JPH0857681A - Low melting brazing filler metal and its production - Google Patents
Low melting brazing filler metal and its productionInfo
- Publication number
- JPH0857681A JPH0857681A JP21942294A JP21942294A JPH0857681A JP H0857681 A JPH0857681 A JP H0857681A JP 21942294 A JP21942294 A JP 21942294A JP 21942294 A JP21942294 A JP 21942294A JP H0857681 A JPH0857681 A JP H0857681A
- Authority
- JP
- Japan
- Prior art keywords
- low melting
- metal
- good workability
- melting point
- powders
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、 300℃〜 600℃で使用
（溶融）する低融点ろう材及びその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a low melting point brazing material which is used (melted) at 300 ° C to 600 ° C and a method for producing the same.
【０００２】[0002]
【従来の技術】従来、 300℃〜 600℃の範囲で使用でき
るろう材は加工性が悪く、線材や薄板で供給されるもの
は殆んどなく、大部分のものは合金粉末やペースト状で
使用されている。例えばＡｕとＳｎを例にとって説明す
ると、Ａｕ−Ｓｎ20％共晶合金は融点が280℃である
が、ＡｕＳｎの金属間化合物合金を生成する為、脆く、
常温では加工できない。また、Ａｇ−Ｓｎ合金の場合も
Ｓｎの添加を増すことにより、融点を下げることは可能
であるが20wt％を超えると、ε相（Ａｇ3 Ｓｎ）が生成
し、急激に脆くなる為、常温での加工はできなくなる。2. Description of the Related Art Conventionally, brazing filler metals that can be used in the temperature range of 300 ° C to 600 ° C have poor workability, few are supplied in wire rods or thin plates, and most are in the form of alloy powder or paste. in use. For example, taking Au and Sn as an example, the melting point of Au—Sn 20% eutectic alloy is 280 ° C., but it is brittle because it produces an AuSn intermetallic compound alloy.
It cannot be processed at room temperature. Further, by increasing the addition of Sn in the case of Ag-Sn alloy, the it is possible to lower the melting point exceeds 20 wt%, epsilon phase (Ag 3 Sn) is produced, made for rapidly brittle, room temperature Can no longer be processed.
【０００３】[0003]
【発明が解決しようとする課題】そこで本発明は、金属
間化合物を生成することなく、常温でも容易に所要形状
に加工でき、使用時ろう付けが良好に行なわれ、十分な
強度が得られるようにした低融点ろう材及びその製造方
法を提供しようとするものである。Therefore, according to the present invention, it is possible to easily form a desired shape even at room temperature without producing an intermetallic compound, to perform good brazing at the time of use and to obtain sufficient strength. To provide a low melting point brazing material and a method for producing the same.
【０００４】[0004]
【課題を解決するための手段】上記課題を解決するため
の本発明の低融点ろう材はＡｕ、Ａｇ、Ｃｕ、Ｎｉ、Ｐ
ｔ、Ｐｄ等の加工性の良い金属の粉末と、Ｓｎ、Ｐｂ、
Ｃｄ、Ｉｎ、Ｚｎ等の加工性の良い金属の粉末が各々１
種類以上混合され、圧縮、固化の上所要形状に成形され
ていることを特徴とするものである。また、本発明の低
融点ろう材の製造方法は、Ａｕ、Ａｇ、Ｃｕ、Ｎｉ、Ｐ
ｔ、Ｐｄ等の加工性の良い金属の粉末とＳｎ、Ｐｂ、Ｃ
ｄ、Ｉｎ、Ｚｎ等の加工性の良い金属の粉末を、各々１
種類以上混合し、次にそのいずれの金属粉末も溶融しな
い温度で圧縮、固化し、次いで押出し加工後伸線又は圧
延加工して所要形状に成形することを特徴とするもので
ある。なお、上記金属粉末の組み合わせの中でも、特に
Ａｕ粉とＳｎ粉の組合わせは用途の広さなどから好まし
いものである。このときの圧縮固化温度としては 100℃
乃至 230℃が好ましく、 100℃未満では成形加工性が悪
く、また 230℃を超えるとＳｎの溶融が起こり好ましく
ない。The low melting point brazing material of the present invention for solving the above problems is Au, Ag, Cu, Ni, P.
t, Pd and other metal powders with good workability, Sn, Pb,
1 for each metal powder with good workability such as Cd, In, Zn
It is characterized in that more than one kind is mixed, compressed and solidified to be molded into a required shape. The method for producing the low melting point brazing material of the present invention is Au, Ag, Cu, Ni, P.
Powder of metal such as t, Pd having good workability and Sn, Pb, C
Powder of metal with good workability such as d, In, Zn, etc.
It is characterized in that more than one kind of powder is mixed, then compressed and solidified at a temperature that does not melt any of the metal powders, and then extruded and then drawn or rolled to form into a required shape. Among the combinations of the above metal powders, the combination of Au powder and Sn powder is particularly preferable in terms of versatility. The compression solidification temperature at this time is 100 ° C
If the temperature is less than 100 ° C, the moldability is poor, and if it exceeds 230 ° C, Sn is melted, which is not preferable.
【０００５】[0005]
【作用】上記のように本発明の低融点ろう材の製造方法
は、金属粉末を溶融しない温度で圧縮、固化するので、
金属間化合物が生成されず、従って常温で伸線又は圧延
加工して所要の細線又は薄板に成形できる。またこうし
て作られた本発明の低融点ろう材は、 300〜 600℃での
使用時（溶融時）金属同士が分離（溶け分かれ）しない
ので、ろう付けが良好に行なわれ、十分なろう付け強度
が得られる。As described above, according to the method for producing a low melting point brazing material of the present invention, since the metal powder is compressed and solidified at a temperature at which it does not melt,
Since no intermetallic compound is generated, it can be drawn or rolled at room temperature to form a desired thin wire or thin plate. In addition, the low melting point brazing material of the present invention thus produced does not separate (melts apart) from each other when used at 300 to 600 ° C (when molten), so brazing is performed well and sufficient brazing strength is obtained. Is obtained.
【０００６】[0006]
【実施例】本発明の低融点ろう材及びその製造方法の実
施例と従来例について説明する。先ず実施例について説
明すると、水冷ガスアトマイズ法によりＡｕ及びＳｎ粉
末を作成し、 200メッシュの篩にて篩分けし、粉末を調
製した。次にＡｕ粉末 800ｇとＳｎ粉末 200ｇをＶ型ミ
キサーにて十分に撹拌混合した後、内径40mm、深さ100m
mの円筒金型に入れ、 100ｔonで予備圧縮を行い、直径4
0mm、長さ80mmのビレットを作成した。然る後ビレット
を 150℃に加熱して押出機にてこのビレットを直径４mm
の線に押出加工し、その後、冷間伸線にて直径４mmから
0.4mmまで線引加工した。そして厚さ 0.5mm、幅５mm、
長さ50mmのＡｇ板２枚を、直径 0.4mm、長さ５mmのろう
線材を介在して突き合わせ、 350℃の水素雰囲気炉にて
10分間加熱し、炉中ろう付けした結果、ろう材は完全に
溶融し、継ぎ目を完全に濡らし、十分満足できるろう付
けができた。このサンプルを引張試験機にて引張り、ろ
う付け部の接合強度を測定した結果、Ａｇ部が伸び切
れ、母材切れとなり、十分な接合強度であることが判っ
た。次に、従来例について説明すると、Ａｕ−Ｓｎ20wt
％合金のインゴット1100ｇを直径30mm、長さ 100mmに 2
00℃で熱間加工し、これをさらに一辺３mmの角線まで溝
ロール加工し、その後熱間ダイス引きにて直径 0.4mmま
で伸線し、細線を得た。この間に常時 200℃を保持する
ことが難しく、時々 100℃位まで低下してしまう為に、
線が折れたり、切れたりして、最終線径の 0.4mmまで加
工できたのは、 300ｇであった。そして厚さ 0.5mm、幅
５mm、長さ50mmのＡｇ板２枚を直径 0.4mm、長さ５mmの
ろう線材を介在して突き合わせ、 350℃の水素雰囲気炉
にて10分間加熱し、炉中ろう付けした結果、ろう材は完
全に溶融し、継ぎ目を完全に濡らし、十分満足できるろ
う付けができた。このサンプルを引張試験機にて引張
り、ろう付け部の接合強度を測定した結果、Ａｇ部が伸
び切られ、母材切れとなり、十分な接合強度であること
が判った。尚、上記実施例はＳｎを用いているが、Ｐ
ｂ、Ｃｄ、Ｉｎ、Ｚｎ等でも良く、またＡｕを用いてい
るがＡｇ、Ｃｕ、Ｎｉ、Ｐｔ、Ｐｄ等でも良いものであ
る。EXAMPLES Examples and conventional examples of the low melting point brazing material and the method for producing the same according to the present invention will be described. First, an example will be described. Au and Sn powders were prepared by a water-cooled gas atomization method and sieved with a 200 mesh screen to prepare powders. Next, after thoroughly mixing 800g of Au powder and 200g of Sn powder with a V-type mixer, the inner diameter is 40mm and the depth is 100m.
Put into m cylindrical mold, pre-compress at 100 ton, diameter 4
A billet with a length of 0 mm and a length of 80 mm was created. After that, the billet is heated to 150 ° C and the diameter of this billet is 4 mm with an extruder.
Wire extruded and then cold drawn from a diameter of 4 mm
Wire drawing was performed up to 0.4 mm. And thickness 0.5mm, width 5mm,
Two Ag plates with a length of 50 mm are butted against each other with a brazing wire rod having a diameter of 0.4 mm and a length of 5 mm, and they are placed in a hydrogen atmosphere furnace at 350 ° C.
As a result of heating for 10 minutes and brazing in the furnace, the brazing material was completely melted, the joint was completely wetted, and brazing was sufficiently satisfactory. As a result of pulling this sample with a tensile tester and measuring the joint strength of the brazed portion, it was found that the Ag portion was completely stretched and the base metal was broken, and the joint strength was sufficient. Next, a conventional example will be described. Au-Sn20wt
% 100% alloy ingot for diameter 30mm and length 100mm 2
Hot working was carried out at 00 ° C., and this was further groove-rolled to a square wire having a side length of 3 mm, and then drawn with a hot die to a diameter of 0.4 mm to obtain a fine wire. During this time, it is difficult to maintain a temperature of 200 ° C at all times, and it sometimes drops to around 100 ° C.
It was 300 g that the wire could be broken or broken and could be processed to the final wire diameter of 0.4 mm. Then, two Ag plates having a thickness of 0.5 mm, a width of 5 mm, and a length of 50 mm are butted against each other with a brazing wire rod having a diameter of 0.4 mm and a length of 5 mm, and heated in a hydrogen atmosphere furnace at 350 ° C. for 10 minutes. As a result of the brazing, the brazing material was completely melted and the seam was completely wetted, and the brazing was sufficiently satisfactory. As a result of pulling this sample with a tensile tester and measuring the joint strength of the brazed portion, it was found that the Ag portion was fully stretched and the base metal was cut, and the joint strength was sufficient. In the above embodiment, Sn is used, but P
b, Cd, In, Zn or the like may be used, and although Au is used, Ag, Cu, Ni, Pt, Pd or the like may also be used.
【０００７】[0007]
【発明の効果】以上の説明で判るように本発明の低融点
ろう材の製造方法は、金属粉末を溶融しない温度で圧
縮、固化するので、金属間化合物が生成されず、従って
常温で伸線又は圧延加工して所要の細線又は薄板に成形
できる。また、本発明の低融点ろう材は、 300〜 600℃
での使用時（溶融時）金属同士が分離（溶け分かれ）し
ないでろう付けが良好に行なわれ、十分なろう付け強度
が得られる。As can be seen from the above description, in the method for producing a low melting point brazing filler metal of the present invention, since the metal powder is compressed and solidified at a temperature at which it does not melt, no intermetallic compound is produced, and therefore wire drawing is performed at room temperature. Alternatively, it can be rolled to be formed into a desired thin wire or thin plate. The low melting point brazing filler metal of the present invention is 300 to 600 ° C.
In use (when molten), the metals are not separated (melted) from each other and brazing is performed well, and sufficient brazing strength is obtained.
Claims (4)
ｇ、Ｃｕ、Ｎｉ、Ｐｔ及びＰｄより選ばれる１種以上の
金属の粉末と、低融点で加工性の良い金属としてＳｎ、
Ｐｂ、Ｃｄ、Ｉｎ及びＺｎより選ばれる１種以上の金属
の粉末とが混合され、圧縮固化の上所要形状に成形され
ていることを特徴とする低融点ろう材。1. Au or A as a noble metal having good workability
Powder of at least one metal selected from g, Cu, Ni, Pt and Pd, and Sn as a metal having a low melting point and good workability,
A low melting point brazing material characterized by being mixed with powder of at least one metal selected from Pb, Cd, In and Zn, and being compacted into a required shape after being solidified by compression.
る１種以上がＡｕであり、低融点で加工性の良い金属と
して選ばれる１種以上がＳｎであることを特徴とする請
求項１記載の低融点ろう材。2. One or more selected as the noble metal having good workability is Au, and one or more selected as a metal having a low melting point and good workability is Sn. The low melting point brazing material described.
ｇ、Ｃｕ、Ｎｉ、Ｐｔ又はＰｄより選ばれる１種以上の
金属の粉末と、低融点で加工性の良い金属としてＳｎ、
Ｐｂ、Ｃｄ、Ｉｎ及びＺｎより選ばれる１種以上の金属
の粉末とを混合し、次にそのいずれの金属粉末も溶融し
ない温度で圧縮、固化し、次いで所要形状に成形加工す
ることを特徴とする低融点ろう材の製造方法。3. Au or A as a noble metal having good workability
Powder of at least one metal selected from g, Cu, Ni, Pt or Pd, and Sn as a metal having a low melting point and good workability,
Characterized by mixing powder of at least one metal selected from Pb, Cd, In, and Zn, compressing and solidifying at a temperature that does not melt any of the metal powders, and then forming into a required shape. Method for producing low melting point brazing material.
る１種以上がＡｕであり、低融点で加工性の良い金属と
して選ばれる１種以上がＳｎであることを特徴とする請
求項３記載の低融点ろう材の製造方法。4. The one or more selected as the noble metal having good workability is Au, and the one or more selected as a metal having a low melting point and good workability is Sn. A method for producing the low melting point brazing material described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21942294A JPH0857681A (en) | 1994-08-22 | 1994-08-22 | Low melting brazing filler metal and its production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21942294A JPH0857681A (en) | 1994-08-22 | 1994-08-22 | Low melting brazing filler metal and its production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0857681A true JPH0857681A (en) | 1996-03-05 |
Family
ID=16735148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21942294A Pending JPH0857681A (en) | 1994-08-22 | 1994-08-22 | Low melting brazing filler metal and its production |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0857681A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998056217A1 (en) * | 1997-06-04 | 1998-12-10 | Ibiden Co., Ltd. | Soldering member for printed wiring boards |
| CN106001980A (en) * | 2016-06-15 | 2016-10-12 | 中国科学院电工研究所 | High-temperature lead-free soldering lug for encapsulating power electronic module and preparation method thereof |
| CN111098062A (en) * | 2020-01-09 | 2020-05-05 | 东莞市锡达焊锡制品有限公司 | High-temperature lead-containing tin wire and production method thereof |
| JP2020099916A (en) * | 2018-12-20 | 2020-07-02 | 株式会社タムラ製作所 | Method for manufacturing molding solder |
| US10818405B2 (en) | 2015-07-09 | 2020-10-27 | Furukawa Electric Co., Ltd. | Metal fine particle-containing composition |
-
1994
- 1994-08-22 JP JP21942294A patent/JPH0857681A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998056217A1 (en) * | 1997-06-04 | 1998-12-10 | Ibiden Co., Ltd. | Soldering member for printed wiring boards |
| US6358630B1 (en) | 1997-06-04 | 2002-03-19 | Ibiden Co., Ltd. | Soldering member for printed wiring boards |
| US10818405B2 (en) | 2015-07-09 | 2020-10-27 | Furukawa Electric Co., Ltd. | Metal fine particle-containing composition |
| CN106001980A (en) * | 2016-06-15 | 2016-10-12 | 中国科学院电工研究所 | High-temperature lead-free soldering lug for encapsulating power electronic module and preparation method thereof |
| JP2020099916A (en) * | 2018-12-20 | 2020-07-02 | 株式会社タムラ製作所 | Method for manufacturing molding solder |
| CN111098062A (en) * | 2020-01-09 | 2020-05-05 | 东莞市锡达焊锡制品有限公司 | High-temperature lead-containing tin wire and production method thereof |
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