JPH08290396A - Backup board for drilling - Google Patents
Backup board for drillingInfo
- Publication number
- JPH08290396A JPH08290396A JP13094995A JP13094995A JPH08290396A JP H08290396 A JPH08290396 A JP H08290396A JP 13094995 A JP13094995 A JP 13094995A JP 13094995 A JP13094995 A JP 13094995A JP H08290396 A JPH08290396 A JP H08290396A
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- board
- drilling
- plate
- shaped body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明はプリント配線板製造工
程中の、部品挿入穴、スルーホール等の穴明け加工工程
で使用するバックアップボードに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a backup board used in a process of forming holes for inserting parts, through holes, etc. during a process of manufacturing a printed wiring board.
【０００２】[0002]
【従来技術およびその問題点】ドリル加工用バックアッ
プボードは、穴明け加工時のドリル刃によるプリント配
線板の銅箔バリ発生を抑制する目的で使用され、フェノ
ール樹脂を含浸し乾燥した紙基材を、厚に合った所定板
枚数を重ね、これを加熱加圧して一体化した積層板（以
下、ベーク板と云う）が一般的に使用されている。最近
では、安価な材料としてハードボード材をそのまま使用
する場合もある。しかし、これらドリル加工用バックア
ップボードは、その表面がプリント配線板表面の銅箔と
較べ柔らかいため、ある程度のバリ発生を抑制すること
はできるが、完全にプリント配線板の銅箔を保持するに
は不十分である。プリント配線板の銅箔にバリが残ると
ドリル加工穴が極***（一般的には、穴径０．３ｍｍφ
以下）では、プリント配線板のメッキ工程でメッキ不良
の原因になる頻度が高くなることから、ドリル加工用バ
ックアップボードの銅箔バリの発生を抑制する効果の大
きいものが要求されている。銅箔のバリ発生を抑制する
ためには、ドリル加工用バックアップボードの表面を平
滑にし、且つ硬度を上げることが必要がある。ベーク板
の硬度を上げる方法の一つとしては、フェノール樹脂の
架橋密度を上げることが考えられるが、フェノール樹脂
だけでは硬度が所望のところまであがらずバリ抑制もま
だ不十分である。またドリル加工用バックアップボード
の表面硬度を上げる手段として、高硬度樹脂のメラミン
樹脂等を用いることも考えられるが、メラミン樹脂は脆
いため、プリント配線板のサイズに切断する際に切断面
より内側に向かって割れが生じると云う問題があった。
発明者等は、係る点に鑑みて、表面の硬度を上げる手段
として表面に金属箔を貼り合わせたものにつき鋭意検討
をなして本発明をする至ったのである。[Background Art and its problems] Backup boards for drilling are used for the purpose of suppressing copper foil burrs on printed wiring boards due to the drill blade during drilling. Generally, a laminated plate (hereinafter, referred to as a bake plate) in which a predetermined number of plates suitable for the thickness are stacked and heated and pressed to be integrated is used. Recently, hard board materials are sometimes used as they are as inexpensive materials. However, since these backup boards for drilling have a softer surface than the copper foil on the surface of the printed wiring board, it is possible to suppress burr generation to some extent, but to completely retain the copper foil on the printed wiring board. Is insufficient. If burrs are left on the copper foil of the printed wiring board, the drilled hole will be a very small hole (generally 0.3 mmφ
In the following), the frequency of causing plating failure in the plating process of the printed wiring board is high, and therefore, a large effect of suppressing the generation of copper foil burr on the backup board for drilling is required. In order to suppress the burr generation of the copper foil, it is necessary to smooth the surface of the backup board for drilling and increase the hardness. One of the methods for increasing the hardness of the bake plate is to increase the crosslink density of the phenol resin, but the phenol resin alone does not achieve the desired hardness and the burr suppression is still insufficient. It is also conceivable to use melamine resin, which is a high hardness resin, as a means to increase the surface hardness of the backup board for drilling, but melamine resin is brittle, so when cutting to the size of a printed wiring board, put it inside the cut surface. There was a problem that a crack was generated toward it.
In view of this point, the inventors of the present invention have made extensive studies as to a method in which a metal foil is attached to the surface as a means for increasing the hardness of the surface, and arrived at the present invention.
【０００３】[0003]
【問題点を解決するための手段】この発明のドリル加工
用バックアップボードは、板状体の片面または両面に銅
箔を一体に接合した構成であり、板状体として紙基材フ
ェノール樹脂積層板又はハードボードを用いることがで
き、銅箔として厚みが１２〜７０μｍの範囲であるもの
が好ましい。A backup board for drilling according to the present invention has a structure in which a copper foil is integrally bonded to one side or both sides of a plate-like body, and a paper-based phenol resin laminated plate is used as the plate-like body. Alternatively, a hard board can be used, and a copper foil having a thickness in the range of 12 to 70 μm is preferable.
【０００４】尚、板状体であるベーク板の表面に銅箔を
一体に接合したものとして、プリント配線板用銅張り紙
基材フェノール樹脂積層板があるが、このプリント配線
板用銅張り紙基材フェノール樹脂積層板は、予め銅箔
に、プリント回路パターンの加熱時等の接着強度を保持
する為に接着剤を塗工したものを用い、この接着剤がド
リル加工時の発熱により溶融してドリル穴内に移動付着
（スミア）する原因となり、好ましくない。以下、実施
例・比較例を用いてこの発明を説明する。There is a copper-clad paper base material for a printed wiring board, which is a phenolic resin laminated board, in which a copper foil is integrally joined to the surface of a bake board which is a plate-shaped body. For the phenol resin laminate, use a copper foil coated beforehand with an adhesive to maintain the adhesive strength when the printed circuit pattern is heated, etc. It is not preferable because it causes migration (smear) in the holes. Hereinafter, the present invention will be described using examples and comparative examples.
【０００５】[0005]
【実施例１】フェノール樹脂を含浸し乾燥した紙基材
を、厚に合った所定板枚数を重ね、更に両面に３５μｍ
銅箔を重ね、全体を加熱加圧して銅箔と共に積層一体化
したバックアップボードを作成した。このバックアップ
ボードのドリル径０．２ｍｍφのドリル加工性を試験
し、その結果を表１に示した。[Example 1] A paper base material impregnated with a phenol resin and dried was laminated with a predetermined number of plates according to the thickness, and further 35 μm on both sides.
A copper foil was overlaid, and the whole was heated and pressed to form a backup board that was laminated and integrated with the copper foil. This backup board was tested for drill workability with a drill diameter of 0.2 mmφ, and the results are shown in Table 1.
【０００６】[0006]
【比較例１】実施例１で用いたフェノール樹脂を含浸し
乾燥した紙基材を、厚に合った所定板枚数を重ね、これ
を実施例１の加熱加圧条件と同じ条件で積層一体化して
バックアップボードを作成した。このバックアップボー
ドのドリル径０．２ｍｍφのドリル加工性を試験し、そ
の結果を表１に示した。[Comparative Example 1] Paper substrates impregnated with the phenol resin used in Example 1 and dried were stacked in a predetermined number of sheets according to the thickness, and these were laminated and integrated under the same heating and pressing conditions as in Example 1. Created a backup board. This backup board was tested for drill workability with a drill diameter of 0.2 mmφ, and the results are shown in Table 1.
【０００７】[0007]
【比較例２】比較例１で用いたフェノール樹脂を含浸し
乾燥した紙基材を、厚に合った所定板枚数を重ね、比較
例１で用いた加熱加圧条件よりフェノール樹脂の架橋密
度を高めるため、より高温でより長時間の条件で加熱加
圧して積層一体化したバックアップボードを作成した。
このバックアップボードのドリル径０．２ｍｍφのドリ
ル加工性を試験し、その結果を表１に示した。[Comparative Example 2] The paper base material impregnated with the phenolic resin used in Comparative Example 1 was dried by stacking a predetermined number of sheets according to the thickness, and the crosslinking density of the phenolic resin was determined according to the heating and pressing conditions used in Comparative Example 1. In order to increase the temperature, heating and pressurization was performed under conditions of higher temperature and longer time, and a backup board integrated and laminated was prepared.
This backup board was tested for drill workability with a drill diameter of 0.2 mmφ, and the results are shown in Table 1.
【０００７】[0007]
【比較例３】実施例１で用いた銅箔に代えてアルミニウ
ム箔を用いた以外は実施例１と同じ条件でバックアップ
ボードを作成した。このバックアップボードのドリル径
０．２ｍｍφのドリル加工性を試験し、その結果を表１
に示した。Comparative Example 3 A backup board was prepared under the same conditions as in Example 1 except that the aluminum foil was used instead of the copper foil used in Example 1. This backup board was tested for drill workability with a drill diameter of 0.2 mmφ, and the results are shown in Table 1.
It was shown to.
【０００８】[0008]
【表１】 [Table 1]
【０００９】[0009]
【発明の効果】この発明のドリル加工用バックアップボ
ードは、ドリルビットの磨耗、ピッチングを損すること
なくプリント配線板銅箔のバリ発生が殆どないドリル穴
明け加工ができる、と云う効果がある。EFFECTS OF THE INVENTION The backup board for drilling of the present invention has an effect that drilling can be carried out without damaging the wear and pitting of the drill bit and causing almost no burr on the copper foil of the printed wiring board.
Claims (3)
接合したドリル加工用バックアップボード。1. A backup board for drilling, wherein a copper foil is integrally joined to one or both sides of a plate-shaped body.
はハードボードである請求項１記載のドリル加工用バッ
クアップボード。2. The backup board for drilling according to claim 1, wherein the plate-shaped body is a paper-based phenolic resin laminate or a hardboard.
ることを特徴とする請求項１記載のドリル加工用バック
アップボード。3. The backup board for drilling according to claim 1, wherein the thickness of the copper foil is in the range of 12 to 70 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13094995A JPH08290396A (en) | 1995-04-18 | 1995-04-18 | Backup board for drilling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13094995A JPH08290396A (en) | 1995-04-18 | 1995-04-18 | Backup board for drilling |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08290396A true JPH08290396A (en) | 1996-11-05 |
Family
ID=15046429
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13094995A Pending JPH08290396A (en) | 1995-04-18 | 1995-04-18 | Backup board for drilling |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08290396A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10217199A (en) * | 1996-09-21 | 1998-08-18 | Risho Kogyo Co Ltd | Entry board for drill machining |
| KR100648358B1 (en) * | 2005-08-26 | 2006-11-23 | 주식회사 유원 | A backup-board for drilling a PCB |
| CN111634084A (en) * | 2020-05-28 | 2020-09-08 | 广东中晨电子科技有限公司 | PCB back drilling cover plate and manufacturing method thereof |
-
1995
- 1995-04-18 JP JP13094995A patent/JPH08290396A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10217199A (en) * | 1996-09-21 | 1998-08-18 | Risho Kogyo Co Ltd | Entry board for drill machining |
| KR100648358B1 (en) * | 2005-08-26 | 2006-11-23 | 주식회사 유원 | A backup-board for drilling a PCB |
| CN111634084A (en) * | 2020-05-28 | 2020-09-08 | 广东中晨电子科技有限公司 | PCB back drilling cover plate and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
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Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20041126 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20050104 |
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| A521 | Written amendment |
Effective date: 20050304 Free format text: JAPANESE INTERMEDIATE CODE: A523 |
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| RD02 | Notification of acceptance of power of attorney |
Effective date: 20050304 Free format text: JAPANESE INTERMEDIATE CODE: A7422 |
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| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20050405 |