JPH0823184A - Electronic circuit case provided with heat removing structure - Google Patents
Electronic circuit case provided with heat removing structureInfo
- Publication number
- JPH0823184A JPH0823184A JP15741494A JP15741494A JPH0823184A JP H0823184 A JPH0823184 A JP H0823184A JP 15741494 A JP15741494 A JP 15741494A JP 15741494 A JP15741494 A JP 15741494A JP H0823184 A JPH0823184 A JP H0823184A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- electronic circuit
- circuit case
- fins
- peripheral wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Casings For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は複数の電子素子を内蔵し
た電子回路ケースに関し、特には電子素子等から発生し
た熱をケース外に放熱する熱除去構造を備える電子回路
ケースに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit case containing a plurality of electronic elements, and more particularly to an electronic circuit case having a heat removal structure for radiating heat generated from the electronic elements and the like to the outside of the case.
【0002】[0002]
【従来の技術】自動車等に搭載される電気機器類に使用
される電気回路等で、ドロッパー抵抗等の発熱を伴う電
子部品を小型の電子回路ケースに収納する場合、他の部
品に熱的影響を与えないように効率よく放熱させて、電
子回路ケース内の温度の過度の上昇を抑制しなければな
らない。従来の電子回路ケースにおいては、このような
ドロッパー抵抗等の発熱量の大きい部品をケース内に収
納する場合には、電子回路ケースに多くのスリットを設
け、空気の自然対流の作用で電子回路ケース外に放熱を
行なっていた。2. Description of the Related Art In an electric circuit used for electric equipment mounted on an automobile, etc., when an electronic part which generates heat such as a dropper resistance is housed in a small electronic circuit case, thermal influence on other parts is caused. It is necessary to efficiently radiate heat so as not to give heat to suppress an excessive rise in temperature inside the electronic circuit case. In a conventional electronic circuit case, when a large amount of heat such as a dropper resistance is stored in the case, many slits are provided in the electronic circuit case, and the electronic circuit case is operated by the action of natural convection of air. It was radiating heat to the outside.
【0003】図5に示すように従来の電子回路ケース5
0は、その内部にドロッパー抵抗器52を備える電子回
路を収納し、その一方の側壁50Aに設けたスリット5
1Aからケース外部の低温の流入空気53を取り入れ
る。そして、流入空気53は電子回路ケース50内に入
ってドロッパー抵抗器52に接して、ドロッパー抵抗器
52から除熱して自身の温度を上昇させる。この後、温
度の高い流出空気54として天井壁50Bのスリット5
1Bから外へ流出させる。このように空気の自然対流に
より発熱体からの熱除去が行われていた。As shown in FIG. 5, a conventional electronic circuit case 5 is used.
0 is a slit 5 provided in one side wall 50A of the electronic circuit having the dropper resistor 52 therein.
The low-temperature inflow air 53 outside the case is taken in from 1A. Then, the inflow air 53 enters the electronic circuit case 50, contacts the dropper resistor 52, and removes heat from the dropper resistor 52 to raise its own temperature. After this, the slit 5 of the ceiling wall 50B is used as the high temperature outflow air 54.
Flow out from 1B. In this way, the heat is removed from the heating element by the natural convection of air.
【0004】[0004]
【発明が解決しようとする課題】しかしながら、上記の
ような従来の自然対流式の電子回路ケースでは、熱の除
去媒体である空気の比熱或いは熱容量が小さいため、十
分な熱除去効果が得られないという問題があった。更に
このような多くのスリットを天井壁や側壁に有する電子
回路ケースの構成では、水や塵埃が電子回路ケース内に
侵入する環境下での使用が困難であった。また、モール
ド材等で回路全体を覆う場合には、電子回路ケースにス
リットを設けることができず、前述のような自然対流に
よる熱除去の採用が困難であった。However, in the conventional natural convection type electronic circuit case as described above, since the specific heat or heat capacity of air as a heat removing medium is small, a sufficient heat removing effect cannot be obtained. There was a problem. Furthermore, the configuration of the electronic circuit case having such many slits on the ceiling wall or the side wall is difficult to use in an environment where water and dust enter the electronic circuit case. Further, when the entire circuit is covered with a molding material or the like, the slit cannot be provided in the electronic circuit case, which makes it difficult to adopt the heat removal by natural convection as described above.
【0005】本発明の目的は、上記の従来技術の問題点
を解決するためになされたものであり、高い熱除去機能
を備え、水や塵埃が存在する環境下でも熱除去可能な熱
除去構造を備える電子回路ケースを提供することにあ
る。The object of the present invention is to solve the above-mentioned problems of the prior art. It has a high heat removal function and is capable of removing heat even in an environment where water and dust are present. An object of the present invention is to provide an electronic circuit case provided with.
【0006】[0006]
【課題を解決するための手段】本発明の上記目的は、発
熱体を有する電子回路を内蔵した熱除去構造を備える電
子回路ケースにおいて、電子回路ケースを構成する同一
の周壁の内側及び外側にそれぞれフィンを設け、この両
フィンを熱的に連結した構成であることを特徴とする熱
除去構造を備える電子回路ケースによって達成すること
ができる。SUMMARY OF THE INVENTION It is an object of the present invention to provide an electronic circuit case having a heat removal structure containing an electronic circuit having a heating element inside and outside the same peripheral wall constituting the electronic circuit case, respectively. This can be achieved by an electronic circuit case provided with a heat removal structure characterized in that fins are provided and both fins are thermally connected.
【0007】また、本発明の上記目的は、発熱体を有す
る電子回路を内蔵した熱除去構造を備える電子回路ケー
スにおいて、電子回路ケースを構成する同一の周壁の内
側及び外側にそれぞれフィンを設け、前記電子回路ケー
スの周壁の内側フィンと発熱体との空隙を熱伝導材で充
填し、この両フィンを熱的に連結した構成であることを
特徴とする熱除去構造を備える電子回路ケースによって
達成することができる。Further, the above object of the present invention is to provide an electronic circuit case having a heat removal structure containing an electronic circuit having a heating element, with fins provided inside and outside the same peripheral wall constituting the electronic circuit case, Achieved by an electronic circuit case having a heat removal structure characterized in that a gap between an inner fin of a peripheral wall of the electronic circuit case and a heating element is filled with a heat conductive material, and both fins are thermally connected. can do.
【0008】[0008]
【作用】本発明に係る熱除去構造を備える電子回路ケー
スにおいては、電子回路ケースを構成する同一の周壁の
内側及び外側にそれぞれフィンを設け、この両フィンを
熱的に連結した構成である。これにより、電子回路ケー
スの周壁の内側のフィンが電子回路ケース内の発熱体か
らの発熱分を効果的に吸熱し、この吸熱分が効果的に電
子回路ケースの周壁の外側のフィンに伝達されて、この
外側のフィンから熱除去が行われる。よって、両フィン
間の熱伝達が低損失で行われるので高い熱除去効率が実
現される。In the electronic circuit case provided with the heat removal structure according to the present invention, fins are provided inside and outside the same peripheral wall constituting the electronic circuit case, and both fins are thermally connected. As a result, the fins inside the peripheral wall of the electronic circuit case effectively absorb the heat generated by the heating element inside the electronic circuit case, and the absorbed heat is effectively transmitted to the fins outside the peripheral wall of the electronic circuit case. Heat is removed from the outer fins. Therefore, the heat transfer between both fins is performed with low loss, so that high heat removal efficiency is realized.
【0009】また、電子回路ケースを構成する同一の周
壁の内側及び外側にそれぞれフィンを設け、前記電子回
路ケースの周壁の内側フィンと発熱体との空隙を熱伝導
材で充填し、この両フィンを熱的に連結した構成であ
る。これにより、発熱体からの熱が熱伝導材中を伝導す
ることで高効率で内側のフィンに伝達され、さらに改善
された熱除去効率を実現することができる。Further, fins are provided inside and outside the same peripheral wall constituting the electronic circuit case, and a gap between the inner fin on the peripheral wall of the electronic circuit case and the heating element is filled with a heat conductive material. This is a configuration in which is thermally connected. With this, the heat from the heating element is transmitted to the inner fins with high efficiency by being conducted through the heat conducting material, and further improved heat removal efficiency can be realized.
【0010】[0010]
【実施例】以下、本発明の熱除去構造を備える電子回路
ケースの第1実施例を図1及び図2に基づいて説明す
る。図1は本発明の熱除去構造を備える電子回路ケース
の第1実施例を示す部分斜視図、図2は図1における熱
除去状態を示す説明図である。図1に示すように本実施
例の熱除去構造を備える電子回路ケース1は、周壁2の
内側ならびに外側にそれぞれ外側フィン3と内側フィン
4を設け、これら両フィン3,4を熱的に連結した構成
とするものである。この両フィン3,4の熱的な連結
は、例えば両フィン3,4を同一の周壁部材で樹脂成形
することで実現される。この電子回路ケース1の周壁2
の内側フィン4は、配線板8に半田付部9によって取付
けられたドロッパー抵抗等の発熱体5近傍の周壁下面よ
り少なくとも発熱体5を介して対向した一対の壁として
垂下に配設される。また、外側フィン3は、ケース外側
6上の周壁2を隔てて内側フィン4に対向した位置に突
設されている。なお、上記両フィン3,4を含み電子回
路ケース1の材質は、樹脂である必要はなく、アルミニ
ウム等をベースにした金属合金で形成することも可能で
ある。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of an electronic circuit case having a heat removal structure of the present invention will be described below with reference to FIGS. FIG. 1 is a partial perspective view showing a first embodiment of an electronic circuit case having a heat removal structure of the present invention, and FIG. 2 is an explanatory view showing a heat removal state in FIG. As shown in FIG. 1, an electronic circuit case 1 having the heat removal structure of this embodiment is provided with outer fins 3 and inner fins 4 on the inside and outside of the peripheral wall 2, respectively, and these fins 3 and 4 are thermally connected. The configuration is as follows. The thermal connection between the fins 3 and 4 is realized by resin-molding the fins 3 and 4 with the same peripheral wall member, for example. The peripheral wall 2 of this electronic circuit case 1
The inner fins 4 are disposed as a pair of walls facing at least the heating element 5 from the lower surface of the peripheral wall near the heating element 5 such as a dropper resistor attached to the wiring board 8 by the soldering portion 9. Further, the outer fins 3 are provided so as to project from the outer wall 6 of the case at a position facing the inner fins 4 with the peripheral wall 2 therebetween. The material of the electronic circuit case 1 including both the fins 3 and 4 does not have to be resin, and can be formed of a metal alloy based on aluminum or the like.
【0011】図2に示すように上記構成による電子回路
ケースの周壁2の内側フィン4が、電子回路ケース内の
発熱体5からの発熱分を、輻射伝熱11或いはケース内
空気の対流伝熱12によって効率的に吸熱(集熱)す
る。この吸熱分が、電子回路ケースの周壁の内側フィン
4ならびに外側フィン3間における低損失の熱伝達によ
って効率的に外側フィン3に伝達され、この外側フィン
3から放熱13等で熱除去されるものである。As shown in FIG. 2, the inner fins 4 of the peripheral wall 2 of the electronic circuit case having the above-described structure transfer the heat generated from the heating element 5 in the electronic circuit case to the radiant heat transfer 11 or the convective heat transfer of the air inside the case. 12 efficiently absorbs heat (collects heat). The absorbed heat is efficiently transferred to the outer fins 3 by the low-loss heat transfer between the inner fins 4 and the outer fins 3 on the peripheral wall of the electronic circuit case, and the heat is removed from the outer fins 3 by the heat radiation 13 or the like. Is.
【0012】即ち、電子回路ケースの周壁の内側フィン
4は吸熱作用を備え、また同じ周壁の外側フィン3は放
熱作用を備えていることになる。この結果、比較的高温
の内側フィン4から低温の外側フィン3に至る温度勾配
が形成される。これにより、電子回路ケースのケース内
側7からケース外側6への熱伝達を効率的に行なうこと
ができ、よって大きな熱除去効果を得ることができる。
この結果、発熱を伴う電気部品を狭いスペースに収納す
る場合においても、熱除去を効率良く行なえるので、電
子回路ケース内の過度の温度上昇を抑制でき、他の部品
への熱的影響を回避することができる。That is, the inner fins 4 on the peripheral wall of the electronic circuit case have a heat absorbing function, and the outer fins 3 on the same peripheral wall have a heat radiating function. As a result, a temperature gradient is formed from the relatively high temperature inner fin 4 to the relatively low temperature outer fin 3. As a result, heat can be efficiently transferred from the case inner side 7 to the case outer side 6 of the electronic circuit case, and thus a large heat removal effect can be obtained.
As a result, heat can be efficiently removed even when accommodating heat-generating electrical components in a narrow space, and it is possible to prevent excessive temperature rise in the electronic circuit case and avoid thermal effects on other components. can do.
【0013】また、本発明に係る熱除去構造を備える電
子回路ケースの第2実施例を図3及び図4に基づいて説
明する。図3は本発明に係る熱除去構造を備える電子回
路ケースの第2実施例を示す部分斜視図、図4は図3に
おける熱除去状態の説明図である。図3に示すように本
実施例の熱除去構造を備える電子回路ケース21は、そ
の構成する周壁22の内側には内側フィン24が、ドロ
ッパー抵抗等の発熱体5近傍の周壁下面より少なくとも
発熱体5を介して対向した一対の壁として垂下に配設さ
れている。また、周壁22の外側には外側フィン23
が、ケース外側26上の周壁22を隔てて内側フィン2
4に対向した位置に突設されている。この外側フィン2
3と内側フィン24は熱的に連結された構成となってお
り、この熱的な連結は、例えば両フィン23,24を同
一の周壁部材で樹脂成形することで実現される。なお、
第1実施例と同様に電子回路ケース21の材質は、樹脂
である必要はなく、アルミニウム等をベースにした金属
合金で形成することも可能である。A second embodiment of the electronic circuit case having the heat removal structure according to the present invention will be described with reference to FIGS. 3 and 4. FIG. 3 is a partial perspective view showing a second embodiment of an electronic circuit case having a heat removal structure according to the present invention, and FIG. 4 is an explanatory view of a heat removal state in FIG. As shown in FIG. 3, in the electronic circuit case 21 having the heat removal structure of the present embodiment, the inner fins 24 are provided inside the peripheral wall 22 which constitutes at least the heating element from the lower surface of the peripheral wall near the heating element 5 such as a dropper resistor. 5 are provided as a pair of walls that face each other with 5 in between. The outer fins 23 are provided outside the peripheral wall 22.
However, the inner fins 2 are separated by the peripheral wall 22 on the outside 26 of the case.
4 is provided so as to project at a position opposite to 4. This outer fin 2
3 and the inner fin 24 are thermally connected to each other, and this thermal connection is realized, for example, by resin-molding both fins 23 and 24 with the same peripheral wall member. In addition,
Similar to the first embodiment, the material of the electronic circuit case 21 does not have to be resin, and can be formed of a metal alloy based on aluminum or the like.
【0014】この電子回路ケース21の周壁22の内側
フィン24は、ドロッパー抵抗等の発熱体5を囲い込む
のに十分な深さを有するものとする。さらに発熱体5と
内側フィン24との間の空隙に熱伝導性のモールド材2
8を充填する。この充填方法としては、配線板8上に半
田付部9によって取付けられた発熱体5を所定の型に入
れてモールド材28を流し込み、固まる前に型から出し
て電子回路ケース21内の所定位置に取付けることで発
熱体5は所定内側フィン24間にモールド材28ととも
に配置される。または、配線板8を電子回路ケース21
内の所定位置に取付け、ケース内側27を上方に向けて
モールド材28を直接空隙に流し込んでも良い。また、
モールド材としては、熱伝達率が大きく他の熱特性にも
優れる、例えばエポキシ系樹脂やナイロン系樹脂が適切
であるが、これに限定されるものではない。The inner fins 24 of the peripheral wall 22 of the electronic circuit case 21 have a sufficient depth to enclose the heating element 5 such as a dropper resistor. Further, the thermally conductive molding material 2 is provided in the space between the heating element 5 and the inner fin 24.
Fill 8. As the filling method, the heating element 5 mounted on the wiring board 8 by the soldering portion 9 is put in a predetermined mold, the molding material 28 is poured, and the mold material 28 is taken out from the mold before it is solidified and the predetermined position in the electronic circuit case 21. The heating element 5 is disposed between the predetermined inner fins 24 together with the molding material 28 by being attached to. Alternatively, the wiring board 8 may be attached to the electronic circuit case 21.
Alternatively, the molding material 28 may be attached at a predetermined position inside and the molding material 28 may be directly poured into the gap with the case inside 27 facing upward. Also,
As the molding material, an epoxy resin or a nylon resin, which has a large heat transfer coefficient and is excellent in other thermal characteristics, is suitable, but the molding material is not limited thereto.
【0015】図4に示すように充填されたモールド材2
8は、発熱体5からの発熱分を伝導伝熱29によって内
側フィン24に高効率で伝達する。この熱が、低損失の
熱貫流30によって効果的に外側フィン23に伝達さ
れ、この外側フィン23から放熱31等で熱除去され
る。この構成により熱伝達効率が向上して、単位時間な
らびに単位面積あたりの発熱体からの吸熱量が増大す
る。即ち、本実施例は空気に比べて熱伝達率の大きいモ
ールド材28の使用によって、発熱体から電子回路ケー
スの内側フィン24への熱伝達を格段に向上させるもの
である。Molding material 2 filled as shown in FIG.
8 efficiently transfers the heat generated from the heating element 5 to the inner fins 24 by the conduction heat transfer 29. This heat is effectively transmitted to the outer fins 23 by the low loss heat flow-through 30, and is removed from the outer fins 23 by the heat radiation 31 and the like. With this configuration, the heat transfer efficiency is improved, and the amount of heat absorbed from the heating element per unit time and unit area is increased. That is, the present embodiment remarkably improves the heat transfer from the heating element to the inner fins 24 of the electronic circuit case by using the molding material 28 having a larger heat transfer coefficient than air.
【0016】[0016]
【発明の効果】以上説明したように本発明に係る熱除去
構造を備える電子回路ケースにおいては、電子回路ケー
スを構成する同一の周壁の内側及び外側にそれぞれフィ
ンを設け、この両フィンを熱的に連結した構成である。
この構成により、電子回路ケースの周壁の内側フィンが
電子回路ケース内の発熱体からの熱を効果的に吸熱し、
この吸熱分が効果的に電子回路ケースの周壁の外側フィ
ンに伝達され、放熱等でこの外側フィンから熱除去され
るものである。更には、両フィン間の熱伝達が低損失で
行われるため、高い熱除去効率を実現でき、電子回路ケ
ース内の温度上昇を効果的に抑制することができる。よ
って、発熱を伴う電気部品を狭いスペースに収納する場
合においても、熱除去が効率良く行なわれ、過度の温度
上昇を抑制することができ、他の部品に熱的影響を与え
ることを回避することができる。As described above, in the electronic circuit case provided with the heat removal structure according to the present invention, fins are provided inside and outside the same peripheral wall constituting the electronic circuit case, and both fins are thermally provided. It is a structure connected to.
With this configuration, the inner fins on the peripheral wall of the electronic circuit case effectively absorb heat from the heating element in the electronic circuit case,
The absorbed heat is effectively transmitted to the outer fins of the peripheral wall of the electronic circuit case, and the heat is removed from the outer fins by heat radiation or the like. Furthermore, since heat transfer between both fins is performed with low loss, high heat removal efficiency can be realized, and temperature rise in the electronic circuit case can be effectively suppressed. Therefore, even when the heat-generating electrical components are stored in a narrow space, the heat can be efficiently removed, excessive temperature rise can be suppressed, and thermal influence on other components can be avoided. You can
【0017】また、電子回路ケースを構成する同一の周
壁の内側及び外側にそれぞれフィンを設け、前記電子回
路ケースの周壁の内側フィンと発熱体との空隙を熱伝導
材で充填し、この両フィンを熱的に連結した構成であ
る。この構成により、発熱体からの熱が熱伝導材中を伝
導して効率良く内側フィンに伝達され、さらに改善され
た熱除去効率を実現することができる。Further, fins are provided inside and outside the same peripheral wall constituting the electronic circuit case, and a gap between the inner fin on the peripheral wall of the electronic circuit case and the heating element is filled with a heat conductive material. This is a configuration in which is thermally connected. With this configuration, the heat from the heating element is conducted through the heat conducting material and efficiently transmitted to the inner fins, and further improved heat removal efficiency can be realized.
【0018】更に、電子回路ケースの周壁材の熱貫流に
よって熱除去を行なうものであり、空気の対流によるも
のではないのでスリット等の開口を電子回路ケースに設
ける必要がない。よって、電子回路ケースを密閉できる
ので、耐水性や防塵性を確保しつつ、熱除去を効率良く
行なうことができる。Further, the heat is removed by the heat flow through the peripheral wall material of the electronic circuit case, and it is not due to the convection of air, so that it is not necessary to provide an opening such as a slit in the electronic circuit case. Therefore, since the electronic circuit case can be sealed, heat can be efficiently removed while ensuring water resistance and dust resistance.
【図1】本発明に係る熱除去構造を備える電子回路ケー
スの第1実施例を示す部分斜視図である。FIG. 1 is a partial perspective view showing a first embodiment of an electronic circuit case having a heat removal structure according to the present invention.
【図2】図1における熱除去状態を示す説明図である。FIG. 2 is an explanatory diagram showing a heat removal state in FIG.
【図3】本発明に係る熱除去構造を備える電子回路ケー
スの第2実施例を示す部分斜視図である。FIG. 3 is a partial perspective view showing a second embodiment of an electronic circuit case having a heat removal structure according to the present invention.
【図4】図3における熱除去状態を示す説明図である。FIG. 4 is an explanatory diagram showing a heat removal state in FIG.
【図5】従来の熱除去構造を示す断面図である。FIG. 5 is a cross-sectional view showing a conventional heat removal structure.
1,21 熱除去構造を備える電子回路ケース 2,22 周壁 3,23 外側フィン 4,24 内側フィン 5 発熱体 6,26 ケース外側 7,27 ケース内側 8 配線板 11 輻射伝熱 12 対流伝熱 13,31 放熱 14,30 熱貫流 28 モールド材 29 伝導伝熱 1,21 Electronic Circuit Case with Heat Removal Structure 2,22 Peripheral Wall 3,23 Outer Fin 4,24 Inner Fin 5 Heater 6,26 Outer Case 7,27 Inside Case 8 Wiring Board 11 Radiant Heat Transfer 12 Convective Heat Transfer 13 , 31 Heat dissipation 14,30 Heat flow through 28 Mold material 29 Conductive heat transfer
Claims (2)
去構造を備える電子回路ケースにおいて、電子回路ケー
スを構成する同一の周壁の内側及び外側にそれぞれフィ
ンを設け、この両フィンを熱的に連結した構成であるこ
とを特徴とする熱除去構造を備える電子回路ケース。1. An electronic circuit case having a heat removal structure containing an electronic circuit having a heating element, wherein fins are provided inside and outside the same peripheral wall constituting the electronic circuit case, and both fins are thermally provided. An electronic circuit case having a heat removal structure characterized by being connected.
去構造を備える電子回路ケースにおいて、電子回路ケー
スを構成する同一の周壁の内側及び外側にそれぞれフィ
ンを設け、前記電子回路ケースの周壁の内側フィンと発
熱体との空隙を熱伝導材で充填し、この両フィンを熱的
に連結した構成であることを特徴とする熱除去構造を備
える電子回路ケース。2. An electronic circuit case having a heat removal structure containing an electronic circuit having a heating element, wherein fins are provided on the inside and outside of the same peripheral wall forming the electronic circuit case, respectively. An electronic circuit case having a heat removal structure, characterized in that the gap between the inner fin and the heating element is filled with a heat conductive material, and the two fins are thermally connected.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15741494A JPH0823184A (en) | 1994-07-08 | 1994-07-08 | Electronic circuit case provided with heat removing structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15741494A JPH0823184A (en) | 1994-07-08 | 1994-07-08 | Electronic circuit case provided with heat removing structure |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0823184A true JPH0823184A (en) | 1996-01-23 |
Family
ID=15649122
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15741494A Pending JPH0823184A (en) | 1994-07-08 | 1994-07-08 | Electronic circuit case provided with heat removing structure |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0823184A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6185101B1 (en) | 1997-12-24 | 2001-02-06 | Denso Corporation | Electronic circuit apparatus and method for assembling the same |
JP2011023459A (en) * | 2009-07-14 | 2011-02-03 | Denso Corp | Electronic control unit |
-
1994
- 1994-07-08 JP JP15741494A patent/JPH0823184A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6185101B1 (en) | 1997-12-24 | 2001-02-06 | Denso Corporation | Electronic circuit apparatus and method for assembling the same |
US6418021B1 (en) | 1997-12-24 | 2002-07-09 | Denso Corporation | Electronic circuit apparatus and method for assembling the same |
JP2011023459A (en) * | 2009-07-14 | 2011-02-03 | Denso Corp | Electronic control unit |
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