JPH08269173A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPH08269173A JPH08269173A JP7120795A JP7120795A JPH08269173A JP H08269173 A JPH08269173 A JP H08269173A JP 7120795 A JP7120795 A JP 7120795A JP 7120795 A JP7120795 A JP 7120795A JP H08269173 A JPH08269173 A JP H08269173A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- curing agent
- weight
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、例えば印刷配線板の材
料として使用される積層板の製造等に用いられるエポキ
シ樹脂組成物に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin composition used for producing laminated boards used as materials for printed wiring boards.
【０００２】[0002]
【従来の技術】印刷配線板の高密度化に伴い、多層プリ
ント配線板の採用が進んでいる。多層プリント配線板で
は、内層用回路板に形成した銅回路とプリプレグの樹脂
との接着性を確保することが必要である。内層用回路板
は、通常、電解銅箔が表面に接着されている銅張積層板
に回路を形成して製造される。通常の電解銅箔は一方の
面はマット面と呼ばれる粗面であり、他方の面はシャイ
ニー面と呼ばれる平滑面であり、銅張積層板にする際に
は粗面（マット面）側が接着されているので、内層用回
路板に形成した銅回路の表面は平滑面（シャイニー面）
となり、多層プリント配線板における、銅回路とプリプ
レグの樹脂との接着性は低いものとなる傾向がある。そ
のため、銅回路とプリプレグの樹脂との接着性を高める
ことが必要となっている。2. Description of the Related Art With the increase in density of printed wiring boards, multilayer printed wiring boards are being adopted. In a multilayer printed wiring board, it is necessary to secure the adhesiveness between the copper circuit formed on the inner layer circuit board and the resin of the prepreg. The inner layer circuit board is usually manufactured by forming a circuit on a copper clad laminate having an electrolytic copper foil adhered to the surface thereof. One surface of a normal electrolytic copper foil is a rough surface called matte surface, and the other surface is a smooth surface called shiny surface. When making a copper clad laminate, the rough surface (matte surface) side is bonded. Therefore, the surface of the copper circuit formed on the inner layer circuit board has a smooth surface (shiny surface).
Therefore, in the multilayer printed wiring board, the adhesiveness between the copper circuit and the resin of the prepreg tends to be low. Therefore, it is necessary to improve the adhesiveness between the copper circuit and the resin of the prepreg.
【０００３】そこで、従来から種々の方法で銅回路とプ
リプレグの樹脂との接着性を高めることが検討されてお
り、例えば銅回路の表面に銅酸化物を形成して接着性を
高めることがなされている。この理由は、銅を酸化処理
して得られる銅酸化物には表面に微細な突起が形成され
ることになり、この突起によって銅回路の表面を粗面化
して接着性を高めることができるからである。銅回路の
表面に銅酸化物を形成する方法としては亜塩素酸ナトリ
ウムを含むアルカリ水溶液を用いて処理する黒化処理と
呼ばれる方法が一般的である。Therefore, conventionally, various methods have been studied to improve the adhesiveness between the copper circuit and the resin of the prepreg. For example, copper oxide is formed on the surface of the copper circuit to improve the adhesiveness. ing. The reason for this is that the copper oxide obtained by oxidizing copper has fine protrusions formed on the surface, and these protrusions can roughen the surface of the copper circuit and improve the adhesion. Is. As a method for forming a copper oxide on the surface of a copper circuit, a method called blackening treatment in which an alkaline aqueous solution containing sodium chlorite is used for treatment is generally used.
【０００４】このように、銅回路の表面に銅酸化物を形
成することにより、銅回路とプリプレグの樹脂との接着
性を確保できるが、次のような問題が未解決であった。
すなわち、銅酸化物、特に酸化第二銅は酸に溶解し易い
ために、多層化した基板にスルホール加工し、スルホー
ルめっきを施す際に化学めっきや電気めっき液に浸漬す
ると、スルホールの内壁に露出する銅回路の断面部分の
銅酸化物層がめっき液中の酸（塩酸等）に溶解し、スル
ホールの内壁から、銅回路とプリプレグの樹脂との界面
に沿ってめっき液が侵入する溶解浸食現象（いわゆるハ
ロー現象）が生じやすく、多層プリント配線板の信頼性
が低下するおそれがあるという問題が未解決であった。Thus, by forming the copper oxide on the surface of the copper circuit, the adhesion between the copper circuit and the resin of the prepreg can be secured, but the following problems have not been solved.
That is, since copper oxides, especially cupric oxide, are easily dissolved in acid, if through-hole processing is performed on a multilayered substrate and immersion in chemical plating or electroplating solution is performed during through-hole plating, it is exposed to the inner wall of the through-hole. The copper oxide layer in the cross section of the copper circuit dissolves in acid (hydrochloric acid, etc.) in the plating solution, and the plating solution enters from the inner wall of the through hole along the interface between the copper circuit and the resin of the prepreg. (So-called halo phenomenon) is likely to occur, and the problem that the reliability of the multilayer printed wiring board may decrease has not been solved.
【０００５】一方、内層用回路板に形成した銅回路に接
着させるプリプレグは、ガラス布等の基材をエポキシ樹
脂組成物からなるワニスに含浸し、次いで乾燥して製造
される。従来、この用途のエポキシ樹脂組成物における
硬化剤としては、ジシアンジアミドのようなアミン系の
硬化剤を使用するのが一般的であるが、近年、実装密度
の増大と共に、従来より耐熱性に優れる積層板が求めら
れ、各種の検討の結果、フェノール系硬化剤を使用する
と耐熱性が優れることが知られている。On the other hand, a prepreg to be adhered to a copper circuit formed on an inner layer circuit board is manufactured by impregnating a base material such as glass cloth with a varnish made of an epoxy resin composition and then drying. Conventionally, an amine-based curing agent such as dicyandiamide is generally used as a curing agent in an epoxy resin composition for this application, but in recent years, with an increase in mounting density, a laminate having higher heat resistance than before is laminated. A plate is required, and as a result of various studies, it is known that a phenolic curing agent has excellent heat resistance.
【０００６】[0006]
【発明が解決しようとする課題】本発明は上記の事情に
鑑みてなされたもので、その目的とするところは、硬化
剤として良好な耐熱性が得られるフェノール系硬化剤を
使用するエポキシ樹脂組成物であって、内層用回路板に
形成した銅回路とプリプレグの樹脂との界面に沿ってめ
っき液が侵入する溶解浸食現象（ハロー現象）が生じに
くいプリプレグを得ることができるエポキシ樹脂組成物
を提供することにある。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances. An object of the present invention is to provide an epoxy resin composition using a phenolic curing agent that can obtain good heat resistance as a curing agent. An epoxy resin composition capable of obtaining a prepreg that is unlikely to cause a dissolution erosion phenomenon (halo phenomenon) in which a plating solution enters along the interface between the copper circuit formed on the inner layer circuit board and the resin of the prepreg. To provide.
【０００７】[0007]
【課題を解決するための手段】請求項１に係る発明のエ
ポキシ樹脂組成物は、（ａ）エポキシ基を分子内に２個
以上有するエポキシ樹脂、（ｂ）フェノール性水酸基を
分子内に２個以上有するフェノール系硬化剤及び（ｃ）
下記一般式で表されるグアナミン系化合物を含有して
いることを特徴とする。The epoxy resin composition of the invention according to claim 1 is (a) an epoxy resin having two or more epoxy groups in the molecule, and (b) two phenolic hydroxyl groups in the molecule. Phenolic curing agent having the above and (c)
It is characterized in that it contains a guanamine compound represented by the following general formula.
【０００８】[0008]
【化６】 [Chemical 6]
【０００９】請求項２に係る発明のエポキシ樹脂組成物
は、請求項１記載のエポキシ樹脂組成物において、
（ｃ）のグアナミン系化合物の含有量が、（ａ）のエポ
キシ樹脂と（ｂ）のフェノール系硬化剤の合計１００重
量部に対して、０．２〜３．０重量部であることを特徴
とする。An epoxy resin composition according to a second aspect of the present invention is the epoxy resin composition according to the first aspect,
The content of the guanamine-based compound (c) is 0.2 to 3.0 parts by weight based on 100 parts by weight of the total of the epoxy resin (a) and the phenolic curing agent (b). And
【００１０】請求項３に係る発明のエポキシ樹脂組成物
は、請求項１又は請求項２記載のエポキシ樹脂組成物に
おいて、（ｃ）のグアナミン系化合物が下記の構造式
、構造式、構造式及び構造式で表される化合物
からなる群より選ばれた化合物であることを特徴とす
る。An epoxy resin composition according to a third aspect of the present invention is the epoxy resin composition according to the first or second aspect, wherein the guanamine-based compound (c) has the following structural formula, structural formula, structural formula and A compound selected from the group consisting of compounds represented by structural formulas.
【００１１】[0011]
【化７】 [Chemical 7]
【００１２】[0012]
【化８】 Embedded image
【００１３】[0013]
【化９】 [Chemical 9]
【００１４】[0014]
【化１０】 [Chemical 10]
【００１５】請求項４に係る発明のエポキシ樹脂組成物
は、請求項１から請求項３までのいずれかに記載のエポ
キシ樹脂組成物において、ジシアンジアミドをも含有し
ていて、その含有量が（ａ）のエポキシ樹脂と（ｂ）の
フェノール系硬化剤の合計１００重量部に対して、０．
１〜１．０重量部であることを特徴とする。An epoxy resin composition according to a fourth aspect of the present invention is the epoxy resin composition according to any one of the first to third aspects, which further contains dicyandiamide and has a content of (a ) To the total of 100 parts by weight of the epoxy resin of () and the phenolic curing agent of (b).
It is characterized in that it is 1 to 1.0 parts by weight.
【００１６】以下、本発明を詳しく説明する。本発明に
おける（ａ）のエポキシ樹脂は、分子内に２個以上のエ
ポキシ基を有する化合物であればよく、混合物であって
もよい。代表的なエポキシ樹脂としては、ビスフェノー
ルＡ型エポキシ樹脂、臭素化ビスフェノールＡ型エポキ
シ樹脂、ビスフェノールＦ型エポキシ樹脂、クレゾール
ノボラック型エポキシ樹脂、３官能型エポキシ樹脂等が
例示できるが、これらに限定されるものではない。The present invention will be described in detail below. The epoxy resin (a) in the present invention may be a compound having two or more epoxy groups in the molecule and may be a mixture. Examples of representative epoxy resins include bisphenol A type epoxy resin, brominated bisphenol A type epoxy resin, bisphenol F type epoxy resin, cresol novolac type epoxy resin, and trifunctional epoxy resin, but are not limited thereto. Not a thing.
【００１７】本発明における（ｂ）のフェノール系硬化
剤は、フェノール性水酸基を分子内に２個以上有する化
合物であればよく、混合物であってもよい。代表的なフ
ェノール系硬化剤としては、フェノールノボラック、ク
レゾールノボラック等が例示できるが、これらに限定さ
れるものではない。The (b) phenolic curing agent in the present invention may be a compound having two or more phenolic hydroxyl groups in the molecule, or may be a mixture. Examples of typical phenol-based curing agents include phenol novolac and cresol novolac, but are not limited to these.
【００１８】本発明では、（ｃ）として、前記一般式
で表されるグアナミン系化合物を含有していることが重
要であり、その含有量は、（ａ）のエポキシ樹脂と
（ｂ）のフェノール系硬化剤の合計１００重量部に対し
て、０．２〜３．０重量部であることが望ましい。この
理由は、０．２重量部未満の場合はハロー現象を低減す
る効果が顕著でなくなり、また、３．０重量部を越える
と、得られる硬化物の吸湿率が増加し、多層プリント配
線板としたときの吸湿耐熱性や電気特性を低下させる傾
向が生じるからである。（ｃ）の前記一般式で表され
るグアナミン系化合物としては、前記構造式で表され
る化合物（グアナミン）、前記構造式で表される化合
物（ベンゾグアナミン）、前記構造式で表される化合
物（アセトグアナミン）、前記構造式で表される化合
物等が例示でき、これらを単独あるいは併用して使用す
ることができる。In the present invention, it is important that (c) contains the guanamine compound represented by the above general formula, and the contents thereof are the epoxy resin of (a) and the phenol of (b). It is desirable that the amount is 0.2 to 3.0 parts by weight based on 100 parts by weight of the total amount of the system curing agent. The reason for this is that if the amount is less than 0.2 parts by weight, the effect of reducing the halo phenomenon is not remarkable, and if it exceeds 3.0 parts by weight, the moisture absorption rate of the obtained cured product increases, and the multilayer printed wiring board is obtained. This is because there is a tendency that the heat resistance after moisture absorption and the electrical characteristics deteriorate. As the guanamine-based compound represented by the general formula (c), a compound represented by the structural formula (guanamine), a compound represented by the structural formula (benzoguanamine), a compound represented by the structural formula ( Acetoguanamine), compounds represented by the above structural formula, and the like, and these can be used alone or in combination.
【００１９】また、本発明では、ジシアンジアミドをも
含有していて、その含有量が（ａ）のエポキシ樹脂と
（ｂ）のフェノール系硬化剤の合計１００重量部に対し
て、０．１〜１．０重量部であると、ハロー現象をより
低減することができるので好ましい。なお、ジシアンジ
アミドの含有量が０．１重量部未満ではこの効果が不十
分であり、また、１．０重量部を越えると、得られる硬
化物の吸湿率が増加し、多層プリント配線板としたとき
の吸湿耐熱性や電気特性を低下させる傾向が生じる。Further, in the present invention, dicyandiamide is also contained, and the content is 0.1 to 1 with respect to 100 parts by weight of the total of the epoxy resin of (a) and the phenolic curing agent of (b). It is preferable that the amount is 0.0 parts by weight because the halo phenomenon can be further reduced. If the content of dicyandiamide is less than 0.1 part by weight, this effect is insufficient, and if it exceeds 1.0 part by weight, the moisture absorption rate of the obtained cured product increases, and a multilayer printed wiring board is obtained. At this time, there is a tendency that the heat resistance after moisture absorption and the electric characteristics are deteriorated.
【００２０】[0020]
【作用】本発明において、（ｃ）の成分として、前記一
般式で表されるグアナミン系化合物を含有しているこ
とは、多層プリント配線板の製造時のハロー現象を低減
する作用があり、また、ジシアンジアミドをも含有する
ことは、このハロー現象をさらに低減する作用がある。In the present invention, the inclusion of the guanamine compound represented by the above general formula as the component (c) has the effect of reducing the halo phenomenon during the production of a multilayer printed wiring board, and The inclusion of dicyandiamide also has the effect of further reducing this halo phenomenon.
【００２１】[0021]
【実施例】以下、本発明を実施例及び比較例に基づいて
説明する。 （実施例１〜実施例５及び比較例１〜比較例２）（ａ）
のエポキシ樹脂としては、下記の２種類のエポキシ樹脂
を表１及び表２に示す割合で配合して使用した。 エポキシ樹脂１：エポキシ当量５００のテトラブロモビ
スフェノールＡ型エポキシ樹脂〔ダウケミカル社製、品
番ＤＥＲ５１１〕 エポキシ樹脂２：エポキシ当量２００のクレゾールノボ
ラック型エポキシ樹脂〔東都化成（株）製、品番ＹＤＣ
Ｎ７０２〕EXAMPLES The present invention will be described below based on Examples and Comparative Examples. (Examples 1 to 5 and Comparative Examples 1 to 2) (a)
The following two types of epoxy resins were used by mixing them in the ratios shown in Tables 1 and 2. Epoxy resin 1: Tetrabromobisphenol A type epoxy resin with an epoxy equivalent of 500 [Dow Chemical Co., product number DER511] Epoxy resin 2: Cresol novolac type epoxy resin with an epoxy equivalent of 200 [Toto Kasei Co., Ltd. product number YDC]
N702]
【００２２】（ｂ）のフェノール系硬化剤としては、フ
ェノール性水酸基当量１０５のフェノールノボラック
〔荒川化学工業（株）製、商品名タマノール７５２〕を
表１及び表２に示す割合で配合して使用した。As the phenol-based curing agent (b), phenol novolak having a phenolic hydroxyl group equivalent of 105 (trade name: Tamanol 752, manufactured by Arakawa Chemical Industry Co., Ltd.) is blended at a ratio shown in Tables 1 and 2 and used. did.
【００２３】（ｃ）のグアナミン系化合物としては前記
構造式で表される化合物（グアナミン）又は前記構造
式で表される化合物（ベンゾグアナミン）を表１及び
表２に示す割合で配合して使用した。なお、これらは試
薬を使用した。As the guanamine-based compound (c), a compound represented by the above structural formula (guanamine) or a compound represented by the above structural formula (benzoguanamine) was blended at a ratio shown in Tables 1 and 2 and used. . In addition, these used the reagent.
【００２４】上記の原料の他に、表１及び表２に示す割
合で、ジシアンジアミド（試薬を使用）、硬化促進剤で
あるトリフェニルホスフィン（表中ではＴＰＰと略し、
試薬を使用）、硬化促進剤である２エチル４メチルイミ
ダゾール（表中では２Ｅ４ＭＺと略し、試薬を使用）及
び溶媒であるプロピレンセロソルブ（表中ではＰＣと略
し、試薬を使用）とメチルエチルケトン（表中ではＭＥ
Ｋと略し、試薬を使用）を使用した。In addition to the above raw materials, dicyandiamide (using a reagent) and triphenylphosphine as a curing accelerator (abbreviated as TPP in the table, in the ratios shown in Tables 1 and 2)
Reagent is used), curing accelerator 2 ethyl 4-methyl imidazole (abbreviated as 2E4MZ in the table, reagent is used) and solvent propylene cellosolve (abbreviated as PC in the table, reagent is used) and methyl ethyl ketone (in the table) Then ME
(Abbreviated as K and using reagents) was used.
【００２５】上記の原料を表１及び表２に示す割合で配
合し、攪拌混合してエポキシ樹脂組成物（ワニス）を得
た。得られたワニスをガラス布〔旭シュエーベル（株）
製、品番２１６ＬＡＳ４５０〕に含浸し、次いで１５０
℃で乾燥して、レジンコンテントが約５０重量％で、厚
みが約０．１ｍｍのプリプレグを作製した。得られたプ
リプレグを用いて、耐熱性を示す性能であるガラス転移
温度、ハロー性及び吸湿率を下記に示す各測定方法で測
定し、その結果を表１及び表２に示した。The above raw materials were mixed in the proportions shown in Tables 1 and 2 and mixed by stirring to obtain an epoxy resin composition (varnish). The obtained varnish is glass cloth [Asahi Schebel Co., Ltd.
Product number 216LAS450] and then 150
By drying at 0 ° C., a prepreg having a resin content of about 50% by weight and a thickness of about 0.1 mm was prepared. Using the obtained prepreg, the glass transition temperature, the halo property, and the moisture absorption, which are the performances showing heat resistance, were measured by the respective measuring methods shown below, and the results are shown in Tables 1 and 2.
【００２６】（ガラス転移温度の測定方法）得られたプ
リプレグを３枚積層し、離型フィルムを介して、金属プ
レートに挟み、圧力４０ｋｇ／ｃｍ2 、温度１７０℃で
９０分間成型して得られた積層板を試験片とし、動的粘
弾性の温度分散を測定し、得られたｔａｎδのピーク温
度をガラス転移温度とする。(Measurement Method of Glass Transition Temperature) Three obtained prepregs were laminated, sandwiched between metal plates with a release film interposed therebetween, and molded at a pressure of 40 kg / cm 2 and a temperature of 170 ° C. for 90 minutes to obtain a glass transition temperature. Using the laminated plate as a test piece, the temperature dispersion of dynamic viscoelasticity is measured, and the obtained peak temperature of tan δ is taken as the glass transition temperature.
【００２７】（ハロー性の測定方法）両面に７０μ厚の
銅箔をその粗面（マット面）側で接着した、厚み０．７
ｍｍのガラス布基材銅張積層板〔松下電工（株）製、品
番１７６６〕を用いて内層用回路板を作成し、次いでこ
の内層用回路板を、９５℃に調整された亜塩素酸ナトリ
ウムを含む水溶液に２分間浸漬し、内層用回路板に形成
した銅回路の表面を酸化処理する。次いで、内層用回路
板を水洗、乾燥する。次いで内層用回路板の上下にそれ
ぞれプリプレグを各３枚配し、さらにその外側に厚み１
８μｍの銅箔を重ねて積層する、この積層品を金属プレ
ートに挟み、圧力４０ｋｇ／ｃｍ2 、温度１７０℃で９
０分間成型して多層化した基板を得る。次いで、この多
層化した基板に、０．４ｍｍφのドリルビットを用いて
８万ｒｐｍの回転速度及び１．６ｍ／分の送り速度の条
件でスルホール加工を行い、得られるスルホール加工さ
れた基板を試験片とする。この試験片を１７．５％の塩
酸水溶液に６０分間浸漬し、次いで表面の１８μｍの銅
箔をエッチングにより除去した後、ハローの発生状態を
１００倍の顕微鏡で観察し、ハローの大きさ（スルホー
ルの壁面からの酸溶液の侵入幅寸法）を測定し、ハロー
性を示す数値とする。(Method of measuring halo property) A copper foil having a thickness of 70 μm was adhered to both surfaces on the rough surface (matte surface) side, and the thickness was 0.7.
mm glass cloth base material copper clad laminate [manufactured by Matsushita Electric Works, Ltd., product number 1766] was used to prepare an inner layer circuit board, and the inner layer circuit board was then adjusted to 95 ° C. sodium chlorite. The surface of the copper circuit formed on the inner layer circuit board is oxidized by immersing it in an aqueous solution containing Next, the inner layer circuit board is washed with water and dried. Next, arrange three prepregs on each of the upper and lower sides of the circuit board for the inner layer, and further, on the outer side thereof, a thickness of 1
8 μm copper foils are stacked and laminated, this laminated product is sandwiched between metal plates, and pressure is 40 kg / cm 2 , and temperature is 170 ° C.
It is molded for 0 minutes to obtain a multilayer substrate. Then, through-hole processing was performed on the multilayered board using a 0.4 mmφ drill bit under the conditions of a rotation speed of 80,000 rpm and a feed rate of 1.6 m / min, and the obtained through-hole processed board was tested. Let's just cut it. This test piece was immersed in a 17.5% hydrochloric acid aqueous solution for 60 minutes, and then the copper foil of 18 μm on the surface was removed by etching, and then the halo generation state was observed with a 100 × microscope to determine the size of the halo (through hole). The width of penetration of the acid solution from the wall surface is measured and used as the numerical value indicating the halo property.
【００２８】（吸湿率の測定方法）得られたプリプレグ
を８枚積層し、離型フィルムを介して、金属プレートに
挟み、圧力４０ｋｇ／ｃｍ2 、温度１７０℃で９０分間
成型して得られた積層板を試験片とし、８５℃、８５％
の恒温恒湿槽で７日間吸湿処理する。吸湿処理前後の試
験片の重量を測定し、吸湿処理による吸湿率を算出す
る。(Measurement Method of Moisture Absorption Rate) Eight prepregs thus obtained were laminated, sandwiched between metal plates with a release film interposed therebetween, and molded at 90 ° C. for 90 minutes at a pressure of 40 kg / cm 2 . Laminated plate as a test piece, 85 ℃, 85%
Moisture absorption treatment for 7 days in a constant temperature and humidity bath. The weight of the test piece before and after the moisture absorption treatment is measured, and the moisture absorption rate by the moisture absorption treatment is calculated.
【００２９】[0029]
【表１】 [Table 1]
【００３０】[0030]
【表２】 [Table 2]
【００３１】表１及び表２の結果から、比較例に比べ、
本発明の実施例は、耐熱性を示す性能であるガラス転移
温度が低下することなく、内層用回路板に形成した銅回
路とプリプレグの樹脂との界面に沿ってめっき液が侵入
するハロー現象が生じにくいプリプレグを得られている
ことが確認された。From the results of Table 1 and Table 2, compared with the comparative example,
In the examples of the present invention, the halo phenomenon that the plating solution penetrates along the interface between the copper circuit formed on the inner layer circuit board and the resin of the prepreg without lowering the glass transition temperature, which is the performance showing heat resistance, It was confirmed that a prepreg that does not easily occur was obtained.
【００３２】[0032]
【発明の効果】請求項１〜３に係る発明のエポキシ樹脂
組成物によれば、硬化剤として良好な耐熱性が得られる
フェノール系硬化剤を使用し、かつ、内層用回路板に形
成した銅回路とプリプレグの樹脂との界面に沿ってめっ
き液が侵入するハロー現象が生じにくいプリプレグを得
ることができる。また、請求項４に係る発明のエポキシ
樹脂組成物によれば、ジシアンジアミドをも含有してい
るので、さらにハロー現象が生じるのを低減することが
できる。EFFECTS OF THE INVENTION According to the epoxy resin composition of the present invention as claimed in claims 1 to 3, a phenol-based curing agent capable of obtaining good heat resistance is used as a curing agent, and copper formed on the inner layer circuit board is used. It is possible to obtain a prepreg in which the halo phenomenon in which the plating solution penetrates along the interface between the circuit and the resin of the prepreg is unlikely to occur. Further, according to the epoxy resin composition of the invention of claim 4, since it also contains dicyandiamide, it is possible to further reduce the occurrence of the halo phenomenon.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 岩本 成正 大阪府門真市大字門真1048番地松下電工株 式会社内 (72)発明者 八田 行大 大阪府門真市大字門真1048番地松下電工株 式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Shigemasa Iwamoto 1048, Kadoma, Kadoma, Osaka Prefecture Matsushita Electric Works Co., Ltd. (72) Yudai Hatta, 1048, Kadoma, Kadoma, Osaka Prefecture
Claims (4)
するエポキシ樹脂、（ｂ）フェノール性水酸基を分子内
に２個以上有するフェノール系硬化剤及び（ｃ）下記一
般式で表されるグアナミン系化合物を含有してなるエ
ポキシ樹脂組成物。 【化１】 1. An epoxy resin having (a) two or more epoxy groups in the molecule, (b) a phenolic curing agent having two or more phenolic hydroxyl groups in the molecule, and (c) represented by the following general formula. An epoxy resin composition containing a guanamine-based compound. Embedded image
量が、前記（ａ）のエポキシ樹脂と前記（ｂ）のフェノ
ール系硬化剤の合計１００重量部に対して、０．２〜
３．０重量部であることを特徴とする請求項１記載のエ
ポキシ樹脂組成物。2. The content of the guanamine-based compound (c) is 0.2 to 100 parts by weight based on 100 parts by weight of the epoxy resin (a) and the phenol-based curing agent (b).
The epoxy resin composition according to claim 1, which is 3.0 parts by weight.
の構造式、構造式、構造式及び構造式で表され
る化合物からなる群より選ばれた化合物であることを特
徴とする請求項１又は請求項２記載のエポキシ樹脂組成
物。 【化２】 【化３】 【化４】 【化５】 3. The guanamine-based compound (c) is a compound selected from the group consisting of the following structural formulas, structural formulas, structural formulas and compounds represented by the structural formulas: Alternatively, the epoxy resin composition according to claim 2. Embedded image Embedded image [Chemical 4] Embedded image
の含有量が前記（ａ）のエポキシ樹脂と前記（ｂ）のフ
ェノール系硬化剤の合計１００重量部に対して、０．１
〜１．０重量部であることを特徴とする請求項１から請
求項３までのいずれかに記載のエポキシ樹脂組成物。4. A dicyandiamide is also contained, the content of which is 0.1 part with respect to a total of 100 parts by weight of the epoxy resin of (a) and the phenolic curing agent of (b).
To 1.0 parts by weight, the epoxy resin composition according to any one of claims 1 to 3.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7120795A JPH08269173A (en) | 1995-03-29 | 1995-03-29 | Epoxy resin composition |
| DE1996612522 DE69612522T2 (en) | 1995-02-27 | 1996-02-22 | Process for the production of prepregs and laminates based on epoxy resin |
| EP19960200451 EP0728789B1 (en) | 1995-02-27 | 1996-02-22 | Process for making epoxy resin prepregs and laminates |
| TW085102073A TW363997B (en) | 1995-02-27 | 1996-02-23 | Epoxy resin compound for use in laminated sheet |
| US09/225,500 US6231959B1 (en) | 1995-02-27 | 1999-01-06 | Prepreg of epoxy resin, hardener, and organodialkyurea promotor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7120795A JPH08269173A (en) | 1995-03-29 | 1995-03-29 | Epoxy resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08269173A true JPH08269173A (en) | 1996-10-15 |
Family
ID=13454010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7120795A Pending JPH08269173A (en) | 1995-02-27 | 1995-03-29 | Epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08269173A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007288087A (en) * | 2006-04-20 | 2007-11-01 | Matsushita Electric Ind Co Ltd | Circuit board fabrication method |
| JP2008150575A (en) * | 2006-11-22 | 2008-07-03 | Hitachi Chem Co Ltd | Guanamine compound-comtaining solution, thermosetting resin composition and prepreg, laminated plate, and printed wiring board using the same |
| JP2008163308A (en) * | 2006-12-04 | 2008-07-17 | Hitachi Chem Co Ltd | Thermosetting resin composition, as well as prepreg, laminated plate, and printed wiring board using the same |
-
1995
- 1995-03-29 JP JP7120795A patent/JPH08269173A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007288087A (en) * | 2006-04-20 | 2007-11-01 | Matsushita Electric Ind Co Ltd | Circuit board fabrication method |
| JP2008150575A (en) * | 2006-11-22 | 2008-07-03 | Hitachi Chem Co Ltd | Guanamine compound-comtaining solution, thermosetting resin composition and prepreg, laminated plate, and printed wiring board using the same |
| JP2008163308A (en) * | 2006-12-04 | 2008-07-17 | Hitachi Chem Co Ltd | Thermosetting resin composition, as well as prepreg, laminated plate, and printed wiring board using the same |
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