CN111132524A

CN111132524A - Radiator for electronic product

Info

Publication number: CN111132524A
Application number: CN202010047428.7A
Authority: CN
Inventors: 刘斌; 石胜强; 拉希德; 陈爱强; 赵松松; 杨文哲
Original assignee: Tianjin University of Commerce
Current assignee: Tianjin University of Commerce
Priority date: 2020-01-16
Filing date: 2020-01-16
Publication date: 2020-05-08

Abstract

The invention discloses a radiator for electronic products, and aims to provide a radiator which increases convection heat transfer while conducting heat dissipation so as to improve heat transfer efficiency, and has a simple structure and light equipment. The heat dissipation structure comprises an integrated metal heat dissipation body and a rib type heat dissipation structure, wherein the metal heat dissipation body is of a porous structure; the metal radiator comprises metal enclosing plates, and the metal enclosing plates are separated into porous structures through a gap framework. The metal radiator, the connector and the rib type radiating structure are formed through 3D printing. The radiator adopts the porous metal material radiating system as a carrier to be contacted with the electronic product, thereby increasing the convective heat transfer while conducting and radiating, strengthening the heat transfer effect and improving the heat transfer efficiency. Meanwhile, due to the design of the porous structure, the weight of the radiator is reduced, and the structure is simpler and lighter.

Description

Radiator for electronic product

Technical Field

The invention relates to the technical field of electronics, in particular to a novel electronic product radiator using a porous metal material as a carrier.

Background

With the continuous progress of electronic technology, the required power of electronic components is increasing, and the heating value of the components is increasing. Meanwhile, in order to meet the use requirements of convenience in carrying and the like, the volume of the electronic element tends to be miniaturized, the integration level of the electronic chip is improved, and the density in unit area is higher and higher. Therefore, the heat generated by the electronic products during the operation is increasing. The heat accumulation causes the electronic product to be in an excessively high temperature environment, which causes the electronic component to generate phenomena such as electron dissociation and thermal stress, resulting in a decrease in overall stability and a reduction in the lifetime of the electronic component itself.

In order to reduce the ambient temperature of the electronic device, a dedicated heat sink is required to dissipate heat of the electronic product. At present, a solid heat conductor at the joint of an electronic device is mainly used as a carrier of a radiator for radiating electronic products and is combined with a radiating fin, heat is radiated between the heat conductor and the electronic device mainly by heat conduction, and the radiating mode is single, so that the radiating effect is influenced. Meanwhile, the solid heat conductor increases the weight of the electronic product. In addition, because the heat conductor and the radiating fins are made of metal materials and are often fixedly connected in a welding mode, the heat resistance at the joints is large, and the radiating effect is influenced.

Disclosure of Invention

The invention aims to provide an electronic product radiator which increases convection heat transfer while conducting heat dissipation so as to improve heat transfer efficiency, has a simple structure and is light and handy in equipment, aiming at the technical defects in the prior art.

The technical scheme adopted for realizing the purpose of the invention is as follows:

a radiator of an electronic product comprises an integrated metal radiator and a rib type radiating structure, wherein the metal radiator is of a porous structure; the metal radiator comprises metal enclosing plates, and the metal enclosing plates are separated into porous structures through a gap framework.

The metal enclosing plate is square, four corners of the metal enclosing plate are respectively connected with connectors, and the connectors are arranged in a scattered manner; the rib type heat dissipation structure consists of primary ribs and secondary ribs which are arranged in a staggered mode; the primary fins and the secondary fins are respectively arranged between two adjacent connectors; the first-stage fins are connected with the adjacent connectors and the metal enclosing plates; the secondary fins are connected with the adjacent primary fins or the connecting bodies.

The connecting body is provided with a fixed mounting hole.

The metal radiator, the connector and the rib type radiating structure are formed through 3D printing.

Compared with the prior art, the invention has the beneficial effects that:

1. the electronic product radiator adopts the porous metal material radiating system as a carrier to be in contact with the electronic product, increases convection heat transfer while conducting and radiating, strengthens the heat transfer effect and improves the heat transfer efficiency. Meanwhile, due to the design of the porous structure, the weight of the radiator is reduced, and the structure is simpler and lighter.

2. The electronic product radiator is connected with the rib type radiating structure through the connecting body, and the connecting body is arranged in a dispersing mode, so that the whole system is supported, the heat conduction function is played, and the radiating efficiency is further improved.

3. The radiator integrally adopts integrated 3D printing, so that the problem that heat exchange is difficult due to high thermal resistance at the node is effectively solved, and the heat exchange efficiency is improved.

Drawings

FIG. 1 is a schematic view of a heat sink for an electronic product according to the present invention;

fig. 2 is a diagram illustrating a usage state of the heat sink of the electronic product according to the present invention.

Detailed Description

The invention is described in detail below with reference to the figures and specific examples.

The electronic product radiator comprises an integrated metal radiator and a rib type radiating structure, wherein the metal radiator is of a porous structure. The specific structural schematic diagram is shown in fig. 1, the metal heat radiator comprises metal enclosing plates 1, and the metal enclosing plates 1 are separated into porous structures through a gap framework 5. In this embodiment, the metal enclosing plate 1 is square, four corners of the metal enclosing plate 1 are respectively connected with connectors 2, and the connectors 2 are arranged in a scattered manner; the rib type heat dissipation structure consists of primary ribs 3 and secondary ribs 4 which are arranged in a staggered mode; the primary fins 3 and the secondary fins 4 are respectively arranged between two adjacent connectors 2; the primary fins 3 are connected with the adjacent connectors 2 and the adjacent metal enclosing plates 1. The secondary fins 4 are connected with the adjacent primary fins 3 or the connecting body 2.

The connecting body 2 is provided with a fixed mounting hole.

In order to avoid the influence of node thermal resistance on heat dissipation, the metal heat dissipation body, the connector 2 and the rib type heat dissipation structure are formed through 3D printing.

When in use, the metal radiator of the electronic product radiator 7 of the invention is contacted and installed with the chip 6. When the temperature of the electronic element rises, the heat of the electronic element is firstly transferred into the metal heat dissipation body which is in contact with the electronic element, one part of the heat dissipation body is subjected to convection heat transfer and directly enters the environment, and the other part of the heat dissipation body is transferred into the connecting body 2 through heat transfer and then enters the first-stage fins 3. Heat conduction and convection heat transfer occur in the primary fins 3, a part of heat is dissipated into the environment, the other part of heat is transferred to the secondary fins 4 again, heat conduction and convection heat transfer occur in the secondary fins 4, and the heat is dissipated into the environment. Wherein the connecting body 2 plays a role in supporting the whole system and simultaneously playing a role in heat conduction, and the connecting body 2 is fixed by screws through the fixing and mounting holes on the periphery. The heat dissipated into the environment is carried away by a conventional fan 8. The radiator adopts a porous structure, and the porous structure has the advantages of high specific surface area, high permeability, high mechanical strength and the like, and has important practical significance for reducing the volume of the heat exchanger, lightening the equipment mass and strengthening heat exchange.

The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.

Claims

1. The electronic product radiator is characterized by comprising an integrated metal radiator and a rib type radiating structure, wherein the metal radiator is of a porous structure; the metal radiator comprises metal enclosing plates, and the metal enclosing plates are separated into porous structures through a gap framework.

2. The heat sink for electronic products as claimed in claim 1, wherein the metal enclosure is square, and four corners of the metal enclosure are respectively connected with connectors, and the connectors are arranged in a scattered manner; the rib type heat dissipation structure consists of primary ribs and secondary ribs which are arranged in a staggered mode; the primary fins and the secondary fins are respectively arranged between two adjacent connectors; the first-stage fins are connected with the adjacent connectors and the metal enclosing plates; the second-level fins are connected with the adjacent first-level fins and the connecting body.

3. The heat sink for electronic products as claimed in claim 2, wherein the connecting body is provided with a fixing hole.

4. The electronic product heat sink as claimed in claim 2, wherein the metal heat sink, the connecting body and the finned heat sink structure are formed by 3D printing.