JPH0846009A - Measuring method of discrepancy between gripper and holder, allignment method of gripper and holder, discrepancy measuring jig, diagnosis method of discrepancy between gripper and holder and washer and washing method - Google Patents
Measuring method of discrepancy between gripper and holder, allignment method of gripper and holder, discrepancy measuring jig, diagnosis method of discrepancy between gripper and holder and washer and washing methodInfo
- Publication number
- JPH0846009A JPH0846009A JP19723194A JP19723194A JPH0846009A JP H0846009 A JPH0846009 A JP H0846009A JP 19723194 A JP19723194 A JP 19723194A JP 19723194 A JP19723194 A JP 19723194A JP H0846009 A JPH0846009 A JP H0846009A
- Authority
- JP
- Japan
- Prior art keywords
- tool
- holding tool
- holding
- gripping
- jig
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Manipulator (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、例えば半導体ウェハな
どの被処理体を洗浄するための洗浄装置において搬送手
段として好適に使用される、ウェハチャックとボートの
如き把持具と保持具との間で被処理体を受け渡す際の該
把持具と保持具の相対なずれを測定、診断し、両者の位
置合わせを行う手段に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer chuck, a holding tool such as a boat, and a holding tool, which are preferably used as a transfer means in a cleaning apparatus for cleaning an object to be processed such as a semiconductor wafer. The present invention relates to means for measuring and diagnosing relative displacement between the gripping tool and the holding tool when delivering the object to be processed, and aligning the two.
【０００２】[0002]
【従来の技術】例えばＬＳＩ等の半導体デバイスの製造
工程における洗浄処理を例にとって説明すると、従来か
ら半導体ウェハ表面のパーティクル、有機汚染物、金属
不純物等のコンタミネーションを除去するために洗浄処
理装置が使用されており、その中でもとりわけ、ウェッ
ト洗浄装置は、パーティクルを効果的に除去できしかも
バッチ処理が可能なため、広く普及している。2. Description of the Related Art For example, a cleaning process in a manufacturing process of a semiconductor device such as an LSI will be described. Conventionally, a cleaning process apparatus has been used to remove contaminants such as particles, organic contaminants and metal impurities on the surface of a semiconductor wafer. In particular, the wet cleaning device is widely used because it can effectively remove particles and can perform batch processing.
【０００３】かかるウェット洗浄装置においては、例え
ば２５枚の半導体ウェハを収納したカセットをロードす
るロード機構と、このロード機構によってロードされた
半導体ウェハを例えば５０枚ずつ搬送するウェハ搬送装
置と、このウェハ搬送装置によって搬送されたウェハを
一括して洗浄するように配列された複数の洗浄処理槽
と、各洗浄処理槽によって洗浄された半導体ウェハをア
ンロードするアンロード機構とを備えて構成されてい
る。In such a wet cleaning apparatus, a loading mechanism for loading a cassette containing, for example, 25 semiconductor wafers, a wafer transporting apparatus for transporting, for example, 50 semiconductor wafers loaded by the loading mechanism, and this wafer A plurality of cleaning processing tanks arranged to collectively clean the wafers transferred by the transfer device, and an unload mechanism for unloading the semiconductor wafers cleaned by each cleaning processing tank are configured. .
【０００４】そして、ウェハ搬送装置は各洗浄処理槽へ
半導体ウェハを搬送する際に所定枚数の半導体ウェハを
一括して同時に把持する、ウェハチャックと呼ばれる把
持具を有している。このウェハチャックは通常、略水平
方向に突出した対向する一対の把持部材に、把持すべき
半導体ウェハの枚数に応じた複数の把持溝が所定の間隔
をおいて形成されており、各半導体ウェハはこれら各把
持溝にその周縁部が挿入され、各把持部材相互の接近に
よって、前記各半導体ウェハは垂直状態でウェハチャッ
クに把持されるように構成されている。The wafer transfer device has a gripping tool called a wafer chuck that simultaneously grips a predetermined number of semiconductor wafers at the same time when the semiconductor wafers are transferred to each cleaning processing tank. In this wafer chuck, usually, a plurality of gripping grooves corresponding to the number of semiconductor wafers to be gripped are formed at a predetermined interval in a pair of facing gripping members that protrude in a substantially horizontal direction. The peripheral edge portion is inserted into each of the holding grooves, and when the holding members approach each other, the semiconductor wafers are held by the wafer chuck in a vertical state.
【０００５】一方、半導体ウェハの洗浄がなされる洗浄
処理槽内には、ウェハチャックによって把持されて搬送
されてくる半導体ウェハを保持するためのボートと呼ば
れる保持具が設けられている。このボートには、ウェハ
チャックによって把持された状態の半導体ウェハを一括
して受け取って保持するため、ウェハチャックにおける
把持溝に対応した複数の保持溝が形成され、これら各保
持溝内で各半導体ウェハの周縁部を垂直に受容して、半
導体ウェハを所定の保持位置にて保持するように構成さ
れている。On the other hand, a holder called a boat for holding the semiconductor wafer which is gripped by the wafer chuck and conveyed is provided in the cleaning tank for cleaning the semiconductor wafer. In this boat, a plurality of holding grooves corresponding to the holding grooves in the wafer chuck are formed in order to collectively receive and hold the semiconductor wafers held by the wafer chuck, and the semiconductor wafers are held in the holding grooves. It is configured to vertically receive the peripheral edge portion of and to hold the semiconductor wafer at a predetermined holding position.
【０００６】従って、これらウェハチャックとボートの
間で半導体ウェハを受け渡す際には、ウェハチャックに
おける把持位置となる把持溝と、ボートにおける保持位
置となる保持溝とが、半導体ウェハを受け渡す際に相対
的に一致、即ち同一垂直面上に位置していなければ、半
導体ウェハを円滑に受け渡すことができない。そのた
め、ウェハチャックとボートとの間で事前に把持位置と
保持位置との位置合わせを行っておく必要がある。Therefore, when the semiconductor wafer is transferred between the wafer chuck and the boat, the gripping groove at the gripping position of the wafer chuck and the holding groove at the holding position of the boat are transferred between the semiconductor wafers. The semiconductor wafer cannot be smoothly delivered unless it is relatively aligned with, ie, located on the same vertical plane. For this reason, it is necessary to previously align the holding position and the holding position between the wafer chuck and the boat.
【０００７】ところが、特にボートにあっては洗浄処理
槽に充填される高温の薬液などが充填される場合も多
く、その熱履歴や薬液自体の作用によってその長さが変
動し、これによりウェハチャックの把持溝とボートの保
持溝との間に相対的な位置ずれが生じやすい。そこで、
かかる位置ずれをなくすために、ウェハチャックを適宜
平面内で調整移動させて位置合わせを行っている。However, particularly in boats, the cleaning treatment tank is often filled with high-temperature chemicals and the like, and the length thereof varies due to the thermal history of the chemicals and the action of the chemicals themselves. A relative displacement is likely to occur between the holding groove of the boat and the holding groove of the boat. Therefore,
In order to eliminate such misalignment, the wafer chuck is appropriately adjusted and moved within a plane for alignment.
【０００８】そしてそのような位置合わせは、従来はウ
ェハチャックの把持溝に複数のダミーウェハを実際に把
持させてウェハチャック受け渡し位置まで移動させ、ダ
ミーウェハの周縁がボート側の保持溝に丁度嵌入できる
ようにオペレータがウェハチャックの設定位置をマニュ
アル調整することにより行われている。In such alignment, conventionally, a plurality of dummy wafers are actually gripped in the gripping groove of the wafer chuck and moved to the wafer chuck transfer position so that the peripheral edge of the dummy wafer can be just fitted into the holding groove on the boat side. The operator manually adjusts the set position of the wafer chuck.
【０００９】[0009]
【発明が解決しようとする課題】しかしながら、このよ
うにオペレータが目でみながら位置合わせを行う方法
は、個々のオペレータの技量に負うところが多く、また
人為的な誤差が皆無とは言えず信頼性に欠ける。そのう
え洗浄処理槽内での実際の受け渡しの様子を直接のぞき
込むようにして確認しなければならないので、作業環境
が悪く、調整までに多大な時間と労力を必要としてい
る。However, such a method in which the operator visually adjusts the position depends on the skill of each operator, and there is no human error. Lack. In addition, since it is necessary to directly look into the state of actual delivery in the cleaning treatment tank, the working environment is bad, and it takes a lot of time and labor before adjustment.
【００１０】本発明はそのような問題点に鑑みてなされ
たものであり、簡単な装置構成によって把持具と保持具
のずれを測定、診断でき、両者の相対的な位置合わせを
行える手段を提供することを目的としている。The present invention has been made in view of such problems, and provides means for measuring and diagnosing the deviation between the gripping tool and the holding tool with a simple device configuration, and for performing relative alignment between the two. The purpose is to do.
【００１１】[0011]
【課題を解決するための手段】この目的を達成するた
め、本発明によれば、把持具と保持具との間で被処理体
を受け渡す際の該把持具と保持具の相対的なずれを測定
するための装置であって、把持具に脱着自在に装着され
る把持具側治具と、保持具に脱着自在に装着される保持
具側治具を備え、それら把持具側治具と保持具側治具の
間の距離を測定する測定手段を設けてなる把持具と保持
具のずれ測定装置が提供される。In order to achieve this object, according to the present invention, the relative displacement between the gripping tool and the holding tool when the object to be processed is transferred between the gripping tool and the holding tool. Is a device for measuring a gripping tool side jig that is removably mounted on a gripping tool and a holding tool side jig that is removably mounted on a holding tool. There is provided a shift measuring device for a holding tool and a holding tool, which is provided with a measuring means for measuring the distance between the holding tool side jigs.
【００１２】この測定装置は、更に次の特徴と備えるこ
とが可能である。 ・上記測定手段を複数設けたこと。 ・上記測定手段は、上記把持具側治具と保持具側治具の
一方に設けられる距離センサと、他方に形成される距離
の測定用の基準面で構成されること。 ・上記距離センサはＬＥＤ変位センサであること。 ・上記測定手段は、上記把持具側治具と保持具側治具の
一方に設けられる発光センサと、他方に設けられる受光
センサで構成されること。The measuring device can be further provided with the following features. -A plurality of the above-mentioned measuring means are provided. The measuring means is composed of a distance sensor provided on one of the gripping tool side jig and the holding tool side jig, and a reference surface for measuring the distance formed on the other side. -The above distance sensor must be an LED displacement sensor. The measuring means is configured by a light emitting sensor provided on one of the gripping tool side jig and the holding tool side jig, and a light receiving sensor provided on the other side.
【００１３】また、本発明によれば、把持具と保持具と
の間で被処理体を受け渡す際の該把持具と保持具の相対
的な位置合わせを行う方法であって、把持具に把持具側
治具を装着すると共に、保持具には保持具側治具を装着
し、それら把持具側治具と保持具側治具の間の距離を測
定して、該測定値を所望の値に一致させるように把持具
と保持具の相対的な位置合わせを行う方法が併せて提供
される。Further, according to the present invention, there is provided a method for performing relative positioning between the gripping tool and the holding tool when the object to be processed is transferred between the gripping tool and the holding tool. Attach the jig on the gripper side, and also attach the jig on the holder side to the holder, measure the distance between the jig on the gripper side and the jig on the holder side, and set the measured value to the desired value. A method is also provided for relative alignment of the gripper and the retainer to match the values.
【００１４】また、本発明によれば、以上のように把持
具と保持具との間で被処理体を受け渡す際の該把持具と
保持具の相対的なずれを測定するために好適に供される
手段として、把持具または保持具に脱着自在で、かつ距
離センサを備えている把持具と保持具のずれ測定用治
具、及び、把持具または保持具に脱着自在で、かつ距離
の測定用の基準面を備えている把持具と保持具のずれ測
定用治具が提供される。Further, according to the present invention, it is preferable to measure the relative displacement between the gripping tool and the holding tool when the object to be processed is transferred between the gripping tool and the holding tool as described above. As means to be provided, a jig for measuring the deviation between the gripping tool and the holding tool, which is detachable to the gripping tool or the holding tool, and has a distance sensor, and a tool which is detachable to the gripping tool or the holding tool and has a distance Provided is a jig for measuring a shift between a gripping tool and a holding tool, which has a reference surface for measurement.
【００１５】なお、これらずれ測定用治具は、更に次の
特徴と備えることが可能である。 ・上記距離センサを複数備えていること。 ・上記距離センサはＬＥＤ変位センサであること。The displacement measuring jigs can be further provided with the following features. -A plurality of the above distance sensors must be provided. -The above distance sensor must be an LED displacement sensor.
【００１６】また一方、本発明によれば、把持具または
保持具に脱着自在で、かつ発光センサを備えている把持
具と保持具のずれ測定用治具、及び、把持具または保持
具に脱着自在で、かつ受光センサを備えている把持具と
保持具のずれ測定用治具も提供される。なお、これらず
れ測定用治具にあっても、発光センサまたは受光センサ
を複数備えることが可能である。On the other hand, according to the present invention, a jig for measuring the deviation between the gripping tool and the holding tool, which is detachable from the gripping tool or the holding tool, and has a light emitting sensor, and the fitting / removing tool to the gripping tool or the holding tool. A jig for measuring the deviation between the holding tool and the holding tool, which is free and includes a light receiving sensor, is also provided. Note that these deviation measuring jigs can also be provided with a plurality of light emitting sensors or light receiving sensors.
【００１７】更に、本発明によれば、把持具と保持具と
の間で被処理体の受け渡しを行うものにおいて、把持具
に把持具側治具を装着すると共に、保持具には保持具側
治具を装着し、それら把持具側治具と保持具側治具の間
の距離を測定することによって把持具と保持具の間に生
じた相対的なずれを測定する操作を周期的に行い、その
測定値に基づいて、把持具または保持具の交換時期、位
置調整時期などを決定する把持具と保持具のずれ診断方
法が提供される。Further, according to the present invention, in a device for transferring an object to be processed between the holding tool and the holding tool, the holding tool side jig is attached to the holding tool and the holding tool side is attached to the holding tool. Cycling is performed by periodically mounting the jigs and measuring the distance between the jigs on the gripper side and the jigs on the holder side to measure the relative displacement between the grippers and the holder. A method for diagnosing the shift between the gripping tool and the holding tool is provided, which determines the replacement time of the gripping tool or the holding tool, the position adjustment time, and the like based on the measured value.
【００１８】また一方、本発明によれば、処理液を供給
可能に構成された処理槽内に被処理体を搬入して該被処
理体を処理液で処理する処理装置であって、被処理体を
処理槽内に搬入する把持具と、該把持具により処理槽内
に搬入された被処理体を前記処理槽内において保持する
保持具が配置されたものにおいて、把持具に脱着自在に
装着される把持具側治具及び／または保持具に脱着自在
に装着される保持具側治具、及び、それら把持具側治具
と保持具側治具の間の距離を測定する測定手段を備える
ずれ測定装置により測定された測定値に基づいて、把持
具と保持具の相対的な位置合わせを行って把持具と保持
具との間で被処理体の受け渡しを行わせる制御手段を備
えていることを特徴とする処理装置が提供される。On the other hand, according to the present invention, there is provided a processing apparatus for carrying an object to be processed into a processing tank configured to supply the processing liquid and processing the object with the processing liquid. A gripping tool for loading a body into a processing tank and a holding tool for holding an object to be processed loaded into the processing tank by the gripping tool in the processing tank are arranged, and are detachably attached to the gripping tool. And a holder-side jig that is detachably attached to the holder-side jig and / or a holder, and a measuring unit that measures the distance between the holder-side jig and the holder-side jig. Based on the measurement value measured by the displacement measuring device, a control means is provided for performing relative alignment between the gripping tool and the holding tool so as to transfer the object to be processed between the gripping tool and the holding tool. There is provided a processing device characterized by the above.
【００１９】そしてまた、本発明によれば、把持具によ
って把持した被処理体を処理液を供給可能に構成された
処理槽内に搬入すると共に、該搬入された被処理体を処
理槽内において保持具で保持し、被処理体を処理液で処
理する方法において、把持具に把持具側治具を装着する
と共に、保持具には保持具側治具を装着し、それら把持
具側治具と保持具側治具の間の距離を測定して、該測定
値を所望の値に一致させるように把持具と保持具の相対
的な位置合わせを行なった後、把持具と保持具との間で
被処理体の受け渡しを行うことを特徴とする処理方法が
提供される。Further, according to the present invention, the object to be processed grasped by the grasping tool is carried into the processing tank configured to be able to supply the processing liquid, and the carried object to be processed in the processing tank. In the method of holding an object to be processed with a processing liquid with a holding tool, a holding tool-side jig is attached to the holding tool, and a holding tool-side jig is attached to the holding tool. The distance between the holder and the jig on the holder side is measured, and the relative positions of the holder and the holder are adjusted so that the measured value matches the desired value. There is provided a processing method, characterized in that the object to be processed is transferred between them.
【００２０】[0020]
【作用】本発明のずれ測定装置にあっては、把持具に把
持具側治具を装着すると共に、保持具に保持具側治具を
装着する。そして、距離センサと基準面を用いて、それ
ら把持具側治具と保持具側治具の距離を測定する。こう
して得られた各測定値に基づいて、把持具と保持具との
間で被処理体を受け渡す際の該把持具と保持具の相対的
なずれを測定する。なお、本発明のずれ測定装置にあっ
ては、距離センサを複数設けているので、それら各距離
センサで測定された各測定値に基づいて、把持具と保持
具との間に生じた距離ずれの他、把持具と保持具との間
に生じた回転ずれも測定できる。In the deviation measuring device of the present invention, the jig is attached to the jig and the holder is attached to the holder. Then, using the distance sensor and the reference surface, the distance between the holding tool side jig and the holding tool side jig is measured. Based on each measurement value thus obtained, the relative displacement between the gripping tool and the holding tool when the object to be processed is transferred between the gripping tool and the holding tool is measured. In the deviation measuring device of the present invention, since a plurality of distance sensors are provided, the distance deviation generated between the gripping tool and the holding tool is based on each measurement value measured by each distance sensor. In addition, it is possible to measure the rotation deviation generated between the holding tool and the holding tool.
【００２１】また、本発明の位置合わせ方法にあって
は、以上のように距離センサと基準面を用いて測定した
各測定値を所望の値に一致させるように把持具と保持具
との相対的な位置を調整して、両者間に生じている相対
的な距離ずれ及び回転ずれをなくし、把持具と保持具と
の間で被処理体を受け渡す際の位置合わせを行う。Further, in the alignment method of the present invention, the relative position between the gripping tool and the holding tool is adjusted so that each measured value measured using the distance sensor and the reference surface as described above coincides with a desired value. The target position is adjusted so as to eliminate the relative distance shift and rotation shift generated between the two, and perform alignment when passing the object to be processed between the gripping tool and the holding tool.
【００２２】また、本発明のずれ診断方法にあっては、
以上のように距離センサと基準面を用いて把持具と保持
具の間に生じた相対的なずれを測定する操作を周期的に
行う。そして、そのように周期的に求めた測定値に基づ
いて、把持具と保持具の相対的なずれの進捗状況を調査
し、把持具または保持具の交換時期、位置調整時期など
を予測、決定する。Further, according to the deviation diagnosis method of the present invention,
As described above, the operation of measuring the relative displacement between the gripping tool and the holding tool using the distance sensor and the reference surface is periodically performed. Then, based on the measured values obtained periodically in this manner, the progress of the relative displacement between the gripping tool and the holding tool is investigated, and the gripping tool or the holding tool replacement timing, position adjustment timing, etc. are predicted and determined. To do.
【００２３】[0023]
【実施例】以下、本発明の実施例を、例えば半導体ウェ
ハの如き、略円板形状の被処理体Ｗを洗浄するための洗
浄装置１に基づいて説明する。図１に示すように、洗浄
装置１は大別して洗浄処理前の被処理体ＷをキャリアＣ
ごと投入するための搬入部２と、被処理体Ｗの洗浄処理
を行う洗浄処理部３と、洗浄処理後の被処理体Ｗをキャ
リアＣごと取り出すための搬出部４からなっている。Embodiments of the present invention will be described below with reference to a cleaning apparatus 1 for cleaning a substantially disk-shaped object W such as a semiconductor wafer. As shown in FIG. 1, the cleaning apparatus 1 is roughly classified into a carrier C and an object to be processed W before cleaning.
It comprises a carry-in section 2 for loading each of the workpieces W, a cleaning processing section 3 for cleaning the object W to be processed, and an unloading section 4 for taking out the object W to be processed after cleaning with the carrier C.
【００２４】搬入部２には、これから洗浄処理しようと
する被処理体Ｗを所定枚数、例えば２５枚収納したキャ
リアＣを搬入、載置させる載置部５と、載置されたキャ
リアＣを整列部６へ移送するための移送装置７が設けら
れる。洗浄処理部３の前面側（図１における手前側）に
三つの搬送装置１１、１２、１３が配列され、これら各
搬送装置１１、１２、１３には、本発明の把持具に相当
するウェハチャック１４、１５、１６がそれぞれ設けら
れる。搬送装置１１のウェハチャック１４は、整列部６
に搬入された二つのキャリアＣから５０枚の被処理体Ｗ
をまとめて取り出し、その後、その被処理体Ｗを洗浄処
理槽２１〜２９へ適宜搬送する。The carrying-in section 2 aligns the carrier 5 with the placing section 5 for carrying in and placing the carrier C containing a predetermined number, for example, 25 of the objects W to be cleaned. A transfer device 7 for transferring to the section 6 is provided. Three transfer devices 11, 12, 13 are arranged on the front side (front side in FIG. 1) of the cleaning processing unit 3, and each of these transfer devices 11, 12, 13 is a wafer chuck corresponding to the gripping tool of the present invention. 14, 15, and 16 are provided, respectively. The wafer chuck 14 of the transfer device 11 includes the alignment unit 6
50 objects to be processed W from the two carriers C carried into the container
Are collectively taken out, and then the object W to be processed is appropriately conveyed to the cleaning processing tanks 21 to 29.
【００２５】搬出部４には、載置部５とほぼ同様な構成
を備える載置部８、整列部６と同様な構成を備える図示
しない整列部、及び、移送装置７と同様な構成を備える
図示しない移送装置がそれぞれ設けられる。The carry-out section 4 has a placing section 8 having substantially the same configuration as the placing section 5, an unillustrated aligning section having the same configuration as the aligning section 6, and a configuration similar to that of the transfer device 7. Each transfer device (not shown) is provided.
【００２６】洗浄処理部３には、載置部５側から順に、
搬送装置１１のウェハチャック１４を洗浄、乾燥するチ
ャック洗浄・乾燥処理槽２１、被処理体Ｗの表面に付着
している有機汚染物、金属不純物、パーティクル等の不
純物質を薬液によって洗浄処理する薬液洗浄処理槽２
２、この薬液洗浄処理槽２２で洗浄された被処理体Ｗを
例えば純水を用いて洗浄する二つの水洗洗浄処理槽２
３、２４、薬液洗浄処理槽２２の薬液とは異なる薬液で
洗浄処理する薬液洗浄処理槽２５、この薬液洗浄処理槽
２５で洗浄された被処理体Ｗを例えば純水を用いて洗浄
する二つの水洗洗浄処理槽２６、２７、搬送装置１３の
ウェハチャック１６を洗浄、乾燥するチャック洗浄・乾
燥処理槽２８、及び、不純物質が除去された被処理体Ｗ
を例えばＩＰＡ（イソプロピルアルコール）などで蒸気
乾燥させる乾燥処理槽２９が配設される。The cleaning processing unit 3 has, in order from the mounting unit 5 side,
A chuck cleaning / drying processing tank 21 for cleaning and drying the wafer chuck 14 of the transfer device 11, and a chemical solution for cleaning impurities such as organic contaminants, metal impurities, and particles adhered to the surface of the object to be processed W with a chemical solution. Cleaning tank 2
2. Two water washing treatment tanks 2 for washing the object W washed in the chemical liquid washing treatment tank 22 with, for example, pure water
3, 24, a chemical solution cleaning treatment tank 25 for performing a cleaning treatment with a chemical solution different from the chemical solution in the chemical solution cleaning treatment tank 22, and two treatments for cleaning the object W cleaned in the chemical solution cleaning treatment tank 25 with, for example, pure water. Washing and washing treatment tanks 26, 27, a chuck washing / drying treatment tank 28 for washing and drying the wafer chuck 16 of the transfer device 13, and an object W to which impurities have been removed
A drying treatment tank 29 is provided for steam-drying, for example, with IPA (isopropyl alcohol).
【００２７】前述した三つの搬送装置１１、１２、１
３、及び洗浄処理槽２１〜２９は、何れも基本的には同
様の構成を備えているので、以下その代表として搬送装
置１２、及び薬液洗浄処理槽２５の構成について説明す
る。図２に示すように、搬送装置１２はウェハチャック
１５と、このウェハチャック１５を駆動させる駆動部１
７で構成される。駆動部１７は洗浄装置１の下方に敷設
されたレール１８に沿ってＸ方向（横方向）に走行移動
する走行部１７ａと、走行部１７ａの上方においてＺ方
向（上下方向）に伸縮する昇降部１７ｂと、昇降部１７
ｂの上端に配設された支持部１７ｃを備える。この支持
部１７ｃは、適当な調整機構（図示せず）によって平面
内において回転し、図中θで示した方向に角度調整でき
るように構成されている。The above-mentioned three transfer devices 11, 12, 1
Since 3 and the cleaning treatment tanks 21 to 29 basically have the same configuration, the configurations of the transport device 12 and the chemical cleaning treatment tank 25 will be described below as representatives thereof. As shown in FIG. 2, the transfer device 12 includes a wafer chuck 15 and a drive unit 1 that drives the wafer chuck 15.
It is composed of 7. The drive unit 17 includes a traveling unit 17a that travels in the X direction (horizontal direction) along a rail 18 laid below the cleaning device 1, and an elevating unit that extends and contracts in the Z direction (vertical direction) above the traveling unit 17a. 17b and the lifting unit 17
The support part 17c is provided at the upper end of b. The support portion 17c is configured to be rotated in a plane by an appropriate adjusting mechanism (not shown) so that the angle can be adjusted in a direction indicated by θ in the drawing.
【００２８】一方、ウェハチャック１５は、駆動部１７
の支持部１７ｃに対して回動自在に装着された左右一対
の把持部材１５ａ、１５ｂを備える。これら把持部材１
５ａ、１５ｂの突出長さは、前後方向（Ｙ方向）に調整
できるように構成されている。把持部材１５ａ、１５ｂ
にはそれぞれ二本づつのアーム３１ａ、３１ａ、３１
ｂ、３１ｂが垂設され、これらアーム３１ａ、３１ａ、
及びアーム３１ｂ、３１ｂの間に上下の把持棒３３ａ、
３４ａ、把持棒３３ｂ、３４ｂがそれぞれ取り付けられ
る。そして、把持部材１５ａ、１５ｂの回動によって左
右のアーム３１ａ、３１ｂが図中Ｍ、Ｎ方向にそれぞれ
揺動し、アーム３１ａ、３１ｂ同士を互いに近づけるよ
うに揺動させた際に、例えば５０枚の被処理体Ｗを把持
棒３３ａ、３４ａと把持棒３３ｂ、３４ｂの間で一括し
て把持するように構成されている。On the other hand, the wafer chuck 15 includes a drive unit 17
The pair of left and right gripping members 15a and 15b are rotatably attached to the supporting portion 17c. These gripping members 1
The protruding lengths of 5a and 15b are configured to be adjustable in the front-rear direction (Y direction). Grasping members 15a, 15b
Each of the two arms 31a, 31a, 31
b and 31b are vertically installed and these arms 31a, 31a,
And the upper and lower grip bars 33a between the arms 31b and 31b,
34a and gripping bars 33b and 34b are attached, respectively. The left and right arms 31a and 31b are respectively swung in the M and N directions in the figure by the rotation of the gripping members 15a and 15b, and when the arms 31a and 31b are swung so as to approach each other, for example, 50 The object W to be processed is collectively held between the gripping bars 33a and 34a and the gripping bars 33b and 34b.
【００２９】また、薬液洗浄処理槽２５の底部近傍に
は、本発明の保持具に相当するボート４１が配設され
る。ボート４１は薬液洗浄処理槽２５の底部近傍におい
てブラケット４５（図４参照）を介して固定された三本
の保持棒４２、４３、４４により構成される。これら三
本の保持棒４２、４３、４４は何れも、先に説明したウ
ェハチャック１５の把持棒３３ａ、３４ａ、及び把持棒
３３ｂ、３４ｂと平行に配置され、洗浄処理時において
は、薬液洗浄処理槽２５内においてこれら保持棒４２、
４３、４４によって例えば５０枚の被処理体Ｗを一括し
て保持するように構成されている。In the vicinity of the bottom of the chemical cleaning tank 25, a boat 41 corresponding to the holder of the present invention is arranged. The boat 41 is composed of three holding rods 42, 43 and 44 fixed near a bottom portion of the chemical cleaning treatment tank 25 via a bracket 45 (see FIG. 4). All of these three holding rods 42, 43, 44 are arranged in parallel with the gripping rods 33a, 34a and the gripping rods 33b, 34b of the wafer chuck 15 described above, and during the cleaning process, the chemical cleaning process is performed. In the tank 25, these holding rods 42,
43 and 44 are configured to collectively hold, for example, 50 objects W to be processed.
【００３０】図３に示すように、ウェハチャック１５を
構成する一方の把持棒３３ａと把持棒３４ａの内側（被
処理体Ｗと接触する側）には把持溝Ｐ及び把持溝Ｑがそ
れぞれ刻設される。これら把持溝Ｐ及び把持溝Ｑは一定
間隔Ｌをもって配置された溝Ｐ1〜Ｐ50及び溝Ｑ1〜Ｑ50
よりなる。図示はしないが、ウェハチャック１５を構成
する他方の把持棒３３ｂと把持棒３４ｂの内側（被処理
体Ｗと接触する側）にも一定間隔Ｌをもって配置された
溝Ｐ1〜Ｐ50及び溝Ｑ1〜Ｑ50よりなる把持溝Ｐ及び把持
溝Ｑがそれぞれ刻設されている。そして、上記のように
把持棒３３ａ、３４ａと把持棒３３ｂ、３４ｂの間で５
０枚の被処理体Ｗを一括して把持した際には、その把持
された被処理体Ｗの周縁部が、把持棒３３ａ、３４ａ及
び把持棒３３ｂ、３４ｂの各溝Ｐ1〜Ｐ50、溝Ｑ1〜Ｑ50
内にそれぞれ嵌入するようになっている。As shown in FIG. 3, a gripping groove P and a gripping groove Q are formed on the inside (the side in contact with the object W to be processed) of one of the gripping bars 33a and 34a constituting the wafer chuck 15, respectively. To be done. The gripping groove P and the gripping groove Q are grooves P 1 to P 50 and grooves Q 1 to Q 50 which are arranged at a constant interval L.
Consists of. Although not shown, the grooves P 1 to P 50 and the grooves Q arranged at a constant interval L inside the other gripping bar 33b and the gripping bar 34b (the side in contact with the object W to be processed) which form the wafer chuck 15. A gripping groove P and a gripping groove Q composed of 1 to Q 50 are engraved, respectively. Then, as described above, the gripping bars 33a and 34a and the gripping bars 33b and 34b are connected to each other by 5
When the 0 workpieces W are collectively gripped, the peripheral edge of the gripped workpieces W has the grooves P 1 to P 50 of the gripping bars 33a and 34a and the gripping bars 33b and 34b. Grooves Q 1 to Q 50
It is designed to fit in each.
【００３１】またボート４１を構成する三本の保持棒４
２、４３、４４の上面にも保持溝Ｒ、保持溝Ｓ、及び保
持溝Ｔがそれぞれ刻設される。これら保持溝Ｒ、保持溝
Ｓ、及び保持溝Ｔも同様に、一定間隔Ｌをもって配置さ
れた溝Ｒ1〜Ｒ50、溝Ｓ1〜Ｓ50、及び溝Ｔ1〜Ｔ50より
構成される。そして、上記のようにこれら保持棒４２、
４３、４４によって５０枚の被処理体Ｗを一括して保持
した際には、その把持された被処理体Ｗの周縁部が、こ
れら保持棒４２、４３、４４の上面に刻設された各溝Ｒ
1〜Ｒ50、溝Ｓ1〜Ｓ50、及び溝Ｔ1〜Ｔ50内にそれぞれ
嵌入するようになっている。Further, the three holding rods 4 constituting the boat 41
A holding groove R, a holding groove S, and a holding groove T are also engraved on the upper surfaces of 2, 43, and 44, respectively. The holding groove R, the holding groove S, and the holding groove T are also composed of the grooves R 1 to R 50 , the grooves S 1 to S 50 , and the grooves T 1 to T 50, which are arranged at a constant interval L. Then, as described above, these holding rods 42,
When 50 objects W to be processed are collectively held by 43 and 44, the peripheral edges of the gripped objects W are engraved on the upper surfaces of the holding bars 42, 43 and 44. Groove R
1 to R 50 , the grooves S 1 to S 50 , and the grooves T 1 to T 50 are respectively fitted.
【００３２】以上のように構成された搬送装置１２のウ
ェハチャック１５で一括して把持した５０枚の被処理体
Ｗを、薬液洗浄処理槽２５内において薬液洗浄する際に
は、先ず、被処理体Ｗを把持した状態のウェハチャック
１５を走行部１７ａの稼働によってボート４１の真上ま
で移動させる。この状態において被処理体Ｗは、その周
縁部が、把持棒３３ａ、３４ａ及び把持棒３３ｂ、３４
ｂの各溝Ｐ1〜Ｐ50、溝Ｑ1〜Ｑ50内にそれぞれ嵌入し、
把持棒３３ａ、３４ａと把持棒３３ｂ、３４ｂの間で把
持されている。When the 50 wafers W to be processed, which are collectively held by the wafer chuck 15 of the transfer apparatus 12 having the above-described structure, are subjected to chemical cleaning in the chemical cleaning tank 25, first, the processing is performed. The wafer chuck 15 holding the body W is moved to directly above the boat 41 by the operation of the traveling unit 17a. In this state, the peripheral edge of the object W to be processed has gripping bars 33a, 34a and gripping bars 33b, 34.
b into the grooves P 1 to P 50 and the grooves Q 1 to Q 50 ,
It is gripped between the gripping bars 33a and 34a and the gripping bars 33b and 34b.
【００３３】そして、ウェハチャック１５を薬液洗浄処
理槽２５内に下降させ、被処理体Ｗをボート４１上に受
け渡す。この受け渡しの際、ウェハチャック１５で把持
している各被処理体Ｗの周縁部が、ボート４１の各保持
棒４２、４３、４４上面に刻設された各溝Ｒ1〜Ｒ50、
溝Ｓ1〜Ｓ50、及び溝Ｔ1〜Ｔ50内に丁度嵌入される。Then, the wafer chuck 15 is lowered into the chemical cleaning processing bath 25, and the object W to be processed is transferred onto the boat 41. At the time of this delivery, the peripheral edge of each object W to be processed, which is held by the wafer chuck 15, is provided with each groove R 1 to R 50 formed on the upper surface of each holding rod 42, 43, 44 of the boat 41.
It is just fitted into the grooves S 1 to S 50 and the grooves T 1 to T 50 .
【００３４】その後、ウェハチャック１５の把持部材１
５ａ、１５ｂが開脚し、ウェハチャック１５が上昇し
て、薬液洗浄処理槽２５外部に退避する。After that, the holding member 1 of the wafer chuck 15
5a and 15b are opened, the wafer chuck 15 rises, and is withdrawn to the outside of the chemical cleaning processing bath 25.
【００３５】次に、所定の浸漬時間が経過し、洗浄処理
が終了すると、把持部材１５ａ、１５ｂを開脚させた状
態でウェハチャック１５が薬液洗浄処理槽２５内に下降
し、被処理体Ｗをボート４１に渡した際の位置にて停止
する。そして、ウェハチャック１５の把持部材１５ａ、
１５ｂが閉脚し、ボート４１で保持されていた５０枚の
被処理体Ｗを同時に一括して把持する。このこの把持の
際には、ウェハチャック１５で把持した各被処理体Ｗの
周縁部を、把持棒３３ａ、３４ａ及び把持棒３３ｂ、３
４ｂの各溝Ｐ1〜Ｐ50、溝Ｑ1〜Ｑ50内に丁度嵌入させ
る。こうして把持棒３３ａ、３４ａと把持棒３３ｂ、３
４ｂの間で被処理体Ｗを一括して把持し、ウェハチャッ
ク１５を上昇させて、把持した被処理体Ｗを薬液洗浄処
理槽２５外部に退避させ、次の洗浄処理である水洗洗浄
を行う水洗洗浄処理槽２４へと被処理体Ｗを搬送する。Next, when a predetermined dipping time has elapsed and the cleaning process is completed, the wafer chuck 15 is lowered into the chemical cleaning process bath 25 with the holding members 15a and 15b opened, and the object W to be processed W is processed. Is stopped at the position where it was handed over to the boat 41. Then, the holding member 15a of the wafer chuck 15,
The legs 15b are closed, and the 50 workpieces W held by the boat 41 are simultaneously gripped at once. At the time of this gripping, the peripheral portions of the respective workpieces W gripped by the wafer chuck 15 are held by the gripping bars 33a, 34a and the gripping bars 33b, 3 and 3.
4b the groove P 1 to P 50 of, is just fitted into the groove Q 1 to Q 50. In this way, the grip bars 33a, 34a and the grip bars 33b, 3
The objects W to be processed are collectively gripped between 4b, the wafer chuck 15 is lifted up, the gripped objects W are evacuated to the outside of the chemical cleaning processing tank 25, and the next cleaning process, that is, water cleaning is performed. The object W to be processed is conveyed to the washing and washing processing tank 24.
【００３６】従って、以上のようにウェハチャック１５
とボート４１との間で５０枚の被処理体Ｗを円滑に受け
渡すためには、ウェハチャック１５側の各把持溝Ｐ1〜
Ｐ50、Ｑ1〜Ｑ50と、ボート４１側の保持溝Ｒ1〜Ｒ50、
Ｓ1〜Ｓ50、Ｔ1〜Ｔ50とがそれぞれ正しい相対位置関係
になければならない。即ち、例えば一番目の溝について
いえば、把持溝Ｐ1、Ｑ1と、保持溝Ｒ1、Ｓ1、Ｔ1とが
同一垂直面上に位置していなければならない。Therefore, as described above, the wafer chuck 15
In order to smoothly transfer the 50 objects W to be processed between the boat 41 and the boat 41, the holding grooves P 1 to
P 50 , Q 1 to Q 50 and holding grooves R 1 to R 50 on the boat 41 side,
S 1 to S 50 and T 1 to T 50 must be in the correct relative positional relationship with each other. That is, for the first groove, for example, the gripping grooves P 1 , Q 1 and the holding grooves R 1 , S 1 , T 1 must be located on the same vertical plane.
【００３７】本発明はかかる場合の相対的なずれを測
定、診断し、位置合わせを行う手段として提供されるも
のであり、図２に示されるように、把持具であるウェハ
チャック１５に脱着自在に装着される把持具側治具５０
と、保持具であるボート４１側に脱着自在に装着される
保持具側治具５１を備えている。The present invention is provided as means for measuring, diagnosing, and aligning the relative displacement in such a case, and as shown in FIG. 2, it can be freely attached to and detached from the wafer chuck 15, which is a gripping tool. Tool jig 50 attached to the
And a holder-side jig 51 that is detachably attached to the boat 41 that is a holder.
【００３８】先ず、図５〜７にもとづいて保持具側治具
５１を説明する。保持具側治具５１の下方両端には突起
部５２、５３がそれぞれ形成される。図５に示すよう
に、突起部５２、及び突起部５３は、何れも被処理体Ｗ
である円板形状の半導体ウェハと同一の曲率を有してお
り、それら突起部５２、５３同士の間隔は、先に説明し
たボート４１の左右の保持棒４２、４４同士の間隔と同
じになっている。また、この実施例の突起部５２、５３
は、保持棒４２、４４の溝Ｒ1〜Ｒ50、及び溝Ｔ1〜Ｔ50
に嵌入できる大きさの「Ｖ」形状からなる三つの突起５
４、５５、５６を有している。これら突起５４、５５、
５６の配置間隔Ｌは、保持棒４２、４４の溝Ｒ1〜
Ｒ50、及び溝Ｔ1〜Ｔ50と同じ間隔に形成されている。
従って、図５、７に示されるように、保持具側治具５１
の突起部５２、５３をボート４１の保持棒４２、４４に
形成された保持溝Ｒ、及び保持溝Ｔにそれぞれ嵌入させ
ることにより、ボート４１に対して保持具側治具５１を
脱着自在に装着することが可能である。また、以上のよ
うな保持具側治具５１の上方には基準面５７が形成され
ている。後述するように、把持具側治具５０に設けられ
たそれぞれの距離センサから投光された光をこの基準面
５７で反射させるようになっている。また、図示の例で
は、上述の突起部５２、５３の真ん中の突起５５と基準
面５７とが同一平面となるように形成されている。従っ
て、以上のように保持棒４２、４４の保持溝Ｒ、Ｔを利
用して保持具側治具５１をボート４１に装着することに
より、この保持具側治具５１に形成された基準面５７
は、突起部５２、５３の真ん中の突起５５が嵌入した溝
と同じ位置に位置決めされて配置される。First, the holder-side jig 51 will be described with reference to FIGS. Protrusions 52 and 53 are formed at both lower ends of the holder jig 51. As shown in FIG. 5, the protrusion 52 and the protrusion 53 are both the object W to be processed.
Has the same curvature as the disk-shaped semiconductor wafer, and the interval between the protrusions 52 and 53 is the same as the interval between the left and right holding rods 42 and 44 of the boat 41 described above. ing. In addition, the protrusions 52 and 53 of this embodiment
Are grooves R 1 to R 50 of the holding bars 42 and 44 and grooves T 1 to T 50.
Three protrusions 5 of "V" shape that can fit in
It has 4, 55 and 56. These protrusions 54, 55,
The arrangement interval L of 56 is the groove R 1 of the holding rods 42 and 44.
It is formed at the same intervals as R 50 and the grooves T 1 to T 50 .
Therefore, as shown in FIGS.
The holder side jig 51 is detachably attached to the boat 41 by fitting the protrusions 52 and 53 of the boat into the holding grooves R and the holding grooves T formed in the holding rods 42 and 44 of the boat 41, respectively. It is possible to A reference surface 57 is formed above the jig 51 on the holder side. As will be described later, the light projected from each of the distance sensors provided on the holding tool side jig 50 is reflected by the reference surface 57. Further, in the illustrated example, the middle protrusion 55 of the protrusions 52 and 53 and the reference surface 57 are formed so as to be flush with each other. Therefore, by mounting the holder-side jig 51 on the boat 41 using the holding grooves R and T of the holding rods 42 and 44 as described above, the reference surface 57 formed on the holder-side jig 51.
Is positioned and arranged at the same position as the groove into which the middle projection 55 of the projections 52 and 53 is fitted.
【００３９】次に、図８〜１０にもとづいて把持具側治
具５０を説明する。把持具側治具５０の左右両端は、図
２に示される如くウェハチャック１５の上側の把持棒３
３ａ及び把持棒３３ｂの上に把持具側治具５０を載置さ
せるための延設部６０ａ及び延設部６０ｂにそれぞれ形
成される。延設部６０ａ及び延設部６０ｂの内側下方に
は、左右二個づつの突起６１ａ、６１ａ及び突起６１
ｂ、６１ｂがそれぞれ取り付けられる。これら突起６１
ａ、６１ａ及び突起６１ｂ、６１ｂは、それぞれ把持棒
３３ａ及び把持棒３３ｂに形成された把持溝Ｐ及び把持
溝Ｑに嵌入できる形状に形成されている。左右の突起６
１ａと突起６１ｂとの間隔は、先に説明したウェハチャ
ック１５においてアーム３１ａ、３１ｂ同士を互いに近
づけるように揺動させて被処理体Ｗを把持した際に、把
持棒３３ａ及び把持棒３３ｂがなす間隔と同じになって
いる。また、延設部６０ａ側に取り付けられた二個の突
起６１ａ、６１ａ同士の間隔と、延設部６０ｂ側に取り
付けられた二個の突起６１ｂ、６１ｂ同士の間隔は、何
れもウェハチャック１５の把持棒３３ａ、及び把持棒３
３ｂに形成された各溝Ｐ1〜Ｐ50、溝Ｑ1〜Ｑ50の間隔Ｌ
の整数倍の長さに形成されており、図示の例では溝Ｐ1
〜Ｐ50及び溝Ｑ1〜Ｑ50の間隔Ｌの２９倍、即ち、突起
６１ａ、６１ａ同士の間隔と、突起６１ｂ、６１ｂ同士
の間隔は、何れも２９Ｌの長さになっている。従って、
図９に示されるように、把持具側治具５０の突起６１
ａ、６１ｂをウェハチャック１５の把持棒３３ａ、３３
ｂに形成された把持溝Ｐ、Ｑにそれぞれ嵌入させること
により、ウェハチャック１５に対して把持具側治具５０
も脱着自在に装着することが可能である。Next, the gripping tool side jig 50 will be described with reference to FIGS. As shown in FIG. 2, the left and right ends of the gripping tool side jig 50 are located above the gripping bar 3 of the wafer chuck 15.
3a and the grip bar 33b are respectively formed on the extended portion 60a and the extended portion 60b for mounting the grip tool side jig 50. Two protrusions 61a, 61a and two protrusions 61a and 61a are provided on the inner lower side of the extending portion 60a and the extending portion 60b.
b and 61b are attached respectively. These protrusions 61
The a and 61a and the protrusions 61b and 61b are formed in shapes that can be fitted into the gripping grooves P and the gripping grooves Q formed in the gripping bars 33a and 33b, respectively. Left and right protrusion 6
The distance between 1a and the protrusion 61b is made by the gripping rod 33a and the gripping rod 33b when the workpiece W is gripped by swinging the arms 31a and 31b so as to bring them close to each other in the wafer chuck 15 described above. It is the same as the interval. The distance between the two protrusions 61a and 61a attached to the extended portion 60a side and the distance between the two protrusions 61b and 61b attached to the extended portion 60b side are both the same as those of the wafer chuck 15. Grip bar 33a and grip bar 3
The interval L between the grooves P 1 to P 50 and the grooves Q 1 to Q 50 formed in 3b.
Of the groove P 1 in the illustrated example.
To P 50 and 29 times the distance L of the groove Q 1 to Q 50, i.e., the projection 61a, the distance 61a between the projections 61b, 61b interval of each other, both have become the length of 29L. Therefore,
As shown in FIG. 9, the protrusion 61 of the jig 50 on the gripping tool side
a, 61b are gripping bars 33a, 33 of the wafer chuck 15.
By being fitted into the holding grooves P and Q formed in b, respectively, the holding tool side jig 50 with respect to the wafer chuck 15.
Can also be detachably attached.
【００４０】また、把持具側治具５０の下方にはブラケ
ット６５を介して左右二機の距離センサ６６ａ、６６ｂ
が装着される。図示の実施例では距離センサ６６ａ、６
６ｂは、発光ダイオードを利用したＬＥＤ変位センサで
構成されている。図９に示すように、距離センサ６６
ａ、６６ｂの前面には、光を投光する投光部６７ａ、６
７ｂと、後述するようにそれら投光部６７ａ、６７ｂか
ら投光された光が保持具側治具５１の基準面５７で反射
された反射光を受光する受光部６８ａ、６８ｂがそれぞ
れ設けられている。そして、図示の例では、図８に示す
ようにそれら投光部６７ａ、６７ｂと受光部６８ａ、６
７ｂを有する距離センサ６６ａ、６６ｂの前面と一方
（図８では下側）の突起６１ａ、６１ｂとの水平距離
Ｌ'は、上述した間隔Ｌの５倍の長さ、即ち５Ｌに設定
されている。従って、先に説明したように、把持具側治
具５０の突起６１ａ、６１ｂを把持溝Ｐ、Ｑにそれぞれ
嵌入させながら、把持具側治具５０の左右の延設部６０
ａ、６０ｂをウェハチャック１５の把持棒３３ａ、３３
ｂの上に載置して把持具側治具５０をウェハチャック１
５に装着することにより、距離センサ６６ａ、６６ｂの
投光部６７ａ、６７ｂ及び受光部６８ａ、６８ｂを、一
方（図８では下側）の突起６１ａ、６１ｂを嵌入させた
保持溝Ｐ、Ｑから水平距離で５Ｌ離れた位置に配置する
ことが可能である。Below the jig 50 on the gripping tool side, there are two distance sensors 66a, 66b on the left and right sides via a bracket 65.
Is attached. In the illustrated embodiment, the distance sensors 66a, 6a
6b is composed of an LED displacement sensor using a light emitting diode. As shown in FIG. 9, the distance sensor 66
The light projecting portions 67a, 6 for projecting light are provided on the front surfaces of the a, 66b.
7b and, as will be described later, light receiving portions 68a and 68b for receiving light reflected by the light projecting portions 67a and 67b and reflected by the reference surface 57 of the jig 51 on the holder side, respectively. There is. Then, in the illustrated example, as shown in FIG. 8, the light projecting units 67a and 67b and the light receiving units 68a and 6a.
The horizontal distance L ′ between the front surface of the distance sensors 66a, 66b having 7b and the protrusions 61a, 61b on one side (the lower side in FIG. 8) is set to 5 times the above-mentioned distance L, that is, 5L. . Therefore, as described above, the protrusions 61a and 61b of the jig 50 on the gripping tool side are fitted into the gripping grooves P and Q, respectively, and the left and right extending portions 60 of the jig 50 on the gripping tool side are fitted.
a, 60b are gripping bars 33a, 33 of the wafer chuck 15.
The jig 50 on the gripper side is placed on the wafer chuck 1
By mounting the projections 61a and 61b on one side (the lower side in FIG. 8) of the light emitting portions 67a and 67b and the light receiving portions 68a and 68b of the distance sensors 66a and 66b on the holding grooves P and Q, respectively. It is possible to arrange them at a position separated by 5L in the horizontal distance.
【００４１】さて、以上の構成からなる実施例の把持具
側治具５０と保持具側治具５１を用いてずれを測定する
場合は、先ず図２に示したように、ウェハチャック１５
に把持具側治具５０を装着し、また、ボート４１に保持
具側治具５１を装着する。ウェハチャック１５は、予め
アーム３１ａ、３１ｂを互いに近づけるように揺動させ
ておき、被処理体Ｗを把持している時と同じ状態にして
おく。そして、把持具側治具５０の左右の突起６１ａ、
６１ａ、及び突起６１ｂ、６１ｂをウェハチャック１５
の上側の把持棒３３ａと把持棒３３ｂに形成されている
把持溝Ｐ、Ｑにそれぞれ嵌入させながら、把持具側治具
５０の延設部６０ａ及び延設部６０ｂをウェハチャック
１５の把持棒３３ａ及び把持棒３３ｂの上にそれぞれ載
置させる。なお、把持具側治具５０の突起６１ａ、６１
ｂを嵌入させる把持溝Ｐ、Ｑの位置は、各溝Ｐ1〜
Ｐ50、及び溝Ｑ1〜Ｑ50の中から適当に選択し、ずれを
測定しようとする位置の溝に一方（図８では下側）の突
起６１ａ、６１ｂを嵌入させて、ウェハチャック１５に
対して把持具側治具５０を装着する。ここで、突起６１
ａを嵌入させる把持溝Ｐと、突起６１ｂを嵌入させる把
持溝Ｑは左右が同じ位置の溝、即ち、例えば溝Ｐ10に対
しては溝Ｑ10、溝Ｐnに対しては溝Ｑnとなるように対応
させる。なお、距離センサ６６ａ、６６ｂの投光部６７
ａ、６７ｂ及び受光部６８ａ、６８ｂを図２の手前側に
向けるようにして把持具側治具５０を装着することも可
能であるが、その逆に、把持具側治具５０を水平面内で
１８０゜反転させて距離センサ６６ａ、６６ｂの投光部
６７ａ、６７ｂ及び受光部６８ａ、６８ｂを図２の後方
側に向けるようにして装着することも可能である。Now, when the deviation is measured using the holding tool side jig 50 and the holding tool side jig 51 of the embodiment having the above-mentioned structure, first, as shown in FIG.
The grasping tool side jig 50 is attached to the boat, and the retaining tool side jig 51 is attached to the boat 41. The wafer chuck 15 is swung in advance so that the arms 31a and 31b are brought closer to each other, and is in the same state as when the object W to be processed is gripped. Then, the left and right protrusions 61a of the holding tool side jig 50,
61a and the protrusions 61b and 61b are attached to the wafer chuck 15
Of the gripping tool side jig 50 while fitting the gripping grooves P and Q formed in the gripping bar 33a and the gripping bar 33b above the gripping rod 33a of the wafer chuck 15, respectively. And on the gripping bar 33b. The protrusions 61a, 61 of the jig 50 on the gripping tool side
gripping groove P which is fitted to b, the position of Q, each groove P 1 ~
P 50 and grooves Q 1 to Q 50 are properly selected, and one (lower side in FIG. 8) protrusions 61 a and 61 b are fitted into the groove at the position where the deviation is to be measured, and then the wafer chuck 15 is attached. On the other hand, the grasping tool side jig 50 is attached. Here, the protrusion 61
a gripping groove P which is fitted to a, gripping groove Q for fitting the projection 61b is a groove of the left and right have the same position, i.e., for example, grooves Q 10 for the grooves P 10, and grooves Q n for groove P n Make it correspond. The light emitting unit 67 of the distance sensors 66a and 66b.
It is also possible to mount the grasping tool side jig 50 so that the a, 67b and the light receiving portions 68a, 68b are directed to the front side in FIG. 2, but conversely, the grasping tool side jig 50 in the horizontal plane. It is also possible to invert by 180 ° and mount the light emitting portions 67a, 67b and the light receiving portions 68a, 68b of the distance sensors 66a, 66b so as to face the rear side in FIG.
【００４２】一方、保持具側治具５１の下方両端に形成
された突起部５２、５３の突起５４、５５、５６をボー
ト４１の保持棒４２、４４上面の保持溝Ｒ、Ｔにそれぞ
れ嵌入させ、保持具側治具５１の基準面５７をウェハチ
ャック１５に装着される把持具側治具５０の距離センサ
６６ａ、６６ｂの投光部６７ａ、６７ｂ及び受光部６８
ａ、６８ｂと向き合わせるようにして、ボート４１に対
して保持具側治具５１を装着する。この場合、保持具側
治具５１の突起部５２、５３の真ん中の突起５５を嵌入
させる保持棒４２、４４上面の保持溝Ｒ、Ｔの位置は、
先に説明したウェハチャック１５に対して把持具側治具
５０を装着する際に、一方（図８では下側）の突起６１
ａ、６１ｂを嵌入させた把持溝Ｐ、Ｑの位置と同じに
し、かつまた、突起部５２、５３を嵌入させる保持溝
Ｒ、Ｔは左右が同じ位置の溝となるようにする。即ち、
例えばウェハチャック１５に把持具側治具５０を装着す
る際に一方（図８では下側）の突起６１ａ、６１ｂを嵌
入させた把持溝Ｐ、Ｑの位置が溝Ｐ10と溝Ｑ10、であれ
ば、突起部５２、５３の真ん中の突起５５を溝Ｒ10と溝
Ｔ10にそれぞれ嵌入させ、同様に、把持溝Ｐ、Ｑの位置
が溝Ｐnと溝Ｑn、であれば、突起部５２、５３の真ん中
の突起５５を溝Ｒnと溝Ｔnにそれぞれ嵌入させる。On the other hand, the protrusions 54, 55, 56 of the protrusions 52, 53 formed at both lower ends of the holder jig 51 are fitted into the retaining grooves R, T on the upper surfaces of the retaining rods 42, 44 of the boat 41, respectively. , The reference surface 57 of the holder-side jig 51 is mounted on the wafer chuck 15, and the distance sensors 66a and 66b of the holder-side jig 50 are mounted on the light-projecting portions 67a and 67b and the light-receiving portion 68.
The holder-side jig 51 is attached to the boat 41 so as to face the a and 68b. In this case, the positions of the holding grooves R, T on the upper surfaces of the holding rods 42, 44 into which the middle protrusion 55 of the protruding portions 52, 53 of the holder-side jig 51 are fitted are
When the gripper side jig 50 is attached to the wafer chuck 15 described above, one of the protrusions 61 (lower side in FIG. 8)
The positions of the holding grooves P and Q into which the a and 61b are fitted are the same, and the holding grooves R and T into which the protrusions 52 and 53 are fitted are at the same positions on the left and right. That is,
For example the wafer chuck 15 whereas when mounting the gripper side jig 50 with the projection 61a, the gripping groove P, the position of Q groove P 10 and the groove Q 10 which is fitted and 61b (FIG. 8, bottom) in, If there is, the protrusion 55 in the middle of the protrusions 52, 53 is fitted into the groove R 10 and the groove T 10 , respectively. Similarly, if the positions of the gripping grooves P, Q are the groove P n and the groove Q n , the protrusion 55 The protrusion 55 in the middle of the portions 52 and 53 is fitted into the groove R n and the groove T n , respectively.
【００４３】以上のようにウェハチャック１５に把持具
側治具５０を装着すると共に、ボート４１に保持具側治
具５１を装着したら、搬送装置１２の駆動部１７の昇降
部１７ｂを短縮稼働させ、支持部１７ｃを介してウェハ
チャック１５を、図４に示すように薬液洗浄処理槽２５
の内部に下降させる。これにより、ウェハチャック１５
の把持棒３３ａ、３３ｂ上に載置された把持具側治具５
０も同様に薬液洗浄処理槽２５の内部に下降し、図示の
ように把持具側治具５０に設けられた距離センサ６６
ａ、６６ｂの投光部６７ａ、６７ｂの高さと、ボート４
１の保持棒４２、４４上に装着された保持具側治具５１
の基準面５７の高さが一致するようになる。After the jig 50 on the gripping tool side is mounted on the wafer chuck 15 and the jig 51 on the holding tool side is mounted on the boat 41 as described above, the elevating part 17b of the driving part 17 of the transfer device 12 is shortened and operated. As shown in FIG. 4, the wafer chuck 15 is attached via the support portion 17c to the chemical cleaning bath 25.
Lower inside. As a result, the wafer chuck 15
Holding tool side jig 5 placed on the holding bars 33a and 33b
Similarly, 0 also descends into the chemical cleaning treatment tank 25, and the distance sensor 66 provided on the jig 50 on the gripper side as shown in the drawing.
a and 66b, the height of the light projecting portions 67a and 67b, and the boat 4
The jig 51 on the holder side mounted on the holding rods 42 and 44 of No. 1
The heights of the reference planes 57 become the same.
【００４４】そして、図１０に示すようにこの状態で距
離センサ６６ａ、６６ｂの投光部６７ａ、６７ｂからそ
れぞれ光を投光すると共に、保持具側治具５１の基準面
５７によって反射された反射光を距離センサ６６ａ、６
６ｂの受光部６８ａ、６８ｂでそれぞれ受光する。こう
して、これら距離センサ６６ａ、６６ｂによって把持具
側治具５０と保持具側治具５１の距離を測定する。Then, as shown in FIG. 10, in this state, light is projected from the light projecting portions 67a and 67b of the distance sensors 66a and 66b, respectively, and reflected by the reference surface 57 of the holder-side jig 51. The light is detected by the distance sensors 66a, 6
The light receiving portions 68a and 68b of 6b respectively receive light. In this way, the distance between the gripping tool side jig 50 and the holding tool side jig 51 is measured by the distance sensors 66a and 66b.
【００４５】ここで、以上のような距離センサ６６ａ、
６６ｂを用いた測定は、例えば図１１に示されるような
測定システムによって行うことができる。この測定シス
テムの制御部７０には表示部７１ａと表示部７１ｂを設
ける。距離センサ６６ａ、６６ｂと制御部７０とはケー
ブル７２ａ、７２ｂを介してそれぞれ接続し、距離セン
サ６６ａによって測定された保持具側治具５１の基準面
５７との距離を表示部７１ａに表示すると共に、距離セ
ンサ６６ｂによって測定された保持具側治具５１の基準
面５７との距離を表示部７１ｂに表示する。なお、ケー
ブル７２ａ、７２ｂはウェハチャック１５のアーム３１
ａ、３１ｂなどの動きと干渉しないように注意して設置
する。Here, the distance sensor 66a as described above,
The measurement using 66b can be performed by a measurement system as shown in FIG. 11, for example. The control unit 70 of this measurement system is provided with a display unit 71a and a display unit 71b. The distance sensors 66a and 66b and the control unit 70 are connected via cables 72a and 72b, respectively, and the distance between the distance sensor 66a and the reference surface 57 of the jig 51 on the holder side measured by the distance sensor 66a is displayed on the display unit 71a. The distance from the reference plane 57 of the holder-side jig 51 measured by the distance sensor 66b is displayed on the display unit 71b. The cables 72a and 72b are used for the arm 31 of the wafer chuck 15.
Be careful not to interfere with the movement of a, 31b, etc.
【００４６】かくして、このようなシステムを用いて把
持具側治具５０と保持具側治具５１の距離を測定する。
ここで、先に説明したように、ウェハチャック１５に対
して把持具側治具５０を装着する際に一方（図８では下
側）の突起６１ａ、６１ｂを嵌入させた把持溝Ｐ、Ｑの
位置と、ボート４１に対して保持具側治具５１を装着す
る際に突起部５２、５３の真ん中の突起５５を嵌入させ
た保持溝Ｒ、Ｔの位置が同じであり、また、保持具側治
具５１の基準面５７と突起部５２、５３の真ん中の突起
５５とは同一平面に形成され、更に、把持具側治具５０
の投光部６７ａ、６７ｂと受光部６８ａ、６７ｂを有す
る距離センサ６６ａ、６６ｂの前面と一方（図８では下
側）の突起６１ａ、６１ｂとの水平距離Ｌ'は上述した
間隔Ｌの５倍の長さ５Ｌに設定されている。従って、も
し把持具側治具５０の一方（図８では下側）の突起６１
ａ、６１ｂを嵌入させた把持溝Ｐ、Ｑの位置と、保持具
側治具５１の突起部５２、５３の真ん中の突起５５を嵌
入させた保持溝Ｒ、Ｔの位置において、ウェハチャック
１５とボート４１との間の相対的なずれが生じていない
ならば、上記の如く距離センサ６６ａ、６６ｂによって
測定される把持具側治具５０と保持具側治具５１との距
離は５Ｌとなる。一方、もしそのような把持溝Ｐ、Ｑの
位置と保持溝Ｒ、Ｔの位置において、ウェハチャック１
５とボート４１との間の相対的なずれが生じているなら
ば、距離センサ６６ａ、６６ｂによって測定される把持
具側治具５０と保持具側治具５１との距離は５Ｌとは異
なった値となる。このように、距離センサ６６ａ、６６
ｂによって測定された把持具側治具５０と保持具側治具
５１の距離に基づいてウェハチャック１５とボート４１
との間で被処理体Ｗを受け渡す際の相対的なずれを測定
することが可能となる。Thus, the distance between the holding tool side jig 50 and the holding tool side jig 51 is measured using such a system.
Here, as described above, when the gripping tool side jig 50 is attached to the wafer chuck 15, the gripping grooves P and Q into which the protrusions 61a and 61b on one side (the lower side in FIG. 8) are fitted are formed. The position is the same as the positions of the holding grooves R and T into which the middle protrusion 55 of the protrusions 52 and 53 is fitted when the holder-side jig 51 is attached to the boat 41, and the holder side The reference surface 57 of the jig 51 and the middle protrusion 55 of the protrusions 52 and 53 are formed on the same plane, and the jig 50 on the gripper side is further formed.
The horizontal distance L ′ between the front surfaces of the distance sensors 66a and 66b having the light emitting portions 67a and 67b and the light receiving portions 68a and 67b and one (lower side in FIG. 8) protrusions 61a and 61b is 5 times the above-described distance L. Is set to 5 L. Therefore, if one of the protrusions 61 on the gripping tool side jig 50 (lower side in FIG. 8)
At the positions of the holding grooves P and Q into which the a and 61b are fitted and the positions of the holding grooves R and T into which the middle projection 55 of the projecting portions 52 and 53 of the holder jig 51 are fitted, the wafer chuck 15 and If there is no relative displacement between the boat 41 and the boat 41, the distance between the holding tool side jig 50 and the holding tool side jig 51 measured by the distance sensors 66a and 66b as described above is 5L. On the other hand, if the positions of the gripping grooves P and Q and the positions of the holding grooves R and T are such,
If there is a relative displacement between the boat 5 and the boat 41, the distance between the holding tool side jig 50 and the holding tool side jig 51 measured by the distance sensors 66a and 66b is different from 5L. It becomes a value. In this way, the distance sensors 66a, 66
Based on the distance between the holding tool side jig 50 and the holding tool side jig 51 measured by b, the wafer chuck 15 and the boat 41
It is possible to measure a relative shift when the object W to be processed is transferred between and.
【００４７】また、この実施例のように把持具側治具５
０に二機の距離センサ６６ａ、６６ｂを設けていること
により、それら各距離センサ６６ａ、６６ｂで測定され
た測定値同士を比較することによって、ウェハチャック
１５とボート４１との間に生じた回転ずれも測定できる
ようになる。即ち、もしウェハチャック１５とボート４
１との間に回転ずれが生じた場合には、把持溝Ｐ、Ｑに
よってウェハチャック１５の所定位置に装着されている
把持具側治具５０と、保持溝Ｒ、Ｔによってボート４１
の所定位置に装着されている保持具側治具５１との間に
も回転ずれが生じることとなり、これにより距離センサ
６６ａの投光部６７ａから保持具側治具５１の基準面５
７までの距離と、距離センサ６６ｂの投光部６７ｂから
保持具側治具５１の基準面５７までの距離が等しくなら
なくなる。従って、ウェハチャック１５とボート４１と
の間に回転ずれが生じると二機の距離センサ６６ａ、６
６ｂで測定される測定値は互いに相違することとなるか
ら、それら測定値同士を比較することによって、ウェハ
チャック１５とボート４１との間に生じる回転ずれを測
定することが可能である。Further, as in this embodiment, the jig 5 on the gripping tool side is used.
By providing the two distance sensors 66a and 66b in 0, the rotations generated between the wafer chuck 15 and the boat 41 are compared by comparing the measurement values measured by the distance sensors 66a and 66b. The deviation can also be measured. That is, if the wafer chuck 15 and the boat 4
When a rotation deviation occurs between the boat 41 and the holding tool R and T, the holding tool side jig 50 mounted at a predetermined position of the wafer chuck 15 by the holding grooves P and Q, and the boat 41 by the holding grooves R and T.
There is also a rotational deviation between the holder-side jig 51 mounted at the predetermined position of the holder 51 and the reference surface 5 of the holder-side jig 51 from the light projecting portion 67a of the distance sensor 66a.
7 and the distance from the light projecting portion 67b of the distance sensor 66b to the reference surface 57 of the holder-side jig 51 are not equal to each other. Therefore, if there is a rotation deviation between the wafer chuck 15 and the boat 41, the distance sensors 66a, 6
Since the measured values measured by 6b are different from each other, it is possible to measure the rotational deviation between the wafer chuck 15 and the boat 41 by comparing the measured values with each other.
【００４８】また、以上の実施例においてウェハチャッ
ク１５とボート４１の相対的な位置合わせを行う場合
は、先ず、先と同様の手順によってウェハチャック１５
とボート４１との間に生じているずれを測定する。ここ
で、もしウェハチャック１５とボート４１との間にずれ
が生じていない場合には、距離センサ６６ａ、６６ｂに
よって測定される把持具側治具５０と保持具側治具５１
との距離は５Ｌとなる。ところが、両者間にずれが生じ
ている場合には、距離センサ６６ａ、６６ｂによって測
定される把持具側治具５０と保持具側治具５１との距離
は、もはや５Ｌとはならず、異なった測定値を示すこと
になる。In the above embodiment, when the relative position between the wafer chuck 15 and the boat 41 is adjusted, first, the wafer chuck 15 is subjected to the same procedure as above.
The displacement between the boat and the boat 41 is measured. Here, if there is no deviation between the wafer chuck 15 and the boat 41, the holding tool side jig 50 and the holding tool side jig 51 measured by the distance sensors 66a and 66b.
The distance between and is 5L. However, when there is a deviation between the two, the distance between the holding tool-side jig 50 and the holding tool-side jig 51 measured by the distance sensors 66a and 66b is no longer 5L and is different. It will show the measured value.
【００４９】そこで先ず、距離センサ６６ａ、６６ｂに
よって測定される把持具側治具５０と保持具側治具５１
との距離同士は等しいが、何れも例えば４Ｌと短くなっ
たような場合、あるいは、何れも例えば６Ｌと長くなっ
たような場合には、ウェハチャック１５に装着された左
右一対の把持部材１５ａ、１５ｂの突出長さを、適宜伸
張、短縮させることにより前後方向（図２においてＹ方
向）に調整し、距離センサ６６ａ、６６ｂによって測定
される把持具側治具５０と保持具側治具５１との距離が
何れも５Ｌとなるように矯正する。Therefore, first, the holding tool side jig 50 and the holding tool side jig 51 measured by the distance sensors 66a and 66b.
And the distance between them is equal to each other, but both are shortened to, for example, 4 L, or both are lengthened to, for example, 6 L, the pair of left and right gripping members 15a mounted on the wafer chuck 15, The protrusion length of 15b is adjusted in the front-rear direction (Y direction in FIG. 2) by appropriately extending and shortening, and the holding tool side jig 50 and the holding tool side jig 51 which are measured by the distance sensors 66a and 66b. The distance is corrected to 5L.
【００５０】一方、距離センサ６６ａと距離センサ６６
ｂによって測定された把持具側治具５０と保持具側治具
５１との距離が互いに相違するような場合、距離センサ
６６ａ測定された把持具側治具５０と保持具側治具５１
との距離が４Ｌで、距離センサ６６ｂによって測定され
た把持具側治具５０と保持具側治具５１との距離が６Ｌ
となったような場合は、ウェハチャック１５とボート４
１との間に回転ずれを生じていることになる。そこで、
そのような場合は薬液洗浄処理槽２５の底部近傍に配設
されたボート４１の取り付け姿勢を回動調節し、図２に
おいてθで示した方向に角度調整する。なお、このよう
なボート４１の取り付け姿勢を調節は三本の保持棒４
２、４３、４４を支持しているブラケット４５の取り付
け位置を調整することによって行うことができる。On the other hand, the distance sensor 66a and the distance sensor 66
When the distance between the holding tool side jig 50 and the holding tool side jig 51 measured by b is different from each other, the distance sensor 66a measures the holding tool side jig 50 and the holding tool side jig 51.
Is 4 L, and the distance between the holding tool side jig 50 and the holding tool side jig 51 measured by the distance sensor 66b is 6 L.
In such a case, the wafer chuck 15 and the boat 4
This means that there is a rotational deviation with respect to 1. Therefore,
In such a case, the mounting posture of the boat 41 arranged near the bottom of the chemical cleaning tank 25 is rotationally adjusted, and the angle is adjusted in the direction indicated by θ in FIG. In addition, adjusting the mounting posture of such a boat 41 is performed by the three holding rods 4.
This can be done by adjusting the mounting position of the bracket 45 supporting 2, 43, 44.
【００５１】かくして、以上の手順によって距離センサ
６６ａと距離センサ６６ｂによって測定される把持具側
治具５０と保持具側治具５１との距離が何れも５Ｌとな
るように、把持部材１５ａ、１５ｂの突出長さ、及びボ
ート４１の取り付け姿勢を適宜調整することにより、ウ
ェハチャック１５とボート４１との間に生じた相対的な
距離ずれ及び回転ずれをなくすことができ、両者の間で
被処理体Ｗを受け渡す際の位置合わせを行うことが可能
となる。Thus, the gripping members 15a, 15b are arranged so that the distances between the gripping tool side jig 50 and the holding tool side jig 51 measured by the distance sensor 66a and the distance sensor 66b are all 5L by the above procedure. By appropriately adjusting the protruding length of the wafer chuck 41 and the mounting posture of the boat 41, it is possible to eliminate the relative distance shift and rotation shift generated between the wafer chuck 15 and the boat 41. Positioning can be performed when the body W is handed over.
【００５２】また、以上の実施例においてウェハチャッ
ク１５とボート４１の間に生じるずれを診断する場合
は、先と同様の手順によってウェハチャック１５とボー
ト４１との間に生じているずれを測定する。そして、こ
の測定操作を、例えば月毎や週毎というように、周期的
に繰り返して行い、周期的に求めた測定値の経時的な変
化を例えばグラフや近似式などで表示する。そして、ウ
ェハチャック１５とボート４１の間に発生する相対的な
ずれの進捗状況を調査する。このように、両者間の相対
的なずれの変化を考察し、ウェハチャック１５やボート
４１の交換時期、位置調整時期などを予測、決定するこ
とが可能となる。When diagnosing the deviation between the wafer chuck 15 and the boat 41 in the above embodiment, the deviation between the wafer chuck 15 and the boat 41 is measured by the same procedure as above. . Then, this measurement operation is repeated cyclically, for example, monthly or weekly, and the change over time of the measured value obtained periodically is displayed, for example, in a graph or an approximate expression. Then, the progress of the relative displacement between the wafer chuck 15 and the boat 41 is investigated. In this manner, it is possible to predict and determine the replacement timing of the wafer chuck 15 and the boat 41, the position adjustment timing, and the like by considering the change in relative displacement between the two.
【００５３】このように、以上に説明した実施例のもの
によれば、ウェハチャック１５とボート４１に把持具側
治具５０と保持具側治具５１を装着するといった極めて
簡単な手法により、両者間の相対的なずれを正確に測
定、診断予測することができ、しかも、ウェハチャック
１５とボート４１の間で被処理体Ｗを受け渡す位置の位
置合わせも正確にできるようになる。As described above, according to the above-described embodiment, the wafer chuck 15 and the boat 41 are attached to the jig 50 on the holding tool side and the jig 51 on the holding tool side by an extremely simple method. It is possible to accurately measure and diagnose relative displacement between them, and moreover, it is possible to accurately align the position where the object W to be processed is transferred between the wafer chuck 15 and the boat 41.
【００５４】しかして、以上の実施例においては、本発
明をウエハの洗浄装置における搬送装置に適用した場合
を説明したが、本発明はこれに限らず、ウェハチャック
の如き把持具とボートの如き保持具との間で被処理体を
受け渡すように構成された、他の一般の処理装置に対し
ても適用できるものである。In the above embodiments, the case where the present invention is applied to the transfer device in the wafer cleaning device has been described. However, the present invention is not limited to this, and a holding tool such as a wafer chuck and a boat. The present invention can also be applied to other general processing apparatuses configured to transfer the object to be processed to and from the holder.
【００５５】[0055]
【発明の効果】本発明によれば、把持具に把持具側治具
を装着し、保持具に保持具側治具を装着するといった極
めて簡単な操作でありながら、把持具と保持具との間で
被処理体を受け渡す際の両者の相対的なずれを正確に測
定できるといった優れた効果がある。そして、このよう
に把持具と保持具との相対的なずれを正確に測定するこ
とによって、両者の位置合わせもできるようになる。ま
た、把持具と保持具との間で将来的に発生する相対的な
ずれを予測することによって、保持具の交換時期、位置
調整時期などを決定することも可能である。According to the present invention, the gripping tool-side jig is attached to the gripping tool, and the holding-tool-side jig is mounted to the holding tool. There is an excellent effect that it is possible to accurately measure the relative deviation between the two when the object to be processed is transferred. By accurately measuring the relative displacement between the gripping tool and the holding tool in this manner, it becomes possible to align the two. It is also possible to determine the replacement timing of the holding tool, the position adjustment timing, etc. by predicting a relative shift that will occur in the future between the gripping tool and the holding tool.
【図面の簡単な説明】[Brief description of drawings]
【図１】洗浄処理装置の斜視図FIG. 1 is a perspective view of a cleaning processing apparatus.
【図２】ずれ測定用治具が装着された搬送装置の斜視図FIG. 2 is a perspective view of a transfer device equipped with a displacement measuring jig.
【図３】ウェハチャックとボートの斜視図FIG. 3 is a perspective view of a wafer chuck and a boat.
【図４】ウェハチャックとボートの側面図FIG. 4 is a side view of the wafer chuck and the boat.
【図５】保持具側治具の正面図FIG. 5 is a front view of a holder-side jig.
【図６】保持具側治具の側面図FIG. 6 is a side view of a holder-side jig.
【図７】図５Ａ−Ａ断面矢視図FIG. 7 is a cross-sectional arrow view of FIG. 5A-A.
【図８】把持具側治具の平面図FIG. 8 is a plan view of a jig on a gripping tool side.
【図９】把持具側治具の正面図FIG. 9 is a front view of a holding tool side jig.
【図１０】把持具側治具の側面図FIG. 10 is a side view of a jig on a gripping tool side.
【図１１】測定システムの説明図FIG. 11 is an explanatory diagram of the measurement system.
１５ ウェハチャック（把持具） ４１ ボート（保持具） ５０ 把持具側治具 ５１ 保持具側治具 ５７ 基準面 ６６ａ、６６ｂ 距離センサ Ｗ 被処理体 15 wafer chuck (grasping tool) 41 boat (holding tool) 50 gripping tool side jig 51 holding tool side jig 57 reference surfaces 66a, 66b distance sensor W object to be processed
Claims (16)
渡す際の該把持具と保持具の相対的なずれを測定するた
めの装置であって、把持具に脱着自在に装着される把持
具側治具と、保持具に脱着自在に装着される保持具側治
具を備え、それら把持具側治具と保持具側治具の間の距
離を測定する測定手段を設けてなる把持具と保持具のず
れ測定装置。1. A device for measuring relative displacement between a gripping tool and a holding tool when the object to be processed is transferred between the gripping tool and the holding tool, which is detachably attached to the gripping tool. The jig on the side of the holding tool and the jig on the side of the holding tool which are detachably attached to the holding tool are provided, and the measuring means for measuring the distance between the jig on the side of the holding tool and the jig on the holding tool is provided. Device for measuring the deviation between the gripping tool and the holding tool.
に記載の把持具と保持具のずれ測定装置。2. A plurality of the measuring means are provided.
The device for measuring the deviation between the gripping tool and the holding tool according to [4].
持具側治具の一方に設けられる距離センサと、他方に形
成される距離の測定用の基準面で構成される請求項１ま
たは２に記載の把持具と保持具のずれ測定装置。3. The distance measuring device includes a distance sensor provided on one of the gripping tool side jig and the holding tool side jig, and a reference surface for measuring a distance formed on the other side. Alternatively, the shift measuring device between the gripping tool and the holding tool according to item 2.
る請求項３に記載の把持具と保持具のずれ測定装置。4. The shift measuring device between the gripping tool and the holding tool according to claim 3, wherein the distance sensor is an LED displacement sensor.
持具側治具の一方に設けられる発光センサと、他方に設
けられる受光センサで構成される請求項１または２に記
載の把持具と保持具のずれ測定装置。5. The grip according to claim 1, wherein the measuring means includes a light emitting sensor provided on one of the gripping tool side jig and the holding tool side jig, and a light receiving sensor provided on the other side. Deviation measuring device between tool and holder.
渡す際の該把持具と保持具の相対的な位置合わせを行う
方法であって、把持具に把持具側治具を装着すると共
に、保持具には保持具側治具を装着し、それら把持具側
治具と保持具側治具の間の距離を測定して、該測定値を
所望の値に一致させるように把持具と保持具の相対的な
位置合わせを行う方法。6. A method for performing relative alignment between a gripping tool and a holding tool when transferring an object to be processed between the gripping tool and the holding tool. At the same time as mounting, mount the holder-side jig to the holder, measure the distance between the gripper-side jig and the holder-side jig, and match the measured value to the desired value. A method for performing relative alignment between the gripping tool and the holding tool.
渡す際の該把持具と保持具の相対的なずれを測定するた
めに供されるものであって、把持具または保持具に脱着
自在で、かつ距離センサを備えている把持具と保持具の
ずれ測定用治具。7. A gripping tool or a holding tool for measuring relative displacement between the gripping tool and the holding tool when the object to be processed is transferred between the gripping tool and the holding tool. A jig for measuring the deviation between the gripping tool and the holding tool that is detachable from the tool and equipped with a distance sensor.
７に記載の把持具と保持具のずれ測定用治具。8. The jig for measuring the deviation between the gripping tool and the holding tool according to claim 7, comprising a plurality of the distance sensors.
る請求項７または８に記載の把持具と保持具のずれ測定
用治具。9. The jig for measuring the deviation between the gripping tool and the holding tool according to claim 7, wherein the distance sensor is an LED displacement sensor.
け渡す際の該把持具と保持具の相対的なずれを測定する
ために供されるものであって、把持具または保持具に脱
着自在で、かつ距離の測定用の基準面を備えている把持
具と保持具のずれ測定用治具。10. A gripping tool or a holding tool for measuring relative displacement between the gripping tool and the holding tool when the object to be processed is transferred between the gripping tool and the holding tool. A jig for measuring the deviation between the gripping tool and the holding tool, which is detachable from the tool and has a reference surface for measuring the distance.
け渡す際の該把持具と保持具の相対的なずれを測定する
ために供されるものであって、把持具または保持具に脱
着自在で、かつ発光センサを備えている把持具と保持具
のずれ測定用治具。11. A gripping tool or a holding tool for measuring relative displacement between the gripping tool and the holding tool when the object to be processed is transferred between the gripping tool and the holding tool. A jig for measuring the deviation between the gripping tool and the holding tool that is detachable from the tool and equipped with a luminescence sensor.
け渡す際の該把持具と保持具の相対的なずれを測定する
ために供されるものであって、把持具または保持具に脱
着自在で、かつ受光センサを備えている把持具と保持具
のずれ測定用治具。12. A gripping tool or a holding tool, which is used for measuring a relative displacement between the gripping tool and the holding tool when the object to be processed is transferred between the gripping tool and the holding tool. A jig for measuring the deviation between the gripping tool and the holding tool that is detachable from the tool and equipped with a light receiving sensor.
数備えている請求項１１または１２に記載の把持具と保
持具のずれ測定用治具。13. The jig for measuring the deviation between the holding tool and the holding tool according to claim 11 or 12, further comprising a plurality of the light emitting sensors or the light receiving sensors.
け渡しを行うものにおいて、把持具に把持具側治具を装
着すると共に、保持具には保持具側治具を装着し、それ
ら把持具側治具と保持具側治具の間の距離を測定するこ
とによって把持具と保持具の間に生じた相対的なずれを
測定する操作を周期的に行い、その測定値に基づいて、
把持具または保持具の交換時期、位置調整時期などを決
定する把持具と保持具のずれ診断方法。14. A device for delivering an object to be processed between a holding tool and a holding tool, wherein a holding tool-side jig is attached to the holding tool, and a holding tool-side jig is attached to the holding tool. The operation to measure the relative displacement between the gripper and the holder by periodically measuring the distance between the gripper-side jig and the holder-side jig is performed, and based on the measured value hand,
A method for diagnosing a shift between a gripping tool and a holding tool that determines the timing of exchanging the gripping tool or the holding tool, the timing of position adjustment, and the like.
内に被処理体を搬入して該被処理体を処理液で処理する
処理装置であって、被処理体を処理槽内に搬入する把持
具と、該把持具により処理槽内に搬入された被処理体を
前記処理槽内において保持する保持具が配置されたもの
において、把持具に脱着自在に装着される把持具側治具
及び／または保持具に脱着自在に装着される保持具側治
具、及び、それら把持具側治具と保持具側治具の間の距
離を測定する測定手段を備えるずれ測定装置により測定
された測定値に基づいて、把持具と保持具の相対的な位
置合わせを行って把持具と保持具との間で被処理体の受
け渡しを行わせる制御手段を備えていることを特徴とす
る処理装置。15. A processing apparatus for loading an object to be processed into a processing tank configured to supply the processing liquid and processing the object with the processing liquid, wherein the object is carried into the processing tank. In which a holding tool for holding the object to be processed carried into the processing tank by the holding tool in the processing tank is arranged, and the holding tool side jig is detachably mounted on the holding tool. And / or a displacement measuring device equipped with a holder-side jig that is detachably attached to the holder and a measuring unit that measures the distance between the holder-side jig and the holder-side jig. A processing apparatus comprising: a control unit that performs relative alignment between the gripping tool and the holding tool based on the measured value and transfers the object to be processed between the gripping tool and the holding tool. .
理液を供給可能に構成された処理槽内に搬入すると共
に、該搬入された被処理体を処理槽内において保持具で
保持し、被処理体を処理液で処理する方法において、把
持具に把持具側治具を装着すると共に、保持具には保持
具側治具を装着し、それら把持具側治具と保持具側治具
の間の距離を測定して、該測定値を所望の値に一致させ
るように把持具と保持具の相対的な位置合わせを行なっ
た後、把持具と保持具との間で被処理体の受け渡しを行
うことを特徴とする処理方法。16. The object to be treated grasped by the grasping tool is carried into a treatment tank configured to be capable of supplying a treatment liquid, and the carried object to be treated is held by a holder in the treatment tank, In the method of treating a treatment object with a treatment liquid, a grasping tool-side jig is attached to a grasping tool, and a retaining tool-side jig is attached to a retaining tool. After measuring the distance between them and performing relative alignment between the holding tool and the holding tool so that the measured value matches the desired value, the object to be processed is passed between the holding tool and the holding tool. The processing method characterized by performing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19723194A JP3202875B2 (en) | 1994-07-29 | 1994-07-29 | Apparatus and method for measuring misalignment between gripper and holder, jig for measuring misalignment, method for diagnosing misalignment between gripper and holder, and cleaning device and cleaning method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19723194A JP3202875B2 (en) | 1994-07-29 | 1994-07-29 | Apparatus and method for measuring misalignment between gripper and holder, jig for measuring misalignment, method for diagnosing misalignment between gripper and holder, and cleaning device and cleaning method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0846009A true JPH0846009A (en) | 1996-02-16 |
| JP3202875B2 JP3202875B2 (en) | 2001-08-27 |
Family
ID=16371031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19723194A Expired - Fee Related JP3202875B2 (en) | 1994-07-29 | 1994-07-29 | Apparatus and method for measuring misalignment between gripper and holder, jig for measuring misalignment, method for diagnosing misalignment between gripper and holder, and cleaning device and cleaning method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3202875B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8033401B2 (en) | 2007-09-12 | 2011-10-11 | Samsung Electronics Co., Ltd. | Wafer guide for preventing wafer breakage in semiconductor cleaning apparatus |
| CN107993963A (en) * | 2017-11-21 | 2018-05-04 | 长江存储科技有限责任公司 | Mechanical arm for wafer detection |
| CN110155721A (en) * | 2019-06-06 | 2019-08-23 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Transmission machine arm |
| CN110676210A (en) * | 2019-09-04 | 2020-01-10 | 芜湖德锐电子技术有限公司 | Chip fixing device |
| WO2024060277A1 (en) * | 2022-09-20 | 2024-03-28 | 台湾积体电路制造股份有限公司 | Clamping apparatus, manipulator, and mechanical apparatus |
-
1994
- 1994-07-29 JP JP19723194A patent/JP3202875B2/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8033401B2 (en) | 2007-09-12 | 2011-10-11 | Samsung Electronics Co., Ltd. | Wafer guide for preventing wafer breakage in semiconductor cleaning apparatus |
| KR101231182B1 (en) * | 2007-09-12 | 2013-02-07 | 삼성전자주식회사 | Waferguide for preventing wafer broken of semiconductor cleaning equipment |
| CN107993963A (en) * | 2017-11-21 | 2018-05-04 | 长江存储科技有限责任公司 | Mechanical arm for wafer detection |
| CN107993963B (en) * | 2017-11-21 | 2020-07-10 | 长江存储科技有限责任公司 | Mechanical arm for wafer detection |
| CN110155721A (en) * | 2019-06-06 | 2019-08-23 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Transmission machine arm |
| CN110676210A (en) * | 2019-09-04 | 2020-01-10 | 芜湖德锐电子技术有限公司 | Chip fixing device |
| WO2024060277A1 (en) * | 2022-09-20 | 2024-03-28 | 台湾积体电路制造股份有限公司 | Clamping apparatus, manipulator, and mechanical apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3202875B2 (en) | 2001-08-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI636858B (en) | Substrate transfer robot and substrate processing system | |
| KR100927301B1 (en) | Substrate Processing Apparatus and Substrate Processing Method | |
| KR100917304B1 (en) | Substrate processing apparatus | |
| US7878213B2 (en) | Substrate processing apparatus | |
| EP1737031A1 (en) | Vertical heat treating apparatus and automatic teaching method for transfer mechanism | |
| JP4999487B2 (en) | Substrate processing equipment | |
| KR100957912B1 (en) | Substrate processing apparatus | |
| KR20080061290A (en) | Substrate transporting apparatus, substrate platform shelf and substrate processing apparatus | |
| KR20080076787A (en) | Substrate processing apparatus | |
| TW201700239A (en) | Substrate conveying robot and substrate processing system | |
| JP3162704B2 (en) | Processing equipment | |
| JP3069575B2 (en) | Vertical heat treatment equipment | |
| JP3202875B2 (en) | Apparatus and method for measuring misalignment between gripper and holder, jig for measuring misalignment, method for diagnosing misalignment between gripper and holder, and cleaning device and cleaning method | |
| JP3562748B2 (en) | Substrate processing equipment | |
| JPH0786373A (en) | Substrate attitude change equipment | |
| JP4869097B2 (en) | Substrate processing equipment | |
| KR101779322B1 (en) | Wafer Cleaner with Improved Operational Pattern | |
| JP5385965B2 (en) | Substrate processing equipment | |
| JP2002299421A (en) | Notch alignment method and mechanism and semiconductor manufacturing apparatus | |
| KR100466296B1 (en) | Transfer robot and wafer array system using this robot | |
| JPH0737845A (en) | Wet treatment of substrate and treating system | |
| JP2564432Y2 (en) | Adjustment jig for substrate transfer | |
| TWI828281B (en) | Substrate treating apparatus and substrate treating method | |
| KR0159528B1 (en) | Method of loading and unloading wafer boat in vertical heat treatment apparatus | |
| JPH06302585A (en) | Method and apparatus for wet treatment of substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20010612 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |