JPH09118986A - Electroless gold plating bath and electroless gold plating method - Google Patents
Electroless gold plating bath and electroless gold plating methodInfo
- Publication number
- JPH09118986A JPH09118986A JP29918795A JP29918795A JPH09118986A JP H09118986 A JPH09118986 A JP H09118986A JP 29918795 A JP29918795 A JP 29918795A JP 29918795 A JP29918795 A JP 29918795A JP H09118986 A JPH09118986 A JP H09118986A
- Authority
- JP
- Japan
- Prior art keywords
- gold plating
- gold
- electroless
- plating bath
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、プリント配線基板
や電子工業部品等に金めっき皮膜を形成する場合に好適
に使用される無電解金めっき浴及び無電解金めっき方法
に関し、更に詳述すると、被めっき物表面に金めっき皮
膜の厚付けを行う際、赤みのないめっき外観を得ること
ができる無電解金めっき浴及び無電解金めっき方法に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electroless gold plating bath and an electroless gold plating method, which are preferably used when a gold plating film is formed on a printed wiring board, electronic industrial parts, etc. The present invention relates to an electroless gold plating bath and a method for electroless gold plating that can obtain a plating appearance without redness when a thick gold plating film is applied to the surface of an object to be plated.
【０００２】[0002]
【従来の技術及び発明が解決しようとする課題】従来よ
り、無電解金めっきは、金の電気伝導性、熱圧着による
接続性等の物理的性質及び耐酸化性、耐薬品性等の点か
らプリント配線基板、セラミックＩＣパッケージ、ＩＴ
Ｏ基板、ＩＣカード等の電子工業部品の表面に適用され
ている。ここで、従来は、厚付けが可能な無電解金めっ
き浴は強アルカリ性浴しかなく、被めっき物が耐アルカ
リ性のものしか適用し得ないものであった。そのため、
樹脂部品や有機レジストを使用するプリント基板業界に
おいて、中性又は弱アルカリ性の無電解厚付け金めっき
浴が望まれており、本発明者はこれら事情を鑑み、先に
特願平６−１５１４４９号によって、めっき浴を中性領
域としても、被めっき物表面に金めっき皮膜の厚付けが
可能で、かつ液安定性に優れ、安定な金析出皮膜特性を
有し、工業的に有利に使用することができる無電解金め
っき浴及び無電解金めっき方法を提案している。2. Description of the Related Art Electroless gold plating has hitherto been used in view of physical properties such as electrical conductivity of gold, connectivity by thermocompression bonding, oxidation resistance and chemical resistance. Printed wiring board, ceramic IC package, IT
It is applied to the surface of electronic industrial parts such as O substrates and IC cards. Here, conventionally, the electroless gold plating bath capable of thickening is only a strong alkaline bath, and only an alkaline resistant one can be applied to the plated object. for that reason,
In the printed circuit board industry using resin parts and organic resists, a neutral or weakly alkaline electroless thick plating gold plating bath is desired, and in view of these circumstances, the present inventor has previously proposed Japanese Patent Application No. 6-151449. Even if the plating bath is used as a neutral region, it is possible to apply a thick gold plating film on the surface of the object to be plated, has excellent liquid stability, has stable gold deposition film characteristics, and is used industrially advantageously. It proposes an electroless gold plating bath and a method of electroless gold plating.
【０００３】ところで、無電解金めっき浴で厚付けを行
う場合、被めっき物の表面皮膜が赤くなることがある。
このようなめっき皮膜はボンディング性が悪いとされる
上、金の中の赤みを帯びることは外観的に良い印象を与
えるものではない。By the way, when thickening is performed in an electroless gold plating bath, the surface film of the object to be plated may become red.
Such a plating film is considered to have poor bonding properties, and the reddish tint in gold does not give a good appearance.
【０００４】本発明は上記事情に鑑みなされたもので、
被めっき物に良好な皮膜の厚付けを行うことができる共
に、得られた皮膜表面が赤くなることなく良好な外観を
有する無電解金めっき浴及び無電解金めっき方法を提供
することを目的とする。[0004] The present invention has been made in view of the above circumstances,
An object of the present invention is to provide an electroless gold plating bath and a method for electroless gold plating, which can perform a good film thickening on an object to be plated and which has a good appearance without the obtained film surface becoming red. To do.
【０００５】[0005]
【課題を解決するための手段及び発明の実施の形態】本
発明者は、上記目的を達成するために鋭意検討を行った
結果、金原料、錯化剤を含有する無電解金めっき浴中に
酸アミド及び／又は酸イミドを加えてめっきを行うこと
により、被めっき物表面に金めっき皮膜の厚付けを行う
ことができ、しかも、厚付けされた皮膜は赤みを生じる
事なく外観も良好であることを見い出した。またこの場
合、厚付け用のめっき浴に酸アミドや酸イミドを添加す
るだけではなく、被めっき物を無電解ストライク金めっ
きした後、厚付けの無電解金めっきを行う場合、この無
電解厚付け用金めっき浴に酸アミドや酸イミドを添加せ
ず、無電解ストライク金めっき浴に酸アミドや酸イミド
を添加した場合も、厚付け用金めっき皮膜に赤みを生じ
させることがないことを知見し、本発明をなすに至っ
た。Means for Solving the Problems and Modes for Carrying Out the Invention As a result of intensive studies to achieve the above object, the present inventor has found that an electroless gold plating bath containing a gold raw material and a complexing agent is used. By adding acid amide and / or acid imide to perform plating, a gold plating film can be thickened on the surface of the object to be plated, and the thickened film has a good appearance without causing redness. I found something. In addition, in this case, when not only adding acid amide or acid imide to the plating bath for thickening, but also performing electroless strike gold plating on the object to be plated and then performing electroless gold plating for thickening, this electroless thickness Even if acid amide or acid imide is not added to the plating gold plating bath and acid amide or acid imide is added to the electroless strike gold plating bath, redness does not occur in the gold plating film for thickening. They found out the present invention and made the present invention.
【０００６】従って、本発明は、（１）金原料及び錯化
剤を含有する無電解金めっき浴に酸アミド及び／又は酸
イミド化合物を添加したことを特徴とする無電解金めっ
き浴、（２）上記めっき浴中に被めっき物を浸漬して無
電解金めっきを行うことを特徴とする無電解金めっき方
法、及び（３）被めっき物を金原料及び錯化剤を含有す
る無電解ストライク金めっき浴に浸漬し、金薄膜を形成
した後、金原料及び錯化剤を含有する無電解厚付け用金
めっき浴に浸漬して金めっき膜を形成するに当り、上記
無電解ストライク金めっき浴及び無電解厚付け用金めっ
き浴の一方又は双方に酸アミド及び／又は酸イミド化合
物を添加したことを特徴とする無電解金めっき方法を提
供する。Therefore, according to the present invention, (1) an electroless gold plating bath characterized in that an acid amide and / or an acid imide compound is added to an electroless gold plating bath containing a gold raw material and a complexing agent, 2) An electroless gold plating method characterized by immersing an object to be plated in the above plating bath to perform electroless gold plating, and (3) an electroless method in which the object to be plated contains a gold raw material and a complexing agent. In order to form a gold plating film by dipping in a strike gold plating bath to form a gold thin film and then dipping in a gold plating bath for electroless thickening containing a gold raw material and a complexing agent, the above electroless strike gold is used. Provided is an electroless gold plating method characterized in that an acid amide and / or an acid imide compound is added to one or both of a plating bath and an electroless thick gold plating bath.
【０００７】以下、本発明につき更に詳しく説明する
と、本発明の無電解金めっき浴に使用される金原料は、
通常の金めっき浴に使用される金原料でよく、例えば、
シアン化金塩、亜硫酸金塩、チオ硫酸金塩等を使用する
ことができ、特にシアン化金カリウムを好適に使用する
ことができる。この場合、金原料の配合量は特に限定さ
れるものではないが、金濃度として０．５〜１０ｇ／
Ｌ、特に１〜５ｇ／Ｌとすることが好ましい。この場
合、金原料の配合量、即ちめっき浴中の金イオン濃度に
ほぼ比例してめっき速度が増大するが、１０ｇ／Ｌを超
えるとめっき速度は増大するものの、めっき浴の安定性
に劣る場合がある。一方、金濃度が０．５ｇ／Ｌ未満で
あると、めっき速度が非常に小さくなってしまう場合が
生じる。The present invention will be described in more detail below. The gold raw material used in the electroless gold plating bath of the present invention is
It may be a gold raw material used in a normal gold plating bath, for example,
Gold cyanide, gold sulfite, gold thiosulfate and the like can be used, and potassium gold cyanide can be particularly preferably used. In this case, the compounding amount of the gold raw material is not particularly limited, but the gold concentration is 0.5 to 10 g /
L, particularly preferably 1 to 5 g / L. In this case, the plating rate increases almost in proportion to the amount of the gold raw material mixed, that is, the concentration of gold ions in the plating bath. If the plating rate exceeds 10 g / L, the plating rate increases but the stability of the plating bath is poor. There is. On the other hand, if the gold concentration is less than 0.5 g / L, the plating rate may be extremely low.
【０００８】次に、上記無電解金めっき浴に配合する錯
化剤も公知のものを使用することができる。具体的に
は、硫酸アンモニウム、アミノカルボン酸塩、カルボン
酸塩、ヒドロキシカルボン酸塩等を使用することがで
き、通常５〜３００ｇ／Ｌ、特に１０〜２００ｇ／Ｌの
範囲で配合することが好ましく、５ｇ／Ｌ未満では錯化
剤としても効果が不十分となり、液安定性に欠ける場合
があり、また３００ｇ／Ｌを超える量を添加しても効果
はあまり上がらず、不経済である。Next, a known complexing agent may be used as the complexing agent to be blended with the electroless gold plating bath. Specifically, ammonium sulfate, aminocarboxylate, carboxylate, hydroxycarboxylate and the like can be used, and it is usually preferable to add 5 to 300 g / L, particularly 10 to 200 g / L, If it is less than 5 g / L, the effect as a complexing agent may be insufficient and the liquid stability may be insufficient, and if the amount exceeds 300 g / L, the effect may not be improved so much and it is uneconomical.
【０００９】また、還元剤としてチオ硫酸塩、ヒドラジ
ン、アスコルビン酸塩などを配合することができる。こ
の場合、チオ硫酸塩としては、チオ硫酸アンモニウム、
チオ硫酸ナトリウム、チオ硫酸カリウム等が好適に用い
られ、このチオ硫酸塩還元剤が放出する電子により、め
っき浴中の金イオンが被めっき物に析出させることがで
きる。上記還元剤はその１種を単独で用いても２種以上
を併用してもよい。As the reducing agent, thiosulfate, hydrazine, ascorbate and the like can be added. In this case, as the thiosulfate, ammonium thiosulfate,
Sodium thiosulfate, potassium thiosulfate and the like are preferably used, and gold ions in the plating bath can be deposited on the object to be plated by the electrons emitted by the thiosulfate reducing agent. The reducing agents may be used alone or in combination of two or more.
【００１０】還元剤の配合量は特に制限されるものでは
ないが、通常０．１〜１０ｇ／Ｌ、特に０．３〜５ｇ／
Ｌとすることが好ましい。この場合、還元剤の濃度にほ
ぼ比例してめっき速度が増大するが、１０ｇ／Ｌを超え
る量を添加してもめっき速度は余り大きくならず、むし
ろ液安定性が劣化する場合がある。一方、還元剤の配合
量が０．１ｇ／Ｌ未満であると、めっき速度が非常に小
さくなってしまう場合がある。The compounding amount of the reducing agent is not particularly limited, but is usually 0.1 to 10 g / L, particularly 0.3 to 5 g / L.
It is preferably L. In this case, the plating rate increases almost in proportion to the concentration of the reducing agent, but even if the amount exceeds 10 g / L, the plating rate does not increase so much, and rather the liquid stability may deteriorate. On the other hand, if the reducing agent content is less than 0.1 g / L, the plating rate may be extremely low.
【００１１】本発明の無電解金めっき浴は上記金原料及
び錯化剤を含有してなるめっき浴に酸アミド及び／又は
酸イミドを添加するものでこれよって、被めっき物に皮
膜形成した際、得られた皮膜の表面に赤みを生じること
なく良好な外観を得られるものである。The electroless gold plating bath of the present invention is one in which an acid amide and / or an acid imide is added to the plating bath containing the above-mentioned gold raw material and complexing agent. A good appearance can be obtained without causing redness on the surface of the obtained film.
【００１２】この場合、酸アミドとしては、具体的には
ホルムアミド、ジメチルホルムアミド、アセトアミド、
プロピルアミド、ブチルアミド、アクリルアミド、Ｎ，
Ｎ−ジアクリルアミド、ラクトアミド、グルタミン、ピ
ログルタミン酸、ベンズアミド、ベンゼンスルホンアミ
ド等を挙げることができ、また、酸イミドとしては、ス
クシンイミド、グルタルイミド、サッカリン等が挙げら
れる。In this case, as the acid amide, specifically, formamide, dimethylformamide, acetamide,
Propylamide, butyramide, acrylamide, N,
N-diacrylamide, lactoamide, glutamine, pyroglutamic acid, benzamide, benzenesulfonamide and the like can be mentioned, and as the acid imide, succinimide, glutarimide, saccharin and the like can be mentioned.
【００１３】上記酸アミド及び／又は酸イミドの配合量
は特に制限されるものではないが、通常０．１〜５０ｇ
／Ｌ、特に０．２〜１０ｇ／Ｌの範囲で配合することが
好ましく、０．１ｇ／Ｌ未満では本発明の効果が得られ
ない場合があり、５０ｇ／Ｌを超えると密着不良になる
場合がある。The amount of the above-mentioned acid amide and / or acid imide is not particularly limited, but is usually 0.1 to 50 g.
/ L, particularly preferably in the range of 0.2 to 10 g / L. If the amount is less than 0.1 g / L, the effect of the present invention may not be obtained, and if it exceeds 50 g / L, poor adhesion may result. There is.
【００１４】なお、本発明の無電解金めっき浴は更に必
要に応じて上記成分に加えてリン酸塩、亜リン酸塩、カ
ルボン酸塩等のｐＨ調整剤、Ｔｌ，Ａｓ，Ｐｂ等の結晶
調整剤その他の各種添加剤を適宜混合して使用すること
ができる。The electroless gold plating bath of the present invention may further contain, in addition to the above components, a pH adjusting agent such as phosphate, phosphite or carboxylate and crystals of Tl, As, Pb or the like. A regulator and various other additives can be used by appropriately mixing them.
【００１５】本発明のめっき浴は中性付近で使用される
ものであり、通常ｐＨ３．５〜９、より好ましくはｐＨ
４〜９の範囲で使用することが推奨される。The plating bath of the present invention is used in the vicinity of neutrality, and usually has a pH of 3.5 to 9, more preferably pH.
It is recommended to use in the range of 4-9.
【００１６】ここで、上記無電解金めっき浴は厚付け用
として使用されるものであるが、本発明の無電解金めっ
き方法は、上記無電解金めっき浴を用いる以外は常法に
従って行うことができ、直接被めっき物に皮膜形成を行
うこともできるが、特に、厚付けめっきを行う際には、
ストライク無電解金めっきを行ってから厚付け無電解金
めっきを行うことが好ましく、ストライク無電解金めっ
きを行うことによって、被めっき物に厚付け金めっきの
下地調整を行うことができ、厚付けする際に、被めっき
物との密着、膜厚分布を均一にすることができ、良好に
皮膜形成することができる。Here, the electroless gold plating bath is used for thickening, but the electroless gold plating method of the present invention is carried out by a conventional method except that the electroless gold plating bath is used. It is possible to form a film directly on the object to be plated, but especially when performing thick plating.
It is preferable to perform strike electroless gold plating before thickening electroless gold plating.By performing strike electroless gold plating, the underlayer of thick gold plating can be adjusted on the object to be plated. In doing so, the adhesion with the object to be plated and the film thickness distribution can be made uniform, and a film can be formed satisfactorily.
【００１７】ここで、無電解金めっきをストライク及び
厚付けの２段階で行う場合には、上記酸アミド及び／又
は酸イミドはどちらかのめっき浴、或いは双方のめっき
浴中に共に添加してもよい。Here, when the electroless gold plating is performed in two steps of strike and thickening, the above acid amide and / or acid imide is added to either plating bath or both plating baths. Good.
【００１８】この場合、ストライク金めっき浴の組成
は、上記金原料を金濃度として０．５〜１０ｇ／Ｌ、特
に１〜５ｇ／Ｌとし、ＥＤＴＡ及びそのアルカリ金属
塩、その他上述した錯化剤を５〜３００ｇ／Ｌ、特に１
０〜２００ｇ／Ｌ配合し、ｐＨを３．５〜９としたもの
とすることができる。また、このストライク金めっき浴
への酸アミド、酸イミドの配合量は上記と同様にするこ
とができる。In this case, the composition of the strike gold plating bath is such that the gold raw material has a gold concentration of 0.5 to 10 g / L, particularly 1 to 5 g / L, and EDTA and its alkali metal salt and other complexing agents described above. 5 to 300 g / L, especially 1
It is possible to add 0 to 200 g / L and adjust the pH to 3.5 to 9. The amount of acid amide and acid imide compounded in the strike gold plating bath can be the same as above.
【００１９】なお、被めっき物には、例えば、ニッケル
又はニッケル合金又はこれらの皮膜を表面に有する被め
っき物が有効であり、ニッケルを触媒として還元剤を効
果的に酸化すると共に、金原料を還元して良好な金めっ
き皮膜が形成される。As the object to be plated, for example, an object to be plated having nickel or a nickel alloy or a film of these on the surface is effective, and the reducing agent is effectively oxidized with nickel as a catalyst, and the gold raw material is used. It is reduced to form a good gold plating film.
【００２０】上記ニッケル又はニッケル合金皮膜は、電
気ニッケルめっき又は無電解ニッケルめっきの手法或い
は気相めっき法により被めっき物に形成することがで
き、その厚さは特に制限されないが、通常０．１μｍ以
上であればよく、被めっき物の使用目的に応じて適宜選
定される。なお、ニッケル合金としては、Ｎｉ−Ｐ、Ｎ
ｉ−Ｂ、Ｎｉ−Ｃｏ、Ｎｉ−Ｆｅ等が挙げられ、ニッケ
ル量５０重量％以上、特に８０重量％以上のものであ
る。The nickel or nickel alloy film can be formed on the object to be plated by a method of electro nickel plating or electroless nickel plating or a vapor phase plating method, and the thickness thereof is not particularly limited, but is usually 0.1 μm. The above is sufficient, and is appropriately selected according to the purpose of use of the object to be plated. As the nickel alloy, Ni-P, N
i-B, Ni-Co, Ni-Fe, etc. are mentioned, and the amount of nickel is 50% by weight or more, especially 80% by weight or more.
【００２１】本発明の無電解金めっきを行う場合、その
被めっき物の表面は上記のようにニッケル又はニッケル
合金皮膜である場合に限られず、その上に例えば公知の
方法により置換金めっき皮膜を形成したものでもよい。When the electroless gold plating of the present invention is performed, the surface of the object to be plated is not limited to the nickel or nickel alloy film as described above, and a displacement gold plating film may be formed thereon by a known method. It may be formed.
【００２２】上記無電解金めっき浴を用いて金めっきを
行う場合、めっき温度（液温）は、ストライクめっき浴
では、２０〜９５℃、特に３０〜９０℃で、通常０．５
〜３０分、特に１〜１５分とすることが好ましく、次い
で行う無電解厚付け用金めっき浴では２０〜９５℃、特
に５０〜９０℃で、通常１〜６０分、特に５〜４０分と
することが好ましく、めっき液の温度が５０℃未満だと
めっき速度が遅く、厚付けの場合、生産性が悪くなり不
経済であり、９５℃を超えるとめっき液が分解するおそ
れがある。When gold plating is performed using the above electroless gold plating bath, the plating temperature (solution temperature) is 20 to 95 ° C., especially 30 to 90 ° C. in the strike plating bath, and usually 0.5.
-30 minutes, especially 1 to 15 minutes is preferable, and in the electroless thickening gold plating bath to be performed next, at 20 to 95 ° C, especially 50 to 90 ° C, usually 1 to 60 minutes, especially 5 to 40 minutes. If the temperature of the plating solution is less than 50 ° C., the plating rate is slow, and in the case of thick coating, productivity is poor and uneconomical. If it exceeds 95 ° C., the plating solution may decompose.
【００２３】また、被めっき物に直接無電解厚付け用金
めっきを行う場合には、めっき浴の温度は５０〜９５
℃、特に７０〜９０℃とすることが好ましく、５０℃未
満ではめっき速度が非常に小さくなる場合があり、９５
℃を超えるとめっき速度は大きくなるが、金析出皮膜特
性の安定性が乏しくなる場合がある。When the electroless thick plating gold is directly applied to the object to be plated, the temperature of the plating bath is 50 to 95.
C., particularly 70 to 90.degree. C., and if the temperature is less than 50.degree. C., the plating rate may become extremely low.
If the temperature exceeds ℃, the plating rate will increase, but the stability of the gold deposition film characteristics may be poor.
【００２４】なお、直接被めっき物にめっきを行う場合
には、通常９０℃のめっき温度において３０分で０．６
μｍの皮膜を得ることができる。When the object to be plated is directly plated, it is usually 0.6 in 30 minutes at a plating temperature of 90.degree.
A μm film can be obtained.
【００２５】また、撹拌を行うことは差し支えなく、更
にガスピットの発生を防止するため被めっき物をハンマ
ー等で叩く機構を設けることが好ましく、更にあけ替え
瀘過、循環瀘過を行うこともでき、特に瀘過器でめっき
浴を循環瀘過することが好ましく、これによりめっき浴
の温度むらを防止し、且つめっき浴中の固形ゴミを瀘過
することができる。この場合、激しくめっき浴を撹拌す
るとめっき速度が減少する傾向があり、このため撹拌、
被めっき物の謡動及び瀘過によるめっき浴の循環はあま
り激しく行わないことが好ましい。Further, stirring may be carried out, and it is preferable to provide a mechanism for hitting the object to be plated with a hammer or the like in order to prevent the generation of gas pits. Further, it is possible to carry out filtration after replacement and circulation filtration. In particular, it is preferable to circulate and filter the plating bath with a filter, so that the temperature unevenness of the plating bath can be prevented and the solid dust in the plating bath can be filtered. In this case, if the plating bath is vigorously stirred, the plating rate tends to decrease.
Circulation of the plating bath due to movement and filtration of the object to be plated is preferably not so vigorous.
【００２６】更に、めっき浴中に空気を導入することも
でき、これによりめっき浴中に金コロイド粒子或いは金
粒子が発生するのをより有効に防止することができる。
空気の導入は、めっき浴中に空気を吹き込むことにより
行うことができ、めっき浴の撹拌操作として空気撹拌を
採用することにより空気導入を行ってもまた撹拌操作と
は別に空気の吹き込みを行ってもよい。Further, air can be introduced into the plating bath, which can more effectively prevent generation of gold colloid particles or gold particles in the plating bath.
The air can be introduced by blowing air into the plating bath, and even if the air is introduced by adopting air stirring as the stirring operation of the plating bath, the air can be blown separately from the stirring operation. Good.
【００２７】[0027]
【発明の効果】以上説明したように、本発明の無電解金
めっき浴によれば、被めっき物表面に金めっき皮膜の厚
付けを行うことができ、しかもこの場合、厚付けであっ
ても赤みが生じることなく良好な外観を付与することが
できる。As described above, according to the electroless gold plating bath of the present invention, a gold plating film can be thickened on the surface of the object to be plated, and in this case, even if thickening is performed. A good appearance can be provided without causing redness.
【００２８】[0028]
【実施例】以下、実施例を示して本発明を具体的に説明
するが、本発明は下記実施例に制限されるものではな
い。EXAMPLES The present invention will be specifically described below with reference to examples, but the present invention is not limited to the following examples.
【００２９】銅板の表面に次亜リン酸ナトリウムを還元
剤とする無電解ニッケルめっき浴「ニムデンＳＸ」（上
村工業株式会社製、商品名）により無電解ニッケル皮膜
を５μｍ形成し、更にその上に置換金めっき浴「デグサ
オールナ５１１」（デグサ社製、商品名）による置換金
めっき皮膜を０．０５μｍ形成した試料に、下記組成の
ストライク無電解金めっき浴、厚付け無電解金めっき浴
を順に用い、表１に示す配合量のグルタミンと共に下記
めっき条件で無電解めっきを施した後、めっき皮膜の外
観を調べた。結果を表１に示す。ストライク無電解金めっき ＫＡｕ（ＣＮ）2 １．５ｇ／Ｌ （Ａｕ １．０ｇ／Ｌ） ＥＤＴＡ・２Ｎａ ５．０ｇ／Ｌ クエン酸・２Ｋ ３０．０ｇ／Ｌ グリコール酸・ＮＨ4 ２０．０ｇ／Ｌ ｐＨ ７ 温度 ９０℃ 時間 ７分厚付け無電解金めっき ＫＡｕ（ＣＮ）2 ５．９ｇ／Ｌ （Ａｕ ４．０ｇ／Ｌ） 硫酸アンモニウム ２００ｇ／Ｌ チオ硫酸ナトリウム ０．５ｇ／Ｌ リン酸アンモニウム ５．０ｇ／Ｌ ｐＨ ６ 温度 ９０℃ 時間 １５分An electroless nickel film of 5 μm was formed on the surface of a copper plate by an electroless nickel plating bath "Nimden SX" (trade name, manufactured by Uemura Kogyo Co., Ltd.) using sodium hypophosphite as a reducing agent, and further formed thereon. A strike electroless gold plating bath having the following composition and a thick electroless gold plating bath were used in order on a sample having a displacement gold plating film of 0.05 μm formed by the displacement gold plating bath “Degussa Orna 511” (trade name, manufactured by Degussa). After performing electroless plating under the following plating conditions together with the amounts of glutamine shown in Table 1, the appearance of the plating film was examined. Table 1 shows the results. Strike electroless gold plating KAu (CN) 2 1.5g / L (Au 1.0g / L) EDTA ・ 2Na 5.0g / L citric acid ・ 2K 30.0g / L glycolic acid ・ NH 4 20.0g / L pH 7 temperature 90 ° C. time 7 minutes thick layer electroless gold plating KAu (CN) 2 5.9g / L (Au 4.0g / L) ammonium sulfate 200 g / L of sodium thiosulfate 0.5 g / L ammonium phosphate 5.0g / L pH 6 temperature 90 ° C time 15 minutes
【００３０】[0030]
【表１】 [Table 1]
Claims (3)
っき浴に酸アミド及び／又は酸イミド化合物を添加した
ことを特徴とする無電解金めっき浴。1. An electroless gold plating bath, wherein an acid amide and / or an acid imide compound is added to an electroless gold plating bath containing a gold raw material and a complexing agent.
を浸漬して無電解金めっきを行うことを特徴とする無電
解金めっき方法。2. An electroless gold plating method, which comprises immersing an object to be plated in the plating bath according to claim 1 to perform electroless gold plating.
る無電解ストライク金めっき浴に浸漬し、金薄膜を形成
した後、金原料及び錯化剤を含有する無電解厚付け用金
めっき浴に浸漬して金めっき膜を形成するに当り、上記
無電解ストライク金めっき浴及び無電解厚付け用金めっ
き浴の一方又は双方に酸アミド及び／又は酸イミド化合
物を添加したことを特徴とする無電解金めっき方法。3. An electroless thickening gold containing a gold raw material and a complexing agent after a gold thin film is formed by immersing an object to be plated in an electroless strike gold plating bath containing a gold raw material and a complexing agent. In forming a gold plating film by immersing in a plating bath, an acid amide and / or acid imide compound is added to one or both of the above electroless strike gold plating bath and electroless thickening gold plating bath. And an electroless gold plating method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29918795A JP3175562B2 (en) | 1995-10-23 | 1995-10-23 | Electroless gold plating bath and electroless gold plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29918795A JP3175562B2 (en) | 1995-10-23 | 1995-10-23 | Electroless gold plating bath and electroless gold plating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09118986A true JPH09118986A (en) | 1997-05-06 |
| JP3175562B2 JP3175562B2 (en) | 2001-06-11 |
Family
ID=17869276
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29918795A Expired - Fee Related JP3175562B2 (en) | 1995-10-23 | 1995-10-23 | Electroless gold plating bath and electroless gold plating method |
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| Country | Link |
|---|---|
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007023324A (en) * | 2005-07-14 | 2007-02-01 | Kanto Chem Co Inc | Electroless hard gold plating liquid |
| JP2010255010A (en) * | 2009-04-21 | 2010-11-11 | C Uyemura & Co Ltd | Electroless gold plating bath |
| KR102292210B1 (en) * | 2020-12-31 | 2021-08-25 | (주)엠케이켐앤텍 | Non-cyanide electroless gold plating method and composition for electroless gold plating |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101626027B1 (en) * | 2015-07-23 | 2016-05-31 | 김진용 | display apparatus |
| KR102171093B1 (en) * | 2018-11-23 | 2020-10-28 | 유귀인 | Length adjustable flashlight |
-
1995
- 1995-10-23 JP JP29918795A patent/JP3175562B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007023324A (en) * | 2005-07-14 | 2007-02-01 | Kanto Chem Co Inc | Electroless hard gold plating liquid |
| JP2010255010A (en) * | 2009-04-21 | 2010-11-11 | C Uyemura & Co Ltd | Electroless gold plating bath |
| KR102292210B1 (en) * | 2020-12-31 | 2021-08-25 | (주)엠케이켐앤텍 | Non-cyanide electroless gold plating method and composition for electroless gold plating |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3175562B2 (en) | 2001-06-11 |
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