JPH083283A - Epoxy resin composition, prepreg, and laminate - Google Patents
Epoxy resin composition, prepreg, and laminateInfo
- Publication number
- JPH083283A JPH083283A JP14418494A JP14418494A JPH083283A JP H083283 A JPH083283 A JP H083283A JP 14418494 A JP14418494 A JP 14418494A JP 14418494 A JP14418494 A JP 14418494A JP H083283 A JPH083283 A JP H083283A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- prepreg
- resin composition
- laminate
- solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Laminated Bodies (AREA)
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、例えば、プリント配線
板に用いられるエポキシ樹脂組成物、この組成物を用い
たプリプレグ及びこのプリプレグを用いた積層板に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to, for example, an epoxy resin composition used for printed wiring boards, a prepreg using this composition, and a laminated board using this prepreg.
【０００２】[0002]
【従来の技術】従来、プリント配線板等に加工される積
層板は、例えば、ガラス布等の基材にエポキシ樹脂等の
樹脂ワニスを含浸して乾燥することよってプリプレグを
作製し、このプリプレグを所要枚数重ねるとともに、こ
の片面又は両面に必要に応じて銅箔等の金属箔を重ね、
これを加熱加圧することによって製造されたものが知ら
れている。このようなプリント配線板用のエポキシ樹脂
組成物は、接着性、耐熱性及び保存安定性の観点から硬
化剤としてジシアンジアミド（Ｄｉｃｙ）を用いている
が、このＤｉｃｙを溶解できる溶剤がジメチルホルムア
ミド（ＤＭＦ）のような高沸点のアミド系の溶剤に限ら
れている。すなわち、低沸点の溶剤を使用すると、Ｄｉ
ｃｙが溶解しないため、プリプレグに吸湿性の高いＤｉ
ｃｙの結晶が析出し、水分を含有することになり、積層
板の機能が低下する。硬化剤としてＤｉｃｙを用い、溶
剤としてＤＭＦ等の高沸点の溶剤を使用したエポキシ樹
脂組成物のワニスを含浸して乾燥することよってプリプ
レグを作製した場合、このプリプレグには、ＤＭＦ等の
高沸点の溶剤が残留し易くなる。すなわち、このプリプ
レグを用いて成形された積層板にも溶剤が残留し易く、
この残留した溶剤が、はんだリフロー等の高温にさらさ
れたときに揮発して破壊し、積層板の機能が低下する。
すなわち、この積層板は、耐熱性に劣るという問題があ
った。2. Description of the Related Art Conventionally, for a laminated board processed into a printed wiring board or the like, a prepreg is prepared by impregnating a base material such as glass cloth with a resin varnish such as epoxy resin and drying the prepreg. While stacking the required number of sheets, if necessary, stack metal foil such as copper foil on one or both sides,
What was manufactured by heating and pressurizing this is known. In such an epoxy resin composition for a printed wiring board, dicyandiamide (Dicy) is used as a curing agent from the viewpoint of adhesiveness, heat resistance and storage stability. However, a solvent capable of dissolving this Dicy is dimethylformamide (DMF). ) Is limited to high boiling amide solvents. That is, when a low boiling point solvent is used, Di
Since cy does not dissolve, Di has high hygroscopicity in the prepreg.
Crystals of cy are deposited and contain water, which deteriorates the function of the laminate. When a prepreg is prepared by impregnating and drying a varnish of an epoxy resin composition in which Dicy is used as a curing agent and a solvent having a high boiling point such as DMF is used as a solvent, this prepreg has a high boiling point such as DMF. The solvent is likely to remain. That is, the solvent is likely to remain in the laminated plate molded using this prepreg,
The residual solvent volatilizes and breaks when exposed to high temperatures such as solder reflow, and the function of the laminated plate deteriorates.
That is, this laminated plate had a problem of poor heat resistance.
【０００３】[0003]
【発明が解決しようとする課題】本発明は上記の事情に
鑑みてなされたもので、その目的とするところは、耐熱
性に優れた積層板が得られるエポキシ樹脂組成物、耐熱
性に優れた積層板が得られるプリプレグ及び耐熱性に優
れた積層板を提供することにある。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object thereof is to obtain an epoxy resin composition capable of obtaining a laminated board having excellent heat resistance, and to provide excellent heat resistance. It is intended to provide a prepreg from which a laminate is obtained and a laminate having excellent heat resistance.
【０００４】[0004]
【課題を解決するための手段】本発明の請求項１に係る
エポキシ樹脂組成物は、１分子中に２つ以上のエポキシ
基を含むエポキシ樹脂と、ジシアンジアミドと、沸点が
１３０℃以下の溶剤とを含む混合液を７０〜１３０℃で
加熱して、エポキシ樹脂とジシアンジアミドとを溶解
し、上記混合液を溶液化してなることを特徴とする。The epoxy resin composition according to claim 1 of the present invention comprises an epoxy resin containing two or more epoxy groups in one molecule, dicyandiamide, and a solvent having a boiling point of 130 ° C. or less. Is heated at 70 to 130 ° C. to dissolve the epoxy resin and dicyandiamide, and the mixed solution is made into a solution.
【０００５】本発明の請求項２に係るエポキシ樹脂組成
物は、上記溶剤が、沸点１３０℃以下の成分を溶剤の全
量に対して９９重量％以上含有していることを特徴とす
る。The epoxy resin composition according to claim 2 of the present invention is characterized in that the solvent contains a component having a boiling point of 130 ° C. or lower in an amount of 99% by weight or more based on the total amount of the solvent.
【０００６】本発明の請求項３に係るプリプレグは、請
求項１又は請求項２に記載のエポキシ樹脂組成物を用い
ることを特徴とする。A prepreg according to claim 3 of the present invention is characterized by using the epoxy resin composition according to claim 1 or 2.
【０００７】本発明の請求項４に係る積層板は、請求項
３記載のプリプレグを用いることを特徴とする。A laminated plate according to a fourth aspect of the present invention is characterized by using the prepreg according to the third aspect.
【０００８】以下、本発明を詳述する。本発明の請求項
１に係るエポキシ樹脂組成物に用いられる１分子中に２
つ以上のエポキシ基を含むエポキシ樹脂としては、積層
板の樹脂として一般に使用されている任意のものが使用
でき、例えば、ビスフェノールＡ型エポキシ樹脂、ビス
フェノールＦ型エポキシ樹脂、ビスフェノールＳ型エポ
キシ樹脂、フェノールノボラック型エポキシ樹脂、クレ
ゾールノボラック型エポキシ樹脂、ビスフェノールＡ型
ノボラック型エポキシ樹脂、２，６−キシレノールダイ
マーのグリシジルエーテル化エポキシ樹脂、ビスフェノ
ールＦ型ノボラック型エポキシ樹脂、イソシアヌレート
型エポキシ樹脂、ヒダントイン型エポキシ樹脂、３官能
型エポキシ樹脂や４官能型エポキシ樹脂等の多官能型エ
ポキシ樹脂、グリシジルアミン型エポキシ樹脂、ジアミ
ノフェニルエーテルのグリシジル化エポキシ樹脂、脂環
式エポキシ樹脂、あるいはこれらの臭素化等ハロゲン化
された難燃性樹脂等が例示される。これらのエポキシ樹
脂を単独で使用することもでき又は複数の種類を併用す
ることもできる。The present invention will be described in detail below. 2 in 1 molecule used in the epoxy resin composition according to claim 1 of the present invention.
As the epoxy resin containing one or more epoxy groups, any of those generally used as a resin for laminated boards can be used, and examples thereof include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, and phenol. Novolac type epoxy resin, cresol novolac type epoxy resin, bisphenol A type novolak type epoxy resin, 2,6-xylenol dimer glycidyl etherified epoxy resin, bisphenol F type novolac type epoxy resin, isocyanurate type epoxy resin, hydantoin type epoxy resin Multifunctional epoxy resin such as trifunctional epoxy resin and tetrafunctional epoxy resin, glycidyl amine epoxy resin, glycidylated epoxy resin of diaminophenyl ether, alicyclic epoxy resin, Rui flame retardant resin or the like which is these brominated and halogenated and the like. These epoxy resins can be used alone or in combination of two or more kinds.
【０００９】本発明の請求項１に係るエポキシ樹脂組成
物に用いられる硬化剤としては、ジシアンジアミド（Ｄ
ｉｃｙ）を使用する。The curing agent used in the epoxy resin composition according to claim 1 of the present invention is dicyandiamide (D
icy) is used.
【００１０】本発明の請求項１に係るエポキシ樹脂組成
物に用いられる溶剤としては、沸点が１３０℃以下の溶
剤を使用する。沸点が１３０℃以下の成分を溶剤の全量
に対して９９重量％以上含有することが望ましい。沸点
が１３０℃以下の溶剤として、メチルエチルケトン（Ｍ
ＥＫ）、アセトン、エチレングリコールモノメチルエー
テル、プロピレングリコールモノメチルエーテル、メタ
ノール、エタノール、トルエン、キシレン、又はジオキ
サン等を単独で使用することもでき又は複数の種類を併
用して混合溶媒として用いることもできる。As the solvent used in the epoxy resin composition according to the first aspect of the present invention, a solvent having a boiling point of 130 ° C. or less is used. It is desirable to contain a component having a boiling point of 130 ° C. or less in an amount of 99% by weight or more based on the total amount of the solvent. Methyl ethyl ketone (M
EK), acetone, ethylene glycol monomethyl ether, propylene glycol monomethyl ether, methanol, ethanol, toluene, xylene, dioxane or the like can be used alone or in combination of two or more kinds as a mixed solvent.
【００１１】なお、硬化促進剤として、イミダゾール化
合物、３級アミン又は３フッ化ホウ素錯塩類等公知のも
のから選択して用いてもよい。The curing accelerator may be selected from known ones such as imidazole compounds, tertiary amines or boron trifluoride complex salts.
【００１２】このような各成分を配合してなる混合液
は、通常、Ｄｉｃｙが溶解していないので懸濁液になっ
ている。この懸濁液を加熱することにより、Ｄｉｃｙが
エポキシ樹脂と反応して溶解し、混合液を溶液化してエ
ポキシ樹脂組成物を得る。溶液化の条件としては、加熱
温度が７０〜１３０℃で時間が１０〜１２０分が好まし
い。すなわち、加熱温度が７０℃未満の場合には、Ｄｉ
ｃｙがエポキシ樹脂と反応し難いため、Ｄｉｃｙがエポ
キシ樹脂組成物の中で析出する。このように、Ｄｉｃｙ
が析出したエポキシ樹脂組成物を用いた積層板は、耐吸
湿性及び耐熱性等が悪くなる。The mixed solution prepared by mixing the above components is usually a suspension because Dicy is not dissolved. By heating this suspension, Dicy reacts with the epoxy resin and dissolves, and the mixed solution is made into a solution to obtain an epoxy resin composition. As a solution condition, a heating temperature of 70 to 130 ° C. and a time of 10 to 120 minutes are preferable. That is, when the heating temperature is lower than 70 ° C., Di
Since cy does not easily react with the epoxy resin, Dicy precipitates in the epoxy resin composition. Like this, Dicy
The laminated board using the epoxy resin composition in which is deposited has poor moisture absorption resistance and heat resistance.
【００１３】この溶液化した本発明のエポキシ樹脂組成
物は、そのまま樹脂ワニスとすることができる特徴を持
っている。このワニス化されたエポキシ樹脂組成物は、
例えば、ガラスクロス、ガラスペーパー若しくはガラス
マット等のガラス繊維基材、有機繊維基材、クラフト紙
又はリンター紙等に含浸し、乾燥機中で１２０〜１８０
℃、３〜１０分間程度乾燥することにより、半硬化状態
（Ｂステージ状態）のプリプレグを得ることができる。The solution-type epoxy resin composition of the present invention has a feature that it can be directly used as a resin varnish. This varnished epoxy resin composition,
For example, a glass fiber substrate such as glass cloth, glass paper or glass mat, an organic fiber substrate, kraft paper or linter paper is impregnated and dried in a dryer at 120 to 180.
A prepreg in a semi-cured state (B stage state) can be obtained by drying at 3 ° C. for about 3 to 10 minutes.
【００１４】本発明によって得られるプリプレグを、例
えば、１４０〜２００℃、１０〜５０ｋｇ／ｃｍ2 の範
囲で加熱・加圧して印刷配線用金属張積層板を得る。こ
の場合の金属箔としては、例えば銅、アルミニウム、ス
テンレス等が使用され、所要枚数のプリプレグとともに
積層成形することができる。このようにして得られた金
属張積層板に回路を形成して、この回路を形成した金属
張積層板の上下にプリプレグを配し、その外側に金属箔
を配することによって、多層金属張積層板を得ることが
できる。The prepreg obtained by the present invention is heated / pressurized at 140 to 200 ° C. and 10 to 50 kg / cm 2 to obtain a metal-clad laminate for printed wiring. As the metal foil in this case, for example, copper, aluminum, stainless steel or the like is used, and can be laminated and formed with a required number of prepregs. A circuit is formed on the metal-clad laminate obtained in this manner, prepregs are arranged above and below the metal-clad laminate on which the circuit is formed, and a metal foil is arranged on the outer side of the prepreg to form a multilayer metal-clad laminate. The board can be obtained.
【００１５】以上により、耐熱性に優れた積層板を得る
ことのできるエポキシ樹脂組成物、このエポキシ樹脂組
成物を用いたプリプレグ及びこのプリプレグを用いた積
層板を提供することができる。As described above, it is possible to provide an epoxy resin composition capable of obtaining a laminated board having excellent heat resistance, a prepreg using the epoxy resin composition, and a laminated board using the prepreg.
【００１６】[0016]
【実施例】以下、本発明を実施例によって具体的に説明
する。EXAMPLES The present invention will be specifically described below with reference to examples.
【００１７】（実施例１）１分子中に２つ以上のエポキ
シ基を含むエポキシ樹脂として、エポキシ当量５００の
臭素化ビスフェノールＡ型エポキシ樹脂（ＹＤＢ−５０
０：東都化成社製）を沸点が８０℃のメチルエチルケト
ン（ＭＥＫ）で希釈して樹脂分濃度８０重量％にしたも
の１２５ｇを用い、硬化剤として、ジシアンジアミド
（Ｄｉｃｙ）１．７ｇ、硬化促進剤として、２エチル４
メチルイミダゾール（２Ｅ４ＭＺ：四国化成社製）０．
１５ｇ、さらに、溶剤として、沸点が１２４℃のエチレ
ングリコールモノメチルエーテル３０ｇを混合し、混合
液を作製した。この混合液はＤｉｃｙが未溶解の懸濁液
になっていた。この懸濁液を８０℃で６０分間加熱撹拌
し、反応させた結果、Ｄｉｃｙが溶解し、混合液が透明
な溶液となり、Ｄｉｃｙの析出がないエポキシ樹脂組成
物を得た。このエポキシ樹脂組成物のゲルタイムは、１
７０℃で２２０秒であった。Example 1 As an epoxy resin containing two or more epoxy groups in one molecule, a brominated bisphenol A type epoxy resin (YDB-50 having an epoxy equivalent of 500) was used.
0: manufactured by Tohto Kasei Co., Ltd.) was diluted with methyl ethyl ketone (MEK) having a boiling point of 80 ° C. to a resin concentration of 80% by weight, and 125 g was used. As a curing agent, dicyandiamide (Dicy) 1.7 g 2 ethyl 4
Methylimidazole (2E4MZ: manufactured by Shikoku Kasei) 0.
15 g, and 30 g of ethylene glycol monomethyl ether having a boiling point of 124 ° C. were mixed as a solvent to prepare a mixed liquid. This mixed solution was a suspension in which Dicy was not dissolved. The suspension was heated and stirred at 80 ° C. for 60 minutes to cause a reaction, and as a result, Dicy was dissolved and the mixed solution became a transparent solution to obtain an epoxy resin composition without precipitation of Didy. The gel time of this epoxy resin composition is 1
It was 220 seconds at 70 ° C.
【００１８】このエポキシ樹脂組成物の溶液を樹脂ワニ
スとし、この樹脂ワニスをＭＩＬ規格仕様７６２８タイ
プのガラス布（７６２８Ｗ：旭シェーベル社製）に樹脂
含有率がプリプレグの全量に対して４２重量％となるよ
うに含浸して乾燥機で乾燥し、ゲルタイムが１７０℃で
１００秒となるようにプリプレグを作製した。A solution of this epoxy resin composition was used as a resin varnish, and the resin varnish was applied to a MIL standard specification 7628 type glass cloth (7628W: manufactured by Asahi Shabel Co.) with a resin content of 42% by weight based on the total amount of the prepreg. The resulting product was impregnated with the above to obtain a prepreg with a gel time of 100 seconds at 170 ° C.
【００１９】次いで、このプリプレグを８枚重ね、その
両面に１８μｍの銅箔を配し、さらにこの外側に金属プ
レートを配置して、温度１７０℃、圧力４０ｋｇ／ｃｍ
2 で加熱加圧し、厚み１．６ｍｍの両面銅張積層板を得
た。このようにして得たエポキシ樹脂組成物、プリプレ
グ及び積層板について、Ｄｉｃｙの析出性、プリプレグ
及び積層板の揮発分並びに積層板の耐熱性を評価した。
その結果を表１に示した。Next, eight prepregs were stacked, a copper foil of 18 μm was placed on both sides of the prepreg, and a metal plate was placed on the outside, and the temperature was 170 ° C. and the pressure was 40 kg / cm.
By heating and pressurizing at 2 , a double-sided copper clad laminate having a thickness of 1.6 mm was obtained. With respect to the epoxy resin composition, the prepreg and the laminated board thus obtained, the Dicy depositability, the volatile content of the prepreg and the laminated board and the heat resistance of the laminated board were evaluated.
The results are shown in Table 1.
【００２０】（実施例２）１分子中に２つ以上のエポキ
シ基を含むエポキシ樹脂として、エポキシ当量３９０の
臭素化多官能エポキシ樹脂（ＶＦ２８０１：三井石油化
学社製）を沸点が８０℃のメチルエチルケトン（ＭＥ
Ｋ）で希釈して樹脂分濃度８０重量％にしたもの１２５
ｇを用い、硬化剤として、ジシアンジアミド（Ｄｉｃ
ｙ）２．５ｇ、硬化促進剤として、２エチル４メチルイ
ミダゾール（２Ｅ４ＭＺ：四国化成社製）０．１０ｇ、
さらに、溶剤として、沸点が１２４℃のエチレングリコ
ールモノメチルエーテル３０ｇを混合し、混合液を作製
した。この混合液はＤｉｃｙが未溶解の懸濁液になって
いた。この懸濁液を８０℃で６０分間加熱撹拌し、反応
させた結果、Ｄｉｃｙが溶解し、混合液が透明な溶液と
なり、Ｄｉｃｙの析出がないエポキシ樹脂組成物を得
た。このエポキシ樹脂組成物のゲルタイムは、１７０℃
で３１０秒であった。(Example 2) As an epoxy resin containing two or more epoxy groups in one molecule, a brominated polyfunctional epoxy resin (VF2801 manufactured by Mitsui Petrochemical Co., Ltd.) having an epoxy equivalent of 390 was used and methyl ethyl ketone having a boiling point of 80 ° C. (ME
K) diluted to a resin concentration of 80% by weight 125
g, and dicyandiamide (Dic
y) 2.5 g, as a curing accelerator, 2 ethyl 4-methylimidazole (2E4MZ: manufactured by Shikoku Kasei) 0.10 g,
Further, 30 g of ethylene glycol monomethyl ether having a boiling point of 124 ° C. was mixed as a solvent to prepare a mixed liquid. This mixed solution was a suspension in which Dicy was not dissolved. This suspension was heated and stirred at 80 ° C. for 60 minutes to cause a reaction, and as a result, Dicy was dissolved and the mixed solution became a transparent solution to obtain an epoxy resin composition without precipitation of Didy. The gel time of this epoxy resin composition is 170 ° C.
It was 310 seconds.
【００２１】その他は、実施例１と同様にして、プリプ
レグ及び積層板を得た。このようにして得たエポキシ樹
脂組成物、プリプレグ及び積層板について、Ｄｉｃｙの
析出性、プリプレグ及び積層板の揮発分並びに積層板の
耐熱性を評価した。その結果を表１に示した。Others were the same as in Example 1 to obtain a prepreg and a laminated plate. With respect to the epoxy resin composition, the prepreg and the laminated board thus obtained, the Dicy depositability, the volatile content of the prepreg and the laminated board and the heat resistance of the laminated board were evaluated. The results are shown in Table 1.
【００２２】（比較例１）１分子中に２つ以上のエポキ
シ基を含むエポキシ樹脂として、エポキシ当量５００の
臭素化ビスフェノールＡ型エポキシ樹脂（ＹＤＢ−５０
０：東都化成社製）を沸点が８０℃のメチルエチルケト
ン（ＭＥＫ）で希釈して樹脂分濃度８０重量％にしたも
の１２５ｇを用い、硬化剤として、ジシアンジアミド
（Ｄｉｃｙ）１．７ｇ、硬化促進剤として、２エチル４
メチルイミダゾール（２Ｅ４ＭＺ：四国化成社製）０．
１５ｇ、さらに、溶剤として、沸点が１５３℃のジメチ
ルホルムアミド（ＤＭＦ）３０ｇを混合し、混合液を作
製した。この混合液は、Ｄｉｃｙの析出がなく、透明な
エポキシ樹脂組成物の溶液となり、このエポキシ樹脂組
成物のゲルタイムは、１７０℃で２４５秒であった。Comparative Example 1 As an epoxy resin containing two or more epoxy groups in one molecule, a brominated bisphenol A type epoxy resin having an epoxy equivalent of 500 (YDB-50).
0: manufactured by Tohto Kasei Co., Ltd.) was diluted with methyl ethyl ketone (MEK) having a boiling point of 80 ° C. to a resin concentration of 80% by weight, and 125 g was used. As a curing agent, dicyandiamide (Dicy) 1.7 g 2 ethyl 4
Methylimidazole (2E4MZ: manufactured by Shikoku Kasei) 0.
15 g, and further 30 g of dimethylformamide (DMF) having a boiling point of 153 ° C. were mixed as a solvent to prepare a mixed liquid. This mixed solution was a solution of a transparent epoxy resin composition without the precipitation of Dicy, and the gel time of this epoxy resin composition was 245 seconds at 170 ° C.
【００２３】その他は、実施例１と同様にして、プリプ
レグ及び積層板を得た。このようにして得たエポキシ樹
脂組成物、プリプレグ及び積層板について、Ｄｉｃｙの
析出性、プリプレグ及び積層板の揮発分並びに積層板の
耐熱性を評価した。その結果を表１に示した。Others were the same as in Example 1 to obtain a prepreg and a laminated plate. With respect to the epoxy resin composition, the prepreg and the laminated board thus obtained, the Dicy depositability, the volatile content of the prepreg and the laminated board and the heat resistance of the laminated board were evaluated. The results are shown in Table 1.
【００２４】（比較例２）１分子中に２つ以上のエポキ
シ基を含むエポキシ樹脂として、エポキシ当量５００の
臭素化ビスフェノールＡ型エポキシ樹脂（ＹＤＢ−５０
０：東都化成社製）を沸点が８０℃のメチルエチルケト
ン（ＭＥＫ）で希釈して樹脂分濃度８０重量％にしたも
の１２５ｇを用い、硬化剤として、ジシアンジアミド
（Ｄｉｃｙ）１．７ｇ、硬化促進剤として、２エチル４
メチルイミダゾール（２Ｅ４ＭＺ：四国化成社製）０．
１５ｇ、さらに、沸点が１２４℃のエチレングリコール
モノメチルエーテル３０ｇを混合し、混合液を作製し
た。この混合液はＤｉｃｙが未溶解の懸濁液になってい
た。このＤｉｃｙの析出した懸濁液であるエポキシ樹脂
組成物のゲルタイムは、１７０℃で２５５秒であった。(Comparative Example 2) As an epoxy resin containing two or more epoxy groups in one molecule, a brominated bisphenol A type epoxy resin having an epoxy equivalent of 500 (YDB-50).
0: manufactured by Tohto Kasei Co., Ltd.) was diluted with methyl ethyl ketone (MEK) having a boiling point of 80 ° C. to a resin concentration of 80% by weight, and 125 g was used. As a curing agent, dicyandiamide (Dicy) 1.7 g 2 ethyl 4
Methylimidazole (2E4MZ: manufactured by Shikoku Kasei) 0.
15 g and further 30 g of ethylene glycol monomethyl ether having a boiling point of 124 ° C. were mixed to prepare a mixed liquid. This mixed solution was a suspension in which Dicy was not dissolved. The gel time of the epoxy resin composition, which is a suspension in which Dicy was deposited, was 255 seconds at 170 ° C.
【００２５】その他は、実施例１と同様にして、プリプ
レグ及び積層板を得た。このようにして得たエポキシ樹
脂組成物、プリプレグ及び積層板について、Ｄｉｃｙの
析出性、プリプレグ及び積層板の揮発分並びに積層板の
１２１℃２気圧でのＰＣＴ耐熱性を測定し、耐熱性を評
価した。その結果を表１に示した。Others were the same as in Example 1 to obtain a prepreg and a laminated plate. The epoxy resin composition, the prepreg and the laminate thus obtained were evaluated for the heat resistance by measuring the dicy deposition property, the volatile content of the prepreg and the laminate and the PCT heat resistance of the laminate at 121 ° C. and 2 atm. did. The results are shown in Table 1.
【００２６】[0026]
【表１】 [Table 1]
【００２７】実施例１及び実施例２並びに比較例１及び
比較例２で得た樹脂ワニスのＤｉｃｙの析出の有無の状
態は、目視により観察し、揮発分は、プリプレグ又は銅
箔を除去した積層板を１６０℃の乾燥機で１５分間加熱
してデシケータ中で室温まで冷却後、減量分を重量％で
表し、ＰＣＴ耐熱性は、銅箔を除去した積層板を１２１
℃２気圧で処理後、２６０℃の半田層に浸漬し、積層板
のミーズリングやふくれの有無を目視により調べて、積
層板にミーズリングやふくれが発生しない１２１℃２気
圧での処理時間を表１に示した。The resin varnishes obtained in Examples 1 and 2 and Comparative Examples 1 and 2 were visually observed for the presence or absence of Dicy deposition, and the volatile matter was laminated by removing the prepreg or copper foil. The plate was heated in a desiccator at 160 ° C. for 15 minutes and cooled to room temperature in a desiccator, and the weight loss was expressed in weight%.
After processing at ℃ 2 atm, dip it in a solder layer at 260 ℃, visually inspect the laminated plate for measling and swelling. The results are shown in Table 1.
【００２８】以上の結果、実施例１及び実施例２は、比
較例１及び比較例２に比べてプリプレグと積層板の揮発
分が小さく、積層板の１２１℃２気圧でのＰＣＴ耐熱性
に優れていることが確認できた。As a result of the above, in Examples 1 and 2, the volatile matter of the prepreg and the laminate were smaller than those of Comparative Examples 1 and 2, and the laminate had excellent PCT heat resistance at 121 ° C. and 2 atmospheres. I was able to confirm.
【００２９】[0029]
【発明の効果】本発明の請求項１に係るエポキシ樹脂組
成物は、上記のように構成されているので、本発明のエ
ポキシ樹脂組成物によると、耐熱性に優れた積層板が得
られる。Since the epoxy resin composition according to the first aspect of the present invention is configured as described above, the epoxy resin composition of the present invention can provide a laminate having excellent heat resistance.
【００３０】本発明の請求項２に係るプリプレグは、上
記のように構成されているので、本発明のプリプレグに
よると、耐熱性に優れた積層板が得られる。Since the prepreg according to the second aspect of the present invention is configured as described above, the prepreg of the present invention can provide a laminate having excellent heat resistance.
【００３１】本発明の請求項３に係る積層板は、上記の
ように構成されているので、耐熱性に優れる。Since the laminated plate according to the third aspect of the present invention is constructed as described above, it has excellent heat resistance.
Claims (4)
エポキシ樹脂と、ジシアンジアミドと、沸点が１３０℃
以下の溶剤とを含む混合液を７０〜１３０℃で加熱し
て、エポキシ樹脂とジシアンジアミドとを溶解し、上記
混合液を溶液化してなることを特徴とするエポキシ樹脂
組成物。1. An epoxy resin containing two or more epoxy groups in one molecule, dicyandiamide, and a boiling point of 130 ° C.
An epoxy resin composition, characterized in that a mixed solution containing the following solvent is heated at 70 to 130 ° C. to dissolve the epoxy resin and dicyandiamide, and the mixed solution is made into a solution.
溶剤の全量に対して９９重量％以上含有していることを
特徴とする請求項１記載のエポキシ樹脂組成物。2. The epoxy resin composition according to claim 1, wherein the solvent contains a component having a boiling point of 130 ° C. or lower in an amount of 99% by weight or more based on the total amount of the solvent.
樹脂組成物を用いることを特徴とするプリプレグ。3. A prepreg comprising the epoxy resin composition according to claim 1 or 2.
を特徴とする積層板。4. A laminated board using the prepreg according to claim 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14418494A JPH083283A (en) | 1994-06-27 | 1994-06-27 | Epoxy resin composition, prepreg, and laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14418494A JPH083283A (en) | 1994-06-27 | 1994-06-27 | Epoxy resin composition, prepreg, and laminate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH083283A true JPH083283A (en) | 1996-01-09 |
Family
ID=15356161
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14418494A Pending JPH083283A (en) | 1994-06-27 | 1994-06-27 | Epoxy resin composition, prepreg, and laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH083283A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002048236A1 (en) * | 2000-12-14 | 2002-06-20 | Hitachi Chemical Co., Ltd. | Varnish for laminate or prepreg, laminate or prepreg obtained with this varnish, and printed circuit board made with this laminate or prepreg |
-
1994
- 1994-06-27 JP JP14418494A patent/JPH083283A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002048236A1 (en) * | 2000-12-14 | 2002-06-20 | Hitachi Chemical Co., Ltd. | Varnish for laminate or prepreg, laminate or prepreg obtained with this varnish, and printed circuit board made with this laminate or prepreg |
| US7041399B2 (en) | 2000-12-14 | 2006-05-09 | Hitachi Chemical Co., Ltd. | Varnish for laminate or prepreg, laminate or prepreg obtained with this varnish, and printed circuit board made with this laminate or prepreg |
| KR100777500B1 (en) * | 2000-12-14 | 2007-11-16 | 히다치 가세고교 가부시끼가이샤 | Varnish for laminate or prepreg, laminate or prepreg obtained with this varnish, and printed circuit board made with this laminate or prepreg |
| US7390571B2 (en) | 2000-12-14 | 2008-06-24 | Hitachi Chemical Co., Ltd. | Varnish for laminate or prepreg, laminate or prepreg prepared using this varnish, and printed wiring board prepared using this laminate or prepreg |
| JP2008163329A (en) * | 2000-12-14 | 2008-07-17 | Hitachi Chem Co Ltd | Varnish for use in laminated sheet or prepreg, laminated sheet or prepreg produced from this varnish, and printed wiring board using this laminated sheet or prepreg |
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