JPH05295558A - High-speed substitutional electroless gold plating solution - Google Patents
High-speed substitutional electroless gold plating solutionInfo
- Publication number
- JPH05295558A JPH05295558A JP9827692A JP9827692A JPH05295558A JP H05295558 A JPH05295558 A JP H05295558A JP 9827692 A JP9827692 A JP 9827692A JP 9827692 A JP9827692 A JP 9827692A JP H05295558 A JPH05295558 A JP H05295558A
- Authority
- JP
- Japan
- Prior art keywords
- gold
- plating
- gold plating
- plating solution
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、高速置換型無電解金め
っき液に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a rapid displacement type electroless gold plating solution.
【０００２】[0002]
【従来技術とその問題点】置換型金めっき方法は、エレ
クトロニクス分野で使用されている無電解金めっき方法
の中の一つであり、銅、ニッケル、パラジウム、銀、
鉄、真鍮等の素地金属との電位差を利用して析出を行な
うものである。この方法によると、素地金属が完全に金
で覆われた段階で反応が停止するため、０．３μｍ程度
以下の膜厚のめっきしか得られない。そこで、０．５〜
数μｍ程度の膜厚のめっきを必要とする場合には、自己
触媒型無電解金めっき方法が行なわれる。この自己触媒
型無電解めっき方法では、めっき液中の金イオンを還元
剤により金属金に還元できるので、厚付けの金めっきを
高速で行なうことが可能である。2. Description of the Related Art The substitutional gold plating method is one of electroless gold plating methods used in the electronics field, and includes copper, nickel, palladium, silver,
Precipitation is carried out by utilizing the potential difference with a base metal such as iron or brass. According to this method, the reaction is stopped when the base metal is completely covered with gold, so that only a plating film having a thickness of about 0.3 μm or less can be obtained. Therefore, 0.5 ~
When plating with a film thickness of about several μm is required, an autocatalytic electroless gold plating method is performed. In this self-catalytic electroless plating method, the gold ions in the plating solution can be reduced to metallic gold by the reducing agent, so that thick gold plating can be performed at high speed.
【０００３】しかしながら、自己触媒型無電解金めっき
液では、強アルカリ性条件で使用されるものが多く、こ
の場合には素地金属或いは非めっき部分が腐食されてし
まうおそれがある。自己触媒型無電解金めっき液の中で
も中性領域で使用できるものもあるが、これらのめっき
液は安定性に欠けるため、数時間しか使用することがで
きず、それ故所望の膜厚のめっき皮膜を得ることは実際
上困難である。他方、上記金めっき以外にも、無電解パ
ラジウムめっき上にストライク金めっきを施す方法があ
るが、この方法では形成されるめっき皮膜の厚さが不安
定で一定しないことが多く、０．１μｍの膜厚を得るこ
とも困難な場合がある。However, many self-catalytic electroless gold plating solutions are used under strong alkaline conditions, and in this case, the base metal or non-plated part may be corroded. Some autocatalytic electroless gold plating solutions can be used in the neutral range, but these plating solutions lack stability and can only be used for a few hours. Obtaining a film is practically difficult. On the other hand, in addition to the above gold plating, there is a method of performing strike gold plating on electroless palladium plating. However, in this method, the thickness of the plating film formed is often unstable and inconsistent. It may be difficult to obtain a film thickness.
【０００４】[0004]
【発明が解決しようとする課題】本発明は、中性のｐＨ
領域で安定して所望の膜厚のめっき皮膜を得ることがで
きる高速置換型無電解金めっき液を提供することを主な
目的とする。SUMMARY OF THE INVENTION The present invention is directed to a neutral pH.
It is a main object to provide a high-speed substitution type electroless gold plating solution that can stably obtain a plating film having a desired film thickness in a region.
【０００５】[0005]
【課題を解決するための手段】本発明者は、上記問題点
に鑑み鋭意研究した結果、一定の成分からなる置換型金
めっき液にタリウム化合物を含む置換型無電解金めっき
液を用いる場合には、予想外にも中性領域で優れた皮膜
形成能を発揮できることを見出し、本発明を完成するに
至った。As a result of intensive studies in view of the above problems, the present inventor has found that when a substitutional electroless gold plating solution containing a thallium compound is used in a substitutional gold plating solution consisting of certain components. Unexpectedly found that they can exhibit an excellent film-forming ability in the neutral region, and completed the present invention.
【０００６】即ち、本発明は、金塩、錯形成剤及びｐＨ
調整剤を含む置換型無電解金めっき液において、タリウ
ム化合物が含有されていることを特徴とする高速置換型
無電解金めっき液。That is, the present invention relates to a gold salt, a complexing agent and a pH.
A high-speed substitution type electroless gold plating solution comprising a thallium compound in a substitution type electroless gold plating solution containing an adjusting agent.
【０００７】以下、本発明について詳細に説明する。The present invention will be described in detail below.
【０００８】本発明のめっき液の成分であるタリウム化
合物としては、水に可溶性のものであればその種類は限
定されず、例えば硫酸タリウム、硝酸タリウム、酸化タ
リウム、塩化タリウム、マロン酸タリウム等の各種化合
物を用いることができる。その使用量は通常０．００１
〜１０ｇ／ｌ程度、好ましくは０．０１〜５ｇ／ｌ程度
とするのが良い。The type of thallium compound which is a component of the plating solution of the present invention is not limited as long as it is soluble in water, and examples thereof include thallium sulfate, thallium nitrate, thallium oxide, thallium chloride and thallium malonate. Various compounds can be used. The amount used is usually 0.001
It is about 10 to 10 g / l, preferably about 0.01 to 5 g / l.
【０００９】金塩としては、公知のめっき液で金供給源
として用いられているものをそのまま使用することがで
きる。具体的には、例えばジシアノ金（Ｉ）カリウム、
ジシアノ金（Ｉ）ナトリウム、ジシアノ金（Ｉ）アンモ
ニウム等のジシアノ金（Ｉ）錯塩、テトラシアノ金 (II
I)カリウム、テトラシアノ金 (III)ナトリウム、テトラ
シアノ金 (III)アンモニウム等のテトラシアノ金 (III)
錯塩、シアン化金、テトラクロロ金 (III)酸、テトラク
ロロ金 (III)酸、テトラクロロ金 (III)ナトリウム等の
テトラクロロ金 (III)化合物、亜硫酸金ナトリウム等の
亜硫酸金塩、酸化金、水酸化金及びこれらのアルカリ金
属塩等が挙げられる。めっき液中での金イオン濃度は、
めっき液の溶解度、めっき作業効率、所望の析出速度等
によって異なり一様ではないが、通常０．３〜２０ｇ／
ｌ程度、好ましくは１〜５ｇ／ｌ程度とする。As the gold salt, a known plating solution used as a gold supply source can be used as it is. Specifically, for example, potassium dicyanogold (I),
Dicyano gold (I) sodium salt, dicyano gold (I) ammonium salt, etc., dicyano gold (I) complex salt, tetracyano gold (II)
I) Tetracyanogold (III) such as potassium, tetracyanogold (III) sodium, tetracyanogold (III) ammonium
Complex salts, gold cyanide, tetrachloroauric (III) acid, tetrachloroauric (III) acid, tetrachloroauric (III) compounds such as sodium tetrachloroauric (III), gold sulfite such as sodium gold sulfite, gold oxide , Gold hydroxide and their alkali metal salts. The gold ion concentration in the plating solution is
It varies depending on the solubility of the plating solution, the plating work efficiency, the desired deposition rate, etc., but is not uniform, but is usually 0.3 to 20 g /
It is about 1 and preferably about 1 to 5 g / l.
【００１０】錯形成剤としても、公知のめっき液で汎用
されているものが使用できる。具体的には、リン酸、ホ
ウ酸、ポリリン酸、或いはクエン酸、酒石酸、リンゴ
酸、フタル酸等のカルボン酸並びにその誘導体及びその
塩類、エチレンジアミン、トリエタノールアミン等のア
ミン化合物、ＥＤＴＡ（エチレンジアミン四酢酸）、Ｎ
ＴＡ（ニトリロ三酢酸）等のアミノカルボン酸及びその
誘導体、ＡＴＭＰ（アミノトリメチレンホスホン酸）等
のアミノスルホン酸及びその誘導体等が例示できる。こ
れらは単独で使用しても良く、或いは二種以上を併用し
ても良い。配合量は通常５〜２００ｇ／ｌ程度、好まし
くは１０〜１００ｇ／ｌ程度である。尚、錯形成剤は、
めっきされる下地の素材によって適宜選択すれば良い。As the complex-forming agent, those commonly used in known plating solutions can be used. Specifically, phosphoric acid, boric acid, polyphosphoric acid, or carboxylic acids such as citric acid, tartaric acid, malic acid, and phthalic acid and their derivatives and salts thereof, amine compounds such as ethylenediamine and triethanolamine, EDTA (ethylenediamine tetracarboxylic acid). Acetic acid), N
Examples thereof include aminocarboxylic acids such as TA (nitrilotriacetic acid) and derivatives thereof, and aminosulfonic acids such as ATMP (aminotrimethylenephosphonic acid) and derivatives thereof. These may be used alone or in combination of two or more. The compounding amount is usually about 5 to 200 g / l, preferably about 10 to 100 g / l. The complexing agent is
It may be appropriately selected depending on the material of the base to be plated.
【００１１】ｐＨ調整剤としては、公知のめっき液で使
用されている水酸化カリウム、水酸化ナトリウム等の水
酸化アルカリ或いは水酸化アンモニウム等の化合物、硫
酸、リン酸、ホウ酸等の鉱酸、クエン酸、酒石酸、乳酸
等の有機酸等を使用することができる。これらのｐＨ調
整剤は、ｐＨの緩衝剤として溶解度限度内で過剰に添加
することもできる。また、アンモニア水を用いる場合に
は、ｐＨの調整と同時に錯形成剤としても作用し、めっ
きを促進する効果も得られる。As the pH adjuster, compounds such as potassium hydroxide and sodium hydroxide, which are used in known plating solutions, such as alkali hydroxide or ammonium hydroxide, and sulfuric acid, phosphoric acid, boric acid and other mineral acids, Organic acids such as citric acid, tartaric acid and lactic acid can be used. These pH adjusters can also be added in excess within the solubility limits as pH buffers. When ammonia water is used, it also acts as a complexing agent at the same time as the pH is adjusted, and the effect of promoting plating can be obtained.
【００１２】本発明のめっき液には、必要に応じて、金
イオンの安定性を保つための物質を添加しても良い。こ
のような物質としてはシアン化カリウム、シアン化ナト
リウム、シアン化アンモニウム等のシアン化合物、亜硫
酸ナトリウム、亜硫酸カリウム、亜硫酸アンモニウム等
の亜硫酸イオンを供給できる物質等を例示できる。めっ
き液中での濃度は、金錯体を形成するのに必要な濃度或
いは安定化するために過剰に加えることもできる。If necessary, a substance for maintaining the stability of gold ions may be added to the plating solution of the present invention. Examples of such substances include cyanide compounds such as potassium cyanide, sodium cyanide and ammonium cyanide, and substances capable of supplying sulfite ions such as sodium sulfite, potassium sulfite and ammonium sulfite. The concentration in the plating solution may be the concentration required to form the gold complex or may be added in excess for stabilization.
【００１３】以上の成分からなる本発明の金めっき液を
中性ｐＨ領域下で用い、常法に従ってめっき処理すれば
金めっき皮膜が得られる。この場合、めっき温度は用い
る被めっき素材、金塩等にもよるが通常５５〜９５℃程
度の範囲内で用いるのが好ましい。A gold plating film can be obtained by using the gold plating solution of the present invention having the above components in a neutral pH range and performing a plating treatment according to a conventional method. In this case, the plating temperature depends on the material to be plated, the gold salt, etc., but it is usually preferable to use it within the range of about 55 to 95 ° C.
【００１４】本発明の金めっき液が適用できる素材とし
ては、金と電位差が生じるような金属乃至合金であれば
良く、例えばニッケル、ニッケル合金、パラジウム、パ
ラジウム合金、銅、銀、鉄等の金よりも卑なる金属等に
好適である。The material to which the gold plating solution of the present invention can be applied may be any metal or alloy capable of producing a potential difference with gold, for example, gold such as nickel, nickel alloy, palladium, palladium alloy, copper, silver and iron. It is suitable for less base metals and the like.
【００１５】[0015]
【発明の効果】本発明のタリウム化合物を含有する高速
置換型無電解金めっき液によれば、めっき液の安定性を
損なうことなく中性ｐＨ領域で所望の厚さの金めっき皮
膜を得ることができる。従って、アルカリ又は酸に弱い
レジスト塗布プリント配線基板、窒化アルミニウム等に
も容易に金めっきを施すことが可能となる。The high-speed substitution type electroless gold plating solution containing the thallium compound of the present invention can obtain a gold plating film having a desired thickness in the neutral pH range without impairing the stability of the plating solution. You can Therefore, it becomes possible to easily perform gold plating on a resist-coated printed circuit board, aluminum nitride, etc., which are weak against alkalis or acids.
【００１６】また同時に、めっき速度も大幅に改善でき
るので、その作業性の向上も図ることができる。At the same time, since the plating rate can be greatly improved, the workability can be improved.
【００１７】[0017]
【実施例】以下に実施例及び比較例を示し、本発明の特
徴とするところをより一層明瞭にする。尚、実施例及び
比較例におけるめっき皮膜厚さは、ケイ光Ｘ線微小部膜
厚計（「ＳＦＴ−８０００」セイコー電子工業（株）
製）により測定した。EXAMPLES Examples and comparative examples will be shown below to further clarify the characteristics of the present invention. The thickness of the plating film in the examples and comparative examples was measured by a fluorescent X-ray micro-part thickness gauge (“SFT-8000”, Seiko Electronic Industry Co., Ltd.).
Manufactured).
【００１８】実施例１ 表１に示す組成の液をアンモニア水でｐＨ６として高速
置換型無電解金めっき液を調製した。Example 1 A liquid having the composition shown in Table 1 was adjusted to pH 6 with aqueous ammonia to prepare a rapid displacement electroless gold plating liquid.
【００１９】 表 １ 組 成 濃 度（ｇ／ｌ） シアン化金カリウム ５ クエン酸アンモニウム ２０ ＥＤＴＡ．２Ｎａ １０ 硫酸タリウム ２（金属Ｔｌとして） 次いで、銅パターン化されたプリント配線基板５ｃｍ×
１０ｃｍ（めっき有効面積３０ｃｍ2 ）を４枚用意し、
これらを脱脂し、２００ｇ／ｌ過硫酸アンモニウム液に
てソフトエッチングを行ない、次いで１０％硫酸水溶液
でスマット除去した。続いて、１００ｍｌ／ｌ塩酸で活
性化を行ない、触媒を付与した後、無電解ニッケル−リ
ン合金めっき液（「ＩＰＣニコロンＵ」奥野製薬工業
（株）製）により無電解ニッケルめっきを行なった。こ
れにより膜厚５μｍのニッケルめっき皮膜を得た。Table 1 Composition Concentration (g / l) Potassium gold cyanide 5 Ammonium citrate 20 EDTA. 2Na 10 thallium sulfate 2 (as metal Tl) then copper patterned printed wiring board 5 cm ×
Prepare 4 pieces of 10 cm (plating effective area 30 cm 2 ),
These were degreased, soft-etched with a 200 g / l ammonium persulfate solution, and then smut-removed with a 10% sulfuric acid aqueous solution. Then, activation was performed with 100 ml / l hydrochloric acid to apply a catalyst, and then electroless nickel plating was performed with an electroless nickel-phosphorus alloy plating solution (“IPC Nicoron U”, manufactured by Okuno Chemical Industries Co., Ltd.). As a result, a nickel plating film having a film thickness of 5 μm was obtained.
【００２０】次いで、プリント配線基板を上記金めっき
液に８５℃で浸漬し、ニッケルめっき皮膜の上に金めっ
き皮膜を形成させた。その浸漬時間とめっき膜厚との関
係を表２に示す。Next, the printed wiring board was immersed in the above gold plating solution at 85 ° C. to form a gold plating film on the nickel plating film. Table 2 shows the relationship between the immersion time and the plating film thickness.
【００２１】 得られた金めっきの純度は９９．９％以上で目的の部分
以外のめっきのはみだし、腐食等は認められなかった。[0021] The purity of the obtained gold plating was 99.9% or more, and the plating other than the target portion was not exposed and no corrosion or the like was observed.
【００２２】実施例２ プリント配線基板に、実施例１と同様にして無電解ニッ
ケルめっきを施した後、無電解パラジウムめっき（「ム
デンノーブルＰＤ」奥野製薬工業（株）製を使用）を膜
厚１μｍで形成させた。次いで、これを実施例１の金め
っき液に１時間浸漬した。その結果、０．１５μｍの金
めっき皮膜が得られた。Example 2 A printed wiring board was subjected to electroless nickel plating in the same manner as in Example 1, and then electroless palladium plating (“Muden Noble PD” manufactured by Okuno Chemical Industries Co., Ltd.) was used to form a film having a thickness of 1 μm. Was formed. Then, this was immersed in the gold plating solution of Example 1 for 1 hour. As a result, a 0.15 μm gold plating film was obtained.
【００２３】この金めっきの純度は９９．９％以上であ
り、また半田付け性及びボンディング性能も良好であっ
た。The purity of this gold plating was 99.9% or more, and the solderability and the bonding performance were good.
【００２４】実施例３ 表３に示す組成の液をクエン酸でｐＨ６．５とした高速
置換型無電解金めっき液を調製した。Example 3 A high-speed substitution type electroless gold plating solution having a composition shown in Table 3 adjusted to pH 6.5 with citric acid was prepared.
【００２５】 表 ３ 組 成 濃 度（ｇ／ｌ） 亜硫酸金カリウム ５ 亜硫酸ナトリウム ２０ クエン酸アンモニウム １０ エチレンジアミン ２０ 硫酸タリウム ０．４（金属Ｔｌとして） 次いで、銅パターン化されたプリント配線基板５ｃｍ×
１０ｃｍ（めっき有効面積３０ｃｍ2 ）を４枚用意し、
これらを脱脂し、２００ｇ／ｌ過硫酸アンモニウム液に
てソフトエッチングを行ない、次いで１０％硫酸水溶液
でスマット除去した。続いて、１００ｍｌ／ｌ塩酸で活
性化を行ない、触媒を付与した後、無電解ニッケル−リ
ン合金めっき液（「ＩＰＣニコロンＵ」奥野製薬工業
（株）製）により無電解ニッケルめっきを行なった。こ
れにより膜厚５μｍのニッケルめっき皮膜を得た。Table 3 Composition Concentration (g / l) Potassium gold sulfite 5 Sodium sulfite 20 Ammonium citrate 10 Ethylenediamine 20 Thallium sulfate 0.4 (as metal Tl) Then, copper-patterned printed wiring board 5 cm ×
Prepare 4 pieces of 10 cm (plating effective area 30 cm 2 ),
These were degreased, soft-etched with a 200 g / l ammonium persulfate solution, and then smut-removed with a 10% sulfuric acid aqueous solution. Then, activation was performed with 100 ml / l hydrochloric acid to apply a catalyst, and then electroless nickel plating was performed with an electroless nickel-phosphorus alloy plating solution (“IPC Nicoron U”, manufactured by Okuno Chemical Industries Co., Ltd.). As a result, a nickel plating film having a film thickness of 5 μm was obtained.
【００２６】次いで、上記金めっき液に８５℃で浸漬
し、上記ニッケルめっき皮膜の上に金めっき皮膜を形成
させた。その浸漬時間とめっき膜厚との関係を表４に示
す。Then, it was dipped in the gold plating solution at 85 ° C. to form a gold plating film on the nickel plating film. Table 4 shows the relationship between the immersion time and the plating film thickness.
【００２７】 得られた金めっきの純度は９９．９％以上で目的の部分
以外のめっきのはみだし、腐食等は認められなかった。[0027] The purity of the obtained gold plating was 99.9% or more, and the plating other than the target portion was not exposed and no corrosion or the like was observed.
【００２８】実施例４ 硫酸タリウムの代わりに硝酸タリウムを金属タリウムと
して２ｇ／ｌ使用する以外は、実施例１と同様にして無
電解金めっきを行なった。その浸漬時間とめっき膜厚と
の関係を表５に示す。Example 4 Electroless gold plating was carried out in the same manner as in Example 1 except that thallium nitrate was used as metal thallium in an amount of 2 g / l instead of thallium sulfate. Table 5 shows the relationship between the immersion time and the plating film thickness.
【００２９】 得られた金めっきの純度は９９．９％以上で目的の部分
以外のめっきのはみだし、腐食等は認められなかった。[0029] The purity of the obtained gold plating was 99.9% or more, and the plating other than the target portion was not exposed and no corrosion or the like was observed.
【００３０】実施例５ 硫酸タリウムの代わりにマロン酸タリウムを金属タリウ
ムとして２ｇ／ｌ使用する以外は、実施例１と同様にし
て無電解金めっきを行なった。その浸漬時間とめっき膜
厚との関係を表６に示す。Example 5 Electroless gold plating was carried out in the same manner as in Example 1 except that thallium malonate was used as metal thallium in an amount of 2 g / l instead of thallium sulfate. Table 6 shows the relationship between the immersion time and the plating film thickness.
【００３１】 得られた金めっきの純度は９９．９％以上で目的の部分
以外のめっきのはみだし、腐食等は認められなかった。[0031] The purity of the obtained gold plating was 99.9% or more, and the plating other than the target portion was not exposed and no corrosion or the like was observed.
【００３２】比較例１ 実施例１の無電解金めっき液で硫酸タリウムを含まない
ものをアンモニア水でｐＨ６とした金めっき液を調製し
た。Comparative Example 1 A gold plating solution was prepared by changing the electroless gold plating solution of Example 1 containing no thallium sulfate to pH 6 with ammonia water.
【００３３】上記めっき液を９０℃に加熱し、実施例１
のニッケルめっきされたプリント配線基板及び実施例２
のパラジウムめっきされたプリント配線基板を浸漬し、
無電解金めっきを行なった。その結果を表７に示す。The above plating solution was heated to 90 ° C. to obtain Example 1
Nickel-plated printed wiring board and Example 2
Immerse the palladium-plated printed wiring board in
Electroless gold plating was performed. The results are shown in Table 7.
【００３４】 表 ７ 基板 浸漬時間 めっき皮膜（μｍ） 実施例１基板 １時間 ０．３ 実施例１基板 ２４時間 ０．５ 実施例２基板 １時間 ０．０５ 比較例２ 実施例３の無電解金めっき液で硫酸タリウムを含まない
ものをクエン酸でｐＨ６．５とした金めっき液を調製し
た。Table 7 Substrate Immersion Time Plating Film (μm) Example 1 Substrate 1 hour 0.3 Example 1 Substrate 24 hours 0.5 Example 2 Substrate 1 hour 0.05 Comparative Example 2 Electroless gold of Example 3 A gold plating solution was prepared by adjusting a plating solution containing no thallium sulfate to pH 6.5 with citric acid.
【００３５】上記めっき液を９０℃に加熱し、実施例３
と同様にしてニッケルめっきされたプリント配線基板を
浸漬し、無電解金めっきを行なった。その結果を表８に
示す。The above plating solution was heated to 90 ° C. to obtain Example 3
Similarly to the above, the nickel-plated printed wiring board was immersed and electroless gold plating was performed. The results are shown in Table 8.
【００３６】 [0036]
Claims (1)
型無電解金めっき液において、タリウム化合物が含有さ
れていることを特徴とする高速置換型無電解金めっき
液。1. A high-speed substitution type electroless gold plating solution comprising a thallium compound in a substitution type electroless gold plating solution containing a gold salt, a complexing agent and a pH adjusting agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9827692A JPH05295558A (en) | 1992-04-17 | 1992-04-17 | High-speed substitutional electroless gold plating solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9827692A JPH05295558A (en) | 1992-04-17 | 1992-04-17 | High-speed substitutional electroless gold plating solution |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05295558A true JPH05295558A (en) | 1993-11-09 |
Family
ID=14215422
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9827692A Pending JPH05295558A (en) | 1992-04-17 | 1992-04-17 | High-speed substitutional electroless gold plating solution |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05295558A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003013248A (en) * | 2001-07-02 | 2003-01-15 | Learonal Japan Inc | Electroless gold plating solution and method for electroless plating gold |
| US6767392B2 (en) | 2001-06-29 | 2004-07-27 | Electroplating Engineers Of Japan Limited | Displacement gold plating solution |
| JP2005146410A (en) * | 2003-10-22 | 2005-06-09 | Kanto Chem Co Inc | Electroless gold plating liquid |
| KR101036376B1 (en) * | 2008-11-03 | 2011-05-23 | 삼성전기주식회사 | Apparatus and method for controlling of concentration of electroless plating bath |
| WO2016031723A1 (en) * | 2014-08-25 | 2016-03-03 | 小島化学薬品株式会社 | Reduction-type electroless gold plating solution and electroless gold plating method using said plating solution |
-
1992
- 1992-04-17 JP JP9827692A patent/JPH05295558A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6767392B2 (en) | 2001-06-29 | 2004-07-27 | Electroplating Engineers Of Japan Limited | Displacement gold plating solution |
| JP2003013248A (en) * | 2001-07-02 | 2003-01-15 | Learonal Japan Inc | Electroless gold plating solution and method for electroless plating gold |
| JP2005146410A (en) * | 2003-10-22 | 2005-06-09 | Kanto Chem Co Inc | Electroless gold plating liquid |
| JP4603320B2 (en) * | 2003-10-22 | 2010-12-22 | 関東化学株式会社 | Electroless gold plating solution |
| KR101036376B1 (en) * | 2008-11-03 | 2011-05-23 | 삼성전기주식회사 | Apparatus and method for controlling of concentration of electroless plating bath |
| WO2016031723A1 (en) * | 2014-08-25 | 2016-03-03 | 小島化学薬品株式会社 | Reduction-type electroless gold plating solution and electroless gold plating method using said plating solution |
| JP6017726B2 (en) * | 2014-08-25 | 2016-11-02 | 小島化学薬品株式会社 | Reduced electroless gold plating solution and electroless gold plating method using the plating solution |
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