JPH0823165A - Manufacture of metal cored wiring board using copper foil with insulating bonding agent - Google Patents
Manufacture of metal cored wiring board using copper foil with insulating bonding agentInfo
- Publication number
- JPH0823165A JPH0823165A JP6156854A JP15685494A JPH0823165A JP H0823165 A JPH0823165 A JP H0823165A JP 6156854 A JP6156854 A JP 6156854A JP 15685494 A JP15685494 A JP 15685494A JP H0823165 A JPH0823165 A JP H0823165A
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- adhesive material
- insulating adhesive
- wiring board
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、金属コア配線板の製造
方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a metal core wiring board.
【０００２】[0002]
【従来の技術】近年、高電圧で駆動するパワートランジ
スタやハイブリッドＩＣを高密度に実装する例が増加し
ており、放熱性に優れた配線板の要求がますます高まっ
ており、金属ベース配線板を用いることが行われてい
る。通常、この金属ベース配線板は、金属板に絶縁層と
銅箔とを重ねて積層一体化したものや、金属板に穴明け
を行い、穴明け部を穴埋め樹脂で埋め込んだ後、積層一
体化したものが知られている。2. Description of the Related Art In recent years, the number of high-density mounting of power transistors and hybrid ICs driven by high voltage is increasing, and the demand for wiring boards with excellent heat dissipation is increasing. Is used. Usually, this metal base wiring board is made by stacking an insulating layer and a copper foil on a metal plate and laminating and integrating them, or by punching a metal plate and filling the hole with resin for filling, then laminating and integrating. What you have done is known.
【０００３】[0003]
【発明が解決しようとする課題】ところが、金属板に絶
縁層と銅箔とを重ねて積層一体化したものは、片面単層
配線のため配線密度を高くすることに限界があった。ま
た、金属板に穴明けを行い、穴明け部を穴埋め樹脂で埋
め込んだ後、積層一体化したものは、製造工程が長くな
るためにコストが高くなるという課題があり、また、穴
埋め樹脂と絶縁層の界面にクラックが発生することや、
電食の発生などの課題もあった。However, the one in which the insulating layer and the copper foil are superposed and laminated integrally on the metal plate has a limit in increasing the wiring density because of the single-sided single-layer wiring. In addition, there is a problem in that the cost is increased because the manufacturing process becomes long because the metal plate is drilled, the hole is filled with the resin for filling the hole, and then integrated with the resin. Cracks occur at the interface of layers,
There were also problems such as the occurrence of electrolytic corrosion.
【０００４】穴明け部の充填と積層を一括して行うこと
ができれば工程数が大きく減少するため、コストの低減
を図ることができるが、通常の絶縁樹脂材料は、流れを
大きくすると、穴埋めはできるが、流れが大きいので、
絶縁層の厚さを一定に保つことができず、必要とする絶
縁抵抗が得られず、流れを小さくすると必要とする絶縁
抵抗は得られるものの、穴を埋めることができないとい
うように、このような工程に適した材料は得られていな
かった。The cost can be reduced because the number of steps can be greatly reduced if the filling and laminating of the perforated portion can be performed at the same time. You can, but because the flow is large,
The thickness of the insulating layer cannot be kept constant, the required insulation resistance cannot be obtained, and if the flow is reduced, the required insulation resistance can be obtained, but the holes cannot be filled. No material suitable for various processes has been obtained.
【０００５】本発明は、穴埋めと絶縁接着層の形成を一
括して行うことができ、効率的に配線密度に優れた金属
コア配線板を製造する方法を提供することを目的とす
る。It is an object of the present invention to provide a method for efficiently manufacturing a metal core wiring board which is capable of filling holes and forming an insulating adhesive layer at the same time and which is excellent in wiring density.
【０００６】[0006]
【課題を解決するための手段】本発明の金属コア両面配
線板の製造方法は、以下の工程よりなることを特徴とす
る。 ａ．銅箔上に塗膜を配して形成した絶縁接着材料付き銅
箔を作製する工程 ｂ．厚さが０．１ｍｍから２ｍｍの金属板に穴明けを行
う工程 ｃ．工程ａで得られた絶縁接着材料付き銅箔と、工程ｂ
で得られた穴明け済み金属板を、加熱加圧して積層一体
化する工程 ｄ．層間接続を行う部分に穴明けを行う工程 ｅ．めっき、導電ペーストにより回路両面を電気的に接
続する工程 ｆ．エッチングにより回路形成を行う工程 ｇ．必要に応じて基板の曲げ加工かつ、または絞り加工
を行う工程A method of manufacturing a metal core double-sided wiring board according to the present invention is characterized by the following steps. a. Step of producing a copper foil with an insulating adhesive material formed by arranging a coating film on the copper foil b. Process of punching a metal plate having a thickness of 0.1 mm to 2 mm c. Copper foil with insulating adhesive material obtained in step a, and step b
Step of heating and pressing the perforated metal plate obtained in step 1 to perform laminated integration. D. A step of making a hole in a portion where interlayer connection is performed e. Process of electrically connecting both sides of the circuit by plating and conductive paste f. Step of forming a circuit by etching g. A step of bending and / or drawing the substrate as necessary
【０００７】このような方法に用いる絶縁接着材料付き
銅箔は、銅箔上に、絶縁接着材料を塗布し、ＢまたはＣ
ステージ状態に加熱硬化した後、この上に絶縁接着材料
を塗布し、ＡまたはＢステージ状態に加熱硬化すること
によって作成することができる。The copper foil with an insulating adhesive material used in such a method is prepared by applying an insulating adhesive material onto a copper foil and then applying B or C.
It can be prepared by heating and curing in a stage state, then applying an insulating adhesive material thereon, and heating and curing in an A or B stage state.
【０００８】また、片面銅張り積層板上に絶縁接着材料
を塗布し、これをＡまたはＢステージ状態に加熱硬化す
ることによっても作成することができる。It can also be prepared by applying an insulating adhesive material on a single-sided copper-clad laminate and heating and curing it in the A or B stage state.
【０００９】本発明に用いる絶縁接着材料は、エポキシ
樹脂、ゴム、高熱伝導無機フィラーよりなるものを用い
ることができる。絶縁接着材料の樹脂組成は、フロー性
を向上させるために、分子量５００以下の低分子量エポ
キシ樹脂を１０体積％以上含有する必要がある。このよ
うなエポキシ樹脂としては、市販のものとして、エピコ
ート８１２，８２８（油化シェル株式会社製、商品名）
などが挙げられる。このエポキシ樹脂の硬化剤として
は、特に制限するものではないが、ワニスライフの長い
潜在性の高いものが望ましい。例えば、３級アミン、酸
無水物、イミダゾール化合物、ポリフェノール樹脂、マ
スクイソシアネートなどの１種以上を使用することがで
きる。また、ドリル穴明け時のクラック発生を防止する
ため、可とう性付与成分を加えることが必要である。こ
のようなものとしては電気絶縁性の良い高分子物質、例
えばアクリルゴム、ＮＢＲ、エポキシ変性アクリルゴ
ム、エポキシ化ポリブタジエン、フェノキシ樹脂などを
１種以上使用することができる。The insulating adhesive material used in the present invention may be made of an epoxy resin, rubber, or a high thermal conductive inorganic filler. The resin composition of the insulating adhesive material needs to contain 10 vol% or more of a low molecular weight epoxy resin having a molecular weight of 500 or less in order to improve the flowability. As such an epoxy resin, as a commercially available product, Epicoat 812, 828 (trade name of Yuka Shell Co., Ltd.)
And the like. The curing agent for the epoxy resin is not particularly limited, but one having a long varnish life and high potential is desirable. For example, at least one kind of tertiary amine, acid anhydride, imidazole compound, polyphenol resin, masked isocyanate and the like can be used. In addition, it is necessary to add a flexibility-imparting component in order to prevent the occurrence of cracks during drilling. As such a material, one or more kinds of polymer substances having good electric insulation, such as acrylic rubber, NBR, epoxy modified acrylic rubber, epoxidized polybutadiene, and phenoxy resin can be used.
【００１０】また、銅箔と接着シートとの接着性を向上
させるため、シランカップリング剤を用いることが好ま
しく、例えば市販のものとしては、ＮＵＣ−Ａ１８７、
Ａ１８９、Ａ１１６０（日本ユニカー株式会社製、商品
名）などを組み合わせて使用することができる。このよ
うな組成であることにより無機フィラーを含有した場合
でもフロー性、接着性が優れた絶縁接着材料を得ること
ができる。Further, in order to improve the adhesiveness between the copper foil and the adhesive sheet, it is preferable to use a silane coupling agent. For example, as a commercially available product, NUC-A187,
A189, A1160 (manufactured by Nippon Unicar Co., Ltd., trade name) and the like can be used in combination. With such a composition, an insulating adhesive material having excellent flowability and adhesiveness can be obtained even when an inorganic filler is contained.
【００１１】また、高熱伝導率の無機フィラーを添加す
ることにより放熱性の向上を図ることができる。このよ
うな高熱伝導率の無機フィラーとしてはアルミナ、シリ
カ、窒化アルミなどを使用することができる。添加量は
１０から７５体積％の範囲が好ましい。その理由として
添加量が多くなるに従い放熱性は向上するが、その反面
接着シートのフロー性が低下し、穴埋め性が悪化する。
また、銅箔と接着シートとの接着性は低下するため、添
加量が７５体積％を越えると十分なはんだ耐熱信頼性を
得ることができない。また添加量が１０体積％以下では
放熱性向上の効果が少ない。Further, heat dissipation can be improved by adding an inorganic filler having a high thermal conductivity. Alumina, silica, aluminum nitride or the like can be used as the inorganic filler having such a high thermal conductivity. The addition amount is preferably in the range of 10 to 75% by volume. The reason for this is that as the amount of addition increases, the heat dissipation improves, but on the other hand, the flowability of the adhesive sheet decreases and the hole filling property deteriorates.
Further, since the adhesiveness between the copper foil and the adhesive sheet is lowered, if the added amount exceeds 75% by volume, sufficient solder heat resistance reliability cannot be obtained. Further, if the addition amount is 10% by volume or less, the effect of improving heat dissipation is small.
【００１２】また、フィラー及びゴム成分を加えること
によって下記の利点があるので、エポキシ樹脂、フィラ
ー及びゴムからなる組成であることが好ましい。すなわ
ち １）スルーホール穴明け時に微少なクラックが発生する
が、フィラーやゴムの界面でそれらの成長が抑制される
ため、大きなクラックが発生しにくい。 ２）ドリル穴明け時の摩擦熱により、樹脂の極所的な温
度上昇及び熱膨張が発生し、しばしばクラック発生の原
因となるが、フィラーが含まれているため放熱性が良く
なり、樹脂の極所的な温度上昇を押さえることができ
る。 ３）スルーホールの側面が適度な凹凸を有するため、め
っきの密着性が良好である。The addition of a filler and a rubber component has the following advantages, so that a composition comprising an epoxy resin, a filler and a rubber is preferable. That is, 1) Although small cracks are generated at the time of drilling through-holes, their growth is suppressed at the interface of the filler and rubber, so that large cracks are less likely to occur. 2) Due to frictional heat when drilling holes, temperature rise and thermal expansion of the resin locally occur, which often causes cracks. It is possible to suppress the local temperature rise. 3) Since the side surface of the through hole has appropriate unevenness, the adhesion of plating is good.
【００１３】コアとなる金属板については、アルミニウ
ム、鉄及びこれらを主成分とする合金等が使用でき、厚
さについては０．１ｍｍから２ｍｍが好ましい。この金
属板が２ｍｍより厚い場合、穴埋めを行うことが難しく
なる。また、この金属板には、予め、穴明け、表面研磨
処理、シランカップリング剤処理を行うことが好まし
い。For the metal plate to be the core, aluminum, iron and alloys containing these as main components can be used, and the thickness is preferably 0.1 mm to 2 mm. If this metal plate is thicker than 2 mm, it becomes difficult to fill the holes. Further, it is preferable that the metal plate is previously subjected to drilling, surface polishing treatment, and silane coupling agent treatment.
【００１４】絶縁接着材料の作成方法は、銅箔上に塗膜
第１層としてワニスを塗工し、これをＢまたはＣステー
ジ状態に加熱硬化することによりフロー性を小さくし、
この上に塗膜第２層を塗工し、これをＡまたはＢステー
ジ状態に加熱硬化する。The insulating adhesive material is produced by applying a varnish as a first layer of a coating film on a copper foil and heating and curing the varnish in a B or C stage state to reduce the flowability.
A second layer of the coating film is applied on this, and this is heat-cured in the A or B stage state.
【００１５】なお、ワニスを銅箔に塗工する方法として
は、バーコータ、リップコータ、ロールコータなどがあ
るが、クレータ、ボイドなどの欠陥が少なく塗膜厚をほ
ぼ均一に塗工できる方法ならば、どのような方法でも良
い。As a method for applying the varnish to the copper foil, there are a bar coater, a lip coater, a roll coater and the like. However, if the method has few defects such as craters and voids and the coating film thickness is almost uniform, Any method will do.
【００１６】次に、絶縁接着材料付き銅箔と金属板を加
圧加熱下で積層するが、穴明け部への絶縁接着材料の充
填性を向上させるためクッション材を用いることが好ま
しく、このようなクッション材としては、シリコンゴム
シート、ポリエチレンシートなどが挙げられる。Next, a copper foil with an insulating adhesive material and a metal plate are laminated under pressure and heating, but it is preferable to use a cushioning material in order to improve the filling property of the insulating adhesive material into the holes. Examples of such cushioning materials include silicone rubber sheets and polyethylene sheets.
【００１７】次に、ドリル、パンチッグにて穴明けを行
うが、この穴径は、予め金属板に明けた穴明けの径より
０．４ｍｍ以上小さいことが望ましい。その理由は、
０．１ｍｍ程度の作業誤差が発生した場合でも、絶縁不
良を生じることがないからである。Next, a hole is drilled with a drill or punch, and the diameter of the hole is preferably smaller than the diameter of the hole previously drilled in the metal plate by 0.4 mm or more. The reason is,
This is because even if a work error of about 0.1 mm occurs, insulation failure will not occur.
【００１８】次に、両面間の層間接続を行うが、これ
は、従来使用されている、導電ペースト、めっき、ワイ
ヤボンディングなどによる方法を用いることができる。
また、次に続く、回路形成については、銅箔上にエッチ
ングレジストを形成し、不要な銅をエッチング除去して
導体回路を形成するか、めっきにより塗膜を形成するこ
とにより行うことができる。さらにまた、導体回路形成
後に、基板の曲げ加工、絞り加工を行い電子機器に組み
込む形状に合わせることもできる。Next, interlayer connection between both surfaces is performed, which can be performed by using a conventionally used method such as conductive paste, plating, wire bonding or the like.
The subsequent circuit formation can be performed by forming an etching resist on the copper foil and removing unnecessary copper by etching to form a conductor circuit, or by forming a coating film by plating. Furthermore, after the conductor circuit is formed, the substrate can be bent and drawn to match the shape to be incorporated in an electronic device.
【００１９】[0019]
【作用】本発明により、絶縁接着材料付き銅箔の第１層
はフロー性が低いため、絶縁接着材料を挟む銅箔と金属
板との間の絶縁層を確保することができ、第２層はフロ
ー性が大きいため、金属板に明けた穴の内部間隙を埋め
ることができる。また、このような２層構成にすること
により、絶縁接着材料の膜厚を薄くすることが可能であ
り、放熱性の向上が期待できる。さらにまた、絶縁接着
材料の膜厚が薄い場合であっても、絶縁信頼性は確保さ
れ、かつ穴埋め性が高いため、また接着シートは２層以
上に分けて塗工することが可能であり、その場合、前述
した２層塗工の効果に加えて、さらにボイド、クレータ
などの、塗膜欠陥を防止することができる。According to the present invention, since the first layer of the copper foil with insulating adhesive material has low flowability, an insulating layer can be secured between the copper foil and the metal plate sandwiching the insulating adhesive material, and the second layer can be secured. Has a high flow property, so that it is possible to fill the internal gap of the hole opened in the metal plate. Further, by adopting such a two-layer structure, it is possible to reduce the film thickness of the insulating adhesive material, and it can be expected to improve heat dissipation. Furthermore, even if the thickness of the insulating adhesive material is small, the insulation reliability is ensured and the hole filling property is high. Therefore, the adhesive sheet can be applied in two or more layers. In that case, in addition to the effect of the two-layer coating described above, coating film defects such as voids and craters can be further prevented.
【００２０】[0020]
実施例１ （１）３５μｍの銅箔に第１層として、乾燥後の膜厚が
７０μｍになるようにワニスＡ（以下に組成を示す。）
を塗工後、１５０℃にて１０分乾燥し、この上に第２層
として、乾燥後の膜厚が第１層、第２層合わせて１４０
μｍになるようにワニスＡを塗工後、１１０℃にて１０
分乾燥して絶縁接着材料付き銅箔を作製する。 ・エポキシ樹脂 エピコート８２８（油化シェル株式会社製、商品名）・・・・６０重量部 ・可とう化剤 フェノキシ樹脂・・・・・・・・・・・・・・・・・・・・・２０重量部 アクリルゴム・・・・・・・・・・・・・・・・・・・・・・２０重量部 ・硬化剤 フェノールノボラック・・・・・・・・・・・・・・・・・・３０重量部 ・硬化促進剤 ２ＰＺ−ＣＮ（四国化成株式会社製、商品名）・・・・・・０．５重量部 ・シランカップリング剤 ＮＵＣ−Ａ１８７（日本ユニカー株式会社製、商品名）・・・・２重量部 ・無機フィラー アルミナ・・・・・・・・・・・・・・・・・・・・・・・１３０重量部 （２）厚さ０．３ｍｍのアルミ板の所定位置にパンチッ
グで穴明けを施した後、表面の研磨を行い、ばりを除去
し、さらに表面をシランカップリング処理を行う。 （３）絶縁接着材料付き銅箔と（２）で用意したアルミ
板をプレスにて積層する。 （４）アミル板の先穴明け部にドリルにて穴明けを行
い、スルーホールを形成する。 （５）スルーホール部にめっきを行い、両面の回路の接
続を行う。 （６）エッチング処理によりパターンを形成する。Example 1 (1) Varnish A (the composition is shown below) as a first layer on a 35 μm copper foil so that the film thickness after drying would be 70 μm.
And then dried at 150 ° C. for 10 minutes, and a second layer having a total thickness of 140 after the first layer and the second layer is dried.
After coating with varnish A to a thickness of 10 μm,
It is minutely dried to produce a copper foil with an insulating adhesive material.・ Epoxy resin Epicoat 828 (Yukaka Shell Co., Ltd., trade name) ・ ・ ・ 60 parts by weight ・ Flexible agent phenoxy resin ・ ・ ・ ・ ・ ・ ・ ・・ 20 parts by weight Acrylic rubber ・ ・ ・ ・ 20 parts by weight ・ Curing agent Phenol novolac ・ ・ ・ ・・ ・ ・ ・ 30 parts by weight ・ Curing accelerator 2PZ-CN (manufactured by Shikoku Kasei Co., Ltd.) ・ 0.5 parts by weight ・ Silane coupling agent NUC-A187 (manufactured by Nippon Unicar Co., Ltd., Product name) 2 parts by weight Inorganic filler Alumina 130 parts by weight (2) Aluminum with a thickness of 0.3 mm After punching holes in the plate at predetermined positions, the surface is polished to remove burrs and Is subjected to silane coupling treatment. (3) A copper foil with an insulating adhesive material and the aluminum plate prepared in (2) are laminated by pressing. (4) A through hole is formed by drilling a tip hole of the amyl plate with a drill. (5) The through holes are plated to connect the circuits on both sides. (6) A pattern is formed by etching.
【００２１】実施例２ （１）離型フィルムに第１層として、乾燥後の膜厚が７
０μｍになるようにワニスＡを塗工後、１５０℃にて１
０分乾燥し、この上に第２層として、乾燥後の膜厚が第
１層、第２層合わせて１４０μｍなるようにワニスＡを
塗工後、１１０℃にて１０分乾燥して絶縁接着材料を作
製する。 （２）厚さ０．３ｍｍのアルミ板の所定位置に、パンチ
ッグで穴明けを施した後、表面の研磨を行い、ばりを除
去し、さらに表面にシランカップリング処理を行う。 （３）絶縁接着材料と（２）で用意したアルミ板をプレ
スにて積層する。 （４）アミル板の先穴明け部にドリルにて穴明けを行
い、スルーホールを形成する。 （５）スルーホール部、及び導体回路をめっきで形成す
る。Example 2 (1) As the first layer of the release film, the film thickness after drying was 7
After applying Varnish A to 0 μm, 1 at 150 ° C
Dry for 0 minutes, and apply a varnish A as a second layer on the first and second layers so that the combined thickness of the first and second layers is 140 μm, and then dry at 110 ° C. for 10 minutes for insulation adhesion. Make the material. (2) After punching holes in predetermined positions of an aluminum plate having a thickness of 0.3 mm with a punch, the surface is polished to remove burrs, and the surface is subjected to silane coupling treatment. (3) The insulating adhesive material and the aluminum plate prepared in (2) are laminated by pressing. (4) A through hole is formed by drilling a tip hole of the amyl plate with a drill. (5) The through hole portion and the conductor circuit are formed by plating.
【００２２】比較例１ ３５μｍの銅箔に、第１層として乾燥後の膜厚が７０μ
ｍになるようにワニスＡを塗工後、１１０℃にて１０分
乾燥し、絶縁接着材料付き銅箔を作製する他は、実施例
１と同様である。Comparative Example 1 A copper foil having a thickness of 35 μm and a thickness of 70 μm after being dried as a first layer
After coating the varnish A so as to have a thickness of m, it is dried at 110 ° C. for 10 minutes to produce a copper foil with an insulating adhesive material, which is the same as in Example 1.
【００２３】このようにして作成した金属コア配線板の
熱抵抗、耐電圧、および引き剥し強さを測定し、表１に
その結果を示す。熱抵抗は、放熱ブロック上に作成した
金属コア配線板を置き、さらに銅箔上に発熱源となるＮ
ＰＮ型トランジスタをはんだ付けし、トランジスタのコ
レクタに直流電源の正極をエミッタに負極を接続し、ト
ランジスタと放熱ブロックの２箇所の温度測定点に熱電
対を固定し、トランジスタのベースに直流電源から分圧
した電圧を印加し、２箇所の温度と、供給した電力を測
定し、２箇所の温度差と電力の商を熱抵抗として求め
た。耐電圧は、ＰＣＴ処理（１２０℃、２気圧）、９６
時間後絶縁層の膜厚１５０μｍで、２５℃で、上下回路
間に交流電圧を、０Ｖから、毎秒１００Ｖの速度で印加
し、絶縁破壊の生じた電圧とした。引き剥がし強さは、
ＪＩＳ Ｃ ６４８１に準拠し、幅１０ｍｍに形成した
銅箔を、基板と９０度の角度で、５０ｍｍ／分のひっぱ
り速度で剥離したときのひっぱり力を測定した。The thermal resistance, withstand voltage, and peel strength of the metal core wiring board thus prepared were measured, and the results are shown in Table 1. For the thermal resistance, the metal core wiring board created on the heat dissipation block is placed, and N is used as a heat source on the copper foil.
Solder a PN type transistor, connect the positive pole of the DC power supply to the collector of the transistor and the negative pole of the emitter, fix the thermocouple at two temperature measurement points of the transistor and the heat radiation block, and connect the DC power source to the base of the transistor. The pressure applied was applied, the temperature at two locations and the supplied power were measured, and the quotient of the temperature difference at the two locations and the power was determined as the thermal resistance. Withstanding voltage is PCT treatment (120 ° C, 2 atm), 96
After a lapse of time, with the film thickness of the insulating layer being 150 μm, an AC voltage was applied between the upper and lower circuits at a rate of 0 V to 100 V per second to obtain a voltage at which dielectric breakdown occurred. The peel strength is
Based on JIS C 6481, the pulling force when the copper foil formed to have a width of 10 mm was peeled off from the substrate at a pulling speed of 50 mm / min at an angle of 90 degrees was measured.
【００２４】[0024]
【表１】 [Table 1]
【００２５】[0025]
【発明の効果】以上に説明したように、本発明により、
穴埋めと絶縁接着層の形成を一括して行うことができ、
効率的に配線密度に優れた金属コア配線板を製造する方
法を提供することができた。As described above, according to the present invention,
It is possible to fill holes and form an insulating adhesive layer at once.
It was possible to provide a method for efficiently producing a metal core wiring board having excellent wiring density.
【図１】本発明の一実施例を示す断面図である。FIG. 1 is a sectional view showing an embodiment of the present invention.
１．金属コア ２．絶縁接着材料 ３．銅パターン ４．銅めっき部 1. Metal core 2. Insulating adhesive material 3. Copper pattern 4. Copper plating part
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｃ０９Ｄ 5/25 ＰＱＹ Ｃ０９Ｊ 9/00 ＪＢＣ Ｈ０５Ｋ 1/03 Ｈ 7511−4Ｅ 3/40 Ｅ 7511−4Ｅ 3/42 Ｂ 7511−4Ｅ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Internal reference number FI Technical display location C09D 5/25 PQY C09J 9/00 JBC H05K 1/03 H 7511-4E 3/40 E 7511-4E 3/42 B 7511-4E
Claims (4)
コア両面配線板の製造方法。 ａ．銅箔上に塗膜を配して形成した絶縁接着材料付き銅
箔を作製する工程 ｂ．厚さが０．１ｍｍから２ｍｍの金属板に穴明けを行
う工程 ｃ．工程ａで得られた絶縁接着材料付き銅箔と、工程ｂ
で得られた穴明け済み金属板を、加熱加圧して積層一体
化する工程 ｄ．層間接続を行う部分に穴明けを行う工程 ｅ．めっき、導電ペーストにより回路両面を電気的に接
続する工程 ｆ．エッチングにより回路形成を行う工程 ｇ．必要に応じて基板の曲げ加工かつ、または絞り加工
を行う工程1. A method of manufacturing a metal core double-sided wiring board, comprising the following steps. a. Step of producing a copper foil with an insulating adhesive material formed by arranging a coating film on the copper foil b. Process of punching a metal plate having a thickness of 0.1 mm to 2 mm c. Copper foil with insulating adhesive material obtained in step a, and step b
Step of heating and pressing the perforated metal plate obtained in step 1 to perform laminated integration. D. A step of making a hole in a portion where interlayer connection is performed e. Process of electrically connecting both sides of the circuit by plating and conductive paste f. Step of forming a circuit by etching g. A step of bending and / or drawing the substrate as necessary
接着材料を塗布し、ＢまたはＣステージ状態に加熱硬化
した後、この上に絶縁接着材料を塗布し、ＡまたはＢス
テージ状態に加熱硬化することによって作成することを
特徴とする請求項１に記載の金属コア両面配線板の製造
方法。2. A copper foil with an insulating adhesive material is applied to the copper foil, the insulating adhesive material is heated and cured in a B or C stage state, and then the insulating adhesive material is applied onto the copper foil, and the A or B stage is applied. The metal core double-sided wiring board according to claim 1, wherein the metal core double-sided wiring board is produced by heating and curing to a state.
し、これをＡまたはＢステージ状態に加熱硬化すること
によって作成することを特徴とする請求項１に記載の金
属コア配線板の製造方法。3. A metal core wiring board according to claim 1, which is produced by applying an insulating adhesive material on a single-sided copper-clad laminate and heating and curing the same in an A or B stage state. Production method.
熱伝導無機フィラーよりなることを特徴とする請求項２
または３に記載の金属コア配線板の製造方法。4. The insulating adhesive material comprises epoxy resin, rubber, and a high thermal conductive inorganic filler.
Alternatively, the method for manufacturing the metal core wiring board according to 3 above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6156854A JPH0823165A (en) | 1994-07-08 | 1994-07-08 | Manufacture of metal cored wiring board using copper foil with insulating bonding agent |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6156854A JPH0823165A (en) | 1994-07-08 | 1994-07-08 | Manufacture of metal cored wiring board using copper foil with insulating bonding agent |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0823165A true JPH0823165A (en) | 1996-01-23 |
Family
ID=15636836
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6156854A Pending JPH0823165A (en) | 1994-07-08 | 1994-07-08 | Manufacture of metal cored wiring board using copper foil with insulating bonding agent |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0823165A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6323439B1 (en) | 1998-09-24 | 2001-11-27 | Ngk Spark Plug Co., Ltd. | Metal core multilayer resin wiring board with thin portion and method for manufacturing the same |
| US6673471B2 (en) * | 2001-02-23 | 2004-01-06 | Nikko Materials Usa, Inc. | Corrosion prevention for CAC component |
| JP2004331783A (en) * | 2003-05-07 | 2004-11-25 | Kyocera Chemical Corp | Flame-retardant adhesive composition, flexible copper-clad laminate, cover lay and adhesive film |
| JP2008053362A (en) * | 2006-08-23 | 2008-03-06 | Mitsubishi Electric Corp | Printed wiring board and its manufacturing method |
| JP2009289850A (en) * | 2008-05-28 | 2009-12-10 | Sanyu Rec Co Ltd | Method of manufacturing metal core-containing multilayer substrate |
| CN102602111A (en) * | 2012-02-21 | 2012-07-25 | 甄凯军 | Method for producing aluminum-base copper-clad plate and aluminum-base copper-clad plate product |
| WO2014042413A1 (en) * | 2012-09-12 | 2014-03-20 | 주식회사 두산 | Heat dissipating metal foil, method for manufacturing same, and heat dissipating metal-clad laminate and multi-layer printed circuit board comprising heat dissipating metal foil |
-
1994
- 1994-07-08 JP JP6156854A patent/JPH0823165A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6323439B1 (en) | 1998-09-24 | 2001-11-27 | Ngk Spark Plug Co., Ltd. | Metal core multilayer resin wiring board with thin portion and method for manufacturing the same |
| US6673471B2 (en) * | 2001-02-23 | 2004-01-06 | Nikko Materials Usa, Inc. | Corrosion prevention for CAC component |
| JP2004331783A (en) * | 2003-05-07 | 2004-11-25 | Kyocera Chemical Corp | Flame-retardant adhesive composition, flexible copper-clad laminate, cover lay and adhesive film |
| JP4503239B2 (en) * | 2003-05-07 | 2010-07-14 | 京セラケミカル株式会社 | Flame-retardant adhesive composition, flexible copper-clad laminate, coverlay and adhesive film |
| JP2008053362A (en) * | 2006-08-23 | 2008-03-06 | Mitsubishi Electric Corp | Printed wiring board and its manufacturing method |
| JP2009289850A (en) * | 2008-05-28 | 2009-12-10 | Sanyu Rec Co Ltd | Method of manufacturing metal core-containing multilayer substrate |
| CN102602111A (en) * | 2012-02-21 | 2012-07-25 | 甄凯军 | Method for producing aluminum-base copper-clad plate and aluminum-base copper-clad plate product |
| WO2014042413A1 (en) * | 2012-09-12 | 2014-03-20 | 주식회사 두산 | Heat dissipating metal foil, method for manufacturing same, and heat dissipating metal-clad laminate and multi-layer printed circuit board comprising heat dissipating metal foil |
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