JPH0846404A - Dielectric filter - Google Patents
Dielectric filterInfo
- Publication number
- JPH0846404A JPH0846404A JP18226094A JP18226094A JPH0846404A JP H0846404 A JPH0846404 A JP H0846404A JP 18226094 A JP18226094 A JP 18226094A JP 18226094 A JP18226094 A JP 18226094A JP H0846404 A JPH0846404 A JP H0846404A
- Authority
- JP
- Japan
- Prior art keywords
- dielectric
- conductor
- substrate
- coupling
- dielectric resonator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Control Of Motors That Do Not Use Commutators (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は高周波帯（ＶＨＦ〜ＵＨ
Ｆ）において、無線通信機器などで使用される小型で低
損失な誘電体フィルタに関するものである。The present invention relates to a high frequency band (VHF to UH).
F) relates to a small-sized and low-loss dielectric filter used in a wireless communication device or the like.
【０００２】[0002]
【従来の技術】近年、自動車電話や携帯電話、コードレ
ス電話等の移動通信機器に誘電体フィルタが使用されて
いるが、移動通信機器の小型化、高性能化に伴い、使用
される部品もプリント基板の表面から実装可能なチップ
部品に超小型化される傾向にあり、この傾向に沿った誘
電体フィルタの開発が要求されている。2. Description of the Related Art In recent years, dielectric filters have been used in mobile communication devices such as car phones, mobile phones, cordless phones, etc. However, with the downsizing and high performance of mobile communication devices, used parts are also printed. There is a tendency toward miniaturization of chip components that can be mounted from the surface of a substrate, and development of a dielectric filter that meets this tendency is required.
【０００３】以下、従来の誘電体フィルタについて説明
する。図１４、図１５は、それぞれ従来の誘電体フィル
タを示す斜視図及び断面図である。図１４、図１５にお
いて、１は誘電体共振器であり２は絶縁体基板であっ
て、一方の主表面２ａに接地電極３が形成されている。
この接地電極３は、主表面２ａからスルホール電極４を
経由して他方の主表面２ｂ上に形成された接地電極５と
電気的に接続されている。また、接地電極３上には、複
数の誘電体共振器１がそれぞれ互いに接触した状態で配
置されている。A conventional dielectric filter will be described below. 14 and 15 are a perspective view and a cross-sectional view, respectively, showing a conventional dielectric filter. In FIGS. 14 and 15, 1 is a dielectric resonator and 2 is an insulating substrate, and a ground electrode 3 is formed on one main surface 2a.
The ground electrode 3 is electrically connected from the main surface 2a via the through-hole electrode 4 to the ground electrode 5 formed on the other main surface 2b. A plurality of dielectric resonators 1 are arranged on the ground electrode 3 in contact with each other.
【０００４】誘電体共振器１は、それぞれ中央部に貫通
孔１ｂを有する角筒状の誘電体基体１ａからなる。貫通
孔１ｂの内面には内導体１ｃが、また誘電体基体１ａの
表面には外導体１ｄが形成され、また内導体１ｃと外導
体１ｄとの間を誘電体基体１ａの連結導体１ｅを介して
電気的に短絡する。また、この誘電体基体１ａの連結導
体１ｅと反対側の端面は導体がない開放端となってい
る。The dielectric resonator 1 comprises a rectangular cylindrical dielectric substrate 1a having a through hole 1b in the center thereof. An inner conductor 1c is formed on the inner surface of the through hole 1b, and an outer conductor 1d is formed on the surface of the dielectric base body 1a. The inner conductor 1c and the outer conductor 1d are connected via the connecting conductor 1e of the dielectric base body 1a. Electrical short circuit. Further, the end surface of the dielectric substrate 1a opposite to the connecting conductor 1e is an open end having no conductor.
【０００５】この誘電体共振器１の外導体１ｄは、接地
電極３と半田付け等により電気的に接続されている。さ
らに誘電体共振器１の貫通孔１ｂには金属ターミナル７
が半田付け等により内導体１ｃと電気的に接続されてい
る。The outer conductor 1d of the dielectric resonator 1 is electrically connected to the ground electrode 3 by soldering or the like. Further, a metal terminal 7 is provided in the through hole 1b of the dielectric resonator 1.
Are electrically connected to the inner conductor 1c by soldering or the like.
【０００６】誘電体共振器１の開放端側が臨む絶縁体基
板２の前方部には外部回路と接続するための入出力電極
８とコンデンサ９ａ〜９ｆ、コイル１１ａ〜１１ｂ、金
属ターミナル７を接続するための結合電極１０が形成さ
れている。An input / output electrode 8 for connecting to an external circuit, capacitors 9a to 9f, coils 11a to 11b, and a metal terminal 7 are connected to the front portion of the insulating substrate 2 facing the open end side of the dielectric resonator 1. A coupling electrode 10 for forming is formed.
【０００７】また、このフィルタは図１５の金属のシー
ルドケース１２を接地電極３や誘電体共振器の外導体１
ｄとを半田付け等により接続し電気的なシールドを得て
いる。In this filter, the metal shield case 12 shown in FIG. 15 is connected to the ground electrode 3 and the outer conductor 1 of the dielectric resonator.
d is connected by soldering or the like to obtain an electric shield.
【０００８】[0008]
【発明が解決しようとする課題】しかしながら、以上の
ような従来の構成では、結合回路部のコンデンサ９ａ〜
９ｆ、コイル１１ａ〜１１ｂ、金属ターミナル７等を実
装するために、誘電体フィルタの大きさを小型化するこ
とが難しく、また部品点数が多いので工数がかかり、量
産性が悪いという問題があった。特に、誘電体共振器１
と金属ターミナル７との接続は貫通孔１ｂにおいて行う
ため難しい作業となり、さらに自動組立の障害となって
いた。However, in the conventional structure as described above, the capacitors 9a to 9a of the coupling circuit portion are not provided.
It is difficult to reduce the size of the dielectric filter in order to mount the 9f, the coils 11a to 11b, the metal terminal 7 and the like, and the number of parts is large, which requires a lot of man-hours and the mass productivity is poor. . In particular, the dielectric resonator 1
Since the connection between the metal terminal 7 and the metal terminal 7 is performed in the through hole 1b, it is a difficult task, which is an obstacle to automatic assembly.
【０００９】本発明は以上のような従来の課題を解決す
るもので、小型で部品点数も削減でき、量産性に優れた
誘電体フィルタを提供することを目的としている。The present invention solves the conventional problems as described above, and an object thereof is to provide a dielectric filter which is small in size, can reduce the number of parts, and is excellent in mass productivity.
【００１０】[0010]
【課題を解決するための手段】この目的を達成するため
に、開放端面側の外導体の１面に外導体から独立して結
合用導体を設けた誘電体共振器を少なくとも１個以上、
絶縁体基板上の接地電極に外導体を半田付け等により電
気的に接続し、また絶縁体基板上の回路電極に結合用導
体を半田付け等により電気的に接続して誘電体フィルタ
を構成する。In order to achieve this object, at least one or more dielectric resonators each having a coupling conductor independently of the outer conductor on one surface of the outer conductor on the open end face side,
An outer conductor is electrically connected to the ground electrode on the insulating substrate by soldering or the like, and a coupling conductor is electrically connected to the circuit electrode on the insulating substrate by soldering or the like to form a dielectric filter. .
【００１１】[0011]
【作用】この構成によって、誘電体共振器の内導体と結
合用導体間との容量で結合容量を決定して回路との結合
を行わせることにより、コンデンサの一部や金属ターミ
ナルをなくすことができるので小型化を実現できる。さ
らに、部品点数の削減により組立工数の削減ができる。With this configuration, the coupling capacitance is determined by the capacitance between the inner conductor of the dielectric resonator and the coupling conductor, and the coupling with the circuit is performed, thereby eliminating a part of the capacitor and the metal terminal. Therefore, downsizing can be realized. Furthermore, the number of assembly steps can be reduced by reducing the number of parts.
【００１２】[0012]
（実施例１）図１及び図２はそれぞれ本発明の第１の実
施例における誘電体フィルタを示す斜視図及び分解斜視
図である。図１、図２において、１は誘電体共振器であ
る。(Embodiment 1) FIGS. 1 and 2 are a perspective view and an exploded perspective view, respectively, showing a dielectric filter according to a first embodiment of the present invention. In FIGS. 1 and 2, reference numeral 1 is a dielectric resonator.
【００１３】以下、誘電体共振器の構造について、図２
の誘電体共振器１を用いて説明する。ＢａＯ−ＴｉＯ2
−Ｎｄ2 Ｏ3 ，ＢａＯ−ＴｉＯ2 ，ＺｎＯ2 −ＳｎＯ2
−ＴｉＯ2 ，ＢａＯ−Ｓｍ2 Ｏ3 −ＴｉＯ2 ，Ｌｎ2 Ｏ
3 −ＢａＯ−ＴｉＯ2 系等の誘電体材料で構成された誘
電体基体１ａに貫通孔１ｂを設ける。この時、誘電体基
体１ａの外形形状は方形であり、貫通孔１ｂは断面円筒
形に形成されている。誘電体基体１ａの外側面には外導
体１ｄが設けられており、貫通孔１ｂを構成する内側面
には内導体１ｃが設けられている。外導体１ｄと内導体
１ｃは一方の端面に設けられた連結導体１ｅによって連
結されている。The structure of the dielectric resonator will be described below with reference to FIG.
The dielectric resonator 1 will be described. BaO-TiO 2
-Nd 2 O 3, BaO-TiO 2, ZnO 2 -SnO 2
-TiO 2, BaO-Sm 2 O 3 -TiO 2, Ln 2 O
3 a dielectric material the dielectric substrate 1a constituted by a -BaO-TiO 2 system, etc. providing through hole 1b. At this time, the outer shape of the dielectric substrate 1a is rectangular, and the through hole 1b is formed in a cylindrical shape in cross section. An outer conductor 1d is provided on the outer side surface of the dielectric substrate 1a, and an inner conductor 1c is provided on the inner side surface forming the through hole 1b. The outer conductor 1d and the inner conductor 1c are connected by a connecting conductor 1e provided on one end surface.
【００１４】誘電体基体１ａの外側面の一面には、外導
体１ｄから離隔し絶縁された結合用導体１ｆが設けられ
ており、この結合用導体１ｆと内導体１ｃの間で誘電体
基体１ａを介してコンデンサを形成している。図３にこ
の誘電体共振器１の等価回路を示す。図３において１３
は誘電体共振器の共振回路部、１４は図２における誘電
体共振器１の内導体１ｃと結合用導体１ｆとの間に構成
されたコンデンサである。A coupling conductor 1f, which is insulated from the outer conductor 1d, is provided on one outer surface of the dielectric substrate 1a. Between the coupling conductor 1f and the inner conductor 1c, the dielectric substrate 1a is provided. To form a capacitor. FIG. 3 shows an equivalent circuit of this dielectric resonator 1. 13 in FIG.
Is a resonance circuit section of the dielectric resonator, and 14 is a capacitor formed between the inner conductor 1c and the coupling conductor 1f of the dielectric resonator 1 in FIG.
【００１５】この誘電体共振器１を少なくとも１個以
上、絶縁体基板２上の接地電極３に外導体１ｄを半田付
け等により電気的に接続し、また絶縁体基板２上の結合
電極６に結合用導体１ｆを半田付け等により電気的に接
続して誘電体フィルタを構成する。At least one or more of this dielectric resonator 1 is electrically connected to the ground electrode 3 on the insulating substrate 2 with the outer conductor 1d by soldering or the like, and to the coupling electrode 6 on the insulating substrate 2. The coupling conductor 1f is electrically connected by soldering or the like to form a dielectric filter.
【００１６】絶縁体基板２は平板であり、一方の主表面
２ａに接地電極３が形成されている。この接地電極３
は、主表面２ａからスルホール電極４を経由して他方の
主表面２ｂ上に形成された接地電極５と電気的に接続さ
れている。また、接地電極３上には、複数の誘電体共振
器１がそれぞれ互いに接触した状態で配置されている。
この誘電体共振器１の結合用導体１ｆは絶縁体基板２上
の結合電極６と半田等により電気的、機械的に接続さ
れ、また、外導体１ｄは接地電極３と半田等により電気
的、機械的に接続される。Insulator substrate 2 is a flat plate, and ground electrode 3 is formed on one main surface 2a. This ground electrode 3
Is electrically connected from main surface 2a through through-hole electrode 4 to ground electrode 5 formed on the other main surface 2b. A plurality of dielectric resonators 1 are arranged on the ground electrode 3 in contact with each other.
The coupling conductor 1f of the dielectric resonator 1 is electrically and mechanically connected to the coupling electrode 6 on the insulator substrate 2 by soldering or the like, and the outer conductor 1d is electrically connected to the ground electrode 3 by soldering or the like. Mechanically connected.
【００１７】絶縁体基板２の前方部には外部回路と接続
するための入出力電極８とコンデンサ９ａ，９ｂ，９
ｃ、コイル１１ａ，１１ｂを接続するための電極１０ａ
が形成されており、これ等の電極にコンデンサ、コイ
ル、誘電体共振器等を結合し誘電体フィルタを構成して
いる。An input / output electrode 8 and capacitors 9a, 9b, 9 for connecting to an external circuit are provided on the front side of the insulating substrate 2.
c, an electrode 10a for connecting the coils 11a and 11b
Are formed, and a capacitor, a coil, a dielectric resonator, and the like are coupled to these electrodes to form a dielectric filter.
【００１８】また、この誘電体フィルタは図１の金属の
シールドケース１２を接地電極３や誘電体共振器１の外
導体１ｄとを半田付け等により接続し電気的なシールド
を得ている。In this dielectric filter, the metal shield case 12 of FIG. 1 is connected to the ground electrode 3 and the outer conductor 1d of the dielectric resonator 1 by soldering or the like to obtain an electric shield.
【００１９】誘電体共振器１の導体膜である内導体１
ｃ，外導体１ｄ，結合用導体１ｆは、それぞれ銅や銀等
の導電材料で構成された薄膜で構成されており、その膜
厚は５μｍ程度となるように形成される。本実施例で
は、導体膜を１層で構成したが、２層以上の多層にして
も良く、材料も２種以上用いても良い。さらに膜厚は５
μｍ程度としたが、誘電体フィルタの使用条件等によっ
て膜厚は適宜決定しなければならない。Inner conductor 1 which is a conductor film of the dielectric resonator 1.
Each of the c, the outer conductor 1d, and the coupling conductor 1f is formed of a thin film made of a conductive material such as copper or silver, and is formed to have a film thickness of about 5 μm. In this embodiment, the conductor film is composed of one layer, but it may be composed of two or more layers and two or more materials may be used. Furthermore, the film thickness is 5
Although the thickness is about μm, the film thickness must be appropriately determined according to the usage conditions of the dielectric filter.
【００２０】以上のように構成された誘電体フィルタに
ついて、以下その製造方法を説明する。A method of manufacturing the dielectric filter having the above structure will be described below.
【００２１】まず原材料（ＢａＯ，ＴｉＯ2 ，Ｎｄ2 Ｏ
3 等）を所定量ずつ配合し、この配合物をミル等を用い
て混合する。次にこの混合物をスプレードライヤー等を
用いて粒度の調整及びバインダーの添加を行い造粒す
る。次に造粒物を乾式プレスを用いて所定の形状に成形
し、その成形物を焼成炉で１３００℃〜１４００℃の温
度で焼結させ、筒型の誘電体基体１ａを作成する。次に
誘電体基体１ａ上に導体膜を形成する。まず導体膜を形
成する場合には、様々な形成方法があるので、数例を挙
げて説明する。First, raw materials (BaO, TiO 2 , Nd 2 O
3 ) and the like are mixed in predetermined amounts, and this mixture is mixed using a mill or the like. Next, this mixture is granulated by adjusting the particle size and adding a binder using a spray dryer or the like. Next, the granulated product is molded into a predetermined shape using a dry press, and the molded product is sintered at a temperature of 1300 ° C. to 1400 ° C. in a firing furnace to prepare a cylindrical dielectric substrate 1a. Next, a conductor film is formed on the dielectric substrate 1a. First, there are various forming methods for forming the conductor film, and therefore several examples will be described.
【００２２】まず第１の方法として、導体膜を構成する
材料に銅を用いた時について説明する。誘電体基体１ａ
の表面をバレル研磨機やブラスト装置によって粗面化
し、その後に誘電体基体１ａにエッチング処理を施し
て、誘電体基体１ａの表面粗度を５μｍ〜９μｍ程度に
調整する。この時エッチング液としては、例えばＨＦ−
ＨＮＯ2 系のものを用いる。次に誘電体基体１ａの全表
面を塩化第１錫等を用いて感受性化処理を行った後に、
全表面に触媒金属となるパラジウムを付着させ、誘電体
基体１ａの一部にレジスト膜を形成する。すなわち、誘
電体基体１ａの導体膜が付着してはならない部分にレジ
スト膜を形成する。レジスト膜はレジストインクを印刷
技術や転写技術等を用いて誘電体基体１ａ上に塗布し、
その塗布したレジストインクを乾燥硬化させることによ
って形成される。次にこのように加工された誘電体基体
１ａを無電解銅鍍金法を用いて、誘電体基体１ａ上に薄
い第１の銅膜を形成する。この時、第１の銅膜はレジス
ト膜が形成されていない部分のみに選択的に形成され
る。次に電解銅鍍金にて第１の銅膜の上に第２の銅膜を
積層し、導体膜を形成する。この時、導体膜は５μｍ程
度になるように形成する。そして最後にレジスト膜を溶
剤等で溶かし出して、導体膜を完成させる。なおこの製
造方法ではレジスト膜を印刷で誘電体基体１ａの所定の
位置にレジストインクを塗布した後に乾燥硬化させる方
法で形成したが、レジストとして感光性レジストを用い
る方法もある。すなわち、パラジウム等の触媒金属を誘
電体基体１ａに付着させた後に、誘電体基体１ａの全表
面に感光性レジストを塗布し、露光させて所定の部分の
感光性レジストのみを硬化させる。そして現像剤によっ
て、感光性レジストが硬化していない部分を洗い流し、
導体膜を完成させる。First, as a first method, the case where copper is used as the material for the conductor film will be described. Dielectric substrate 1a
The surface of the substrate is roughened by a barrel polishing machine or a blasting device, and then the dielectric substrate 1a is subjected to etching treatment to adjust the surface roughness of the dielectric substrate 1a to about 5 μm to 9 μm. At this time, as the etching liquid, for example, HF-
HNO 2 type is used. Next, after sensitizing the entire surface of the dielectric substrate 1a with stannous chloride or the like,
Palladium as a catalytic metal is attached to the entire surface to form a resist film on a part of the dielectric substrate 1a. That is, the resist film is formed on the portion of the dielectric substrate 1a where the conductor film should not adhere. The resist film is formed by applying resist ink onto the dielectric substrate 1a using a printing technique, a transfer technique, or the like,
It is formed by drying and curing the applied resist ink. Next, the dielectric substrate 1a thus processed is formed by electroless copper plating to form a thin first copper film on the dielectric substrate 1a. At this time, the first copper film is selectively formed only in the portion where the resist film is not formed. Next, a second copper film is laminated on the first copper film by electrolytic copper plating to form a conductor film. At this time, the conductor film is formed to have a thickness of about 5 μm. Finally, the resist film is dissolved with a solvent or the like to complete the conductor film. In this manufacturing method, the resist film is formed by printing a resist ink on a predetermined position of the dielectric substrate 1a by printing and then drying and curing, but there is also a method of using a photosensitive resist as the resist. That is, after a catalytic metal such as palladium is attached to the dielectric substrate 1a, a photosensitive resist is applied to the entire surface of the dielectric substrate 1a and exposed to cure only a predetermined portion of the photosensitive resist. Then, with the developer, wash away the part where the photosensitive resist is not cured,
Complete the conductor film.
【００２３】他の方法としては、Ａｇペーストを誘電体
基体１ａの全表面に印刷またはデップ法で塗布し、乾燥
した後に８００℃〜９００℃の温度で熱処理を行うこと
によって、導体膜を誘電体基体１ａの全表面に形成して
もよい。さらに、全表面に導体膜を形成後、ケミカルエ
ッチング、ドライエッチング等のエッチング技術を用い
て不要部分の導体膜を削除し、導体膜を完成させても良
い。As another method, the Ag paste is applied to the entire surface of the dielectric substrate 1a by a printing or dipping method, dried and then heat-treated at a temperature of 800 ° C. to 900 ° C. to form a dielectric film on the conductor film. It may be formed on the entire surface of the substrate 1a. Furthermore, after forming the conductor film on the entire surface, the conductor film may be completed by removing the unnecessary portion of the conductor film using an etching technique such as chemical etching or dry etching.
【００２４】また別の方法として、誘電体基体１ａの全
表面に導体膜を形成した後に、切削加工やレーザー加工
等を施して物理的に除去し、導体膜を完成させても良
い。As another method, the conductor film may be completed by forming a conductor film on the entire surface of the dielectric substrate 1a and then physically removing it by cutting or laser processing.
【００２５】上述のように構成した誘電体共振器１と絶
縁体基板２を結合用導体１ｆと結合電極６が対向するよ
うに突合せ、クリーム半田等で外導体１ｄ，絶縁体基板
２上の接地電極３を接合するとともに、結合用導体１ｆ
と結合電極６をそれぞれクリーム半田等の接合材によっ
て接合する。The dielectric resonator 1 and the insulating substrate 2 configured as described above are butted so that the coupling conductor 1f and the coupling electrode 6 face each other, and the outer conductor 1d and the insulating substrate 2 are grounded with cream solder or the like. The electrode 3 is joined and the coupling conductor 1f
The bonding electrode 6 and the bonding electrode 6 are bonded together with a bonding material such as cream solder.
【００２６】（実施例２）図４、図５はそれぞれ本発明
の第２の実施例における誘電体フィルタを示す斜視図及
び分解斜視図である。(Embodiment 2) FIGS. 4 and 5 are a perspective view and an exploded perspective view, respectively, showing a dielectric filter according to a second embodiment of the present invention.
【００２７】図４、図５において、２１は誘電体共振器
であり、誘電体共振器２１は図１、図２に示す（実施例
１）の構造とほぼ同じであるが、貫通孔２１ｂの形状が
異なっている。In FIGS. 4 and 5, reference numeral 21 is a dielectric resonator, and the dielectric resonator 21 has substantially the same structure as that of the (Embodiment 1) shown in FIGS. 1 and 2, but with the through hole 21b. The shapes are different.
【００２８】まず誘電体共振器２１について説明する。
２１ａは誘電体材料で構成された誘電体基体で、誘電体
基体２１ａは外形が方形状に形成されている。さらに誘
電体基体２１ａには貫通孔２１ｂが設けられており、貫
通孔２１ｂには開放端側に形成された方形状の孔２１ｇ
と、孔２１ｇに連結した円筒状の孔２１ｈによって構成
されている。図１、図２に示す（実施例１）の誘電体共
振器１においては、貫通孔１ｂは開放端から連結端に至
るまで同一の径を有していたが、本実施例においては、
貫通孔２１ｂに段差部２１ｉが設けられていることが特
徴である。この構成によって貫通孔２１ｂ内に形成され
る内導体２１ｃを大きく形成できるので、結合用導体２
１ｆと内導体２１ｃとの間の入出力結合容量を大きくと
ることができ、高減衰量の誘電体フィルタを作成するこ
とができる。その他の構成は図１、図２に示すものと同
様の構成を有している。First, the dielectric resonator 21 will be described.
Reference numeral 21a denotes a dielectric base made of a dielectric material, and the dielectric base 21a has a rectangular outer shape. Further, the dielectric substrate 21a is provided with a through hole 21b, and the through hole 21b has a rectangular hole 21g formed on the open end side.
And a cylindrical hole 21h connected to the hole 21g. In the dielectric resonator 1 of (Embodiment 1) shown in FIGS. 1 and 2, the through hole 1b had the same diameter from the open end to the connecting end, but in the present embodiment,
The feature is that a step portion 21i is provided in the through hole 21b. With this configuration, since the inner conductor 21c formed in the through hole 21b can be formed large, the coupling conductor 2
The input / output coupling capacitance between 1f and the inner conductor 21c can be made large, and a dielectric filter with high attenuation can be produced. Other configurations are similar to those shown in FIGS. 1 and 2.
【００２９】なお、誘電体フィルタの構成としては、図
１、図２に示す（実施例１）の貫通孔１ｂが開放端から
連結端に至るまで同一の径を有する誘電体共振器１と、
図４、図５に示す本実施例の誘電体共振器２１とを混在
して使用しても良い。As the constitution of the dielectric filter, the dielectric resonator 1 having the same diameter from the open end to the connecting end of the through hole 1b shown in (Embodiment 1) shown in FIGS. 1 and 2,
The dielectric resonator 21 of the present embodiment shown in FIGS. 4 and 5 may be mixed and used.
【００３０】加えて、本実施例の誘電体共振器２１の貫
通孔２１ｂａは方形状であったが、長方形、多角形、楕
円形、円形でも同様の効果が得られる。In addition, although the through hole 21ba of the dielectric resonator 21 of this embodiment has a rectangular shape, the same effect can be obtained by using a rectangular shape, a polygonal shape, an elliptical shape, or a circular shape.
【００３１】（実施例３）図６は本発明の第３の実施例
における誘電体フィルタを示す分解斜視図であり、誘電
体共振器の構造自体は、（実施例１）や（実施例２）の
ものと同様である。ただし、図面の都合上（実施例１）
の誘電体共振器１を基に説明を行う。(Embodiment 3) FIG. 6 is an exploded perspective view showing a dielectric filter according to a third embodiment of the present invention, and the structure itself of the dielectric resonator is (embodiment 1) or (embodiment 2). ) Is the same as that of. However, for the convenience of the drawings (Example 1)
The description will be made based on the dielectric resonator 1.
【００３２】この誘電体共振器１を少なくとも１個以
上、絶縁体基板２上の接地電極３に外導体１ｄを半田付
け等により電気的に接続し、また絶縁体基板２上の結合
電極６に結合用導体１ｆを半田付け等により電気的に接
続して誘電体フィルタを構成する。At least one or more of this dielectric resonator 1 is electrically connected to the ground electrode 3 on the insulating substrate 2 with the outer conductor 1d by soldering or the like, and to the coupling electrode 6 on the insulating substrate 2. The coupling conductor 1f is electrically connected by soldering or the like to form a dielectric filter.
【００３３】絶縁体基板２は平板であり、一方の主表面
２ａに接地電極３が形成されている。この接地電極３
は、主表面２ａからスルホール電極４を経由して他方の
主表面２ｂ上に形成された接地電極５と電気的に接続さ
れている。また、接地電極３上には、複数の誘電体共振
器１がそれぞれ互いに接触した状態で配置されている。
この誘電体共振器１の結合用導体１ｆは絶縁体基板２上
の結合電極６と半田等により電気的、機械的に接続さ
れ、また、外導体１ｄは接地電極３と半田等により電気
的、機械的に接続される。Insulator substrate 2 is a flat plate, and ground electrode 3 is formed on one main surface 2a. This ground electrode 3
Is electrically connected from main surface 2a through through-hole electrode 4 to ground electrode 5 formed on the other main surface 2b. A plurality of dielectric resonators 1 are arranged on the ground electrode 3 in contact with each other.
The coupling conductor 1f of the dielectric resonator 1 is electrically and mechanically connected to the coupling electrode 6 on the insulator substrate 2 by soldering or the like, and the outer conductor 1d is electrically connected to the ground electrode 3 by soldering or the like. Mechanically connected.
【００３４】絶縁体基板２０は４層の積層構造になって
おり、第１層は誘電体共振器１の結合用導体１ｆと接続
するための結合電極６と接地電極３を有している。第２
層はコイル電極１５を、第３層はコンデンサ電極１６
を、第４層は接地電極１７を有している。この接地電極
１７はスルーホル電極４により接地電極３，５と電気的
に接続している。また、コンデンサ電極１６は接地電極
１７との間で絶縁基板層１８を介してコンデンサを形成
している。また結合電極６とコイル電極１５、コンデン
サ電極１６は側面電極１９ａ、１９ｂ、１９ｃを介して
接続されている。この側面電極１９ａと１９ｃは入出力
電極も兼ねている。The insulating substrate 20 has a laminated structure of four layers, and the first layer has a coupling electrode 6 for connecting to the coupling conductor 1f of the dielectric resonator 1 and a ground electrode 3. Second
The layer is the coil electrode 15, and the third layer is the capacitor electrode 16.
The fourth layer has a ground electrode 17. The ground electrode 17 is electrically connected to the ground electrodes 3 and 5 through the through-hole electrode 4. The capacitor electrode 16 and the ground electrode 17 form a capacitor via the insulating substrate layer 18. Further, the coupling electrode 6, the coil electrode 15 and the capacitor electrode 16 are connected via side surface electrodes 19a, 19b and 19c. The side electrodes 19a and 19c also serve as input / output electrodes.
【００３５】なお、誘電体フィルタの構成としては、図
１、図２に示す（実施例１）の誘電体共振器１と、図
４、図５に示す（実施例２）の誘電体共振器２１とを混
在して使用しても良い。The structure of the dielectric filter includes the dielectric resonator 1 of (Embodiment 1) shown in FIGS. 1 and 2 and the dielectric resonator of (Embodiment 2) shown in FIGS. 4 and 5. 21 may be mixed and used.
【００３６】（実施例４）図７及び図８はそれぞれ本発
明の第４の実施例における誘電体フィルタを示す斜視図
及び等価回路図である。誘電体共振器の構造自体は、
（実施例１）や（実施例２）のものと同様であるが、図
面の都合上（実施例１）の誘電体共振器１を基に説明を
行う。(Embodiment 4) FIGS. 7 and 8 are a perspective view and an equivalent circuit diagram, respectively, showing a dielectric filter according to a fourth embodiment of the present invention. The structure itself of the dielectric resonator is
Although it is similar to those of (Embodiment 1) and (Embodiment 2), the explanation will be given based on the dielectric resonator 1 of (Embodiment 1) for convenience of the drawings.
【００３７】図７に示すのは、（実施例１）の構造の誘
電体フィルタを２個合成回路を通して一端で接続したデ
ュプレクサ構造の誘電体フィルタであり、１はそれぞれ
誘電体共振器である。この誘電体フィルタは図８に示す
ような等価回路構造となり、（実施例１）の誘電体フィ
ルタをａ部、ｂ部としてｃ部の合成回路により接続した
構造である。このｃ部の回路は２つの誘電体フィルタを
接続するための合成回路であり、本実施例においてはイ
ンピーダンスＺ１、Ｚ２が誘導性、Ｚ３＝０の場合であ
るが、それぞれの回路によりＺ１〜Ｚ３は容量性から誘
導性まで種々の値をとり、適当な値のコイルやコンデン
サにより実施することができる。この合成回路のコイル
は図７のコイル２２，２３に対応する。このコイル２
２、２３は電極２４に接続され合成入出力電極２５に接
続される。他の構成は（実施例１）と同様である。図９
に本実施例の特性例を示す。FIG. 7 shows a dielectric filter having a duplexer structure in which two dielectric filters having the structure of (Embodiment 1) are connected at one end through a synthesis circuit, and 1 is a dielectric resonator. This dielectric filter has an equivalent circuit structure as shown in FIG. 8, which is a structure in which the dielectric filters of (Example 1) are connected by a synthetic circuit of a part and a part c. The circuit of this c section is a synthetic circuit for connecting two dielectric filters. In this embodiment, the impedances Z1 and Z2 are inductive, and Z3 = 0. Can take various values from capacitive to inductive, and can be implemented by a coil or capacitor having an appropriate value. The coils of this combination circuit correspond to the coils 22 and 23 of FIG. This coil 2
Reference numerals 2 and 23 are connected to an electrode 24 and a combined input / output electrode 25. Other configurations are similar to those of the first embodiment. Figure 9
An example of characteristics of this embodiment is shown in FIG.
【００３８】なお、図７の絶縁体基板２は（実施例３）
のような積層型で内部に容量やコイルを一体形成したも
のでも同様の効果が得られる。The insulator substrate 2 shown in FIG. 7 is (Example 3).
The same effect can be obtained by a laminated type in which a capacitor and a coil are integrally formed.
【００３９】（実施例５）図１０及び図１２はそれぞれ
本発明の第５の実施例における誘電体フィルタを示す斜
視図及び等価回路図である。誘電体共振器の構造自体
は、（実施例１）や（実施例２）のものと同様である
が、図面の都合上（実施例１）の誘電体共振器１を基に
説明を行う。図１０において１はそれぞれ誘電体共振器
である。(Embodiment 5) FIGS. 10 and 12 are a perspective view and an equivalent circuit diagram showing a dielectric filter according to a fifth embodiment of the present invention, respectively. The structure itself of the dielectric resonator is similar to that of (Example 1) or (Example 2), but for convenience of the drawings, description will be given based on the dielectric resonator 1 of (Example 1). In FIG. 10, 1 is a dielectric resonator.
【００４０】図１０に示すのは（実施例１）の構造の誘
電体フィルタとバンドパス構造の誘電体フィルタを一端
で接続したデュプレクサ構造のフィルタである。この誘
電体フィルタは図１２に示すような等価回路構造とな
り、（実施例１）の誘電体フィルタのａ部、合成回路の
ｃ部、バンドパスフィルタのｄ部、さらにノッチ回路の
ｅ部を接続した回路構成となっている。このｃ部の回路
は２つの誘電体フィルタを接続するための合成回路であ
り、本実施例においてはインピーダンスＺ１＝０、Ｚ２
が誘導性、Ｚ３＝０の場合であるが、それぞれの回路に
よりＺ１〜Ｚ３は容量性から誘導性まで種々の値をとり
適当な値のコイルやコンデンサにより実施することがで
きる。この合成回路のコイルは図１０のコイル２２に対
応する。このコイル２２、は電極２４に接続され合成入
出力端子２５に接続される。FIG. 10 shows a duplexer structure filter in which a dielectric filter having the structure of the first embodiment and a dielectric filter having a bandpass structure are connected at one end. This dielectric filter has an equivalent circuit structure as shown in FIG. 12, and the a part of the dielectric filter of (Example 1), the c part of the synthesis circuit, the d part of the bandpass filter, and the e part of the notch circuit are connected. It has a circuit configuration. The circuit of this c section is a synthetic circuit for connecting two dielectric filters, and in this embodiment, impedances Z1 = 0 and Z2.
Is inductive and Z3 = 0, but Z1 to Z3 can take various values from capacitive to inductive depending on the respective circuits, and can be implemented by coils or capacitors having appropriate values. The coil of this synthesis circuit corresponds to the coil 22 of FIG. The coil 22 is connected to the electrode 24 and the combined input / output terminal 25.
【００４１】バンドパスフィルタの例を図１１に示す。
誘電体共振器３１、３２は開放端面側の外導体３１ｄ，
３２ｄの２面に、外導体３１ｄ，３２ｄから独立した結
合用導体３１ｆ，３２ｆをそれぞれ直交するように設け
る。また、誘電体共振器３３は開放端面側の外導体３３
ｄの２面に、外導体３３ｄから独立した結合用導体３３
ｆをそれぞれ平行になるように設け、誘電体共振器３１
の側面に設けた結合用導体３１ｆと誘電体共振器３３の
側面に設けた結合用導体３３ｆとが密着するように、ま
た、誘電体共振器３３の側面に設けた結合用導体３３ｆ
と誘電体共振器３２の側面に設けた結合用導体３２ｆと
が密着するように配置し、半田等により電気的、機械的
に接続する。これらの誘電体共振器の接合によって得ら
れた誘電体フィルタを絶縁体基板２上の電極２６，２７
に、それぞれ電極２６が誘電体共振器３１の底部の結合
用導体３１ｆに電極２７が誘電体共振器３２の底部の結
合用導体３２ｆに密着するように配置し、半田等により
電気的、機械的に接続する。FIG. 11 shows an example of the bandpass filter.
The dielectric resonators 31 and 32 are the outer conductors 31d on the open end face side,
Coupling conductors 31f and 32f, which are independent of the outer conductors 31d and 32d, are provided on the two surfaces of 32d so as to be orthogonal to each other. In addition, the dielectric resonator 33 is the outer conductor 33 on the open end face side.
On the two surfaces of d, the coupling conductor 33 independent of the outer conductor 33d
f are provided so as to be parallel to each other, and the dielectric resonator 31
So that the coupling conductor 31f provided on the side surface of the dielectric resonator 33 closely contacts the coupling conductor 33f provided on the side surface of the dielectric resonator 33, and the coupling conductor 33f provided on the side surface of the dielectric resonator 33.
And the coupling conductor 32f provided on the side surface of the dielectric resonator 32 are arranged in close contact with each other, and are electrically and mechanically connected by soldering or the like. The dielectric filter obtained by joining these dielectric resonators is connected to the electrodes 26, 27 on the insulator substrate 2.
The electrodes 26 are arranged so that the electrodes 27 are closely attached to the coupling conductors 31f at the bottom of the dielectric resonator 31 and the electrodes 27 are closely attached to the coupling conductors 32f at the bottom of the dielectric resonator 32. Connect to.
【００４２】誘電体共振器３４は誘電体共振器１と同一
構造であり、絶縁体基板２上の電極２８に誘電体共振器
３４の結合用導体３４ｆが密着するように配置し、半田
等により電気的、機械的に接続する。以上のような本実
施例の特性例を図１３に示す。The dielectric resonator 34 has the same structure as the dielectric resonator 1, and is arranged so that the coupling conductor 34f of the dielectric resonator 34 is in close contact with the electrode 28 on the insulating substrate 2 and is soldered or the like. Connect electrically and mechanically. FIG. 13 shows a characteristic example of the present embodiment as described above.
【００４３】なお、図１０の絶縁体基板２は（実施例
３）のような積層型で内部に容量やコイルを一体形成し
たものでも同様の効果が得られる。The same effect can be obtained even if the insulator substrate 2 shown in FIG. 10 is of a laminated type as in (Embodiment 3) and has capacitors and coils integrally formed therein.
【００４４】[0044]
【発明の効果】以上のように本発明は、誘電体基体と、
誘電体基体の外側面に設けられた外導体と、誘電体基体
の内側面に設けられた内導体と、誘電体基体の一方の端
面に設けられ、外導体と内導体を連結する連結導体と、
外側面の一面に設けられ各導体と電気的に接触しない結
合用導体を有する誘電体共振器を少なくとも１つ以上具
備し、この誘電体共振器を絶縁体基板上に配置しこの絶
縁体基板上に設けた回路電極と結合用導体とを電気的に
接合した誘電体フィルタを構成することにより、小型で
広帯域フィルタを実現することができ、性能を向上する
ことができる。As described above, the present invention comprises a dielectric substrate,
An outer conductor provided on the outer surface of the dielectric substrate, an inner conductor provided on the inner surface of the dielectric substrate, and a connecting conductor provided on one end surface of the dielectric substrate and connecting the outer conductor and the inner conductor. ,
At least one dielectric resonator having a coupling conductor that is provided on one surface of the outer surface and does not make electrical contact with each conductor is provided, and the dielectric resonator is arranged on an insulator substrate. By configuring the dielectric filter in which the circuit electrode and the coupling conductor provided in the above are electrically connected, it is possible to realize a small-sized broadband filter and improve the performance.
【図１】本発明の第１の実施例における誘電体フィルタ
を示す斜視図FIG. 1 is a perspective view showing a dielectric filter according to a first embodiment of the present invention.
【図２】本発明の第１の実施例における誘電体フィルタ
を示す分解斜視図FIG. 2 is an exploded perspective view showing a dielectric filter according to the first embodiment of the present invention.
【図３】本発明の第１の実施例における誘電体共振器の
等価回路図FIG. 3 is an equivalent circuit diagram of a dielectric resonator according to the first embodiment of the present invention.
【図４】本発明の第２の実施例における誘電体フィルタ
を示す斜視図FIG. 4 is a perspective view showing a dielectric filter according to a second embodiment of the present invention.
【図５】本発明の第２の実施例における誘電体フィルタ
を示す分解斜視図FIG. 5 is an exploded perspective view showing a dielectric filter according to a second embodiment of the present invention.
【図６】本発明の第３の実施例における誘電体フィルタ
を示す分解斜視図FIG. 6 is an exploded perspective view showing a dielectric filter according to a third embodiment of the present invention.
【図７】本発明の第４の実施例における誘電体フィルタ
を示す斜視図FIG. 7 is a perspective view showing a dielectric filter according to a fourth embodiment of the present invention.
【図８】本発明の第４の実施例における誘電体フィルタ
の等価回路図FIG. 8 is an equivalent circuit diagram of a dielectric filter according to a fourth embodiment of the present invention.
【図９】本発明の第４の実施例における誘電体フィルタ
の特性図FIG. 9 is a characteristic diagram of a dielectric filter according to a fourth embodiment of the present invention.
【図１０】本発明の第５の実施例における誘電体フィル
タを示す斜視図FIG. 10 is a perspective view showing a dielectric filter according to a fifth embodiment of the present invention.
【図１１】本発明の一実施例における誘電体フィルタの
バンドパスフィルタを示す斜視図FIG. 11 is a perspective view showing a bandpass filter of a dielectric filter according to an embodiment of the present invention.
【図１２】本発明の第５の実施例における誘電体フィル
タの等価回路図FIG. 12 is an equivalent circuit diagram of a dielectric filter according to a fifth embodiment of the present invention.
【図１３】本発明の第５の実施例における誘電体フィル
タの特性図FIG. 13 is a characteristic diagram of a dielectric filter according to a fifth embodiment of the present invention.
【図１４】従来の誘電体フィルタを示す斜視図FIG. 14 is a perspective view showing a conventional dielectric filter.
【図１５】従来の誘電体フィルタを示す断面図FIG. 15 is a sectional view showing a conventional dielectric filter.
１ 誘電体共振器 １ａ 誘電体基体 １ｂ 貫通孔 １ｃ 内導体 １ｄ 外導体 １ｅ 連結導体 １ｆ 結合用導体 ２ 絶縁体基板 ３ 接地電極 ４ スルホール電極 ６ 結合電極 ２０ 絶縁体基板 ２１ 誘電体共振器 ２１ａ 誘電体基体 ２１ｂ 貫通孔 ２１ｃ 内導体 ２１ｄ 外導体 ２１ｆ 結合用導体 ２１ｇ 孔 ２１ｈ 孔 ２１ｉ 段差部 ３１ 誘電体共振器 ３１ｄ 外導体 ３１ｆ 結合用導体 ３２ 誘電体共振器 ３２ｄ 外導体 ３２ｆ 結合用導体 ３３ 誘電体共振器 ３３ｄ 外導体 ３３ｆ 結合用導体 ３４ 誘電体共振器 ３４ｆ 結合用導体 1 Dielectric Resonator 1a Dielectric Substrate 1b Through Hole 1c Inner Conductor 1d Outer Conductor 1e Connecting Conductor 1f Coupling Conductor 2 Insulator Substrate 3 Grounding Electrode 4 Through Hole Electrode 6 Coupling Electrode 20 Insulator Substrate 21 Dielectric Resonator 21a Dielectric Base 21b Through hole 21c Inner conductor 21d Outer conductor 21f Coupling conductor 21g Hole 21h Hole 21i Step portion 31 Dielectric resonator 31d Outer conductor 31f Coupling conductor 32 Dielectric resonator 32d Outer conductor 32f Coupling conductor 33 Dielectric resonator 33d outer conductor 33f coupling conductor 34 dielectric resonator 34f coupling conductor
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｐ 11/00 Ｊ // Ｈ０１Ｐ 7/04 (72)発明者 大野 博司 大阪府門真市大字門真1006番地 松下電器 産業株式会社内─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification number Reference number within the agency FI Technical indication H01P 11/00 J // H01P 7/04 (72) Inventor Hiroshi Ohno 1006 Kadoma, Kadoma, Osaka Prefecture Address: Matsushita Electric Industrial Co., Ltd.
Claims (4)
設けられた外導体と、前記誘電体基体の内側面に設けら
れた内導体と、前記誘電体基体の一方の端面に設けら
れ、前記外導体と前記内導体を連結する連結導体と、前
記外側面の一面に設けられ各導体と電気的に接触しない
結合用導体を有する誘電体共振器を少なくとも１つ以上
具備し、この誘電体共振器を絶縁体基板上に配置しこの
絶縁体基板上に設けた回路電極と結合用導体とを電気的
に接合したことを特徴とする誘電体フィルタ。1. A dielectric substrate, an outer conductor provided on an outer side surface of the dielectric substrate, an inner conductor provided on an inner side surface of the dielectric substrate, and one end surface of the dielectric substrate. At least one dielectric resonator having a coupling conductor for coupling the outer conductor and the inner conductor, and a coupling conductor provided on one surface of the outer surface and not electrically contacting each conductor, A dielectric filter characterized in that a dielectric resonator is arranged on an insulating substrate, and a circuit electrode provided on this insulating substrate and a coupling conductor are electrically joined.
以上の段差を設けたことを特徴とする請求項１記載の誘
電体フィルタ。2. The dielectric filter according to claim 1, wherein at least one step is provided on the inner peripheral surface of the dielectric resonator.
ンサ、コイル、抵抗を少なくとも１個以上一体形成した
回路基板を用いたことを特徴とする請求項１記載の誘電
体フィルタ。3. The dielectric filter according to claim 1, wherein a circuit board having at least one capacitor, coil, or resistor integrally formed on or in the insulating substrate is used.
れて、そのうち少なくとも１個以上請求項１記載の誘電
体フィルタを用いてマルチプレクサ構造としたことを特
徴とする誘電体フィルタ。4. A dielectric filter comprising at least two filter circuits, at least one of which is used as a multiplexer structure using the dielectric filter according to claim 1.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6182260A JP2907010B2 (en) | 1994-08-03 | 1994-08-03 | Dielectric filter |
| JP31175898A JPH11205009A (en) | 1994-08-03 | 1998-11-02 | Dielectric filter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6182260A JP2907010B2 (en) | 1994-08-03 | 1994-08-03 | Dielectric filter |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31175898A Division JPH11205009A (en) | 1994-08-03 | 1998-11-02 | Dielectric filter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0846404A true JPH0846404A (en) | 1996-02-16 |
| JP2907010B2 JP2907010B2 (en) | 1999-06-21 |
Family
ID=16115146
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6182260A Expired - Fee Related JP2907010B2 (en) | 1994-08-03 | 1994-08-03 | Dielectric filter |
| JP31175898A Pending JPH11205009A (en) | 1994-08-03 | 1998-11-02 | Dielectric filter |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31175898A Pending JPH11205009A (en) | 1994-08-03 | 1998-11-02 | Dielectric filter |
Country Status (1)
| Country | Link |
|---|---|
| JP (2) | JP2907010B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3444246B2 (en) | 1999-09-14 | 2003-09-08 | 株式会社村田製作所 | Dielectric resonator device, dielectric duplexer, and communication device |
| EP1976133B1 (en) * | 2006-01-17 | 2017-08-16 | Hitachi Metals, Ltd. | High frequency circuit component and communication apparatus using such high frequency circuit component |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6350102A (en) * | 1986-08-20 | 1988-03-03 | Fujitsu Ltd | Dielectric resonator |
| JPH02116102U (en) * | 1989-03-06 | 1990-09-18 | ||
| JPH02290302A (en) * | 1989-02-16 | 1990-11-30 | Matsushita Electric Ind Co Ltd | Coaxial type dielectric resonator |
| JPH036103A (en) * | 1989-06-01 | 1991-01-11 | Fujitsu Ltd | Dielectric filter |
| JPH03125502A (en) * | 1989-10-11 | 1991-05-28 | Fujitsu Ltd | Microwave circuit module |
| JPH04211501A (en) * | 1990-03-20 | 1992-08-03 | Sanyo Electric Co Ltd | Dielectric filter |
| JPH05110307A (en) * | 1991-03-25 | 1993-04-30 | Sanyo Electric Co Ltd | Dielectric filter and branching device using it |
| JPH06132706A (en) * | 1992-09-07 | 1994-05-13 | Murata Mfg Co Ltd | Dielectric resonance parts |
-
1994
- 1994-08-03 JP JP6182260A patent/JP2907010B2/en not_active Expired - Fee Related
-
1998
- 1998-11-02 JP JP31175898A patent/JPH11205009A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6350102A (en) * | 1986-08-20 | 1988-03-03 | Fujitsu Ltd | Dielectric resonator |
| JPH02290302A (en) * | 1989-02-16 | 1990-11-30 | Matsushita Electric Ind Co Ltd | Coaxial type dielectric resonator |
| JPH02116102U (en) * | 1989-03-06 | 1990-09-18 | ||
| JPH036103A (en) * | 1989-06-01 | 1991-01-11 | Fujitsu Ltd | Dielectric filter |
| JPH03125502A (en) * | 1989-10-11 | 1991-05-28 | Fujitsu Ltd | Microwave circuit module |
| JPH04211501A (en) * | 1990-03-20 | 1992-08-03 | Sanyo Electric Co Ltd | Dielectric filter |
| JPH05110307A (en) * | 1991-03-25 | 1993-04-30 | Sanyo Electric Co Ltd | Dielectric filter and branching device using it |
| JPH06132706A (en) * | 1992-09-07 | 1994-05-13 | Murata Mfg Co Ltd | Dielectric resonance parts |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11205009A (en) | 1999-07-30 |
| JP2907010B2 (en) | 1999-06-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH098506A (en) | Band stop filter | |
| JP3366021B2 (en) | Antenna duplexer | |
| JP2907010B2 (en) | Dielectric filter | |
| JPH0115164Y2 (en) | ||
| JP2780591B2 (en) | Dielectric filter | |
| JP2778432B2 (en) | Dielectric filter | |
| JP3176859B2 (en) | Dielectric filter | |
| JP2566086Y2 (en) | Dielectric filter | |
| JP2910685B2 (en) | Dielectric resonator and electronic device using the same | |
| JP2727447B2 (en) | Circuit device having a dielectric filter | |
| JP3306331B2 (en) | Dielectric filter | |
| JP2577792Y2 (en) | Dielectric filter | |
| JPH03173202A (en) | Filter | |
| JP2906828B2 (en) | Surface mount type dielectric filter | |
| JPH0496401A (en) | Delay line | |
| JP3802639B2 (en) | Band stop filter | |
| JP3286872B2 (en) | Dielectric filter | |
| JPH012403A (en) | dielectric resonator | |
| JPH09307394A (en) | Chip type lc filter element | |
| JPH0846403A (en) | Substrate for dielectric filter and dielectric filter | |
| JPH10242704A (en) | Dielectric filter | |
| JPH06125204A (en) | Dielectric filter | |
| JPH07176921A (en) | Coaxial dielectric resonator | |
| JPH10242709A (en) | Dielectric duplexer | |
| JPH11340714A (en) | Manufacture of dielectric resonance member |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |