JPH09120078A - 液晶表示装置 - Google Patents

液晶表示装置

Info

Publication number
JPH09120078A
JPH09120078A JP27813095A JP27813095A JPH09120078A JP H09120078 A JPH09120078 A JP H09120078A JP 27813095 A JP27813095 A JP 27813095A JP 27813095 A JP27813095 A JP 27813095A JP H09120078 A JPH09120078 A JP H09120078A
Authority
JP
Japan
Prior art keywords
glass substrate
liquid crystal
crystal display
display device
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP27813095A
Other languages
English (en)
Inventor
Umimoto Morita
海幹 森田
Takao Minami
隆郎 南
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP27813095A priority Critical patent/JPH09120078A/ja
Publication of JPH09120078A publication Critical patent/JPH09120078A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/5442—Marks applied to semiconductor devices or parts comprising non digital, non alphanumeric information, e.g. symbols
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/061—Disposition
    • H01L2224/0612—Layout
    • H01L2224/0615—Mirror array, i.e. array having only a reflection symmetry, i.e. bilateral symmetry
    • H01L2224/06153—Mirror array, i.e. array having only a reflection symmetry, i.e. bilateral symmetry with a staggered arrangement, e.g. depopulated array
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/494—Connecting portions
    • H01L2224/4943—Connecting portions the connecting portions being staggered
    • H01L2224/49431—Connecting portions the connecting portions being staggered on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/494—Connecting portions
    • H01L2224/4943—Connecting portions the connecting portions being staggered
    • H01L2224/49433—Connecting portions the connecting portions being staggered outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Liquid Crystal (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】 【課題】駆動ＩＣのワイヤーボンデイング性能を増大さ
せ、高い信頼性を得るとともに、小型・軽量化および低
コスト化を達成した液晶表示装置。 【解決手段】下ガラス基板３に液晶を介して上ガラス基
板２を貼り合わせて表示領域４を設け、下ガラス基板３
の非表示領域９の貼り合わせ面上に駆動ＩＣ８ａ、８ｂ
を配するとともに、その非貼り合わせ面上に配線基板５
ａ、５ｂを固定し、駆動ＩＣ８ａ、８ｂの端子と配線基
板５ａ、５ｂの端子とをワイヤーボンデイング１２によ
り導電せしめた液晶表示装置１４。

Description

【発明の詳細な説明】
【０００１】
【発明の属する技術分野】本発明は液晶表示装置に関す
るものである。
【０００２】
【従来の技術】従来の液晶表示装置１を図４〜図６に示
すと、図４はその平面図、図５および図６はそれぞれ図
４に示すＡ領域の拡大平面図と拡大断面図である。
【０００３】液晶表示装置１においては、上ガラス基板
２と下ガラス基板３との間に液晶を封入し、それぞれの
内面には表示電極を相互に直交するように配列して表示
領域４を成し、下ガラス基板３には、それぞれの端面が
対向するようにプリント基板等の配線基板５を並設する
とともに、ステンレス等から成る金属プレート６の上に
下ガラス基板３と配線基板５とを接着用樹脂７により固
定している。また、駆動ＩＣ８が配線基板５と下ガラス
基板３の上に配列され、表示領域４の表示電極は下ガラ
ス基板３の非表示領域９に設けた出力側配線１０と接続
され、更に配線基板５上にはボンデイングパッド１１も
形成されている。そして、駆動ＩＣ８の端子は出力側配
線１０（出力側配線１０の一部がボンデイングパッドを
成している）およびボンデイングパッド１１の各端子と
ワイヤーボンデイング１２でもって接続されている。ま
た、１３はＩＣ搭載用もしくはＩＣ端子へのワイヤーボ
ンデイング用の座標認識用マーカーである。
【０００４】
【発明が解決しようとする課題】しかしながら、上記構
成の液晶表示装置１においては、配線基板５の平坦性が
劣っているので、配線基板５が金属プレート６から剥が
れたり、あるいは駆動ＩＣ８が配線基板５から剥がれ、
これによってワイヤーボンデイング１２が断線するとい
う問題点がある。
【０００５】また、下ガラス基板３や配線基板５は、双
方ともそれ以上に大きな寸法のマスターガラスやマスタ
ーガラエポ基板から切り出して供しているが、その切り
出しに当たって、所望通りのカット精度が得られないの
で、下ガラス基板３と配線基板５との端面同士の間隔を
０．１ｍｍ位にしている。
【０００６】したがって、このような間隔が生じること
によって、装置の小型化を更にむずかしくしている。
【０００７】しかも、薄くて小さいステンレス等から成
る金属プレート６の上に厚みのある大きな下ガラス基板
３と配線基板５とを接着用樹脂７により支持しているの
で、そのための固定が十分ではなく、過酷な環境下にお
かれると、歪みが生じるという問題点もある。
【０００８】更にまた、液晶表示装置１には、配線基板
５の他に金属プレート６も設けているので、その金属自
体の重さによって軽量化をむずかしくしており、未だ満
足し得る程度の軽量化にいたっていないという問題点も
ある。
【０００９】したがって本発明の目的は叙上の問題点を
解決して、駆動ＩＣのワイヤーボンデイング性能を増大
させ、高い信頼性を得るとともに、小型・軽量化および
低コスト化を達成した液晶表示装置を提供することにあ
る。
【００１０】
【課題を解決するための手段】本発明の液晶表示装置
は、大きな主面を有する一方のガラス基板に液晶を介し
て小さな主面を有する他方のガラス基板を貼り合わせて
表示領域を設け、一方のガラス基板の非表示領域の貼り
合わせ面上に駆動ＩＣを配するとともに、その非貼り合
わせ面上に配線基板を固定し、駆動ＩＣの端子と配線基
板の端子とをワイヤーボンデイングにより導電せしめた
ことを特徴とする。
【００１１】
【発明の実施の形態】本発明の液晶表示装置１４を図１
〜図３に示すと、図１はその平面図、図２は図１に示す
Ｂ領域の拡大平面図であり、図３はその拡大断面図であ
る。なお、従来の液晶表示装置１と同一部材には同一符
号を付す。
【００１２】液晶表示装置１４においては、コモン側の
ガラス基板である上ガラス基板２とセグメント側のガラ
ス基板である下ガラス基板３との間に封止剤（図示せ
ず）によって液晶（図示せず）を封入し、更に両ガラス
基板２、３を貼り合わせている。そして、上下ガラス基
板２、３のそれぞれの内面には表示電極と配向膜（共に
図示せず）を相互に直交するように配列して表示領域４
を成し、下ガラス基板３には表示領域４に対応して非表
示領域９も設けられている。
【００１３】また、下ガラス基板３の貼り合わせ面の非
表示領域９上には駆動ＩＣ８ａ、８ｂをエポキシ・シリ
コンの接着樹脂から成る接着層１５を介して固定してい
る。この固定部位は非表示領域９の端にする方が、非表
示領域９の幅が小さくなり、小型化を優位に達成するこ
とができる。
【００１４】更にまた、下ガラス基板３の非貼り合わせ
面（外側面）の非表示領域９上にプリント基板等の配線
基板５ａ、５ｂを接着樹脂層１６を介して設けている。
この接着樹脂層１６はテープ（たとえば日東電工（株）
製Ｎｏ．３１６１−Ｆ〔黒色片面テープ〕とＮｏ．５９
１５〔両面テープ〕）でもって貼り付け固定したもので
ある。
【００１５】上記配線基板５ａ、５ｂは、たとえば基板
内部に１種もしくは２種以上の配線層が形成できる多層
配線構造および／または両主面上に配線層を形成した構
造であって、駆動ＩＣ８ａ、８ｂの駆動に必要な電源や
信号線を擁したバスライン群を配線している。更に必要
に応じて電源、ロジック等の各系を層別に配線したり、
あるいは外部から供給される各種電源や信号の処理回路
を搭載してもよい。
【００１６】そして、この配線基板５ａ、５ｂはワイヤ
ボンデイングパッド１７が設けられ、表示領域４の表示
電極は下ガラス基板３の非表示領域９に設けた出力側配
線１０と接続しているので、駆動ＩＣ８ａ、８ｂの端子
は出力側配線１０のボンデイングパッド端子およびワイ
ヤボンデイングパッド１７とをＡｕ線でもってワイヤー
ボンデイング１２により接続されている。
【００１７】かくして上記液晶表示装置１４によれば、
平坦性に劣る配線基板５ａ、５ｂの上ではなくて、それ
に優れた下ガラス基板３上に駆動ＩＣ８ａ、８ｂを接着
固定しているので、これら駆動ＩＣ８ａ、８ｂが剥がれ
なくなる。
【００１８】また、従来の液晶表示装置１にて用いた金
属プレート６ならびに下ガラス基板３と配線基板５との
端面同士の間隔などを不要し、更に配線基板５ａ、５ｂ
を下ガラス基板３の非表示領域９に設けているので、装
置の小型化、軽量化ならびに低コスト化が達成できると
ともに、歪みが生じないように配線基板５ａ、５ｂを強
固に接合することができる。
【００１９】なお、本発明は上記実施形態例に限定され
るものではなく、本発明の要旨を逸脱しない範囲内で種
々の変更や改良等は何ら差し支えない。
【００２０】
【発明の効果】以上のように、本発明の液晶表示装置に
よれば、駆動ＩＣをガラス基板上に強固に接着して、更
に金属プレートを不要し、そして、配線基板を非表示領
域の外側に設けているので、駆動ＩＣのワイヤーボンデ
イング性能を増大させ、高い信頼性を得るとともに、小
型・軽量化および低コスト化を達成できる。
【図面の簡単な説明】
【図１】本発明の液晶表示装置の平面図である。
【図２】本発明の液晶表示装置の要部拡大図である。
【図３】本発明の液晶表示装置の要部拡大断面図であ
る。
【図４】従来の液晶表示装置の平面図である。
【図５】従来の液晶表示装置の要部拡大図である。
【図６】従来の液晶表示装置の要部拡大断面図である。
【符合の説明】
１、１４ 液晶表示装置 ２ 上ガラス基板 ３ 下ガラス基板 ４ 表示領域 ５、５ａ、５ｂ 配線基板 ８、８ａ、８ｂ 駆動ＩＣ ９ 非表示領域 １２ ワイヤーボンデイング

Claims (1)

    【特許請求の範囲】
  1. 【請求項１】 大きな主面を有する一方のガラス基板に
    液晶を介して小さな主面を有する他方のガラス基板を貼
    り合わせて表示領域を設け、一方のガラス基板の非表示
    領域の貼り合わせ面上に駆動ＩＣを配するとともに、そ
    の非貼り合わせ面上に配線基板を固定し、駆動ＩＣの端
    子と配線基板の端子とをワイヤーボンデイングにより導
    電せしめた液晶表示装置。
JP27813095A 1995-10-25 1995-10-25 液晶表示装置 Pending JPH09120078A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27813095A JPH09120078A (ja) 1995-10-25 1995-10-25 液晶表示装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27813095A JPH09120078A (ja) 1995-10-25 1995-10-25 液晶表示装置

Publications (1)

Publication Number Publication Date
JPH09120078A true JPH09120078A (ja) 1997-05-06

Family

ID=17593024

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27813095A Pending JPH09120078A (ja) 1995-10-25 1995-10-25 液晶表示装置

Country Status (1)

Country Link
JP (1) JPH09120078A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002021199A1 (fr) * 2000-09-08 2002-03-14 Citizen Watch Co., Ltd. Affichage a cristaux liquides
CN100428030C (zh) * 2004-11-09 2008-10-22 三星电子株式会社 液晶显示器驱动集成电路芯片及封装结构

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002021199A1 (fr) * 2000-09-08 2002-03-14 Citizen Watch Co., Ltd. Affichage a cristaux liquides
CN100428030C (zh) * 2004-11-09 2008-10-22 三星电子株式会社 液晶显示器驱动集成电路芯片及封装结构

Similar Documents

Publication Publication Date Title
KR100321883B1 (ko) 반도체소자의실장구조및실장방법과,액정표시장치
US6952250B2 (en) Pressure-welded structure of flexible circuit boards
KR20160092123A (ko) 표시 장치 및 그 제조 방법
JP2002373969A (ja) 半導体装置及び半導体装置の製造方法
JPH08138774A (ja) フレキシブル配線基板の接続構造
JP3658127B2 (ja) 表示装置
JPH09120078A (ja) 液晶表示装置
JP3217628B2 (ja) 液晶表示装置
JP3217633B2 (ja) 液晶表示装置
JP3199579B2 (ja) 液晶表示装置
JP2920843B2 (ja) 液晶表示装置
JP2828829B2 (ja) 液晶表示モジュール
JPS6016899Y2 (ja) 液晶表示装置
JPH0675240A (ja) 液晶表示装置
JP3261002B2 (ja) 液晶表示装置
JP3214996B2 (ja) 液晶表示装置の製造方法
JP3296626B2 (ja) 混成集積回路装置
KR100804524B1 (ko) 테이프 캐리어 패키지 및 이를 이용한 액정표시모듈
JPH048458Y2 (ja)
JPH0827595B2 (ja) 表示装置
JPS60208734A (ja) 液晶表示装置
JPH10123554A (ja) 液晶表示装置
JPH01237685A (ja) 液晶表示装置
JPH04220623A (ja) 液晶表示装置
TW546514B (en) Liquid crystal display module structure