JPH09117815A - Outline machining device and outline machining method using the device - Google Patents
Outline machining device and outline machining method using the deviceInfo
- Publication number
- JPH09117815A JPH09117815A JP7277423A JP27742395A JPH09117815A JP H09117815 A JPH09117815 A JP H09117815A JP 7277423 A JP7277423 A JP 7277423A JP 27742395 A JP27742395 A JP 27742395A JP H09117815 A JPH09117815 A JP H09117815A
- Authority
- JP
- Japan
- Prior art keywords
- drill
- cutting
- substrate
- pressure foot
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Milling Processes (AREA)
- Drilling And Boring (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は回転する工具と基板
が相対移動することによって基板を外形加工するプリン
ト配線板などの外形加工装置およびそれを用いた外形加
工方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an outer shape processing apparatus such as a printed wiring board for outer shape processing of a substrate by relative movement of a rotating tool and the substrate, and an outer shape processing method using the same.
【０００２】[0002]
【従来の技術】一般に、プリント配線板の外形加工は金
型で打ち抜く方法と回転する工具により切削しながら工
具と基板を相対的に移動しながら所望する形状に切削す
る方法がある。2. Description of the Related Art Generally, there are a method of punching with a die and a method of cutting a printed wiring board into a desired shape while relatively moving the tool and the board while cutting the board with a rotating tool.
【０００３】以下に従来の切削によるプリント配線板の
外形加工方法と外形加工装置について図４、図５を用い
て説明する。A conventional method and a device for processing a contour of a printed wiring board by cutting will be described below with reference to FIGS. 4 and 5.
【０００４】図４、図５において、２１は所定の大きさ
に切断された銅張積層板（図示せず）に貫通穴を形成
し、導体層および絶縁層で形成された基板、２２はプリ
ント配線板、２３はスピンドル、２４はドリル（加工用
刃具、ドリル、カッタ、ルータービット、エンドミル等
の工具を代表してドリルと表現する）、２５はプレッシ
ャフット、２６は排気除塵口、２７は加工テーブル、２
８は下板、２９は固定ピン、３０ａは切り粉、３０ｂは
溶着した切り粉、３１ａは角穴、３１ｂは長穴、３１ｃ
はミシン目などのスリット、３１ｄは外形部である。In FIGS. 4 and 5, reference numeral 21 denotes a board formed by forming through holes in a copper clad laminate (not shown) cut into a predetermined size, and a board formed of a conductor layer and an insulating layer, and 22 is a print. Wiring board, 23 is a spindle, 24 is a drill (a tool such as a cutting tool, a drill, a cutter, a router bit, and an end mill is represented as a drill), 25 is a pressure foot, 26 is an exhaust dust removing port, and 27 is processing. Table, 2
8 is a lower plate, 29 is a fixed pin, 30a is cutting powder, 30b is welded cutting powder, 31a is a square hole, 31b is a long hole, 31c
Is a slit such as perforations, and 31d is an outer shape portion.
【０００５】図４において、外形加工装置の加工テーブ
ル２７上にフェノール材の下板２８を載置し、その上に
基板２１を３枚重ねて載置し、固定ピン２９で３ヵ所を
固定する。加工に際し、プレッシャフット２５で切削部
の周辺を押さえ、プレッシャフット２５の中心を毎分４
０，０００回転で回転するスピンドル２３に取り付けら
れたドリル２４を下降し、基板２１を切削しながらあら
かじめ入力した外形形状に沿って加工テーブル２７がＸ
−Ｙ（紙面に垂直）方向に相対送り速度３０ｃｍ／分で
動きながら基板２１を所望する形状に外形加工したの
ち、プリント配線板２２を得る。In FIG. 4, a lower plate 28 of a phenolic material is placed on a processing table 27 of the outer shape processing device, three substrates 21 are placed on top of the lower plate 28, and fixing pins 29 fix the three places. . When processing, press the periphery of the cutting part with the pressure foot 25 and move the center of the pressure foot 25 to 4
A drill 24 attached to a spindle 23 that rotates at 10,000 rotations is lowered to cut the substrate 21 while the machining table 27 is moved along the external shape that is input in advance.
The printed wiring board 22 is obtained after the substrate 21 is externally processed into a desired shape while moving in the −Y (perpendicular to the paper) direction at a relative feed speed of 30 cm / min.
【０００６】外形加工の際に生じる切り粉３０ａは、プ
レッシャフット２５内から排気除塵口２６より除塵され
ていく。一方、切削部に残った切り粉３０ａは外形加工
終了後、プリント配線板２２を外形加工装置から取り外
したとき図５に示すように、角穴３１ａ、長穴３１ｂ、
ミシン目などのスリット３１ｃ、外形部３１ｄには切り
粉３０ａや溶着した切り粉３０ｂが残っており、部品実
装時に切り粉が脱落し導体ランド等に付着するとはんだ
付け性を低下させるという問題があった。The chips 30a generated during the outer shape machining are removed from the pressure foot 25 through the exhaust dust removal port 26. On the other hand, when the printed wiring board 22 is removed from the outer shape processing device after the outer shape processing is completed, the cutting chips 30a remaining in the cutting portion have square holes 31a, elongated holes 31b,
There is a problem that the cutting powder 30a and the welded cutting powder 30b remain in the slits 31c such as perforations and the outer shape portion 31d, and if the cutting powder comes off during the component mounting and adheres to the conductor land or the like, the solderability is deteriorated. It was
【０００７】[0007]
【発明が解決しようとする課題】上記従来の方法では、
プレッシャフット２５内の切り粉３０ａを排気除塵口２
６への除塵が効率的にできるようにするためのものであ
り、切削部の切り粉３０ａを除去できるものではない。
したがって、従来は外形加工終了後のプリント配線板２
２の切り粉３０ａの除去作業を別途行う必要があった。In the above conventional method,
Exhaust dust removal port 2 for cutting chips 30a in the pressure foot 25
It is intended to efficiently remove dust to the 6 and cannot remove the cutting powder 30a in the cutting portion.
Therefore, conventionally, the printed wiring board 2 after the outer shape processing is completed
It was necessary to separately perform the work of removing the second cutting powder 30a.
【０００８】すなわち、ブラシやエアーガンを用いて切
り粉３０ａを除去するが、図５に示すような角穴３１
ａ、長穴３１ｂ、ミシン目などのスリット３１ｃには、
切削時の回転するドリル２４と相対移動する基板２１の
切削部に多量の切り粉３０ａが発生し、１枚目の基板上
方の舞い上がった切り粉３０ａは排気除塵口２６の吸気
により除塵されるが、１枚目下方および２乃至３枚目で
発生し排気除塵口２６で吸気できずに残留した切り粉３
０ａはドリル２４が回転しながら相対移動する際にドリ
ル２４と基板２１の加工壁面に巻き込まれる。That is, the chips 30a are removed by using a brush or an air gun, but the square holes 31 as shown in FIG.
a, slot 31b, slit 31c such as perforations,
A large amount of cutting dust 30a is generated in the cutting portion of the substrate 21 that moves relative to the rotating drill 24 during cutting, and the rising cutting dust 30a above the first substrate is removed by the intake air from the exhaust dust removal port 26. Cutting chips 3 which were generated on the lower side of the first sheet and on the second to third sheets and could not be sucked into the exhaust dust removal port 26 and remained.
0a is caught in the processed wall surface of the drill 24 and the substrate 21 when the drill 24 relatively moves while rotating.
【０００９】この場合切削による摩擦熱は局所的に１３
０〜１５０℃に昇温しているため、ガラス転移点１１０
〜１２０℃の基材では基板２１の加工壁面に溶着した状
態で切り粉３０ｂとして残る場合があり、上記の除去作
業で完全に除去することは困難であった。その際、一般
には先端が鋭利なピン状の工具を用いて除去作業を行う
が、これらの作業には１サイクル１０〜２０分の作業時
間を要しており生産性を著しく低下させていた。In this case, frictional heat generated by cutting is locally 13
Since the temperature is raised to 0 to 150 ° C., the glass transition point 110
In the case of a base material of 120 ° C., it may remain as the cutting powder 30b in a state of being welded to the processed wall surface of the substrate 21, and it was difficult to completely remove it by the above removing work. At that time, generally, the removal work is performed using a pin-shaped tool having a sharp tip, but these works require a work time of 10 to 20 minutes per cycle, which significantly lowers the productivity.
【００１０】また、従来では切削部で発生した切り粉を
加工テーブルの側から集塵する方法（特開平２−２３２
９８９号公報）が開示されているが、この方法では切削
時に舞い上がった切り粉を基板の下側から集塵するには
有効であるが摩擦熱により溶着した切り粉を除去するの
は困難であった。Further, conventionally, a method of collecting the cutting dust generated in the cutting portion from the side of the processing table (Japanese Patent Laid-Open No. 2-232).
No. 989) is disclosed, this method is effective for collecting the cutting chips that have risen up during cutting from the lower side of the substrate, but it is difficult to remove the cutting chips that have been welded by frictional heat. It was
【００１１】本発明は上記従来の問題点を解決するもの
で、外形加工時に発生する切り粉を完全にかつ効率的に
除去することを目的とする外形加工装置およびそれを用
いた外形加工方法を提供することである。The present invention solves the above-mentioned conventional problems, and provides a contour processing apparatus and a contour processing method using the contour processing apparatus for completely and efficiently removing chips generated during contour processing. Is to provide.
【００１２】[0012]
【課題を解決するための手段】この目的を達成するため
に本発明は、基板が水平に載置される加工テーブルと、
プレッシャフットの中心を回転するスピンドルに取り付
けられたドリルが水平方向に相対的に移動しながら基板
を加工する外形加工装置において、プレッシャフットの
下面にドリルと基板の切削部の両方に対して直接気体を
噴射する噴射口を配置した外形加工装置を用いて切り粉
を確実に除去しながらプリント配線板を外形加工するも
のである。To achieve this object, the present invention provides a processing table on which a substrate is placed horizontally,
In an external processing device that processes a substrate while a drill mounted on a spindle that rotates around the center of the pressure foot moves relatively in the horizontal direction, a gas is directly applied to both the drill and the cutting part of the substrate on the lower surface of the pressure foot. The external shape processing device is provided with an injection port for injecting to remove the cutting chips surely and externally processes the printed wiring board.
【００１３】[0013]
【発明の実施の形態】本発明の請求項１記載の発明は、
基板が水平に載置される加工テーブルと、プレッシャフ
ットの中心を回転するスピンドルに取り付けられたドリ
ルが水平方向に相対的に移動しながら基板を加工する外
形加工装置において、プレッシャフットの下面にドリル
と基板の切削部の両方に対して直接気体を噴射する噴射
口を配置したプリント配線板の外形加工装置としたもの
であり、切削部およびドリルに気体を直接噴射すること
ができ、外形加工時に発生する切り粉を確実に除去でき
ることになる。BEST MODE FOR CARRYING OUT THE INVENTION The invention according to claim 1 of the present invention is
In the external processing device that processes the board while the board mounted horizontally and the drill mounted on the spindle that rotates the center of the pressure foot move relatively in the horizontal direction, drill on the bottom surface of the pressure foot. It is an external processing device for printed wiring boards that has an injection port that directly injects gas to both the cutting part and the cutting part of the board.It is possible to directly inject gas to the cutting part and the drill. The generated cutting chips can be reliably removed.
【００１４】請求項２に記載の発明は、加工テーブルに
基板が水平に載置され、プレッシャフットの中心を回転
するスピンドルに取り付けたドリルが水平方向に相対的
に移動しながら基板の外形を加工する外形加工方法にお
いて、プレッシャフットの下面でドリルと基板の切削部
の両方に対して直接気体を噴射する外形加工方法とした
ものであり、切削部およびドリルに気体を直接噴射する
ことによって切り粉の除去を効果的に行え、高品質なプ
リント配線板が得られるという作用を有する。According to a second aspect of the present invention, the substrate is placed horizontally on the processing table, and the outer shape of the substrate is processed while the drill attached to the spindle rotating the center of the pressure foot relatively moves in the horizontal direction. The outer shape processing method is to directly inject gas to both the drill and the cutting portion of the substrate on the lower surface of the pressure foot. Can be effectively removed and a high quality printed wiring board can be obtained.
【００１５】請求項３に記載の発明は、冷却した気体を
噴射する請求項２記載の外形加工方法としたものであ
り、冷却した気体を直接噴射することによりスピンドル
および切削部を冷却することができることから、切削時
の熱による基板の樹脂の溶着を防止するという作用を有
している。The invention described in claim 3 is the outer shape processing method according to claim 2 in which a cooled gas is injected, and the spindle and the cutting portion can be cooled by directly injecting the cooled gas. Therefore, it has an effect of preventing the resin of the substrate from being welded by the heat during cutting.
【００１６】（実施の形態１）以下本発明の一実施の形
態について、図面を参照しながら説明する。(Embodiment 1) An embodiment of the present invention will be described below with reference to the drawings.
【００１７】図１〜図３は本発明の一実施の形態のプリ
ント配線板の外形加工装置と外形加工方法を示す概略図
である。図１〜図３において１は導体層および絶縁層に
よって形成された基板、２はプリント配線板、３はスピ
ンドル、４はドリル、５はプレッシャフット、６は切り
込み、７は排気除塵口、８は加工テーブル、９は下板、
１０は固定ピン、１１は切り粉、１２ａは角穴、１２ｂ
は長穴、１２ｃはミシン目などのスリット、１２ｄは外
形部、１３は噴射口、１４は銅管、１５はエアーホー
ス、１６は圧縮ポンプ、１７は圧力タンク、１８は冷却
部である。1 to 3 are schematic views showing an outer shape processing apparatus and an outer shape processing method for a printed wiring board according to an embodiment of the present invention. 1 to 3, 1 is a substrate formed of a conductor layer and an insulating layer, 2 is a printed wiring board, 3 is a spindle, 4 is a drill, 5 is a pressure foot, 6 is a notch, 7 is an exhaust dust removal port, and 8 is Processing table, 9 is lower plate,
10 is a fixing pin, 11 is a cutting powder, 12a is a square hole, 12b
Is an elongated hole, 12c is a slit such as perforations, 12d is an outer shape portion, 13 is an injection port, 14 is a copper pipe, 15 is an air hose, 16 is a compression pump, 17 is a pressure tank, and 18 is a cooling part.
【００１８】本発明の外形加工装置の構成は、図１に示
すように、プレッシャフット５の下面に中心部に沿って
切り込み６を作り、そこに直径４．０ｍｍの銅管１４を
配置する。銅管１４の先端の噴射口１３は約５．０ｍｍ
の長さで１３０〜１３５°の角度を設け、回転するスピ
ンドル３に取り付けられたドリル４および基板１の切削
部に対して４５〜５０°の角度で気体が直接噴射できる
ように配置する。As shown in FIG. 1, the outer shape processing apparatus of the present invention has a notch 6 formed along the center of the lower surface of the pressure foot 5, and a copper tube 14 having a diameter of 4.0 mm is placed therein. The injection port 13 at the tip of the copper tube 14 is about 5.0 mm
Is provided at an angle of 130 to 135 ° and is arranged so that the gas can be directly jetted at an angle of 45 to 50 ° with respect to the drill 4 attached to the rotating spindle 3 and the cutting portion of the substrate 1.
【００１９】（実施の形態２）以上の外形加工装置を用
いた本発明の外形加工方法を以下に説明する。(Embodiment 2) An outline machining method of the present invention using the above outline machining apparatus will be described below.
【００２０】まず、所定の大きさに切断された銅張積層
板（図示せず）に貫通穴を形成し、導体層および絶縁層
で形成された基板１を得る。First, through holes are formed in a copper clad laminate (not shown) cut into a predetermined size to obtain a substrate 1 formed of a conductor layer and an insulating layer.
【００２１】図２において、外形加工装置の加工テーブ
ル８上にフェノール材の下板９を配置し、その上に基板
１を３枚重ねて配置し、固定ピン１０で３ヵ所を固定す
る。加工に際し、プレッシャフット５で切削部周辺を押
さえ、プレッシャフット５の中心を毎分４０，０００回
転で回転するスピンドル３に取り付けられたドリル４を
降下し、基板１を切削しながらあらかじめ入力した加工
経路に沿って加工テーブル８がＸ−Ｙ（紙面に垂直）方
向に送り速度３０ｃｍ／分で相対移動する。In FIG. 2, a lower plate 9 of a phenolic material is placed on a processing table 8 of an outer shape processing device, three substrates 1 are placed on top of the lower plate 9, and fixing pins 10 fix the three places. At the time of processing, the periphery of the cutting portion is held down by the pressure foot 5, the drill 4 attached to the spindle 3 rotating at the center of the pressure foot 5 at 40,000 revolutions per minute is lowered, and the processing input in advance while cutting the substrate 1 is performed. The processing table 8 relatively moves along the path in the XY direction (perpendicular to the paper surface) at a feed speed of 30 cm / min.
【００２２】このとき、圧縮ポンプ１６により圧力タン
ク１７に貯蔵された外気は冷却部１８で１０〜１５℃の
温度に冷却され、エアーホース１５および銅管１４を通
して噴射口１３よりドリル４および切削部に対して４５
〜５０°の角度でエアー圧力８ｋｇｆ／ｃｍ2で噴射さ
れる。このとき、１枚目乃至３枚目の基板切削部より生
ずる切り粉１１はエアーの圧力で除去され、舞い上がっ
た切り粉１１は排気除塵口７より除塵されていく。また
ドリル４および切削部がエアーにより冷却されることか
ら、切削の摩擦熱による局所的昇温も６０〜８０℃に押
さえることができ、ガラス転移点１１０〜１２０℃の基
材を用いた基板では切り粉１１に含まれる樹脂の溶着を
防止することができるから、切り粉１１の除去を容易か
つ確実に行うことができる。At this time, the outside air stored in the pressure tank 17 by the compression pump 16 is cooled to a temperature of 10 to 15 ° C. in the cooling unit 18, and passes through the air hose 15 and the copper pipe 14 from the injection port 13 to the drill 4 and the cutting unit. Against 45
It is jetted at an air pressure of 8 kgf / cm 2 at an angle of -50 °. At this time, the chips 11 generated from the first to third substrate cutting parts are removed by the pressure of air, and the rising chips 11 are removed from the exhaust dust removing port 7. Further, since the drill 4 and the cutting portion are cooled by air, the local temperature rise due to frictional heat of cutting can be suppressed to 60 to 80 ° C., and the substrate using the base material having the glass transition point 110 to 120 ° C. Since the resin contained in the cutting chips 11 can be prevented from welding, the cutting chips 11 can be easily and surely removed.
【００２３】以上のように本実施の形態２によれば、基
板１を所望する形状に外形加工し、プリント配線板２を
得たのち、図３に示すように角穴１２ａ、長穴１２ｂ、
スリット１２ｃは切り粉の残りはなく所望する外形形状
に仕上がっており、従来１０〜２０分の時間を要して行
っていた切り粉の除去作業を完全に解消することができ
る。As described above, according to the second embodiment, after the substrate 1 is processed into the desired shape and the printed wiring board 2 is obtained, the square hole 12a, the elongated hole 12b, and the rectangular hole 12b are formed as shown in FIG.
The slit 12c has a desired outer shape without remaining cutting chips, and can completely eliminate the cutting powder removal work that conventionally takes 10 to 20 minutes.
【００２４】なお、本発明の実施の形態では噴射口１３
を１個配置したが、複数個例えば、Ｘ−Ｙ方向で４個配
置し、電磁弁等を併用することによって相対移動方向に
対してドリルの後方に配置された噴射口から気体を噴射
し除塵を行えば一層効果的である。In the embodiment of the present invention, the injection port 13
Although one is arranged, a plurality of, for example, four in the XY direction are arranged, and by using an electromagnetic valve and the like together, gas is injected from the injection port arranged behind the drill with respect to the relative movement direction to remove dust. Is more effective.
【００２５】また実施の形態では外気を圧縮し冷却して
用いたが、窒素を用いて冷却効果を高めてもよい。その
ときはドリル４の回転数を上げ、ドリル４と加工テーブ
ル８の相対送り速度を上げ、生産効率をさらに向上させ
ることも可能である。In the embodiment, the outside air is compressed and cooled for use, but nitrogen may be used to enhance the cooling effect. At that time, it is possible to increase the rotation speed of the drill 4 and increase the relative feed speed between the drill 4 and the processing table 8 to further improve the production efficiency.
【００２６】[0026]
【発明の効果】以上のように本発明は、回転する工具が
基板を切削しながら相対的に移動し外形加工する装置方
法と外形加工方法において、切削加工時に発生する切り
粉を確実に除去し、工具の摩耗による寿命をのばし、生
産性を向上し、高品質の外形加工仕上がりを実現するこ
とができるものである。As described above, according to the present invention, in a device method and an outer shape processing method in which a rotating tool relatively moves while cutting a substrate, and an outer shape processing method, chips generated during cutting are reliably removed. It is possible to extend the life of the tool due to wear, improve productivity, and achieve a high-quality finish of the outer shape processing.
【図１】本発明の一実施の形態におけるプリント配線板
の外形加工装置の主要部を示す断面図FIG. 1 is a cross-sectional view showing a main part of a contour processing apparatus for a printed wiring board according to an embodiment of the present invention.
【図２】本発明の一実施の形態におけるプリント配線板
の外形加工装置と外形加工方法を示す概略構成図FIG. 2 is a schematic configuration diagram showing a contour processing apparatus and a contour processing method for a printed wiring board according to an embodiment of the present invention.
【図３】本発明の一実施の形態におけるプリント配線板
の外形加工後を示す要部の斜視図FIG. 3 is a perspective view of a main part of the printed wiring board according to the embodiment of the present invention after the outer shape processing.
【図４】従来のプリント配線板の外形加工装置と外形加
工方法を示す断面図FIG. 4 is a cross-sectional view showing a conventional external processing apparatus and external processing method for a printed wiring board.
【図５】従来のプリント配線板の外形加工後を示す要部
の斜視図FIG. 5 is a perspective view of a main part of the conventional printed wiring board after external processing.
１ 基板 ２ プリント配線板 ３ スピンドル ４ ドリル ５ プレッシャフット ６ 切り込み ７ 排気除塵口 ８ 加工テーブル ９ 下板 １０ 固定ピン １１ 切り粉 １２ａ 角穴 １２ｂ 長穴 １２ｃ ミシン目などのスリット １２ｄ 外形部 １３ 噴射口 １４ 銅管 １５ エアーホース １６ 圧縮ポンプ １７ 圧力タンク １８ 冷却部 1 Substrate 2 Printed Wiring Board 3 Spindle 4 Drill 5 Pressure Foot 6 Notch 7 Exhaust Dust Removal Port 8 Processing Table 9 Lower Plate 10 Fixing Pin 11 Cutting Chip 12a Square Hole 12b Long Hole 12c Perforations 12c Outer Part 13 Injection Port 14 Copper pipe 15 Air hose 16 Compression pump 17 Pressure tank 18 Cooling unit
Claims (3)
と、プレッシャフットの中心を回転するスピンドルに取
り付けられたドリルが水平方向に相対的に移動しながら
基板を加工する外形加工装置において、プレッシャフッ
トの下面にドリルと基板の切削部の両方に対して直接気
体を噴射する噴射口を配置した外形加工装置。1. A contour processing apparatus for processing a substrate while horizontally moving a processing table on which the substrate is placed horizontally and a drill mounted on a spindle rotating about the center of a pressure foot in a horizontal direction. A contour processing device that has an injection port that directly injects gas to both the drill and the cutting part of the board on the bottom surface of the foot.
プレッシャフットの中心を回転するスピンドルに取り付
けたドリルが水平方向に相対的に移動しながら基板の外
形を加工する外形加工方法において、プレッシャフット
の下面でドリルと基板の切削部の両方に対して直接気体
を噴射する外形加工方法。2. The substrate is horizontally placed on the processing table,
In the contour processing method, in which the drill attached to the spindle that rotates the center of the pressure foot moves relative to the horizontal direction to process the contour of the board, directly under the pressure foot, both the drill and the cutting portion of the board are processed. Outline processing method of injecting gas.
外形加工方法。3. The outer shape processing method according to claim 2, wherein the cooled gas is injected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7277423A JPH09117815A (en) | 1995-10-25 | 1995-10-25 | Outline machining device and outline machining method using the device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7277423A JPH09117815A (en) | 1995-10-25 | 1995-10-25 | Outline machining device and outline machining method using the device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09117815A true JPH09117815A (en) | 1997-05-06 |
Family
ID=17583358
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7277423A Pending JPH09117815A (en) | 1995-10-25 | 1995-10-25 | Outline machining device and outline machining method using the device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09117815A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100455406C (en) * | 2004-10-20 | 2009-01-28 | 日立比亚机械股份有限公司 | Tool positioning device and machining tool |
| JP2015160275A (en) * | 2014-02-27 | 2015-09-07 | 株式会社北川鉄工所 | Processing device of end face of fiber-reinforced composite material |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5859746A (en) * | 1981-10-06 | 1983-04-08 | Sanshin Ind Co Ltd | Dust collector of machine tool |
| JPH033713A (en) * | 1989-05-30 | 1991-01-09 | Hitachi Seiko Ltd | Pressure foot of printed board hole driller |
| JPH07156038A (en) * | 1993-12-01 | 1995-06-20 | Fuji Heavy Ind Ltd | Cooling and dust collection device of machine tool |
-
1995
- 1995-10-25 JP JP7277423A patent/JPH09117815A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5859746A (en) * | 1981-10-06 | 1983-04-08 | Sanshin Ind Co Ltd | Dust collector of machine tool |
| JPH033713A (en) * | 1989-05-30 | 1991-01-09 | Hitachi Seiko Ltd | Pressure foot of printed board hole driller |
| JPH07156038A (en) * | 1993-12-01 | 1995-06-20 | Fuji Heavy Ind Ltd | Cooling and dust collection device of machine tool |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100455406C (en) * | 2004-10-20 | 2009-01-28 | 日立比亚机械股份有限公司 | Tool positioning device and machining tool |
| JP2015160275A (en) * | 2014-02-27 | 2015-09-07 | 株式会社北川鉄工所 | Processing device of end face of fiber-reinforced composite material |
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