JPH08288343A - Checker for printed board - Google Patents
Checker for printed boardInfo
- Publication number
- JPH08288343A JPH08288343A JP8981895A JP8981895A JPH08288343A JP H08288343 A JPH08288343 A JP H08288343A JP 8981895 A JP8981895 A JP 8981895A JP 8981895 A JP8981895 A JP 8981895A JP H08288343 A JPH08288343 A JP H08288343A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- inspection
- inspecting
- measuring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Length Measuring Devices By Optical Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、プリント基板に実装さ
れた表面実装部品（ＩＣ、ＬＳＩ、チップ部品等）のハ
ンダ形状検査を主として行なうプリント基板検査装置に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board inspection apparatus which mainly performs a solder shape inspection of surface mount components (IC, LSI, chip components, etc.) mounted on a printed circuit board.
【０００２】[0002]
【従来の技術】図２は従来のこの種のプリント基板検査
装置の主要部分を示す図である。図２において１は検査
対象のプリント基板であり、このプリント基板１はいく
つかの基板固定手段２によりＸＹテーブル３に固定され
ている。このＸＹテーブル３はＸ軸駆動手段４およびＹ
軸駆動手段５により駆動され、検査経路に応じてＸ−Ｙ
方向に移動するものである。プリント基板１上方にはプ
リント基板１に対して垂直方向つまりＺ軸方向に移動可
能なカメラ６を備えた測定ヘッド７が装着されており、
このカメラ６においてプリント基板１面上の各部品のハ
ンダ形状が撮像される。そして撮像された各部品のハン
ダ形状に基づき画像処理装置８においてそのハンダ形状
の特徴量（はんだぬれ高さ、ぬれ角等）が演算され、そ
の特徴量を基に良否判定手段９において各部品のハンダ
の良否が判定されることになる。2. Description of the Related Art FIG. 2 is a diagram showing a main part of a conventional printed circuit board inspection apparatus of this type. In FIG. 2, reference numeral 1 denotes a printed circuit board to be inspected, and this printed circuit board 1 is fixed to the XY table 3 by some board fixing means 2. The XY table 3 includes an X-axis drive unit 4 and a Y-axis drive unit 4.
It is driven by the axis drive means 5 and X-Y according to the inspection path.
It moves in the direction. A measuring head 7 having a camera 6 movable in a direction perpendicular to the printed circuit board 1, that is, in the Z-axis direction is mounted above the printed circuit board 1.
The camera 6 takes an image of the solder shape of each component on the surface of the printed board 1. Then, based on the imaged solder shape of each component, the image processing device 8 calculates the characteristic amount of the solder shape (solder wetting height, wetting angle, etc.), and based on the calculated characteristic amount, the quality determination unit 9 determines each component. The quality of the solder will be determined.
【０００３】図３はプリント基板１面上に実装されてい
る表面実装ＬＳＩ２０と、この実装ＬＳＩ２０のＩＣリ
ード２１と基板とが接着している部分をカメラ６で撮像
した像の例とを示す図である。図３の右側に示すように
基板面２２上に実装されている表面実装ＬＳＩ２０から
伸びている複数のＩＣリード２１が各々前記基板面２２
上にハンダ２３により固定されている。そして図３の左
側に示すカメラ視野２４の範囲で、カメラ６はハンダ２
３のぬれ高さ２５、ぬれ角２６部分を撮像している。FIG. 3 is a diagram showing a surface mounting LSI 20 mounted on the surface of a printed circuit board 1 and an example of an image taken by a camera 6 of a portion where the IC lead 21 of the mounting LSI 20 and the substrate are bonded. Is. As shown on the right side of FIG. 3, a plurality of IC leads 21 extending from the surface-mounted LSI 20 mounted on the board surface 22 are respectively formed on the board surface 22.
It is fixed on the top by solder 23. In the range of the camera visual field 24 shown on the left side of FIG.
The image of the wetting height 25 of FIG.
【０００４】図４は従来のプリント基板検査装置の制御
系統を示すブロック図である。図４における検査経路生
成器１４は、基板１面上の各部品の実装位置に基づいた
検査経路を生成し移動指令生成手段１２に出力する。移
動指令生成手段１２は前記検査経路を基に、ＸＹテーブ
ル３のＸ軸方向およびＹ軸方向の移動量を生成しテーブ
ル駆動手段１１に与えるとともに、カメラ６のＺ軸方向
の移動量を生成しカメラ駆動手段１０に与える。また移
動指令生成手段１２は、カメラ６において撮像すべきプ
リント基板１面での位置を機械位置監視手段１５へ通知
する。FIG. 4 is a block diagram showing a control system of a conventional printed circuit board inspection apparatus. The inspection path generator 14 in FIG. 4 generates an inspection path based on the mounting position of each component on the surface of the board 1 and outputs the inspection path to the movement command generating means 12. The movement command generation means 12 generates movement amounts of the XY table 3 in the X-axis direction and the Y-axis direction based on the inspection path and supplies the movement amounts to the table driving means 11, and also generates movement amounts of the camera 6 in the Z-axis direction. It is given to the camera driving means 10. Further, the movement command generation means 12 notifies the machine position monitoring means 15 of the position on the printed circuit board 1 surface to be imaged by the camera 6.
【０００５】テーブル駆動手段１１では移動指令生成手
段１２から与えられたＸ軸方向およびＹ軸方向の移動量
を基にＸ軸駆動手段４およびＹ軸駆動手段５を駆動させ
ＸＹテーブル３を動かす。またカメラ駆動手段１０は移
動指令生成手段１２から与えられたＺ軸方向の移動量を
基にカメラ６を備えた測定ヘッド７を動かす。一方機械
位置監視手段１５は、常にカメラ６の現在位置を監視し
ており、カメラ６が移動指令生成手段１２から通知され
た撮像位置（ハンダ上部）に到来すると、カメラ６に対
し撮像指令Ｓを出力する。The table driving means 11 drives the X-axis driving means 4 and the Y-axis driving means 5 to move the XY table 3 based on the movement amounts in the X-axis direction and the Y-axis direction given from the movement command generating means 12. Further, the camera driving means 10 moves the measuring head 7 equipped with the camera 6 based on the movement amount in the Z-axis direction given from the movement command generating means 12. On the other hand, the machine position monitoring means 15 constantly monitors the current position of the camera 6, and when the camera 6 arrives at the imaging position (upper part of the solder) notified from the movement command generation means 12, sends an imaging command S to the camera 6. Output.
【０００６】カメラ６は、機械位置監視手段１５から撮
像指令Ｓを受けるとその位置で撮像を行ない、このカメ
ラ６により撮像された画像は画像処理装置８に送られ
る。前記画像は画像処理装置８におけるハンダ形状抽出
手段８１により雑音除去、細線化等の画像処理が施さ
れ、さらに形状特徴量演算手段８２によりぬれ高さやぬ
れ角度等の特徴量が演算される。良否判定手段９は、こ
れら特徴量を基にハンダの良否を判定する。When the camera 6 receives an image pickup command S from the machine position monitoring means 15, the camera 6 takes an image at that position, and the image picked up by this camera 6 is sent to the image processing device 8. The image is subjected to image processing such as noise removal and thinning by the solder shape extracting means 81 in the image processing device 8, and the feature quantity such as the wetting height and the wetting angle is calculated by the shape feature quantity computing means 82. The quality determination unit 9 determines the quality of the solder based on these feature amounts.
【０００７】[0007]
【発明が解決しようとする課題】上述した従来のプリン
ト基板検査装置では、図２に示すようにプリント基板１
の各辺はいくつかの基板固定手段２により固定されてい
るが、基板１の中央部を支持することはできない。この
ため実装されている各部品の重量により基板１自体にそ
りが生じ、また基板原料の材質によってはもともとそり
を生じている基板もある。これらのそり量は数１００μ
ｍ〜数mmに及ぶことがある。基板１にそりが生じている
場合、図３の左側に示す像のように基板面２２をカメラ
視野２４の中央に設定し０．１mm程度のＩＣリード２１
の高さを測定する場合、０．２mm程度の基板１のそりが
あることにより、像がカメラ６の視野２４内に収まりき
れなくなる。このためカメラ６において適切な画像を撮
像することができず、ハンダ付けの良否の検査が行なえ
なくなるという問題が生じる。このような事情により、
そりが生じている基板においても適切なハンダ形状の検
査が可能な検査装置が要求されている。In the conventional printed circuit board inspection apparatus described above, as shown in FIG.
Each side of is fixed by some substrate fixing means 2, but the central part of the substrate 1 cannot be supported. Therefore, the substrate 1 itself is warped due to the weight of each mounted component, and depending on the material of the substrate material, some substrates are originally warped. The amount of these sleds is several hundred μ
It may range from m to several mm. When the substrate 1 is warped, as shown in the image on the left side of FIG.
When measuring the height of the substrate 1, the warp of the substrate 1 of about 0.2 mm causes the image to not fit within the field of view 24 of the camera 6. For this reason, the camera 6 cannot capture an appropriate image, and the problem of the quality of soldering cannot be inspected. Due to such circumstances,
There is a demand for an inspection apparatus capable of inspecting an appropriate solder shape even on a substrate having warpage.
【０００８】本発明の目的は、そりを生じたプリント基
板に対しても精度良く実装部品のハンダ形状等の検査を
行なうことができるプリント基板検査装置を提供するこ
とにある。An object of the present invention is to provide a printed circuit board inspecting apparatus capable of accurately inspecting the solder shape and the like of mounted components even on a printed circuit board having a warp.
【０００９】[0009]
【課題を解決するための手段】上記課題を解決し目的を
達成するために、本発明のプリント基板検査装置は以下
の如く構成されている。 （１）本発明のプリント基板検査装置は、プリント基板
に対し光学式測定手段を相対的に移動させ、前記プリン
ト基板の実装部品の検査を行なうプリント基板検査装置
において、前記プリント基板のそり量を測定する測定手
段と、前記プリント基板面上での検査経路を生成する検
査経路生成手段と、前記測定手段にて測定されたそり量
に基づき前記検査経路生成手段にて生成された検査経路
を補正する補正手段と、この補正手段により補正された
検査経路で前記プリント基板の検査を前記光学式測定手
段により行なう検査手段とから構成されている。 （２）本発明のプリント基板検査装置は、プリント基板
に対し光学式測定手段を相対的に移動させ、前記プリン
ト基板の実装部品の検査を行なうプリント基板検査装置
において、前記プリント基板面上での検査経路を生成す
る検査経路生成手段と、この検査経路生成手段にて生成
された検査経路で前記プリント基板の検査を前記光学式
測定手段により行なう検査手段と、この検査手段での検
査とともに前記プリント基板のそり量を測定する測定手
段と、この測定手段にて測定されたそり量に基づき前記
検査経路生成手段にて生成された検査経路を補正する補
正手段とから構成されている。In order to solve the above problems and achieve the object, the printed circuit board inspection apparatus of the present invention is configured as follows. (1) The printed circuit board inspecting device of the present invention is a printed circuit board inspecting device for inspecting mounted components of the printed circuit board by moving an optical measuring device relative to the printed circuit board, and measuring the warpage amount of the printed circuit board. Measuring means for measuring, inspection path generating means for generating an inspection path on the printed circuit board surface, and correction of the inspection path generated by the inspection path generating means based on the amount of warpage measured by the measuring means. Correction means and an inspection means for inspecting the printed circuit board by the optical measuring means on the inspection path corrected by the correction means. (2) The printed circuit board inspecting device of the present invention is a printed circuit board inspecting device for inspecting a mounted component of the printed circuit board by moving an optical measuring device relative to the printed circuit board. An inspection path generating means for generating an inspection path, an inspection means for inspecting the printed circuit board by the optical measuring means on the inspection path generated by the inspection path generating means, and the inspection together with the inspection by the optical measuring means. It comprises a measuring means for measuring the warp amount of the substrate, and a correcting means for correcting the inspection path generated by the inspection path generating means based on the warp amount measured by the measuring means.
【００１０】[0010]
【作用】上記手段（１）（２）を講じた結果、それぞれ
次のような作用が生じる。 （１）本発明のプリント基板検査装置においては、測定
されたそり量に基づき検査経路を補正し、その経路で前
記プリント基板の検査を行なうので、そりを生じた基板
でも基板面をカメラの視野の中央にとらえることが可能
となり、そりによる検査不可能な箇所を大幅に減らすこ
とができる。 （２）本発明のプリント基板検査装置においては、検査
を行なうとともに前記プリント基板のそり量を測定し、
そのそり量を基に検査経路を補正するので、検査手段が
検査を行なった箇所から次に検査を行なう箇所に移動す
る際に検査経路を補正することにより、より有効な箇所
での検査を行なうことができる。As a result of taking the above measures (1) and (2), the following effects occur. (1) In the printed circuit board inspecting apparatus of the present invention, the inspection path is corrected based on the measured warpage amount, and the printed circuit board is inspected along the path. It is possible to capture in the center of, and it is possible to greatly reduce the non-inspectable parts due to the sled. (2) In the printed circuit board inspecting device of the present invention, the inspection is performed and the warpage amount of the printed circuit board is measured,
Since the inspection path is corrected based on the amount of warpage, the inspection means corrects the inspection path when moving from the place where the inspection is performed to the place where the inspection is performed next, so that the inspection is performed at a more effective place. be able to.
【００１１】[0011]
【実施例】図１は本発明の一実施例に係るプリント基板
検査装置の構成を示すブロック図である。なお図１にお
いて上述した図４と同一部分には同一符号を付してあ
る。図１において１６は測長器であり、測長器１６は補
正データ生成手段１７および補正データ記憶手段１８を
介して移動指令補正手段１３に接続している。測長器１
６はプリント基板１上で走査し、例えば部品が装着され
ていない複数の箇所で基板１と測長器１６自身との距離
を測定することにより、これら複数の測定結果に基づい
て基板１のそり量を求める。この測長器１６にて求めら
れたそり量は補正データ生成手段１７に送られる。補正
データ生成手段１７は前記そり量より後述するＸＹテー
ブル３のＸ軸方向、Ｙ軸方向、およびカメラ６のＺ軸方
向のそれぞれの移動補正量（主としてＺ軸方向）を求
め、補正データ記憶手段１８に記憶する。DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a block diagram showing the structure of a printed circuit board inspection apparatus according to an embodiment of the present invention. In FIG. 1, the same parts as those in FIG. 4 described above are designated by the same reference numerals. In FIG. 1, reference numeral 16 is a length measuring device, and the length measuring device 16 is connected to the movement command correcting means 13 via a correction data generating means 17 and a correction data storing means 18. Length measuring machine 1
6 scans the printed circuit board 1 to measure the distance between the circuit board 1 and the length measuring device 16 itself at a plurality of locations where no components are mounted, and the warp of the circuit board 1 is performed based on the plurality of measurement results. Find the amount. The warpage amount obtained by the length measuring device 16 is sent to the correction data generating means 17. The correction data generation means 17 obtains the movement correction amounts (mainly the Z axis direction) of the XY table 3 to be described later in the X axis direction, the Y axis direction, and the camera 6 in the Z axis direction, respectively, and the correction data storage means. Store in 18.
【００１２】図１において１４は検査経路生成器であ
り、この検査経路生成器１４も移動指令補正手段１３に
接続している。この移動指令補正手段１３は移動指令生
成手段１２を介してテーブル駆動手段１１、機械位置監
視手段１５、カメラ駆動手段１０に接続している。テー
ブル駆動手段１１はＸ・Ｙモータ（Ｘ軸駆動手段４、Ｙ
軸駆動手段５）へ、カメラ駆動手段１０はＺモータへ各
々通じており、機械位置監視手段１５はカメラ７に接続
している。カメラ７は画像処理装置８を介して良否判定
手段９に接続している。なお画像処理装置８はハンダ形
状抽出手段８１と形状特徴量演算手段８２とを備えてい
る。In FIG. 1, reference numeral 14 is an inspection path generator, which is also connected to the movement command correction means 13. The movement command correcting means 13 is connected to the table driving means 11, the machine position monitoring means 15, and the camera driving means 10 via the movement command generating means 12. The table driving means 11 is an X / Y motor (X-axis driving means 4, Y
The axis drive means 5) and the camera drive means 10 communicate with the Z motor, respectively, and the machine position monitoring means 15 is connected to the camera 7. The camera 7 is connected to the quality determination unit 9 via the image processing device 8. The image processing device 8 includes a solder shape extracting unit 81 and a shape feature amount calculating unit 82.
【００１３】上記移動指令補正手段１３は、検査経路生
成器１４にて生成された経路情報を入力すると、補正デ
ータ記憶手段１８に記憶されているＸ軸、Ｙ軸、Ｚ軸各
方向の補正量を読み出す。そしてこの各軸方向の補正量
を基に前記経路情報を補正し移動指令生成手段１２に出
力する。移動指令生成手段１２は移動指令補正手段１３
から入力した補正済みの経路情報を基に、ＸＹテーブル
３のＸ軸方向およびＹ軸方向の移動量を生成しテーブル
駆動手段１１に与えるとともに、カメラ６のＺ軸方向の
移動量を生成しカメラ駆動手段１０に与える。また移動
指令生成手段１２は、カメラ６において撮像すべきプリ
ント基板１面での位置を機械位置監視手段１５へ通知す
る。When the path information generated by the inspection path generator 14 is input, the movement command correction means 13 receives the correction amounts in the X-axis, Y-axis, and Z-axis directions stored in the correction data storage means 18. Read out. Then, the path information is corrected based on the correction amount in each axial direction and output to the movement command generating means 12. The movement command generation means 12 is a movement command correction means 13
On the basis of the corrected route information input from, the movement amount of the XY table 3 in the X-axis direction and the Y-axis direction is generated and given to the table drive means 11, and the movement amount of the camera 6 in the Z-axis direction is generated. It is given to the driving means 10. Further, the movement command generation means 12 notifies the machine position monitoring means 15 of the position on the printed circuit board 1 surface to be imaged by the camera 6.
【００１４】テーブル駆動手段１１では移動指令生成手
段１２から与えられたＸ軸方向およびＹ軸方向の移動量
を基に前記Ｘ・Ｙモータ（Ｘ軸駆動手段４、Ｙ軸駆動手
段５）を駆動させＸＹテーブル３を動かす。またカメラ
駆動手段１０は移動指令生成手段１２から与えられたＺ
軸方向の移動量を基に、前記Ｚモータを駆動させカメラ
６を備えた測定ヘッド７を動かす。ここでプリント基板
１面にてそりが生じている箇所における測定ヘッド７の
Ｚ軸方向の移動量はそのそり量に応じて補正されている
ため、カメラ６と基板１面との距離をそりが生じていな
い正常な箇所と同一に保つことができる。一方機械位置
監視手段１５は、常にカメラ６の現在位置を監視してお
り、カメラ６が移動指令生成手段１２から通知された撮
像位置（ハンダ上部）に到来すると、カメラ６に対し撮
像指令Ｓを出力する。The table drive means 11 drives the XY motors (X-axis drive means 4, Y-axis drive means 5) based on the movement amounts in the X-axis direction and the Y-axis direction given from the movement command generation means 12. Then move the XY table 3. Further, the camera driving means 10 receives Z given from the movement command generating means 12.
Based on the amount of movement in the axial direction, the Z motor is driven to move the measuring head 7 equipped with the camera 6. Since the amount of movement of the measuring head 7 in the Z-axis direction at the portion where the warp occurs on the printed circuit board 1 surface is corrected according to the amount of warp, the distance between the camera 6 and the printed circuit board 1 surface is warped. It can be kept the same as the normal part that has not occurred. On the other hand, the machine position monitoring means 15 constantly monitors the current position of the camera 6, and when the camera 6 arrives at the imaging position (upper part of the solder) notified from the movement command generation means 12, sends an imaging command S to the camera 6. Output.
【００１５】以降、上記図４に基づき説明したと同様に
動作し、カメラ６にて撮像された画像について雑音除
去、細線化等の画像処理が施され、ぬれ高さやぬれ角度
等の特徴量が演算され、これら特徴量を基にハンダの良
否を判定することになる。After that, the same operation as described above with reference to FIG. 4 is performed, and the image picked up by the camera 6 is subjected to image processing such as noise removal, thinning, and the like, and feature amounts such as a wetting height and a wetting angle are obtained. The quality of the solder is calculated based on these calculated feature amounts.
【００１６】（変形例）上記実施例に示されたプリント
基板検査装置は下記の変形例を含んでいる。 (1) 上記実施例では、測長器１６にて基板１のそり量を
測定した後、そのそり量に応じて検査経路を補正し、そ
の補正された検査経路で検査を行なったが、検査を行な
うと同時に測長器１６にてそり量を測定し、そのそり量
に応じて検査経路を補正するようにしてもよい。 (2) 測長器１６の機能を、カメラ６および画像処理手段
８により兼用するようにしてもよい。 (3) 上記測長器１６には、レーザ測長器を用いてもよい
し接触式のタッチセンサで各所を測定してもよい。また
スリット光を照射し光切断法により基板１のそり形状を
測定してもよい。なお基板１のそりはゆるやかな形状変
化であるため、測定された点以外のそり量は、近接する
測定点のそり量を内挿することで得られる。 (4) 上記実施例ではハンダ形状の検査を行なったが、本
発明はハンダ形状に限らず各実装部品の形状の検査にも
適用できる。(Modification) The printed circuit board inspection apparatus shown in the above embodiment includes the following modifications. (1) In the above embodiment, after the warp amount of the substrate 1 is measured by the length measuring device 16, the inspection route is corrected according to the warp amount, and the inspection is performed on the corrected inspection route. The warp amount may be measured by the length measuring device 16 at the same time as the above step, and the inspection route may be corrected according to the warp amount. (2) The function of the length measuring device 16 may be shared by the camera 6 and the image processing means 8. (3) As the length measuring device 16, a laser length measuring device may be used, or a contact type touch sensor may be used to measure each position. Alternatively, the warp shape of the substrate 1 may be measured by irradiating with slit light and using a light cutting method. Since the warp of the substrate 1 is a gradual change in shape, the warp amounts other than the measured points can be obtained by interpolating the warp amounts of the adjacent measurement points. (4) Although the solder shape is inspected in the above embodiment, the present invention can be applied not only to the solder shape but also to the shape of each mounted component.
【００１７】（実施例のまとめ）実施例に示された構成
および作用効果をまとめると次の通りである。 ［１］実施例に示されたプリント基板検査装置は、プリ
ント基板１に対し光学式測定手段（６）を相対的に移動
させ、前記プリント基板１の実装部品の検査を行なうプ
リント基板検査装置において、前記プリント基板１のそ
り量を測定する測定手段（１６）と、前記プリント基板
１面上での検査経路を生成する検査経路生成手段１４
と、前記測定手段（１６）にて測定されたそり量に基づ
き前記検査経路生成手段１４にて生成された検査経路を
補正する補正手段１３と、この補正手段１３により補正
された検査経路で前記プリント基板１の検査を前記光学
式測定手段（６）により行なう検査手段とから構成され
ている。(Summary of Embodiments) The configuration and operational effects shown in the embodiments are summarized as follows. [1] The printed circuit board inspecting apparatus shown in the embodiment is a printed circuit board inspecting apparatus for inspecting mounted parts of the printed circuit board 1 by moving the optical measuring means (6) relative to the printed circuit board 1. , A measuring means (16) for measuring the warp amount of the printed circuit board 1, and an inspection path generating means 14 for generating an inspection path on the surface of the printed circuit board 1.
And a correction means 13 for correcting the inspection path generated by the inspection path generation means 14 based on the warp amount measured by the measurement means (16), and the inspection path corrected by the correction means 13. The printed circuit board 1 is inspected by the optical measuring means (6).
【００１８】このように上記プリント基板検査装置にお
いては、測定されたそり量に基づき検査経路を補正し、
その経路で前記プリント基板１の検査を行なうので、そ
りを生じた基板でも基板面をカメラの視野の中央にとら
えることが可能となり、そりによる検査不可能な箇所を
大幅に減らすことができる。 ［２］実施例に示されたプリント基板検査装置は、プリ
ント基板１に対し光学式測定手段（６）を相対的に移動
させ、前記プリント基板１の実装部品の検査を行なうプ
リント基板検査装置において、前記プリント基板１面上
での検査経路を生成する検査経路生成手段１４と、この
検査経路生成手段１４にて生成された検査経路で前記プ
リント基板１の検査を前記光学式測定手段（６）により
行なう検査手段と、この検査手段での検査とともに前記
プリント基板１のそり量を測定する測定手段（１６）
と、この測定手段（１６）にて測定されたそり量に基づ
き前記検査経路生成手段１４にて生成された検査経路を
補正する補正手段１３とから構成されている。As described above, in the printed circuit board inspection apparatus, the inspection path is corrected based on the measured warpage amount,
Since the printed circuit board 1 is inspected along the route, it is possible to catch the substrate surface in the center of the field of view of the camera even with a substrate having a warp, and it is possible to greatly reduce the number of uninspectable portions due to the warp. [2] The printed circuit board inspecting apparatus shown in the embodiment is a printed circuit board inspecting apparatus for inspecting mounted components of the printed circuit board 1 by moving the optical measuring means (6) relative to the printed circuit board 1. , An inspection path generation means 14 for generating an inspection path on the surface of the printed board 1, and an inspection of the printed board 1 by the inspection path generated by the inspection path generation means 14 by the optical measuring means (6). And a measuring means (16) for measuring the warp amount of the printed circuit board 1 together with the inspection by the inspection means.
And a correcting means 13 for correcting the inspection path generated by the inspection path generating means 14 based on the amount of warp measured by the measuring means (16).
【００１９】このように上記プリント基板検査装置にお
いては、検査を行なうとともに前記プリント基板１のそ
り量を測定し、そのそり量を基に検査経路を補正するの
で、検査手段が検査を行なった箇所から次に検査を行な
う箇所に移動する際に検査経路を補正することにより、
より有効な箇所での検査を行なうことができる。As described above, in the printed circuit board inspecting apparatus, the inspection is performed, the warp amount of the printed circuit board 1 is measured, and the inspection route is corrected based on the warp amount. By correcting the inspection route when moving from the next to the place to be inspected,
It is possible to carry out inspections at more effective locations.
【００２０】[0020]
【発明の効果】本発明によれば、そりを生じたプリント
基板に対しても精度良く実装部品のハンダ形状等の検査
を行なうことができるプリント基板検査装置を提供でき
る。According to the present invention, it is possible to provide a printed circuit board inspection apparatus capable of accurately inspecting the solder shape of a mounted component even on a printed circuit board having a warp.
【図１】本発明の一実施例に係るプリント基板検査装置
の構成を示すブロック図。FIG. 1 is a block diagram showing a configuration of a printed circuit board inspection device according to an embodiment of the present invention.
【図２】従来例に係るプリント基板検査装置の主要部分
を示す図。FIG. 2 is a diagram showing a main part of a printed circuit board inspection device according to a conventional example.
【図３】従来例に係るプリント基板面上に実装されてい
る表面実装ＬＳＩとカメラで撮像した像の例とを示す
図。FIG. 3 is a diagram showing a surface-mounted LSI mounted on a printed circuit board surface according to a conventional example and an example of an image captured by a camera.
【図４】従来例に係るプリント基板検査装置の制御系統
を示すブロック図。FIG. 4 is a block diagram showing a control system of a printed circuit board inspection device according to a conventional example.
１…プリント基板 ２…基板固定手段 ３…ＸＹテーブル ４…Ｘ軸駆動手段 ５…Ｙ軸駆動手段 ６…カメラ ７…測定ヘッド ８…画像処理装置 ８１…ハンダ形状抽出手段 ８２…形状特徴量演
算手段 ９…良否判定手段 １０…カメラ駆動手段 １１…テーブル駆動手段 １２…移動指令生成
手段 １３…移動指令補正手段 １４…検査経路生成
器 １５…機械位置監視手段 １６…測長器 １７…補正データ生成手段 １８…補正データ記
憶手段 ２０…表面実装ＬＳＩ ２１…ＩＣリード ２２…基板面 ２３…ハンダ ２４…カメラ視野 ２５…ぬれ高さ ２６…ぬれ角DESCRIPTION OF SYMBOLS 1 ... Printed circuit board 2 ... Substrate fixing means 3 ... XY table 4 ... X-axis drive means 5 ... Y-axis drive means 6 ... Camera 7 ... Measuring head 8 ... Image processing device 81 ... Solder shape extraction means 82 ... Shape feature amount calculation means 9 ... Pass / fail judgment means 10 ... Camera drive means 11 ... Table drive means 12 ... Movement command generation means 13 ... Movement command correction means 14 ... Inspection path generator 15 ... Machine position monitoring means 16 ... Length measuring device 17 ... Correction data generation means 18 ... Correction data storage means 20 ... Surface mount LSI 21 ... IC lead 22 ... Board surface 23 ... Solder 24 ... Camera field of view 25 ... Wetting height 26 ... Wetting angle
Claims (2)
的に移動させ、前記プリント基板の実装部品の検査を行
なうプリント基板検査装置において、 前記プリント基板のそり量を測定する測定手段と、 前記プリント基板面上での検査経路を生成する検査経路
生成手段と、 前記測定手段にて測定されたそり量に基づき前記検査経
路生成手段にて生成された検査経路を補正する補正手段
と、 この補正手段により補正された検査経路で前記プリント
基板の検査を前記光学式測定手段により行なう検査手段
と、 を具備したことを特徴とするプリント基板検査装置。1. A printed circuit board inspection apparatus for inspecting mounted components of the printed circuit board by moving an optical measuring device relative to the printed circuit board, the measuring means for measuring a warp amount of the printed circuit board, Inspection path generation means for generating an inspection path on the printed circuit board surface; correction means for correcting the inspection path generated by the inspection path generation means based on the amount of warpage measured by the measurement means; A printed circuit board inspecting device, comprising: an inspection unit that inspects the printed circuit board by the optical measuring unit on an inspection path corrected by the unit.
的に移動させ、前記プリント基板の実装部品の検査を行
なうプリント基板検査装置において、 前記プリント基板面上での検査経路を生成する検査経路
生成手段と、 この検査経路生成手段にて生成された検査経路で前記プ
リント基板の検査を前記光学式測定手段により行なう検
査手段と、 この検査手段での検査とともに前記プリント基板のそり
量を測定する測定手段と、 この測定手段にて測定されたそり量に基づき前記検査経
路生成手段にて生成された検査経路を補正する補正手段
と、 を具備したことを特徴とするプリント基板検査装置。2. A printed circuit board inspection apparatus for inspecting mounted components of the printed circuit board by moving an optical measuring device relative to the printed circuit board, wherein an inspection path is generated on the surface of the printed circuit board. Generating means, inspecting means for inspecting the printed circuit board by the optical measuring means on the inspection path generated by the inspecting path generating means, and measuring the warp amount of the printed circuit board together with the inspection by the inspecting means. A printed circuit board inspection device comprising: a measuring unit; and a correcting unit that corrects the inspection path generated by the inspection path generating unit based on the amount of warpage measured by the measuring unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8981895A JPH08288343A (en) | 1995-04-14 | 1995-04-14 | Checker for printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8981895A JPH08288343A (en) | 1995-04-14 | 1995-04-14 | Checker for printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08288343A true JPH08288343A (en) | 1996-11-01 |
Family
ID=13981337
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8981895A Withdrawn JPH08288343A (en) | 1995-04-14 | 1995-04-14 | Checker for printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08288343A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7884949B2 (en) | 2003-02-06 | 2011-02-08 | Koh Young Technology Inc. | Three-dimensional image measuring apparatus |
| JP2018165655A (en) * | 2017-03-28 | 2018-10-25 | 凸版印刷株式会社 | Object measurement control device and object measurement control method |
-
1995
- 1995-04-14 JP JP8981895A patent/JPH08288343A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7884949B2 (en) | 2003-02-06 | 2011-02-08 | Koh Young Technology Inc. | Three-dimensional image measuring apparatus |
| JP2018165655A (en) * | 2017-03-28 | 2018-10-25 | 凸版印刷株式会社 | Object measurement control device and object measurement control method |
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