JPH088567A - Cooling device and heat conducting mechanism section of part - Google Patents
Cooling device and heat conducting mechanism section of partInfo
- Publication number
- JPH088567A JPH088567A JP6142036A JP14203694A JPH088567A JP H088567 A JPH088567 A JP H088567A JP 6142036 A JP6142036 A JP 6142036A JP 14203694 A JP14203694 A JP 14203694A JP H088567 A JPH088567 A JP H088567A
- Authority
- JP
- Japan
- Prior art keywords
- heat conduction
- component
- conduction mechanism
- housing
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、部品の冷却装置に係
り、特に部品で発生した熱を筐体を利用して筐体外部に
放熱する電子部品の冷却装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device for components, and more particularly to a cooling device for electronic components that radiates heat generated in components to the outside of the casing by utilizing the casing.
【０００２】電子機器の小型軽量化の追及の結果、部品
の配置密度が高まり、其れに伴う発熱密度も大きくなっ
てきている。As a result of pursuing reduction in size and weight of electronic devices, the arrangement density of components has increased, and the heat generation density associated therewith has also increased.
【０００３】このため部品を冷却する手段を施すこと
は、電子機器の信頼性を得るために重要である。Therefore, it is important to provide a means for cooling the components in order to obtain the reliability of the electronic equipment.
【０００４】[0004]
【従来の技術】従来における部品が発生する熱の冷却
は、例えば電子部品が搭載される電子機器が携帯用のパ
ソコン（パーソナルコンピュター）のような小型機であ
る場合には、形状が大なる強制冷却装置を設けるスペー
スが無いため、自然対流によって行われている。2. Description of the Related Art Conventional cooling of heat generated by components is forced to have a large shape when the electronic equipment on which the electronic components are mounted is a small machine such as a portable personal computer (personal computer). Since there is no space to install a cooling device, natural convection is used.
【０００５】一方、電子部品が搭載される電子機器が大
型コンピューターのような大型機である場合には、冷却
ファン、或いは水冷装置のような冷却方法が適用されて
いる。On the other hand, when the electronic device on which the electronic parts are mounted is a large machine such as a large computer, a cooling method such as a cooling fan or a water cooling device is applied.
【０００６】[0006]
【発明が解決しようとする課題】しかし、年々小型、軽
量化される傾向にあるコンピュータにおいては、上記し
た従来の冷却方法では充分な冷却処理が行えなくなって
きた。However, in the computer, which tends to be smaller and lighter year by year, the conventional cooling method described above cannot perform sufficient cooling processing.
【０００７】即ち、例えばラップトップ型のパソコンを
例に挙げると、この種のパソコンは小型化のために実装
密度が上がり、発熱密度の上がる一方で、大気を循環さ
せることのできる空間が減って熱が籠もりやすくなって
きている。[0007] That is, for example, in the case of a laptop personal computer as an example, this type of personal computer has a higher packaging density due to its miniaturization and a higher heat generation density, while the space for circulating the atmosphere is reduced. The heat is getting easier.
【０００８】また、冷却ファンや水冷装置は、設置する
のに広いスペースが必要であり装置の小型化軽量化の要
請と相反する。Further, the cooling fan and the water cooling device require a large space for installation, which conflicts with the demand for size reduction and weight reduction of the device.
【０００９】本発明は、上記の点を鑑みて成されたもの
であり、大気よりも高い熱伝導率を有する部材を熱伝導
機構部として、部品から発生する熱を、電子機器の筐体
へ直接伝え、電子機器外へ放熱させることによって、効
果的に部品を冷却し得る部品の冷却装置を提案すること
を目的とする。The present invention has been made in view of the above points, and uses a member having a thermal conductivity higher than that of the atmosphere as a heat conduction mechanism section to transfer heat generated from a component to a housing of an electronic device. An object of the present invention is to propose a component cooling device capable of effectively cooling components by directly transmitting the heat and dissipating the heat outside the electronic device.
【００１０】[0010]
【課題を解決するための手段】請求項１記載の発明は、
筐体を有する電子機器内で、該筐体との間に空間部を有
するように配置された部品を冷却する部品の冷却装置に
おいて、該部品と筐体の間に熱伝導機構部を介装して成
ることを特徴とする。According to the first aspect of the present invention,
In a component cooling device for cooling a component arranged to have a space between the component and an electronic device having a casing, a heat conduction mechanism is interposed between the component and the casing. It is characterized by consisting of.
【００１１】請求項２記載の発明は、熱伝導機構部部
を、高熱伝導体と、高熱伝導体を内部に封入する包装袋
から構成し、包装袋に封入された高熱伝導体が室温付近
で常温か、または常温付近で液相である部材と、室温付
近で固相である部材の混合物により、該包装袋の外郭形
状が、変形し得る構成として成ることを特徴とする。According to a second aspect of the present invention, the heat conduction mechanism portion is composed of a high thermal conductor and a packaging bag in which the high thermal conductor is enclosed, and the high thermal conductor enclosed in the packaging bag is near room temperature. The outer shape of the packaging bag can be deformed by a mixture of a member that is in a liquid phase at or near room temperature and a member that is in a solid phase at around room temperature.
【００１２】請求項３の発明は、該熱伝導機構部を部品
と当接することにより、熱的に接続される第１の部材
と、筐体と当接することにより熱的に接続される第２の
部材と、第１の部材を該部品に向け付勢すると共に、該
第２の部材を筐体に向けて付勢する付勢手段とにより構
成することを特徴とする。According to a third aspect of the present invention, a first member is thermally connected by bringing the heat conducting mechanism into contact with a component, and a second member is thermally connected with being brought into contact with the housing. And a biasing unit that biases the first member toward the component and biases the second member toward the housing.
【００１３】[0013]
【作用】上記の各手段は、下記のようにして作用する。The above-mentioned means operate as follows.
【００１４】請求項１記載の発明によれば、部品で発生
した熱は、部品と筐体との間に熱伝導機構部が介装され
ているため、この熱伝導機構部を介して筐体に熱伝導し
ていく。また、熱伝導機構部は高い熱伝導率を有するた
め、熱効率良く筐体に熱伝導していく。According to the first aspect of the present invention, the heat generated in the component has the heat conduction mechanism interposed between the component and the casing. Therefore, the heat is generated through the heat conduction mechanism. Conduct heat to. Moreover, since the heat conduction mechanism has a high heat conductivity, heat is efficiently conducted to the housing.
【００１５】更に筐体は大気と接しており、また大気と
の接触面積は広い。よって、筐体に熱伝導された熱は効
率よく大気に放熱される。Further, the housing is in contact with the atmosphere, and the contact area with the atmosphere is wide. Therefore, the heat conducted to the housing is efficiently radiated to the atmosphere.
【００１６】請求項２の発明によれば、熱伝導機構部が
包装体内に高熱伝導率流体を封入して成る構成とされて
いるため、高熱伝導率流体の流動性により、その外郭形
状が変形し得る構成となっている。 よって、冷却すべ
き部品の形状に凹凸がある場合、あるいは高さが一様で
ない場合、 異なる複数の部品を一括的に冷却する場合に
おいても、部品と熱伝導機構部の密着性を良好に保つこ
とができる。According to the second aspect of the present invention, since the heat conduction mechanism portion is constituted by enclosing the high thermal conductivity fluid in the package, the outer shape thereof is deformed due to the fluidity of the high heat conductivity fluid. It can be configured. Therefore, even if the shape of the parts to be cooled has unevenness, or if the heights are not uniform, even if multiple different parts are cooled collectively, good adhesion between the parts and the heat transfer mechanism is maintained. be able to.
【００１７】また、これにより部品と熱伝導機構部の接
触面積を大きくとることができ、部品で発生する熱を、
効率よく筐体へ伝えることが可能となる。Further, this makes it possible to increase the contact area between the component and the heat conduction mechanism portion, and to reduce the heat generated by the component.
It is possible to efficiently transmit to the case.
【００１８】更に請求項３の発明によれば、熱伝導機構
部が機械的な構造を有するために、高熱伝導流体の経時
劣化が発生する恐れが無くなり、また包装袋の劣化に起
因する液漏れの発生を防止することができる。更に、包
装袋を介さないで高熱伝導率部材を部品、及び筐体に直
接熱的に接続することができる。Further, according to the invention of claim 3, since the heat transfer mechanism has a mechanical structure, there is no possibility of deterioration of the high heat transfer fluid over time, and leakage of liquid due to deterioration of the packaging bag. Can be prevented. Further, the high thermal conductivity member can be directly and thermally connected to the component and the housing without using the packaging bag.
【００１９】[0019]
【実施例】本発明の実施例を図面と共に説明する。Embodiments of the present invention will be described with reference to the drawings.
【００２０】図２は、本発明の第１実施例を適用して成
る、ノート型の小型パソコンを説明した概略図である。FIG. 2 is a schematic diagram illustrating a notebook type personal computer to which the first embodiment of the present invention is applied.
【００２１】同図に示される１は半導体装置（ＩＣ）等
の部品であり、稼働することによって熱を発生する。Reference numeral 1 shown in the figure is a component such as a semiconductor device (IC), which generates heat when it is operated.
【００２２】２はパソコンを構成する筐体であり、樹脂
等の部材から成る。また、３は部品１を装着したプリン
ト配線板で、筐体２内に配設されている。Reference numeral 2 denotes a housing which constitutes a personal computer and is made of a member such as resin. Reference numeral 3 denotes a printed wiring board on which the component 1 is mounted, which is arranged inside the housing 2.
【００２３】７はパソコンの液晶デイスプレイで、８は
データ等の入力を行なうキーボードである。Reference numeral 7 is a liquid crystal display of a personal computer, and 8 is a keyboard for inputting data and the like.
【００２４】更に、４ａは、本発明の第１実施例による
熱伝導機構部である。Further, 4a is a heat conduction mechanism portion according to the first embodiment of the present invention.
【００２５】ここで本発明の要部となる、熱伝導機構部
４ａを用いて構成される冷却装置部分を、より詳細に図
１（Ａ）、（Ｂ）を用いて説明する。Here, a cooling device portion constituted by using the heat conduction mechanism portion 4a, which is an essential portion of the present invention, will be described in more detail with reference to FIGS. 1 (A) and 1 (B).
【００２６】図１（Ａ）は、プリント配線板３と、部品
１、熱伝導機構部４ａ、筐体２の位置関係を示した図で
ある。熱伝導機構部４ａは、同図に示されるように、部
品１と筐体２の間に介装されている。FIG. 1A is a diagram showing the positional relationship among the printed wiring board 3, the component 1, the heat conduction mechanism portion 4a, and the housing 2. As shown in FIG. The heat conduction mechanism portion 4a is interposed between the component 1 and the housing 2 as shown in the figure.
【００２７】熱伝導機構部４ａは、図１（Ｂ）に示す通
り、包装袋６中に高熱伝導体５を封入して成る構造を有
している。包装袋６は、アルミニウム箔を数種類の有機
樹脂で挟んで接合させた多層構造の膜によってなる袋で
出来ており、層全体の厚みは１．２ｍｍである。As shown in FIG. 1B, the heat conduction mechanism section 4a has a structure in which a high heat conductor 5 is enclosed in a packaging bag 6. The packaging bag 6 is made of a bag having a multi-layered structure in which an aluminum foil is sandwiched and bonded with several kinds of organic resins, and the total thickness of the layers is 1.2 mm.
【００２８】また、熱伝導機構部４ａは、部品１及び、
筐体２への圧着性を上げるために、筐体２と部品１の間
隔よりも２０％大きい値の厚さに設計する。今回の実験
で製作した熱伝導機構部４ａは、高熱伝導体５として、
水銀５０ｍｌを使っており、この高熱伝導体５を内部に
封入した状態で包装袋６の外形は、縦６ｃｍ×横８ｃ
ｍ、最大の厚みは１．２ｃｍとし、この構造で作られた
熱伝導機構部４ａは、高熱伝導体５が水銀であり、常温
（２５℃付近で）液体であることより、形状の変形が可
能であり、部品１と筐体２との間によく密着性よく介装
することができる。Further, the heat conduction mechanism portion 4a includes the component 1 and
In order to improve the crimpability to the housing 2, the thickness is designed to be 20% larger than the distance between the housing 2 and the component 1. The heat conduction mechanism portion 4a manufactured in this experiment is the high heat conductor 5
50 ml of mercury is used, and the outer shape of the packaging bag 6 with the high thermal conductor 5 sealed inside is 6 cm in length × 8 c in width.
m, the maximum thickness is 1.2 cm, and the heat conduction mechanism portion 4a made with this structure has a shape deformation due to the high heat conductor 5 being mercury and a liquid at room temperature (around 25 ° C.). It is possible, and it is possible to interpose between the component 1 and the housing 2 with good adhesion.
【００２９】よって、部品１で発生した熱は包装袋６を
介して高熱伝導体５へ熱伝導し、続いて高熱伝導体５か
ら筐体２へと熱が伝導する。Therefore, the heat generated in the component 1 is conducted to the high thermal conductor 5 through the packaging bag 6, and then the heat is conducted from the high thermal conductor 5 to the housing 2.
【００３０】また上記のように、高熱伝導体５として高
熱伝導率流体である水銀を使用しているため、高熱伝導
体５に生じた高温部分は、より温度の低い低温部分であ
る筐体２側への移動、即ち対流を生じる。Further, as described above, since mercury, which is a high thermal conductivity fluid, is used as the high thermal conductor 5, the high temperature portion generated in the high thermal conductor 5 is the low temperature portion of the housing 2 which is lower in temperature. The movement to the side, that is, convection occurs.
【００３１】よって、部品１側で温められた高熱伝導体
５を筐体側へ送り、筐体２は高熱伝導体５の熱を小型パ
ソコンの外へ放熱することで高熱伝導体５の温度を下げ
る。Therefore, the high thermal conductor 5 warmed on the component 1 side is sent to the housing side, and the casing 2 radiates the heat of the high thermal conductor 5 to the outside of the small personal computer to lower the temperature of the high thermal conductor 5. .
【００３２】温度の下がった高熱伝導体５は、部品１側
の高熱伝導体５の高温部が、上記対流によって移動して
くることで、再び部品１側へ移動する。The high thermal conductor 5 whose temperature has dropped moves to the component 1 side again when the high temperature portion of the high thermal conductor 5 on the component 1 side moves due to the convection.
【００３３】こうした対流の現象は熱伝導機構部４ａの
部品１を冷却する効果を促進する。ところで、現在一般
的に、筐体２の材質として、放熱効果の高い部材の開発
が成されている。Such a phenomenon of convection promotes the effect of cooling the component 1 of the heat conduction mechanism portion 4a. By the way, generally, as a material of the housing 2, a member having a high heat dissipation effect has been developed.
【００３４】本発明による部品１の冷却装置は、部品１
で発生する熱を筐体２に、熱伝導機構部４ａによって直
接接続する構成であるために、放熱効果の高い部材によ
り筐体２を形成することには部品１の放熱効果が更に上
がることが期待される。また、高熱伝導部材に流動体を
用いたことで、電子機器に加わる衝撃を緩和する効果も
得られる。A cooling device for a component 1 according to the present invention comprises a component 1
Since the heat generated in 1 is directly connected to the housing 2 by the heat conduction mechanism portion 4a, forming the housing 2 with a member having a high heat dissipation effect can further enhance the heat dissipation effect of the component 1. Be expected. In addition, the use of the fluid for the high thermal conductivity member also has the effect of reducing the impact applied to the electronic device.
【００３５】尚、上記実施例では、高熱伝導体５とし
て、水銀（Ｈｇ）を使用したが、水銀に代えて、常温で
液相であるＧａ（融点、２９．７℃）等を用いることが
考えられる次に本発明者が本発明の効果を実証するため
に行なった実験について説明する。以下説明する実験に
おいては、図２に示すノート型のパソコンに本発明を適
用した。In the above embodiment, mercury (Hg) was used as the high thermal conductor 5, but Ga (melting point, 29.7 ° C.) which is a liquid phase at room temperature may be used instead of mercury. Considerable Next, an experiment conducted by the present inventor to demonstrate the effect of the present invention will be described. In the experiments described below, the present invention was applied to the notebook personal computer shown in FIG.
【００３６】実験の対象となった１電子部品は、その規
格は１６０ピン、ＳＱＦＢ（Ｓｈｒｉｎｋ Ｑｕａｄ
Ｆｌａｔ Ｐａｋａｇｅ）、ＣＰＵ（Ｃｅｎｔｒａｌ
Ｐｒｏｓｅｓｓｉｎｇ Ｕｎｉｔ）その発熱量は２．４
Ｗである。プリント板は１．２ｍｍの厚さで、このほぼ
中央に電子部品を配した。筐体２は１．５ｍｍのＡＢＳ
（Ａｃｒｙｌｏｎｉｔｒｉｌｅ Ｂｕｔａｄｉｅｎｅ
Ｓｔｙｒｅｎｅ）樹脂製である。One electronic component that was the subject of the experiment has a 160-pin standard, SQFB (Shrink Quad).
Flat Package), CPU (Central)
Processing Unit) The calorific value is 2.4.
W. The printed board had a thickness of 1.2 mm, and the electronic parts were arranged in the approximate center. Case 2 is ABS of 1.5 mm
(Acrylonitrile Butadiene
Styrene) resin.
【００３７】先ず本発明の冷却装置を使用しない場合、
即ち電子部品の冷却は、電子機器内の大気の自然対流に
よるだけである場合について、ノート型パソコン本体の
稼働時に電子部品の温度を測定したところ５５℃であっ
た。First, when the cooling device of the present invention is not used,
That is, when the cooling of the electronic component was only due to natural convection of the atmosphere in the electronic device, the temperature of the electronic component was measured at the time of operating the notebook computer main body, and it was 55 ° C.
【００３８】これに対し、熱伝導機構部４ａを用いた本
発明の電子部品冷却装置を図２のノート型パソコンを使
って稼働時の電子部品の温度を測定したところ、３５℃
であった。On the other hand, when the temperature of the electronic component during operation of the electronic component cooling device of the present invention using the heat conduction mechanism portion 4a was measured using the notebook computer shown in FIG.
Met.
【００３９】つまり、図１の熱伝導機構部４ａを使った
冷却装置によって電子部品の温度は２０℃下がったこと
になり、顕著な冷却効果が観測された。That is, the temperature of the electronic component was lowered by 20 ° C. by the cooling device using the heat conduction mechanism portion 4a of FIG. 1, and a remarkable cooling effect was observed.
【００４０】図３（Ａ）は、本発明の第２実施例による
熱伝導機構部４ｂを搭載した場合のノート型パソコンを
示している。FIG. 3A shows a notebook type personal computer in which the heat conduction mechanism portion 4b according to the second embodiment of the present invention is mounted.
【００４１】本実施例に用いる熱伝導機構部４ｂは図３
（Ｂ）に示す構造のもので、図１（Ｂ）に記載したのと
同様の包装体６を使用し、高熱伝導体９として、常温付
近で液相である水銀２５ｍｌと、常温付近で固相である
アルミニウム粉末５０ｇの混合物を使用し、水銀の流動
性によって形状を変形可能な構造としたものである。上
記のように、熱伝導機構部４ｂの高熱伝導体９を水銀２
５ｍｌと、アルミニウム粉末５０ｇの混合物にしたこと
で、包装袋６は水銀の流動性による形状を変形可能な構
造に維持でき、水銀より高い熱伝導率を有するアルミニ
ウムを含有させることにより熱伝導機構部４ｂ全体の熱
伝導性を向上させることができた。The heat transfer mechanism 4b used in this embodiment is shown in FIG.
The structure shown in FIG. 1 (B) is used, and the same packaging body 6 as that shown in FIG. 1 (B) is used, and as the high thermal conductor 9, 25 ml of mercury which is a liquid phase at around room temperature and solid at around room temperature are used. A mixture of 50 g of aluminum powder, which is a phase, is used, and the shape is deformable by the fluidity of mercury. As described above, the high heat conductor 9 of the heat conduction mechanism portion 4b is replaced with the mercury 2
By using a mixture of 5 ml and 50 g of aluminum powder, the packaging bag 6 can maintain the shape due to the fluidity of mercury in a deformable structure, and by containing aluminum having a higher thermal conductivity than mercury, the heat conduction mechanism part. It was possible to improve the thermal conductivity of the entire 4b.
【００４２】上記第２実施例では、固相である高熱伝導
率部材としてアルミニウム粉末を用いたが、アルミに代
えて熱伝導性の高い銀（Ａｇ），インジウム（Ｉｎ）を
用いることも可能である。In the second embodiment, aluminum powder is used as the solid phase high thermal conductivity member, but silver (Ag) or indium (In) having high thermal conductivity can be used instead of aluminum. is there.
【００４３】また、第１実施例の実験と同様に熱伝導機
構部４ｂをノート型パソコンに取り付けて稼働時の電子
部品温度を測定した結果、３０℃を得た。即ち、熱伝導
機構部４ｂを使った冷却装置によって電子部品の温度は
２５℃下がったことになり、第１実施例同様、顕著な冷
却効果が観測された。Further, as in the experiment of the first embodiment, the heat conduction mechanism portion 4b was attached to the notebook type personal computer, and the temperature of the electronic parts during operation was measured. As a result, 30 ° C. was obtained. That is, the temperature of the electronic component was lowered by 25 ° C. by the cooling device using the heat conduction mechanism portion 4b, and the remarkable cooling effect was observed as in the first embodiment.
【００４４】図４（Ａ）は本発明、第３実施例による熱
伝導機構部４ｃをノート型の小型パソコンに搭載した例
を示した図である。FIG. 4A is a diagram showing an example in which the heat conduction mechanism portion 4c according to the third embodiment of the present invention is mounted on a small notebook type personal computer.
【００４５】熱伝導機構部４ｃの詳細な構造を図４
（Ｃ）ないし４（Ｄ）により説明する。FIG. 4 shows the detailed structure of the heat conduction mechanism section 4c.
This will be described with reference to (C) to 4 (D).
【００４６】図４（Ｂ）は本実施例による熱伝導機構部
４ｃを電子部品１と、筐体２との間に介在させた状態を
拡大して示すものである。FIG. 4B is an enlarged view showing a state in which the heat conduction mechanism portion 4c according to this embodiment is interposed between the electronic component 1 and the housing 2.
【００４７】熱伝導機構部４ｃは、電子部品１と密着し
熱的に接続される、第１の部材１１と、筐体２に密着し
熱的に接続される第２の部材１２と、第１の部材１１と
第２の部材１２との間に介装されるコイルスプリング状
のバネ１０から構成される。図４（Ｃ）、図４（Ｄ）に
示すように、第１の部材１１は、ピストン部１１ｂと、
このピストン部１１ｂの上部に設けられる円盤１１ａか
ら構成されている。また第２の部材１２は、シリンダー
部１２ｂと、このピストン部１２ｂの上部に設けられる
円盤１２ａから構成されている。The heat conduction mechanism portion 4c includes a first member 11 which is in close contact with the electronic component 1 and is thermally connected thereto, a second member 12 which is in close contact with the housing 2 and is thermally connected thereto, and a second member 12. The coil spring-like spring 10 is interposed between the first member 11 and the second member 12. As shown in FIGS. 4 (C) and 4 (D), the first member 11 includes a piston portion 11b,
It is composed of a disk 11a provided above the piston portion 11b. The second member 12 is composed of a cylinder portion 12b and a disk 12a provided above the piston portion 12b.
【００４８】ピストン部１１ｂはシリンダー部１２ｂ内
に摺動可能に挿入されており、よって熱伝導機構部４ｃ
は上下方向に伸縮し得る構成となっている。また、バネ
１０は各円盤１１ａ、１２ａを離間させる方向に弾性力
を付勢する。The piston portion 11b is slidably inserted into the cylinder portion 12b, so that the heat conduction mechanism portion 4c is provided.
Has a structure capable of expanding and contracting in the vertical direction. Further, the spring 10 urges an elastic force in a direction in which the disks 11a and 12a are separated from each other.
【００４９】第１の部材１１を構成する円盤１１ａ、ピ
ストン部１１ｂ、第２の部材１２を構成する円盤１２
ａ、シリンダー部１２ｂ、及びバネ１０はいずれも熱伝
導率の高いアルミニウムで作られている。The disk 11a forming the first member 11, the piston portion 11b, and the disk 12 forming the second member 12
The a, the cylinder portion 12b, and the spring 10 are all made of aluminum having high thermal conductivity.
【００５０】本発明実施例においては、円盤１１ａ、円
盤１２ａは半径２．５ｃｍ、厚さ１．５ｍｍのサイズと
し、バネ１０の高さは１．５ｃｍのものを使用してい
る。上記構成の熱伝導機構部４ｃは、図４（Ｂ）に示す
ように、電子部品１と筐体２との間に、バネ１０が圧縮
された状態で介装される。In the embodiment of the present invention, the disks 11a and 12a have a radius of 2.5 cm and a thickness of 1.5 mm, and the spring 10 has a height of 1.5 cm. As shown in FIG. 4B, the heat conduction mechanism section 4c having the above-described configuration is interposed between the electronic component 1 and the housing 2 in a state where the spring 10 is compressed.
【００５１】これにより、円盤１１ａ、及び円盤１２ａ
は、それぞれ電子部品１と筐体２にバネ１０により押し
つけられて密着することになり、それぞれの間での熱伝
導効果が高められる。As a result, the disk 11a and the disk 12a are
Are pressed against the electronic component 1 and the housing 2 by the spring 10 and are brought into close contact with each other, and the heat conduction effect between them is enhanced.
【００５２】また、第１の部材１１及び、第２の部材１
２はバネ１０及びピストン１１ｂ、シリンダー１２ｂを
介して熱的に接続されるため、電子部品１で発生した熱
は、第１の部材１１、第２の部材１２を経て筐体２に伝
導し、筐体２を通じて外部に放熱されることとなり、電
子部品１は効率的に冷却される。Further, the first member 11 and the second member 1
Since 2 is thermally connected via the spring 10, the piston 11b, and the cylinder 12b, the heat generated in the electronic component 1 is conducted to the housing 2 via the first member 11 and the second member 12, Heat is radiated to the outside through the housing 2, and the electronic component 1 is efficiently cooled.
【００５３】上記構成とされた熱伝導機構部４ｃによれ
ば、熱伝導機構部が機械的な構造を有するために、前記
した各実施例で発生する恐れのある高熱伝導体５の経時
劣化（例えば液漏れの発生）を防止することができる。
また、包装袋を介さないで高熱伝導体５を電子部品１、
及び筐体２に直接向接することができるため、電子部品
の冷却は一層効果的である。According to the heat conduction mechanism portion 4c having the above structure, since the heat conduction mechanism portion has a mechanical structure, deterioration of the high thermal conductor 5 which may occur in each of the above-described embodiments ( For example, the occurrence of liquid leakage) can be prevented.
In addition, the high thermal conductor 5 is connected to the electronic component 1 without a packaging bag.
Further, the electronic component can be cooled more effectively because it can directly face the housing 2.
【００５４】第３実施例においては、熱伝導機構部４ｃ
を構成する各部材をアルミによって作成したが、アルミ
に代えて金（Ａｕ）、銀（Ａｇ）、銅（Ｃｕ）を用いる
ことも可能である。In the third embodiment, the heat conduction mechanism section 4c.
Although each of the members forming is made of aluminum, gold (Au), silver (Ag), or copper (Cu) can be used instead of aluminum.
【００５５】上記した第３実施例に係る熱伝導機構部４
ｃをノート型パソコンに搭載して第１実施例で述べたの
と同様の実験を行なった結果、測定された電子部品１の
温度は２３℃であった。即ち、本実施例の、熱伝導機構
部４ｃを使った冷却装置によって電子部品の温度は２３
℃下がったことになり、第１実施例、第２実施例同様に
顕著な冷却効果が観測された。The heat conduction mechanism section 4 according to the third embodiment described above.
As a result of carrying out the same experiment as described in the first embodiment by mounting c on a notebook computer, the measured temperature of the electronic component 1 was 23 ° C. That is, the temperature of the electronic component is 23 by the cooling device using the heat conduction mechanism portion 4c of this embodiment.
Since the temperature was lowered by 0 ° C., a remarkable cooling effect was observed as in the first and second examples.
【００５６】尚、熱伝導機構部は、前記各実施例に示し
た位置に限らず、電子機器内で電子部品が熱を発生する
可能性のある、いかなる位置にも複数個の適用が可能で
ある。 例えば、図５は熱伝導機構部４（ａ，ｂ，ｃの
いずれでも可）をデイ スプレイ部分に挿入した場合を示
している。The heat conduction mechanism portion is not limited to the position shown in each of the above-described embodiments, but a plurality of heat conduction mechanism portions can be applied to any position where an electronic component may generate heat in an electronic device. is there. For example, FIG. 5 shows a case where the heat conduction mechanism portion 4 (any of a, b, and c is acceptable) is inserted in the display portion.
【００５７】また、本発明による熱伝導機構部４ａ、４
ｂ、４ｃで使用した部材の各熱伝導構部部材の熱伝導率
を図６に纏めて示しておく。Further, the heat conduction mechanism portions 4a, 4 according to the present invention.
The heat conductivity of each heat conducting structure member of the members used in b and 4c is shown collectively in FIG.
【００５８】[0058]
【発明の効果】上述のように、請求項１記載の発明によ
れば、筐体を有する電子機器内で、筐体との間に空間部
を有するように配置された部品を冷却する部品の装置に
おいて、部品と筐体の間に熱伝導機構部を介装すること
で、大気を介在した自然冷却以上の冷却効果を実現でき
る。As described above, according to the first aspect of the present invention, in an electronic device having a casing, a component arranged to have a space between the casing and the casing is cooled. In the device, by providing the heat conduction mechanism between the component and the housing, it is possible to achieve a cooling effect that is higher than the natural cooling with the atmosphere.
【００５９】また、熱伝導機構部を部品と、筐体との間
の空間部に設置することにより、電子機器を小型化する
のに効果がある。Also, by disposing the heat conduction mechanism in the space between the component and the housing, it is effective in downsizing the electronic equipment.
【００６０】請求項２記載の発明によれば、部品と筐体
との間の空間部の形状に依らず、熱伝導機構部と部品の
密着面積を大きくとり、部品から筐体への熱伝導効果を
上げ、部品の冷却効果を上げる効果がある。According to the second aspect of the present invention, the contact area between the heat conduction mechanism section and the component is set large regardless of the shape of the space between the component and the case, and heat conduction from the component to the case is achieved. It has the effect of increasing the effect and cooling effect of parts.
【００６１】更に請求項３の発明によれば、熱伝導機構
部が機械的な構造を有し、液相より成る高熱伝導体の経
時劣化の発生を防止でき、より信頼性の高い冷却装置を
提供できる。Further, according to the invention of claim 3, the heat conduction mechanism portion has a mechanical structure, and it is possible to prevent the deterioration of the high heat conductor made of the liquid phase with the passage of time, and to provide a more reliable cooling device. Can be provided.
【００６２】また、包装袋を介さないで高熱伝導率部材
を部品、及び筐体に直接向接することができるため、部
品の冷却効率を向上させることができる。Further, since the high thermal conductivity member can be directly contacted with the component and the casing without using the packaging bag, the cooling efficiency of the component can be improved.
【図１】（Ａ）は本発明の第１実施例である冷却装置の
断面図である。（Ｂ）は（Ａ）中、熱伝導機構部４ａを
拡大して示す図である。FIG. 1A is a sectional view of a cooling device according to a first embodiment of the present invention. (B) is an enlarged view of the heat conduction mechanism portion 4a in (A).
【図２】本発明の第１実施例に使用した熱伝導機構部４
ａを搭載したノート型パソコンの概略構成図である。FIG. 2 is a heat conduction mechanism portion 4 used in the first embodiment of the present invention.
FIG. 3 is a schematic configuration diagram of a laptop computer equipped with a.
【図３】（Ａ）は本発明の第２実施例に使用した熱伝導
機構部４ｂを搭載したノート型パソコンである。（Ｂ）
は図３（Ａ）中、熱伝導機構部４ｂを拡大して示す図で
ある。FIG. 3A is a notebook type personal computer equipped with a heat conduction mechanism portion 4b used in the second embodiment of the present invention. (B)
FIG. 4 is an enlarged view of the heat conduction mechanism portion 4b in FIG. 3 (A).
【図４】（Ａ）は本発明の第３実施例に使用した熱伝導
機構部４ｃを搭載したノート型パソコンである。（Ｂ）
は図４（Ａ）中、熱伝導機構部４ｃを拡大して示す図で
ある。（Ｃ）は（Ｂ）で示した熱伝導機構部４ｃの断
面、及び概略図であるFIG. 4A is a laptop computer equipped with a heat conduction mechanism section 4c used in a third embodiment of the present invention. (B)
FIG. 4 is an enlarged view of the heat conduction mechanism portion 4c in FIG. 4 (A). (C) is a cross-sectional view and a schematic view of the heat conduction mechanism portion 4c shown in (B).
【図５】本発明の第１、或いは第２実施例による熱伝導
機構部を、複数個使用した実施例の概略図である。FIG. 5 is a schematic view of an embodiment using a plurality of heat conduction mechanism parts according to the first or second embodiment of the present invention.
【図６】本発明の実施例による熱伝導機構部の各熱伝導
機構部部材の熱伝導率を、大気と比較してまとめた図で
ある。FIG. 6 is a diagram summarizing the thermal conductivity of each heat conduction mechanism member of the heat conduction mechanism unit according to the embodiment of the present invention in comparison with the atmosphere.
１ 電子部品 ２ 筐体 ３ プリント配線板 ４ａ、４ｂ、４ｃ 熱伝導機構部 ５、９ 高熱伝導部材 ６ 包装袋 ７ デスプレイ ８ キーボード １０ 熱伝導機構部４ｃのバネ分 １１ 熱伝導機構部４ｃの、電子部品（１）に向接する
第１の部材（Ａｌ製） １２ 熱伝導機構部４ｃの、筐体（２）に向接する第２
の部材（Ａｌ製）DESCRIPTION OF SYMBOLS 1 Electronic component 2 Housing 3 Printed wiring board 4a, 4b, 4c Heat conduction mechanism part 5, 9 High heat conduction member 6 Packaging bag 7 Display 8 Keyboard 10 Spring part of heat conduction mechanism part 4c 11 Electronic of heat conduction mechanism part 4c A first member (made of Al) facing the component (1) 12 A second member of the heat transfer mechanism portion 4c facing the housing (2)
Member (made of Al)
Claims (3)
間に空間部を有するように配置された、部品を冷却する
部品の冷却装置において、該部品と筐体との間に、熱伝
導機構を介装して成ることを特徴とする部品の冷却装
置。1. A cooling device for a component, which is arranged in an electronic device having a housing so as to have a space between the housing and the housing, between the housing and the housing. , A cooling device for parts, characterized by being provided with a heat conduction mechanism.
ら構成し、 該包装袋に封入された高熱伝導体が常温付近で液相か、
または常温付近で液相である部材と、室温付近で固相で
ある部材の混合物により、該包装袋の形状が変形し得る
構成として成ることを特徴とする熱伝導機構部。2. The heat transfer mechanism is composed of a high heat conductor and a packaging bag in which the high heat conductor is enclosed, and the high heat conductor enclosed in the packaging bag is in a liquid phase at around room temperature,
Alternatively, the heat conduction mechanism part is configured such that the shape of the packaging bag can be deformed by a mixture of a member that is in a liquid phase near room temperature and a member that is in a solid phase near room temperature.
材と、 該筐体と当接することにより熱的に接続される第２の部
材と、 該第１の部材を該部品に向け付勢すると共に、該第２の
部材を該筐体に向けて付勢する付勢手段とにより構成す
ることを特徴とする特許請求範囲第１項記載の部品の冷
却装置。3. A first member, which is thermally connected by abutting the heat conducting mechanism to the component, and a second member, which is thermally connected by abutting the casing. 2. A biasing means for biasing the first member toward the component and biasing the second member toward the housing. Cooling system for parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6142036A JPH088567A (en) | 1994-06-23 | 1994-06-23 | Cooling device and heat conducting mechanism section of part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6142036A JPH088567A (en) | 1994-06-23 | 1994-06-23 | Cooling device and heat conducting mechanism section of part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH088567A true JPH088567A (en) | 1996-01-12 |
Family
ID=15305888
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6142036A Withdrawn JPH088567A (en) | 1994-06-23 | 1994-06-23 | Cooling device and heat conducting mechanism section of part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH088567A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5872699A (en) * | 1995-07-25 | 1999-02-16 | Fujitsu Limited | Electronic apparatus, housing for electronic apparatus and housing manufacturing method |
| US6226180B1 (en) | 1996-10-11 | 2001-05-01 | Fujitsu Limited | Electronic apparatus having a heat dissipation member |
| US6275374B1 (en) | 1999-01-25 | 2001-08-14 | Fujitsu Limited | Electronic device equipped with spacer which serves to protect electronic components |
| WO2003001860A1 (en) * | 2001-06-13 | 2003-01-03 | Fujitsu Limited | Cooling device, electronic equipment, and production method |
| WO2005066740A1 (en) * | 2004-01-05 | 2005-07-21 | Tamai Kasei Co. Ltd. | Cooling pad |
| JP2006024608A (en) * | 2004-07-06 | 2006-01-26 | Central Res Inst Of Electric Power Ind | Heat transfer cushion and thermoelectric conversion module provided therewith |
| JP2007227458A (en) * | 2006-02-21 | 2007-09-06 | Toyota Motor Corp | Thermoelectric generator |
| WO2016185687A1 (en) * | 2015-05-20 | 2016-11-24 | Ricoh Company, Ltd. | Electronic device and heat spreader |
-
1994
- 1994-06-23 JP JP6142036A patent/JPH088567A/en not_active Withdrawn
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5872699A (en) * | 1995-07-25 | 1999-02-16 | Fujitsu Limited | Electronic apparatus, housing for electronic apparatus and housing manufacturing method |
| US6507493B2 (en) | 1996-10-11 | 2003-01-14 | Fujitsu Limited | Electronic apparatus having a heat dissipation member |
| US6385043B1 (en) | 1996-10-11 | 2002-05-07 | Fujitsu Limited | Electronic apparatus having a heat dissipation member |
| US6469892B2 (en) | 1996-10-11 | 2002-10-22 | Fujitsu Limited | Electronic apparatus having a heat dissipation member |
| US6226180B1 (en) | 1996-10-11 | 2001-05-01 | Fujitsu Limited | Electronic apparatus having a heat dissipation member |
| US6275374B1 (en) | 1999-01-25 | 2001-08-14 | Fujitsu Limited | Electronic device equipped with spacer which serves to protect electronic components |
| WO2003001860A1 (en) * | 2001-06-13 | 2003-01-03 | Fujitsu Limited | Cooling device, electronic equipment, and production method |
| WO2005066740A1 (en) * | 2004-01-05 | 2005-07-21 | Tamai Kasei Co. Ltd. | Cooling pad |
| JP2006024608A (en) * | 2004-07-06 | 2006-01-26 | Central Res Inst Of Electric Power Ind | Heat transfer cushion and thermoelectric conversion module provided therewith |
| JP2007227458A (en) * | 2006-02-21 | 2007-09-06 | Toyota Motor Corp | Thermoelectric generator |
| WO2016185687A1 (en) * | 2015-05-20 | 2016-11-24 | Ricoh Company, Ltd. | Electronic device and heat spreader |
| JP2016219599A (en) * | 2015-05-20 | 2016-12-22 | 株式会社リコー | Electronic equipment and heat spreader |
| KR20170137869A (en) * | 2015-05-20 | 2017-12-13 | 가부시키가이샤 리코 | Electronic devices and heat spreaders |
| US10524389B2 (en) | 2015-05-20 | 2019-12-31 | Ricoh Company, Ltd. | Electronic device and heat spreader |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20010904 |