JPH0890730A - Phenol resin composition, prepreg using the same and laminated sheet - Google Patents
Phenol resin composition, prepreg using the same and laminated sheetInfo
- Publication number
- JPH0890730A JPH0890730A JP23195394A JP23195394A JPH0890730A JP H0890730 A JPH0890730 A JP H0890730A JP 23195394 A JP23195394 A JP 23195394A JP 23195394 A JP23195394 A JP 23195394A JP H0890730 A JPH0890730 A JP H0890730A
- Authority
- JP
- Japan
- Prior art keywords
- phenol resin
- resin composition
- prepreg
- phosphorus
- compd
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はフェノール樹脂組成物、
このフェノール樹脂組成物を用いたプリプレグ、及び積
層板に関し、一例をあげれば、電気機器・電子機器、産
業機器等に搭載される紙基材積層板に有用なものであ
る。The present invention relates to a phenol resin composition,
With regard to a prepreg and a laminated board using this phenol resin composition, for example, they are useful for a paper base laminated board to be mounted on electric equipment / electronic equipment, industrial equipment and the like.
【０００２】[0002]
【従来の技術】電子機器等に搭載される紙基材フェノー
ル樹脂積層板に難燃性を付与させるために、ブロム系難
燃剤やアンチモン系難燃剤を含有させている。しかし、
このブロム系難燃剤やアンチモン系難燃剤の使用は公害
上問題から、使用量の削減、又は不使用が求められてい
る。ブロム系難燃剤やアンチモン系難燃剤に代わり、リ
ン系難燃剤の使用が検討されているが、リン系難燃剤は
含有量を増加すると難燃性は向上するが半田耐熱性や耐
トラッキング性が劣化する問題がある。従って、リン系
難燃剤を用いたフェノール樹脂積層板において、半田耐
熱性や耐トラッキング性の水準を維持しつつ、難燃性の
向上が求められていいる。2. Description of the Related Art Brominated flame retardants and antimony flame retardants are contained in a paper-based phenolic resin laminated plate mounted on electronic equipment to impart flame retardancy. But,
The use of the bromine-based flame retardant and antimony-based flame retardant is required to be reduced or not used because of pollution problems. The use of phosphorus-based flame retardants is being considered in place of bromine-based flame retardants and antimony-based flame retardants.However, phosphorus-based flame retardants improve flame retardance as the content increases, but solder heat resistance and tracking resistance are improved. There is a problem of deterioration. Therefore, in the phenol resin laminate using the phosphorus-based flame retardant, it is required to improve the flame retardancy while maintaining the solder heat resistance and the tracking resistance.
【０００３】[0003]
【発明が解決しようとする課題】本発明は上記の事実に
鑑みてなされたもので、その目的とするところは、難燃
性、半田耐熱性、及び、耐トラッキング性の良好な積層
板、及び、この積層板が得られるフェノール樹脂組成
物、及びプリプレグを提供することにある。SUMMARY OF THE INVENTION The present invention has been made in view of the above facts, and an object thereof is to provide a laminate having good flame retardancy, solder heat resistance, and tracking resistance, and The purpose of the present invention is to provide a phenol resin composition and a prepreg from which this laminated board can be obtained.
【０００４】[0004]
【課題を解決するための手段】本発明の請求項１に係る
フェノール樹脂組成物は、フェノール樹脂と、上記フェ
ノール樹脂の固形分に対し１０〜３０重量％のリン含有
化合物と、及び、下式〔１〕の構造式を有する窒素化合
物とを含有することを特徴とする。A phenol resin composition according to claim 1 of the present invention comprises a phenol resin, a phosphorus-containing compound of 10 to 30% by weight based on the solid content of the phenol resin, and a compound represented by the following formula: And a nitrogen compound having the structural formula [1].
【０００５】[0005]
【化２】 [Chemical 2]
【０００６】〔式中Ｒ1,Ｒ2,Ｒ3 はアルキル基を示す。
このアルキル基は互いに同じであってもよく、異なって
いてもよい。〕 本発明の請求項２に係るフェノール樹脂組成物は、請求
項１記載のフェノール樹脂組成物において、上記窒素化
合物の含有量が上記フェノール樹脂の固形分に対し１〜
１０重量％の範囲であることを特徴とする。[In the formula, R 1 , R 2 and R 3 represent an alkyl group.
The alkyl groups may be the same as or different from each other. The phenol resin composition according to claim 2 of the present invention is the phenol resin composition according to claim 1, wherein the content of the nitrogen compound is 1 to the solid content of the phenol resin.
It is characterized by being in the range of 10% by weight.
【０００７】本発明の請求項３に係るプリプレグは、請
求項１又は請求項２記載のフェノール樹脂組成物を基材
に含浸し、この含浸したフェノール樹脂組成物の樹脂が
半硬化した状態にあることを特徴とする。In the prepreg according to claim 3 of the present invention, a substrate is impregnated with the phenol resin composition according to claim 1 or 2, and the resin of the impregnated phenol resin composition is in a semi-cured state. It is characterized by
【０００８】本発明の請求項４に係る積層板は、請求項
３記載のプリプレグを用いて、樹脂が完全に硬化した状
態にあることを特徴とする。The laminated plate according to a fourth aspect of the present invention is characterized in that the resin is completely cured by using the prepreg according to the third aspect.
【０００９】以下、本発明を詳細に説明する。本発明の
フェノール樹脂組成物は、フェノール樹脂と、リン含有
化合物と、及び、前式〔１〕の構造式を有する窒素化合
物を含有する。The present invention will be described in detail below. The phenol resin composition of the present invention contains a phenol resin, a phosphorus-containing compound, and a nitrogen compound having the structural formula [1].
【００１０】上記フェノール樹脂としては、各種のもの
が使用でき、フェノール、ブチルフェノール、クレゾー
ル等のフェノール類とホルマリンとの生成物、これらと
メラミン、桐油、エポキシ等の変性物、及び、混合物等
が用いられる。As the above-mentioned phenol resin, various ones can be used, and products of phenols such as phenol, butylphenol and cresol and formalin, modified products such as melamine, tung oil and epoxy, and mixtures thereof are used. To be
【００１１】本発明のフェノール樹脂組成物に含有する
リン含有化合物は、得られる積層板に難燃性を付与する
ものであって、例えば、トリフェニルホスフェイト、ト
リクレジルホスフェイト、キシレニルジフェニルホスフ
ェイト、クレジルジフェニルホスフェイト等が挙げられ
る。このリン含有化合物の含有量は、上記フェノール樹
脂の固形分に対し１０〜３０重量％の範囲に制限され
る。上記リン含有化合物の含有量が１０重量％未満であ
ると難燃性が劣り、３０重量％を超えると耐熱性が低下
する。The phosphorus-containing compound contained in the phenol resin composition of the present invention imparts flame retardancy to the resulting laminate, and examples thereof include triphenyl phosphate, tricresyl phosphate and xylenyl. Examples thereof include diphenyl phosphate and cresyl diphenyl phosphate. The content of the phosphorus-containing compound is limited to the range of 10 to 30% by weight based on the solid content of the phenol resin. If the content of the phosphorus-containing compound is less than 10% by weight, the flame retardancy is poor, and if it exceeds 30% by weight, the heat resistance is reduced.
【００１２】本発明のフェノール樹脂組成物が含有す
る、前式〔１〕の構造式を有する窒素化合物の含有量
は、上記フェノール樹脂の固形分に対し１〜１０重量％
の範囲が望ましい。上記窒素化合物の含有量が上記範囲
であると、上記リン含有化合物との相乗効果で燃焼反応
を停止する働きをする。上記窒素化合物の含有量が１重
量％未満であると難燃性、及び、耐熱性が低下し、含有
量が１０重量％を超えても難燃性が低下する。The content of the nitrogen compound having the structural formula [1] contained in the phenol resin composition of the present invention is 1 to 10% by weight based on the solid content of the phenol resin.
The range of is desirable. When the content of the nitrogen compound is in the above range, the combustion reaction is stopped by a synergistic effect with the phosphorus-containing compound. When the content of the nitrogen compound is less than 1% by weight, flame retardancy and heat resistance are deteriorated, and even when the content exceeds 10% by weight, flame retardancy is deteriorated.
【００１３】一般的に、難燃剤の機能は、燃焼の際、ガ
ス等を発生して酸素を遮断する機能と燃焼反応を停止す
る機能によると推定される。リン含有化合物はポリリン
酸の生成による酸素の遮断機能は有するが、燃焼反応を
停止する機能がほとんどないため、リン含有化合物で難
燃性を高めるためには、リン含有化合物の含有量を増量
する必要があった。しかし、本発明のフェノール樹脂組
成物においては、前式〔１〕の構造式を有する窒素化合
物と共に含有することで、燃焼反応を停止する機能を有
することができ、その結果、リン含有化合物を増量する
ことなく、難燃性、耐熱性を維持し、耐トラッキング性
を良好にできる。Generally, the function of the flame retardant is presumed to be due to the function of generating gas or the like to block oxygen during combustion and the function of stopping the combustion reaction. Although the phosphorus-containing compound has a function of blocking oxygen due to the formation of polyphosphoric acid, it has almost no function of stopping the combustion reaction. Therefore, in order to increase the flame retardancy of the phosphorus-containing compound, the content of the phosphorus-containing compound is increased. There was a need. However, the phenol resin composition of the present invention can have a function of stopping the combustion reaction by containing it together with the nitrogen compound having the structural formula [1], and as a result, the amount of the phosphorus-containing compound can be increased. Flame resistance and heat resistance can be maintained, and tracking resistance can be improved.
【００１４】上記フェノール樹脂組成物は、必要に応じ
てアンチモン、少量のテトラビスフェノールＡ等のブロ
ム系難燃剤等の他種の難燃剤を併用してもよい。さら
に、無機、有機の充填剤、溶剤及びその他水等の添加物
を適宜に配合してもよい。If necessary, the above-mentioned phenol resin composition may be used in combination with other flame retardants such as antimony and a small amount of bromine flame retardants such as tetrabisphenol A. Further, an inorganic or organic filler, a solvent, and other additives such as water may be appropriately blended.
【００１５】上記フェノール樹脂組成物を用いてプリプ
レグを製造するにあたって、基材は、例えば、クラフト
紙、リンター紙、その他クラフト紙又はリンター紙に無
機物又は有機物を混入した紙基材が挙げられる。上述の
フェノール樹脂組成物をこれらの基材に含浸し、樹脂を
半硬化してプリプレグを得る。高度の電気特性を有する
積層板の場合、樹脂を多量に含有させる必要性から、含
浸する際には、上記フェノール樹脂組成物、又は、フェ
ノール樹脂組成物と別の樹脂組成物を用い一次含浸処理
を行い、次いで上記フェノール樹脂組成物を用いて二次
含浸処理を行うことが有効である。通常においては、上
記一次含浸用の樹脂組成物は溶剤又は水等で希釈された
粘度の低いものが用いられる。In producing a prepreg using the above-mentioned phenol resin composition, examples of the substrate include kraft paper, linter paper, and other kraft paper or linter paper mixed with an inorganic or organic material. These substrates are impregnated with the above-mentioned phenol resin composition and the resin is semi-cured to obtain a prepreg. In the case of a laminated board having a high degree of electrical characteristics, since it is necessary to contain a large amount of resin, the above-mentioned phenol resin composition or a resin composition different from the phenol resin composition is used for the primary impregnation treatment during impregnation. Then, it is effective to carry out the secondary impregnation treatment using the above-mentioned phenol resin composition. In general, the resin composition for primary impregnation used has a low viscosity diluted with a solvent or water.
【００１６】本発明の積層板は、上述の製造方法で得ら
れたプリプレグ数枚と、必要により銅、アルミニウム、
ニッケル等の金属箔を重ね合わせ、加熱加圧により、基
材中の樹脂が完全に硬化して得られる。上記フェノール
樹脂組成物を用いるので、難燃性、半田耐熱性、及び、
耐トラッキング性の良好な積層板が得られる。また、こ
の積層板はブロム系難燃剤の使用の削減、又は不使用を
可能とするので、公害防止の点からも優れる。The laminated plate of the present invention comprises several prepregs obtained by the above-mentioned manufacturing method, and optionally copper, aluminum,
It is obtained by stacking metal foils such as nickel and heating and pressurizing the resin in the base material completely. Since the above-mentioned phenol resin composition is used, flame retardancy, solder heat resistance, and
A laminated plate having good tracking resistance can be obtained. Further, since this laminated plate enables reduction or non-use of the brominated flame retardant, it is also excellent in pollution prevention.
【００１７】[0017]
【作用】本発明の請求項１又は請求項２記載のフェノー
ル樹脂組成物を用いると、リン含有化合物と共に、前式
〔１〕の構造式を有する窒素化合物を含有するので、リ
ン含有化合物によるポリリン酸の生成による酸素の遮断
機能と共に、リン含有化合物を増量しなくとも、相乗効
果で燃焼反応を停止する働きをする。When the phenol resin composition according to claim 1 or 2 of the present invention is used, since it contains a nitrogen compound having the structural formula of the above formula [1] together with the phosphorus-containing compound, polyphosphorus produced by the phosphorus-containing compound It functions to block the combustion reaction by a synergistic effect, together with the function of blocking oxygen by the generation of acid, and without increasing the amount of the phosphorus-containing compound.
【００１８】本発明の請求項３に係るプリプレグは上記
フェノール樹脂組成物を用いるので、このプリプレグを
用いるた積層板は、難燃性、半田耐熱性、及び、耐トラ
ッキング性が良好になる。Since the prepreg according to claim 3 of the present invention uses the above-mentioned phenol resin composition, the laminate using this prepreg has good flame retardancy, solder heat resistance, and tracking resistance.
【００１９】本発明の請求項４に係る積層板は上記プリ
プレグを用いるので、難燃性、半田耐熱性、及び、耐ト
ラッキング性が良好になる。The laminated board according to the fourth aspect of the present invention uses the above prepreg, so that flame retardancy, solder heat resistance, and tracking resistance are improved.
【００２０】[0020]
実施例１ 一次含浸用の樹脂組成物を次の様に作製した。フェノー
ル１００重量部（以下部と記す）、３７重量％（以下単
に％と記す）のホルマリン７０部を反応させてレゾール
型フェノール反応生成物Ａを得た。また、メラミン１０
０部、ホルマリン（固形分３７％）１００部を反応させ
てメラミン反応生成物Ｂを得た。このレゾール型フェノ
ール反応生成物Ａ５０部とメラミン反応生成物Ｂ５０部
の混合物を、水とメタノールを１対１で混合したメタノ
ール水溶液で希釈し、固形分１５％の一次含浸用の樹脂
組成物を得た。Example 1 A resin composition for primary impregnation was prepared as follows. Resol type phenol reaction product A was obtained by reacting 100 parts by weight of phenol (hereinafter referred to as “part”) and 70 parts of 37% by weight (hereinafter referred to as “%”) formalin. Also, melamine 10
A melamine reaction product B was obtained by reacting 0 part with 100 parts formalin (solid content 37%). A mixture of 50 parts of this resol type phenol reaction product A and 50 parts of melamine reaction product B was diluted with an aqueous methanol solution in which water and methanol were mixed in a ratio of 1: 1 to obtain a resin composition for primary impregnation with a solid content of 15%. It was
【００２１】二次含浸に用いたフェノール樹脂組成物の
調製は次の様に行った。フェノール１００部、３７％の
ホルマリン８０部、桐油３０部を反応させた桐油変性レ
ゾール型フェノール樹脂に、リン含有化合物としてトリ
フェニルホスフェイトを上記桐油変性レゾール型フェノ
ール樹脂の固形分に対して１０重量％、及び、下記構造
式〔２〕で表される窒素化合物（日産化学工業株式会社
製：商品名タナック）を、上記桐油変性レゾール型フェ
ノール樹脂の固形分に対して５重量％配合し、溶剤とし
てメタノールを添加し、二次含浸用のフェノール樹脂組
成物を得た。The phenol resin composition used for the secondary impregnation was prepared as follows. Phenol 100 parts, 80% of 37% formalin, 30 parts of tung oil were reacted with tung oil-modified resol type phenol resin, and triphenyl phosphate as a phosphorus-containing compound was added to the tung oil modified resol type phenol resin in an amount of 10% by weight. %, And a nitrogen compound represented by the following structural formula [2] (manufactured by Nissan Chemical Industries, Ltd .: trade name Tanac) in an amount of 5% by weight based on the solid content of the tung oil-modified resol-type phenol resin, and a solvent. Was added as a solvent to obtain a phenol resin composition for secondary impregnation.
【００２２】[0022]
【化３】 [Chemical 3]
【００２３】プリプレグの調製は次の様に行った。基材
に重量１２６ｇ／ｍ2のクラフト紙を用い、このクラフ
ト紙に上記一次含浸用の樹脂組成物を一次含浸した後
に、１３５℃の乾燥機で３０秒乾燥し、樹脂が半硬化し
た状態である一次プリプレグＡを得た。この一次プリプ
レグＡは、一次ワニスＡの樹脂含有量がクラフト紙に対
して１５％であった。この一次プリプレグＡに上記二次
含浸用のフェノール樹脂組成物を含浸し、１５５℃の乾
燥機で１００秒間処理し、樹脂が半硬化した状態である
プリプレグＢを製造した。このプリプレグＢ中におけ
る、樹脂の含有量は５２％であった。The prepreg was prepared as follows. Kraft paper with a weight of 126 g / m 2 was used as the base material, and the kraft paper was first impregnated with the resin composition for primary impregnation described above and then dried for 30 seconds in a dryer at 135 ° C. A certain primary prepreg A was obtained. In this primary prepreg A, the resin content of the primary varnish A was 15% based on the kraft paper. This primary prepreg A was impregnated with the above-mentioned secondary impregnating phenolic resin composition and treated with a dryer at 155 ° C. for 100 seconds to produce a prepreg B in which the resin was semi-cured. The resin content in this prepreg B was 52%.
【００２４】次に、プリプレグＢを８枚重ね、この片側
の最上層に厚さ０．０３５ｍｍの銅箔を接着剤を介して
配設し、これを圧力１００ｋｇ／ｃｍ2 、温度１６０℃
で６０分間成形し、樹脂が完全に硬化した厚さ１．６ｍ
ｍの片面に銅箔面を有した積層板を得た。Next, eight prepregs B are stacked, a copper foil having a thickness of 0.035 mm is arranged on the uppermost layer on one side through an adhesive, and the pressure is 100 kg / cm 2 and the temperature is 160 ° C.
Molded for 60 minutes, the resin is completely cured, thickness 1.6m
A laminated board having a copper foil surface on one side of m was obtained.
【００２５】実施例２ 実施例１の二次含浸用のフェノール樹脂組成物のトリフ
ェニルホスフェイトの含有量を上記桐油変性レゾール型
フェノール樹脂の固形分に対して２０重量％に配合した
以外は実施例１と同様にして、積層板を得た。Example 2 Example 2 was repeated except that the content of triphenyl phosphate in the phenol resin composition for secondary impregnation of Example 1 was 20% by weight based on the solid content of the tung oil-modified resol type phenol resin. A laminated plate was obtained in the same manner as in Example 1.
【００２６】実施例３ 実施例１の二次含浸用のフェノール樹脂組成物のトリフ
ェニルホスフェイトの含有量を上記桐油変性レゾール型
フェノール樹脂の固形分に対して２０重量％、前記構造
式〔２〕で表される窒素化合物を、上記桐油変性レゾー
ル型フェノール樹脂の固形分に対して１０重量％に配合
した以外は実施例１と同様にして、積層板を得た。Example 3 The content of triphenyl phosphate in the phenol resin composition for secondary impregnation of Example 1 was 20% by weight based on the solid content of the tung oil-modified resol-type phenol resin, and the structural formula [2] A laminated board was obtained in the same manner as in Example 1 except that the nitrogen compound represented by the above formula was added in an amount of 10% by weight based on the solid content of the tung oil-modified resol-type phenol resin.
【００２７】実施例４ 実施例１の二次含浸用のフェノール樹脂組成物のトリフ
ェニルホスフェイトの含有量を上記桐油変性レゾール型
フェノール樹脂の固形分に対して３０重量％に配合した
以外は実施例１と同様にして、積層板を得た。Example 4 Example 3 was repeated except that the content of triphenyl phosphate in the phenol resin composition for secondary impregnation of Example 1 was 30% by weight based on the solid content of the tung oil-modified resol type phenol resin. A laminated plate was obtained in the same manner as in Example 1.
【００２８】比較例１ 二次含浸用のフェノール樹脂組成物の調製は次の用に行
った。フェノール１００部、３７％のホルマリン８０
部、桐油３０部を反応させた桐油変性レゾール型フェノ
ール樹脂に、前記構造式〔２〕で表される窒素化合物
を、上記桐油変性レゾール型フェノール樹脂の固形分に
対して５重量％配合し、溶剤としてメタノールを添加
し、二次含浸用のフェノール樹脂組成物を得た。このフ
ェノール樹脂組成物を二次含浸に用いた以外は実施例１
と同様にして、積層板を得た。Comparative Example 1 A phenol resin composition for secondary impregnation was prepared as follows. Phenol 100 parts, 37% formalin 80
Part, and a tung oil-modified resol type phenol resin obtained by reacting 30 parts of tung oil with a nitrogen compound represented by the structural formula [2] by 5% by weight based on the solid content of the tung oil modified resol type phenol resin. Methanol was added as a solvent to obtain a phenol resin composition for secondary impregnation. Example 1 except that this phenolic resin composition was used for secondary impregnation.
A laminated plate was obtained in the same manner as in.
【００２９】比較例２ 二次含浸用のフェノール樹脂組成物の調製は次の用に行
った。フェノール１００部、３７％のホルマリン８０
部、桐油３０部を反応させた桐油変性レゾール型フェノ
ール樹脂に、トリフェニルホスフェイトを上記桐油変性
レゾール型フェノール樹脂の固形分に対して２０重量％
配合し、溶剤としてメタノールを添加し、二次含浸用の
フェノール樹脂組成物を得た。このフェノール樹脂組成
物を二次含浸に用いた以外は実施例１と同様にして、積
層板を得た。Comparative Example 2 A phenol resin composition for secondary impregnation was prepared as follows. Phenol 100 parts, 37% formalin 80
20 parts by weight of triphenyl phosphate in a tung oil-modified resol-type phenolic resin obtained by reacting 30 parts of tung oil with 30 parts by weight based on the solid content of the tung oil-modified resol-type phenolic resin
After blending, methanol was added as a solvent to obtain a phenol resin composition for secondary impregnation. A laminated board was obtained in the same manner as in Example 1 except that this phenol resin composition was used for secondary impregnation.
【００３０】得られた実施例１〜４、及び比較例１〜２
の積層板の難燃性、半田耐熱性、及び、耐トラッキング
性を評価した。難燃性は、ＵＬ試験法に基づいて消炎時
間を１０個測定し、平均値と最大値を求めた。半田耐熱
性はＪＩＳ−６４８１に基づき、２６０℃の半田にフロ
ートし、ふくれ発生までの時間を測定した。The obtained Examples 1 to 4 and Comparative Examples 1 to 2
The flame retardancy, the solder heat resistance, and the tracking resistance of the laminated plate of 1 were evaluated. For flame retardancy, 10 extinction times were measured based on the UL test method, and an average value and a maximum value were obtained. The solder heat resistance was measured according to JIS-6481 by floating the solder at 260 ° C. and measuring the time until the occurrence of blistering.
【００３１】耐トラッキング性は次の様に測定した。銅
箔面と反対側の積層板の表面に４ｍｍ離して電極を配置
し、所定電圧を印加しながら０．１％の塩化アンモニウ
ム水溶液を３０秒間隔で滴下し、積層板が着火するまで
の滴下数を、印加電圧を変化させながら記録した。この
値から５０滴に対応する電圧を求めた。Tracking resistance was measured as follows. Place electrodes 4 mm apart on the surface of the laminated plate opposite to the copper foil surface, drop 0.1% ammonium chloride aqueous solution at 30 second intervals while applying a predetermined voltage, and drop until the laminated plate ignites. Numbers were recorded while changing the applied voltage. The voltage corresponding to 50 drops was determined from this value.
【００３２】結果は表１に示したとおり、実施例１〜４
はいずれも難燃性、半田耐熱性、及び、耐トラッキング
性が良好であった。比較例１は難燃性、及び、耐トラッ
キング性が劣り、比較例２は半田耐熱性、及び、耐トラ
ッキング性が劣った。The results, as shown in Table 1, are shown in Examples 1 to 4.
All had good flame retardancy, solder heat resistance, and tracking resistance. Comparative Example 1 was inferior in flame retardancy and tracking resistance, and Comparative Example 2 was inferior in solder heat resistance and tracking resistance.
【００３３】[0033]
【表１】 [Table 1]
【００３４】[0034]
【発明の効果】本発明の請求項１又は請求項２記載のフ
ェノール樹脂組成物は、難燃性、半田耐熱性、及び、耐
トラッキング性の良好な積層板を得ることができる。The phenol resin composition according to the first or second aspect of the present invention can provide a laminate having good flame retardancy, solder heat resistance, and tracking resistance.
【００３５】本発明の請求項３に係るプリプレグは上記
フェノール樹脂組成物を用いるので、このプリプレグを
用いるた積層板は、難燃性、半田耐熱性、及び、耐トラ
ッキング性が良好になる。Since the prepreg according to claim 3 of the present invention uses the above-mentioned phenol resin composition, the laminate using this prepreg has good flame retardancy, solder heat resistance, and tracking resistance.
【００３６】本発明の請求項４に係る積層板は上記プリ
プレグを用いるので、難燃性、半田耐熱性、及び、耐ト
ラッキング性が良好になる。また、この積層板はブロム
系難燃剤の使用の削減、又は不使用を可能とするため、
公害防止の点からも優れる。Since the laminated board according to the fourth aspect of the present invention uses the prepreg, the flame retardancy, the solder heat resistance, and the tracking resistance are improved. In addition, since this laminated board enables the reduction or non-use of the brominated flame retardant,
It is also excellent in terms of pollution prevention.
フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｃ０８Ｌ 61/04 ＬＭＲ Continuation of the front page (51) Int.Cl. 6 Identification number Office reference number FI technical display area C08L 61/04 LMR
Claims (4)
の固形分に対し１０〜３０重量％のリン含有化合物と、
及び、下式〔１〕の構造式を有する窒素化合物とを含有
することを特徴とするフェノール樹脂組成物。 【化１】 〔式中Ｒ1,Ｒ2,Ｒ3 はアルキル基を示す。このアルキル
基は互いに同じであってもよく、異なっていてもよ
い。〕1. A phenol resin, and a phosphorus-containing compound in an amount of 10 to 30% by weight based on the solid content of the phenol resin,
And a nitrogen compound having a structural formula of the following formula [1]. [Chemical 1] [In the formula, R 1 , R 2 and R 3 represent an alkyl group. The alkyl groups may be the same as or different from each other. ]
ル樹脂の固形分に対し１〜１０重量％の範囲であること
を特徴とする請求項１記載のフェノール樹脂組成物。2. The phenol resin composition according to claim 1, wherein the content of the nitrogen compound is in the range of 1 to 10% by weight based on the solid content of the phenol resin.
樹脂組成物を基材に含浸し、この含浸したフェノール樹
脂組成物の樹脂が半硬化した状態にあることを特徴とす
るプリプレグ。3. A prepreg characterized in that a substrate is impregnated with the phenol resin composition according to claim 1 or 2, and the resin of the impregnated phenol resin composition is in a semi-cured state.
脂が完全に硬化した状態にあることを特徴とする積層
板。4. A laminate comprising the prepreg according to claim 3 and a resin in a completely cured state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23195394A JP3331774B2 (en) | 1994-09-28 | 1994-09-28 | Phenolic resin composition, laminate using this phenolic resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23195394A JP3331774B2 (en) | 1994-09-28 | 1994-09-28 | Phenolic resin composition, laminate using this phenolic resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0890730A true JPH0890730A (en) | 1996-04-09 |
| JP3331774B2 JP3331774B2 (en) | 2002-10-07 |
Family
ID=16931655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23195394A Expired - Fee Related JP3331774B2 (en) | 1994-09-28 | 1994-09-28 | Phenolic resin composition, laminate using this phenolic resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3331774B2 (en) |
-
1994
- 1994-09-28 JP JP23195394A patent/JP3331774B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP3331774B2 (en) | 2002-10-07 |
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