexible printed circuit board 601 may be used instead of the lead wire 501 shown in FIG.
【0019】その他の構成は図2に示す構成と同一であ
り、その構成の説明は省略する。この実施の形態におい
ても、前記仕切り板307とフレキシブルプリント基板
601との間に隙間が生じるのを防ぐ為、接着剤を塗布
することが好ましい。The other structure is the same as that shown in FIG. 2, and the description of the structure is omitted. Also in this embodiment, in order to prevent a gap from being formed between the partition plate 307 and the flexible printed board 601, it is preferable to apply an adhesive.
【0020】図6は、この発明の半導体装置の第5の実
施の形態を説明する斜視図であり、コネクタ317のケ
ース304への取り付け位置は図1乃至図5に示すよう
にケースの側面に限らず、ケース304の前記コネクタ
収納部309の上面であってもよい。FIG. 6 is a perspective view for explaining a fifth embodiment of the semiconductor device of the present invention. The connector 317 is attached to the case 304 at the side surface of the case as shown in FIGS. Not limited to this, it may be the upper surface of the connector storage portion 309 of the case 304.
【0021】図7は、この発明の半導体装置の第5の実
施の形態を説明する斜視図であり、図8は、図7のVIII
−VIII線矢視断面図である。図2に示す第1の実施の形
態との主たる違いは、前記電力素子収納部308の内部
にプリント基板815が収納され、このプリント基板8
15には、制御部816や保護回路817が搭載されて
いることである。FIG. 7 is a perspective view illustrating a fifth embodiment of the semiconductor device of the present invention, and FIG. 8 is a view of VIII in FIG.
FIG. 8 is a sectional view taken along line VIII. The main difference from the first embodiment shown in FIG. 2 is that a printed board 815 is housed inside the power device housing 308.
15 is that the control unit 816 and the protection circuit 817 are mounted.
【0022】前記プリント基板815は、支持部材81
9で支持される。前記電力素子収納部308の内部に
は、電極間の絶縁性確保のため、ポッティング剤310
を収納し、熱硬化させる。電力端子305は、厚みを有
するケース304上に配置される。前記電力素子収納部
308の上面は、上蓋410で閉じる。The printed circuit board 815 has a support member 81.
Supported by 9. A potting agent 310 is provided inside the power device housing 308 to secure insulation between electrodes.
Store and heat cure. The power terminal 305 is arranged on a case 304 having a thickness. An upper lid 410 closes the upper surface of the power element housing 308.
【0023】コネクタ317の差し込みには外側からプ
ラグ819が差し込まれる。その他の構成は図2又は、
図3に示す構成と部分的に同一であり、その構成の説明
は省略する。A plug 819 is inserted into the connector 317 from the outside. Other configurations are shown in FIG. 2 or
The configuration is partially the same as that shown in FIG. 3, and the description of the configuration is omitted.
【0024】この形態によれば、制御部816や保護回
路817の電源入力用やエラー信号出力用などの信号端
子数が増えるので、コネクタ化による外部装置との接続
の簡略化に効果的である。According to this aspect, since the number of signal terminals for power input and error signal output of the control unit 816 and the protection circuit 817 is increased, it is effective in simplifying the connection with the external device by forming a connector. .
【0025】[0025]
【発明の効果】上述したように、この発明のコネクタを
ケース内に内蔵する半導体装置は、ケースを仕切り板で
区切り、前記電力素子収納部とコネクタ収納部とに分
け、前記電力素子収納部にのみ電極間の絶縁性確保のた
め、ポッティング剤を収納し、熱硬化させる。従って、
前記コネクタ収納部には、ポッティング剤が侵入せず、
コネクタのケース内への収納及び着脱が容易に行える。As described above, in the semiconductor device in which the connector of the present invention is built in the case, the case is divided by the partition plate, and the power element housing portion and the connector housing portion are divided into the power element housing portion. In order to secure the insulation between the electrodes, the potting agent is stored and heat-cured. Therefore,
Potting agent does not enter the connector storage section,
The connector can be easily stored in and removed from the case.
【0026】又、前記仕切り板を介しての前記電力素子
収納部と、前記コネクタ収納部との間の電気接続が容易
な構造であるので、前記コネクタ収納部にコネクタを配
置するのに支障はない。Further, since the electric element storage portion and the connector storage portion can be easily electrically connected to each other through the partition plate, there is no obstacle in disposing the connector in the connector storage portion. Absent.
【0027】更に、前記コネクタの前記コネクタ収納部
への収納は、前記電力素子収納部へのポッティング剤な
どの熱硬化工程の後に、行うので、コネクタのハウジン
グの材料は耐熱性の低い材質のものであってもよく、材
質の選択の幅が大きいという利点を有する。Further, since the connector is housed in the connector housing portion after the thermosetting process of potting agent or the like in the power device housing portion, the connector housing is made of a material having low heat resistance. May be used, which has the advantage that the range of selection of materials is large.
【図1】本発明のコネクタをケース内に内蔵する半導体
装置の外観斜視図。FIG. 1 is an external perspective view of a semiconductor device having a connector according to the present invention built in a case.
【図2】本発明の半導体装置の第1の実施の態様を示
す、図1に示すII−II線矢視部分断面図。FIG. 2 is a partial cross-sectional view taken along the line II-II of FIG. 1, showing a first embodiment of the semiconductor device of the present invention.
【図3】本発明の半導体装置の第2の実施の態様を示
す、図1に示すIII −III 線矢視部分断面図。FIG. 3 is a partial cross-sectional view taken along the line III-III of FIG. 1, showing a second embodiment of the semiconductor device of the present invention.
【図4】本発明の半導体装置の第3の実施の態様を示
す、図1に示すIV−IV線矢視断部分面図。FIG. 4 is a partial cross-sectional view taken along the line IV-IV of FIG. 1, showing a third embodiment of the semiconductor device of the present invention.
【図5】本発明の半導体装置の第4の実施の態様を示
す、図1に示すV−V線矢視部分断面図。FIG. 5 is a partial cross-sectional view taken along the line VV of FIG. 1 showing a fourth embodiment of the semiconductor device of the present invention.
【図6】本発明の半導体装置の第5の実施の態様を示す
外観斜視図。FIG. 6 is an external perspective view showing a fifth embodiment of the semiconductor device of the present invention.
【図7】本発明の半導体装置の第6の実施の態様を示す
外観斜視図。FIG. 7 is an external perspective view showing a sixth embodiment of the semiconductor device of the present invention.
【図8】本発明の半導体装置の図7に示すVIII−VIII線
矢視部分断面図。FIG. 8 is a partial sectional view of the semiconductor device of the present invention taken along the line VIII-VIII shown in FIG.
【図9】従来の大電力半導体装置の一例を示す斜視図。FIG. 9 is a perspective view showing an example of a conventional high-power semiconductor device.
【図10】従来の大電力半導体装置の他の例を示す斜視
図。FIG. 10 is a perspective view showing another example of a conventional high-power semiconductor device.
308…電力素子収納部、309…コネクタ収納部、3
01…金属ベース、307…仕切り板、303…電力半
導体素子、305…電力端子、304…ケース、316
…導電体、317…コネクタ、310…ポッティング剤308 ... Power element storage section, 309 ... Connector storage section, 3
01 ... Metal base, 307 ... Partition plate, 303 ... Power semiconductor element, 305 ... Power terminal, 304 ... Case, 316
... conductor, 317 ... connector, 310 ... potting agent
Claims (6)
り、前記電力素子収納部は、金属ベースと、前記金属ベ
ースを囲み、前記電力素子収納部と前記コネクタ収納部
とを形成する仕切り板を有するケースと、前記電力素子
収納部に収納される金属ベース上の絶縁性基板に載置さ
れる少なくとも1個の、電極を有する電力半導体素子
と、前記絶縁性基板に支持体を介して支持されるホルダ
ー上に固定される複数の電力端子と、前記電力半導体素
子の絶縁性を確保のため前記ケース内に注入されるポッ
ティング剤と、前記コネクタ収納部に本体が収納され、
前記ケースを貫通して装着され一部が外部に連絡される
信号配線接続用コネクタと、前記仕切り板を挟んで前記
電力半導体素子と前記コネクタとを接続する接続手段
と、より成ることを特徴とするコネクタをケース内に内
蔵する半導体装置。1. A power supply device housing part and a connector housing part, wherein the power device housing part encloses the metal base and the metal base, and forms a partition plate which forms the power device housing part and the connector housing part. A case, an electric power semiconductor element having at least one electrode mounted on an insulating substrate on a metal base housed in the power element housing, and supported on the insulating substrate via a support. A plurality of power terminals fixed on the holder, a potting agent injected into the case for ensuring insulation of the power semiconductor element, and a main body stored in the connector storage portion,
A signal wiring connecting connector that is mounted through the case and is partially connected to the outside; and a connecting means that connects the power semiconductor element and the connector with the partition plate interposed therebetween. A semiconductor device with a built-in connector inside the case.
ティング剤の上に、更にエポキシ樹脂が注入されること
を特徴とする請求項1に記載のコネクタをケース内に内
蔵する半導体装置。2. A semiconductor device having a connector according to claim 1, wherein an epoxy resin is further injected on the potting agent injected into the power element housing portion.
された導電体と、前記導電体を通し、前記仕切り板を挟
んで前記電力半導体素子と前記コネクタとを接続する接
続線より成ることを特徴とする請求項1に記載のコネク
タをケース内に内蔵する半導体装置。3. The connecting means comprises a conductor molded in the partition plate, and a connecting wire for connecting the power semiconductor element and the connector through the conductor and sandwiching the partition plate. A semiconductor device having the connector according to claim 1 built in a case.
前記電力半導体素子と前記コネクタとを接続する接続線
より成ることを特徴とする請求項1に記載のコネクタを
ケース内に内蔵する半導体装置。4. The connecting means penetrates through the partition plate,
The semiconductor device having the connector according to claim 1 built in a case, comprising a connection line connecting the power semiconductor element and the connector.
記電力半導体素子と前記コネクタとを接続するフレキシ
ブルプリント基板より成ることを特徴とする請求項1に
記載のコネクタをケース内に内蔵する半導体装置。5. The connector according to claim 1, wherein the connecting means comprises a flexible printed circuit board that penetrates the partition plate and connects the power semiconductor element and the connector. Semiconductor device.
護回路が搭載されているプリント基板が収納されること
を特徴とする請求項1に記載のコネクタをケース内に内
蔵する半導体装置。6. A semiconductor device having a connector according to claim 1, wherein a printed circuit board on which a control unit and a protection circuit are mounted is further housed in the power element housing unit. .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7280773A JPH09120852A (en) | 1995-10-27 | 1995-10-27 | Semiconductor device with connector built in case |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7280773A JPH09120852A (en) | 1995-10-27 | 1995-10-27 | Semiconductor device with connector built in case |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH09120852A true JPH09120852A (en) | 1997-05-06 |
Family
ID=17629767
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7280773A Pending JPH09120852A (en) | 1995-10-27 | 1995-10-27 | Semiconductor device with connector built in case |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH09120852A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000245170A (en) * | 1999-02-22 | 2000-09-08 | Hitachi Ltd | Semiconductor module, power conversion device using the same and manufacture thereof |
WO2008093549A1 (en) * | 2007-02-02 | 2008-08-07 | Daikin, Industries, Ltd. | Substrate module |
US7458823B2 (en) | 2005-04-22 | 2008-12-02 | Denso Corporation | Electronic circuit device and manufacturing method of the same |
-
1995
- 1995-10-27 JP JP7280773A patent/JPH09120852A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000245170A (en) * | 1999-02-22 | 2000-09-08 | Hitachi Ltd | Semiconductor module, power conversion device using the same and manufacture thereof |
US7458823B2 (en) | 2005-04-22 | 2008-12-02 | Denso Corporation | Electronic circuit device and manufacturing method of the same |
US7604765B2 (en) | 2005-04-22 | 2009-10-20 | Denso Corporation | Electronic circuit device and manufacturing method of the same |
WO2008093549A1 (en) * | 2007-02-02 | 2008-08-07 | Daikin, Industries, Ltd. | Substrate module |
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