JPH087619Y2 - Lead frame - Google Patents
Lead frameInfo
- Publication number
- JPH087619Y2 JPH087619Y2 JP1990063331U JP6333190U JPH087619Y2 JP H087619 Y2 JPH087619 Y2 JP H087619Y2 JP 1990063331 U JP1990063331 U JP 1990063331U JP 6333190 U JP6333190 U JP 6333190U JP H087619 Y2 JPH087619 Y2 JP H087619Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- lead frame
- side plates
- tie bar
- cathode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【考案の詳細な説明】 〔産業上の利用分野〕 本考案はリードフレームに関し、さらに詳しく言え
ば、チップ型固体電解コンデンサなどの電子部品に好適
なリードフレームに関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a lead frame, and more particularly to a lead frame suitable for electronic components such as a chip type solid electrolytic capacitor.
第４図および第５図には、例えばタンタルの粉末焼結
体からなる固体電解コンデンサ素子１をリードフレーム
２に取付けてチップ化する場合の従来例が示されてい
る。これによると、リードフレーム２は互いに平行に延
びる一対の側板3a,3bを有し、それらの間には複数のタ
イバー４…が一定の間隔をもって梯子状に形成されてい
る。各側板3a,3bの内側縁には、陽極リード端子5aと陰
極リード端子5bとが対向するように連設されている。こ
の場合、陰極リード端子5bはコンデンサ素子１を受け止
めるようにほぼＬ字状に折り曲げられている。実際に
は、このリードフレーム２は一枚の金属板（例えば鉄
板）をプレスにより打ち抜くことにより得られる。4 and 5 show a conventional example in which the solid electrolytic capacitor element 1 made of, for example, a powder sintered body of tantalum is attached to the lead frame 2 to form a chip. According to this, the lead frame 2 has a pair of side plates 3a, 3b extending in parallel to each other, and a plurality of tie bars 4 ... Are formed in a ladder shape with a constant interval therebetween. An anode lead terminal 5a and a cathode lead terminal 5b are connected to the inner edges of the side plates 3a and 3b so as to face each other. In this case, the cathode lead terminal 5b is bent into a substantially L shape so as to receive the capacitor element 1. Actually, the lead frame 2 is obtained by punching a single metal plate (for example, an iron plate) with a press.
チップ化するにあたっては、コンデンサ素子１の陽極
リード1aを陽極リード端子5aに溶接するとともに、同素
子１の陰極面1bを陰極リード端子5b上に載置して導電性
接着材にて固定する。しかる後、図示しない金型内にお
いてコンデンサ素子１の周りに鎖線で示されているよう
に樹脂外装体６を形成する。In forming the chip, the anode lead 1a of the capacitor element 1 is welded to the anode lead terminal 5a, and the cathode surface 1b of the element 1 is placed on the cathode lead terminal 5b and fixed with a conductive adhesive. Thereafter, a resin outer package 6 is formed around the capacitor element 1 in a mold (not shown) as indicated by a chain line.
上記のようにして一つのリードフレーム２に多数のチ
ップ部品Ａ…が形成され、しかる後各チップ部品Ａ…は
リードフレーム２から取り外されることなく、エージン
グ検査工程に運ばれる。そのエージング検査を行なうた
め、従来では例えば陽極リード端子5aを側板3aの根元部
分から切断するとともに、タイバー４をも切断して、第
６図に示されているようにチップ部品Ａを陰極リード端
子5bを介して側板3bに片持ち的に支持させた状態として
エージング検査およびその後のテーピングもしくはリー
ル巻取り工程に供給するようにしている。As described above, a large number of chip components A ... Are formed on one lead frame 2, and thereafter each chip component A ... Is carried to the aging inspection process without being removed from the lead frame 2. In order to perform the aging inspection, conventionally, for example, the anode lead terminal 5a is cut from the root portion of the side plate 3a, and the tie bar 4 is also cut, so that the chip component A is connected to the cathode lead terminal as shown in FIG. It is supplied to the aging inspection and the subsequent taping or reel winding process while being cantilevered by the side plate 3b via the 5b.
しかしながら、支持が片持ちで不安定であるため、例
えばその多数本を重ねて次工程などに運ぶ場合にはチッ
プ部品Ａの絡み合いやフレーム自体の曲がりなどが生
じ、その取り扱いに支障をきたす場合があった。However, since the support is cantilevered and unstable, for example, when a large number of them are piled up and carried to the next step, entanglement of the chip parts A or bending of the frame itself may occur, which may hinder the handling thereof. there were.
本考案は上記従来の欠点を解消するためになされたも
ので、その構成上の特徴は、互いに平行に延びる一対の
側板間に梯子状に形成された複数のタイバーと、同タイ
バー間における上記各側板の内側縁にそれぞれ対向的に
連設された陽極リードと陰極リードとを備え、同陽極リ
ードと陰極リードとの間にチップ部品が搭載され、か
つ、上記一方のリードが上記側板から切り離された状態
で電気的なエージング検査に供されるリードフレームに
おいて、上記タイバーにはプレスにより一方の面が凹溝
となり、他方の面が突条となるような補強用のリブが同
タイバーの長さ方向に沿って形成されていることにあ
る。The present invention has been made in order to solve the above-mentioned conventional drawbacks, and its characteristic feature is that a plurality of tie bars formed in a ladder shape between a pair of side plates extending in parallel with each other and the above-mentioned tie bars between the tie bars. A side plate is provided with an anode lead and a cathode lead, which are continuously arranged opposite to each other, respectively, and a chip component is mounted between the anode lead and the cathode lead, and the one lead is separated from the side plate. In a lead frame that is used for electrical aging inspection in a closed state, the tie bar has a reinforcing rib that makes one surface a concave groove and the other surface a ridge by pressing. It is formed along the direction.
タイバーがリブによって機械的に補強されているた
め、リードフレームに曲がりなどが生じにくくなり、そ
の取り扱い性がよくなる。すなわち、エージング検査に
あたっては、いずれか一方のリード端子のみを切断し、
タイバーは一対の側板間に残しておくことにより、搬送
時やスタック時などにおけるチップ部品の絡み合いなど
が防止される。Since the tie bar is mechanically reinforced by the ribs, the lead frame is less likely to be bent and the handleability is improved. That is, in the aging inspection, cut only one of the lead terminals,
Leaving the tie bar between the pair of side plates prevents entanglement of chip components during transportation or stacking.
以下、本考案の実施例を第１図および第３図を参照し
ながら説明する。なお、これらの図において、先に説明
の従来例に係る図面と同一もしくは同一とみなされる部
分にはそれと同じ参照符号が付けられている。An embodiment of the present invention will be described below with reference to FIGS. 1 and 3. In these drawings, the same reference numerals as those used in the drawings related to the above-described conventional example are the same as or considered to be the same.
このリードフレーム10においては、各側板3a,3bを連
結している各タイバー４…に補強用のリブ11を形成して
いる。第２図にはその拡大断面が示されているが、この
実施例においては、同リブ11はプレスによって、好まし
くはこのリードフレーム10の成形と同時に、タイバー４
の一方の面が凹溝11aとなり、他方の面が突条11bとなる
ように形成される。同図によると、リブ11は断面ほぼ半
円状を呈しているが、断面Ｖ字状もしくはコ字状であっ
てもよい。In the lead frame 10, reinforcing ribs 11 are formed on the tie bars 4 ... Connecting the side plates 3a and 3b. The enlarged cross section is shown in FIG. 2, but in this embodiment, the ribs 11 are formed by pressing, preferably simultaneously with the molding of the lead frame 10, at the same time as the tie bar 4.
One surface is a concave groove 11a, and the other surface is a protrusion 11b. According to the figure, the rib 11 has a substantially semicircular cross section, but it may have a V-shaped or U-shaped cross section.
第３図にはリードフレーム10のエージング検査に供され
る状態が示されている。すなわち、同リードフレーム10
にチップ部品Ａを形成したのち、エージング検査に供す
るため、例えば陽極リード端子5aを側板3aから切断して
片持ち支持とするのであるが、その際、各タイバー４…
は切断されることなく、そのまま残される。FIG. 3 shows a state in which the lead frame 10 is subjected to an aging inspection. That is, the lead frame 10
After the chip component A is formed on the chip, the anode lead terminal 5a is cut from the side plate 3a for cantilever support in order to be subjected to the aging test. At that time, the tie bars 4 ...
Remains uncut, without being cut.
このように、機械的強度の大きいタイバー４によっ
て、リードフレーム10自体が強度的に補強されるため、
チップ部品Ａのふらつきなどがなくなり、例えば同リー
ドフレームを多数本を重ねて次工程などに運ぶ場合、部
品同士の絡み合いなどが防止される。In this way, since the lead frame 10 itself is reinforced in strength by the tie bar 4 having a large mechanical strength,
The chip component A is prevented from wobbling, and, for example, when a large number of the same lead frames are piled up and carried to the next process or the like, entanglement of the components is prevented.
以上説明したように、本考案によれば、全体として機
械的強度が高く、特にエージング検査を行なう上で、取
り扱い性の優れたリードフレームが提供される。As described above, according to the present invention, there is provided a lead frame which has a high mechanical strength as a whole and is excellent in handleability particularly in aging inspection.
第１図は本考案に係るリードフレームの一実施例を示し
た平面図、第２図は第１図のII-II線に沿った拡大断面
図、第３図は同リードフレームにチップ部品を形成した
後、その一方のリード端子を切断した状態を例示した平
面図、第４図は従来例を示した第５図のIV-IV線断面
図、第５図は従来例を示した平面図、第６図は従来のフ
レームによる片持ち状態を説明するための平面図であ
る。 図中、１はコンデンサ素子、2,10はリードフレーム、3
a,3bは側板、４はタイバー、5aは陽極リード線、5bは陰
極リード線、６は樹脂外装体、11はリブである。FIG. 1 is a plan view showing an embodiment of a lead frame according to the present invention, FIG. 2 is an enlarged sectional view taken along line II-II of FIG. 1, and FIG. FIG. 4 is a plan view showing a state in which one of the lead terminals is cut after being formed, FIG. 4 is a sectional view taken along line IV-IV of FIG. 5 showing a conventional example, and FIG. 5 is a plan view showing a conventional example. , FIG. 6 is a plan view for explaining a cantilever state of a conventional frame. In the figure, 1 is a capacitor element, 2 and 10 are lead frames, and 3
Reference numerals a and 3b are side plates, 4 is a tie bar, 5a is an anode lead wire, 5b is a cathode lead wire, 6 is a resin outer casing, and 11 is a rib.
Claims (1)
に形成された複数のタイバーと、同タイバー間における
上記各側板の内側縁にそれぞれ対向的に連設された陽極
リードと陰極リードとを備え、同陽極リードと陰極リー
ドとの間にチップ部品が搭載され、かつ、上記一方のリ
ードが上記側板から切り離された状態で電気的なエージ
ング検査に供されるリードフレームにおいて、上記タイ
バーにはプレスにより一方の面が凹溝となり、他方の面
が突条となるような補強用のリブが同タイバーの長さ方
向に沿って形成されていることを特徴とするリードフレ
ーム。1. A plurality of tie bars formed in a ladder shape between a pair of side plates extending in parallel to each other, and an anode lead and a cathode lead, which are continuously provided so as to face each other at inner edges of the side plates between the tie bars. In a lead frame provided with a chip component between the anode lead and the cathode lead, and being subjected to electrical aging inspection in a state where the one lead is separated from the side plate, the tie bar Is a lead frame in which reinforcing ribs are formed along the length direction of the tie bar so that one surface becomes a concave groove and the other surface becomes a ridge by pressing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990063331U JPH087619Y2 (en) | 1990-06-15 | 1990-06-15 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990063331U JPH087619Y2 (en) | 1990-06-15 | 1990-06-15 | Lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0423128U JPH0423128U (en) | 1992-02-26 |
| JPH087619Y2 true JPH087619Y2 (en) | 1996-03-04 |
Family
ID=31593280
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990063331U Expired - Lifetime JPH087619Y2 (en) | 1990-06-15 | 1990-06-15 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH087619Y2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8568011B2 (en) | 2009-08-20 | 2013-10-29 | Solatube International, Inc. | Daylighting devices with auxiliary lighting system and light turning features |
| US8601757B2 (en) | 2010-05-27 | 2013-12-10 | Solatube International, Inc. | Thermally insulating fenestration devices and methods |
| US8837048B2 (en) | 2011-11-30 | 2014-09-16 | Solatube International, Inc. | Daylight collection systems and methods |
| US8982467B2 (en) | 2012-12-11 | 2015-03-17 | Solatube International, Inc. | High aspect ratio daylight collectors |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6158146A (en) * | 1984-08-30 | 1986-03-25 | Matsushita Electric Ind Co Ltd | Container of flat surface type vacuum display tube |
| EP0327860A1 (en) * | 1988-02-10 | 1989-08-16 | Siemens Aktiengesellschaft | Electrical component of the chip type, and method of making the same |
-
1990
- 1990-06-15 JP JP1990063331U patent/JPH087619Y2/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8568011B2 (en) | 2009-08-20 | 2013-10-29 | Solatube International, Inc. | Daylighting devices with auxiliary lighting system and light turning features |
| US8601757B2 (en) | 2010-05-27 | 2013-12-10 | Solatube International, Inc. | Thermally insulating fenestration devices and methods |
| US8837048B2 (en) | 2011-11-30 | 2014-09-16 | Solatube International, Inc. | Daylight collection systems and methods |
| US9127823B2 (en) | 2011-11-30 | 2015-09-08 | Solatube International, Inc. | Daylight collection systems and methods |
| US8982467B2 (en) | 2012-12-11 | 2015-03-17 | Solatube International, Inc. | High aspect ratio daylight collectors |
| US9291321B2 (en) | 2012-12-11 | 2016-03-22 | Solatube International, Inc. | Devices and methods for collecting daylight in clear and cloudy weather conditions |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0423128U (en) | 1992-02-26 |
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