JPH08232084A - Surface-treating solution of copper foil and production of multilayer printed circuit board using the solution - Google Patents
Surface-treating solution of copper foil and production of multilayer printed circuit board using the solutionInfo
- Publication number
- JPH08232084A JPH08232084A JP3560195A JP3560195A JPH08232084A JP H08232084 A JPH08232084 A JP H08232084A JP 3560195 A JP3560195 A JP 3560195A JP 3560195 A JP3560195 A JP 3560195A JP H08232084 A JPH08232084 A JP H08232084A
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- concentration
- treatment liquid
- sulfide
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Landscapes
- ing And Chemical Polishing (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、銅箔の表面処理液並び
にその処理液を用いた多層プリント配線板の製造方法に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface treatment solution for copper foil and a method for manufacturing a multilayer printed wiring board using the treatment solution.
【０００２】[0002]
【従来の技術】通常、多層プリント配線板は、複数の内
層回路と、外層回路と、各回路層を絶縁する絶縁層と、
各回路層間の接続を行なうスルーホールあるいはバイア
ホールとから構成されている。2. Description of the Related Art Generally, a multilayer printed wiring board has a plurality of inner layer circuits, outer layer circuits, and an insulating layer for insulating each circuit layer.
It is composed of a through hole or a via hole for connecting each circuit layer.
【０００３】ところで、各回路層と絶縁層とは、強固に
接着させなければならず、この両者の接着力が弱いと、
配線板に電子部品をはんだで接続する際、層間剥離やボ
イド等の不具合が生じる。By the way, each circuit layer and the insulating layer must be firmly adhered to each other, and if the adhesive force between them is weak,
When connecting electronic parts to a wiring board with solder, problems such as delamination and voids occur.
【０００４】この回路層と絶縁層との接着力を高めるた
めに、例えば「プリント回路技術便欄」第二版、７０５
頁〜７０８頁（１９９３年日刊工業新聞社発行）に記載
されているように、内層回路表面の銅箔を亜塩素酸ナト
リウムやペルオクソニ硫酸塩等の酸化剤による化学処理
を行なうことが知られている。In order to enhance the adhesive force between the circuit layer and the insulating layer, for example, "Printed Circuit Technology", Second Edition, 705.
It is known that the copper foil on the surface of the inner layer circuit is chemically treated with an oxidizing agent such as sodium chlorite and peroxonisulfate as described in pages 708 to 708 (published by Nikkan Kogyo Shimbun Ltd. in 1993). There is.
【０００５】この酸化剤による化学処理では、銅箔表面
に酸化銅の針状の微細結晶が形成され、この微細な凹凸
により、絶縁樹脂と銅箔との接着強度を高めるというも
のである。In the chemical treatment with the oxidizing agent, needle-like fine crystals of copper oxide are formed on the surface of the copper foil, and the fine irregularities enhance the adhesive strength between the insulating resin and the copper foil.
【０００６】また、この酸化剤による化学処理の前に、
通常は、銅箔表面に粗さの大きい粗化表面を与えるため
に、ソフトエッチング加工を実施することが多い。Before the chemical treatment with the oxidizing agent,
Usually, a soft etching process is often carried out in order to give a roughened surface having a large roughness to the copper foil surface.
【０００７】[0007]
【発明が解決しようとする課題】しかしながら、酸化剤
による化学処理は、処理液温度が７０℃以上と高く、各
処理液をそれぞれの槽に準備し、次々に浸漬するバッチ
処理方法では、酸化剤の蒸気による作業者への安全が損
なわれることがあり、作業安全上好ましいものではなか
った。However, in the chemical treatment with an oxidizing agent, the temperature of the treating solution is as high as 70 ° C. or more, the treating solution is prepared in each tank, and the batch treating method of dipping the treating solution one after another is carried out by the oxidizing agent. Since the steam of the above may impair the safety for workers, it was not preferable in terms of work safety.
【０００８】また、処理を効率的に行なうために、ソフ
トエッチング工程、酸化剤による化学処理工程を連続的
に行なう場合に、ソフトエッチングの工程は、液温も低
く、連続化は容易であるが、それに続く酸化剤による化
学処理は、上述したように一般に液温が７０℃以上と高
く、ベルトコンベヤで搬送しながら、各処理液をスプレ
ー噴霧する連続処理装置では、耐熱性や処理時間が長期
化することから、大がかりな装置を必要とし、設備コス
トの高騰化を招くという欠点があった。When the soft etching process and the chemical treatment process using an oxidant are continuously performed for efficient treatment, the liquid temperature of the soft etching process is low and the continuation is easy. As described above, the subsequent chemical treatment with an oxidizing agent generally has a high liquid temperature of 70 ° C. or higher, and in a continuous treatment device that sprays each treatment liquid while transporting it on a belt conveyor, heat resistance and treatment time are long. However, there is a drawback in that a large-scale device is required and the equipment cost rises.
【０００９】この発明は、このような事情に鑑みてなさ
れたもので、内層回路と絶縁樹脂との強固な接着が期待
できるとともに、作業安全上も好ましく、かつ、処理時
間を短縮化できる等、処理作業効率に優れた銅箔の表面
処理液並びにその処理液を用いた多層プリント配線板の
製造方法を提供することを目的とする。The present invention has been made in view of the above circumstances, and it is expected that firm adhesion between the inner layer circuit and the insulating resin can be expected, work safety is preferable, and the processing time can be shortened. An object of the present invention is to provide a surface treatment solution for copper foil having excellent treatment work efficiency and a method for producing a multilayer printed wiring board using the treatment solution.
【００１０】[0010]
【課題を解決するための手段】上記目的を達成するため
に、本発明に係る銅箔の表面処理液は、塩化第二銅、塩
酸、及び水からなるエッチング液に、硫化カリウム、硫
化ナトリウム、ヨウ化カリウム、及びヨウ化ナトリウム
からなるグループから選択された１種以上の物質を添加
したことを特徴とする。In order to achieve the above object, a surface treatment solution for a copper foil according to the present invention is an etching solution comprising cupric chloride, hydrochloric acid, and water, potassium sulfide, sodium sulfide, One or more substances selected from the group consisting of potassium iodide and sodium iodide are added.
【００１１】更に、上記塩化第二銅の濃度は２０〜１２
０ｇ／ｌ、３６％塩酸の濃度は１００〜７００ｍｌ／
ｌ、硫化カリウム又は硫化ナトリウムの濃度は１〜５０
０ｍｇ／ｌであることが好ましい。Further, the concentration of cupric chloride is 20 to 12
The concentration of 0 g / l, 36% hydrochloric acid is 100-700 ml /
1, the concentration of potassium sulfide or sodium sulfide is 1 to 50
It is preferably 0 mg / l.
【００１２】塩化第二銅の濃度が２０ｇ／ｌ未満である
と、銅箔のエッチング量が著しく少ないため、微細な粗
化表面が得られにくい。When the concentration of cupric chloride is less than 20 g / l, the etching amount of the copper foil is extremely small, and it is difficult to obtain a fine roughened surface.
【００１３】逆に塩化第二銅の濃度が１２０ｇ／ｌを越
えた場合、銅箔のエッチング量が著しく増加するため、
銅箔の厚さが過度に減少するため望ましくない。On the contrary, when the concentration of cupric chloride exceeds 120 g / l, the etching amount of the copper foil increases remarkably.
It is not desirable because the thickness of the copper foil is excessively reduced.
【００１４】また、塩酸の濃度が１００ｍｌ／ｌ未満で
あると、銅箔表面の微細な粗化表面が得られにくくな
り、逆に、塩酸の濃度が７００ｍｌ／ｌを越えた場合、
銅箔表面のエッチングされない箇所が残り易くなり、所
望のエッチング効果が期待できない。If the concentration of hydrochloric acid is less than 100 ml / l, it becomes difficult to obtain a finely roughened copper foil surface. Conversely, if the concentration of hydrochloric acid exceeds 700 ml / l,
Unetched portions of the copper foil surface tend to remain, and the desired etching effect cannot be expected.
【００１５】また、硫化カリウムあるいは硫化ナトリウ
ムの濃度が１ｍｇ／ｌ未満であると、表面粗化効果が現
れず、逆に、５００ｍｇ／ｌを越えると、所望の効果は
得られるものの、経済的ではない。When the concentration of potassium sulfide or sodium sulfide is less than 1 mg / l, the surface roughening effect does not appear. On the other hand, when it exceeds 500 mg / l, the desired effect is obtained, but it is economical. Absent.
【００１６】同様に、ヨウ化カリウム又はヨウ化ナトリ
ウムの濃度が５０ｍｇ／ｌ未満であると、所望の銅箔表
面の粗化効果が得られず、逆に、１０００ｍｇ／ｌを越
えた場合、所望の効果は得られるものの、経済的ではな
い。Similarly, if the concentration of potassium iodide or sodium iodide is less than 50 mg / l, the desired effect of roughening the copper foil surface cannot be obtained, and conversely, if it exceeds 1000 mg / l, the desired effect is obtained. Although the effect of can be obtained, it is not economical.
【００１７】更に、上述した銅箔の表面処理液を用い
て、多層プリント配線板を製造するには、内層回路板に
所定パターンで形成された銅箔表面に、塩化第二銅、塩
酸、及び水からなるエッチング液に、硫化カリウム、硫
化ナトリウム、ヨウ化カリウム、及びヨウ化ナトリウム
からなるグループから選択された１種以上の物質を添加
した処理液に接触させ、水洗，乾燥処理後、絶縁性有機
接着シートあるいはプリプレグと積層一体化することに
より製造することができる。Further, in order to manufacture a multilayer printed wiring board using the above-mentioned copper foil surface treatment solution, cupric chloride, hydrochloric acid, and hydrochloric acid are added to the copper foil surface formed in a predetermined pattern on the inner layer circuit board. Insulating property is obtained by contacting with a treatment liquid obtained by adding one or more substances selected from the group consisting of potassium sulfide, sodium sulfide, potassium iodide, and sodium iodide to an etching liquid made of water, washing with water and drying treatment. It can be manufactured by laminating and integrating with an organic adhesive sheet or prepreg.
【００１８】その後、スルーホールの必要な箇所に孔を
明け、孔内壁を金属化し、外層回路を形成することによ
り、多層プリント配線板とすることがてきる。After that, a multilayer printed wiring board can be obtained by forming a hole at a required position of the through hole, metallizing the inner wall of the hole, and forming an outer layer circuit.
【００１９】また、内層回路板に形成された所定パター
ンの銅箔表面に処理液を接触させるには、処理液に浸漬
する方法や、ポンプ等により圧力を加え、スプレーノズ
ルから噴霧する方法等があり、その条件としては、銅箔
の厚み減少が、平均厚さに換算して、２μｍ以下となる
条件とすることが好ましく、このことは、予め液温，接
触時間，スプレー圧力等の処理条件を減少する銅箔の厚
さに応じて制御すれば良い。Further, in order to bring the treatment liquid into contact with the surface of the copper foil having a predetermined pattern formed on the inner layer circuit board, there are a method of dipping in the treatment liquid, a method of applying pressure with a pump or the like and a method of spraying from a spray nozzle, and the like. It is preferable that the reduction of the thickness of the copper foil is 2 μm or less in terms of the average thickness, which means that the treatment conditions such as liquid temperature, contact time, and spray pressure are set in advance. Can be controlled according to the thickness of the copper foil to be reduced.
【００２０】また、減少する厚さを２μ以下とする理由
は、導体の厚さの減少により導体抵抗の増大を抑えるた
めである。The reason for reducing the thickness to 2 μm or less is to suppress the increase in conductor resistance due to the reduction in conductor thickness.
【００２１】[0021]
【作用】以上の構成から明らかなように、本発明に係る
銅箔の表面処理液は、処理液中の硫黄やヨウ素が、部分
的に銅箔の表面に強く吸着され、この部分が塩化第二
銅，塩酸，及び水からなるエッチング液によって、エッ
チングされにくくなり、吸着していない部分とのエッチ
ング量が異なるために、凹凸が形成される。As apparent from the above structure, in the surface treatment liquid for copper foil according to the present invention, sulfur or iodine in the treatment liquid is partially strongly adsorbed on the surface of the copper foil, and this portion is chlorided. The etching liquid composed of dicopper, hydrochloric acid, and water makes it difficult to etch, and unevenness is formed because the etching amount is different from that of the non-adsorbed portion.
【００２２】そして、処理液中の硫黄やヨウ素が、銅箔
の表面にミクロ的に強く吸着された部分と、吸着されな
い部分とが形成される結果、ミクロ的にエッチングのさ
れやすい箇所とされにくい箇所とができるため、銅箔表
面は微細な凹凸面が形成され、アンカー接合により、絶
縁樹脂と銅箔との間の強固な接着強度が得られるものと
推定される。The sulfur and iodine in the treatment liquid are strongly adsorbed on the surface of the copper foil and a non-adsorbed portion is formed on the surface of the copper foil. As a result, microscopic etching is unlikely to occur. It is presumed that a fine uneven surface is formed on the surface of the copper foil because of the formation of a portion, and that a strong adhesive strength between the insulating resin and the copper foil can be obtained by anchor bonding.
【００２３】[0023]
【実施例】以下、本発明に係る銅箔の表面処理液並びに
その処理液を用いた多層プリント配線板の製造方法につ
いて、以下に詳細に説明する。EXAMPLES The surface treatment liquid for copper foil and the method for producing a multilayer printed wiring board using the treatment liquid according to the present invention will be described in detail below.
【００２４】＜実施例１＞ガラス布にエポキシ樹脂を含
浸させ、両面に厚さ３５μｍの銅箔を貼り合せ、厚さ
０．２ｍｍの両面銅張積層板を作成した後、銅箔表面を
サンドブラストで研磨した後、塩化第二銅の濃度を４０
ｇ／ｌに、３６％塩酸の濃度を５００ｍｌ／ｌに、硫化
カリウムの濃度を５ｍｇ／ｌに調整した銅箔の表面処理
液を調整し、この処理液温度を４５℃に制御しながら、
前記研磨した銅張積層板を３０秒間浸漬し、水洗し、８
０℃で３０分間乾燥させた。<Example 1> A glass cloth was impregnated with an epoxy resin, and a copper foil having a thickness of 35 µm was attached to both surfaces thereof to form a double-sided copper-clad laminate having a thickness of 0.2 mm, and then the surface of the copper foil was sandblasted. After polishing with, the cupric chloride concentration is adjusted to 40
g / l, the concentration of 36% hydrochloric acid was 500 ml / l, and the concentration of potassium sulfide was 5 mg / l.
Immerse the polished copper clad laminate for 30 seconds, wash with water,
Dry at 0 ° C. for 30 minutes.
【００２５】このときに、上記表面処理液によって減少
した銅箔の量は、平均厚さに換算して、約０．６μｍで
あった。At this time, the amount of copper foil reduced by the surface treatment solution was about 0.6 μm in terms of average thickness.
【００２６】次に、表面処理を施した積層板の表面に、
ガラス布にエポキシ樹脂を含浸させたプリプレグを重
ね、圧力２５ｋｇｆ／ｃｍ2 、加熱温度１７０℃、時間
９０分間の条件で加熱加圧して積層一体化した。Next, on the surface of the laminated plate which has been subjected to the surface treatment,
A glass cloth was overlaid with an epoxy resin-impregnated prepreg and heated and pressed under the conditions of a pressure of 25 kgf / cm 2 , a heating temperature of 170 ° C., and a time of 90 minutes to laminate and integrate them.
【００２７】このように形成した積層板を、幅１０ｍｍ
に切断し、銅箔と絶縁樹脂であるプリプレグとの間にナ
イフの刃先を入れ、引き剥がし強度をＪＩＳ−Ｃ−６４
８１で測定した。その結果、引き剥がし強度は、０．７
５ｋｇｆ／ｃｍであった。The laminated plate thus formed has a width of 10 mm.
The blade edge of the knife is put between the copper foil and the prepreg which is an insulating resin, and the peel strength is JIS-C-64.
It was measured at 81. As a result, the peel strength is 0.7
It was 5 kgf / cm.
【００２８】＜実施例２＞実施例１の硫化カリウムに代
えて、ヨウ化カリウムを濃度１００ｍｇ／ｌで加えた他
は、実施例１と同一の方法で積層板を作成した。Example 2 A laminated plate was prepared in the same manner as in Example 1 except that potassium iodide was added at a concentration of 100 mg / l in place of the potassium sulfide of Example 1.
【００２９】このときに、上記表面処理液により減少し
た銅箔の量は、平均厚さに換算して、約０．８μｍであ
った。At this time, the amount of copper foil reduced by the surface treatment solution was about 0.8 μm in terms of average thickness.
【００３０】次に、表面処理を施した積層板の表面に、
ガラス布にエポキシ樹脂を含浸させたプリプレグを重
ね、圧力２５ｋｇｆ／ｃｍ2 、加熱温度１７０℃、時間
９０分間の条件で加熱加圧して積層一体化した。Next, on the surface of the surface-treated laminated plate,
A glass cloth was overlaid with an epoxy resin-impregnated prepreg and heated and pressed under the conditions of a pressure of 25 kgf / cm 2 , a heating temperature of 170 ° C., and a time of 90 minutes to laminate and integrate them.
【００３１】この積層板を幅１０ｍｍに切断し、銅箔と
絶縁樹脂であるプリプレグとの間にナイフの刃先を入
れ、引き剥がし強度をＪＩＳ−Ｃ−６４８１で測定し
た。その結果、引き剥がし強度は０．７８ｋｇｆ／ｃｍ
であった。This laminated plate was cut into a width of 10 mm, a blade edge of a knife was put between the copper foil and the prepreg which was an insulating resin, and the peeling strength was measured according to JIS-C-6481. As a result, the peel strength is 0.78 kgf / cm
Met.
【００３２】＜比較例＞実施例１の硫化カリウムを添加
せずに積層板を作成した。Comparative Example A laminated plate was prepared without adding the potassium sulfide of Example 1.
【００３３】このときに、上記処理液により銅箔の量
は、平均厚さに換算して、約０．７μｍであった。At this time, the amount of copper foil by the above treatment liquid was about 0.7 μm in terms of average thickness.
【００３４】次に、表面処理を施した積層板の表面に、
ガラス布にエポキシ樹脂を含浸させたプリプレグを重
ね、圧力２５ｋｇｆ／ｃｍ2 、加熱温度１７０℃、時間
９０分間の条件で加熱加圧して積層一体化した。Next, on the surface of the laminated plate which has been subjected to the surface treatment,
A glass cloth was overlaid with an epoxy resin-impregnated prepreg and heated and pressed under the conditions of a pressure of 25 kgf / cm 2 , a heating temperature of 170 ° C., and a time of 90 minutes to laminate and integrate them.
【００３５】この積層板を幅１０ｍｍに切断し、銅箔と
絶縁樹脂であるプリプレグとの間にナイフの刃先を入
れ、ＪＩＳ−Ｃ−６４８１で引き剥がし強度を測定し
た。その結果、引き剥がし強度は０．４５ｋｇｆ／ｃｍ
であった。This laminated plate was cut into a width of 10 mm, a blade edge of a knife was put between a copper foil and a prepreg which was an insulating resin, and the peeling strength was measured according to JIS-C-6481. As a result, the peel strength is 0.45 kgf / cm
Met.
【００３６】＜実施例３＞ガラス布にエポキシ樹脂を含
浸させ、両面に厚さ３５μｍの銅箔を貼り合せ、厚さ
０．２ｍｍの両面銅張積層板を作成し、この両面銅張積
層板の銅箔表面をサンドブラストで研磨処理した後、内
層回路の形状にエッチングレジストを形成し、そのエッ
チングレジストから露出した銅箔を、化学エッチング液
でエッチング除去し、回路導体を形成した後、塩化第二
銅の濃度を４０ｇ／ｌに、３６％塩酸の濃度を５００ｍ
ｌ／ｌに、硫化カリウムの濃度を５ｍｇ／ｌに調整した
表面処理液を作成し、この表面処理液の液温を４５℃に
制御しながら前記研磨した銅張積層板を３０秒間浸漬
し、水洗し、８０℃で３０分間乾燥させた。<Embodiment 3> A glass cloth is impregnated with an epoxy resin, and a copper foil having a thickness of 35 μm is adhered to both surfaces to form a double-sided copper-clad laminate having a thickness of 0.2 mm. After sandblasting the copper foil surface of, the etching resist is formed in the shape of the inner layer circuit, the copper foil exposed from the etching resist is removed by etching with a chemical etching solution to form the circuit conductor, and then the chloride chloride is formed. The concentration of dicopper is 40 g / l and the concentration of 36% hydrochloric acid is 500 m.
A surface treatment solution in which the concentration of potassium sulfide was adjusted to 5 mg / l was prepared in 1 / l, and the polished copper-clad laminate was immersed for 30 seconds while controlling the solution temperature of the surface treatment solution at 45 ° C. It was washed with water and dried at 80 ° C. for 30 minutes.
【００３７】このときに、上記処理液によって減少した
銅箔の量は、平均厚さに換算して、約０．６μｍであっ
た。At this time, the amount of copper foil reduced by the treatment liquid was about 0.6 μm in terms of average thickness.
【００３８】次に、表面処理を施した内層回路板の表面
に、ガラス布にエポキシ樹脂を含浸させたプリプレグを
重ね、圧力２５ｋｇｆ／ｃｍ2 、加熱温度１７０℃、時
間９０分間の条件で加熱加圧して積層一体化した。Next, a prepreg obtained by impregnating a glass cloth with an epoxy resin was placed on the surface of the surface-treated inner layer circuit board, and heated under the conditions of a pressure of 25 kgf / cm 2 , a heating temperature of 170 ° C. and a time of 90 minutes. It was pressed and laminated.
【００３９】この内層回路板の内層回路がベタの銅箔に
なっている箇所を、幅１０ｍｍに切断し、銅箔と絶縁樹
脂であるプリプレグとの間に、ナイフの刃先を入れ、Ｊ
ＩＳ−Ｃ−６４８１で引き剥がし強度を測定した。その
結果、引き剥がし強度は０．７５ｋｇｆ／ｃｍであっ
た。A portion of the inner layer circuit board where the inner layer circuit is a solid copper foil is cut into a width of 10 mm, and a knife edge is inserted between the copper foil and the prepreg which is an insulating resin.
The peel strength was measured by IS-C-6482. As a result, the peeling strength was 0.75 kgf / cm.
【００４０】前記積層板にスルーホールとなる孔を開
け、無電解めっき前処理を行ない、無電解めっきを行な
って、孔内壁と表面の銅箔全面に無電解めっきを析出さ
せ、その表面に導体の厚さを確保するために電解めっき
を行なって、めっき銅の厚さを約３０μｍとした。A hole to be a through hole is opened in the laminated plate, pretreatment for electroless plating is performed, and electroless plating is performed to deposit electroless plating on the inner wall of the hole and the entire surface of the copper foil, and a conductor is formed on the surface. The thickness of the plated copper was about 30 μm.
【００４１】更に、外層回路の形状にエッチングレジス
トを形成し、そのエッチングレジストから露出した銅箔
を、化学エッチング液でエッチング除去し、外層回路導
体を形成し、多層配線板とした。Further, an etching resist was formed in the shape of the outer layer circuit, and the copper foil exposed from the etching resist was removed by etching with a chemical etching solution to form an outer layer circuit conductor to obtain a multilayer wiring board.
【００４２】[0042]
【発明の効果】以上説明した通り、本発明は、以下に記
載する格別の作用効果を有する。As described above, the present invention has the following special operational effects.
【００４３】（１）本発明に係る銅箔の表面処理液は、
エッチング液に、硫化カリウム，硫化ナトリウム，ヨウ
化カリウム，及びヨウ化ナトリウムからなるグループか
ら選択された１種以上の物質を添加するものであり、処
理液中の硫黄やヨウ素が部分的に銅箔の表面に強く吸着
され、その部分がエッチングされにくくなり、結果的に
銅箔表面に微細な凹凸が形成され、絶縁樹脂と銅箔との
間の強固な接着強度が確保されると共に、従来の酸化剤
の蒸気により、作業者への安全が損なわれることがな
く、良好な作業環境を確保できるという効果を有する。(1) The surface treatment liquid for copper foil according to the present invention is
One or more substances selected from the group consisting of potassium sulfide, sodium sulfide, potassium iodide, and sodium iodide are added to the etching solution, and sulfur or iodine in the processing solution is partially contained in the copper foil. It is strongly adsorbed on the surface of the copper foil, which makes it difficult to etch, resulting in the formation of fine irregularities on the copper foil surface, ensuring a strong adhesive strength between the insulating resin and the copper foil, and The oxidant vapor has the effect of ensuring a good working environment without impairing the safety of the worker.
【００４４】（２）本発明に係る銅箔の表面処理液は、
処理液温度が低く、かつ、処理時間も短いため、処理液
をスプレー噴霧する処理装置として、耐熱性を要求され
る高価な材質のものを使用しなくて済み、また、従来の
酸化剤の処理時間に比べ、極めて短時間で済むため、装
置も大掛かりとならず、処理装置の費用を大幅に低減で
きるという効果を有する。(2) The surface treatment liquid for copper foil according to the present invention is
Since the temperature of the treatment liquid is low and the treatment time is short, it is not necessary to use an expensive material that requires heat resistance as a treatment device for spraying the treatment liquid. Since the time required is extremely short compared with time, the apparatus does not need to be large in size, and the cost of the processing apparatus can be significantly reduced.
【００４５】（３）本発明方法によれば、内層回路板と
絶縁樹脂との間の剥離強度を銅箔の表面処理液を銅箔表
面に接触させて、短時間で銅箔表面と絶縁樹脂との接着
強度を著しく強化できるため、層間剥離やホイドの発生
のない品質の優れた多層プリント配線板を効率よく量産
できるという効果を有する。(3) According to the method of the present invention, the peeling strength between the inner layer circuit board and the insulating resin is brought into contact with the copper foil surface treatment liquid so that the copper foil surface and the insulating resin are contacted in a short time. Since the adhesive strength with the can be remarkably strengthened, there is an effect that it is possible to efficiently mass-produce a multi-layer printed wiring board having excellent quality without delamination or generation of whid.
Claims (5)
チング液に、硫化カリウム、硫化ナトリウム、ヨウ化カ
リウム、及びヨウ化ナトリウムからなるグループから選
択された１種以上の物質を添加したことを特徴とする銅
箔の表面処理液。1. An etching solution containing cupric chloride, hydrochloric acid, and water, to which one or more substances selected from the group consisting of potassium sulfide, sodium sulfide, potassium iodide, and sodium iodide are added. A surface treatment liquid for copper foil.
ｌ、３６％塩酸の濃度が１００〜７００ｍｌ／ｌ、硫化
カリウムまたは硫化ナトリウムの濃度が１〜５００ｍｇ
／ｌに調整されていることを特徴とする請求項１記載の
銅箔の表面処理液。2. The concentration of cupric chloride is 20 to 120 g /
1, the concentration of 36% hydrochloric acid is 100 to 700 ml / l, the concentration of potassium sulfide or sodium sulfide is 1 to 500 mg
The surface treatment liquid for copper foil according to claim 1, wherein the surface treatment liquid is adjusted to 1 / l.
ｌ、３６％塩酸の濃度が１００〜７００ｍｌ／ｌ、ヨウ
化カリウム又はヨウ化ナトリウムの濃度が５０〜１００
０ｍｇ／ｌに調整されていることを特徴する請求項１，
２記載の銅箔の表面処理液。3. The concentration of cupric chloride is 20 to 120 g /
1, the concentration of 36% hydrochloric acid is 100 to 700 ml / l, the concentration of potassium iodide or sodium iodide is 50 to 100
It is adjusted to 0 mg / l.
The surface treatment liquid for the copper foil according to 2.
された銅箔表面に、塩化第二銅、塩酸、及び水からなる
エッチング液に、硫化カリウム、硫化ナトリウム、ヨウ
化カリウム、及びヨウ化ナトリウムからなる、グループ
から選択された１種以上の物質を添加した処理液に接触
させ、水洗，乾燥工程後、絶縁性有機接着シートあるい
はプリプレグと積層一体化したことを特徴とする多層プ
リント配線板の製造方法。4. A copper foil surface formed in a predetermined pattern on the surface of an inner layer circuit board, an etching solution containing cupric chloride, hydrochloric acid, and water, potassium sulfide, sodium sulfide, potassium iodide, and iodide. A multilayer printed wiring board characterized by being brought into contact with a treatment liquid containing one or more substances selected from the group consisting of sodium, washed with water and dried, and then laminated integrally with an insulating organic adhesive sheet or prepreg. Manufacturing method.
された銅箔表面に表面処理液を接触させる条件として、
銅箔の厚み減少が、平均厚さに換算して２μｍ以下に調
整したことを特徴とする請求項４記載の多層プリント配
線板の製造方法。5. The condition for contacting the surface treatment liquid with the copper foil surface formed in a predetermined pattern on the surface of the inner layer circuit board is as follows:
The method for manufacturing a multilayer printed wiring board according to claim 4, wherein the reduction in thickness of the copper foil is adjusted to 2 μm or less in terms of average thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3560195A JP3432629B2 (en) | 1995-02-23 | 1995-02-23 | Surface treatment liquid for copper foil and method for producing multilayer printed wiring board using the treatment liquid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3560195A JP3432629B2 (en) | 1995-02-23 | 1995-02-23 | Surface treatment liquid for copper foil and method for producing multilayer printed wiring board using the treatment liquid |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08232084A true JPH08232084A (en) | 1996-09-10 |
| JP3432629B2 JP3432629B2 (en) | 2003-08-04 |
Family
ID=12446350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3560195A Expired - Fee Related JP3432629B2 (en) | 1995-02-23 | 1995-02-23 | Surface treatment liquid for copper foil and method for producing multilayer printed wiring board using the treatment liquid |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3432629B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007189059A (en) * | 2006-01-13 | 2007-07-26 | Hitachi Chem Co Ltd | Inner layer circuit board, processing method therefor, and multilayer printed wiring board using same |
| JP2008103532A (en) * | 2006-10-19 | 2008-05-01 | Hitachi Chem Co Ltd | Inner layer treatment method for multilayer printed wiring board and circuit board obtained thereby |
| WO2009023988A1 (en) * | 2007-08-21 | 2009-02-26 | King Tim Tse | Process and system for etching copper |
| JP6333455B1 (en) * | 2017-08-23 | 2018-05-30 | メック株式会社 | Copper microetching agent and method of manufacturing wiring board |
-
1995
- 1995-02-23 JP JP3560195A patent/JP3432629B2/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007189059A (en) * | 2006-01-13 | 2007-07-26 | Hitachi Chem Co Ltd | Inner layer circuit board, processing method therefor, and multilayer printed wiring board using same |
| JP2008103532A (en) * | 2006-10-19 | 2008-05-01 | Hitachi Chem Co Ltd | Inner layer treatment method for multilayer printed wiring board and circuit board obtained thereby |
| WO2009023988A1 (en) * | 2007-08-21 | 2009-02-26 | King Tim Tse | Process and system for etching copper |
| JP6333455B1 (en) * | 2017-08-23 | 2018-05-30 | メック株式会社 | Copper microetching agent and method of manufacturing wiring board |
| JP2019039027A (en) * | 2017-08-23 | 2019-03-14 | メック株式会社 | Copper micro etching agent and method for producing wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3432629B2 (en) | 2003-08-04 |
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