JPH0852872A - Ink jet head and manufacture thereof - Google Patents
Ink jet head and manufacture thereofInfo
- Publication number
- JPH0852872A JPH0852872A JP19150494A JP19150494A JPH0852872A JP H0852872 A JPH0852872 A JP H0852872A JP 19150494 A JP19150494 A JP 19150494A JP 19150494 A JP19150494 A JP 19150494A JP H0852872 A JPH0852872 A JP H0852872A
- Authority
- JP
- Japan
- Prior art keywords
- groove
- ink
- substrate
- partition wall
- step portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/10—Finger type piezoelectric elements
Landscapes
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はプリンターに関し、さら
に詳しくはインク溝の隔壁の圧電変形を利用した圧電式
インクジェットヘッドに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printer, and more particularly to a piezoelectric ink jet head utilizing piezoelectric deformation of partition walls of ink grooves.
【０００２】[0002]
【従来の技術】圧電材料よりなる基板の上面にその一方
の端面から対向する端面に通じる複数の溝を有し、該基
板の上面に蓋を接着し、インクを充填した溝の隔壁の圧
電変形を利用して溝内のインクを圧縮し、噴射孔よりイ
ンク滴を印字用紙に吐出して印字を行うインクジェット
ヘッドが例えば特開平４ー３０７２５４号公報に記載さ
れている。このような構造のインクジェットヘッドはイ
ンクカセット等のインク貯蔵手段を蓋に搭載するのに適
している反面、溝の一方の開口部を閉塞してインクの流
出を阻止する必要がある。このため従来は同号公報に記
載するように基板に蓋を取付けた後上記開口部に半田、
シリコン樹脂等を注入して封口を行っていた。2. Description of the Related Art A substrate made of a piezoelectric material has a plurality of grooves extending from one end face to an opposite end face on the upper face of the substrate, and a lid is adhered to the upper face of the substrate to piezoelectrically deform a partition wall of the groove filled with ink. JP-A-4-307254 discloses, for example, an ink jet head for compressing the ink in the groove using the ink jet and ejecting ink droplets from the ejection hole onto the printing paper to perform printing. The inkjet head having such a structure is suitable for mounting an ink storage means such as an ink cassette on the lid, but it is necessary to block one opening of the groove to prevent the outflow of ink. Therefore, conventionally, as described in the same publication, after attaching a lid to the substrate, solder in the opening,
A silicon resin or the like was injected to seal the container.
【０００３】このような構造によれば、前記の封口用の
接着剤により、封口に手間がかかるとともに、各溝に対
し均一な状態での封口を行うことが困難であり、接着剤
の量の大小により前記溝により構成されるインク室の実
質的な形状が変化し、インク中に気泡を生じ易い形状と
なったり、インクを供給しにくい形になったりして、イ
ンク滴の吐出の不均一または吐出不良を生じ易い。もっ
とも、このような封口手段を必要としない方式が、特開
昭５７ー２０１６６５号公報および特開平５ー０４２６
７２号公報に記載されているが、これらはいずれもイン
ク室を別途形成し、その外部に圧電素子を取り付けるも
のであり、インクノズルの集積度およびインクの吐出効
率の点から言って好ましくない。また特開平５ー２２０
９６８号公報に記載された方式は、圧電基板に複数の溝
を設け、封口手段を必要としないものであるが、基板の
溝加工において、溝を途中で切り上げる方式のもので
り、溝の加工性およびその後の引き出し線の取り付けの
作業性等の上で問題がある。そこで、これらの欠点を除
去する目的で、圧電基板の溝の一方の開口部を封口する
封口片を備えたインクジェットヘッドが考え出され、知
られている。According to such a structure, the sealing adhesive takes time and labor for sealing and it is difficult to seal each groove in a uniform state. The shape of the ink chamber formed by the groove changes depending on the size of the groove, resulting in a shape that easily causes bubbles in the ink or a shape that makes it difficult to supply ink, resulting in non-uniform ejection of ink droplets. Or, ejection failure is likely to occur. However, a method that does not require such a sealing means is disclosed in JP-A-57-201665 and JP-A-5-0426.
As described in Japanese Patent Laid-Open No. 72-72, all of these are for forming an ink chamber separately and mounting a piezoelectric element on the outside thereof, which is not preferable in terms of the degree of integration of ink nozzles and the ejection efficiency of ink. In addition, JP-A-5-220
The method described in Japanese Patent No. 968 is a method in which a plurality of grooves are provided in a piezoelectric substrate and a sealing means is not required. However, in the groove processing of the substrate, the groove is cut up in the middle, and the groove processing is performed. And the workability of attaching the lead wire after that. Then, for the purpose of eliminating these defects, an inkjet head provided with a sealing piece for sealing one opening of the groove of the piezoelectric substrate has been devised and known.
【０００４】図１３はかかる封口片を備えたインクジェ
ットヘッドの構造を示す上面図であり、図１４はその溝
に沿った断面図である。但し図１３では蓋を省いてあ
る。図１３および図１４に示すように圧電材よりなる基
板６１は複数の溝６２、隔壁６０および隔壁の低い段部
６４を備えており、溝６２の内面に駆動電極６３を備え
ている。段部６４の隅部に、溝６２の段部６４に面する
端部を封口するように封口片５を接着剤６９により接着
する。次に図１４に示すようにインク供給手段６８を備
えた蓋６７を溝の隔壁６０の上に接合する。基板６１の
溝６２の開口する端面および隣接する蓋６７の端面にノ
ズル孔１６を有するノズル板７２を接合する。次に、段
部６４の封口片５が取付けられていない部分にフイルム
状のプリント配線基板（いわゆるＦＰＣ）３４を取付
け、該配線基板３４の外部電極３５を前記駆動電極６３
の引き出し部６３ｂに接続する。前記外部電極３５を介
して外部の駆動電源より駆動電極６３に駆動電圧を加え
ると溝６２の隔壁６０が変形し、溝６２の容積を変化さ
せ、溝６２に供給したインクを圧縮し、ノズル孔１６か
らインク滴を吐出し、印字を行う。このような構造のイ
ンクジェットヘッドにおいては、以下に述べるような問
題点を有していた。FIG. 13 is a top view showing the structure of an ink jet head provided with such a sealing piece, and FIG. 14 is a sectional view taken along the groove thereof. However, the lid is omitted in FIG. As shown in FIGS. 13 and 14, a substrate 61 made of a piezoelectric material includes a plurality of grooves 62, partition walls 60, and step portions 64 with low partition walls, and drive electrodes 63 are provided on the inner surfaces of the grooves 62. The sealing piece 5 is bonded to the corner of the step portion 64 with an adhesive 69 so that the end of the groove 62 facing the step portion 64 is sealed. Next, as shown in FIG. 14, a lid 67 provided with an ink supply means 68 is bonded onto the partition wall 60 of the groove. The nozzle plate 72 having the nozzle holes 16 is joined to the end surface of the substrate 61 where the groove 62 is open and the end surface of the adjacent lid 67. Next, a film-shaped printed wiring board (so-called FPC) 34 is attached to a portion of the step portion 64 where the sealing piece 5 is not attached, and the external electrode 35 of the wiring board 34 is connected to the drive electrode 63.
Connected to the lead-out portion 63b. When a driving voltage is applied to the driving electrode 63 from an external driving power source through the external electrode 35, the partition wall 60 of the groove 62 is deformed, the volume of the groove 62 is changed, the ink supplied to the groove 62 is compressed, and the nozzle hole is formed. Ink droplets are ejected from 16 to perform printing. The inkjet head having such a structure has the following problems.
【０００５】封口片５を段部６４と溝の隔壁６０の端面
に接着して封口を行い、溝６２内のインクの流出を阻止
するには、図１４に示す封口片５の下面と溝６２の底面
６２ｂとの間の隙間を接着剤６９により十分に充填して
外部との連通を阻止する必要がある。このためには接着
剤６９は粘度が低く流動性の高いものが望ましい。しか
し、このような粘度が低く流動性の高い接着剤を用いる
と、図１４に示すように段部６４全域にわたり溝部に接
着剤が流れる。この結果、フイルム状のプリント配線基
板３４を段部６４に圧接して駆動電極の引き出し部６３
ｂとプリント配線基板３４上の外部電極３５の導通をさ
せようとしても、駆動電極の引き出し部６３ｂの表面に
存在する接着剤６９に阻止されて導通がとれなくなる。
一方かかる導通を確保するため流動性の低い接着剤を用
いた場合には、封口片５の下面と溝６２の底面６２ｂと
の間の隙間を接着剤により十分に充填することが難し
く、インクの流出の阻止が不完全となり易い。In order to prevent the outflow of ink in the groove 62 by adhering the sealing piece 5 to the step portion 64 and the end surface of the partition wall 60 of the groove to prevent the ink from flowing out in the groove 62, the lower surface of the sealing piece 5 and the groove 62 shown in FIG. It is necessary to sufficiently fill the gap between the bottom surface 62b and the bottom surface 62b with the adhesive 69 to prevent communication with the outside. For this purpose, it is desirable that the adhesive 69 has low viscosity and high fluidity. However, when such an adhesive having a low viscosity and a high fluidity is used, the adhesive flows in the groove portion over the entire step portion 64 as shown in FIG. As a result, the film-shaped printed wiring board 34 is brought into pressure contact with the step portion 64, and the drive electrode lead portion 63 is formed.
Even if an attempt is made to establish electrical continuity between b and the external electrode 35 on the printed wiring board 34, the electrical continuity cannot be established because the adhesive 69 present on the surface of the lead-out portion 63b of the drive electrode blocks the electrical continuity.
On the other hand, when an adhesive having low fluidity is used to secure such continuity, it is difficult to sufficiently fill the gap between the lower surface of the sealing piece 5 and the bottom surface 62b of the groove 62 with the adhesive, and Prevention of outflow tends to be incomplete.
【０００６】[0006]
【発明が解決しようとする課題】本発明は前記の如く圧
電材料よりなり複数の溝を備え、溝の隔壁が低くなった
段部を有する基板の該段部にインク室の一部を構成する
封口片を接着するとともに、フイルム状のプリント配線
基板を取り付け、駆動電極の引き出し手段を外部の駆動
電源と接続する構造の従来のインクジェットヘッドにお
いて、前記のような封口片の密封性とプリント配線基板
の導通性の両立の困難性を課題とし、この課題を解決し
ようとするものである。そして本発明はかかる構造のイ
ンクジェットヘッドにおいて封口片による密封性を上げ
てインクの流出を完全に阻止するとともに前記プリント
配線基板上の外部電極と基板の段部における駆動電極の
引き出し手段との導通が十分にとれるようなインクジェ
ットヘッドを提供することを目的とする。As described above, the present invention comprises a plurality of grooves made of a piezoelectric material, and a part of an ink chamber is formed on the stepped portion of a substrate having a stepped portion with a low partition wall of the groove. In a conventional inkjet head having a structure in which a sealing piece is adhered, a film-shaped printed wiring board is attached, and a driving electrode lead-out means is connected to an external driving power source, the sealing property of the sealing piece and the printed wiring board are as described above. Therefore, it is an attempt to solve this problem by making it difficult to achieve both conductivity. Further, according to the present invention, in the ink jet head having such a structure, the sealing property of the sealing piece is enhanced to completely prevent the outflow of the ink, and the conduction between the external electrode on the printed wiring board and the drive electrode lead-out means on the stepped portion of the board is established. It is an object of the present invention to provide an inkjet head that can be sufficiently taken.
【０００７】[0007]
【課題を解決するための手段】上記課題を解決するため
の第１の手段として、本発明は圧電材料よりなり複数の
溝および段部を備えた基板、前記溝の隔壁の上面に取り
付ける蓋、および該溝の段部への開口部を塞ぐ封口片を
有し、前記溝の内面に導電膜を備え、前記隔壁を圧電変
形することにより溝に供給されたインクを圧縮して該溝
に接続するノズル孔よりインク滴を吐出し印字を行うイ
ンクジェットヘッドにおいて、前記基板はインクを吐出
する端面から順次に隔壁の高さが段階的に変化する第１
の段部、第２の段部、第３の段部若しくは突起部および
第４の段部を有し、第１の段部および第３の段部若しく
突起部の隔壁の高さは第２の段部および第４の段部の隔
壁の高さよりも高く形成し、第３の段部若しくは突起部
の溝部に粘度の高い接着剤を充填し、第１の段部と第２
の段部が構成する隅部に封口片を接着し、第４の段部に
プリント配線基板を取り付けることを特徴とする。As a first means for solving the above problems, the present invention is a substrate made of a piezoelectric material and provided with a plurality of grooves and steps, a lid attached to the upper surface of the partition walls of the grooves, And a sealing piece that closes the opening of the groove to the stepped portion, the conductive film is provided on the inner surface of the groove, and the ink supplied to the groove is compressed by piezoelectrically deforming the partition wall and connected to the groove. In an inkjet head that performs printing by ejecting ink droplets from a nozzle hole, the height of a partition wall of the substrate changes stepwise from the end face that ejects ink.
Has a step, a second step, a third step or a protrusion and a fourth step, and the height of the partition wall of the first step, the third step or the protrusion is The height of the partition walls of the second step portion and the fourth step portion is made higher than that of the second step portion, and the groove portion of the third step portion or the protruding portion is filled with an adhesive having high viscosity.
The sealing piece is adhered to the corner formed by the step portion, and the printed wiring board is attached to the fourth step portion.
【０００８】上記問題点を解決するための第２の手段と
して、本発明は第１の手段のインクジェットヘッドを製
造する方法において、基板に溝加工をした後、溝に導電
膜を取り付け、その後、段加工等機械加工により第１の
段部、第２の段部、第３の段部若しくは突起部、および
第４の段部を形成し、第３の段部若しくは突起部の溝部
に粘度の高い接着剤を充填した後、第１の段部と第２の
段部が構成する隅部に封口片を粘度の低い接着剤により
接着し、その後、第１の段部の溝の上面を塞ぐようにし
て基板に蓋を接合することを特徴とする。As a second means for solving the above problems, the present invention is a method for manufacturing an ink jet head according to the first means, in which a groove is formed on a substrate, a conductive film is attached to the groove, and then, The first step portion, the second step portion, the third step portion or the protruding portion, and the fourth step portion are formed by mechanical processing such as step processing, and the viscosity of the groove of the third step portion or the protruding portion is increased. After filling with a high adhesive, the sealing piece is adhered to the corner formed by the first step and the second step with an adhesive having a low viscosity, and then the upper surface of the groove of the first step is closed. The lid is joined to the substrate in this manner.
【０００９】[0009]
【作用】本発明における前記第１の手段によれば、基板
の前記第３の段部若しくは突起部の溝部に粘度の高い接
着剤を充填しているため、封口片を第２の段部において
粘度の低い接着剤を用いて接着しても、流動する接着剤
は第３の段部若しくは突起部の前記粘度の高い接着剤に
阻止されて第４の段部へ流出しなくなる。一方該粘度の
高い接着剤は流動性が低いため、第３の段部等およびそ
の近傍のみに接着し、第４の段部のほとんどの部分には
流出しない。従って、第４の段部は第３の段部の近傍を
除き、その表面および溝内にいかなる接着剤も接着して
おらず、プリント配線基板を取り付けたとき溝部の電極
との導通を十分にとることができる。その一方、前記の
如く、封口片を粘度が低く流動性の高い接着剤を用いて
接着することができるので封口片の下面と溝の底面との
間の隙間を接着剤により十分に充填してインクの流出を
完全に阻止することができる。According to the first means of the present invention, since the adhesive having high viscosity is filled in the groove portion of the third step portion or the projecting portion of the substrate, the sealing piece is provided in the second step portion. Even if the adhesive having a low viscosity is used for bonding, the flowing adhesive is prevented from flowing out to the fourth step by being blocked by the high-viscosity adhesive of the third step or the protrusion. On the other hand, since the adhesive having high viscosity has low fluidity, it adheres only to the third step and the like and the vicinity thereof, and does not flow out to most of the fourth step. Therefore, except for the vicinity of the third step portion, the fourth step portion does not have any adhesive adhered to its surface and inside the groove, and when the printed wiring board is attached, sufficient electrical continuity with the electrode of the groove portion is achieved. Can be taken. On the other hand, as described above, since the sealing piece can be adhered using an adhesive having low viscosity and high fluidity, the gap between the lower surface of the sealing piece and the bottom surface of the groove should be sufficiently filled with the adhesive. It is possible to completely prevent the outflow of ink.
【００１０】前記第２の手段によれば、基板に溝加工を
した後、溝に導電膜を取り付けた後、段加工により第
１、第２、第３等および第４の段部を形成し、その後、
第３の段部等の溝部に粘度の高い接着剤を充填した後、
第１の段部と第２の段部が構成する隅部に封口板を粘度
の低い接着剤により接着することにより、プリント配線
基板との導通が良好で、インクの流出を完全に阻止する
ことができるインクジェットヘッドを確実に製造するこ
とができる。According to the second means, after the groove is formed on the substrate, the conductive film is attached to the groove, and then the first, second, third, etc. and fourth step portions are formed by step processing. ,afterwards,
After filling the high-viscosity adhesive in the grooves such as the third step,
The sealing plate is adhered to the corner formed by the first step and the second step with a low-viscosity adhesive to ensure good continuity with the printed wiring board and to completely prevent the outflow of ink. It is possible to reliably manufacture an inkjet head capable of performing the above.
【００１１】[0011]
（実施例１）本発明の第１の実施例を図面を参照して説
明する。図１は本実施例のインクジェットヘッドの構造
を示す斜視図である。圧電材料よりなる基板１の上面に
はダイシングソーによる加工等により複数の溝２を形成
し、溝２の内面に駆動電極３を取り付け基板１の上面を
段加工することにより、溝２の開口する基板の一方の端
面から溝２に沿って順次隔壁の高さが段階的に変化する
第１の段部２１、第２の段部２２、第３の段部２３およ
び第４の段部２４を形成する。ここで、第１の段部２１
の隔壁２５および第３の段部２３の隔壁２７の高さは第
２の段部２２の隔壁２６および第４の段部２４の隔壁２
８の高さよりも高くなるよう形成する。(Embodiment 1) A first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing the structure of the inkjet head of this embodiment. A plurality of grooves 2 are formed on the upper surface of the substrate 1 made of a piezoelectric material by processing with a dicing saw, the drive electrodes 3 are attached to the inner surfaces of the grooves 2, and the upper surface of the substrate 1 is stepped to open the grooves 2. A first step portion 21, a second step portion 22, a third step portion 23, and a fourth step portion 24 in which the height of the partition wall changes step by step from one end surface of the substrate along the groove 2 are formed. Form. Here, the first step portion 21
Of the partition wall 25 of the second step portion 22 and the partition wall 2 of the fourth step portion 24.
It is formed to be higher than the height of 8.
【００１２】第３の段部２３において溝２に粘度の高い
第１の接着剤２９（例えば主剤をアラルダイトＡＶ１３
８、硬化剤をアラルダイトＨＶ９９８とする２液性の接
着剤）を充填・接着した後、第１の段部２１と第２の段
部２２が構成する隅部に封口片５を粘度が低く流動性の
高い第２の接着剤３０（たとえば一液性のエポキシ接着
剤）により接着する。なお、図１においては、第１の接
着剤２９が第３の段部の隔壁２７の間の溝２のみに接着
し、第２の接着剤同士は分離した状態となっているが、
実際には第２の接着剤の塗布のため、この外に第３の段
部の隔壁２７の上面または端面に第２の接着剤２９が接
着し、接着剤同士が接続し、または前記の隔壁２７を埋
めてしまう場合もある。In the third step 23, the first adhesive 29 having a high viscosity (for example, the main component is Araldite AV13) is formed in the groove 2.
8. After filling and adhering with a two-liquid adhesive that uses Araldite HV998 as the curing agent, the sealing piece 5 flows to the corner formed by the first step 21 and the second step 22 with low viscosity. The second adhesive 30 having a high property (for example, a one-component epoxy adhesive) is used for adhesion. In addition, in FIG. 1, the first adhesive 29 is adhered only to the groove 2 between the partition walls 27 of the third step portion, and the second adhesives are separated from each other.
In practice, since the second adhesive is applied, the second adhesive 29 is adhered to the upper surface or the end surface of the partition wall 27 of the third step portion to connect the adhesives to each other, or the partition wall described above is applied. In some cases, 27 may be filled.
【００１３】図２は本実施例のインクジェットヘッドの
溝２に沿った断面図である。図２に示すように第１の接
着剤２９は流動性が低いために第３の段部の隔壁２７お
よびその近傍のみに接着し、第４の段部２４にはほとん
ど流れて行かない。これに対し、第２の接着剤３０は流
動性が高いため、封口片の側面と第１の段部の隔壁２６
の立下がる端面との間、封口片５の底面と第２の段部の
隔壁２６の上面との間および封口片５の底面と溝２の底
面２ｂとの間の空間に流れ込み、これらの間を充填し、
密封・接着する。第１の接着剤は更に第２の段部２２に
流出するが、第３の段部２３に充填・接着した第１の接
着剤２９に阻止されて第４の段部２４には流出しない。
この結果、第４の段部２４においては、第３の段部２３
の近傍を除き、第１の接着剤２９も第２の接着剤３０も
付着していない。FIG. 2 is a sectional view taken along the groove 2 of the ink jet head of this embodiment. As shown in FIG. 2, since the first adhesive 29 has low fluidity, it adheres only to the partition wall 27 of the third step and the vicinity thereof, and hardly flows to the fourth step 24. On the other hand, since the second adhesive 30 has a high fluidity, the side surface of the sealing piece and the partition wall 26 of the first step portion are
Between the bottom surface of the sealing piece 5 and the upper surface of the partition wall 26 of the second step portion, and between the bottom surface of the sealing piece 5 and the bottom surface 2b of the groove 2 and between them. Fill the
Seal and adhere. The first adhesive further flows out to the second step 22, but is prevented from flowing out to the fourth step 24 by being blocked by the first adhesive 29 filled and adhered to the third step 23.
As a result, in the fourth step portion 24, the third step portion 23
The first adhesive 29 and the second adhesive 30 are not attached except in the vicinity of.
【００１４】次に必要に応じて基板１の第１の段部およ
び封口片５の上面を平面研削した後、図１または図２に
示すように、第１の段部の隔壁２６の上面および封口片
５の上面に蓋８を接着し、第１の段部２１において溝２
の開口する基板１の端面およびこれに隣接する蓋８の端
面にノズル孔１６を有するノズル板１５を接合する。蓋
８は図１に示すように共通のインク溜め９および該共通
のインク溜め９と溝２とを一つおきに連通する複数のイ
ンク通孔１０を備えている。蓋８の上面にインク導入孔
１２を有する上板１１を取付けてインクジェットヘッド
を構成する。Next, if necessary, the first step portion of the substrate 1 and the upper surface of the sealing piece 5 are surface-ground, and then, as shown in FIG. 1 or 2, the upper surface of the partition wall 26 of the first step portion and The lid 8 is adhered to the upper surface of the sealing piece 5, and the groove 2 is formed in the first step portion 21.
The nozzle plate 15 having the nozzle holes 16 is bonded to the end face of the substrate 1 that is open and the end face of the lid 8 adjacent to the end face. As shown in FIG. 1, the lid 8 is provided with a common ink reservoir 9 and a plurality of ink through holes 10 that communicate every other one of the common ink reservoir 9 and the groove 2. An upper plate 11 having an ink introduction hole 12 is attached to the upper surface of the lid 8 to form an inkjet head.
【００１５】図３は本実施例のインクジェットヘッドの
第４の段部２４にフイルム状のプリント配線基板（いわ
ゆるＦＰＣ）３４を取り付ける方法を示す側面図であ
り、図４は図３のＡ−Ａ断面図である。図３および図４
に示すように第４の段部２４において駆動電極の引き出
し部３ｂに異方性導電膜３６を介してフイルム状のプリ
ント配線基板３４の外部電極３５を圧接し、該引き出し
部３ｂと外部電極３５を導通する。このとき、第４の段
部２４の接続部には第１の接着剤も第２の接着剤も付着
していないので、従来のように接着剤による阻害を受け
ることなく、溝の内面の引き出し部３ｂとプリント配線
基板上の外部電極３５の導通を十分にとることができ
る。FIG. 3 is a side view showing a method of attaching a film-shaped printed wiring board (so-called FPC) 34 to the fourth step portion 24 of the ink jet head of this embodiment, and FIG. 4 is an AA line of FIG. FIG. 3 and 4
As shown in FIG. 5, the external electrode 35 of the film-shaped printed wiring board 34 is pressed against the lead-out portion 3b of the drive electrode via the anisotropic conductive film 36 in the fourth step portion 24, and the lead-out portion 3b and the external electrode 35 are formed. To conduct. At this time, neither the first adhesive nor the second adhesive is attached to the connecting portion of the fourth step portion 24, so that the inner surface of the groove can be pulled out without being hindered by the adhesive as in the conventional case. The portion 3b and the external electrode 35 on the printed wiring board can be sufficiently electrically connected.
【００１６】本実施例のインクジェットヘッドの動作に
つき説明する。図５および図６は本実施例のインクジェ
ットヘッドの溝２に垂直な断面を示す。図中の矢印は圧
電材料の分極方向を示す。本実施例においては基板１の
第１の段部２１において、その隔壁２５の中央から下の
部分が下部基板部材１ｂ、上の部分が上部基板部材１ｃ
である。ここで下部基板部材１ｂは図中上向きに分極さ
れ、上部基板部材１ｃは下向きに分極されている。前述
したように、溝２の内面には駆動電極３を取付けた構造
となっている。図１に示す前記のインク導入孔１２から
インクを注入し、インク溜９およびインク通孔１０を介
して、図５および図６に示すように溝２に一つおきにイ
ンクを充填する。ここでインクを充填する溝２をインク
溝２ｄ、インクを充填しない溝をダミー溝２ｃと呼ぶこ
とにする。隔壁２５の上面に接着した蓋８とインク溝２
ｄは図１または図２に示す封口片５とともにインク室１
８を形成する。The operation of the ink jet head of this embodiment will be described. 5 and 6 show a cross section perpendicular to the groove 2 of the ink jet head of this embodiment. The arrow in the figure indicates the polarization direction of the piezoelectric material. In the present embodiment, in the first step portion 21 of the substrate 1, the lower portion from the center of the partition wall 25 is the lower substrate member 1b, and the upper portion is the upper substrate member 1c.
Is. Here, the lower substrate member 1b is polarized upward in the figure, and the upper substrate member 1c is polarized downward. As described above, the drive electrode 3 is attached to the inner surface of the groove 2. Ink is injected from the ink introduction hole 12 shown in FIG. 1, and the ink is filled into the groove 2 through the ink reservoir 9 and the ink passage hole 10 as shown in FIGS. 5 and 6. Here, the groove 2 filled with ink is called an ink groove 2d, and the groove not filled with ink is called a dummy groove 2c. The lid 8 and the ink groove 2 bonded to the upper surface of the partition wall 25
d is the ink chamber 1 together with the sealing piece 5 shown in FIG. 1 or 2.
8 is formed.
【００１７】図６に示すように、いずれかのインク溝２
ｄの駆動電極３とその両側のダミー溝２ｃの駆動電極３
の間に、ダミー溝の駆動電極３が高電位となるように、
外部の駆動電源から前記のフイルム状のプリント配線基
板上の外部電極およびこれに導通する引き出し線を介し
て駆動電圧７０を加えるとインク溝２ｄの両側の隔壁１
３は内側に向けてせん断モードにより圧電変形しインク
室１８の容積を縮小する。この動作を急速に行うことに
より、ノズル孔１６からインク滴を吐出し印字を行うこ
とができる。次に図５に示すように、駆動電圧７０を除
去し放電スイッチ８０を閉じ非駆動状態とし、インク溝
２ｄの両側の隔壁１３をもとの状態に復帰させ、次の印
字ができるようにする。As shown in FIG. 6, one of the ink grooves 2
drive electrode 3 of d and drive electrodes 3 of dummy grooves 2c on both sides thereof
So that the drive electrode 3 of the dummy groove has a high potential during
When a driving voltage 70 is applied from an external driving power source through the external electrodes on the film-shaped printed wiring board and the lead lines conducted to the external electrodes, the partition walls 1 on both sides of the ink groove 2d are applied.
3 inwardly piezoelectrically deforms in the shear mode to reduce the volume of the ink chamber 18. By rapidly performing this operation, ink droplets can be ejected from the nozzle holes 16 and printing can be performed. Next, as shown in FIG. 5, the drive voltage 70 is removed, the discharge switch 80 is closed and the non-driving state is set, and the partition walls 13 on both sides of the ink groove 2d are returned to the original state so that the next printing can be performed. .
【００１８】本実施例によれば、前述したように封口片
５の接着の密封性により、インク室からのインクの漏れ
を完全に阻止するとともに、図４に示し、説明したよう
に駆動電極の引き出し部３ｂとプリント配線基板上の外
部電極３５との導通を十分にとることができ、駆動電圧
を駆動電極３間に確実に加えることができるので、前記
の印字動作を確実に行うことができる。According to the present embodiment, as described above, due to the adhesive sealing property of the sealing piece 5, the leakage of ink from the ink chamber is completely prevented, and as shown in FIG. Since the lead-out portion 3b and the external electrode 35 on the printed wiring board can be sufficiently conducted and the drive voltage can be reliably applied between the drive electrodes 3, the above-described printing operation can be reliably performed. .
【００１９】（実施例２）次に、本発明の第２の実施例
として、第１の実施例におけるインク室の溝の表面に絶
縁膜を取り付けたものにつき図面を参照して説明する。
図７はインク室３８の駆動電極の表面に絶縁膜７を取り
付ける方法を示す図であり、溝２に沿った断面を示す。
図８は組み立てた状態における本実施例のインク室３８
に垂直な断面を示す図である。図７に示すように、第１
の実施例と同様にして、同様の基板１の第３の段部２３
において溝２に第１の接着剤２９を充填・接着し、第１
の段部２１と第２の段部２２が構成する隅部に封口片５
を第２の接着剤３０により接着した後、第１の段部２１
の溝２の内面の駆動電極３を含む基板１の上面、第２の
接着剤３０および封口片５の露出した表面にパリレン等
の絶縁膜７をＣＶＤ等により取付ける。絶縁膜７の第４
の段部への付着はマスキングにより阻止する。この絶縁
膜７の表面に必要に応じ親水化処理を行う。次に必要に
応じて第１の段部および封口片の上面を平面研削した後
に、第１の実施例と同様にして第１の段部の隔壁２５の
上面および封口片５の上面に蓋８を接着し、第１の段部
２１において溝２の開口する基板の端面およびこれに隣
接する蓋８の端面にノズル孔１６を有するノズル板１５
を接合し、図８に示すように絶縁膜７が駆動電極３を保
護するインク室３８を構成する。(Embodiment 2) Next, as a second embodiment of the present invention, a description will be given with reference to the drawings in which an insulating film is attached to the surface of the groove of the ink chamber in the first embodiment.
FIG. 7 is a diagram showing a method of attaching the insulating film 7 to the surface of the drive electrode of the ink chamber 38, and shows a cross section taken along the groove 2.
FIG. 8 shows the ink chamber 38 of this embodiment in the assembled state.
It is a figure which shows the cross section perpendicular | vertical to. As shown in FIG.
Similar to the embodiment of FIG.
First, the groove 2 is filled and adhered with the first adhesive 29,
The sealing piece 5 at the corner formed by the step portion 21 and the second step portion 22 of
Are bonded by the second adhesive 30 and then the first step portion 21
An insulating film 7 of parylene or the like is attached to the upper surface of the substrate 1 including the drive electrode 3 on the inner surface of the groove 2, the exposed surface of the second adhesive 30 and the sealing piece 5 by CVD or the like. Fourth of insulating film 7
Adhesion to the step is blocked by masking. If necessary, the surface of this insulating film 7 is subjected to a hydrophilic treatment. Next, if necessary, the upper surfaces of the first step portion and the sealing piece are surface-ground, and then the lid 8 is attached to the upper surface of the partition wall 25 and the upper surface of the sealing piece 5 of the first step portion in the same manner as in the first embodiment. And a nozzle plate 15 having nozzle holes 16 on the end surface of the substrate in which the groove 2 is opened in the first step portion 21 and the end surface of the lid 8 adjacent thereto.
And the insulating film 7 constitutes an ink chamber 38 that protects the drive electrode 3 as shown in FIG.
【００２０】図８に示すように、インク室３８の周辺の
構造は絶縁膜７を除き、第１の実施例において図５に示
したインク室１８の場合と同様である。次に、図示は省
略するが第１の実施例と同様に第４の段部において駆動
電極の引き出し線に異方性導電膜を介してフイルム状の
プリント配線基板の外部電極を圧接し該引き出し線と外
部電極を導通する。本実施例は第１の実施例と同様の作
用・効果を有する外に、駆動電極３が絶縁膜７により保
護されているため、導電性インクを用いてもインク内に
電流が流れることはなく、かかる電流によるインクの変
質を防ぐことができる。As shown in FIG. 8, the structure around the ink chamber 38 is the same as that of the ink chamber 18 shown in FIG. 5 in the first embodiment except the insulating film 7. Next, although not shown, in the same manner as in the first embodiment, the external electrodes of the film-shaped printed wiring board are pressed to the lead wires of the drive electrodes through the anisotropic conductive film in the fourth step portion and the lead wires are drawn out. Conducts electrical connection between the wire and the external electrode. In addition to having the same actions and effects as the first embodiment, this embodiment has the drive electrode 3 protected by the insulating film 7. Therefore, even if conductive ink is used, current does not flow in the ink. It is possible to prevent the deterioration of the ink due to the current.
【００２１】（実施例３）本発明の第３の実施例を図面
を参照して説明する。図９は本実施例における基板３１
の溝２に沿った断面を示す図である。同図に示すように
本実施例においては第１の実施例の第３の段部２３に相
当する部分が斜面を有する突起部３２となっている。本
実施例においては該突起３２の隔壁３３の間の溝部２に
第１の実施例と同様の第１の接着剤３０を充填・接着す
るが、斜面があるため、第１の接着剤の塗布・充填が容
易となる。その他の点については第１の実施例と同様で
あり、同様の作用・効果を有する。(Embodiment 3) A third embodiment of the present invention will be described with reference to the drawings. FIG. 9 shows the substrate 31 in this embodiment.
It is a figure which shows the cross section along the groove | channel 2 of FIG. As shown in the figure, in this embodiment, the portion corresponding to the third step portion 23 of the first embodiment is a protrusion 32 having an inclined surface. In this embodiment, the groove 2 between the partition walls 33 of the protrusion 32 is filled and adhered with the same first adhesive 30 as in the first embodiment, but since there is a slope, the first adhesive is applied.・ Easy filling. The other points are similar to those of the first embodiment, and have similar operations and effects.
【００２２】（実施例４）本発明の第４の実施例を図面
を参照して説明する。図１０および図１１は本実施例の
インクジェットヘッドのインク室４７に垂直な断面図で
ある。図１２は本実施例のインクジェットヘッドのイン
ク室４７に沿った断面図である。図１０に示すように基
板４１は複数の溝４２および隔壁４３を備えている。基
板４１は複数の圧電薄板４３ｂおよび駆動電極４４とな
る導電膜を交互に積み重ねて結合した積層板を溝加工お
よび段加工して形成する。すなわち、溝加工を行った
後、駆動電極４４を引き出す引き出し電極４５を溝４２
の内面に取り付け、その後図１２に示すように第１の実
施例と同様の第１、第２、第３及び第４の段部２１、２
２、２３および２４を段加工により形成する。ここで、
第１の段部２１における隔壁４３は図１１に示すよう
に、ｄ33モードで積層方向に伸縮する圧電アクチェータ
ーとなる。図１２に示すように、第１の実施例と同様に
して第３の段部２３における第１の接着剤２９の充填、
第２の接着剤３０による封口片５の接着を行う。(Embodiment 4) A fourth embodiment of the present invention will be described with reference to the drawings. 10 and 11 are sectional views perpendicular to the ink chamber 47 of the inkjet head of this embodiment. FIG. 12 is a sectional view taken along the ink chamber 47 of the inkjet head of this embodiment. As shown in FIG. 10, the substrate 41 has a plurality of grooves 42 and partition walls 43. The substrate 41 is formed by performing groove processing and step processing on a laminated plate in which a plurality of piezoelectric thin plates 43b and conductive films to be the drive electrodes 44 are alternately stacked and combined. That is, after the groove processing is performed, the extraction electrode 45 for drawing out the drive electrode 44 is formed in the groove 42.
Attached to the inner surface of the first, second, third, and fourth step portions 21, 2 similar to the first embodiment, as shown in FIG.
2, 23 and 24 are formed by step processing. here,
The partition wall 43 in the first step portion 21 serves as a piezoelectric actuator that expands and contracts in the stacking direction in the d33 mode, as shown in FIG. As shown in FIG. 12, in the same manner as in the first embodiment, the filling of the first adhesive 29 in the third step portion 23,
The sealing piece 5 is bonded with the second adhesive 30.
【００２３】次に、第１の実施例と同様にして必要に応
じて第１の段部２１の上面および封口片５の上面の平面
研削を行った後、蓋４８を基板４１の第１の段部の隔壁
４３および封口片５の上面に接着する。蓋４８は変形可
能な比較的薄い板材よりなり、溝４２に対し一つおきに
インクを供給するインク通孔５０を備えている。基板４
１の溝２の開口する端面および、隣接する蓋４８の端面
にノズル孔１６を有するノズル板５５を接合する。イン
ク導入孔５２よびインク溜５３を有する上板５１を蓋４
８の上に接合し、インクジェットヘッドを構成する。第
４の段部２４に第１の実施例と同様にして図示しないフ
イルム状のプリント配線基板を接続し、該配線基板の外
部電極と前記引き出し電極４５を導通する。Next, as in the first embodiment, the upper surfaces of the first step portion 21 and the sealing piece 5 are subjected to surface grinding as required, and then the lid 48 is placed on the first surface of the substrate 41. It is adhered to the upper surface of the stepped partition wall 43 and the sealing piece 5. The lid 48 is made of a relatively thin plate material that can be deformed, and is provided with ink through holes 50 for supplying ink to the grooves 42 every other one. Board 4
The nozzle plate 55 having the nozzle holes 16 is joined to the open end surface of the groove 2 of No. 1 and the end surface of the adjacent lid 48. The upper plate 51 having the ink introducing hole 52 and the ink reservoir 53 is attached to the lid 4
8 is joined to form an inkjet head. A film-shaped printed wiring board (not shown) is connected to the fourth step portion 24 in the same manner as in the first embodiment, and the external electrode of the wiring board and the lead electrode 45 are electrically connected.
【００２４】本実施例の動作を説明する。前記のインク
導入孔５２からインクを注入し、第１の実施例と同様に
して図１０および図１１に示すように溝４２に一つおき
にインクを充填する。ここでインクを充填する溝をイン
ク溝４２ｄ、インクを充填しない溝をダミー溝４２ｃと
呼ぶことにする。図１０に示すようにインク溝４２ｄに
おいては隔壁４３の上から奇数番目の駆動電極４４ｂ同
士が共通にインク溝４２ｄの内面に取り付けた引き出し
電極４５ｄに接続し、ダミー溝４２ｃにおいては、隔壁
４３の上から偶数番目の駆動電極４４ｃ同士が共通にダ
ミー溝４２ｃの内面に取り付けた引き出し電極４５ｃに
接続している。駆動電極４４ｂおよび４４ｃに対し、そ
れぞれ引き出し電極４５ｄと引き出し電極４５ｃの間に
第１の実施例と同様のプリント配線基板の外部電極を通
じて、その一方が他方より高電位となるように外部より
電圧を加え、積層した圧電薄板４３ｂに予め分極処理を
施しておく。The operation of this embodiment will be described. Ink is injected from the ink introduction hole 52, and every other groove 42 is filled with ink in the same manner as in the first embodiment, as shown in FIGS. Here, the groove filled with ink is called an ink groove 42d, and the groove not filled with ink is called a dummy groove 42c. As shown in FIG. 10, in the ink groove 42d, the odd-numbered drive electrodes 44b from the top of the partition wall 43 are commonly connected to the extraction electrode 45d attached to the inner surface of the ink groove 42d, and in the dummy groove 42c, the partition wall 43 of the partition wall 43. The even-numbered drive electrodes 44c from the top are commonly connected to the extraction electrode 45c attached to the inner surface of the dummy groove 42c. For the drive electrodes 44b and 44c, an external electrode of the printed wiring board similar to that of the first embodiment is provided between the extraction electrode 45d and the extraction electrode 45c, and a voltage is applied from the outside so that one of them has a higher potential than the other. In addition, the laminated piezoelectric thin plates 43b are pre-polarized.
【００２５】インク溝４２ｄにインクを充填した状態
で、注目するインク溝４２ｄの引き出し電極４５ｄとそ
の両側のダミー溝４２ｃの引き出し電極４５ｃの間に分
極処理と逆方向の駆動電圧７０を加えると、駆動電極４
４ｂと４４ｃの間に分極と逆方向の電圧が加わり、図１
１に示すように隔壁４３の高さはｄ33効果により縮小
し、インク溝４２ｄ、蓋４８等により形成するインク室
４７の容積を縮小し、ノズル孔１６からインク滴を吐出
する。次に、図１０に示すように駆動電圧７０を除去し
放電スイッチ８０を閉じ非駆動状態とし、注目するイン
ク溝２２ｄの両側の隔壁４３をもとの状態に復帰させ、
次の印字ができるようにする。When the ink groove 42d is filled with ink, a driving voltage 70 in the opposite direction to the polarization process is applied between the extraction electrode 45d of the noted ink groove 42d and the extraction electrodes 45c of the dummy grooves 42c on both sides thereof. Drive electrode 4
A voltage in the opposite direction to the polarization is applied between 4b and 44c, as shown in FIG.
As shown in FIG. 1, the height of the partition wall 43 is reduced by the d33 effect, the volume of the ink chamber 47 formed by the ink groove 42d, the lid 48 and the like is reduced, and ink droplets are ejected from the nozzle holes 16. Next, as shown in FIG. 10, the driving voltage 70 is removed and the discharge switch 80 is closed to bring it into a non-driving state to restore the partition walls 43 on both sides of the ink groove 22d of interest to the original state.
Enable the next print.
【００２６】本実施例においても、第１の実施例と同様
に封口片の接着の密封性により、インク室からのインク
の漏れを完全に阻止するとともに、引き出し電極とプリ
ント配線基板上の外部電極との導通を十分にとることが
でき、駆動電圧を駆動電極４４ｂおよび４４ｃ間に確実
に加えることができるので、前記の印字動作を確実に行
うことができる。Also in this embodiment, similarly to the first embodiment, the sealing property of the adhesive of the sealing piece completely prevents the leakage of the ink from the ink chamber, and the extraction electrode and the external electrode on the printed wiring board. Can be sufficiently conducted, and the drive voltage can be reliably applied between the drive electrodes 44b and 44c, so that the printing operation can be reliably performed.
【００２７】なお、インク溝４２ｄに図１０および図１
１の点線で示すようなスペーサー４９を配することによ
り、インク室４７が縮小したときのインクの圧力を更に
高めることができ、インク滴の吐出効率を更に高めるこ
とができる。スペーサー４９はガラス、セラミックス等
の弾性率が高く圧力を加えても縮小しにくい材料よりな
り、以下に述べる原理により、インク室４７が縮小した
ときのインク圧力をより高める効果を有する。すなわ
ち、インク室の縮小により発生するインク圧力の上昇は
インクの圧縮率に比例する。ここでインクの圧縮率と
は、縮小前のインク室４７内のインクの体積とインク室
４７の縮小に伴うインクの体積の減少分の比率をいう。It should be noted that the ink groove 42d shown in FIGS.
By disposing the spacer 49 as indicated by the dotted line 1 in FIG. 1, the pressure of the ink when the ink chamber 47 is contracted can be further increased, and the ejection efficiency of ink droplets can be further increased. The spacer 49 is made of a material such as glass and ceramics having a high elastic modulus and is difficult to shrink even when pressure is applied, and has the effect of further increasing the ink pressure when the ink chamber 47 is shrunk according to the principle described below. That is, the increase in the ink pressure caused by the reduction of the ink chamber is proportional to the compression rate of the ink. Here, the ink compression rate refers to the ratio of the volume of ink in the ink chamber 47 before reduction to the amount of decrease in the volume of ink due to the reduction of the ink chamber 47.
【００２８】今、インク室４７の容積をＶ、その縮小分
を△Ｖ、スペーサー４９の体積をＶ１とし、インク室４
９内にスペーサー４９を配していない場合のインクの圧
縮率をＪ１とするとＪ１は略 Ｊ１＝△Ｖ／Ｖ （１） となる。一方、インク室４７内にスペーサー４９を配し
た場合のインクの圧縮率をＪ２とすると、縮小前のイン
ク室４７内のインクの体積はＶ−Ｖ１となるからＪ２は
略 Ｊ２＝△Ｖ／（Ｖ−Ｖ１） （２） となる。（１）式および（２）式よりスペーサー４９を
インク室内に配することにより、インクの圧縮率が向上
することがわかるが、前述のようにインク室の縮小によ
るインク圧力の上昇はインクの圧縮率に比例するので、
スペーサー４９を配することにより、かかるインクの上
昇を更に高めることができる。Now, let the volume of the ink chamber 47 be V, the reduced amount be ΔV, and the volume of the spacer 49 be V1, and the ink chamber 4
If the compression rate of the ink when the spacer 49 is not provided in 9 is J1, J1 is approximately J1 = ΔV / V (1). On the other hand, when the compression ratio of the ink when the spacer 49 is arranged in the ink chamber 47 is J2, the volume of the ink in the ink chamber 47 before the reduction is V-V1, so that J2 is approximately J2 = ΔV / ( V-V1) (2). It can be seen from the formulas (1) and (2) that the spacer 49 is arranged in the ink chamber to improve the compression rate of the ink. However, as described above, the increase in the ink pressure due to the reduction of the ink chamber causes the compression of the ink. Proportional to the rate,
By disposing the spacer 49, the rise of the ink can be further enhanced.
【００２９】[0029]
【発明の効果】以上に述べたように本発明によれば圧電
材料よりなり複数の溝を備え、溝の隔壁が低くなった段
部を有する基板の該段部にインク室一部を形成する封口
片を接着するとともに、フイルム状のプリント配線基板
を取り付け、駆動電極の引き出し手段を外部の駆動電源
と接続する構造のインクジェットヘッドにおいて、封口
片による密封性を上げてインクの流出を完全に阻止する
とともに前記プリント配線基板上の外部電極と基板の段
部における駆動電極の引き出し手段との導通が十分にと
れ、確実な駆動ができるインクジェットヘッドを提供す
ることができる。As described above, according to the present invention, a part of an ink chamber is formed in a step portion of a substrate having a plurality of grooves made of a piezoelectric material and having a step portion with a low partition wall of the groove. In an inkjet head with a structure in which the sealing piece is bonded, a film-shaped printed wiring board is attached, and the drive electrode lead-out means is connected to an external drive power supply, the sealing piece enhances the sealing performance to completely prevent the outflow of ink. In addition, it is possible to provide an ink jet head in which the external electrodes on the printed wiring board and the drive electrode lead-out means in the stepped portion of the board are sufficiently electrically connected to each other and can be driven reliably.
【００３０】更に本発明の製造方法によれば、かかるイ
ンクジェットヘッドを確実な方法により製造することが
できる。Further, according to the manufacturing method of the present invention, such an ink jet head can be manufactured by a reliable method.
【図１】本発明の第１の実施例の構造を示す斜視図であ
る。FIG. 1 is a perspective view showing a structure of a first embodiment of the present invention.
【図２】本発明の第１の実施例の構造を示す溝に沿った
断面図である。FIG. 2 is a sectional view taken along the groove showing the structure of the first embodiment of the present invention.
【図３】本発明の第１の実施例へプリント配線基板を取
り付ける方法を示す側面図である。FIG. 3 is a side view showing a method of attaching the printed wiring board to the first embodiment of the present invention.
【図４】図３におけるＡ−Ａ断面を示す図である。4 is a diagram showing a cross section taken along the line AA in FIG.
【図５】本発明の第１の実施例の構造を示す溝に垂直な
断面図である。FIG. 5 is a cross-sectional view perpendicular to the groove, showing the structure of the first embodiment of the present invention.
【図６】本発明の第１の実施例の構造を示す溝に垂直な
断面図である。FIG. 6 is a sectional view perpendicular to a groove showing a structure of a first embodiment of the present invention.
【図７】本発明の第２の実施例の構造を示す溝に沿った
断面図である。FIG. 7 is a sectional view taken along the groove showing the structure of the second embodiment of the present invention.
【図８】本発明の第２の実施例の構造を示す溝に垂直な
断面図である。FIG. 8 is a sectional view perpendicular to a groove showing a structure of a second embodiment of the present invention.
【図９】本発明の第３の実施例の基板の構造を示す溝に
沿った断面図である。FIG. 9 is a sectional view along a groove showing a structure of a substrate according to a third embodiment of the present invention.
【図１０】本発明の第４の実施例の構造を示す溝に垂直
な断面図である。FIG. 10 is a sectional view perpendicular to a groove showing a structure of a fourth embodiment of the present invention.
【図１１】本発明の第４の実施例の構造を示す溝に垂直
な断面図である。FIG. 11 is a sectional view perpendicular to a groove showing a structure of a fourth embodiment of the present invention.
【図１２】本発明の第４の実施例の構造を示す溝に沿っ
た断面図である。FIG. 12 is a sectional view taken along the groove showing the structure of the fourth embodiment of the present invention.
【図１３】従来のインクジェットヘッドの構造を示す上
面図である。FIG. 13 is a top view showing the structure of a conventional inkjet head.
【図１４】従来のインクジェットヘッドの構造を示す溝
に沿った断面図である。FIG. 14 is a sectional view taken along a groove showing a structure of a conventional inkjet head.
１ 基板 ２ 溝 ３ 駆動電極 ５ 封口片 ７ 絶縁膜 ８ 蓋 ９ インク溜 １０ インク通孔 １１ 上板 １２ インク導入孔 １５ ノズル板 １６ ノズル孔 １８ インク室 ２１ 第１の段部 ２２ 第２の段部 ２３ 第３の段部 ２４ 第４の段部 ２５ 第１の段部の隔壁 ２６ 第２の段部の隔壁 ２７ 第３の段部の隔壁 ２８ 第４の段部の隔壁 ２９ 第１の接着剤 ３０ 第２の接着剤 ３１ 基板 ３２ 突起部 ３３ 突起部の隔壁 ３４ プリント配線基板 ３５ 外部電極 ３６ 異方性導電膜 ３８ インク室 ４１ 基板 ４２ 溝 ４３ 隔壁 ４３ｂ 圧電薄板 ４４ 駆動電極 ４５ 引き出し電極 ４７ インク室 ４８ 蓋 ４９ スペーサー ５０ インク通孔 ５１ 上板 ５２ インク導入孔 ５３ インク溜 ５５ ノズル板 ６０ 隔壁 ６１ 基板 ６２ 溝 ６３ 駆動電極 ６４ 段部 ６７ 蓋 ６８ インク供給手段 ６９ 接着剤 ７０ 駆動電圧 ７２ ノズル板 ８０ 切り替えスイッチ 1 substrate 2 groove 3 drive electrode 5 sealing piece 7 insulating film 8 lid 9 ink reservoir 10 ink through hole 11 upper plate 12 ink introduction hole 15 nozzle plate 16 nozzle hole 18 ink chamber 21 first step 22 second step 23 Third Step Part 24 Fourth Step Part 25 First Step Partition Wall 26 Second Step Partition Wall 27 Third Step Partition Wall 28 Fourth Step Partition Wall 29 First Adhesive 30 Second Adhesive 31 Substrate 32 Projection 33 Partition Wall of Projection 34 Printed Circuit Board 35 External Electrode 36 Anisotropic Conductive Film 38 Ink Chamber 41 Substrate 42 Groove 43 Partition 43b Piezoelectric Thin Plate 44 Drive Electrode 45 Extraction Electrode 47 Ink Chamber 48 Lid 49 Spacer 50 Ink Through Hole 51 Upper Plate 52 Ink Inlet Hole 53 Ink Reservoir 55 Nozzle Plate 60 Partition Wall 61 Substrate 62 Groove 63 Drive Electrode 64 Step Part 67 Lid 68 a Click supplying means 69 adhesive 70 driving voltage 72 nozzle plate 80 changeover switch
Claims (4)
備えた基板、前記溝の隔壁の上面に取り付ける蓋、およ
び該溝の段部への開口部を塞ぐ封口片を有し、前記溝の
内面に導電膜を備え、前記隔壁を圧電変形することによ
り溝に供給されたインクを圧縮して該溝に接続するノズ
ル孔よりインク滴を吐出し印字を行うインクジェットヘ
ッドにおいて、前記基板はインクを吐出する端面から順
次に隔壁の高さが段階的に変化する第１の段部、第２の
段部、第３の段部若しくは突起部および第４の段部を有
し、第１の段部および第３の段部若しくは突起部の隔壁
の高さは第２の段部および第４の段部の隔壁の高さより
も高く形成し、第３の段部若しくは突起部の溝部に粘度
の高い接着剤を充填し、第１の段部と第２の段部が構成
する隅部に封口片を接着し、第４の段部にプリント配線
基板を取り付けることを特徴とするインクジェットヘッ
ド。1. A groove made of a piezoelectric material, the substrate having a plurality of grooves and step portions, a lid attached to the upper surface of the partition wall of the groove, and a sealing piece for closing an opening portion of the groove to the step portion. In an ink jet head that has a conductive film on its inner surface and compresses the ink supplied to the groove by piezoelectrically deforming the partition wall to eject ink droplets from nozzle holes connected to the groove for printing, the substrate is an ink The first step portion, the second step portion, the third step portion or the protruding portion, and the fourth step portion in which the height of the partition wall changes stepwise from the end face for discharging The height of the partition wall of the step portion and the third step portion or the protruding portion is formed higher than the height of the partition wall of the second step portion and the fourth step portion, and the viscosity of the groove portion of the third step portion or the protruding portion is increased. Filled with high adhesive, and put a sealing piece on the corner formed by the first step and the second step. An ink jet head, characterized in that it is adhered and a printed wiring board is attached to the fourth step.
り付け、その後、段加工等機械加工により第１の段部、
第２の段部、第３の段部若しくは突起部、および第４の
段部を形成し、第３の段部若しくは突起部の溝部に粘度
の高い接着剤を充填した後、第１の段部と第２の段部が
構成する隅部に封口片を粘度の低い接着剤により接着
し、その後、第１の段部の溝の上面を塞ぐようにして基
板に蓋を接合することを特徴とする請求講１に記載する
インクジェットヘッドの製造方法。2. A groove is formed on a substrate, a conductive film is attached to the groove, and then a first step portion is formed by mechanical processing such as step processing.
After forming the second step, the third step or the projection, and the fourth step, filling the groove of the third step or the projection with a high-viscosity adhesive, the first step is formed. The sealing piece is adhered to the corner formed by the first step and the second step with a low-viscosity adhesive, and then the lid is joined to the substrate so as to close the upper surface of the groove of the first step. The method for manufacturing an inkjet head according to claim 1.
垂直方向にせん断モードにより圧電変形をすることを特
徴とする請求項１に記載するインクジェットヘッド。3. The ink jet head according to claim 1, wherein the partition wall of the groove provided on the substrate is piezoelectrically deformed in a shearing mode in a direction perpendicular to the height direction of the partition wall.
ｄ33効果により圧電変形をすることを特徴とする請求項
１に記載するインクジェットヘッド。4. The ink jet head according to claim 1, wherein the partition wall of the groove provided on the substrate is piezoelectrically deformed in the height direction by the d33 effect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19150494A JPH0852872A (en) | 1994-08-15 | 1994-08-15 | Ink jet head and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19150494A JPH0852872A (en) | 1994-08-15 | 1994-08-15 | Ink jet head and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0852872A true JPH0852872A (en) | 1996-02-27 |
Family
ID=16275757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19150494A Pending JPH0852872A (en) | 1994-08-15 | 1994-08-15 | Ink jet head and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0852872A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001191525A (en) * | 2000-01-17 | 2001-07-17 | Toshiba Tec Corp | Liquid drop ejector |
| EP1167040A1 (en) * | 2000-06-26 | 2002-01-02 | Toshiba Tec Kabushiki Kaisha | Ink jet printer head and method for manufacturing the same |
| GB2374833A (en) * | 2001-04-27 | 2002-10-30 | Sii Printek Inc | Piezoelectric inkjet printhead with a partition plate which divides a common ink chamber from nozzle chambers and includes holes which define a pump length |
| US6582057B2 (en) | 2001-10-22 | 2003-06-24 | Toshiba Tec Kabushiki Kaisha | Ink jet printer head and method for manufacturing the same |
| US7196455B2 (en) * | 2003-10-30 | 2007-03-27 | Ngk Insulators, Ltd. | Cell driving type piezoelectric/electrostrictive actuator and method of manufacturing the same |
| US7262545B2 (en) * | 2003-05-30 | 2007-08-28 | Ngk Insulators, Ltd. | Cell driving type piezoelectric/electrostrictive actuator and method of manufacturing the same |
| JP2010030110A (en) * | 2008-07-28 | 2010-02-12 | Konica Minolta Ij Technologies Inc | Inkjet head |
| JP2010201781A (en) * | 2009-03-03 | 2010-09-16 | Ricoh Co Ltd | Liquid droplet ejection head, manufacturing method thereof, liquid droplet ejection device and image forming apparatus |
| JP2016137589A (en) * | 2015-01-26 | 2016-08-04 | 株式会社東芝 | Inkjet head and inkjet printer |
| CN112492767A (en) * | 2021-01-18 | 2021-03-12 | 四川英创力电子科技股份有限公司 | PCB (printed circuit board) with step groove and processing method thereof |
-
1994
- 1994-08-15 JP JP19150494A patent/JPH0852872A/en active Pending
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001191525A (en) * | 2000-01-17 | 2001-07-17 | Toshiba Tec Corp | Liquid drop ejector |
| US6547374B2 (en) | 2000-06-26 | 2003-04-15 | Toshiba Tec Kabushiki Kaisha | Ink jet printer head and method for manufacturing the same |
| EP1167040A1 (en) * | 2000-06-26 | 2002-01-02 | Toshiba Tec Kabushiki Kaisha | Ink jet printer head and method for manufacturing the same |
| GB2374833B (en) * | 2001-04-27 | 2004-10-20 | Sii Printek Inc | Head chip |
| US6676247B2 (en) | 2001-04-27 | 2004-01-13 | Sii Printek Inc. | Head chip |
| GB2374833A (en) * | 2001-04-27 | 2002-10-30 | Sii Printek Inc | Piezoelectric inkjet printhead with a partition plate which divides a common ink chamber from nozzle chambers and includes holes which define a pump length |
| US6582057B2 (en) | 2001-10-22 | 2003-06-24 | Toshiba Tec Kabushiki Kaisha | Ink jet printer head and method for manufacturing the same |
| US7262545B2 (en) * | 2003-05-30 | 2007-08-28 | Ngk Insulators, Ltd. | Cell driving type piezoelectric/electrostrictive actuator and method of manufacturing the same |
| US7861388B2 (en) | 2003-05-30 | 2011-01-04 | Ngk Insulators, Ltd. | Method of manufacturing a cell driving type piezoelectric/electrostrictive actuator |
| US7196455B2 (en) * | 2003-10-30 | 2007-03-27 | Ngk Insulators, Ltd. | Cell driving type piezoelectric/electrostrictive actuator and method of manufacturing the same |
| JP2010030110A (en) * | 2008-07-28 | 2010-02-12 | Konica Minolta Ij Technologies Inc | Inkjet head |
| JP2010201781A (en) * | 2009-03-03 | 2010-09-16 | Ricoh Co Ltd | Liquid droplet ejection head, manufacturing method thereof, liquid droplet ejection device and image forming apparatus |
| JP2016137589A (en) * | 2015-01-26 | 2016-08-04 | 株式会社東芝 | Inkjet head and inkjet printer |
| CN112492767A (en) * | 2021-01-18 | 2021-03-12 | 四川英创力电子科技股份有限公司 | PCB (printed circuit board) with step groove and processing method thereof |
| CN112492767B (en) * | 2021-01-18 | 2021-04-20 | 四川英创力电子科技股份有限公司 | PCB (printed circuit board) with step groove and processing method thereof |
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