JPH0886833A - Automatic inspection apparatus for semiconductor element - Google Patents
Automatic inspection apparatus for semiconductor elementInfo
- Publication number
- JPH0886833A JPH0886833A JP6281597A JP28159794A JPH0886833A JP H0886833 A JPH0886833 A JP H0886833A JP 6281597 A JP6281597 A JP 6281597A JP 28159794 A JP28159794 A JP 28159794A JP H0886833 A JPH0886833 A JP H0886833A
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- JP
- Japan
- Prior art keywords
- inspection
- disk
- slit
- inspected
- characteristic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、複数枚のチップを柱状
に積層した高圧用積層形ダイオードなどを対象に、その
特性試験，および良否選別を自動的に行う半導体素子の
自動検査装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an automatic inspection device for a semiconductor device which automatically performs a characteristic test and a pass / fail selection for a high voltage laminated diode in which a plurality of chips are laminated in a column shape.
【０００２】[0002]
【従来の技術】まず、本発明の検査対象となる高圧用の
積層形ダイオードの構造，並びにその製法を図４により
説明する。図４（ａ）において、１は複数枚のダイオー
ドチップ２を重ね合わせた柱状のチップ積層体、３はチ
ップ積層体１の両端に半田接合したリード線、４はチッ
プ積層体１の周域を封止した樹脂パッケージである。2. Description of the Related Art First, the structure of a high voltage laminated diode to be inspected according to the present invention and its manufacturing method will be described with reference to FIG. In FIG. 4A, 1 is a columnar chip laminated body in which a plurality of diode chips 2 are stacked, 3 is a lead wire soldered to both ends of the chip laminated body 1, and 4 is a peripheral region of the chip laminated body 1. It is a sealed resin package.
【０００３】かかる積層形ダイオードは次のようにして
製作される。まず、図４（ｂ）で示すようにｐｎ接合を
形成した複数枚のシリコンウェーハ５を積層して半田付
けする。次にウェーハ５を点線に沿ってダイシングし、
図４（ｃ）で示すチップ積層体１を得る。続いてチップ
積層体１の両端にリード線３を半田付けし、さらにモー
ルド樹脂により封止して図１（ａ）に示す積層形ダイオ
ードが完成する。Such a laminated diode is manufactured as follows. First, as shown in FIG. 4B, a plurality of silicon wafers 5 having pn junctions are stacked and soldered. Next, dicing the wafer 5 along the dotted line,
The chip laminated body 1 shown in FIG. 4C is obtained. Then, the lead wires 3 are soldered to both ends of the chip laminated body 1 and further sealed with a mold resin to complete the laminated diode shown in FIG.
【０００４】一方、かかる積層形ダイオードは、個々に
特性試験（順方向電流／電圧特性，逆回復時間特性な
ど）を行い、その試験結果を基に良品，不良品を選別す
るような検査を行っており、通常は製造工程に投入する
材料のロス分を最小限に抑えるために、製造工程におけ
るリード線３を取付ける以前の段階で、チップ積層体１
を個別に特性試験して合否判定を行い、良品についての
み製造ラインに戻してリード線取付け，樹脂封止を行っ
て製品を組立てるようにしている。On the other hand, such a laminated diode is individually subjected to a characteristic test (forward current / voltage characteristic, reverse recovery time characteristic, etc.), and an inspection is performed to select a good product or a defective product based on the test result. In general, in order to minimize the loss of the material that is input to the manufacturing process, the chip stack 1 is attached at a stage before the lead wire 3 is mounted in the manufacturing process.
The individual products are subjected to a characteristic test to make a pass / fail judgment, and only non-defective products are returned to the production line, and lead wires are attached and resin is sealed to assemble the products.
【０００５】この場合に、従来の検査方法では、検査員
の手作業により１個ずつチップ積層体１の両端電極面に
テスタのプローブ電極を接触させて検査作業を行ってい
るのが現状である。In this case, in the conventional inspection method, the inspection operation is performed by manually inspecting the probe electrodes of the tester by contacting the electrode surfaces of both ends of the chip laminated body 1 one by one by the inspector's manual operation. .
【０００６】[0006]
【発明が解決しようとする課題】前記のように従来で
は、チップ積層体を１個ずつ取出し、手作業によりチッ
プ積層体にテスタの電極を当てて特性試験を行っている
が、チップ積層体は長さが数mm程度の微小な部品である
ことから、その取扱いが厄介で作業能率が低くなるな
ど、量産設備での検査にはそぐわない問題があり、その
改善策が強く要望されている。As described above, conventionally, the chip laminates are taken out one by one and the characteristic test is conducted by manually applying the electrodes of the tester to the chip laminates. Since it is a minute part with a length of several millimeters, it is difficult to handle and the work efficiency is low. There are problems that make it unsuitable for inspection in mass production equipment, and improvement measures are strongly demanded.
【０００７】本発明は上記の点にかんがみなされたもの
であり、その目的は積層形ダイオードなどの半導体素子
を対象に、その特性試験，良否選別を人手作業に頼るこ
となく全て自動的に能率よく行えるようにした半導体素
子の自動検査装置を提供することにある。The present invention has been made in view of the above points, and an object thereof is to automatically and efficiently target semiconductor devices such as laminated diodes for characteristic tests and pass / fail selection without manual labor. An object of the present invention is to provide an automatic inspection device for a semiconductor device that can be performed.
【０００８】[0008]
【課題を解決するための手段】上記目的を達成するため
に、本発明の自動検出装置は、周上に定ピッチおきに並
んで被検査素子を１個ずつ収容する歯列状のスリットを
形成した円盤状の回転式検査ディスクと、該検査ディス
クの駆動用サーボモータと、検査ディスクに対してその
周上に設定した素子供給地点より前記スリット内へ被検
査素子を１個ずつ整列させて供給するフィーダと、検査
ディスクの周上に沿って配置した特性検測部，および良
品，不良品素子の排出部とを具備し、フィーダから１個
ずつ供給された半導体素子を検査ディスクのスリット内
に収容保持した状態で、検査ディスクが一周する間に被
検査素子の特性試験，および合否判定に基づく良品，不
良品の選別回収を行うよう構成するものとする。In order to achieve the above object, the automatic detection device of the present invention has a tooth-like slit for accommodating one element to be inspected at a constant pitch on the circumference. The disk-shaped rotary inspection disk, the servo motor for driving the inspection disk, and the element to be inspected are aligned and supplied into the slits one by one from the element supply point set on the circumference of the inspection disk. Equipped with a feeder, a characteristic inspection unit arranged along the circumference of the inspection disc, and a discharge unit for non-defective and defective devices, and the semiconductor devices supplied one by one from the feeder are placed in the slits of the inspection disc. In a state of being accommodated and held, the inspection disk is configured to perform a characteristic test of the element to be inspected, and to select and collect non-defective products and defective products based on pass / fail judgment.
【０００９】また、前記構成において、特性検測部に
は、スリットの内外周より被検査素子を挟んでその両端
電極面に当接するローラ電極，および可動電極を対とす
るテスタ電極を備えたものとし、さらに検査ディスクの
スリットに対向してフィーダからの素子供給地点に被検
査素子の供給有無を確認する素子検知センサを備え、該
センサの検出信号を基に検査ディスクとフィーダを連係
動作させるようにして実施することができる。Further, in the above-mentioned structure, the characteristic measuring section is provided with a roller electrode which is in contact with both end electrode surfaces of the element to be inspected from the inside and outside of the slit, and a tester electrode which is a pair of movable electrodes. Further, an element detection sensor for confirming the presence or absence of supply of the element to be inspected is provided at the element supply point from the feeder facing the slit of the inspection disk, and the inspection disk and the feeder are operated in association with each other based on the detection signal of the sensor. Can be carried out.
【００１０】[0010]
【作用】上記の構成において、フィーダには多数個の被
検査素子（図４に示したチップ積層体１）がランダムに
一括収容されており、被検査素子はフィーダの出口側で
１列に整列して検査ディスクのスリットに１個ずつ供給
される。そして、この素子供給動作に連係させながら検
査ディスクを定方向にピッチ送りすると、検査ディスク
が一周する間にスリットに収容保持された被検査素子に
対し、次記のように特性試験，および良品，不良品の選
別回収が行われる。In the above structure, the feeder randomly accommodates a large number of elements to be inspected (the chip stack 1 shown in FIG. 4), and the elements to be inspected are arranged in a line on the outlet side of the feeder. Then, the slits of the inspection disk are supplied one by one. When the inspection disk is pitch-fed in a fixed direction while being linked to the element supply operation, the characteristic test and the non-defective product are performed on the element to be inspected housed and held in the slit while the inspection disk makes one round as follows. Defective products are sorted and collected.
【００１１】すなわち、スリットに保持した半導体素子
が検査ディスクの周上に定めた特性検測位置に停止する
と、検査ディスクの内外周側から半導体素子を挟んでそ
の両端面にテスタ電極が当接し、この状態で特性試験
（極性チエック，順方向電圧／電流特性，逆回復時間特
性など）を行うとともに、その試験結果を基に検査装置
の制御部では良品，不良品を合否判定を行う。そして、
不良品と判定されたＮＧ素子は、各特性検測位置の後段
に配置した不良品素子の排出部に備えた例えばプッシャ
式のリジェクタにより検査ディスクから排除され、合格
した良品素子のみが最終位置で検査ディスクより選別回
収されて次の製造工程に搬送される。That is, when the semiconductor element held in the slit is stopped at the characteristic inspection position defined on the circumference of the inspection disk, the tester electrodes come into contact with both end surfaces of the inspection disk with the semiconductor element sandwiched between them. In this state, a characteristic test (polarity check, forward voltage / current characteristic, reverse recovery time characteristic, etc.) is performed, and based on the test result, the control unit of the inspection device determines whether the product is good or bad. And
NG elements judged to be defective are removed from the inspection disk by, for example, a pusher-type rejector provided in the discharge section for defective elements arranged after each characteristic inspection position, and only acceptable non-defective elements are placed at the final position. It is sorted and collected from the inspection disc and transported to the next manufacturing process.
【００１２】なお、被検査素子の供給，特性検測，良否
選別回収を含む一連の工程は全て制御部からの指令で自
動的に行われる。It should be noted that a series of steps including the supply of the device to be inspected, the characteristic inspection, and the pass / fail selection / collection are all automatically performed by a command from the control unit.
【００１３】[0013]
【実施例】以下、図４で述べた積層形ダイオードのチッ
プ積層体を例に、本発明の実施例による自動検査装置を
図面を参照して説明する。まず、図１（ａ),（ｂ）は自
動検査装置全体の構成概要図であり、検査装置は大別し
て円盤状の検査ディスク６と、素子供給基点から検査デ
ィスク６に被検査素子７（図４に示したチップ積層体
１）を１個ずつ供給するフィーダ８と、検査ディスク６
の周上に沿って分散配置した被検査素子の各種特性検測
部，および良品，不良品素子の排出部（これらを＃１〜
＃６で図中に表す）と、および図示されてない制御部と
から構成されている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An automatic inspection device according to an embodiment of the present invention will be described below with reference to the chip laminated body of the laminated diode described in FIG. 4 as an example. First, FIGS. 1A and 1B are schematic configuration diagrams of the entire automatic inspection apparatus. The inspection apparatus is roughly classified into a disk-shaped inspection disk 6 and an inspected element 7 (see FIG. 4 and the feeder 8 for supplying the chip stacks 1) shown in FIG.
Various characteristic inspection parts of the device under test distributed along the circumference of the device, and discharge parts for non-defective and defective devices (these are # 1
# 6) and a control unit (not shown).
【００１４】ここで、検査ディスク６は、その周上に定
ピッチおきに並んで被検査素子７を１個ずつ収容する歯
列状のスリット６ａが形成された回転式の円盤状ディス
クであり、該検査ディスク６にはディスクを軸中心の回
りに定ピッチ送りする駆動用のサーボモータ６ｂが連結
されている。また、フィーダ８はボゥルパーツフィーダ
８ａとリニアパーツフィーダ８ｂを直列に組合わせたも
ので、ボゥルフィーダ８ａにランダムに一括収容した被
検査素子７をリニアフィーダ８ｂで一列に整列させ、前
記検査ディスク６のスリット６ａに１個ずつ供給する。Here, the inspection disc 6 is a rotary disc-shaped disc having a tooth-like slit 6a for accommodating the inspected elements 7 one by one arranged on the circumference thereof at a constant pitch. The inspection disk 6 is connected with a driving servo motor 6b for feeding the disk around the center of the shaft at a constant pitch. Further, the feeder 8 is a combination of a ball parts feeder 8a and a linear parts feeder 8b connected in series, and the devices 7 to be inspected, which are randomly housed in the ball feeder 8a all at once, are aligned in a line by the linear feeder 8b, and the inspection disk 6 One by one is supplied to the slit 6a.
【００１５】一方、＃１の極性チエック部，＃２の順方
向特定検測部，＃４の逆回復時間特性検測部には、検査
ディスク６のスリット６ａを挟んでその内外周側に対向
配置した固定側のローラ電極９ａと、ソレノイドなどの
操作で前進，後退移動するロッド状の可動電極９ｂを組
合わせたテスタ電極９が配備されており、図２で示すよ
うに検査ディスク６のスリット６ａに収容保持された被
検査素子７が特性検測位置に到来すると、可動電極９ａ
が前進移動して被検査素子７の両端電極面にローラ電極
９ａと可動電極９ｂを当接し、この状態でテスタ１２よ
り電圧を印加して積層形ダイオードの特性試験を行う。
一方、＃３，＃５のＮＧ素子排出部には不良品排除用の
プッシャ式リジェクタ１０が、また＃６の良品素子回収
部には，良品排出用のプッシャ機構１１を備えている。On the other hand, the # 1 polarity check section, the # 2 forward direction specific measurement section, and the # 4 reverse recovery time characteristic measurement section face the inner and outer circumference sides of the slit 6a of the inspection disk 6. A tester electrode 9 is provided which is a combination of the fixed fixed roller electrode 9a and a rod-shaped movable electrode 9b that moves forward and backward by operating a solenoid or the like. As shown in FIG. When the device to be inspected 7 housed and held in 6a reaches the characteristic inspection position, the movable electrode 9a
Moves forward to bring the roller electrode 9a and the movable electrode 9b into contact with the electrode surfaces of both ends of the element to be inspected 7. In this state, a voltage is applied from the tester 12 to perform a characteristic test of the laminated diode.
On the other hand, the # 3 and # 5 NG element discharge parts are provided with pusher-type rejectors 10 for rejecting defective products, and the # 6 non-defective element recovery parts are provided with a pusher mechanism 11 for discharging good products.
【００１６】さらに、検査ディスク６のスリット６ａの
上方に対向して前記したフィーダ８からの素子供給地点
には、素子検知センサ（例えば光センサ）１３が配置さ
れており、このセンサで検査ディスク６への被検査素子
７の供給有無を検知確認するとともに、その検知信号を
基に検査ディスク６とフィーダ８とを連係して動作させ
るようにしている。なお、図３は前記検査装置の制御系
統を表したブロック図である。Further, an element detection sensor (for example, an optical sensor) 13 is arranged at the element supply point from the feeder 8 facing above the slit 6a of the inspection disk 6 and the inspection disk 6 is used by this sensor. The presence / absence of supply of the device 7 to be inspected is detected and confirmed, and the inspection disk 6 and the feeder 8 are operated in association with each other based on the detection signal. 3 is a block diagram showing the control system of the inspection device.
【００１７】次に前記構成による検査動作を説明する。
まず、検査ディスク６を停止した状態でフィーダ８より
スリット６ａに向けて被検査素子７を１個供給する。こ
れをセンサ１３が検知すると、その検知信号を基に制御
部からの指令でフィーダ７の供給動作を一旦停止すると
ともに、サーボモータ６ｂを始動して検査ディスク６を
定方向に定ピッチ送りするように検査ディスク６とフィ
ーダ８を連係させながら運転制御する。Next, the inspection operation according to the above configuration will be described.
First, one element 7 to be inspected is supplied from the feeder 8 toward the slit 6a while the inspection disk 6 is stopped. When this is detected by the sensor 13, the supply operation of the feeder 7 is temporarily stopped by a command from the control unit based on the detection signal, and the servo motor 6b is started to feed the inspection disk 6 at a constant pitch in a fixed direction. The operation is controlled while the inspection disk 6 and the feeder 8 are linked to each other.
【００１８】一方、検査ディスク６のピッチ送り動作に
より、スリット６ａに収容保持された被検査素子７が後
段に並ぶ特性検測位置（＃１，＃２，＃４）に到来する
と、テスタ電極９の可動電極９ｂが前進して被検査素子
７の両端電極面に電極９ａと９ｂを圧接し、この状態で
テスタ１３より電圧を印加してｐｎ極性チエック，順方
向電圧／電流特性，逆回復時間特性の各試験を行うとと
もに、この試験データは制御部に送られ、その合否判定
部で良品，不良品を判定する。ここで、不良品と判定さ
れたＮＧ素子は、制御部から指令により後段に配置した
ＮＧ素子排出部（＃３，＃５）に移動したところで、リ
ジェクタ１０の動作で検査ディスク６のスリット６ａか
ら排除され、良品のみが最終の良品素子回収部（＃６）
にてプッシャ機構１１により検査ディスク７から回収さ
れ、次の製造工程に送出される。そして、検査ディスク
６が一周すると、再び空になったスリット６ａにフィー
ダ８を通じて次の被検査素子７が供給されて前記と同様
な検査を行う。On the other hand, when the inspected element 7 housed and held in the slit 6a arrives at the characteristic inspection position (# 1, # 2, # 4) arranged in the subsequent stage by the pitch feeding operation of the inspection disk 6, the tester electrode 9 Movable electrode 9b moves forward and presses electrodes 9a and 9b against the electrode surfaces of both ends of element to be inspected 7. In this state, voltage is applied from tester 13 to pn polarity check, forward voltage / current characteristic, reverse recovery time. While each characteristic test is performed, this test data is sent to the control unit, and the pass / fail determination unit determines whether the product is a good product or a defective product. Here, the NG element determined to be defective is moved from the control section to the NG element discharging section (# 3, # 5) arranged in the subsequent stage in response to the instruction from the control section. Excluded, only non-defective product is the final non-defective device collection section (# 6)
At, the pusher mechanism 11 collects the inspection disk 7 and sends it to the next manufacturing process. Then, when the inspection disk 6 makes one round, the next inspected element 7 is supplied to the vacant slit 6a through the feeder 8 to perform the same inspection as described above.
【００１９】なお、必要により良品，不良品素子排出部
の後段側にはＮＧ素子の排出ミスをチエックするセンサ
を設けるなどして実施することができる。If necessary, a sensor for checking the ejection failure of the NG element may be provided on the rear stage side of the non-defective / defective element ejection section.
【００２０】[0020]
【発明の効果】以上述べたように本発明の自動検査装置
によれば、被検査半導体素子の供給から特性試験，合否
判定，良品，不良品素子の選別回収までの一連の検査工
程を人手作業に頼ることなく自動的に能率よく行うこと
ができ、これにより省人力化，並びに生産性の向上に大
きく寄与できる。As described above, according to the automatic inspection apparatus of the present invention, a series of inspection steps from supply of semiconductor elements to be inspected to characteristic test, acceptance / rejection determination, and selection / collection of non-defective / defective elements are manually performed. This can be done automatically and efficiently without relying on, which greatly contributes to manpower saving and productivity improvement.
【図１】本発明の実施例による自動検査装置の主要部の
構成概要図であり、（ａ）は平面図、（ｂ）は側面図FIG. 1 is a schematic configuration diagram of a main part of an automatic inspection device according to an embodiment of the present invention, in which (a) is a plan view and (b) is a side view.
【図２】図１の特性検測部に設置したテスタ電極の具体
的な構成図FIG. 2 is a specific configuration diagram of a tester electrode installed in the characteristic inspection unit of FIG.
【図３】本発明による自動検査装置の制御系統のブロッ
ク図FIG. 3 is a block diagram of a control system of the automatic inspection device according to the present invention.
【図４】本発明の検査対象となる積層形ダイオードの構
成，および製造法の説明図であり、（ａ）はダイオード
製品の構成断面図、（ｂ）はウェーハ積層体の斜視図、
（ｃ）はチップ積層体の斜視図4A and 4B are explanatory views of a structure and a manufacturing method of a laminated diode to be inspected of the present invention, FIG. 4A is a sectional view of a structure of a diode product, and FIG. 4B is a perspective view of a wafer laminated body;
(C) is a perspective view of the chip laminated body.
【符号の説明】 ６ 検査ディスク ６ａ スリット ６ｂ サーボモータ ７ 被検査素子 ８ フィーダ ９ テスタ電極 ９ａ ローラ電極 ９ｂ 可動電極 １０ 不良品排除用のリジェクタ １１ 良品回収用のプッシャ機構 ＃１，＃２，＃４ 特性検測部 ＃３，＃５ ＮＧ素子排出部 ＃６ 良品素子回収部[Explanation of Codes] 6 Inspection Disc 6a Slit 6b Servo Motor 7 Inspected Element 8 Feeder 9 Tester Electrode 9a Roller Electrode 9b Movable Electrode 10 Rejector for Eliminating Defective Product 11 Pusher Mechanism for Recovering Good Product # 1, # 2, # 4 Characteristic inspection section # 3, # 5 NG element discharge section # 6 Good element collection section
Claims (3)
層形ダイオードなどを対象に、その特性試験，および良
否選別を自動的に行う半導体素子の自動検査装置であっ
て、周上に定ピッチおきに並んで被検査素子を１個ずつ
収容する歯列状のスリットを形成した円盤状の回転式検
査ディスクと、該検査ディスクの駆動用サーボモータ
と、検査ディスクに対してその周上に設定した素子供給
地点より前記スリット内へ被検査素子を１個ずつ整列さ
せて供給するフィーダと、検査ディスクの周上に沿って
配置した特性検測部，および良品，不良品素子の排出部
とを具備し、フィーダから１個ずつ供給された半導体素
子を検査ディスクのスリット内に収容保持した状態で、
検査ディスクが一周する間に被検査素子の特性試験，お
よび合否判定に基づく良品，不良品の選別回収を行うこ
とを特徴とする半導体素子の自動検査装置。1. An automatic inspection device for a semiconductor device, which automatically performs a characteristic test and a pass / fail test for a high-voltage laminated diode in which a plurality of chips are laminated in a columnar shape, and which is fixed on the circumference. A disk-shaped rotary inspection disk in which tooth-like slits for accommodating one element to be inspected are arranged side by side at every pitch, a servo motor for driving the inspection disk, and a periphery of the inspection disk with respect to the inspection disk. A feeder for aligning and supplying the inspected elements one by one from the set element supply point into the slit, a characteristic inspection section arranged along the circumference of the inspection disk, and a discharge section for non-defective and defective elements. In a state in which the semiconductor elements supplied from the feeder one by one are accommodated and held in the slit of the inspection disk,
An automatic inspection device for semiconductor devices, which is characterized by performing a characteristic test of an inspected device while the inspection disk makes one round, and selecting and collecting non-defective products and defective products based on pass / fail judgment.
性検測部には、スリットの内外周より被検査素子を挟ん
でその両端電極面に当接するローラ電極，および可動電
極を対とするテスタ電極を備えたことを特徴とする半導
体素子の自動検査装置。2. The automatic inspection apparatus according to claim 1, wherein the characteristic inspection section is a pair of a roller electrode and a movable electrode which are in contact with both end electrode surfaces of the element to be inspected from the inner and outer circumferences of the slit. An automatic inspection device for a semiconductor device, which is equipped with a tester electrode.
査ディスクのスリットに対向してフィーダからの素子供
給地点に被検査素子の供給有無を確認する素子検知セン
サを備え、該センサの検出信号を基に検査ディスクとフ
ィーダを連係動作させるようにしたことを特徴とする半
導体素子の自動検査装置。3. The automatic inspection apparatus according to claim 1, further comprising an element detection sensor for checking whether or not an element to be inspected is supplied at an element supply point from a feeder, facing an slit of the inspection disk, and a detection signal of the sensor. An automatic inspection device for semiconductor elements, characterized in that the inspection disk and the feeder are linked to each other based on the above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6281597A JPH0886833A (en) | 1994-07-22 | 1994-11-16 | Automatic inspection apparatus for semiconductor element |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17057094 | 1994-07-22 | ||
| JP6-170570 | 1994-07-22 | ||
| JP6281597A JPH0886833A (en) | 1994-07-22 | 1994-11-16 | Automatic inspection apparatus for semiconductor element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0886833A true JPH0886833A (en) | 1996-04-02 |
Family
ID=26493527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6281597A Pending JPH0886833A (en) | 1994-07-22 | 1994-11-16 | Automatic inspection apparatus for semiconductor element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0886833A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10260214A (en) * | 1997-03-17 | 1998-09-29 | Taiyo Yuden Co Ltd | Measuring device of chip-shaped circuit part |
| US6787374B2 (en) | 2001-05-31 | 2004-09-07 | Hitachi, Ltd. | Semiconductor device manufacturing method and semiconductor device sorting system to be used with the same |
| CN100465652C (en) * | 2005-10-20 | 2009-03-04 | 天津科技大学 | Polarity finder of electronic device of automatic braiding machine and testing method thereof |
| DE102012216641A1 (en) | 2011-09-26 | 2013-03-28 | Mitsubishi Electric Corp. | Semiconductor chip test method and semiconductor chip tester |
| CN113877846A (en) * | 2021-12-08 | 2022-01-04 | 苏州佳祺仕信息科技有限公司 | Detection device and method for detecting magnetic flux |
| CN114378006A (en) * | 2022-01-11 | 2022-04-22 | 广东国顺隆电子科技有限公司 | Full-automatic checking and testing device for annular piezoresistor |
-
1994
- 1994-11-16 JP JP6281597A patent/JPH0886833A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10260214A (en) * | 1997-03-17 | 1998-09-29 | Taiyo Yuden Co Ltd | Measuring device of chip-shaped circuit part |
| US6787374B2 (en) | 2001-05-31 | 2004-09-07 | Hitachi, Ltd. | Semiconductor device manufacturing method and semiconductor device sorting system to be used with the same |
| CN100465652C (en) * | 2005-10-20 | 2009-03-04 | 天津科技大学 | Polarity finder of electronic device of automatic braiding machine and testing method thereof |
| DE102012216641A1 (en) | 2011-09-26 | 2013-03-28 | Mitsubishi Electric Corp. | Semiconductor chip test method and semiconductor chip tester |
| US9153502B2 (en) | 2011-09-26 | 2015-10-06 | Mitsubishi Electric Corporation | Semiconductor chip testing method and semiconductor chip testing device |
| DE102012216641B4 (en) | 2011-09-26 | 2022-08-11 | Mitsubishi Electric Corp. | Semiconductor chip testing method and semiconductor chip testing device |
| CN113877846A (en) * | 2021-12-08 | 2022-01-04 | 苏州佳祺仕信息科技有限公司 | Detection device and method for detecting magnetic flux |
| CN114378006A (en) * | 2022-01-11 | 2022-04-22 | 广东国顺隆电子科技有限公司 | Full-automatic checking and testing device for annular piezoresistor |
| CN114378006B (en) * | 2022-01-11 | 2023-09-08 | 广东国顺隆电子科技有限公司 | Full-automatic checking and testing device for annular piezoresistor |
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